CN115173010A - Microwave transmission device - Google Patents
Microwave transmission device Download PDFInfo
- Publication number
- CN115173010A CN115173010A CN202210572000.3A CN202210572000A CN115173010A CN 115173010 A CN115173010 A CN 115173010A CN 202210572000 A CN202210572000 A CN 202210572000A CN 115173010 A CN115173010 A CN 115173010A
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- Prior art keywords
- grounding
- step part
- transmission device
- belt
- microwave transmission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
Abstract
The embodiment of the application discloses microwave transmission device includes: a base having a stepped structure; the base comprises a first step part and a second step part; the upper surface of the second step part is lower than that of the first step part; two microstrip lines are respectively formed on the first step part and the second step part in an extending way along the X direction; one end of each of the two microstrip lines close to each other comprises a T-shaped belt in a T-shaped structure; the two T-shaped belts are connected through at least one first gold wire connecting line. The two microstrip lines with the height difference are connected in a bonding mode through the first gold wire connecting line, so that the cost is reduced, the complexity of design and assembly is reduced, the microwave interconnection between the two microstrip lines can be realized, and the microwave signals can be normally transmitted; the design of the T-shaped structure on the microstrip line can enable the two microstrip lines to realize transition matching and the transmission of low-loss microwave signals in a DC-18GHz frequency band. The standing wave is less than 1.1, the insertion loss is less than 0.24dB, and the good transmission of the ultra-wideband microwave signal is realized.
Description
Technical Field
The present application relates to the field of microwave technology, and more particularly, to a microwave transmission device.
Background
With the continuous development of modern phased array radars, the requirement of the interior of a microwave component on the integration level is further improved, the internal structure of the component is more and more complex, and besides a conventional coplanar connection mode, a radio frequency connection mode with a height difference on the structure is more and more widely applied. In the past, the radio frequency interconnection with height difference on the structure is realized by adopting the insulator, but the complexity of design is increased by using the insulator, and meanwhile, the cost of the microwave assembly is increased.
Therefore, in order to overcome the defects of the prior art, a novel microwave transmission device needs to be provided.
Disclosure of Invention
It is an object of the present invention to provide a microwave transmission device to solve at least one of the above technical problems.
In order to achieve at least one of the above purposes, the following technical scheme is adopted in the application:
the application provides a microwave transmission device, includes:
a base in a step structure;
the base comprises a first step part and a second step part;
the upper surface of the second step part is lower than the upper surface of the first step part;
two microstrip lines are respectively formed on the first step part and the second step part in an extending manner along the X direction;
one end, close to each other, of each of the two microstrip lines comprises a T-shaped belt in a T-shaped structure;
the two T-shaped belts are connected through at least one first gold wire connecting line.
Optionally, the two microstrip lines each include: the belt body and the T-shaped belt are connected in sequence;
the T-shaped belt includes: a transition zone and a connecting zone; two ends of the transition belt are respectively connected with the belt body and the connecting belt;
and two ends of the first gold wire connecting line are respectively connected and fixed with the connecting bands of the two T-shaped belts.
Optionally, the width of the transition belt in the Y direction is smaller than the width of the belt body in the Y direction, and the width of the belt body in the Y direction is smaller than the width of the connection belt in the Y direction.
Optionally, two first ground strips located on the first step portion and disposed on two sides of the microstrip line in the Y direction; the two second grounding belts are positioned on the second step part and arranged on two sides of the microstrip line in the Y direction and respectively correspond to the two first grounding belts;
the two first grounding belts are connected with the two second grounding belts which respectively correspond to the two first grounding belts through at least one second gold wire connecting wire.
Optionally, the two first grounding strips are disposed along an edge of the first step portion, and the two second grounding strips are disposed along an edge of the second step portion.
Optionally, a plurality of ground holes are respectively disposed on the first ground strip and the second ground strip.
Optionally, the apparatus further comprises: a first grounding sheet attached to the upper surface of the first step part; a first substrate positioned between the first ground pad and the first ground strap;
a second grounding sheet is attached to the upper surface of the second step part; a second substrate positioned between the second ground pad and the second ground strap;
the edge of the grounding hole on the first grounding belt extends downwards to form a first grounding part; the first grounding part penetrates through the first substrate and is connected with the first grounding piece;
the edge of the grounding hole on the second grounding strip extends downwards to form a second grounding part; the second grounding part penetrates through the second substrate and is connected with the second grounding piece.
Optionally, two ends of the base respectively extend upwards to form an extension part;
and the extension part is provided with an insulator communicated with the microstrip line.
Optionally, the insulator comprises a fixing portion in the extension portion;
an input part formed by the other end surface of the fixing part protruding outwards; and
and the output part is formed by the outward bulge of the other end surface of the fixing part.
Optionally, projections of the two microstrip lines on a horizontal plane are located on the same straight line.
The beneficial effect of this application is as follows:
aiming at the problems in the prior art, the application provides a microwave transmission device, because the first step part and the second step part have height difference, the microstrip lines respectively positioned on the first step part and the second step part also have height difference; the two microstrip lines with the height difference are connected in a bonding mode through the first gold wire connecting line, so that the cost is reduced, the complexity of design and assembly is reduced, the microwave interconnection between the two microstrip lines can be realized, and the microwave signals can be normally transmitted; the design of the T-shaped structure on the microstrip line can enable the two microstrip lines to realize transition matching and the transmission of low-loss microwave signals in a DC-18GHz frequency band. The standing wave is less than 1.1, the insertion loss is less than 0.24dB, and the good transmission of the ultra-wideband microwave signal is realized.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows an overall structural diagram of a microwave transmission device in one embodiment of the present application.
Fig. 2 shows a top view of a microwave transmission device in an embodiment of the present application.
Fig. 3 shows a longitudinal sectional view of the microwave transmission device in one embodiment of the present application, cut down along a microstrip line.
Fig. 4 shows a longitudinal cross-sectional view of the microwave transmission device in an embodiment of the present application cut down along the first and second grounding straps.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is further noted that, in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
To solve the problems in the prior art, an embodiment of the present application provides a microwave transmission device, as shown in fig. 1 to 4, including: a base 1 in a step structure; the base 1 comprises a first step part 11 and a second step part 12; the upper surface of the second step part 12 is lower than the upper surface of the first step part 11, and the height difference is 0.4mm to 0.6mm, preferably 0.5mm; two microstrip lines 2 are respectively formed on the first step part 11 and the second step part 12 in an extending manner along the X direction; one end of each of the two microstrip lines 2 close to each other comprises a T-shaped strip 21 in a T-shaped structure; the two T-shaped belts 21 are connected through at least one first gold wire connecting line 3. The impedance of the two microstrip lines 2 is 50 ohms; the first gold wire connecting lines 3 are made of gold, preferably three, and the distance between every two adjacent first gold wire connecting lines 3 is 0.18mm to 0.22mm, preferably 0.2mm; the projections of the two microstrip lines 2 on the horizontal plane are located on the same straight line.
In the above embodiment of the present application, since the first step portion 11 and the second step portion 12 have a height difference, the microstrip lines 2 respectively located on the first step portion 11 and the second step portion 12 also have a height difference; the two microstrip lines 2 with the height difference are connected in a bonding mode through the first gold wire connecting line 3, so that the cost is reduced, the complexity of design and assembly is reduced, and the microwave interconnection between the two microstrip lines 2 can be realized, so that microwave signals can be normally transmitted; the design of the T-shaped structure on the microstrip lines 2 can enable the two microstrip lines 2 to realize transition matching and the transmission of low-loss microwave signals in a DC-18GHz frequency band. The standing wave is less than 1.1, the insertion loss is less than 0.24dB, and the good transmission of the ultra-wideband microwave signal is realized.
In an embodiment, each of the two microstrip lines 2 includes: the belt body 22 and the T-shaped belt 21 are connected in sequence; the T-shaped belt 21 includes: transition zone 211 and connecting zone 212; two ends of the transition belt 211 are respectively connected with the belt body 22 and the connecting belt 212; two ends of the first gold wire connecting line 3 are respectively connected and fixed with the connecting bands 212 of the two T-shaped belts 21. Thus, the first gold wire connecting line 3 can be connected with the two microstrip lines 2, thereby realizing the transmission of microwave signals; further, the width of the transition belt 211 in the Y direction is smaller than the width of the belt body 22 in the Y direction, and the width of the belt body 22 in the Y direction is smaller than the width of the connection belt 212 in the Y direction. In the actual transmission process, the first gold wire connection can be equivalent to an inductor, and the inductance can be generated to bring loss to microwave transmission; in the T-shaped belt 21, the connecting belt 212 has a larger width in the Y direction, so that the sensitivity brought by the first gold wire connecting line 3 can be counteracted, and the loss of the microwave signal in the transmission process is greatly reduced; the placement of the connecting band 212 changes the characteristic impedance of the belt body 22, and the transition band 211 is used to achieve impedance matching between the belt body 22 and the connecting band 212. The impedance of both microstrip lines 2 in this application is 50 ohms.
In one embodiment, two first grounding strips 4 are located on the first step portion 11 and disposed on two sides of the microstrip line 2 in the Y direction; two second grounding strips 5 which are located on the second step portion 12 and are arranged on two sides of the microstrip line 2 in the Y direction and respectively correspond to the two first grounding strips 4; the two first grounding strips 4 are connected with the two corresponding second grounding strips 5 through at least one second gold wire connecting wire 6; preferably one. The design of the first grounding band 4 and the second grounding band 5 enables the whole microwave transmission device to be grounded, and the use safety is ensured; the design of the second gold wire connecting wire 6 enables the first grounding belt 4 and the second grounding belt 5 to be connected into a whole, so that the continuity of the first grounding belt 4 and the second grounding belt 5 is realized, and the loss of microwave transmission is reduced.
In a specific embodiment, a plurality of grounding holes 7 are respectively arranged on the first grounding strap 4 and the second grounding strap 5. The plurality of ground holes 7 may be arranged in a matrix; the device further comprises: a first grounding piece 81 attached to the upper surface of the first step portion 11; a first substrate 82 positioned between the first grounding plate 81 and the first grounding strap 4; a second ground strip 91 attached to the upper surface of the second stepped portion 12; a second substrate 92 positioned between the second ground strip 91 and the second ground strip 5; a first grounding part 71 is formed by extending downwards the edge of the grounding hole 7 on the first grounding strip 4; the first ground portion 71 is connected to the first ground piece 81 through the first substrate 82; a second grounding part 72 is formed by extending the edge of the grounding hole 7 on the second grounding strip 5 downwards; the second ground portion 72 is connected to the second ground piece 91 through the second substrate 92. With the above arrangement, the first and second grounding strips 4 and 5 can be grounded because the first and second grounding strips 81 and 91 are in the grounded state.
In a specific embodiment, as shown in fig. 1, two first grounding straps 4 are disposed along the edge of the first step portion 11, and two second grounding straps 5 are disposed along the edge of the second step portion 12. The grounding area of the microwave device is increased, and the reliability of microwave signal transmission is ensured.
In a specific embodiment, two ends of the base 1 respectively extend upwards to form extending portions 13; the extension part 13 is internally provided with an insulator 10 communicated with the microstrip line 2; the insulator 10 comprises a fixing portion 101 in the extension portion 13; an input part 102 formed by protruding outward from the other end surface of the fixing part 101; and an output part 103 formed by the other end surface of the fixing part 101 protruding outward. Only one extension 13 is shown in fig. 1; specifically, as shown in the extension portion 13 and the insulator 10 of fig. 3, the insulator 10 includes a fixing portion 101 located in the extension portion 13; an input portion 102 formed by protruding an end surface of the fixing portion 101 away from the microstrip line 2 outward; and an output portion 103 formed by an end surface of the fixing portion 101 near the microstrip line 2 being protruded outward. Since the microwave signal is transmitted in the same direction, in the other extension portion 13 and the insulator 10, which are not shown, an end surface of the fixing portion 101 close to the microstrip line 2 is formed to protrude outward as an input portion 102, and an end surface of the fixing portion 101 away from the microstrip line 2 is formed to protrude outward as an output portion 103. The insulator 10 may be used to receive microwave signals and output microwave signals from a microwave transmission device. The length of the micro transmission device in the X direction can be reduced by the design of the extension portion 13, which facilitates the communication between the insulator 10 and the microstrip line 2.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. A microwave transmission device, comprising:
a base having a stepped structure;
the base comprises a first step part and a second step part;
the upper surface of the second step part is lower than the upper surface of the first step part;
two microstrip lines are respectively formed on the first step part and the second step part in an extending manner along the X direction;
one end, close to each other, of each of the two microstrip lines comprises a T-shaped belt in a T-shaped structure;
the two T-shaped belts are connected through at least one first gold wire connecting line.
2. Microwave transmission device according to claim 1,
two microstrip lines all include: the belt body and the T-shaped belt are sequentially connected;
the T-belt comprises: a transition zone and a connecting zone; two ends of the transition belt are respectively connected with the belt body and the connecting belt;
and two ends of the first gold wire connecting line are respectively connected and fixed with the connecting bands of the two T-shaped belts.
3. Microwave transmission device according to claim 2,
the width of the transition belt in the Y direction is smaller than the width of the belt body in the Y direction, and the width of the belt body in the Y direction is smaller than the width of the connecting belt in the Y direction.
4. Microwave transmission device according to claim 1,
the two first grounding strips are positioned on the first step part and are arranged on two sides of the microstrip line in the Y direction; two second grounding strips which are positioned on the second step part and are arranged on two sides of the microstrip line in the Y direction and are respectively arranged corresponding to the two first grounding strips;
the two first grounding belts are connected with the two second grounding belts which respectively correspond to the two first grounding belts through at least one second gold wire connecting wire.
5. Microwave transmission device according to claim 4,
two the first ground connection area all follows the border setting of first step portion, two the second ground connection area all follows the border setting of second step portion.
6. Microwave transmission device according to claim 4,
a plurality of grounding holes are formed in the first grounding strip and the second grounding strip respectively.
7. Microwave transmission device according to claim 6,
the device further comprises: a first grounding sheet attached to the upper surface of the first step part; a first substrate positioned between the first ground pad and the first ground strap;
a second grounding sheet is attached to the upper surface of the second step part; a second substrate positioned between the second ground pad and the second ground strap;
the edge of the grounding hole on the first grounding strip extends downwards to form a first grounding part; the first grounding part penetrates through the first substrate and is connected with the first grounding piece;
the edge of the grounding hole on the second grounding strip extends downwards to form a second grounding part; the second grounding part penetrates through the second substrate and is connected with the second grounding piece.
8. Microwave transmission device according to claim 1,
two ends of the base respectively extend upwards to form extending parts;
and the extension part is provided with an insulator communicated with the microstrip line.
9. Microwave transmission device according to claim 8,
the insulator comprises a fixing part positioned in the extension part;
an input part formed by the other end surface of the fixing part protruding outwards; and
and the output part is formed by the outward bulge of the other end surface of the fixing part.
10. Microwave transmission device according to claim 1,
the projections of the two microstrip lines on the horizontal plane are positioned on the same straight line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210572000.3A CN115173010A (en) | 2022-05-25 | 2022-05-25 | Microwave transmission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210572000.3A CN115173010A (en) | 2022-05-25 | 2022-05-25 | Microwave transmission device |
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| Publication Number | Publication Date |
|---|---|
| CN115173010A true CN115173010A (en) | 2022-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210572000.3A Pending CN115173010A (en) | 2022-05-25 | 2022-05-25 | Microwave transmission device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215377B1 (en) * | 1998-05-26 | 2001-04-10 | Microsubstrates Corporation | Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format |
| CN108134171A (en) * | 2017-12-20 | 2018-06-08 | 北京遥感设备研究所 | A kind of Ku band broadband Waveguide-microbelt converters of coaxial probe transition type |
| CN108428989A (en) * | 2018-03-29 | 2018-08-21 | 南京邮电大学 | A kind of substrate is to substrate broadband interconnection architecture |
| CN111555006A (en) * | 2020-05-21 | 2020-08-18 | 深圳振华富电子有限公司 | Gold wire transition structure of Ka-band grounding coplanar waveguide |
| CN111834720A (en) * | 2020-07-10 | 2020-10-27 | 北京邮电大学 | Gold wire bonding structure based on multi-branch matching and multi-chip microwave circuit |
-
2022
- 2022-05-25 CN CN202210572000.3A patent/CN115173010A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215377B1 (en) * | 1998-05-26 | 2001-04-10 | Microsubstrates Corporation | Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format |
| CN108134171A (en) * | 2017-12-20 | 2018-06-08 | 北京遥感设备研究所 | A kind of Ku band broadband Waveguide-microbelt converters of coaxial probe transition type |
| CN108428989A (en) * | 2018-03-29 | 2018-08-21 | 南京邮电大学 | A kind of substrate is to substrate broadband interconnection architecture |
| CN111555006A (en) * | 2020-05-21 | 2020-08-18 | 深圳振华富电子有限公司 | Gold wire transition structure of Ka-band grounding coplanar waveguide |
| CN111834720A (en) * | 2020-07-10 | 2020-10-27 | 北京邮电大学 | Gold wire bonding structure based on multi-branch matching and multi-chip microwave circuit |
Non-Patent Citations (1)
| Title |
|---|
| 徐靖雄等: "一种用于毫米波的共面波导间的宽带互联结构", 《电子元件与材料》, vol. 38, no. 6, pages 1 - 9 * |
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