CN115164862A - Three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and method - Google Patents
Three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and method Download PDFInfo
- Publication number
- CN115164862A CN115164862A CN202210892341.9A CN202210892341A CN115164862A CN 115164862 A CN115164862 A CN 115164862A CN 202210892341 A CN202210892341 A CN 202210892341A CN 115164862 A CN115164862 A CN 115164862A
- Authority
- CN
- China
- Prior art keywords
- harmonic oscillator
- harmonic
- frequency
- vibration
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Abstract
The invention discloses a three-dimensional shell gyro harmonic oscillator multi-harmonic comprehensive trimming system and a method. The system comprises a measuring module and a processing module; the vibration measuring clamp of the measuring module is used for fixing the harmonic oscillator, the frequency scanner is used for outputting an excitation signal and inputting modal information of the harmonic oscillator, the vibration exciter is connected with the frequency scanner, the vibration exciter is used for driving the harmonic oscillator to vibrate and controlling the frequency and amplitude of the harmonic oscillator according to the excitation signal output by the frequency scanner, the vibration pickup is connected with the frequency scanner, and the vibration pickup is used for measuring the vibration information of the harmonic oscillator and converting the vibration information into an electric signal to be input into the frequency scanner so that the frequency scanner analyzes the modal information of the harmonic oscillator according to the electric signal; the object carrying platform of the processing module is used for placing the harmonic oscillator, the laser is used for emitting laser to process an etching groove on the harmonic oscillator, and the displacement platform is used for placing the laser and adjusting the position of the laser. The invention can simplify the harmonic trimming flow to improve the processing efficiency and reduce the damage of the trimming of the removed material to the structure.
Description
Technical Field
The invention relates to the technical field of a resonant gyroscope, in particular to a system and a method for comprehensively trimming multiple harmonics of a harmonic oscillator of a three-dimensional shell gyroscope.
Background
Three-dimensional shell gyros with harmonic oscillators made of three-dimensional bodies as core sensitive elements are mainstream vibration gyros at present, and comprise types of cylindrical shell gyros, hemispherical resonance gyros, micro-hemispherical resonance gyros and the like. Ideally, the three-dimensional shell harmonic oscillator should be a rotationally symmetric structure, that is, the physical properties such as mass, rigidity, damping and the like should be uniformly distributed everywhere along the circumferential direction of the rotationally symmetric axis.
However, manufacturing errors and material defects generally prevent the three-dimensional shell resonator from achieving ideal rotational symmetry, which is characterized by non-uniform mass, rigidity and damping in the circumferential direction. The harmonic oscillator has the advantages that due to the uneven coupling effect of mass and rigidity, the modal characteristic frequency of the harmonic oscillator is influenced, and frequency cracking is caused among degenerate modes of each order of the harmonic oscillator; when the harmonic oscillator vibrates due to uneven quality, a supporting rod of the harmonic oscillator is pulled by inertia force, so that anchor point loss is generated, the anchor point loss is an important factor for reducing quality factors and uneven damping, and zero offset drift of the gyroscope is further increased; in addition, since the gyro is mounted on the movable device, the gyro is generally affected by environmental vibration noise during operation, and the environmental vibration noise of a specific frequency causes an inertial force and moment to be generated in the unbalanced mass, induces a non-operating mode, and causes mass eccentricity, thereby degrading the accuracy of the gyro in a practical application state. Therefore, the unbalanced distribution of harmonic oscillator masses, especially the first, second, third and fourth harmonics, is the biggest bottleneck limiting the performance improvement of the gyroscope at present. Most of the existing documents and patents can only realize fourth harmonic trimming under the condition of mass and rigidity coupling, namely N =2 modal frequency trimming, and comprehensive trimming technologies for first, second, third and fourth harmonics are not disclosed yet.
The conventional mechanical trimming methods include a continuous type and a discrete type. The continuous trimming usually adopts a precisely controlled turntable to control the harmonic oscillator to rotate, chemical solution etching or ion beam etching is used for removing materials of the harmonic oscillator in a large range, and the removal amount of the materials in different directions is different by adjusting the rotating speed, so that the quality balance of the harmonic oscillator is realized. The rotating speed of the rotary table needs to be adjusted through a control algorithm, the iterative process has high requirements on rotating speed parameters, and the chemical solution stability and the ion beam process consistency are high.
The discrete mode adopts modes such as mechanical drilling, laser etching, point gluing and the like to remove or add materials to local areas of the harmonic oscillator, so that the mass of areas with more mass distribution is reduced or the mass of areas with less mass distribution is increased, and balance is realized. The discrete type trimming is easy to realize quickly, the parameter iteration is efficient, and the target convergence can be realized quickly, so that most of documents and patents adopt a discrete type trimming method to realize the trimming of the N =2 modal frequency of the fourth harmonic wave at present.
However, when the discrete trimming is adopted, each trimming point can simultaneously introduce various harmonics with different sizes, so that the various harmonics after each trimming are respectively changed differently, namely, when the first harmonic is trimmed, the first harmonic, the second harmonic, the third harmonic and the fourth harmonic are all changed; when the second harmonic is modified, the second harmonic and the fourth harmonic are changed without influencing the first harmonic and the third harmonic. Therefore, the iterative process of the discrete trimming is a dynamic process and is a difficult point for designing the trimming scheme. If the optimized trimming iteration flow cannot be provided, excessive trimming in the dynamic change of the harmonic wave will cause a great deal of structural damage to the harmonic oscillator, and will generate the reduction of other important performance parameters such as quality factors.
Similar to a common N =2 modal frequency trimming method, the national defense science and technology university patent CN111504292A proposes that by measuring the N =1 modal frequency splitting of the harmonic oscillator, the second harmonic in the case of mass and rigidity coupling can be trimmed, but still the comprehensive trimming of the first, second, third and fourth harmonics with uneven mass cannot be realized. Therefore, the prior art needs to be improved and developed.
Disclosure of Invention
The invention aims to provide a three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and a method, which are used for overcoming the defects in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a three-dimensional shell gyro harmonic oscillator multi-harmonic comprehensive trimming system comprises a measuring module and a processing module; the measuring module comprises a vibration measuring clamp, a frequency scanner, a vibration exciter and a vibration pickup, wherein the vibration measuring clamp is used for fixing the harmonic oscillator, the frequency scanner is used for outputting an excitation signal and inputting harmonic oscillator modal information, the vibration exciter is connected with the frequency scanner, the vibration exciter is used for driving the harmonic oscillator to vibrate and controlling the frequency and amplitude of the harmonic oscillator according to the excitation signal output by the frequency scanner, the vibration pickup is connected with the frequency scanner, and the vibration pickup is used for measuring the vibration information of the harmonic oscillator and converting the vibration information into an electric signal to be input into the frequency scanner so that the frequency scanner analyzes the modal information of the harmonic oscillator according to the electric signal; the processing module comprises an object carrying platform, a laser, a displacement platform and a controller, wherein the object carrying platform is used for placing a harmonic oscillator, the laser is used for emitting laser to process an etching groove on the harmonic oscillator, and the displacement platform is used for placing the laser and adjusting the position of the laser.
Further, the frequency scanner is a frequency analyzer or a phase-locked amplifier, and the vibration exciter is an electrode plate, a piezoelectric plate, an electromagnet or a small hammer.
Further, the vibration pickup is an electrode plate, a piezoelectric plate, a strain gauge, a microphone or a laser vibrometer.
Furthermore, the displacement platform is a displacement platform with a triaxial displacement function, the displacement of the X axis and the displacement of the Y axis of the displacement platform are used for moving the laser to a position where a light path focus is located in a to-be-processed area of the harmonic oscillator, the laser is moved according to a specific path in the processing process to process etching grooves with different sizes, and the displacement of the Z axis of the displacement platform is used for adjusting the distance between the laser and the harmonic oscillator to focus.
The invention also provides a method for comprehensively adjusting the multiple harmonics of the gyro harmonic oscillator of the three-dimensional shell, which comprises the following steps of:
s1, performing vibration test by using a measurement module;
s2, performing first harmonic trimming by adopting a processing module;
s3, performing third harmonic trimming by adopting a processing module;
s4, performing second harmonic trimming by adopting a processing module;
and S5, performing frequency offset trimming by using the processing module.
Further, the step S1 includes:
s11, performing modal frequency sweep test on the harmonic oscillator by using a frequency sweep device to obtain low-frequency modal frequency f 1 High frequency mode frequency f 2 And judging N =2 modal frequency cracking delta f = f 2 -f 1 When Δ f is less than 100mHz, the standing wave is oriented at different orientations depending on the direction of the excitation load, otherwise, the standing wave is fixed at two orientations 45 degrees apart, wherein the orientation theta of the low-frequency modal standing wave is 1 High frequency modal standing wave orientation theta 2 ＝θ 1 +45°；
S12, judging frequency cracking delta f, and controlling the excitation frequency of the vibration exciter to f by the frequency scanner when the frequency cracking delta f is less than 100mHz 1 The initial included angle between the harmonic oscillator and the vibration exciter is phi 0 At the excitation frequency of f 1 Measuring amplitude A (phi) of three-dimensional shell of harmonic oscillator by using vibration pickup 0 ) The free end amplitude B (phi) of the supporting rod 0 ) (ii) a The harmonic oscillator rotates at least 3 times relative to the vibration exciter and the vibration pickup, wherein the ith rotation angle is recorded as phi i The sum of the three rotation angles is not more than 180 degrees, and after each rotation, the frequency scanner controls the excitation frequency of the vibration exciter to f 1 And measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup i ) The free end amplitude B (phi) of the supporting rod i )；
When the frequency cracking delta f is larger than 100mHz, the frequency scanner controls the excitation frequency of the vibration exciter to reach f 1 Measuring the orientation theta of the harmonic oscillator low-frequency mode standing wave by using a vibration pickup 1 Three-dimensional shell amplitude a (phi) 0 )＝A(θ 1 ) The free end amplitude B (phi) of the supporting rod 0 )＝B(θ 1 )；
The harmonic oscillator rotates 45 degrees relative to the vibration exciter and the vibration pickup, and the frequency sweep device controls the vibration exciting frequency of the vibration exciter to f 2 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 1 )＝A(θ 1 + 45) and amplitude B (phi) of free end of the strut 1 )＝B(θ 1 +45)；
The harmonic oscillator rotates 45 degrees relative to the vibration exciter and the vibration pickup, and the frequency sweep device controls the vibration exciting frequency of the vibration exciter to f 1 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 2 )＝A(θ 1 + 90) and amplitude B (phi) of free end of the strut 2 )＝B(θ 1 +90)；
The harmonic oscillator rotates 45 degrees relative to the vibration exciter and the vibration pickup, and the frequency sweep device controls the vibration exciting frequency of the vibration exciter to f 2 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 3 )＝A(θ 1 + 135), free end amplitude B (phi) of the strut 3 )＝B(θ 1 +135)；
S13, using the vibration test result to carry out harmonic calculation;
will A (phi) 0 )、B(φ 0 ) And each group A (phi) i )、B(φ i ) Substituting into the equation set:
obtaining the first harmonic amplitude m 1 And direction of the
And third harmonic amplitude m 3 And direction of the
Will A (phi) 0 )、B(φ 0 ) And any one of the groups A (phi) i )、B(φ i ) Substituting into the equation set:
obtaining the second harmonic amplitude m 2 And direction of the
Further, the step S2 includes:
s21, placing the harmonic oscillator on an object carrying platform, and adjusting the position and the posture of the harmonic oscillator to enable a laser light path to be perpendicular to a region to be processed of the harmonic oscillator;
s22, adjusting the X-axis displacement and the Y-axis displacement of the displacement platform, and moving the laser to a position where the light path focus is positioned on the harmonic oscillator
Orientation according to m 1 Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a plane where a light path can be focused on a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s23, repeating the step S1 and using a measuring module to carry out vibration test;
and S24, adjusting the size of the trimming groove according to the amplitude and the direction of the primary harmonic obtained in the vibration test in the step S23, and repeating the steps S21-S23 until the amplitude of the primary harmonic obtained in the vibration test is reduced to an expected value.
Further, the step S3 includes:
s31, placing the harmonic oscillator on an object carrying platform, and adjusting the position and the posture of the harmonic oscillator to enable a laser light path to be perpendicular to a region to be processed of the harmonic oscillator;
s32, obtaining a third harmonic amplitude m according to the last vibration test in the step S2 3 * And orientation
Information, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser to the position where the optical path focus is located on the harmonic oscillator
Orientation according to m 3 * Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a plane where a light path is focused on a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s33, keeping the position of the Z axis in the step S32 unchanged, adjusting the displacement of the X axis and the Y axis of the displacement platform, and moving the laser until the focus of the light path is positioned on the harmonic oscillator
Orientation, keeping the laser processing technological parameters in the step S32 unchanged, and removing materials according to the size of the trimming groove in the step S32 to form the trimming groove with the same size;
s34, keeping the position of the Z axis in the step S32 unchanged, adjusting the X axis and the Y axis displacement of the displacement platform, and moving the laser until the focus of the light path is positioned on the harmonic oscillator
Maintaining the laser processing technological parameters in the step S32 unchanged, and removing materials according to the dimension of the trimming groove in the step S32 to form the trimming groove with the same dimension;
s35, repeating the step S1 and using a measuring module to carry out vibration test;
and S36, adjusting the size of the trimming groove according to the third harmonic amplitude and the direction obtained in the step S35 through the vibration test, and repeating the steps S31 to S35 until the third harmonic amplitude obtained in the vibration test is reduced to an expected value.
Further, the step S4 includes:
s41, placing the harmonic oscillator on an object carrying platform, and adjusting the position and the posture of the harmonic oscillator to enable a laser light path to be perpendicular to a region to be processed of the harmonic oscillator;
s42, obtaining a third harmonic amplitude m according to the last vibration test in the step S3 2 * And orientation
Information, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser to the position where the optical path focus is located on the harmonic oscillator
Orientation according to m 2 * Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a plane where a light path can be focused on a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s43, keeping the Z-axis position unchanged in the step S42, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the optical path focus is positioned on the harmonic oscillator
Orientation, keeping the laser processing technological parameters in the step S42 unchanged, and removing materials according to the dimension of the trimming groove in the step S42 to form the trimming groove with the same dimension;
s44, repeating the step S41 and using the measuring module to carry out vibration test;
s45, adjusting the size of the trimming groove according to the amplitude and the direction of the second harmonic obtained in the step S44 through the vibration test, and repeating the steps S41-S44 until the amplitude of the second harmonic obtained in the vibration test is reduced to an expected value.
Further, the step S5 includes:
s51, judging the last vibration in S4Δ f from dynamic test * And theta 1 * When Δ f is * Less than 100mHz, which is satisfactory for most applications, when Δ f * When the frequency is more than 100mHz, the harmonic oscillator is placed on the object carrying platform, the position and the posture of the harmonic oscillator are adjusted, the laser light path can be perpendicular to the area to be processed of the harmonic oscillator, the X-axis and Y-axis displacement of the displacement platform is adjusted, and the laser is moved until the focus of the light path is positioned on theta of the harmonic oscillator 1 * Azimuth, according to Δ f * Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a light path to focus on a plane of a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s52, keeping the Z-axis position in the step S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the optical path focus is positioned on the harmonic oscillator theta 1 * The + 90-degree direction, keeping the laser processing technological parameters in the step S51 unchanged, and removing materials according to the size of the trimming groove in the step S51 to form the trimming groove with the same size;
s53, keeping the Z-axis position in the step S51 unchanged, adjusting the X-axis displacement and the Y-axis displacement of the displacement platform, and moving the laser until the light path focus is positioned on the harmonic oscillator theta 1 * + 180-degree orientation, keeping the laser processing technological parameters in the step S53 unchanged, and removing materials according to the trimming groove size in the step S51 to form trimming grooves with the same size;
s54, keeping the Z-axis position in the step S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the optical path focus is positioned on the harmonic oscillator theta 1 * +270 degrees, keeping the laser processing technological parameters in the step S51 unchanged, and removing materials according to the size of the trimming groove in the step S51 to form the trimming groove with the same size;
s55, repeating the step S1, and carrying out mode frequency sweep test on the harmonic oscillator by using a frequency sweep device;
and S56, adjusting the size of the trimming groove according to the frequency cracking and low-frequency modal standing wave orientation obtained by the modal frequency sweep test in the step S55, and repeating the steps S51-S55 until the frequency cracking is reduced to an expected value.
Compared with the prior art, the invention has the advantages that: the invention provides a three-dimensional shell gyro harmonic oscillator multiple harmonic comprehensive trimming system and a method, which consist of a vibration measurement module and a processing module, can simplify the harmonic trimming flow to improve the processing efficiency, reduce the excessive damage of the structure caused by removing material trimming, carry out vibration measurement-processing iteration, and can realize the comprehensive trimming of first, second and third harmonics with unbalanced mass and frequency cracking (fourth harmonic).
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a structural diagram of a measurement module in a three-dimensional shell gyro harmonic oscillator multiple harmonic comprehensive trimming system of the present invention.
Fig. 2 is a structural diagram of a processing module in the three-dimensional shell gyro harmonic oscillator multiple harmonic comprehensive trimming system of the present invention.
Fig. 3 is a flow chart of the multiple harmonic comprehensive trimming method of the three-dimensional shell gyro harmonic oscillator of the present invention.
In the figure: the device comprises a measuring module 1, a processing module 2, a vibration measuring clamp 10, a frequency sweep device 11, a vibration exciter 12, a vibration pickup 13, a harmonic oscillator 15, a fixed end 150, a free end 151, a carrying platform 20, a laser 21 and a displacement platform 22.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention will be more clearly and clearly defined.
Referring to fig. 1 and fig. 2, the embodiment discloses a three-dimensional shell gyro harmonic oscillator multiple harmonic comprehensive trimming system, which includes a measuring module 1 and a processing module 2.
The measurement module 1 comprises a vibration measurement clamp 10, a frequency scanner 11, a vibration exciter 12 and a vibration pickup 13, wherein the vibration measurement clamp 10 is used for fixing a harmonic oscillator 15, the frequency scanner 11 is used for outputting an excitation signal and inputting harmonic oscillator modal information, the vibration exciter 12 is connected with the frequency scanner 11, the vibration exciter 12 is used for driving the harmonic oscillator 15 to vibrate and controlling the frequency and amplitude of the harmonic oscillator 15 according to the excitation signal output by the frequency scanner 11, the vibration pickup 13 is connected with the frequency scanner 11, and the vibration pickup 13 is used for measuring the vibration information of the harmonic oscillator 15 and converting the vibration information into an electric signal to be input into the frequency scanner 11 so that the frequency scanner 11 analyzes the modal information of the harmonic oscillator according to the electric signal;
one end of the support rod of the harmonic oscillator 15 is fixed to the fixture to form a fixed end 150, and the other end of the support rod is a free end.
The frequency scanner 11 is a frequency analyzer or a lock-in amplifier and other devices with a harmonic oscillator modal frequency sweep test function, and is configured to output excitation signals such as frequency and load, and input harmonic oscillator modal information such as frequency and standing wave orientation.
The vibration exciter 12 is in various forms such as an electrode plate, a piezoelectric plate, an electromagnet or a hammer knocking mode, is placed close to the three-dimensional shell of the harmonic oscillator, is in communication connection with the frequency sweep generator 11, and drives the harmonic oscillator to vibrate and control the frequency and the amplitude of the harmonic oscillator according to vibration exciting signals such as frequency and load sent by the frequency sweep generator 11.
The vibration pickup 13 is in various forms such as an electrode plate, a piezoelectric plate, a strain gauge, a microphone or a laser vibration meter, and is in communication connection with the frequency scanner 11, measures vibration information of the harmonic oscillator, namely acoustic or optical signals, converts the vibration information into electrical signals and inputs the electrical signals into the frequency scanner, and enables the frequency scanner to analyze modal information of the harmonic oscillator according to the signals. The vibration pickup is divided into two groups, the first group is close to and measures vibration information of the three-dimensional shell of the harmonic oscillator, and the second group is close to and measures vibration information of the free end of the supporting rod. The vibration information measured by the vibration pickup can be XY plane vibration, Z axis vibration or normal vibration along the surface of the three-dimensional shell.
In this embodiment, the processing module 2 includes an object carrying platform 20, a laser 21, a displacement platform 22 and a controller, the object carrying platform 20 is used for placing the harmonic oscillator 15, the laser 21 is used for emitting laser to process an etching groove on the harmonic oscillator 15, and the displacement platform 22 is used for placing the laser 21 and adjusting the position of the laser 21.
The laser 21 is used for emitting fast laser, the energy of the laser can ablate partial area material of the harmonic oscillator, and an etching groove is processed on the harmonic oscillator, thereby realizing material removal processing.
The carrying platform 20 is used for placing the harmonic oscillator 15, and the laser light path can be perpendicular to the region to be processed of the harmonic oscillator by adjusting the placing pose shape of the harmonic oscillator.
The displacement platform 22 is a displacement platform 22 with a three-axis displacement function, the X-axis and Y-axis displacement of the displacement platform 22 is used for moving the laser 21 to a region to be processed, where a light path focus is located in the harmonic oscillator 15, and moving the laser 21 according to a specific path to process etching grooves with different sizes in the processing process, and the Z-axis displacement of the displacement platform 22 is used for adjusting the distance between the laser 21 and the harmonic oscillator 15 for focusing, so that laser energy is focused on a substitute processing region to realize material etching.
Referring to fig. 3, the invention further provides a method for comprehensively adjusting multiple harmonics of the three-dimensional shell gyro harmonic oscillator, which includes the following steps:
s1, performing vibration test by using a measuring module 1, and specifically comprising the following steps:
step S11, using a frequency scanner 11 to carry out modal frequency scanning test on the harmonic oscillator 15 to obtain low-frequency modal frequency f 1 High frequency mode frequency f 2 And judging N =2 modal frequency cracking delta f = f 2 -f 1 When Δ f is less than 100mHz, the standing wave is oriented in different orientations depending on the direction of the excitation load, otherwise the standing wave is fixed in two 45 degree spaced orientations with the low frequency modal standing wave orientation θ 1 High frequency modal standing wave orientation theta 2 ＝θ 1 +45°。
The frequency measurement of frequency splitting and modal standing wave orientation by the frequency scanner 11 can be replaced by finite element simulation modeling and other modes, as long as two modal natural frequencies of N =2 modal low frequency and high frequency of the harmonic oscillator are found.
And S12, judging the frequency cracking delta f, and selecting a proper subsequent vibration testing method.
When the frequency cracking delta f is less than 100mHz, the frequency sweep device 11 controls the excitation frequency of the vibration exciter 12 to reach f 1 The initial included angle between the harmonic oscillator 15 and the vibration exciter 12 is phi 0 At the excitation frequency of f 1 The vibration pickup 13 is used to measure the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator 0 ) And the amplitude B (phi) of the free end of the support rod 0 ) (ii) a The harmonic oscillator 15 rotates at least 3 times relative to the vibration exciter 12 and the vibration pickup 13, wherein the ith rotation angle is recorded as phi i The sum of the three rotation angles is not more than 180 degrees, after each rotation, the frequency scanner 11 controls the excitation frequency of the vibration exciter 12 to f 1 And the vibration pickup 13 is used to measure the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator i ) The free end amplitude B (phi) of the supporting rod i )。
When the frequency cracking delta f is larger than 100mHz, the frequency sweep device 11 controls the excitation frequency of the vibration exciter 12 to reach f 1 Measuring the orientation theta of the low-frequency mode standing wave of the harmonic oscillator 15 by using the vibration pickup 13 1 Three-dimensional shell amplitude A (phi) 0 )＝A(θ 1 ) The free end amplitude B (phi) of the supporting rod 0 )＝B(θ 1 )。
The harmonic oscillator 15 rotates 45 degrees relative to the vibration exciter 12 and the vibration pickup 13, and the frequency scanner 11 controls the excitation frequency of the vibration exciter 12 to f 2 The vibration pickup 13 is used to measure the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator 15 1 )＝A(θ 1 + 45) and amplitude B (phi) of free end of the strut 1 )＝B(θ 1 +45)。
The harmonic oscillator 15 rotates 45 degrees relative to the vibration exciter 12 and the vibration pickup 13, and the frequency sweep device 11 controls the vibration exciting frequency of the vibration exciter 12 to f 1 The vibration pickup 13 is used to measure the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator 15 2 )＝A(θ 1 + 90) and amplitude B (phi) of free end of the strut 2 )＝B(θ 1 +90)。
The harmonic oscillator 15 rotates 45 degrees relative to the vibration exciter 12 and the vibration pickup 13, and the frequency sweep device 11 controls the vibration exciting frequency of the vibration exciter 12 to f 2 The vibration pickup 13 is used to measure the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator 15 3 )＝A(θ 1 + 135) and amplitude B (phi) of free end of strut 3 )＝B(θ 1 +135)。
In this embodiment, the natural frequency f of the low frequency mode is achieved 1 And natural frequency f of high-frequency mode 2 The frequency can be achieved by frequency sweeping; or may be fixed, i.e. maintaining the frequency at f 1 And f 2 (ii) a Or the frequency may be kept close to f 1 And f 2 The N =2 mode also occurs, but the amplitude is large when there is no resonance, but the result of the calculation by the formula is equivalent and has no influence.
And S13, using the vibration test result to carry out harmonic calculation.
Will A (phi) 0 )、B(φ 0 ) And each group A (phi) i )、B(φ i ) Substituting into the equation set:
solving the equation set can obtain the first harmonic amplitude m 1 Direction and orientation
And third harmonic amplitude m 3 Direction and orientation
Will A (phi) 0 )、B(φ 0 ) And any one of the groups A (phi) i )、B(φ i ) Substituting into the equation set:
solving the equation system can obtain the second harmonic amplitude m 2 Direction and orientation
S2, performing first harmonic trimming by adopting the processing module 2, and specifically comprising the following steps:
and S21, placing the harmonic oscillator 15 on the carrying platform 20, and adjusting the pose of the harmonic oscillator 15 to enable the laser light path to be perpendicular to the region to be processed of the harmonic oscillator 15.
S22, adjusting the X-axis and Y-axis displacements of the displacement platform 22, and moving the laser 21 until the optical path focus is located at the harmonic oscillator 15
Orientation according to m 1 Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform 22, moving a laser 21 to a plane where a light path can be focused on a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s23, repeating the step S1 and using the measuring module 1 to carry out vibration test;
and S24, adjusting the size of the trimming groove according to the primary harmonic amplitude and the direction obtained in the vibration test in the step S23, and repeating the steps S21-S23 until the primary harmonic amplitude obtained in the vibration test is reduced to an expected value.
S3, carrying out third harmonic trimming by adopting the processing module 2, and specifically comprising the following steps:
and S31, placing the harmonic oscillator 15 on the object platform 20, and adjusting the pose of the harmonic oscillator 15 to enable the laser light path to be perpendicular to the region to be processed of the harmonic oscillator 15.
Step S32, according to step S2Third harmonic amplitude m obtained by last vibration test 3 * And orientation
Adjusting the X-axis and Y-axis displacements of the displacement platform 22, and moving the laser 21 to a position where the optical path focus is located on the harmonic oscillator
Orientation according to m 3 * Estimating the removal amount and the size of the trimming groove, adjusting the Z-axis displacement of the displacement platform 22, moving the laser 21 to a position where the light path is focused on the plane of the machining area, adjusting the parameters of the laser machining process, and removing part of materials according to the estimated size of the trimming groove to form the trimming groove.
Step S33, keeping the Z-axis position unchanged in step S32, adjusting the X-axis and Y-axis displacements of the displacement platform 22, and moving the laser 21 until the optical path focus is positioned on the harmonic oscillator
And (6) maintaining the laser processing technological parameters in the step (S32) unchanged, and removing materials according to the size of the trimming groove in the step (S32) to form the trimming groove with the same size.
Step S34, keeping the Z-axis position unchanged in the step S32, adjusting the X-axis and Y-axis displacement of the displacement platform 22, and moving the laser 21 until the optical path focus is positioned on the harmonic oscillator
And (6) maintaining the laser processing technological parameters in the step (S32) unchanged, and removing materials according to the size of the trimming groove in the step (S32) to form the trimming groove with the same size.
And S35, repeating the step S1 and using the measuring module to carry out vibration test.
And S36, adjusting the size of the trimming groove according to the third harmonic amplitude and the direction obtained in the vibration test in the step S35, and repeating the steps S31 to S35 until the third harmonic amplitude obtained in the vibration test is reduced to an expected value.
S4, performing second harmonic trimming by adopting the processing module 2, and specifically comprising the following steps:
and S41, placing the harmonic oscillator 15 on the object platform 20, and adjusting the pose of the harmonic oscillator 15 to enable the laser light path to be perpendicular to the region to be processed of the harmonic oscillator 15.
Step S42, obtaining the third harmonic amplitude m according to the last vibration test in the step S3 2 * And orientation
Adjusting the X-axis and Y-axis displacements of the displacement platform 22, and moving the laser 21 to a position where the optical path focus is located on the harmonic oscillator
Orientation according to m 2 * Estimating the removal amount and the size of the trimming groove, adjusting the Z-axis displacement of the displacement platform 22, moving the laser 21 to a light path which can be focused on a plane of a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove.
S43, keeping the Z-axis position unchanged in the step S42, adjusting the X-axis and Y-axis displacement of the displacement platform 22, and moving the laser until the optical path focus is positioned on the harmonic oscillator
And (5) maintaining the laser processing technological parameters in the step (S42) unchanged, and removing materials according to the trimming groove size in the step (S42) to form trimming grooves with the same size.
And S44, repeating the step S41 and using the measuring module to carry out vibration test.
And S45, adjusting the size of the trimming groove according to the amplitude and the direction of the second harmonic obtained in the vibration test in the step S44, and repeating the steps S41-S44 until the amplitude of the second harmonic obtained in the vibration test is reduced to an expected value.
S5, using the processing module 2 to carry out frequency offset trimming, and comprising the following steps:
step S51, determining delta f obtained in the last vibration test in step S4 * And theta 1 * When Δ f * Below 100mHz, most applications are satisfied, when Δ f * When the frequency is more than 100mHz, the harmonic oscillator is placed on the object carrying platform 20, the position and the posture of the harmonic oscillator are adjusted, the laser light path can be perpendicular to the area to be processed of the harmonic oscillator, the X-axis and Y-axis displacement of the displacement platform 22 is adjusted, and the laser 21 is moved until the focus of the light path is positioned on the harmonic oscillator theta 1 * Azimuth, according to Δ f * Estimating the removal amount and the size of the trimming groove, adjusting the Z-axis displacement of the displacement platform 22, moving the laser 21 to a position where the light path is focused on the plane of the machining area, adjusting the parameters of the laser machining process, and removing part of materials according to the estimated size of the trimming groove to form the trimming groove.
S52, keeping the Z-axis position in the S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform 22, and moving the laser 21 until the optical path focus is positioned on the harmonic oscillator theta 1 * And (5) keeping the laser processing technological parameters in the step (S51) unchanged in the + 90-degree direction, and removing materials according to the size of the trimming groove in the step (S51) to form the trimming groove with the same size.
S53, keeping the Z-axis position in the S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform 22, and moving the laser 21 until the optical path focus is positioned on the harmonic oscillator theta 1 * And (4) keeping the laser processing technological parameters in the step (S53) unchanged in the + 180-degree direction, and removing materials according to the trimming groove size in the step (S51) to form the trimming groove with the same size.
S54, keeping the Z-axis position in the S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform 22, and moving the laser 51 until the optical path focus is positioned on the harmonic oscillator theta 1 * And +270 degrees, keeping the laser processing technological parameters in the step S51 unchanged, and removing materials according to the size of the trimming groove in the step S51 to form the trimming groove with the same size.
And S55, repeating the step S1, and carrying out a mode frequency sweep test on the harmonic oscillator by using a frequency sweep device.
And S56, adjusting the size of the trimming groove according to the frequency cracking and the low-frequency modal standing wave orientation obtained by the modal sweep test in the step S55, and repeating the steps S51-S55 until the frequency cracking is reduced to an expected value.
Thus, comprehensive trimming of the first harmonic, the second harmonic, the third harmonic and the frequency cracking (fourth harmonic) is realized.
The invention can be used as long as the harmonic oscillator rotates relative to the vibration exciter and the vibration pickup. Therefore, the harmonic oscillator can be fixed, and the vibration exciter and the vibration pickup can rotate for 45 degrees around the rotational symmetry axis, which are equivalent. When the platform is rotated in operation, both clockwise and counterclockwise clocks can be used, and the calculated harmonic direction is consistent with the direction of the harmonic.
The invention is based on the laser machining described
Besides realizing k-order harmonic trimming outside the azimuth removing material, the material can also be removed by ion beam etching, chemical solution etching, drilling and the like; can also be at
And the adjustment of the k-th harmonic can be realized by adding materials such as glue dispensing, solder and the like in the azimuth mode.
The invention can also be used for continuous trimming, in addition to the described discrete trimming method. The continuous trimming operation comprises the following steps: the vibration measuring module and the method are kept unchanged to obtain a first harmonic amplitude m 1 And direction of the
And third harmonic amplitude m 3 And direction of the
Second harmonic amplitude m 2 And direction of the
Then, at different angles of the three-dimensional shell
The material is continuously removed, and the removal amount is as follows:
and then, carrying out iteration of vibration measurement and trimming until the first harmonic, the second harmonic and the third harmonic are reduced to expected values, and then carrying out trimming of frequency cracking.
The invention provides a harmonic oscillator multiple harmonic comprehensive trimming system consisting of a vibration measuring module and a processing module, and provides a corresponding comprehensive trimming method. Based on the system and the method, the iteration of vibration measurement and processing is carried out, and the comprehensive trimming of primary, secondary and third harmonic waves of mass unbalance and frequency cracking (fourth harmonic wave) can be realized.
Aiming at the characteristic of dynamic change of harmonic waves during discrete trimming, the invention provides a comprehensive trimming process of first harmonic wave-third harmonic wave-second harmonic wave-frequency cracking, which can simplify the harmonic trimming process to the utmost extent, improve the processing efficiency and reduce the excessive damage of the trimming of the removed material to the structure.
The vibration measurement method provided by the invention utilizes the characteristic that the N =2 mode has two degenerate modes with 45-degree interval, adopts a kinematics calculation method, does not need to firstly carry out frequency cracking trimming before each vibration measurement, and finishes the frequency cracking trimming at the last time in the process. The method can realize the rapid measurement of each harmonic wave, and simultaneously reduces the structural damage caused by frequency cracking trimming to the maximum extent.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, various changes or modifications may be made by the patentees within the scope of the appended claims, and within the scope of the invention, as long as they do not exceed the scope of the invention described in the claims.
Claims (10)
1. A three-dimensional shell gyro harmonic oscillator multi-harmonic comprehensive trimming system is characterized by comprising a measuring module and a processing module; the measuring module comprises a vibration measuring clamp, a frequency scanner, a vibration exciter and a vibration pickup, wherein the vibration measuring clamp is used for fixing the harmonic oscillator, the frequency scanner is used for outputting an excitation signal and inputting harmonic oscillator modal information, the vibration exciter is connected with the frequency scanner, the vibration exciter is used for driving the harmonic oscillator to vibrate and controlling the frequency and amplitude of the harmonic oscillator according to the excitation signal output by the frequency scanner, the vibration pickup is connected with the frequency scanner, and the vibration pickup is used for measuring the vibration information of the harmonic oscillator and converting the vibration information into an electric signal to be input into the frequency scanner so that the frequency scanner analyzes the modal information of the harmonic oscillator according to the electric signal; the processing module comprises an object carrying platform, a laser, a displacement platform and a controller, wherein the object carrying platform is used for placing a harmonic oscillator, the laser is used for emitting laser to process an etching groove on the harmonic oscillator, and the displacement platform is used for placing the laser and adjusting the position of the laser.
2. The system for multiple harmonic comprehensive trimming of a three-dimensional shell gyroscope harmonic oscillator of claim 1, wherein the frequency scanner is a frequency analyzer or a lock-in amplifier, and the vibration exciter is an electrode plate, a piezoelectric plate, an electromagnet or a small hammer.
3. The system according to claim 1, wherein the vibration pickup is an electrode plate, a piezoelectric plate, a strain gauge, a microphone, or a laser vibrometer.
4. The system for multiple harmonic comprehensive trimming of a three-dimensional shell gyroscope harmonic oscillator of claim 1, wherein the displacement platform is a displacement platform with a three-axis displacement function, the X-axis displacement and the Y-axis displacement of the displacement platform are used for moving the laser to a position where the optical path focus is located in a region to be processed of the harmonic oscillator, and moving the laser according to a specific path during processing to process etching grooves with different sizes, and the Z-axis displacement of the displacement platform is used for adjusting the distance between the laser and the harmonic oscillator to focus.
5. The method for the multiple harmonic comprehensive trimming system of the three-dimensional shell gyro harmonic oscillator according to any one of claims 1 to 4, characterized by comprising the following steps:
s1, performing vibration test by using a measurement module;
s2, performing first harmonic trimming by adopting a processing module;
s3, performing third harmonic trimming by adopting a processing module;
s4, performing second harmonic trimming by adopting a processing module;
and S5, performing frequency offset trimming by using the processing module.
6. The method according to claim 5, wherein the step S1 comprises:
s11, performing modal frequency sweep test on the harmonic oscillator by using a frequency sweep device to obtain low-frequency modal frequency f 1 High frequency mode frequency f 2 And judging N =2 modal frequency cracking delta f = f 2 -f 1 When Δ f is less than 100mHz, the standing wave is oriented at different orientations depending on the direction of the excitation load, otherwise, the standing wave is fixed at two orientations 45 degrees apart, wherein the orientation theta of the low-frequency modal standing wave is 1 High frequency modal standing wave orientation theta 2 ＝θ 1 +45°；
S12, judging frequency cracking delta f, and controlling the excitation frequency of the vibration exciter to f by the frequency scanner when the frequency cracking delta f is less than 100mHz 1 The initial included angle between the harmonic oscillator and the vibration exciter is phi 0 At the excitation frequency of f 1 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 0 ) The free end amplitude B (phi) of the supporting rod 0 ) (ii) a The harmonic oscillator rotates at least 3 times relative to the vibration exciter and the vibration pickup, wherein the ith rotation angle is recorded as phi i The sum of the three rotation angles is not more than 180 degrees, and after each rotation, the frequency scanner controls the excitation frequency of the vibration exciter to reach f 1 And measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup i ) And the amplitude B (phi) of the free end of the support rod i )；
When the frequency cracking delta f is larger than 100mHz, the frequency scanner controls the excitation frequency of the vibration exciter to reach f 1 Measuring the orientation theta of the harmonic oscillator low-frequency mode standing wave by using a vibration pickup 1 Three-dimensional shell amplitude a (phi) 0 )＝A(θ 1 ) The free end amplitude B (phi) of the supporting rod 0 )＝B(θ 1 )；
The harmonic oscillator rotates 45 degrees relative to the vibration exciter and the vibration pickup, and the frequency sweep device controls the vibration exciting frequency of the vibration exciter to f 2 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 1 )＝A(θ 1 + 45) and amplitude B (phi) of free end of the strut 1 )＝B(θ 1 +45)；
The harmonic oscillator rotates 45 degrees relative to the vibration exciter and the vibration pickup, and the frequency sweep device controls the vibration exciting frequency of the vibration exciter to f 1 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 2 )＝A(θ 1 + 90) and amplitude B (phi) of free end of the strut 2 )＝B(θ 1 +90)；
The harmonic oscillator rotates 45 degrees relative to the vibration exciter and the vibration pickup, and the frequency sweep device controls the vibration exciting frequency of the vibration exciter to f 2 Measuring the amplitude A (phi) of the three-dimensional shell of the harmonic oscillator by using a vibration pickup 3 )＝A(θ 1 + 135) and amplitude B (phi) of free end of strut 3 )＝B(θ 1 +135)；
S13, using the vibration test result to carry out harmonic calculation;
will A (phi) 0 )、B(φ 0 ) And each group A (phi) i )、B(φ i ) Substituting into the equation set:
obtaining the first harmonic amplitude m 1 And direction of the
And third harmonic amplitude m 3 And direction of the
Will A (phi) 0 )、B(φ 0 ) And any one of the groups A (phi) i )、B(φ i ) Substituting into the equation set:
obtaining the second harmonic amplitude m 2 And direction of the
7. The method according to claim 5, wherein the step S2 comprises:
s21, placing the harmonic oscillator on an object carrying platform, and adjusting the position and the posture of the harmonic oscillator to enable a laser light path to be perpendicular to a region to be processed of the harmonic oscillator;
s22, adjusting the X-axis displacement and the Y-axis displacement of the displacement platform, and moving the laser to a position where the light path focus is positioned on the harmonic oscillator
Orientation according to m 1 Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a plane where a light path can be focused on a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s23, repeating the step S1 and using a measuring module to carry out vibration test;
and S24, adjusting the size of the trimming groove according to the amplitude and the direction of the primary harmonic obtained in the vibration test in the step S23, and repeating the steps S21-S23 until the amplitude of the primary harmonic obtained in the vibration test is reduced to an expected value.
8. The method according to claim 5, wherein the step S3 comprises:
s31, placing the harmonic oscillator on an object carrying platform, and adjusting the position and the posture of the harmonic oscillator to enable a laser light path to be perpendicular to a region to be processed of the harmonic oscillator;
s32, obtaining a third harmonic amplitude m according to the last vibration test in the step S2 3 * And orientation
Information, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser to the position where the optical path focus is located on the harmonic oscillator
Orientation according to m 3 * Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a light path to focus on a plane of a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s33, keeping the Z-axis position unchanged in the step S32, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the light path focus is positioned on the harmonic oscillator
Maintaining the laser processing technological parameters in the step S32 unchanged, and removing materials according to the dimension of the trimming groove in the step S32 to form the trimming groove with the same dimension;
s34, keeping the position of the Z axis in the step S32 unchanged, adjusting the X axis and the Y axis displacement of the displacement platform, and moving the laser until the focus of the light path is positioned on the harmonic oscillator
Orientation, keeping the laser processing technological parameters in the step S32 unchanged, and removing materials according to the size of the trimming groove in the step S32 to form the trimming groove with the same size;
s35, repeating the step S1 and using a measuring module to carry out vibration test;
s36, adjusting the size of the trimming groove according to the third harmonic amplitude and the direction obtained in the step S35 through the vibration test, and repeating the steps S31-S35 until the third harmonic amplitude obtained in the vibration test is reduced to an expected value.
9. The method according to claim 5, wherein the step S4 comprises:
s41, placing the harmonic oscillator on an object carrying platform, and adjusting the position and the posture of the harmonic oscillator to enable a laser light path to be perpendicular to a region to be processed of the harmonic oscillator;
s42, obtaining a third harmonic amplitude m according to the last vibration test in the step S3 2 * And orientation
Information, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser to the position where the optical path focus is located on the harmonic oscillator
Orientation according to m 2 * Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a plane where a light path can be focused on a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s43, keeping the Z-axis position unchanged in the step S42, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the optical path focus is positioned on the harmonic oscillator
Orientation, keeping the laser processing technological parameters in the step S42 unchanged, and removing materials according to the dimension of the trimming groove in the step S42 to form the trimming groove with the same dimension;
s44, repeating the step S41 and using the measuring module to carry out vibration test;
s45, adjusting the size of the trimming groove according to the amplitude and the direction of the second harmonic obtained in the step S44 through the vibration test, and repeating the steps S41-S44 until the amplitude of the second harmonic obtained in the vibration test is reduced to an expected value.
10. The method according to claim 5, wherein the step S5 comprises:
s51, judging delta f obtained in the last vibration test in S4 * And theta 1 * When Δ f is * Less than 100mHz, which is satisfactory for most applications, when Δ f * When the frequency is more than 100mHz, the harmonic oscillator is placed on the object carrying platform, the position and the posture of the harmonic oscillator are adjusted, the laser light path can be perpendicular to the area to be processed of the harmonic oscillator, the X-axis and Y-axis displacement of the displacement platform is adjusted, and the laser is moved until the focus of the light path is positioned on theta of the harmonic oscillator 1 * Azimuth, according to Δ f * Estimating the removal amount and the size of a trimming groove, adjusting the Z-axis displacement of a displacement platform, moving a laser to a light path to focus on a plane of a substitute processing area, adjusting laser processing technological parameters, and removing partial materials according to the estimated size of the trimming groove to form the trimming groove;
s52, keeping the position of the Z axis in the step S51 unchanged, adjusting the X axis and the Y axis displacement of the displacement platform, and moving the laser until the focus of the light path is positioned on the harmonic oscillator theta 1 * The + 90-degree direction, keeping the laser processing technological parameters in the step S51 unchanged, and removing materials according to the size of the trimming groove in the step S51 to form the trimming groove with the same size;
s53, keeping the Z-axis position in the step S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the optical path focus is positioned on the harmonic oscillator theta 1 * + 180-degree orientation, keeping the laser processing technological parameters in the step S53 unchanged, and removing materials according to the trimming groove size in the step S51 to form trimming grooves with the same size;
s54, keeping the Z-axis position in the step S51 unchanged, adjusting the X-axis and Y-axis displacement of the displacement platform, and moving the laser until the optical path focus is positioned on the harmonic oscillator theta 1 * +270 degrees, keeping the laser processing technological parameters in the step S51 unchanged, and removing materials according to the size of the trimming groove in the step S51 to form the trimming groove with the same size;
s55, repeating the step S1, and carrying out mode frequency sweep test on the harmonic oscillator by using a frequency sweep device;
and S56, adjusting the size of the trimming groove according to the frequency cracking and low-frequency modal standing wave orientation obtained by the modal frequency sweep test in the step S55, and repeating the steps S51-S55 until the frequency cracking is reduced to an expected value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210892341.9A CN115164862A (en) | 2022-07-27 | 2022-07-27 | Three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210892341.9A CN115164862A (en) | 2022-07-27 | 2022-07-27 | Three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115164862A true CN115164862A (en) | 2022-10-11 |
Family
ID=83496291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210892341.9A Pending CN115164862A (en) | 2022-07-27 | 2022-07-27 | Three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115164862A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115790667A (en) * | 2023-01-31 | 2023-03-14 | 中国船舶集团有限公司第七〇七研究所 | Harmonic defect identification method and system based on hemispherical resonator gyroscope |
| CN116519012A (en) * | 2023-03-13 | 2023-08-01 | 中国人民解放军国防科技大学 | Method and test device for trimming unbalanced mass of vibrating gyroscope |
-
2022
- 2022-07-27 CN CN202210892341.9A patent/CN115164862A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115790667A (en) * | 2023-01-31 | 2023-03-14 | 中国船舶集团有限公司第七〇七研究所 | Harmonic defect identification method and system based on hemispherical resonator gyroscope |
| CN116519012A (en) * | 2023-03-13 | 2023-08-01 | 中国人民解放军国防科技大学 | Method and test device for trimming unbalanced mass of vibrating gyroscope |
| CN116519012B (en) * | 2023-03-13 | 2023-09-01 | 中国人民解放军国防科技大学 | Method and test device for trimming unbalanced mass of vibrating gyroscope |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115164862A (en) | Three-dimensional shell gyro harmonic oscillator multiple harmonic wave comprehensive trimming system and method | |
| CN108844555B (en) | Method and system for determining unbalanced mass of gyro harmonic oscillator with cylindrical shell | |
| CN115876182B (en) | Electrode error modeling method of hemispherical resonator gyroscope | |
| CN104764902B (en) | A kind of highly sensitive surface acoustic wave acceleration transducer | |
| CN111504292B (en) | Chemical trimming method for second harmonic error of quartz cylindrical harmonic oscillator | |
| CN115248051A (en) | Device and method for determining unbalanced mass of harmonic oscillator of micro-hemispherical gyroscope | |
| CN116372376B (en) | Method and device for repairing hemispherical harmonic oscillator by combination of femtosecond laser and ion beam etching | |
| CN115420269B (en) | Resonant structure frequency cracking identification and trimming method and platform | |
| JPH0627129A (en) | Method of mechanically balancing vibrating section of vibration type speed sensor and vibration type speed sensor adjusted by said method | |
| CN113295359A (en) | Simulation test device for inhibiting ejector supporting plate vibration and vibration inhibition method | |
| Basarab et al. | Influence of nonuniform thickness of hemispherical resonator gyro shell on its unbalance parameters | |
| CN115420203A (en) | Evaluation method for metallization coating uniformity of hemispherical harmonic oscillator | |
| CN113686489A (en) | Detection device and method for mass unbalance defect of hemispherical harmonic oscillator | |
| CN115824263A (en) | Damping trimming method and system based on hemispherical resonator gyroscope | |
| JP2018517898A (en) | Vibration gyroscope using non-linear modal interaction | |
| CN114894173A (en) | Mass stiffness decoupling ring type MEMS resonator structure and trimming method | |
| Gallacher et al. | Multimodal tuning of a vibrating ring using laser ablation | |
| CN111912398A (en) | Device and method for identifying 1-4 harmonic waves of density of axisymmetric harmonic oscillator under atmosphere | |
| Provenza et al. | Experimental methodology for determining turbomachinery blade damping using magnetic bearing excitation and non-contacting optical measurements | |
| CN115200611A (en) | Hemisphere harmonic oscillator batch test system and test method | |
| CN115752518A (en) | Harmonic oscillator 1-3 harmonic identification device and method based on scanning laser vibration measurement | |
| CN112710869A (en) | Harmonic oscillator rigid shaft identification device and method based on additional electrostatic rigidity principle | |
| JP5813296B2 (en) | Method and apparatus for controlling optimal operation of acoustic cleaning | |
| Mierzeiewski et al. | Active vibration control of trapezoidal plate using mfc collocated sensor/actuator | |
| CN113720531A (en) | Harmonic oscillator laser de-weight balancing process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |