CN115165437A - Method for making slices - Google Patents
Method for making slices Download PDFInfo
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- CN115165437A CN115165437A CN202210769515.2A CN202210769515A CN115165437A CN 115165437 A CN115165437 A CN 115165437A CN 202210769515 A CN202210769515 A CN 202210769515A CN 115165437 A CN115165437 A CN 115165437A
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- sample
- intermediate sample
- wafer
- sample wafer
- grinding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/2806—Means for preparing replicas of specimens, e.g. for microscopal analysis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/36—Embedding or analogous mounting of samples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
- G01N2001/2886—Laser cutting, e.g. tissue catapult
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/36—Embedding or analogous mounting of samples
- G01N2001/366—Moulds; Demoulding
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The application relates to the technical field of circuit board detection, in particular to a slice manufacturing method. A method for making a slice, the method comprising: sampling on a circuit board to be tested to obtain a sample wafer; marking the sample wafer to obtain a target detection position; placing a sample wafer between two supporting plates, clamping the sample wafer by the two supporting plates to enable the plane of the sample wafer to be vertical to the observation surface, and packaging by using glue to clamp the sample wafer to obtain a middle sample; placing the intermediate sample on a backing plate, sleeving the intermediate sample on a mold, and pouring glue solution into the mold for sealing; taking the intermediate sample out of the mold, and grinding the intermediate sample; polishing the intermediate sample after grinding to obtain a slice. Through setting up two backup pads and pressing from both sides tight sample wafer, reduce sample wafer atress deformation in grinding process, reduce the risk that sample wafer is dragged the extension and loses original appearance in grinding process, promote detection accuracy and section preparation yield.
Description
Technical Field
The application relates to the technical field of circuit board detection, in particular to a manufacturing method of a slice.
Background
The quality of the circuit board, the occurrence and solution of the problems and the improvement of the manufacturing process all need to observe the circuit board slice as the basis for research and judgment. The quality of the circuit board and the problems in the manufacturing process are judged by observing the hole wall of the circuit board slice. The traditional slice manufacturing method is difficult to ensure the verticality of the slice specimen and the plane, so that the observation is unclear and distorted, and the scrapping and rework are caused.
Disclosure of Invention
The application provides a manufacturing method of a slice, aiming at improving the slice manufacturing yield.
The application provides a manufacturing method of a slice, which comprises the following steps:
sampling on a circuit board to be tested to obtain a sample wafer;
marking the sample wafer to obtain a target detection position;
placing the sample wafer between two supporting plates, clamping the sample wafer by the two supporting plates to enable the plane of the sample wafer to be perpendicular to the observation surface, and packaging with glue to clamp the sample wafer to obtain an intermediate sample;
placing the intermediate sample on a backing plate, sleeving a mold on the intermediate sample, and pouring glue solution into the mold for sealing;
taking the intermediate sample out of the mold, and grinding the intermediate sample;
and polishing the ground intermediate sample to obtain a slice.
In one possible design, the support plate is a transparent plate.
In one possible design, the method of making further comprises:
after the target detection position is obtained, arranging an identification part at the target detection position;
and grinding the intermediate sample until the mark part disappears, and then finishing grinding.
In one possible embodiment, the marking has a color.
In one possible design, the method of making further comprises:
the plane where the base plate is located is perpendicular to the observation surface;
the intermediate sample is vertically placed on the pad.
In one possible design, the pad has an adhesive portion, and the intermediate sample and the pad are connected by the adhesive portion.
In one possible design, the glue solution is a cured resin.
In one possible design, the method of making further comprises:
in the process of grinding the intermediate sample, 200-mesh sand paper is used for grinding the intermediate sample to a position close to the tail end of the identification part, and then 600-mesh sand paper is used for grinding the intermediate sample until the identification part disappears so as to grind the intermediate sample to the target detection position.
In one possible design, the method of making further comprises:
and in the process of polishing the intermediate sample, polishing by adopting 1500-mesh sand paper, 2500-mesh sand paper and polishing cloth in sequence.
In a possible design, the sample wafer is provided with a plurality of target holes, and the target detection position is the position of a central connecting line of the plurality of target holes.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is a schematic structural diagram of a coupon provided herein;
FIG. 2 is a schematic diagram of a process for packaging a sample wafer according to the present application
FIG. 3 is a schematic diagram illustrating a process of placing a pad on an intermediate sample;
FIG. 4 is a schematic view illustrating a process of sealing the intermediate sample.
Reference numerals are as follows:
1-sample wafer;
11-target detection position;
12-an identification portion;
13-a targeting orifice;
2-intermediate sample;
3-a support plate;
4-a backing plate;
41-an adhesive part;
and 5, molding.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely a relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that the directional terms such as "upper", "lower", "left", "right", etc. described in the embodiments of the present application are described in the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
The quality of the circuit board, the occurrence and the solution of the problems and the improvement of the manufacturing process all need to use observation of the circuit board slices as the basis for research and judgment. The quality of the circuit board and the problems in the manufacturing process are judged by observing the hole wall of the circuit board slice, a slice analysis main user checks the thickness, the number of layers, the hole diameter and the quality light difference of the through hole in the circuit board, and the slice analysis main user is used for detecting the holes in the welding spot of the circuit board, the interface combination condition, the wetting quality evaluation and the like, and the quality of slice manufacture influences whether correct and real judgment can be obtained. If the section of the manufactured slice is asymmetrical vertically and inaccurate in precision, the actual appearance cannot be visually shown, and the slice is scrapped and reworked.
In order to solve the above technical problem, this embodiment provides a method for manufacturing a slice, as shown in fig. 1 to 4, the method includes: sampling on a circuit board to be tested to obtain a sample wafer 1; marking the sample wafer 1 to obtain a target detection position 11; placing a sample 1 between two supporting plates 3, clamping the sample 1 by the two supporting plates 3 to ensure that the plane of the sample 1 is vertical to the observation surface, and packaging by using glue to clamp the sample 1 to obtain an intermediate sample 2; placing the intermediate sample 2 on a backing plate 4, sleeving the intermediate sample 2 on a mold 5, and pouring glue solution into the mold 5 for sealing; taking out the intermediate sample 2 from the mold 5, and grinding the intermediate sample 2; the intermediate sample 2 after grinding is polished to obtain a slice.
In this embodiment, a circuit board to be tested is firstly cut by laser to obtain a sample 1 with a proper size, then a plurality of target holes 13 are drilled on the sample 1 by laser, the target holes 13 are uniformly arranged in multiple rows, one row of the target holes 13 is selected as a target hole 13 to be observed, and the row of the target holes 13 is marked on the sample 1. Preparing two supporting plates 3, namely a first supporting plate and a second supporting plate, arranging the first supporting plate on the lower end face of the sample wafer 1, arranging the second supporting plate on the upper end face of the sample wafer 1, clamping the sample wafer 1 by the first supporting plate and the second supporting plate to ensure that the plane of the sample wafer 1 is vertical to the observation surface, and encapsulating the sample wafer to form a middle sample 2 by using transparent glue. Placing the prepared intermediate sample 2 on a backing plate 4, then sleeving a mold 5 into the intermediate sample 2, filling glue solution into the mold 5, sealing the glue solution after the glue solution is cured, taking out the intermediate sample 2 from the mold 5, grinding and polishing the intermediate sample 2 to obtain a clear slice, and clearly displaying the slice on a microscope for observation. This embodiment reduces sample 1 and warp at the grinding in-process atress through setting up two backup pads 3 and pressing from both sides tight sample 1, reduces sample 1 and is dragged the risk that extends and lose original appearance at the grinding in-process, promotes detection precision and section preparation yield.
The observation surface is the surface to be detected of the sample wafer 1, and may also be the surface to be ground of the intermediate sample 2.
Specifically, as shown in fig. 1, the target detection position 11 is a position of a center connecting line of each target hole 13 to be observed, that is, a half-hole position of the target hole 13 is the target detection position 11, and after the intermediate sample 2 is ground and polished to the target detection position 11, a hole wall of each target hole 13 is detected to detect the quality of the circuit board.
The two supporting plates 3 are made of transparent materials, and can be transparent acrylic plates. By clamping the sample wafer 1 by using two transparent acrylic plates, the distance from the grinding surface of the middle sample 2 to the target detection position 11 can be clearly seen through the acrylic plates, so that the grinding amount can be controlled in the grinding process.
In one possible design, as shown in fig. 1, the manufacturing method further includes: after obtaining the target detection position 11, arranging an identification part 12 at the target detection position 11; the intermediate sample 2 is polished until the marker 12 disappears, and reaches the target detection position 11, thereby completing polishing. In this embodiment, after the target detection position 11 is marked on the sample 1, the marking part 12 is placed on the sample 1, one end face of the marking part 12 coincides with the surface to be polished, the other end face coincides with the target detection position 11, the sample 1 is polished while the marking part is polished, so that the intermediate sample 2 can judge whether the target detection position 11 is polished or not by observing the marking part 12 during the polishing process, the marking part 12 is polished to be completely disappeared, that is, the intermediate sample 2 is polished to the target detection position 11, and the polishing can be stopped.
Wherein, sign portion 12 can be the plastic slab that has the colour, conveniently observes the surplus of sign portion 12 through backup pad 3 to learn the face of waiting to grind apart from the distance of target detection position 11. The thickness of the plastic plate is thinner, and the positioning sample wafer 1 of the two supporting blocks is not influenced.
In one possible design, the method of making further comprises: the plane of the backing plate 4 is vertical to the observation surface; the intermediate sample 2 is placed vertically on the pad 4. By arranging the plane of the backing plate 4 perpendicular to the observation plane, it is ensured that the position of the sample 1 is not inclined after the intermediate sample 2 is arranged on the backing plate 4, and the plane of the sample 1 is kept perpendicular to the observation plane, so that the section state of the slice can be observed later.
As shown in fig. 3, the pad 4 is provided with an adhesive portion 41, and the intermediate sample 2 and the pad 4 are connected by the adhesive portion 41. In this embodiment, the adhesive portion 41 may be a double-sided tape, one surface of the double-sided tape is first bonded to the backing plate 4 to form the adhesive portion 41, and the intermediate sample 2 is bonded to the adhesive portion 41 to connect the intermediate sample 2 and the backing plate 4.
The glue solution for sealing glue can be selected from cured resin, the cured resin is prepared by mixing denture powder and denture water, and the mixing ratio of the denture powder to the denture water is 1.2. After the curing resin is poured into the mold 5, the curing resin can be cured after standing for 20-25 minutes, a curing instrument is not needed, the glue pouring efficiency is improved, and the operation is convenient. In addition, compared with the conventional sealing manner, the intermediate sample 2 is cured after being placed in the oven, so that the risk of the intermediate sample 2 being deformed by baking is reduced.
In one possible design, the manufacturing method further includes: in the process of grinding the intermediate sample 2, the surface finish of the intermediate sample 2 does not need to be considered in the early stage of grinding, and the intermediate sample 2 may be roughly ground by 200-mesh sandpaper to increase the grinding efficiency of the intermediate sample 2 and ground to a position close to the end of the marker 12, that is, to a position close to the target detection position 11. In order to improve the smoothness of the surface to be detected of the target detection position 11, the intermediate sample 2 is ground to the target detection position 11 by grinding with 600-mesh sandpaper until the mark 12 disappears completely.
In the process of polishing the intermediate sample 2, 1500-mesh sandpaper, 2500-mesh sandpaper and polishing cloth are sequentially used for polishing until the sand marks generated by grinding completely disappear and are bright. The polishing pressure is light, the reciprocating times are more, and the effect is better.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A method of making a cut sheet, the method comprising:
sampling on a circuit board to be tested to obtain a sample wafer (1);
marking the sample wafer (1) to obtain a target detection position (11);
placing the sample wafer (1) between two supporting plates (3), clamping the sample wafer (1) by the two supporting plates (3) to enable the plane of the sample wafer (1) to be perpendicular to the observation surface, and packaging with glue to clamp the sample wafer (1) to obtain an intermediate sample (2);
placing the intermediate sample (2) on a backing plate (4), sleeving a mold (5) on the intermediate sample (2), and pouring glue solution into the mold (5) for sealing;
taking out the intermediate sample (2) from the mold (5), and grinding the intermediate sample (2);
and polishing the grinded intermediate sample (2) to obtain a slice.
2. Method for making a cut sheet according to claim 1, characterized in that said support plate (3) is a transparent plate.
3. The method of making a chip of claim 1, further comprising:
after the target detection position (11) is obtained, arranging an identification part (12) at the target detection position (11);
and grinding the intermediate sample (2) until the mark part (12) disappears, and then reaching the target detection position (11) to finish grinding.
4. The method for producing a sliced sheet according to claim 3, wherein the marking part (12) has a color.
5. The method of making a chip of claim 1, further comprising:
the plane where the base plate (4) is located is perpendicular to the observation surface;
the intermediate sample (2) is vertically placed on the pad (4).
6. The method for producing a slice according to claim 1, wherein the backing plate (4) is provided with an adhesive portion (41), and the intermediate sample (2) and the backing plate (4) are connected by the adhesive portion (41).
7. The method for producing a chip according to claim 1, wherein the glue solution is a curable resin.
8. The method of making a chip of claim 3, further comprising:
in the process of grinding the intermediate sample (2), 200-mesh sand paper is firstly adopted to grind the intermediate sample (2) to a position close to the tail end of the identification part (12), and then 600-mesh sand paper is adopted to grind the intermediate sample (2) until the identification part (12) disappears so as to grind the intermediate sample to the target detection position (11).
9. The method of making a chip of claim 1, further comprising:
and in the process of polishing the intermediate sample (2), polishing by adopting 1500-mesh sand paper, 2500-mesh sand paper and polishing cloth in sequence.
10. The method for producing a slice according to any one of claims 1 to 9, wherein the sample wafer (1) is provided with a plurality of target holes (13), and the target detection position (11) is a position of a center connecting line of the plurality of target holes (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210769515.2A CN115165437A (en) | 2022-06-30 | 2022-06-30 | Method for making slices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210769515.2A CN115165437A (en) | 2022-06-30 | 2022-06-30 | Method for making slices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115165437A true CN115165437A (en) | 2022-10-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210769515.2A Pending CN115165437A (en) | 2022-06-30 | 2022-06-30 | Method for making slices |
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| CN (1) | CN115165437A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115808341A (en) * | 2022-12-27 | 2023-03-17 | 胜科纳米(苏州)股份有限公司 | Grinding sample preparation method for semiconductor chip sample section |
-
2022
- 2022-06-30 CN CN202210769515.2A patent/CN115165437A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115808341A (en) * | 2022-12-27 | 2023-03-17 | 胜科纳米(苏州)股份有限公司 | Grinding sample preparation method for semiconductor chip sample section |
| CN115808341B (en) * | 2022-12-27 | 2024-01-26 | 胜科纳米(苏州)股份有限公司 | Grinding sample preparation method of semiconductor chip sample section |
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