CN115145323A - Temperature control method for detector chip - Google Patents
Temperature control method for detector chip Download PDFInfo
- Publication number
- CN115145323A CN115145323A CN202210734392.9A CN202210734392A CN115145323A CN 115145323 A CN115145323 A CN 115145323A CN 202210734392 A CN202210734392 A CN 202210734392A CN 115145323 A CN115145323 A CN 115145323A
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- Prior art keywords
- heat
- radiator
- thermal resistance
- detector chip
- heat sink
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Abstract
The invention relates to the technical field of semiconductor packaging heat dissipation application, in particular to a temperature control method for a detector chip, which comprises the following steps: 1) Welding a detector chip on a semiconductor refrigerating sheet through a heat sink; 2) Packaging the semiconductor refrigerating sheet with the detector chip after heat insulation; 3) Mounting the packaged chip on a radiator, wherein the radiator is configured by calculating solid conduction thermal resistance; 4) The radiator is connected with the bottom plate of the machine shell through heat conduction silicone grease in a contact mode, and the radiator radiates heat in a turbulent forced convection mode. The invention configures the radiator by calculating the solid conduction thermal resistance of the radiator according to the working environment temperature required by the detector chip, realizes accurate temperature control by physically connecting the radiator with the semiconductor refrigerating sheet after packaging, and can effectively ensure that the detector chip works in an environment with stable temperature.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging heat dissipation application, in particular to a temperature control method for a detector chip.
Background
The detector chip is welded on a semiconductor refrigerating chip (TEC) through a heat sink, a thermistor is also arranged on the heat sink, and the detector chip needs TO work in an extremely low constant low-temperature environment, so that the scheme adopts three-level TEC for refrigerating and temperature controlling, and heat insulation measures are taken, and finally the detector chip is packaged in a TO-8 shell.
Under the condition of normal temperature, the packaged detector has the heat dissipation requirement of 3W, and the heat is dissipated through the dentate heat dissipater. The purpose of the heat sink is to dissipate the heat generated by the TEC during operation so that the temperature thereof is kept below the allowable temperature during operation. Its physical principle is to conduct and exchange heat by using a medium. Under the conditions of forced air cooling and natural cooling, the heat-conducting media are the heat radiator and air, and finally the air is circulated to take away heat, so that the selection of the heat radiator is very important in the process of controlling the temperature of the packaged chip.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention provides a temperature control method for a detector chip, which has the following specific technical scheme:
a temperature control method for a detector chip comprises the following steps:
1) Welding a detector chip on a semiconductor refrigerating sheet through a heat sink;
2) Packaging the semiconductor refrigerating sheet with the detector chip after heat insulation;
3) A radiator is configured by calculating solid conduction thermal resistance, and the packaged chip is installed on the radiator;
4) The radiator is connected with the bottom plate of the machine shell through heat conduction silicone grease in a contact mode, and the radiator radiates heat in a turbulent forced convection mode.
Furthermore, the heat radiator comprises a substrate and a plurality of tooth plates arranged on the substrate, a through hole is arranged in the middle of the heat radiator, the packaged chip is installed on the substrate, and the contact surface of the packaged chip and the substrate is coated with heat-conducting silicone grease.
Further, the heat conduction coefficient of the heat conduction silicone grease is 6w/m x k, the thermal resistance is less than 0.05 ℃/m2.
Further, the material of the radiator is aluminum.
Further, the calculation of the solid conduction thermal resistance specifically includes:
according to the Fourier heat conduction equation, the heat at two ends of a solid with the area of A and the length of l is passed:
ks is the thermal conductivity; a is the area through which the heat flow passes;
is the length derivative between the temperature difference pairs; the temperature gradient T2-T1 is the temperature difference between the two ends of the solid;
by definition:
is a thermal resistance R th Then:
on a heat sink having n flat plates, i.e., fins, the cross-sectional area a = L × b, L being the length of the flat plate, b being the width of the flat plate, and n flat plates, the solid conduction thermal resistance in the fins is, after converting the thermal resistance unit to "° c/W":
further, the turbulent forced convection mode is a forced air cooling mode.
Furthermore, the forced air cooling mode is that a fan is arranged on the side edge of the radiator, and the fan enables air on a boundary layer of the tooth sheets to be disturbed by external force to cause turbulence.
Compared with the prior art, the invention has the following beneficial effects:
the temperature control method of the detector chip has the advantage of controllable temperature, the radiator is configured by calculating the solid conduction thermal resistance of the radiator according to the temperature of the working environment required by the detector chip, and the accurate temperature control is realized by the physical connection of the radiator and the semiconductor refrigerating sheet after packaging, so that the detector chip can be effectively ensured to work in the environment with stable temperature.
Drawings
FIG. 1 is a schematic view of a heat sink according to an embodiment of the present invention;
FIG. 2 is a schematic view of a boundary layer of turbulent forced convection in an embodiment of the present invention;
FIG. 3 is a schematic view of a boundary layer during laminar flow in an embodiment of the present invention;
FIG. 4 is a schematic diagram of heat transfer in an embodiment of the present invention;
FIG. 5 is a diagram of a temperature control platform of a detector chip according to an embodiment of the present invention;
in the figure, 1-enclosure, 2-fan, 3-tooth-mounted heat sink, 4-packaged chip module, 5-circuit board, 6-enclosure bottom plate.
Detailed Description
In order to make the objects, technical solutions and technical effects of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and examples.
The invention relates to a temperature control method for a detector chip, which comprises the following steps:
1) The detector chip is welded on the semiconductor refrigerating sheet through the heat sink, and the semiconductor refrigerating sheet is used for providing a low-temperature environment for the detector chip to work;
2) Packaging the semiconductor refrigerating sheet with the detector chip after heat insulation and preservation;
3) Mounting the packaged chip on a radiator through heat-conducting silicone grease, wherein the radiator is configured by calculating solid heat conduction resistance;
4) The radiator is connected with the bottom plate of the machine shell through contact of heat-conducting silicone grease, and the radiator radiates heat in a turbulent forced convection mode.
As shown in fig. 1, the heat sink includes a substrate and a plurality of fins disposed on the substrate, a through hole is disposed in the middle of the toothed heat sink for improving heat dissipation performance, the packaged chip is mounted on the substrate and fixed by two M4 countersunk head screws, a contact surface between the packaged chip and the substrate is coated with a heat conductive silicone grease, a heat conductivity coefficient of the heat conductive silicone grease is 6w/M × k, and a thermal resistance is less than 0.05 ℃/M2.
The turbulent forced convection mode is a forced air cooling mode, the forced air cooling mode is a fan arranged on the side edge of the radiator, the fan enables air on the boundary layer of the tooth plates to be disturbed by external force to cause turbulent flow, the turbulent flow enables air molecules to be inserted into each other irregularly, the air molecules with different temperatures are contacted frequently to generate heat exchange transfer, outer air receiving heat is replaced by new air flowing fast, and temperature control of the radiator and the detector chip is completed.
The method for calculating the solid conduction thermal resistance of the radiator in the step 3) comprises the following steps:
there is not the heat source in the radiator, and the thermal current is one-dimensional and stable, according to the Fourier heat conduction equation, through the area be A, the length is the heat at l solid both ends:
ks is the thermal conductivity; a is the area through which the heat flow passes;
is the length derivative between the temperature difference pairs; the temperature gradient T2-T1 is the temperature difference between the two ends of the solid;
by definition:
is a thermal resistance R th And then:
on a heat sink having a plurality of flat plates, i.e., fins, the cross-sectional area of a flat plate a = L × b, L is the length of the flat plate, b is the width of the flat plate, and n flat plates are provided, and the solid conduction thermal resistance in the fins is, after converting the thermal resistance unit to "° c/W":
n: the number of fins of the heat sink;
the solid conduction thermal resistance of the radiator is determined by the external dimension, shape and material of the radiator, and the method for reducing the heat transfer thermal resistance between the radiator and air is adopted to reduce the total thermal resistance of the system.
Example (b):
the radiator of the invention is composed of a substrate and a plurality of tooth sheets on the substrate, a through hole which is as long as 17 is arranged in the middle of the tooth-shaped radiator, the tolerance precision is IT4, and a packaged chip module is arranged on the substrate and is fixed by two M4 countersunk head screws. The contact surface is coated with heat-conducting silicone grease, the heat conductivity coefficient of the heat-conducting silicone grease is 6w/m k, and the thermal resistance is less than 0.05 ℃/m < 2 >. The process of transferring the heat generated during operation to the heat sink through the contact surface is solid heat conduction. The radiator panel is surrounded by air. The heat on the substrate plate is transferred to the air, which is the heat transfer between the solid and the fluid. The total thermal resistance of the heat sink is equal to the sum of the two thermal resistances:
Rzo= R th + R thk ；
wherein Rzo is the total thermal resistance, R th Is a solid heat transfer resistor in the radiator, R thk Is the heat transfer resistance between the heat sink and the air.
The basic characteristics of stable heat conduction in the radiator:
1, a temperature gradient exists in the radiator. The points with the same temperature in the heat conduction process form an isothermal surface. The temperature of the isothermal surface does not change with time.
2, the radiator material is aluminum, the radiator material is isotropic, and the heat flow flows along a path vertical to the isothermal surface towards the direction of temperature reduction.
There is not the heat source in the radiator, and the thermal current is one-dimensional and stable, according to the Fourier heat conduction equation, is A through the area, and length is the heat at l solid both ends:
wherein Ks is the coefficient of thermal conductivity; a is the area through which the heat flow passes;
is a temperature difference pairDerivation of the length between; the temperature gradient T2-T1 is the temperature difference between two ends of the solid;
by definition:
is the thermal resistance R th And then:
on a heat sink having a plurality of flat plates, i.e., fins, where the cross-sectional area of a flat plate a = L × b, L is long, b is wide, and n flat plates are provided, the solid conductive thermal resistance in the fin of the heat sink is, after converting the thermal resistance unit to "° c/W":
n: the number of fins of the heat sink;
the solid conduction thermal resistance of the radiator is determined by the external dimension, shape and material of the radiator, and in order to reduce the total thermal resistance of the system, a method for reducing the heat transfer thermal resistance between the radiator and air is mainly adopted.
When heat is transferred to the surface of the heat sink, the heat is almost entirely dissipated by the fluid.
The thermal transfer resistance of the heat sink to the air fluid is primarily present in a thin layer of air against the solid surface, which, when penetrated by heat, is easily carried away by the outer layer of air. This layer is referred to as the "boundary layer". The boundary layer heat transfer coefficient eta depends on the thickness and characteristics of the boundary layer and is related to parameters reflecting the air flow condition in the boundary layer.
Taking air as an example, there are two kinds of motive force for the air flow, one is to make it flow by mechanical power, such as a fan. The other is natural convection formed by the temperature difference of air. The former causes turbulence due to disturbance of air by external force, which is called "turbulence forced convection"; the latter is also largely in a laminar state, known as "laminar forced convection". Both cases exist in heat exchange between the plate surface and air, but the thermal resistance is very different. Because the former air molecules are irregularly interpenetrated due to external reasons, the air molecules with different temperatures frequently contact to generate heat exchange transfer, and the outer air receiving heat is replaced by the new air flowing rapidly. Such cycling produces extremely high heat dissipation efficiency, as shown in FIG. 2, and this method of heat dissipation is often referred to as "air cooling" or "forced air cooling". The latter exchanges heat by natural convection of air, the air flows in laminar state, as shown in fig. 3, the air molecules with different flow rates in the boundary layer do not generate cross motion, the heat transfer is slow, and the heat dissipation efficiency is low. This method of heat dissipation is often referred to as "self-cooling".
By comparison, the heat conduction resistance between the radiator and the air can be greatly reduced by a forced air cooling mode, so that the total heat resistance of a heat dissipation system is reduced, and the device works in a good and stable working environment.
In addition, in order to further strengthen the heat conduction efficiency, at the bottom plate in close contact with of radiator and casing, the contact surface is scribbled heat conduction silicone grease, on the heat of being convenient for on the radiator shifts the casing bottom plate fast, bottom plate bottom has the radiating groove, also directly contacts with faces or equipment such as platform simultaneously, can conduct the heat to in outside contact facilities and the air circumstance fast. The heat transfer is schematically shown in fig. 4.
As shown in fig. 5, the detector chip temperature control platform with the overall structure of the machine shell comprises a machine shell 1, a fan 2, a toothed radiator 3, a packaged chip module 4, a circuit board 5 and a machine shell bottom plate 6, wherein the fan 1 is arranged on the side edge of the machine shell, a blowing port of the fan 1 is right opposite to the toothed radiator 3, the packaged chip 4 module is installed on the toothed radiator 3 through contact of heat-conducting silicone grease, the packaged chip module 4 is connected with the circuit board 5, a heat-conducting silicone grease layer is arranged between the toothed radiator 3 and the bottom plate bottom, a wire guide groove is formed in the machine shell 1, flying wires such as optical fibers are placed, if the optical fibers are protected through a silicone tube and then coiled in an optical fiber groove at the bottom of the machine shell, the optical fiber groove is sealed by foam, and interference caused by temperature change and airflow disturbance to counting is avoided.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the foregoing has described the practice of the present invention in detail, it will be apparent to those skilled in the art that modifications may be made to the practice of the invention as described in the foregoing examples, or that certain features may be substituted in the practice of the invention. All changes, equivalents and modifications which come within the spirit and scope of the invention are desired to be protected.
Claims (7)
1. A temperature control method for a detector chip is characterized by comprising the following steps:
1) Welding a detector chip on a semiconductor refrigerating sheet through a heat sink;
2) Packaging the semiconductor refrigerating sheet with the detector chip after heat insulation;
3) A radiator is configured by calculating solid conduction thermal resistance, and the packaged chip is installed on the radiator;
4) The radiator is connected with the bottom plate of the machine shell through contact of heat-conducting silicone grease, and the radiator radiates heat in a turbulent forced convection mode.
2. The method according to claim 1, wherein the heat sink comprises a substrate and a plurality of fins disposed on the substrate, a through hole is disposed in the heat sink, the packaged chip is mounted on the substrate, and a contact surface between the packaged chip and the substrate is coated with a thermally conductive silicone grease.
3. The method according to claim 2, wherein the thermal grease has a thermal conductivity of 6w/m x k and a thermal resistance of less than 0.05 ℃/m2.
4. The method according to claim 2, wherein the heat sink material is aluminum.
5. The method for controlling the temperature of the detector chip according to claim 1, wherein the calculation of the solid conduction thermal resistance specifically comprises:
according to the Fourier heat conduction equation, the heat at two ends of a solid with the area of A and the length of l is passed:
ks is the thermal conductivity; a is the area through which the heat flow passes;
is the length derivative between the temperature difference pairs; the temperature gradient T2-T1 is the temperature difference between the two ends of the solid;
by definition:
is the thermal resistance R th And then:
on a heat sink having n flat plates, i.e., fins, the cross-sectional area a = L × b, L being the length of the flat plate, b being the width of the flat plate, and n flat plates, the solid conduction thermal resistance in the fins is, after converting the thermal resistance unit to "° c/W":
6. the method as claimed in claim 1, wherein the turbulent forced convection mode is a forced air cooling mode.
7. The method as claimed in claim 6, wherein the forced air cooling is performed by installing a fan on the side of the heat sink, and the fan causes air in the boundary layer of the fins to be disturbed by external force to cause turbulence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210734392.9A CN115145323A (en) | 2022-06-27 | 2022-06-27 | Temperature control method for detector chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210734392.9A CN115145323A (en) | 2022-06-27 | 2022-06-27 | Temperature control method for detector chip |
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| CN115145323A true CN115145323A (en) | 2022-10-04 |
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| CN202210734392.9A Pending CN115145323A (en) | 2022-06-27 | 2022-06-27 | Temperature control method for detector chip |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6377453B1 (en) * | 1999-01-29 | 2002-04-23 | Hewlett-Packard Company | Field replaceable module with enhanced thermal interface |
| JP2005328018A (en) * | 2004-04-14 | 2005-11-24 | Denso Corp | Semiconductor device |
| CN101719490A (en) * | 2009-10-23 | 2010-06-02 | 广东昭信光电科技有限公司 | Multifunctional LED encapsulating structure |
| CN102801105A (en) * | 2012-08-09 | 2012-11-28 | 无锡沃浦光电传感科技有限公司 | Package of quantum cascade laser with thermoelectric refrigerator |
| CN105658029A (en) * | 2016-01-04 | 2016-06-08 | 北京国科世纪激光技术有限公司 | Modeling calculation method for radiator |
| CN109933175A (en) * | 2019-03-28 | 2019-06-25 | 联想(北京)有限公司 | A kind of heat dissipation detection method, device and electronic equipment |
| WO2021218463A1 (en) * | 2020-04-26 | 2021-11-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2022
- 2022-06-27 CN CN202210734392.9A patent/CN115145323A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6377453B1 (en) * | 1999-01-29 | 2002-04-23 | Hewlett-Packard Company | Field replaceable module with enhanced thermal interface |
| JP2005328018A (en) * | 2004-04-14 | 2005-11-24 | Denso Corp | Semiconductor device |
| CN101719490A (en) * | 2009-10-23 | 2010-06-02 | 广东昭信光电科技有限公司 | Multifunctional LED encapsulating structure |
| CN102801105A (en) * | 2012-08-09 | 2012-11-28 | 无锡沃浦光电传感科技有限公司 | Package of quantum cascade laser with thermoelectric refrigerator |
| CN105658029A (en) * | 2016-01-04 | 2016-06-08 | 北京国科世纪激光技术有限公司 | Modeling calculation method for radiator |
| CN109933175A (en) * | 2019-03-28 | 2019-06-25 | 联想(北京)有限公司 | A kind of heat dissipation detection method, device and electronic equipment |
| WO2021218463A1 (en) * | 2020-04-26 | 2021-11-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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