CN115171193A

CN115171193A - 3D optical sensor structure based on notebook computer and use method

Info

Publication number: CN115171193A
Application number: CN202210886465.6A
Authority: CN
Inventors: 王槐; 唐业飞; 万来保
Original assignee: Suzhou Yabohan Intelligent Technology Co ltd
Current assignee: Suzhou Yabohan Intelligent Technology Co ltd
Priority date: 2022-07-26
Filing date: 2022-07-26
Publication date: 2022-10-11

Abstract

The invention discloses a 3D optical sensor structure based on a notebook computer and a using method thereof, comprising a speckle projector, wherein the speckle projector emits speckles to project to the face of a human body, and a 3D facial makeup is drawn; the infrared camera is arranged corresponding to the speckle projector, reads the 3D facial makeup of the face of the user and captures the infrared image of the face of the user; the system also comprises a color camera for shooting a 2D color picture of the face of the user; the system also comprises an image processing chip, wherein the image processing chip integrates information and analyzes and calculates to obtain a 3D modeling graph; the speckle projector, the infrared camera, the color camera and the image processing chip are all arranged on the PCB mainboard; the 3D optical sensor based on the notebook computer, which is designed by the scheme, can capture dynamic expressions, recognize human faces and gestures, interact videos, and is complete in function and wide in application through the cooperation of the speckle projector, the infrared camera, the color camera and the image processing chip.

Description

3D optical sensor structure based on notebook computer and use method

Technical Field

The invention relates to the technical field of 3D shooting identification modules, in particular to a 3D optical sensor structure based on a notebook computer and a using method thereof.

Background

The sensor module on the notebook computer can shoot, chat with video and meet the video conference through the camera, but under the environment of intelligent rapid development, the requirement of users on electronic products is higher and higher, and the single functions of shooting, chatting with video and the like can not meet the requirements of users. Therefore, nowadays, with the background of the notebook computer becoming thinner and smaller, the sensor module is left useless and unfortunately, and the user experience effect is poor when the notebook computer is used in a dark environment.

Disclosure of Invention

In order to overcome the defects, the invention aims to provide a 3D optical sensor structure based on a notebook computer and a using method thereof, which can capture dynamic expressions, perform face and gesture recognition and video interaction through the cooperation of a speckle projector, an infrared camera and a color camera with an image processing chip, have complete functions and wide application, and thus effectively solve the technical problems of single function and poor user experience of a sensor module on the traditional notebook computer.

In order to achieve the above purposes, the invention adopts the technical scheme that: a 3D light sensor structure based on a notebook computer, comprising a sensor module, the sensor module comprising:

the speckle projector emits speckles to project the speckles to the face of the human body, and the 3D facial makeup is drawn;

the infrared camera is arranged corresponding to the speckle projector, reads the 3D facial makeup of the face of the user and captures an infrared image of the face of the user;

the color camera is used for shooting a 2D color picture of the face of the user;

the image processing chip integrates information, and analyzes and calculates to obtain a 3D modeling graph;

the speckle projector, the infrared camera, the color camera and the image processing chip are all arranged on the PCB mainboard.

A3D light sensor structure based on notebook computer of this scheme design, through the speckle projector, the light that will have certain structural feature is projected on being shot the object, gather by special infrared camera again, this kind of light that possesses certain structure, can be because of being shot the different depth region of object, and gather different image phase information, then convert into the depth information through the change of arithmetic element with this kind of structure, shoot the 2D color picture of user's face through color camera again at last, the depth information of gathering through integrating infrared camera and the 2D color picture that color camera shot, process through the algorithm and reachs three-dimensional structure.

The beneficial effects of the invention are as follows: the adaptability is strong: the device is available at night, can capture dynamic expressions, and can recognize changes of faces, makeup and gestures; the anti-counterfeiting performance is strong: the living body detection can be carried out, and the attack of pictures and videos is completely eradicated; the application is wide: the method can be widely applied to face brushing payment, face recognition, game interaction and the like; the whole function is complete, uses extensively to solve sensor module on traditional notebook computer effectively, the function singleness, user experience is poor technical problem.

Further, the speckle projector, the infrared camera and the color camera are arranged on the PCB mainboard in a straight line side by side mode; the speckle projector, the infrared camera and the color camera are arranged side by side, so that the functions of speckle projection, infrared shooting, photo shooting and the like can be conveniently performed on an object at the same time.

Further, the sensor module further comprises a transmission interface for data transmission, and the transmission interface is arranged on the PCB mainboard; the transmission interface may be used to transmit data and may also be used to provide power support for the sensor module.

Further, the transmission interface is connected with a USB connector and/or a MIPI connector; the transmission interface can be connected with one of a USB connector or a MIPI connector, and can also be simultaneously connected with the USB connector and the MIPI connector.

Further, the speckle projector includes a diffractive optical element, a laser chip, and a housing; the laser chip is bonded with the PCB mainboard through conductive silver adhesive, and the laser chip is connected with a bonding pad on the PCB mainboard through a gold wire; after the diffractive optical element is bonded with the shell seat through glue, the shell seat is bonded with the PCB main board through the glue, and the laser chip is located inside the shell seat.

Further, infrared camera includes first imaging chip and first camera lens, first imaging chip adopts COB encapsulation or CSP packaging mode to set up on the PCB mainboard, first camera lens pass through glue with the bonding of PCB mainboard.

Further, color camera includes second imaging chip and second camera lens, second imaging chip adopts COB encapsulation or CSP packaging mode to set up on the PCB mainboard, the second camera lens pass through glue with the bonding of PCB mainboard.

The imaging chips of the infrared camera and the color camera can adopt two modes of COB packaging or CSP packaging, wherein the COB packaging is to adhere a bare chip on an interconnection substrate by using conductive or non-conductive adhesive and then carry out lead bonding to realize the electrical connection of the bare chip, and the packaging mode has the advantages of saving space and simplifying packaging operation; the CSP packaging is a latest generation of memory chip packaging technology, and its technical performance is improved. CSP packaging allows the ratio of chip area to package area to exceed 1.14, which is quite close to the ideal case of 1:1; both packaging cases have their own advantages, and can be selected correspondingly according to different situations by combining the production process and the manufacturing cost.

Furthermore, the shape of the first lens and the shape of the second lens are both elliptical, and two sides of the first lens are flat structures and are arranged corresponding to two side edges of the PCB; the color camera and the infrared camera are designed through narrow frames, so that the space of the notebook can be saved, the background of lightness, thinness and miniaturization of the notebook at the present stage is met, and the requirements of consumers are met.

Furthermore, the image processing chip and the transmission interface are both arranged on the PCB mainboard in an SMT mounting mode.

SMT is a surface assembly technique, the most popular technique and process in the electronic assembly industry. The surface mounting technology for electronic circuits is called surface mount technology or surface mount technology, and is a circuit mounting and connecting technology in which surface mounted components without pins or short leads are mounted on the surface of a printed circuit board (i.e. a PCB main board) or the surface of other substrates and then soldered and assembled by means of reflow soldering, dip soldering, or the like.

The scheme also provides a use method of the 3D optical sensor based on the notebook computer, and the use method comprises the following steps:

s1, a speckle projector emits speckles, projects the speckles invisible to naked eyes on the face of a user, and starts to draw a 3D facial makeup;

s2: the infrared camera is matched with the speckle projector, reads a 3D facial makeup of the face of the user, captures an infrared image of the face of the user, and sends data to the image processing chip;

s3, the color camera shoots a 2D color picture of the face of the user and sends data to the image processing chip;

and S4, integrating the data sent by the infrared camera and the 2D color picture of the face of the user of the color camera by the image processing chip, and obtaining a 3D modeling graph through algorithm processing.

Drawings

Fig. 1 is a schematic view of an overall structure of a 3D optical sensor according to an embodiment of the present invention.

Fig. 2 is an exploded view of a 3D optical sensor according to an embodiment of the invention.

In the figure: 1. a PCB main board; 2. a speckle projector; 3. an infrared camera; 4. a color camera; 5. an image processing chip; 6. a transmission interface;

2.1, a diffractive optical element; 2.2, laser chip; 2.3, a shell seat;

3.1, a first imaging chip; 3.2, a first lens;

4.1, a second imaging chip; 4.2 and a second lens.

Detailed Description

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the present invention more comprehensible to those skilled in the art, and will thus provide a clear and concise definition of the scope of the present invention.

In the description of the present invention, it should be further noted that, unless otherwise specifically stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediary, and a communication between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1, the embodiment of the invention provides a 3D optical sensor structure based on a notebook computer and a using method thereof, comprising a speckle projector 2, wherein the speckle projector 2 emits speckles to project onto the face of a human body, and draws a 3D facial makeup; the device also comprises an infrared camera 3, wherein the infrared camera 3 is arranged corresponding to the speckle projector 2, reads a 3D facial makeup of the face of the user and captures an infrared image of the face of the user; the device also comprises a color camera 4 for shooting a 2D color picture of the face of the user; the system also comprises an image processing chip 5, wherein information is integrated, and a 3D modeling graph is obtained through analysis and calculation; still include PCB mainboard 1, speckle projector 2 infrared camera 3 color camera 4 and image processing chip 5 all sets up on the PCB mainboard 1.

The 3D light sensor structure based on the notebook computer, which is designed by the scheme, has the following specific principle: through speckle projector 2, the light that will have certain structural feature is projected on being shot the object, gather by special infrared camera 3 again, this kind of light that possesses certain structure, can be because of the different depth regions of being shot the object, and gather different image phase information, then convert into depth information through the change of arithmetic unit with this kind of structure, shoot the 2D color picture of user's face through color camera 4 again at last, through the 2D color picture of integrating the depth information that infrared camera 3 gathered and color camera 4 and shoot, process through the algorithm and obtain three-dimensional structure.

The advantages of this embodiment are:

1. the adaptability is strong: the device is available at night, can capture dynamic expressions, and can recognize changes of faces, makeup and gestures;

2. the anti-counterfeiting performance is strong: the living body detection can be carried out, and the attack of photos and videos is completely avoided;

3. the application is wide: the method can be widely applied to face brushing payment, face recognition, game interaction and the like;

in conclusion, the 3D optical sensor structure based on the notebook computer is complete in overall function and wide in application, and therefore the technical problems that a sensor module on the traditional notebook computer is single in function and poor in user experience are effectively solved.

Preferably, on the basis of the above embodiment, the speckle projector 2, the infrared camera 3 and the color camera 4 are linearly arranged side by side on the PCB main board 1.

The speckle projector 2, the infrared camera 3 and the color camera 4 are arranged side by side, so that the functions of speckle projection, infrared shooting, photo shooting and the like can be conveniently performed on an object at the same time.

Specifically, the sensor module further comprises a transmission interface 6 for data transmission, and the transmission interface 6 is arranged on the PCB main board 1.

The transmission interface 6 may be used to transmit data and may also be used to provide power support for the sensor module.

Specifically, the transmission interface 6 is connected with a USB connector and/or an MIPI connector;

the transmission interface 6 may be connected to one of a USB connector or a MIPI connector, or may be connected to both the USB connector and the MIPI connector.

Specifically, on the basis of the above embodiment, the mounting structure of the speckle projector 2 and the PCB board is specifically described, as shown in fig. 2, the speckle projector 2 includes a diffractive optical element 2.1, a laser chip 2.2, and a housing 2.3; the laser chip 2.2 is bonded with the PCB mainboard 1 through conductive silver adhesive, and the laser chip 2.2 is connected with a bonding pad on the PCB mainboard 1 through a gold thread; after the diffractive optical element 2.1 and the shell base 2.3 are bonded through glue, the shell base 2.3 is bonded with the PCB main board 1 through glue, and the laser chip 2.2 is located inside the shell base 2.3.

Laser chip 2.2 is speckle projector 2's main components and parts, it sets up on PCB mainboard 1, casing 2.3 covers laser chip 2.2 inside it, then set up diffraction optical element 2.1 at casing 2.3's top, constitute whole speckle projector 2, laser chip 2.2 bonds with PCB mainboard 1 through electrically conductive silver glue, and laser chip 2.2 is connected with the pad on the PCB mainboard 1 through the gold thread, diffraction optical element 2.1 passes through glue bonding with casing 2.3, then casing 2.3 reuse glue glues and fixes on the PCB board.

Specifically, on the basis of the above embodiment, a specific description is given to a mounting structure of the infrared camera 3, as shown in fig. 2, the infrared camera 3 includes a first imaging chip 3.1 and a first lens 3.2, the first imaging chip 3.1 is disposed on the PCB main board 1 in a COB packaging manner or a CSP packaging manner, and the first lens 3.2 is bonded to the PCB main board 1 by glue.

Specifically, on the basis of the above embodiment, a specific description is given to a mounting structure of the color camera 4, as shown in fig. 2, the color camera 4 includes a second imaging chip 4.1 and a second lens 4.2, the second imaging chip 4.1 is disposed on the PCB main board 1 by adopting a COB package or CSP package manner, and the second lens 4.2 is adhered to the PCB main board 1 by glue.

The imaging chips of the infrared camera 3 and the color camera 4 can adopt two modes of COB packaging or CSP packaging, wherein the COB packaging is to adhere a bare chip on an interconnection substrate by conductive or non-conductive adhesive and then realize the electrical connection by lead bonding, and the packaging mode has the advantages of saving space and simplifying packaging operation; the CSP packaging is a latest generation of memory chip packaging technology, and its technical performance is improved. CSP packaging allows the ratio of chip area to package area to exceed 1.14, which is quite close to the ideal case of 1:1; both packaging cases have their own advantages, and can be selected according to different situations by combining the production process and the manufacturing cost.

Preferably, the shape of the first lens 3.2 and the shape of the second lens 4.2 are both elliptical, and two sides of the first lens are flat structures and are arranged corresponding to two side edges of the PCB.

The color camera 4 and the infrared camera 3 can save the space of the notebook through the design of the narrow frame, meet the background of lightness, thinness and miniaturization of the notebook at the present stage and meet the requirements of consumers.

Further, the image processing chip 5 and the transmission interface 6 are both disposed on the PCB main board 1 by SMT mounting.

Another embodiment of the present invention provides a method for using a 3D light sensor based on a notebook computer, including the steps of:

s1, a speckle projector 2 emits speckles, projects the speckles invisible to naked eyes on the face of a user, and starts to draw a 3D facial makeup;

s2: the infrared camera 3 is matched with the speckle projector 2, reads a 3D facial makeup of the face of the user, captures an infrared image of the face of the user, and sends data to the image processing chip 5;

s3, the color camera 4 shoots a 2D color picture of the face of the user and sends data to the image processing chip 5;

and S4, integrating the data sent by the infrared camera 3 and the 2D color picture of the face of the user of the color camera 4 by the image processing chip 5, and obtaining a 3D modeling graph through algorithm processing.

The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a 3D light sensor structure based on notebook computer, includes sensor module, its characterized in that: the sensor module includes:

2. The notebook-based 3D light sensor structure of claim 1, wherein: the speckle projector, the infrared camera and the color camera are arranged on the PCB mainboard in a straight line side by side mode.

3. The notebook-based 3D light sensor structure of claim 1, wherein: the sensor module further comprises a transmission interface for data transmission, and the transmission interface is arranged on the PCB mainboard.

4. The notebook-based 3D light sensor structure of claim 3, wherein: the transmission interface is connected with a USB connector and/or an MIPI connector.

5. The notebook-based 3D light sensor structure of claim 1, wherein: the speckle projector comprises a diffraction optical element, a laser chip and a shell seat; the laser chip is bonded with the PCB mainboard through conductive silver adhesive, and the laser chip is connected with a bonding pad on the PCB mainboard through a gold wire; and after the diffractive optical element is bonded with the shell seat through glue, the shell seat is bonded with the PCB mainboard through glue, and the laser chip is positioned inside the shell seat.

6. The notebook-based 3D light sensor structure of claim 1, wherein: the infrared camera comprises a first imaging chip and a first lens, wherein the first imaging chip is arranged on the PCB mainboard in a COB (chip on board) packaging or CSP (chip scale package) packaging mode, and the first lens is adhered to the PCB mainboard through glue.

7. The notebook-based 3D light sensor structure of claim 6, wherein: the color camera includes second imaging chip and second camera lens, second imaging chip adopts COB encapsulation or CSP packaging mode to set up on the PCB mainboard, the second camera lens pass through glue with the bonding of PCB mainboard.

8. The notebook-based 3D light sensor structure of claim 7, wherein: the shape of the first lens and the shape of the second lens are both oval, and two sides of the first lens are flat structures and are arranged corresponding to two side edges of the PCB.

9. The notebook-based 3D light sensor structure of claim 3, wherein: the image processing chip and the transmission interface are arranged on the PCB mainboard in an SMT mounting mode.

10. A method for using a 3D light sensor based on a notebook computer according to any one of claims 1 to 9, characterized in that: the using method comprises the following steps: