CN115124902A - Conductive resin composition - Google Patents
Conductive resin composition Download PDFInfo
- Publication number
- CN115124902A CN115124902A CN202210292720.4A CN202210292720A CN115124902A CN 115124902 A CN115124902 A CN 115124902A CN 202210292720 A CN202210292720 A CN 202210292720A CN 115124902 A CN115124902 A CN 115124902A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- conductive resin
- meth
- acrylate
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 title claims abstract description 93
- 239000002245 particle Substances 0.000 claims abstract description 69
- 229910000679 solder Inorganic materials 0.000 claims abstract description 65
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 230000004907 flux Effects 0.000 claims abstract description 16
- 239000006096 absorbing agent Substances 0.000 claims description 29
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000002834 transmittance Methods 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 239000006229 carbon black Substances 0.000 claims description 7
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 58
- 230000008439 repair process Effects 0.000 abstract description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 106
- 239000003822 epoxy resin Substances 0.000 description 41
- 229920000647 polyepoxide Polymers 0.000 description 41
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 32
- 238000010438 heat treatment Methods 0.000 description 22
- -1 and among them Polymers 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 17
- 239000000126 substance Substances 0.000 description 15
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 230000002950 deficient Effects 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 235000019241 carbon black Nutrition 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000011246 composite particle Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 3
- 235000005074 zinc chloride Nutrition 0.000 description 3
- 239000011592 zinc chloride Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000003556 assay Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- KQTIIICEAUMSDG-UHFFFAOYSA-N tricarballylic acid Chemical compound OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- BEOUGZFCUMNGOU-UHFFFAOYSA-N tuberculostearic acid Chemical compound CCCCCCCCC(C)CCCCCCCCC(O)=O BEOUGZFCUMNGOU-UHFFFAOYSA-N 0.000 description 2
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- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- OIAQMFOKAXHPNH-UHFFFAOYSA-N 1,2-diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC=C1C1=CC=CC=C1 OIAQMFOKAXHPNH-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
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- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Provided is a conductive resin composition which can obtain an electronic component mounting substrate which is easy to repair and has high connection reliability after repair. A conductive resin composition comprising at least (A) a thermosetting resin, (B) a curing agent for curing the thermosetting resin, (C) solder particles, and (D) a flux, wherein when the conductive resin composition is cured to form a cured film having a thickness of 30 [ mu ] m, the cured film has a reflectance of 20% or less with light having a wavelength of 1064nm or 532 nm.
Description
Technical Field
The present invention relates to a conductive resin composition, and particularly to a conductive resin composition used when mounting an electronic component on a wiring board.
Background
Electro-optical devices such as liquid crystal display devices are used as display portions of various electronic devices such as computers and mobile phones, and particularly, liquid crystal display devices are widely used as display portions of various electronic devices because of their light weight, thin profile, and low power consumption. In many of these liquid crystal display devices, a so-called backlight is provided on the back side of an electro-optical component such as a liquid crystal panel.
In recent years, LED array substrates have been used as backlights used in electro-optical devices and the like. The LED array substrate has a plurality of LED chips mounted in a matrix on a wiring substrate, and each LED chip and the wiring substrate are electrically connected by solder or the like. Recently, smaller LED chips are also used in LED array substrates for the purpose of downsizing and increasing the efficiency of backlights, and the respective LED chips are integrated and mounted on a wiring substrate. Accordingly, in mounting LED chips, instead of conventional electrical connection by solder, conductive paste and conductive film called anisotropic conductive material have come to be used. The anisotropic conductive material is a material in which conductive particles are dispersed in an insulating curable resin adhesive, and by thermocompression bonding electrode portions of electronic components (here, a wiring board and an LED chip), the electronic components are electrically connected to each other only in a pressing direction by the conductive particles, and the electronic components can be fixed by curing the curable resin adhesive while maintaining the insulating property between adjacent electrodes (for example, patent document 1 and the like).
The use of an anisotropic conductive material instead of solder has an advantage in that a plurality of LED chips can be mounted to a wiring substrate simultaneously and in a short time. On the other hand, the anisotropic conductive material has a problem of inferior reworkability compared with solder connection. That is, in the case of solder connection, the target component can be easily removed from the wiring board and remounted by heating the component to be reworked, but in the case of connection by the anisotropic conductive material, the electronic components are firmly adhered to each other by the resin adhesive and cannot be easily removed, and even in the case where the electronic components can be removed, the cured resin adhesive remains on the wiring board and therefore the resin adhesive needs to be removed by a dedicated solvent or the like.
To cope with these problems, patent document 2 describes the following technique: the cured anisotropic conductive material is left on the wiring board, and a new anisotropic conductive film is attached in this state, whereby the electronic component can be re-bonded without using a repair agent.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 8-003529
Patent document 2: japanese patent application laid-open No. 2010-272545
Disclosure of Invention
Problems to be solved by the invention
However, in the method proposed in patent document 2, it is necessary to design a cured product of the anisotropic conductive film so that the elastic modulus at 150 ℃ is 10MPa or less, and therefore it is difficult to obtain the connection reliability (heat resistance) between electronic components. Further, since pressurization is required when the electronic component is mounted again, damage to the wiring substrate cannot be avoided when an FPC (flexible wiring substrate) or the like is used as the wiring substrate.
In addition, in recent years, the miniaturization of LED chips has been advanced, and for example, LED array substrates in which LED chips having an outer dimension of about several tens of micrometers are mounted on a wiring substrate at an adjacent interval of 1mm or less have been put into practical use, and it has become increasingly difficult to remove the LED chips from the wiring substrate for repair. Further, since the position from which the defective LED chip is removed is narrow, the work of removing the cured resin adhesive remaining on the wiring substrate side becomes very difficult. The LED chip can be removed by heating the repair portion and melting the resin adhesive and the solder, but in this case, the surrounding LED chip and other mounted components that do not need to be repaired may be affected. It is also conceivable to use a laser or the like capable of local heating, but even in this case, it is inevitable that the insulating film and the electrode on the surface of the wiring substrate on which the LED element is mounted are heated.
The present invention has been made in view of the above problems, and an object thereof is to provide a conductive resin composition which can provide an electronic component mounting board which is easy in a repairing work and has high connection reliability after the repairing work.
Means for solving the problems
In view of the above problems, the present inventors have found that, when an electronic component is removed from an electronic component mounting board in which an electrode of a wiring board and the electronic component are connected by a conductive resin composition, if a cured product of the conductive resin composition has specific optical properties, the electronic component can be easily removed by irradiation with a laser or the like, and the influence on the periphery of the electronic component to be removed can be reduced, and the connection reliability of the electronic component mounting board after a repair work can be improved. The present invention has been completed based on the above findings. That is, the gist of the present invention is as follows.
[1] A conductive resin composition comprising at least (A) a thermosetting resin, (B) a curing agent for curing the thermosetting resin, (C) solder particles, and (D) a flux, wherein,
when the conductive resin composition is cured to form a cured film having a thickness of 30 μm, the cured film has a reflectance of 20% or less under light having a wavelength of 1064 nm.
[2] The conductive resin composition according to [1], wherein when the conductive resin composition is cured to form a cured film having a thickness of 30 μm, the cured film has a transmittance of 55% or less under light having a wavelength of 1064 nm.
[3] A conductive resin composition comprising at least (A) a thermosetting resin, (B) a curing agent for curing the thermosetting resin, (C) solder particles, and (D) a flux, wherein,
when the conductive resin composition is cured to form a cured film having a thickness of 30 μm, the cured film has a reflectance of 20% or less under light having a wavelength of 532 nm.
[4] The conductive resin composition according to [3], wherein when the conductive resin composition is cured to form a cured film having a thickness of 30 μm, the cured film has a transmittance of 55% or less under light having a wavelength of 532 nm.
[5] The conductive resin composition according to any one of [1] to [4], further comprising (E) a light absorbing agent capable of absorbing light energy and converting a part or the whole thereof into heat energy.
[6] The conductive resin composition according to [5], wherein the light absorber capable of absorbing light energy and converting a part or the whole of the light energy into heat energy of the above (E) is not modified or thermally decomposed at a temperature higher by 100 ℃ than the melting point of the solder particles of the above (C).
[7] The conductive resin composition according to [5] or [6], wherein the light absorber (E) capable of absorbing light energy and converting a part or the whole of the light energy into heat energy is contained in a proportion of 0.5 to 8% by mass relative to the amount of the solid component in the conductive resin composition.
[8] The conductive resin composition according to any one of [1] to [7], wherein the solder particles (C) are contained in a proportion of 20 to 70 mass% with respect to the amount of solid components in the conductive resin composition.
[9] The conductive resin composition according to any one of [5] to [8], wherein the light absorber (E) capable of absorbing light energy and converting a part or all of the light energy into heat energy is at least one selected from the group consisting of carbon black, titanium black and near infrared ray absorbers.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, when removing an electronic component from an electronic component mounting board, the electronic component can be easily removed by irradiation with a laser or the like, and the influence on the periphery of the electronic component to be removed can be reduced, and the connection reliability of the electronic component mounting board after the repair work can be improved. In particular, the present invention is effective in repairing a miniaturized LED chip.
Detailed Description
The conductive resin composition of the present invention contains (a) a thermosetting resin, (B) a curing agent for curing the thermosetting resin, (C) solder particles, and (D) a flux as essential components, and when the conductive resin composition is applied between opposing electrodes as in the case of mounting an electronic component on a wiring board, for example, the opposing electrodes are electrically connected, and adjacent electrodes have a property of maintaining insulation. When the conductive resin composition of the present invention is cured to form a cured film having a thickness of 30 μm, the cured film has a reflectance of 20% or less under light having a wavelength of 1064nm or 532 nm. By forming the conductive resin composition having such properties, when a cured product (for example, a cured coating) of the conductive resin composition is heated by irradiation with a laser beam, etc., the laser-irradiated portion can be efficiently heated, and the electronic component can be easily removed from the electronic component mounting substrate in the repair work. Further, even when the heating is locally performed by the laser irradiation, the diffusion of heat to the non-irradiated portion can be suppressed, so that the influence on the periphery of the electronic component to be removed can be reduced, and the connection reliability of the electronic component mounting substrate after the repair work can be improved. The cured coating film preferably has a reflectance of 15% or less, more preferably 10% or less, and particularly preferably 5% or less, under light having a wavelength of 1064nm or 532 nm. In addition, from the viewpoint of further exhibiting the effects of the present invention, it is more preferable that the reflectance of light having a wavelength of 1064nm and the reflectance of light having a wavelength of 532nm are both 20% or less.
The conductive resin composition of the present invention has the following characteristics: when the cured film is cured to form a cured film having a thickness of 30 μm, the reflectance of the cured film under light having a wavelength of 1064nm or 532nm is 20% or less, and the transmittance under light having a wavelength of 1064nm or 532nm is preferably 55% or less. In the case of the conductive resin composition having the above optical properties as a cured coating, the resin component and the solder particles constituting the conductive resin composition absorb light energy, and a part or all of the light energy is converted into heat energy, whereby the removability of the resin component in the cured product during the repair work is further improved. Since the electrically conductive resin composition has such characteristics, a light absorbing agent (hereinafter also referred to as (E) light absorbing agent) capable of absorbing light energy and converting a part or the whole thereof into heat energy, which will be described later, is not essential, and there is no particular limitation as long as optical characteristics are imparted as to the selection of (a) the thermosetting resin and (B) the curing agent, other components to be added according to the desire. In addition to the light absorber (E), the above-mentioned properties can be satisfied by, for example, making a combination of coloring of the cured resin. In addition, (C) the solder particles may have a function of absorbing light energy and converting a part or all thereof into thermal energy, or the cured resin itself may absorb light energy and convert a part or all thereof into thermal energy. In any case, when the conductive resin composition is a cured film, the resin component in the cured product is more easily removed during the repair work if the reflectance is 20% or less, preferably 55% or less, under the light having a wavelength of 1064nm or 532 nm. The transmittance of the cured coating is preferably 30% or less, more preferably 20% or less, and particularly preferably 10% or less.
The reflectance and transmittance specified in the present invention can be specifically measured as follows. First, a conductive resin composition was applied to one surface of a glass substrate (product name S1112, manufactured by sonlang nitre industries co., ltd.) and the conductive resin composition was cured to form a cured film having a thickness of 30 μm. The conductive resin composition was cured (cured film was formed) using a hot plate under curing conditions of 180 ℃ for 30 minutes. Then, the substrate having the cured coating film formed thereon was measured for reflectance and transmittance of light having a wavelength of 1064nm or 532nm using, for example, a V-570 type ultraviolet-visible-infrared spectrophotometer (manufactured by Nippon spectral Co., Ltd.) equipped with an integrating sphere unit ISN-470.
The cured coating of the conductive resin composition of the present invention has the above optical properties, and each component constituting the conductive resin composition will be described in detail.
< A thermosetting resin >
(A) The thermosetting resin functions as a binder for the solder particles (C) described later, and also functions to bond the wiring board and the electronic component by curing. Examples of the thermosetting resin include epoxy resins, phenol resins, melamine resins, unsaturated polyester resins, maleimide resins, urethane resins, silicone resins, cyanate resins, and acrylic resins, and among them, epoxy resins and acrylic resins are preferably used, and epoxy resins are particularly preferred.
As the epoxy resin, any epoxy resin can be used without limitation as long as it has 2 or more epoxy groups in 1 molecule. Examples thereof include bisphenol a type epoxy resins, bisphenol F type epoxy resins, bisphenol E type epoxy resins, hydrogenated bisphenol a type epoxy resins, brominated bisphenol a type epoxy resins, bisphenol S type epoxy resins and other epoxy resins having a bisphenol skeleton, the later-described phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol a novolac type epoxy resins, biphenyl type epoxy resins, naphthol type epoxy resins, naphthalene type epoxy resins, dicyclopentadiene type epoxy resins, triphenylmethane type epoxy resins, alicyclic epoxy resins, aliphatic chain epoxy resins, phosphorus-containing epoxy resins, anthracene type epoxy resins, norbornene type epoxy resins, adamantane type epoxy resins, fluorene type epoxy resins, the later-described aminophenol type epoxy resins, alkylphenol type epoxy resins and the like. The epoxy resin can be used alone in 1 or more than 2 combination.
Examples of the polyfunctional epoxy resin include: EP-3300E manufactured by ADEKA, a phenol-based liquid Epoxy resin (p-aminophenol-based liquid Epoxy resin), JeR 630 manufactured by Mitsubishi chemical corporation, an ELM-100 manufactured by Sumitomo chemical corporation, JeR 604 manufactured by Mitsubishi chemical corporation, a glycidyl amine-based Epoxy resin, YH-434 manufactured by Nikko chemical corporation, Sumi-Epoxy ELM-120 manufactured by Sumitomo chemical industry, and D.E.N.431 manufactured by Dow chemical company, a phenol novolac-based Epoxy resin. These polyfunctional epoxy resins may be used alone in 1 kind or in combination of 2 or more kinds.
In the above epoxy resin, the conductive resin composition is preferably in a liquid state rather than a solid state, from the viewpoint of making the conductive resin composition in a paste state. Specifically, epoxy resins having a bisphenol skeleton are preferred, and bisphenol a type epoxy resins, bisphenol F type epoxy resins, and bisphenol E type epoxy resins are more preferred. Examples of the commercially available products include ZX-1059 (a mixed product of bisphenol A and bisphenol F epoxy resins) manufactured by Nippon iron chemical Co., Ltd, jER 828, jER 834, jER 1001 (bisphenol A epoxy resin), jER 807, jER4004P (bisphenol F epoxy resin), R710 (bisphenol E epoxy resin) manufactured by AIR WATER Co., Ltd.
The acrylic resin is not particularly limited as long as it is a resin having a (meth) acryloyl group, and examples thereof include a 3-functional methacrylate monomer such as trimethylolpropane trimethacrylate and an epoxy acrylate having a trimethylpropane skeleton. Among them, monofunctional (meth) acrylate, 2-functional (meth) acrylate, 3-or more-functional (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, and 2-or more-functional polyester (meth) acrylate can be preferably used.
Examples of monofunctional (meth) acrylates include: methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octyl heptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, dodecyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, butyl (meth) acrylate, butyl acrylate, decyl (meth) acrylate, butyl acrylate, decyl (meth) acrylate, decyl (meth) acrylate, butyl, Aliphatic (meth) acrylates such as behenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate; alicyclic (meth) acrylates such as cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, 3-methyl-3-oxetanylmethyl (meth) acrylate, and 1-adamantyl (meth) acrylate; phenyl (meth) acrylate, nonylphenyl (meth) acrylate, p-cumylphenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthyloxy) propyl (meth) acrylate, aromatic (meth) acrylates such as 2-hydroxy-3- (2-naphthyloxy) propyl (meth) acrylate, 2-tetrahydrofurfuryl (meth) acrylate, N- (meth) acryloyloxyethyl hexahydrophthalimide, N-cumylphthalimide, phenylbiphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthylphenoxy (meth) acrylate, and the like, Heterocyclic (meth) acrylates such as 2- (meth) acryloyloxyethyl-N-carbazole.
Examples of the 2-functional (meth) acrylate include: ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 1, 3-butylene glycol di (meth) acrylate, 2-methyl-1, 3-propylene glycol di (meth) acrylate, 1, 4-butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 3-methyl-1, 5-pentanediol di (meth) acrylate, aliphatic (meth) acrylates such as 6-hexanediol, 2-butyl-2-ethyl-1, 3-propanediol di (meth) acrylate, 1, 9-nonanediol di (meth) acrylate, 1, 10-decanediol di (meth) acrylate, glycerol di (meth) acrylate, tricyclodecanedimethanol (meth) acrylate; alicyclic (meth) acrylates such as cyclohexanedimethanol (meth) acrylate, tricyclodecanedimethanol (meth) acrylate, hydrogenated bisphenol a di (meth) acrylate, and hydrogenated bisphenol F di (meth) acrylate; aromatic (meth) acrylates such as bisphenol a di (meth) acrylate, bisphenol F di (meth) acrylate, bisphenol AF di (meth) acrylate, ethoxylated bisphenol a di (meth) acrylate, fluorene type di (meth) acrylate; heterocyclic (meth) acrylates such as diisocyanato di (meth) acrylate.
Examples of the 3-or more-functional polyfunctional (meth) acrylate include: aliphatic (meth) acrylates such as trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and ethoxylated glycerol tri (meth) acrylate; heterocyclic (meth) acrylates such as isocyanuric acid tri (meth) acrylate.
< curing agent (B) >
The conductive resin composition contains (B) a curing agent for curing the curable resin (a). As the curing agent (B), known curing agents generally used for curing the thermosetting resin (a) can be used, and examples thereof include amines, imidazoles, polyfunctional phenols, acid anhydrides, isocyanates, and polymers containing functional groups thereof, and a plurality of these can be used as necessary. Examples of the amines include dicyandiamide and diaminodiphenylmethane. The imidazoles include alkyl-substituted imidazoles and benzimidazoles. The imidazole compound may be an imidazole latent curing agent such as an imidazole adduct. Examples of the polyfunctional phenol include hydroquinone, resorcinol, bisphenol a and halides thereof, and novolaks and resols which are condensates of hydroquinone, resorcinol, bisphenol a and aldehydes. Examples of the acid anhydride include phthalic anhydride, hexahydrophthalic anhydride, nadic methyl anhydride, and benzophenone tetracarboxylic acid. Examples of the isocyanate include tolylene diisocyanate and isophorone diisocyanate, and the isocyanate may be masked with a phenol or the like. These curing agents may be used alone in 1 kind or in combination of 2 or more kinds.
The amount of the curing agent (B) to be mixed is preferably in the range of 3 to 15 parts by mass, more preferably 4 to 10 parts by mass, and particularly preferably 5 to 8 parts by mass, in terms of solid content, per 100 parts by mass of the thermosetting resin (a), from the viewpoints of the curing rate of the conductive resin composition and the strength of a cured product after curing.
The curing speed of the conductive resin composition can be controlled by adjusting the kind and compounding amount of the curing agent (B) and the curing accelerator which can be added as desired, but the reaction temperature (curing temperature) of the resin is preferably higher than the melting point of the solder particles (C) described later, more preferably higher than 5 ℃. The "anisotropic" conductive resin composition means the following properties: by utilizing the property that the solder particles are aggregated in the electrodes when the solder particles are melted, the solder particles dispersed in the curable resin in a flowing state are melted and self-aggregated in the electrodes, and the solder can be arranged only between the electrodes to be connected, and the insulation can be ensured between the adjacent electrodes. As described above, by setting the reaction temperature (curing temperature) of the (a) thermosetting resin to be higher than the melting point of the (C) solder, the (C) solder particles dispersed in the composition can be self-agglomerated before the thermosetting resin is cured.
< solder particles >
The solder particles (C) are not particularly limited as long as they are conventionally known, and examples thereof include gold, silver, nickel, copper, lead, and low-melting solder particles described later. (C) The solder particles may be composite particles obtained by coating nonconductive particles such as glass, ceramics, plastics, etc. as cores with solder, or composite particles having the nonconductive particles and the solder particles. When the (C) solder particle is the composite particle or the thermally fusible metal particle, the (C) solder particle is melted and deformed by heating, so that a contact area with the electrode at the time of connection is increased, and particularly high reliability can be obtained.
The solder particles (C) are preferably those which melt by heating at 170 ℃ or lower, among which low-melting solder particles are more preferred, and Sn-Pb-based or Sn-Bi-based low-melting solder particles are more preferred. The low-melting solder particles are solder particles having a melting point of 200 ℃ or less, preferably 170 ℃ or less, and more preferably 150 ℃ or less. In particular, the melting point of the solder particles (C) may be higher or lower than the glass transition temperature of the cured product of the curable resin, in order to facilitate removal of the electronic component in the step of removing the defective electronic component.
As the low melting point solder particles, lead-free solder particles are preferred, and the lead-free solder particles are JIS Z3282: 2017 (solder-chemical composition and shape) has a lead content of 0.10 mass% or less.
As the lead-free solder particles, low melting solder particles composed of one or more metals selected from tin, bismuth, indium, copper, silver, and antimony are suitably used. In particular, an alloy of tin (Sn) and bismuth (Bi) is preferably used in terms of balance among cost, handling properties, and bonding strength.
The content of Bi in such low-melting-point solder particles is appropriately selected within a range of 15 to 65 mass%, preferably 35 to 65 mass%, and more preferably 55 to 60 mass%.
When the content of Bi is 15 mass% or more, the alloy starts to melt at about 160 ℃. When the content of Bi is further increased, the melting start temperature decreases, and at 20 mass% or more, the melting start temperature is 139 ℃, and at 58 mass%, the eutectic composition is formed. Therefore, by setting the content of Bi within the range of 15 mass% to 65 mass%, the effect of lowering the melting point can be sufficiently obtained, and as a result, sufficient conduction connection can be obtained even at low temperatures.
(C) The solder particles are preferably spherical. The spherical shape is a particle containing 90% or more of spherical powder having a ratio of the major axis to the minor axis of 1 to 1.5 at a magnification at which the shape of the solder (C) can be confirmed. The average particle diameter of the solder particles (C) is preferably 1 to 100. mu.m, more preferably 3 to 80 μm, and still more preferably 5 to 60 μm. In the present specification, the average particle diameter refers to a median particle diameter (D50) measured by a laser diffraction particle size distribution meter.
In addition, the specific surface area of the solder particles (C) is preferably 300cm 2 /g～2000cm 2 G, more preferably 500cm 2 /g～1500cm 2 (ii) in terms of/g. By using solder particles having a specific surface area within the above range, the stability of conductive connection between the electrode of the wiring substrate and the electronic component is improved. The specific surface area of the solder particles is a value measured by the BET method, and specifically, the specific surface area can be determined from the adsorption amount and the occupied area of the inert gas by adsorbing an inert gas (for example, nitrogen gas) having a known size of one molecule on the surface of the measurement sample.
(C) The amount of the solder particles to be mixed is preferably in the range of 20 to 70 mass%, more preferably 30 to 60 mass%, and particularly preferably 35 to 55 mass% with respect to the amount of the solid component in the conductive resin composition. By setting the mixing amount of the solder particles (C) to 20 mass% or more, sufficient electrical connection can be secured while securing adhesion between the wiring board and the electronic component. Further, by setting the mixing amount of the (C) solder particles to 70 mass% or less, sufficient adhesion can be secured while securing conductive connectivity.
< solder flux >
In order to improve the stability of the conductive connection, the conductive resin composition of the present invention further contains (D) a flux in addition to (a) a thermosetting resin, (B) a curing agent, and (C) solder particles. As the (D) flux, known fluxes used in conductive resin compositions can be used, and examples thereof include zinc chloride, a mixture of zinc chloride and an inorganic halide, a mixture of zinc chloride and an inorganic acid, a molten salt, phosphoric acid, a derivative of phosphoric acid, an organic halide, hydrazine, an organic acid, rosin, and the like. These fluxes may be used alone in 1 kind or in combination of 2 or more kinds.
Among the above fluxes, organic acids can also be suitably used. Preferred examples of the organic acid include polycarboxylic acids such as dicarboxylic acids, tricarboxylic acids, and tetracarboxylic acids, in addition to monocarboxylic acids. Examples of the monocarboxylic acid include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, heptanoic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, margaric acid, stearic acid, tuberculostearic acid, arachidic acid, behenic acid, lignoceric acid, and glycolic acid. Examples of the dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, diglycolic acid, and the like. Examples of tricarboxylic acids include benzene-1, 2, 5-tricarboxylic acid, 1,2, 4-benzenetricarboxylic acid, 1,2, 3-propanetricarboxylic acid, and the like. Examples of the tetracarboxylic acid include benzophenone tetracarboxylic acid and 1,2,3, 4-butane tetracarboxylic acid. Among these carboxylic acids, dicarboxylic acids are preferred, glutaric acid and adipic acid are more preferred, and adipic acid is particularly preferred.
The content of the flux (D) in the conductive resin composition is preferably 1 to 15% by mass, more preferably 3 to 10% by mass, relative to the amount of solid components in the composition. When the conductive resin composition is prepared such that the content of the flux is within the above range, the conductive connectivity can be further improved.
In addition, in order to adjust the activity of the flux (D), a basic organic compound may be contained. The basic organic compound includes aniline hydrochloride and hydrazine hydrochloride.
< E) light absorber capable of absorbing light energy and converting a part or all of it into heat energy >
In order to more easily adjust the reflectance and transmittance of a cured coating having a thickness of 30 μm to the above ranges, the conductive resin composition of the present invention preferably contains a light absorber capable of absorbing light energy and converting a part or all of the light energy into heat energy. By including (E) the light absorber in the conductive resin composition, the connection reliability after the repair work is further improved. The light here is not limited to electromagnetic waves in the heat ray band, but includes various wavelengths of, for example, 300nm to 10.6 μm, and particularly preferably a light absorber capable of absorbing electromagnetic waves in the visible light band to the near infrared band and converting a part or all of the electromagnetic waves into heat energy.
Examples of the (E) light absorber usable in the present invention include various colorants, carbon black, titanium black, and near infrared absorbers. As the colorant, known colorants such as red, blue, green, and yellow may be used, and any of pigments, dyes, and pigments may be used. The near-infrared absorber is not particularly limited as long as it absorbs in the near-infrared band (700nm to 1800nm), and examples thereof include metal complex compounds such as nickel dithiolene complexes having a planar tetracoordinate structure, cyanine dyes having a polymethine skeleton extended, phthalocyanine dyes having aluminum or zinc at the center, anthraquinones, naphthoquinones, squarylium salt dyes, quinone compounds, diimmonium compounds, azo compounds, and the like. Among these, those which do not undergo modification or thermal decomposition at a temperature higher than the melting point of the solder particles (C) by 100 ℃ are preferable. As the (E) light absorber having such characteristics, carbon black, titanium black, and phthalocyanine can be preferably used. Specifically, MA11, MA100, MA600, #900, MA7, MA77, MA14 and MA8 (all of which are carbon blacks) from Mitsubishi chemical corporation; black SD-TT2259 (carbon Black) by RESINO COLOR INDUSTRY co, ltd; mitsubishi material electronic chemical company 12S, 13M-C, 13M-T, UF-8, FB15M (all titanium black); TilackD TM-F (titanium Black) available from Chishizu chemical Co., Ltd; FDN-010, FDN-007 and FDN-008 (phthalocyanine based near infrared ray absorbers) available from Shantian chemical industries, Ltd; OPTLION (registered trademark) (near infrared ray absorber) by TOYO visible sol solvanesco, ltd.; LaB6 (lanthanum hexaboride), CWO (registered trademark (cesium-doped tungsten oxide)) by sumitomo metal mine corporation; IR-915, IR-924 and HA-1 (all near infrared absorbers) available from Japanese catalyst; IR-001 (near infrared ray absorber) available from Fuji film corporation; IR-813 (p-toluenesulfonate) available from Tokyo chemical industry Co., Ltd., indocyanine green, 5,9,14,18,23,27,32, 36-octabutoxy-2, 3-copper (II) naphthalocyanine; ORIENT CHEMICAL INDUSTRIESCO, LTD OIL Blue613, and the like.
The size and shape of the (E) light absorber are not limited as long as the dispersibility of the (C) solder particles and the self-aggregation property during heating are not inhibited, and when the (E) light absorber is a material insoluble in the conductive resin composition, the average particle diameter is preferably 1 μm or less from the viewpoint of further reducing the reflectance of the cured film of the conductive resin composition. The average particle diameter refers to a median particle diameter (D50) measured by a laser diffraction particle size analyzer. The conductive resin composition may be a material that dissolves when mixed therein.
The content of the light absorber (E) in the conductive resin composition can be appropriately adjusted by the kind of the thermosetting resin (a) used and the blending amount of the solder particles (C), and is preferably 0.5 to 8% by mass, more preferably 0.6 to 6% by mass, based on the amount of the solid component in the composition, from the viewpoint of the effect of the present invention.
In addition, a filler may be blended in the conductive resin composition as necessary in order to improve the physical strength of the cured product. As the filler, known inorganic or organic fillers can be used, and barium sulfate, spherical silica, hydrotalcite and talc are particularly preferably used. In addition, metal hydroxides such as metal oxides and aluminum hydroxide may be used as extender pigment fillers for flame retardancy. Among these fillers, a filler having a wavelength band capable of absorbing at least a part of the wavelength band of the laser light can be preferably used.
In addition, in the case of compounding a filler, the filler may be surface-treated in order to improve dispersibility in the conductive resin composition. By using the filler subjected to the surface treatment, the aggregation can be suppressed. The surface treatment method is not particularly limited, and a known and conventional method may be used, and the surface of the inorganic filler is preferably treated with a surface treatment agent having a curable reactive group, for example, a coupling agent having a curable reactive group as an organic group, or the like.
As the coupling agent, silane-based, titanate-based, aluminate-based, and zircoaluminate-based coupling agents can be used. Among them, silane coupling agents are preferable. Examples of the silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, N- (2-aminomethyl) -3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane and the like, and these coupling agents may be used alone in 1 kind or in combination of 2 or more kinds.
The conductive resin composition may contain an organic solvent in view of ease of preparation and coatability. As organic solvents, it is possible to use: ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol diethyl ether, diethylene glycol monomethyl ether acetate, and tripropylene glycol monomethyl ether; esters such as ethyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate; aliphatic hydrocarbons such as octane and decane; and known and conventional organic solvents such as petroleum solvents including petroleum ether, petroleum naphtha, solvent naphtha, and the like. These organic solvents may be used alone in 1 kind or in combination of 2 or more kinds.
The conductive resin composition of the present invention can be produced by mixing and stirring the above components at a predetermined mixing ratio by a known and conventional method.
The conductive resin composition of the present invention can be used for electrical connection between components in an electronic component. For example, the present invention can be used for electrical connection between a printed circuit board and an electronic component and electrical connection between printed circuit boards, and is particularly suitable for an electronic component mounting board such as a Chip On Board (COB) for directly mounting and connecting an electronic component such as a bare chip or an LED chip on a substrate. Among these, the present invention can be suitably used for an application in which a plurality of elements are mounted on a wiring substrate having a fine gap between adjacent electrodes and are electrically connected together.
< repair work >
The specified defective portion is heated in the electronic component mounting substrate, and the specified electronic component is removed from the wiring substrate. The heating region may include the identified defective portion, and when the defective portion is only 1, the identified electronic component can be removed by heating only the defective portion. In addition, when there are a plurality of defective portions in the electronic component mounting substrate, each of the defective portions may be heated, or the entire wiring substrate may be heated to remove a specific electronic component.
The heating temperature is not particularly limited as long as it is a temperature at which the electronic component mounted on the wiring substrate can be removed, and is preferably a temperature higher than the glass transition point of the cured product of the conductive resin composition, and is preferably a temperature equal to or higher than the melting point of the molten cured product of the solder particles (i.e., the solder particles (C) contained in the conductive resin composition). The heating is preferably performed at 100 to 240 ℃, more preferably at 120 to 200 ℃, and particularly preferably at 140 to 170 ℃, although it depends on the thermosetting resin (a) and the solder particles (C) contained in the conductive resin composition used. The heating time is preferably 1 to 60 seconds, more preferably 1 to 30 seconds, and further preferably 1 to 15 seconds.
The heating may be performed from the surface of the wiring substrate on the side where the electronic component is mounted, or from the surface on the opposite side, and from the viewpoint of minimizing the suppression of the thermal damage to the electronic component, it is preferable to perform the heating from the surface on the opposite side to the side of the wiring substrate on which the electronic component is mounted. The heating means is not particularly limited, and various methods can be used, and for example, when heating only a defective portion locally, heating means such as a spot heater or a heat drier can be applied, and when heating the entire wiring board, planar heating means such as a hot plate can be applied.
By heating, the cured product of the conductive resin composition that fixes (bonds) the wiring board and the electronic component is softened, and the molten cured product of the solder particles in the cured product is remelted, so that the electronic component can be removed from the electronic component mounting board without applying unnecessary stress. As a means for removing the electronic component, it is possible to manually use tweezers or the like, or it is also possible to use a removing device provided with a dedicated holding tool.
Next, after removing the specific electronic component as described above, the cured product of the conductive resin composition remaining on the surface of the electronic component mounting substrate is removed. Such a residue may cause a connection failure or cause a positional deviation of mounting of the electronic component when a new electronic component is mounted again. According to the conductive resin composition of the present invention, only the remaining cured product can be easily removed locally by laser irradiation or the like, and the heat couple can be reducedThe influence of the surroundings thereof. The laser light to be irradiated may be of various wavelengths or types without particular limitation, and may be a continuous wave laser or a pulse wave laser. As the continuous wave laser, YVO, for example, can be used 4 A laser, a fiber laser, an excimer laser, a green laser, a carbon dioxide gas laser, an ultraviolet laser, a YAG laser, a semiconductor laser, a glass laser, a ruby laser, a He-Ne laser, a nitrogen laser, a chelate laser, a pigment laser, or the like. As the pulse wave laser, for example, a nanosecond pulse laser, a millisecond pulse laser, or the like can be used. Among them, from the viewpoint of removability and handleability of the cured product, a fiber laser (wavelength 1064nm), a carbon dioxide gas laser (wavelength 10.6 μm), a YAG laser (wavelength 1064nm), and a green laser (wavelength 532nm) are preferably used.
The output of the laser is not particularly limited as long as it is sufficient to remove the resin component in the cured product, and if the output is high, excessive heat may be generated to damage the substrate. Therefore, the laser irradiation is preferably repeated at an average output power of about 0.2W to 1.0W. The number of repetitions is not particularly limited, and is preferably about 5 to 50 times from the viewpoint of both damage to the substrate and practicality. Further, the laser irradiation may be repeated using a continuous wave laser, or a pulse wave laser may be used. The beam diameter of the laser beam is, for example, about 5 μm to 200 μm.
Examples
The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to these examples. In the following description, "part" and "%" are based on mass unless otherwise specified.
< preparation of electroconductive resin composition >
Each of the conductive resin compositions (examples 1 to 6 and comparative example 1) was prepared by mixing the components shown in table 1 below at a predetermined ratio and mixing the mixture at 400rpm for 10 minutes using a stirrer (FBLh600M, manufactured by tokyo nitz instruments co.). Note that, in table 1,1 to 10 represent the following components.
*1: epoxy resin (jER 828, manufactured by Mitsubishi chemical corporation)
*2: curing agent (DICY, dicyandiamide)
*3: low-melting-point solder particles (DS10, melting point 139 ℃, spherical, manufactured by Mitsui Metal mining Co., Ltd., specific surface area: 541 cm) 2 /g)
*4: welding flux (glutaric acid)
*5: carbon black (MA11, average particle diameter 29nm, Mitsubishi chemical Co., Ltd.)
*6: titanium black (12S, primary particle diameter: 80 to 100nm, Mitsubishi Material electronics chemical Co., Ltd.)
*7: titanium black (13M, primary particle diameter: 80 to 100nm, manufactured by Mitsubishi Material electronics Co., Ltd.)
*8: near-infrared absorber (FDN-010, manufactured by Shantian chemical industry Co., Ltd.)
*9: blue dye (OIL Blue613, ORIENT CHEMICAL INDUSTRIESCO., LTD.)
10% by weight of a white pigment (CR-58, titanium oxide, average particle diameter: 0.28 μm, manufactured by SHIYAKU Co., Ltd.)
The obtained conductive resin compositions were applied to one surface of a glass substrate (product name S1112, manufactured by Songlo Kaisha) and cured at 180 ℃ for 30 minutes using a hot plate, thereby forming a cured film having a thickness of 30 μm.
Then, the obtained substrate having the cured coating formed thereon was measured for reflectance and transmittance at a wavelength of 1064nm and a wavelength of 532nm using a V-570 type ultraviolet-visible-infrared spectrophotometer (manufactured by Nippon Kabushiki Kaisha) equipped with an integrating sphere unit ISN-470. The assay conditions were assay responses: fast, bandwidth: 2nm, scanning speed: 400nm/min, a start wavelength of 1100nm, an end wavelength of 350nm, and a data acquisition interval of 2nm, a glass substrate (product name S1112, manufactured by Songlanza Kogyo Co., Ltd.) was used as a reference, and Spectralon (registered trademark) was used as a reflecting plate. In addition, the following were measured according to JIS K7375: 2008, measurement is performed. The measurement results are shown in table 1 below.
< evaluation >
(reliability of connection after mounting)
Each of the obtained conductive resin compositions was applied to a PCB substrate (electrode width: 120 μm, electrode length: 200 μm, pitch width: 0.6mm, electrode number 10, gold flash treatment) with a doctor blade so that the thickness was 80 μm through a metal mask (mask thickness: 100 μm, opening: 200. mu. m.times.100 μm).
Next, electrodes of the respective LED chips (125 μm × 75 μm) were arranged so as to be superposed on respective electrode positions of the PCB substrate coated with the conductive resin composition, and heating was performed at 180 ℃ for 10 minutes from the LED chip side, thereby producing an evaluation substrate on which 10 LED chips were mounted. A voltage of 2.5V was applied to the electrode portion of each evaluation substrate using a 7011DC signal source (manufactured by nippon motor co., ltd.) to confirm whether or not the LED was lit. Whether or not the LED can be lit is evaluated according to the following criteria.
Excellent: lighting 9 or more of 10 LEDs on the evaluation substrate
Good component: 6 to 8 of 10 LEDs in an evaluation substrate are lit
Δ: 3 to 5 LEDs out of 10 LEDs of the evaluation substrate were lighted
X: 2 or less of the 10 LEDs of the evaluation substrate were lit
The evaluation results are shown in table 1.
< connection reliability after repair >
Among the evaluation substrates, a substrate in which all 10 LEDs were lit was selected, and the substrate was heated at 170 ℃ for 1 minute from the back side using a hot plate whose heating surface was partially masked with a heat insulating material, and after 10 LEDs were removed from the substrate, the substrate was cooled to room temperature. The areas from which the LEDs were removed were visually observed, and it was confirmed that the cured product of the conductive resin composition remained on the electrodes on the substrate surface at all 10 locations.
Next, the portion from which the LED was removed was irradiated with a laser beam at an output of 0.4W for 1 second using a fiber laser (wavelength: 1064 μm, beam diameter: 40 μm). This operation was repeated 10 times.
Then, 300mg of each conductive resin composition was applied to the portion (area: about 120. mu. m. times.200. mu.m) from which the LED was removed by using a dispenser, and the same LED as that used for the LED-mounted substrate was disposed at the applied portion, and the position of the electrode of the substrate and the position of the electrode of the LED were adjusted to overlap each other. Subsequently, the LED chip was heated at 180 ℃ for 10 minutes to remount the LED. A voltage of 2.5V was applied to the electrode portion of the submount substrate using a 7011DC signal source (manufactured by nippon motor co., ltd.) to confirm whether or not the LED was lit. Whether or not the LED can be lit is evaluated according to the following criteria.
Very good: 9 or more of the 10 LEDs on the evaluation substrate were lit
Good: 6 to 8 of 10 LEDs in an evaluation substrate are lit
Δ: 3 to 5 LEDs out of 10 LEDs of the evaluation substrate were lighted
X: 2 or less of the 10 LEDs of the evaluation substrate were lit
The evaluation results are shown in table 1.
< influence on the peripheral insulating film during repair >
The insulating film around the remounted substrate where the LED was mounted was observed with an OM microscope. Whether or not there was alteration of the insulating film was evaluated according to the following evaluation criteria.
Very good: the change in shape and the change in color were not confirmed.
Good: the change in shape was not confirmed, but the change in color was partially confirmed.
Δ: the change in shape and the change in color can be partially confirmed.
X: the change in shape and the change in color can be confirmed as a whole.
The evaluation results are shown in table 1.
As is clear from the evaluation results in table 1, in the case of the conductive resin compositions (examples 1 to 6) in which the reflectance at a wavelength of 1064nm and the reflectance at a wavelength of 532nm of the cured coating were 20% or less, the connection reliability in mounting the electronic component such as an LED on the circuit board was maintained, and the connection reliability was excellent without affecting the peripheral insulating part of the electronic component even after the repair work of removing the electronic component from the electronic component mounting board and then mounting the electronic component again.
In addition, it can be seen that: in the case of the conductive resin compositions (examples 1 to 4) in which the transmittance of the cured coating film at a wavelength of 1064nm and the transmittance at a wavelength of 532nm are both 55% or less, the influence of the peripheral insulating part is further suppressed, and the connection reliability is also improved.
On the other hand, it is known that: in the case of the conductive resin composition (comparative example 1) in which the reflectance of the cured coating film at a wavelength of 1064nm and the reflectance at a wavelength of 532nm both exceeded 20%, the connection reliability at the time of mounting the electronic component on the circuit board could be maintained, but the peripheral insulating portion of the circuit board from which the electronic component was removed was altered and the connection reliability after remounting was not obtained.
Claims (9)
1. An electrically conductive resin composition comprising at least (A) a thermosetting resin, (B) a curing agent for curing the thermosetting resin, (C) solder particles, and (D) a flux, characterized in that,
when the conductive resin composition is cured to form a cured film having a thickness of 30 μm, the cured film has a reflectance of 20% or less under light having a wavelength of 1064 nm.
2. The conductive resin composition according to claim 1, wherein when the conductive resin composition is cured to form a cured film having a thickness of 30 μm, the cured film has a transmittance of 55% or less under light having a wavelength of 1064 nm.
3. An electrically conductive resin composition comprising at least (A) a thermosetting resin, (B) a curing agent for curing the thermosetting resin, (C) solder particles, and (D) a flux, characterized in that,
when the conductive resin composition is cured to form a cured film having a thickness of 30 [ mu ] m, the reflectance of the cured film under light having a wavelength of 532nm is 20% or less.
4. The conductive resin composition according to claim 3, wherein when the conductive resin composition is cured to form a cured coating having a thickness of 30 μm, the transmittance of the cured coating under light having a wavelength of 532nm is 55% or less.
5. The electrically conductive resin composition according to claim 1 or 3, further comprising (E) a light absorbing agent capable of absorbing light energy and converting a part or all thereof into heat energy.
6. The electrically conductive resin composition according to claim 5, wherein said (E) light absorber capable of absorbing light energy and converting a part or all thereof into heat energy does not undergo modification or thermal decomposition at a temperature higher by 100 ℃ than the melting point of said (C) solder particles.
7. The conductive resin composition according to claim 5, wherein the light absorber (E) capable of absorbing light energy and converting a part or the whole of the light energy into heat energy is contained in a proportion of 0.5 to 8% by mass relative to the amount of the solid component in the conductive resin composition.
8. The conductive resin composition according to claim 1 or 3, wherein the solder particles (C) are contained in a proportion of 20 to 70 mass% with respect to the amount of the solid component in the conductive resin composition.
9. The electrically conductive resin composition according to claim 5, wherein the light absorber (E) capable of absorbing light energy and converting a part or all of the light energy into heat energy is at least one selected from the group consisting of carbon black, titanium black and a near infrared ray absorber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021051997A JP2022149722A (en) | 2021-03-25 | 2021-03-25 | Conductive resin composition |
| JP2021-051997 | 2021-03-25 |
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| Publication Number | Publication Date |
|---|---|
| CN115124902A true CN115124902A (en) | 2022-09-30 |
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|---|---|---|---|
| CN202210292720.4A Pending CN115124902A (en) | 2021-03-25 | 2022-03-24 | Conductive resin composition |
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|---|---|
| JP (1) | JP2022149722A (en) |
| CN (1) | CN115124902A (en) |
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