CN115122249A - Adhesive part sample preparation tool capable of controlling thickness of adhesive - Google Patents
Adhesive part sample preparation tool capable of controlling thickness of adhesive Download PDFInfo
- Publication number
- CN115122249A CN115122249A CN202110311722.9A CN202110311722A CN115122249A CN 115122249 A CN115122249 A CN 115122249A CN 202110311722 A CN202110311722 A CN 202110311722A CN 115122249 A CN115122249 A CN 115122249A
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- Prior art keywords
- adhesive
- thickness
- sample preparation
- area
- ptfe
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Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 40
- 239000000853 adhesive Substances 0.000 title claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 38
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims description 29
- 238000004026 adhesive bonding Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims 2
- -1 polytetrafluoroethylene Polymers 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 description 6
- 229910000975 Carbon steel Inorganic materials 0.000 description 3
- 239000010962 carbon steel Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the technical field of adhesive part sample preparation, and provides an adhesive part sample preparation tool capable of controlling the thickness of an adhesive, which comprises a base, a PTFE (polytetrafluoroethylene) bonding module and a PTFE gasket, wherein the PTFE bonding module is detachably embedded in the base; the PTFE gasket is placed in the first positioning groove and used for controlling the thickness of the adhesive; an upper substrate is placed above the PTFE gasket of the first positioning groove, and a lower substrate is placed in the second positioning groove. The invention has high sample preparation precision, is easy to assemble and disassemble due to modular design, can control the thickness of the glue and meets the requirement of continuous sample preparation.
Description
Technical Field
The invention relates to the technical field of adhesive part testing, in particular to an adhesive part sample preparation tool capable of controlling the thickness of an adhesive.
Background
The adhesive part is generally characterized in that different base materials are connected by glue, a bonding joint is formed in a gluing area of the two base materials, the firmness of the bonding joint directly influences the use of the adhesive part, and the firmness of the bonding joint depends on the bonding performance between the glue and the base materials.
In order to make the selected glue meet the use requirement of the bonding piece, the bonding performance of the bonding piece needs to be tested. In the test, it is impossible to completely transport the materials in the use environment into the laboratory, and therefore, it is necessary to prepare samples in accordance with the actual use environment and then test the adhesion performance using the prepared samples. At present, a sample preparation mode of a bonding piece is simple, a manual cushion block is mainly adopted for clamping aiming at the preparation of a bonded adhesive layer joint, the thickness of an adhesive layer is not accurately controlled, the deviation of the bonding area and the standard requirement is large, the operation is inconvenient, and the consistency of a sample is poor; or the thickness is fixed and can not be adjusted, and 4 surfaces of the overflow glue need to be cleaned after the glue is applied to the joint.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects in the prior art, the invention provides the adhesive part sample preparation tool capable of controlling the thickness of the adhesive.
The technical scheme adopted by the invention for solving the technical problem is as follows: an adhesive part sample preparation tool capable of controlling the thickness of an adhesive comprises a base, a PTFE (polytetrafluoroethylene) bonding module and a PTFE gasket, wherein an upper substrate positioning area, a bonding module mounting area and a lower substrate positioning area are sequentially arranged on the base along the width direction, the PTFE bonding module is of a step structure and is fixedly embedded in the bonding module mounting area and comprises an upper step part and a lower step part which are sequentially connected, at least one first positioning groove is arranged in the upper substrate positioning area, the first positioning groove extends from the substrate positioning area to the joint of the upper step part and the lower step part through the upper step part, second positioning grooves matched with the first positioning grooves in position and quantity are arranged in the lower substrate positioning area, and the second positioning grooves extend from the lower substrate positioning area to the joint of the upper step part and the lower step part through the lower step part; the PTFE gasket is placed in the first positioning groove and used for controlling the thickness of the adhesive; an upper base material is placed above the PTFE gasket of the first positioning groove, a lower base material is placed in the second positioning groove, the upper base material extends outwards to form a glue applying area with the overlapped part of the lower base material, and the distance between the lower surface of the upper base material and the upper surface of the lower base material is the thickness of the adhesive.
The sample preparation tool is characterized in that the sample preparation tool comprises a sample preparation tool body, a sample preparation module and a sample preparation module. In addition, set up the PTFE gasket in the first constant head tank of upper portion substrate, through the PTFE gasket of placing different thickness, can satisfy the system appearance of different thickness glue films. In order to guarantee the precision of sample preparation, the tool size is preferably selected for the sample preparation that the adhesive layer thickness of the adhesive joint is about 1-10 mm. Because of adopting the step structure, only 3 excessive glue surfaces need to be cleaned after glue application, and the sample preparation efficiency is improved. The gluing part of the tool is made of Polytetrafluoroethylene (PTFE) and is made into a modularized structure, so that the assembly and disassembly of a joint are easy, and the continuous sample preparation can be realized only by replacing a corresponding module under the condition of large sample preparation amount; meanwhile, only 3 surfaces of the overflow glue need to be cleaned after glue application is finished.
Furthermore, press tightly in order to realize overflowing glue, still include the clamp plate, be equipped with the layering that size and first constant head tank match on the clamp plate lower surface for press on the upper portion substrate, beat gluey back in gluey district, cover upper portion substrate, compress tightly upper portion substrate through the layering and appear overflowing glue, make glue compact, clear up unnecessary glue. Preferably, the press plate is a carbon steel press plate.
Further, still include spacing crossbeam, spacing crossbeam supports and keeps away from the one end in gluey district at lower substrate.
Furthermore, in order to adapt to the sizes of the base materials with different lengths, a cross beam fixing area is arranged on the outer side of the lower base material positioning area on the base, and the limiting cross beam is adjustably fixed in the cross beam fixing area through an adjustable mechanism.
Specifically, the adjustable mechanism comprises at least two strip-shaped limiting holes arranged on the limiting cross beam and threaded holes which are arranged in the cross beam fixing area and correspond to the strip-shaped limiting holes in position, and the extending direction of the strip-shaped limiting holes is the same as that of the first positioning grooves.
When the lower base material is placed in the second positioning groove, the limiting cross beam is installed on one side of the base, the tightness of the lower base material is adjusted through the strip-shaped limiting holes, and then glue is applied to the glue applying area of the lower base material.
Preferably, the base is integrally formed by aluminum alloy. The aluminum alloy machining and integrated forming process is adopted, the machining precision is high, and the geometric dimension of the adhesive layer can be effectively guaranteed.
Furthermore, in order to realize the fixation between the PTFE bonding module and the base, the fixing device also comprises a bonding module fixing mechanism, wherein the bonding module fixing mechanism comprises a threaded hole arranged in a bonding module mounting area and a countersunk through hole arranged on the lower step part of the PTFE bonding module, and a screw is placed into the bottom of the countersunk through hole and is in threaded connection with the threaded hole, so that the PTFE bonding module is fixed on the base.
The invention has the beneficial effects that: the adhesive part sample preparation tool capable of controlling the thickness of the adhesive has the advantages of simple and compact structure, convenience in operation and high adhesive layer size control precision, can realize continuous multi-batch sample preparation, and is particularly suitable for the condition of large sample preparation quantity, so that the sample preparation period is shortened, and the sample preparation cost of a single sample part is greatly reduced.
Drawings
The invention is further illustrated by the following figures and examples.
Fig. 1 is a schematic perspective view of the sample preparation tool of the present invention.
Fig. 2 is a schematic top view of the sample preparation tool of the present invention.
Fig. 3 is a schematic sectional view of a-a in fig. 2.
Fig. 4 is a partial structural schematic diagram of the sample preparation tool.
Fig. 5 is a schematic structural view of the base.
FIG. 6 is a schematic diagram of the construction of a PTFE adhesive module.
Fig. 7 is a schematic view of the structure of the platen.
In the figure: 1. the base, 11, upper portion substrate locating area, 12, bonding module installing zone, 13, lower part substrate locating area, 14, crossbeam fixed area, 15, screw hole, 2, PTFE bonding module, 21, go up the step portion, 22, lower step portion, 23, countersunk head through-hole, 3, first constant head tank, 4, second constant head tank, 5, PTFE gasket, 6, clamp plate, 61, layering, 7, spacing crossbeam, 71, the spacing hole of bar, 8, upper portion substrate, 9, lower part substrate, 10, the district of gluing.
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and only illustrates the basic structure of the present invention in a schematic manner, and therefore it only shows the constitution related to the present invention.
As shown in fig. 1 to 4, the adhesive piece sample preparation tool capable of controlling the thickness of an adhesive agent according to the present invention includes a base 1, a PTFE adhesive module 2, a PTFE gasket 5, a pressure plate 6, and a limiting beam 7, for convenience of showing the structure of the tool, only one set of upper substrate 8 and lower substrate 9 is shown in fig. 1 and 2, fig. 3 is a cross-sectional view showing the positions of the substrates, fig. 4 is a schematic structural view showing a first positioning groove 3 and a second positioning groove 4, and the PTFE gasket 5, the pressure plate 6, and the substrates are hidden in the drawing.
As shown in fig. 5 and 6, the base 1 is integrally formed by aluminum alloy, an upper substrate positioning area 11, a bonding module mounting area 12, a lower substrate positioning area 13 and a beam fixing area 14 are sequentially arranged on the base 1 along the width direction, the bonding module mounting area 12 and the beam fixing area 14 are respectively provided with a threaded hole 15, in this embodiment, the number of the threaded holes 15 of the bonding module mounting area 12 is 4, the PTFE bonding module 2 is embedded into the bonding module mounting area 12 on the aluminum alloy base 1, the PTFE bonding module 2 is fixed with the threaded hole 15 on the base 1 through 4 bolts via a countersunk through hole 23 on the PTFE bonding module 2, and the 4 threaded holes 15 and the countersunk through hole 23 jointly form a bonding module fixing mechanism; the number of the threaded holes 15 of the beam fixing area 14 is 2, two strip-shaped limiting holes 71 are formed in the limiting beam 7, the positions of the strip-shaped limiting holes 71 are matched with the threaded holes 15 of the beam fixing area 14, the strip-shaped limiting holes 71 and the threaded holes 15 jointly form an adjustable mechanism, and the limiting beam 7 controls the tightness of the limiting beam 7 through stainless steel bolts arranged in the strip-shaped limiting holes 71, so that the lower substrate 9 is positioned. The PTFE bonding module 2 is of a step structure and comprises an upper step portion 21 and a lower step portion 22 which are sequentially connected, the upper substrate positioning region 11 of the base 1 is provided with at least one first positioning groove 3, preferably, the number of the first positioning grooves 3 is 7 in the embodiment, the first positioning grooves 3 extend from the substrate positioning region to the joint of the upper step portion 21 and the lower step portion 22 through the upper step portion 21, the lower substrate positioning region 13 is provided with 7 second positioning grooves 4, the positions of the second positioning grooves are matched with those of the first positioning grooves 3, and the second positioning grooves 4 extend from the lower substrate positioning region 13 to the joint of the upper step portion 21 and the lower step portion 22 through the lower step portion 22; the first positioning groove 3 and the second positioning groove 4 are in contact with each other to form a certain height difference, so that the lower substrate 9 is limited. The PTFE gasket 5 is placed in the first positioning groove 3 and used for controlling the thickness of the adhesive; an upper base material 8 is placed above the PTFE gasket 5 of the first positioning groove 3, a lower base material 9 is placed in the second positioning groove 4, a glue applying area 10 is formed by the part of the upper base material 8 which extends outwards and is overlapped with the lower base material 9, and the distance between the lower surface of the upper base material 8 and the upper surface of the lower base material 9 is the thickness of the adhesive.
As shown in fig. 7, the lower surface of the pressing plate 6 is provided with 7 pressing strips 61 for pressing on the upper substrate 8, the width of the pressing strips 61 is required to smoothly press the substrate, preferably, the width of the pressing strips 61 is at least slightly smaller than the width of the first positioning groove 3, after the glue is applied in the glue applying region 10, the upper substrate 8 is covered, the upper substrate 8 is pressed by the pressing strips 61, glue overflow occurs, so that the glue is compacted, and redundant glue is cleaned. Preferably, the platen 6 is a carbon steel platen.
The working principle is as follows:
thick glue film bonding joint's system appearance to glue film thickness and overlap joint size requirement strict, for can be convenient system appearance, adopt the standard substrate of putting into system appearance usefulness in the machining constant head tank, for example standard base plate size: 100mm 25mm 2mm, the thickness of glue film is controlled the distance between upper portion substrate 8 and the lower part substrate 9 through the PTFE gasket 5 of different thickness and is realized the control of thickness, the location of lower part substrate 9 is controlled by the spacing crossbeam 7 of one side, then beat to glue on the lower part substrate 9 of bottom one side, require the glue film plump, then cover in glueing district 10 with another upper portion substrate 8, it overflows to guarantee to have unnecessary glue, fix upper portion substrate 8 with carbon steel clamp plate 6, then clear away the excessive gluey part of 3 faces, utilize detachable PTFE bonding module 2 to realize the preparation of many samples simultaneously.
The sample preparation tool is mainly characterized in that the lap joint size can be accurately controlled, the bonding modules can be detached, the time of 7-10 days is generally needed for the complete bonding curing period of the thick adhesive layer, particularly, only a plurality of sets of bonding modules are prepared during preparation of a plurality of samples, the elastic adhesive samples can be subjected to surface drying molding after being cured for 2 days, the prepared samples are integrally detached from the base 1 together with the bonding modules, and the new bonding modules are installed on the base 1 for preparing samples of the next batch, so that the sample preparation period and the material cost can be greatly reduced.
In light of the foregoing description of preferred embodiments in accordance with the invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. The utility model provides an adhesive part system appearance frock of controllable adhesive thickness which characterized in that: the PTFE bonding module is of a step structure and is detachably embedded in the bonding module mounting area and comprises an upper step part and a lower step part which are connected in sequence, the upper substrate positioning area is provided with at least one first positioning groove, the first positioning groove extends to the joint of the upper step part and the lower step part from the substrate positioning area through the upper step part, the lower substrate positioning area is provided with second positioning grooves matched with the first positioning grooves in position and quantity, and the second positioning grooves extend to the joint of the upper step part and the lower step part from the lower substrate positioning area through the lower step part; the PTFE gasket is placed in the first positioning groove and used for controlling the thickness of the adhesive; an upper base material is placed above the PTFE gasket of the first positioning groove, a lower base material is placed in the second positioning groove, the upper base material extends outwards to form a glue applying area with the overlapped part of the lower base material, and the distance between the lower surface of the upper base material and the upper surface of the lower base material is the thickness of the adhesive.
2. The gluing part sample preparation tool capable of controlling the thickness of the adhesive according to claim 1, wherein: the lower surface of the pressing plate is provided with a pressing strip matched with the first positioning groove in size, and the pressing strip is used for pressing the upper substrate to enable the glue to be compact.
3. The gluing part sample preparation tool capable of controlling the thickness of the adhesive according to claim 1, wherein: the glue applying device further comprises a limiting cross beam, and the limiting cross beam abuts against one end, far away from the glue applying area, of the lower base material.
4. The gluing part sample preparation tool capable of controlling the thickness of the gluing agent according to claim 3, wherein: and a cross beam fixing area is arranged outside the lower substrate positioning area on the base, and the limiting cross beam is adjustably fixed in the cross beam fixing area through an adjustable mechanism.
5. The gluing part sample preparation tool capable of controlling the thickness of the gluing agent according to claim 4, wherein: the adjustable mechanism comprises at least two bar-shaped limiting holes arranged on the limiting cross beam and threaded holes which are arranged in the cross beam fixing area and correspond to the bar-shaped limiting holes, and the extending direction of the bar-shaped limiting holes is the same as that of the first positioning grooves.
6. The gluing part sample preparation tool capable of controlling the thickness of the adhesive according to claim 1, wherein: the base is an aluminum alloy base.
7. The gluing part sample preparation tool capable of controlling the thickness of the adhesive according to claim 1, characterized in that: the PTFE bonding module is characterized by further comprising a bonding module fixing mechanism, wherein the bonding module fixing mechanism comprises a threaded hole formed in a bonding module mounting area and a countersunk through hole formed in the lower step part of the PTFE bonding module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110311722.9A CN115122249A (en) | 2021-03-24 | 2021-03-24 | Adhesive part sample preparation tool capable of controlling thickness of adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110311722.9A CN115122249A (en) | 2021-03-24 | 2021-03-24 | Adhesive part sample preparation tool capable of controlling thickness of adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115122249A true CN115122249A (en) | 2022-09-30 |
Family
ID=83374185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110311722.9A Pending CN115122249A (en) | 2021-03-24 | 2021-03-24 | Adhesive part sample preparation tool capable of controlling thickness of adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115122249A (en) |
-
2021
- 2021-03-24 CN CN202110311722.9A patent/CN115122249A/en active Pending
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