CN214749299U

CN214749299U - Tensile shearing sample preparation device for controlling single-lap structural adhesive bonding thickness

Info

Publication number: CN214749299U
Application number: CN202120224860.9U
Authority: CN
Inventors: 马寅虎; 赵伟; 刘宗杰; 肖焱; 张颖
Original assignee: Weixian Zhongke Yuneng Technology Co ltd
Current assignee: Weixian Zhongke Yuneng Technology Co ltd
Priority date: 2021-01-26
Filing date: 2021-01-26
Publication date: 2021-11-16
Anticipated expiration: 2031-01-26

Abstract

The utility model provides a control list is taken structure and is glued tensile shearing system appearance device of bonding thickness, first mould, a plurality of perpendicular connecting holes have all been seted up to corresponding on the circumference edge of second mould, first mould and second mould utilize perpendicular connecting hole and perpendicular connecting piece interconnect, the bed die has a plurality of glue film thickness control recesses on the circumference edge of perpendicular to face direction, place glue film thickness control gasket and be used for controlling the bonding thickness that bonds between bonding substrate and the bonding gasket at this glue film thickness control recess, it is unanimous with the required thickness of test to make this structure glue bonding thickness. The edge of the second die is provided with symmetrical distance control grooves in the direction vertical to the plate surface, and distance control strips are placed in the distance control grooves and used for controlling the distance between the bonding base material and the bonding gaskets. The first die and the second die are also connected with each other through corresponding horizontal connecting plates. The utility model has the advantages of control thickness is accurate, easy operation, cost are lower, be convenient for clear up test area etc.

Description

Tensile shearing sample preparation device for controlling single-lap structural adhesive bonding thickness

Technical Field

The utility model relates to a structural adhesive technical field specifically is a control list is taken structure and is glued tensile shearing system appearance device of bonding thickness, has that control thickness is accurate, easy operation, cost are lower, be convenient for clear up the test region advantage such as unnecessary structural adhesive.

Background

When the tensile shear performance of the structural adhesive is tested by adopting a single lap method, the bonding thickness of the structural adhesive directly influences the accuracy of detection data and the evaluation of a detection result. At present, the tensile shear property of structural adhesive is generally tested by a single lap method in the field of structural adhesive adhesives. The single lap method has two types of standards: one is national standard (GB/T7124), the method is generally suitable for sample blocks with small bonding thickness bonded by adhesives, and the bonding thickness and bonding area are generally controlled by adopting a manual operation method; the other is international standard and/or American standard (ISO 11003 and/or ASTM D3165), the method is generally suitable for sample blocks with larger adhesive bonding thickness, the bonding thickness is generally controlled by a manual method, and the bonding area is ensured by cutting the front side and the back side. The main defects of the structural adhesive stretching and shearing sample block manufactured by the traditional method are as follows: the method has the advantages that manual operation is high in requirement, and size precision is difficult to control; the method in national standards is adopted, the bonding thickness is controlled by small gaskets, and the bonding can only be placed in partial areas, so that the thickness of the areas without the gaskets is difficult to control; thirdly, grooves are cut on the front surface and the back surface of the sample by an engraving machine and/or a machine tool by adopting a method in international standards and/or American standards, the distance between the grooves on the front surface and the grooves on the back surface is difficult to control to meet the standard requirement, the accuracy of a test result is influenced by different grooving depths, and the cost for purchasing corresponding equipment is high.

SUMMERY OF THE UTILITY MODEL

For overcoming the defect and not enough among the above-mentioned prior art, the utility model aims at providing a control list is taken the tensile shearing system appearance device that structure glued thickness, has control thickness accuracy, easy operation, cost lower, be convenient for clear up the test region advantage such as unnecessary structure is glued.

In order to achieve the above object, the utility model adopts the following technical scheme:

a stretching shearing sample preparation device for controlling the bonding thickness of single-lap structural adhesive comprises two die sets, wherein the two die sets are connected in the horizontal direction through a plurality of horizontal connecting plates, each die set comprises a first die and a second die, and the device is characterized in that,

the lower surface of the first die is a working surface which is integrally planar;

the upper surface of the second mold is a working surface, a mold cavity extending along the length direction of the mold is arranged on the working surface, the bottom surface of the mold cavity is a plane, the width direction of the mold cavity is not provided with a side wall, and a bonding substrate, a testing structure adhesive layer and a bonding gasket are sequentially laid in the mold cavity from bottom to top;

a plurality of glue layer thickness control grooves which are in one-to-one correspondence are formed in the two ends of the die cavity, the distance between the bottom surfaces of the glue layer thickness control grooves and the bottom surface of the die cavity is equal to the thickness of the bonding base material, glue layer thickness control gaskets which extend along the length direction of the die are placed between the glue layer thickness control grooves in the two ends of the die cavity, and the thickness of the glue layer thickness control gaskets is consistent with that of the glue layer of the testing structure;

two ends of the die cavity are respectively provided with a distance control groove, the two distance control grooves are positioned on one side of the width direction of the die cavity, a distance control strip extending along the length direction of the die is placed between the two distance control grooves, the thickness of the distance control strip is equal to the sum of the thicknesses of the bonding gasket and the testing structure adhesive layer, and after assembly is completed, the top surface of the distance control strip is flush with the upper surface of the second die;

the bonding substrate, the test structure adhesive layer and the bonding gasket are limited in the die cavity in the length direction, the width of the bonding substrate is larger than that of the die cavity, after the bonding substrate is placed in the die cavity, one end of the bonding substrate in the width direction is aligned with one end, which is not provided with the distance control groove, in the width direction of the second die, the other end of the bonding substrate in the width direction extends out of the die cavity, and the width of the part, which exceeds the die cavity in the width direction, of the bonding substrate is the sum of the lap joint width of the target sample and the width of the distance control strip; the bonding gasket is also limited in the die cavity in the width direction, one end of the bonding gasket in the width direction is aligned with one end, which is not provided with the distance control groove, in the width direction of the second die, and the other end of the bonding gasket is abutted to the distance control strip;

the first die and the second die in the same die group are connected in the vertical direction by utilizing the vertical connecting holes and corresponding vertical connecting pieces;

the end faces of two ends of the first die and the second die in the length direction are respectively provided with a horizontal connecting hole, when the two die sets are connected in the horizontal direction, the first die and the second die in one die set and the corresponding second die and first die in the other die set utilize the horizontal connecting holes and the corresponding horizontal connecting pieces and realize the connection in the horizontal direction by means of the horizontal connecting plates.

Preferably, the stretching and shearing sample preparation device for controlling the adhesive bonding thickness of the single lap structure adhesive is used for:

in each die set, firstly, paving a bonding substrate in a die cavity of the second die, then sequentially placing each glue layer thickness control gasket in the glue layer thickness control grooves at two ends of the second die, then placing a distance control strip in the distance control grooves at two ends of the second die, then coating a structural glue to be tested on the surface, which is not covered by the glue layer thickness control gaskets and the distance control strips, of the bonding substrate and is positioned on the inner side of the distance control strips to prepare a test structural glue layer, then paving bonding gaskets above the test structural glue layer, finally paving the first die above the bonding gaskets, and realizing the connection of the first die and the second die in the vertical direction by using the vertical connecting holes and corresponding vertical connecting pieces;

after the preparation of each die set is respectively completed, the two die sets are horizontally connected, when the horizontal connection is performed, a second die in a first die set is arranged close to a working table surface, a first die of the second die set is arranged close to the working table surface, then a structural adhesive is coated on the surface of the bonding base material positioned outside the distance control strip in the second die to prepare a testing structural adhesive layer, then one side end surface of the second die in the first die set, which is provided with the distance control groove in the width direction, is arranged close to one side end surface of the first die of the second die set, which is not provided with the distance control groove in the width direction, and the bonding base material positioned outside the distance control strip in the second die set is adhered on the testing structural adhesive layer positioned outside the distance control strip in the second die of the first die set, finally, the first die and the second die in the first die set and the corresponding second die and first die in the second die set are connected in the horizontal direction by utilizing the horizontal connecting holes and the corresponding horizontal connecting pieces and the horizontal connecting plates;

and finally, after the structural adhesive layer stably forms a test structural adhesive layer, cleaning the redundant structural adhesive of the sample block, removing all connecting pieces between the dies, removing all the connecting pieces, forming a single-lap groove by the distance control strip, and finally preparing a single-lap structural tensile shear detection sample block.

In the preferred embodiment of the present invention, the bonding substrate and the adhesive layer thickness control pad are made of fiber reinforced plastic or resin cast body.

In a preferred embodiment of the present invention, the distance control bar is a metal bar.

In the preferred embodiment of the present invention, the horizontal connecting plate is provided with a strip hole, and the two die sets pass through when the horizontal connecting plate performs connection in the horizontal direction, each of the horizontal connecting members is in a position in the strip hole is adjustable.

The utility model discloses in the preferred example, after placing the bonding substrate in the die cavity of second mould, scribble the structure glue adhesive on its surface in order to prepare when test structure glues the glue film, the thickness that the structure glue adhesive was paintd is a little higher than glue film thickness control gasket is later put into the bonding gasket, then passes through vertical connection hole and the vertical connecting piece that corresponds are connected first mould and second mould.

The utility model discloses in the preferred example, all be equipped with the alignment connecting hole on the not side end face that sets up distance control recess in the width direction of first mould and second mould, first mould and second mould in same die set use when connecting alignment connecting hole and the alignment connecting piece that a cooperation was used on the side in first mould and the second mould guarantee the bonding substrate aligns with the bonding pad piece.

In the utility model, the distance control strips for controlling the horizontal distance between the bonding base material and the bonding gasket are all stainless steel, and each distance control strip is arranged in the groove of the second mould in the direction vertical to the plate surface; one side of the distance control strip, which is close to the groove of the second die, in the width direction is consistent with the edge of the groove, one side of the distance control strip, which is far away from the groove of the second die, is more than the groove, and the specific size of the distance control strip is manufactured according to actual needs; the distance control strip is higher than the groove in the thickness direction, and the metal strip is manufactured according to actual requirements in specific size.

Compared with the prior art, the utility model discloses a control list is taken tensile shearing system appearance device that structure glued thickness, and its technical advantage lies in: the distance between the bonding base material and the bonding gasket is controlled by the plurality of adhesive layer thickness control gaskets, so that the consistency of the thicknesses of different areas of the prepared sample is ensured; the distance between the single lapping grooves on the front surface and the back surface of the sample block is easy to be consistent with the required size, and the complicated cutting procedure is avoided; no redundant structural adhesive is arranged in the single-lap groove on the front side and the back side of the sample block, so that the front bonding side and the back bonding side are randomly damaged during testing, and the method is more practical; the repeated positioning and alignment of personnel are not needed, so that the operation is simpler.

Drawings

Fig. 1 is the utility model discloses a control is singly taken tensile shearing system appearance device schematic structure of structure glue bonding thickness.

Description of reference numerals:

in fig. 1: 1. a first mold; 2. connecting holes vertically; 3. a horizontal connecting hole; 4. a second mold; 5. the thickness of the adhesive layer is controlled by the groove; 6. connecting holes vertically; 7. a horizontal connecting hole; 8. a distance control bar; 9. a distance control groove; 10. a horizontal connecting plate; 11. a horizontal connecting hole; 12. the side faces are aligned with the connecting holes; 13. the side faces are aligned with the connecting pieces.

Fig. 2 is a schematic diagram of a sample block prepared according to the apparatus of the present invention.

In fig. 2: 21. bonding a base material; 22. bonding a gasket; 24. a glue layer thickness control gasket; 23. testing the structural adhesive layer; 25. and a single lap groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and examples.

As shown in fig. 1 and 2, the stretching, shearing and sample preparation device for controlling the adhesive bonding thickness of the single lap structure of the present invention comprises two mold groups, wherein the two mold groups are connected in the horizontal direction through a plurality of horizontal connecting plates 10, each mold group comprises a first mold 1 and a second mold 4, the whole of the first mold 1 and the whole of the second mold 4 are both in a long strip-shaped plate structure, wherein the lower surface of the first mold 1 is a working surface, and the whole working surface is a plane; the upper surface of the second mold 4 is a working surface, a mold cavity extending along the length direction of the mold is arranged on the working surface, the bottom surface of the mold cavity is a plane, the width direction of the mold cavity is not provided with a side wall, and a bonding substrate 21, a test structure adhesive layer 23 and a bonding gasket 22 are sequentially laid in the mold cavity from bottom to top; a plurality of glue layer thickness control grooves 5 which correspond to one another one by one are formed in the two ends of the die cavity, the distance between the bottom surfaces of the glue layer thickness control grooves 5 and the bottom surface of the die cavity is equal to the thickness of the bonding base material 21, glue layer thickness control gaskets 24 which extend in the length direction of the die are placed between the glue layer thickness control grooves 5 in the two ends of the die cavity, and the thickness of the glue layer thickness control gaskets 24 is equal to that of the test structure glue layer 23; two ends of the die cavity are respectively provided with a distance control groove 9, the two distance control grooves 9 are both positioned on one side of the width direction of the die cavity, a distance control strip 8 extending along the length direction of the die is arranged between the two distance control grooves 9, the thickness of the distance control strip 8 is equal to the sum of the thicknesses of the bonding gasket 22 and the testing structure adhesive layer 23, and after the assembly is completed, the top surface of the distance control strip 8 is flush with the upper surface of the second die 4; the bonding substrate 21, the test structure adhesive layer 23 and the bonding gasket 22 are limited in the die cavity in the length direction, the width of the bonding substrate 21 is larger than that of the die cavity, after the bonding substrate 21 is placed in the die cavity, one end of the bonding substrate in the width direction is aligned with one end, which is not provided with the distance control groove 9, in the width direction of the second die 4, the other end of the bonding substrate in the width direction extends out of the die cavity, and the width of the part, exceeding the die cavity in the width direction, of the bonding substrate 21 is the sum of the lap joint width of the target sample and the width of the distance control strip 8; the bonding pad 22 is also limited in the die cavity in the width direction, one end of the bonding pad 22 in the width direction is aligned with one end of the second die 4 in the width direction, which is not provided with the distance control groove 9, and the other end is abutted with the distance control strip 8; the two ends of the first die 1 and the second die 4 in the length direction are also correspondingly provided with a plurality of vertical connecting

holes

2 and 6 in the direction vertical to the plate surface, and the first die 1 and the second die 4 in the same die group realize the connection in the vertical direction by utilizing the vertical connecting

holes

2 and 6 and corresponding vertical connecting pieces; all be equipped with

horizontal connection hole

3, 7, 11 on the length direction's of first mould 1, second mould 4 both ends terminal surface, be equipped with rectangular hole on the horizontally connect board 10, two when the mould group is carrying out the ascending connection of horizontal direction, first mould 1 in the mould group, second mould 4 and the second mould 4, the first mould 1 utilization that correspond in another mould group

horizontal connection hole

3, 7, 11 and the horizontal connecting piece that corresponds with the help of horizontally connect board 10 realizes the ascending connection of horizontal direction.

The utility model discloses a control list is taken tensile shearing system appearance device of structure glue bonding thickness when using:

in each mould set, firstly, a bonding base material 21 is laid in the mould cavity of the second mould 4, then, glue layer thickness control gaskets 24 are sequentially placed in the glue layer thickness control grooves 5 at the two ends of the second mould 4, then, distance control strips 8 are placed in distance control grooves 9 at two ends of the second mold 4, then structural adhesive to be tested is coated on the surface, which is not covered by the adhesive layer thickness control gasket 24 and the distance control strips 8, of the bonding substrate 21 and is positioned on the inner side of the distance control strips 8 to prepare a testing structural adhesive layer 23, then a bonding gasket 22 is laid above the testing structural adhesive layer 23, and finally the first mold 1 is laid above the bonding gasket 22, the first die 1 and the second die 4 are connected in the vertical direction by utilizing the vertical connecting

holes

2 and 6 and corresponding vertical connecting pieces;

after the preparation of each mold group is respectively completed, the two mold groups are horizontally connected, when the horizontal connection is performed, the second mold 4 in the first mold group is arranged close to a working table, the first mold 1 of the second mold group is arranged close to the working table, then the surface of the bonding base material 21, which is positioned outside the distance control strip 8, in the second mold 4 is coated with a structural adhesive to prepare a test structural adhesive layer 23, then one side end surface, provided with the distance control groove 9 in the width direction, of the second mold 4 in the first mold group is arranged close to one side end surface, not provided with the distance control groove 9 in the width direction, of the first mold 1 of the second mold group, and the bonding base material 21, positioned outside the distance control strip 8, in the second mold 4 in the second mold group is adhered to the test structural adhesive, which is positioned outside the distance control strip 8, in the second mold 4 of the first mold group On the glue layer 23, finally, the first mold 1 and the second mold 4 in the first mold group and the corresponding second mold 4 and first mold 1 in the second mold group are connected in the horizontal direction by using the horizontal connecting

holes

3, 7 and 11 and the corresponding horizontal connecting pieces and by using the horizontal connecting plate 10;

and finally, after the structural adhesive layer is stably formed into a test structural adhesive layer 23, cleaning the redundant structural adhesive of the sample block, removing all connecting pieces between the dies, removing all the distance control strips 8 to form a single-lap groove 25, and finally preparing the single-lap structure stretching and shearing detection sample block shown in fig. 2.

In the preferred embodiment of the present invention, the depth of the glue layer thickness control groove 5 is smaller than the depth of the cavity of the second mold 4, and the depth is about 2 mm.

In the preferred embodiment of the present invention, the bonding substrate 21 and the glue layer thickness control pad 24 are made of fiber reinforced plastic or resin casting.

In a preferred embodiment of the present invention, the distance control strip 8 is a metal strip.

In the preferred embodiment of the present invention, the horizontal connecting plate 10 is provided with a strip hole, and when the die set passes through the horizontal connecting plate 10 to perform connection in the horizontal direction, each of the horizontal connecting members is in the strip hole, the position of the horizontal connecting member is adjustable.

The utility model discloses in the preferred example, after placing bonding substrate 21 in the die cavity of second mould 4, scribble the structure on its surface and glue the adhesive in order to prepare when testing structure glues glue film 23, the thickness that structure glue adhesive 23 was paintd is slightly higher than glue film thickness control gasket 24, later put into bond gasket 22, then pass through

vertical connection hole

2, 6 and the vertical connecting piece that corresponds connect first mould 1 and second mould 4.

In the preferred embodiment of the present invention, the first mold 1 and the second mold 4 are provided with the alignment connection hole 12 on a side surface which is not provided with the distance control groove 9 in the width direction, and the first mold 1 and the second mold 4 in the same mold set are used when being connected to each other, the alignment connection hole 12 on the side surface and the alignment connection member 13 used in cooperation are used in the first mold 1 and the second mold 4, and the bonding substrate 21 is aligned with the bonding pad 22.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A stretching shearing sample preparation device for controlling the bonding thickness of single-lap structural adhesive comprises two die sets, wherein the two die sets are connected in the horizontal direction through a plurality of horizontal connecting plates, each die set comprises a first die and a second die, and the device is characterized in that,

2. The device for preparing the tensile shear sample for controlling the bonding thickness of the single lap structural adhesive according to claim 1, wherein the bonding substrate and the adhesive layer thickness control gasket are made of fiber reinforced plastics or resin casting bodies.

3. The stretch-shear sample preparation device for controlling the bonding thickness of the single lap structural adhesive according to claim 1, wherein the distance control strip is a metal strip.

4. The stretch-shear sample preparation device for controlling the bonding thickness of a single-lap structural adhesive according to claim 1, wherein a long hole is formed in the horizontal connecting plate, and when the two die sets are connected in the horizontal direction through the horizontal connecting plate, the position of each horizontal connecting piece in the long hole is adjustable.

5. The stretching and shearing sample preparation device for controlling the bonding thickness of the single lap structural adhesive according to claim 1, wherein after the bonding base material is placed in the cavity of the second mold, when the structural adhesive is coated on the surface of the bonding base material to prepare the test structural adhesive layer, the thickness coated by the structural adhesive is slightly higher than that of the adhesive layer thickness control gasket, then the bonding gasket is placed, and then the first mold and the second mold are connected through the vertical connecting holes and the corresponding vertical connecting pieces.

6. The stretch-shearing sample preparation device for controlling the bonding thickness of the single-lap structural adhesive according to claim 1, wherein alignment connection holes are formed in both the end faces of the first die and the second die, which are not provided with the distance control grooves in the width direction, and when the first die and the second die in the same die set are connected, the alignment connection holes in the side faces of the first die and the second die and an alignment connection piece used in cooperation are used to ensure that the bonding substrate is aligned with the bonding pad.