CN115110080A - Environment-friendly hanger tin-stripping copper stripping liquid and preparation method and application thereof - Google Patents
Environment-friendly hanger tin-stripping copper stripping liquid and preparation method and application thereof Download PDFInfo
- Publication number
- CN115110080A CN115110080A CN202210727122.5A CN202210727122A CN115110080A CN 115110080 A CN115110080 A CN 115110080A CN 202210727122 A CN202210727122 A CN 202210727122A CN 115110080 A CN115110080 A CN 115110080A
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- Prior art keywords
- tin
- stripping
- copper
- hanger
- hydrogen peroxide
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 183
- 239000010949 copper Substances 0.000 title claims abstract description 183
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 180
- 239000007788 liquid Substances 0.000 title claims abstract description 73
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 132
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 115
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 86
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 49
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000003756 stirring Methods 0.000 claims abstract description 19
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 claims abstract description 9
- 235000003891 ferrous sulphate Nutrition 0.000 claims abstract description 9
- 239000011790 ferrous sulphate Substances 0.000 claims abstract description 9
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims abstract description 9
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims abstract description 9
- 229940044654 phenolsulfonic acid Drugs 0.000 claims abstract description 9
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims abstract description 6
- 229960001781 ferrous sulfate Drugs 0.000 claims abstract description 3
- 229960004063 propylene glycol Drugs 0.000 claims abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 28
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 abstract description 25
- 238000005406 washing Methods 0.000 abstract description 21
- 239000010865 sewage Substances 0.000 abstract description 17
- 239000002351 wastewater Substances 0.000 abstract description 17
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 14
- 239000002699 waste material Substances 0.000 abstract description 13
- 230000007613 environmental effect Effects 0.000 abstract description 10
- 238000005530 etching Methods 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 4
- 229910017464 nitrogen compound Inorganic materials 0.000 abstract description 3
- 150000002830 nitrogen compounds Chemical class 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 description 118
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 64
- 238000007747 plating Methods 0.000 description 56
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 18
- 229910017604 nitric acid Inorganic materials 0.000 description 18
- 239000005028 tinplate Substances 0.000 description 16
- 238000009713 electroplating Methods 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 4
- 238000011001 backwashing Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 4
- 238000012946 outsourcing Methods 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910001385 heavy metal Inorganic materials 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000002341 toxic gas Substances 0.000 description 3
- 238000004065 wastewater treatment Methods 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical group Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- BYMHXIQVEAYSJD-UHFFFAOYSA-M sodium;4-sulfophenolate Chemical compound [Na+].OC1=CC=C(S([O-])(=O)=O)C=C1 BYMHXIQVEAYSJD-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses an environment-friendly hanger tin-stripping copper stripping liquid, a preparation method and application thereof, wherein the preparation method comprises the following steps: under the condition of continuous stirring, adding phenolsulfonic acid, propylene glycol, polyethylene glycol 400 and ferrous sulfate into water, and finally adding water to a constant volume to obtain the environment-friendly hanger tin and copper stripping solution. The invention is suitable for the tin and copper stripping process of the hanger of a sulfuric acid/hydrogen peroxide system, can simultaneously strip tin and copper, has high stripping speed, can meet the process requirements, and can effectively prevent hydrogen peroxide from decomposing; the stripping liquid does not contain nitrogen compounds, the waste liquid treatment is simple, and the waste liquid can be merged into micro-etching waste water or high-acid waste water for treatment; the washing tank water and the post-washing water also do not contain nitrogen, so that the environmental protection pressure that the total nitrogen and ammonia nitrogen discharge standards related to the national environmental protection policy of the printed circuit board factory sewage treatment station are continuously tightened can be effectively relieved.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to an environment-friendly hanger tin-stripping copper stripping liquid and a preparation method and application thereof.
Background
In the processing process of the printed circuit board, after the copper-clad plate is subjected to the working procedures of drilling and chemical copper deposition (the thickness of a copper layer is 0.3-0.5 mu m), the copper layer thickness can meet the process requirement generally by whole-plate copper plating (primary copper plating, the thickness of the copper layer is 5-8 mu m) and pattern electroplating (secondary copper plating, the thickness of the copper layer is 10-15 mu m), and after copper electroplating, tin electroplating (the thickness of a tin layer is 5-8 mu m) is also required, and the typical process is as follows:
substrate → drilling → electroless copper plating → full-plate electroplating (copper plating) → image transfer → pattern electroplating (copper plating + tin plating) → film removal → etching → …
In the whole-plate electroplating and pattern electroplating processes, after copper plating or copper plating and tin plating operation is completed, a layer of metal can be plated on the hanger supporting the plated part, the hanger is repeatedly used, and therefore the metal coating on the hanger needs to be thoroughly removed, and the problem that the quality of products is caused due to the fact that metal powder is generated by point discharge of the metal coating on the hanger falls into a plating tank is avoided. Printed circuit board factories commonly adopt high-concentration nitric acid as stripping and hanging liquid. The nitric acid type stripping solution has the advantages of high stripping speed, cleanness, thoroughness, no need of assistance of other conditions and simple operation. However, high-concentration nitric acid has strong oxidizing property and volatility, when copper, tin and other metals are removed, toxic nitric oxide and nitrogen dioxide gas can be generated, the environment is seriously polluted, the human body is greatly damaged, equipment and a factory building are also greatly corroded, meanwhile, the deplating waste liquid contains a large amount of copper, tin and other heavy metals, the recovery of the heavy metals is not facilitated due to the strong oxidizing property of the nitric acid, the recovery process is complex, more raw materials are needed, a printed circuit board factory generally adopts an outsourcing mode, a third party mechanism is entrusted to treat the heavy metals, and the treatment cost per ton is about 3000-5000 yuan; secondly, the total nitrogen and ammonia nitrogen content in the washing tank water and the back washing water is high, and the load of a sewage treatment station is increased.
In order to overcome the above-mentioned disadvantages of the nitric acid type stripping liquid, a sulfuric acid-hydrogen peroxide stripping system has been widely studied. An electroplating hanger deplating liquid and a deplating liquid method thereof disclose that monoethanolamine is added into a sulfuric acid-hydrogen peroxide stripping system as a complexing agent, n-octylamine is used as an accelerator, the copper stripping speed is only 4-8 microns/min, and the copper stripping speed is low. The patent application is silent about the effect of tin stripping and about the measures for treating the waste liquid and about the treatment of total nitrogen and ammonia nitrogen in the wash tank and the post-wash water. An environment protection stripping agent for removing Sn and Cu from fixture features that a dual-liquid method is used to remove Sn and Cu from fixture, and the first stripping agent and the second stripping agent are sequentially added to test piece for quickly removing Sn and Cu. The method is not suitable for the established factories, the conventional portal frame electrical production line of most circuit board factories is compact in structure, only one deplating tank is arranged, and the other deplating tank is added, so that the difficulty is high, and the cost is high. The tin removing combined liquid and the tin removing method disclose that tin and copper on a clamp are removed by adopting a double-liquid type method, namely liquid A removes tin → washing → liquid B removes copper. The liquid A is a sulfuric acid-hydrogen peroxide system containing organic amine and the like and is specially used for removing tin, and the liquid B is a ferric trichloride system and is specially used for removing copper. The method needs to add a rinsing bath and an deplating bath, and is not suitable for the built factory for the reasons; in addition, the application adopts a ferric trichloride system to remove copper, so that chloride ion pollution is possibly caused; this patent application also uses relatively large amounts of organic amines and other nitrogen-containing compounds, and does not mention waste liquid, wash tank water and post-wash water treatment problems. An environment protection type decoating liquid for tin-copper plating layer and its decoating method are disclosed, which features that organic amine is used as stabilizer of hydrogen peroxide, and the three-step process of immersing in dilute sulfuric acid → washing → decoating is used to decolate tin-copper. The method requires two additional tanks and pumping equipment, and is difficult to apply in an established factory. An environment-friendly hanger stripping agent for a circuit board nitre hanger is disclosed, wherein sodium p-hydroxybenzene sulfonate and diethylene glycol monobutyl ether are added into a sulfuric acid-hydrogen peroxide stripping system to achieve the purpose of deplating. The novel environment-friendly tin stripping solution and the preparation method and the use method thereof disclose that the tin stripping is carried out by adopting a three-step method of dilute sulfuric acid soaking → pure water washing → tin stripping solution stripping, the tin stripping speed is less than 4 microns/minute, and whether copper can be stripped or not is not mentioned. An environment-friendly stripping and hanging solution for stripping copper and tin and a copper and tin stripping method using the same disclose that an organic amine, sulfamic acid, alcohols and other auxiliaries are added into a sulfuric acid-hydrogen peroxide system, so that the tin stripping and copper stripping speed is high, the process requirements are met, and the stripping and hanging solution can replace a nitric acid stripping type stripping and hanging solution. The patent application does not mention the treatment problems of waste liquid, washing tank water and post-washing water, and the stripping and hanging frame additive contains more nitrogenous substances such as organic amine and the like, so that the wastewater treatment pressure of a sewage station of a circuit board plant can be increased.
In conclusion, the sulfuric acid-hydrogen peroxide type stripping solution can meet the process requirements instead of a nitric acid type stripping solution, so that toxic gases such as nitrogen dioxide are prevented from being generated, the workshop environment is improved, and the health of workers is facilitated. However, the additive of the common sulfuric acid-hydrogen peroxide deplating system usually contains a large amount of organic amines, the total nitrogen and ammonia nitrogen content of deplating waste liquid is extremely high, and the waste liquid is generally merged into micro-etching waste water or high-acid waste water, is neutralized, is discharged into a comprehensive waste water tank, is treated and is discharged after reaching the standard. Compared with the nitric acid type deplating waste liquid outsourcing treatment, the common sulfuric acid-hydrogen peroxide type deplating system does not relieve the total nitrogen and ammonia nitrogen treatment pressure of the printed circuit board factory sewage treatment station, but aggravates the total nitrogen and ammonia nitrogen treatment pressure of the printed circuit board factory sewage treatment station. The washing tank water and the post-washing water of the common sulfuric acid-hydrogen peroxide deplating system still belong to high ammonia nitrogen sewage, and still have considerable pressure on a sewage treatment station of a circuit board factory. Total nitrogen and ammonia nitrogen in wastewater of a circuit board factory mainly come from a nitric acid stripping and hanging frame and alkaline etching, and the concentration of the total nitrogen and the ammonia nitrogen is a main monitoring project for sewage discharge in the circuit board industry. At present, a circuit board factory faces great environmental protection pressure, the emission standards of total nitrogen and ammonia nitrogen are continuously tightened, and a sulfuric acid-hydrogen peroxide type deplating solution still needs to be further improved to achieve the practical purpose.
Disclosure of Invention
Aiming at the problems, the invention aims to provide an environment-friendly hanger tin-copper stripping liquid and a preparation method and application thereof, the stripping liquid is suitable for a sulfuric acid-hydrogen peroxide system, the sulfuric acid-hydrogen peroxide system hanger stripping liquid prepared by the environment-friendly hanger tin-copper stripping liquid can achieve the purpose of quickly stripping tin-copper coatings, and meanwhile, the stripping liquid does not contain nitrogen compounds and fluorides, so that the pollution to the environment is effectively reduced, meanwhile, waste liquid can be merged into micro-etching waste water or high-acid waste water and is discharged into a comprehensive waste water tank after being neutralized, the treatment is simple, the outsourcing treatment cost is not needed, additional facilities are not needed, and the cost is low; the water of the washing tank and the back washing water do not contain nitrogen, the sewage treatment pressure of the wastewater treatment station of the circuit board plant is effectively relieved, and the circuit board plant still has enough counter measures under the condition that the environmental standards of the total nitrogen and the ammonia nitrogen of follow-up countries are continuously tightened.
The purpose of the invention is realized by the following technical scheme:
the invention provides a preparation method of an environment-friendly hanger tin-stripping copper stripping liquid, which comprises the following steps:
adding phenolsulfonic acid, propylene glycol, polyethylene glycol 400 and ferrous sulfate into water under the condition of continuous stirring, and finally adding water to a constant volume to obtain the environment-friendly hanger tin and copper stripping solution.
Furthermore, the volume of phenolsulfonic acid added into each liter of environment-friendly hanger tin-stripping copper stripping liquid is 30-90 mL.
Furthermore, the volume of propylene glycol added into each liter of the environment-friendly hanger tin-stripping copper stripping liquid is 20-80 mL.
Further, the volume of polyethylene glycol 400 added into each liter of the environment-friendly hanger tin-stripping copper stripping liquid is 3-9 mL.
Furthermore, the weight of ferrous sulfate added into each liter of the environment-friendly hanger tin-stripping copper stripping liquid is 5-35 g.
The invention provides the environment-friendly hanger tin-stripping copper stripping liquid prepared by the preparation method.
The invention also provides a process for stripping tin and copper from a hanger by using the environment-friendly stripping liquid for stripping tin and copper from a sulfuric acid/hydrogen peroxide system.
Further, the environment-friendly hanger tin and copper stripping solution needs to be used in combination with sulfuric acid-hydrogen peroxide, and the hanger stripping solution of a sulfuric acid-hydrogen peroxide system comprises the following components:
460-560 mL of sulfuric acid (with the mass percentage concentration of 50%), 80-140 mL of hydrogen peroxide (with the mass percentage concentration of 50%) and 80-180 mL of environment-friendly hanger tin and copper stripping liquid are added into each liter of sulfuric acid-hydrogen peroxide system hanger stripping liquid.
The tin and copper stripping rates were determined as follows
Taking a double-sided copper-clad plate or a tin plate with the thickness of 4cm multiplied by 4cm, and recording the area as s (cm) 2 ) Drying in a forced air drier at 105 deg.C for 30 min, transferring into a drying oven, cooling to room temperature, weighing with an analytical balance, and recording as w 0 (g) And is ready for use;
soaking the dried copper-clad plate or tin plate into the environment-friendly hanger tin-copper stripping solution, and recording the soaking time as t (min);
thirdly, washing the deplated copper-clad plate or tin plate with water, transferring the copper-clad plate or tin plate into a blast drier, drying the copper-clad plate or tin plate for 30 minutes at 105 ℃, transferring the copper-clad plate or tin plate into a drying box, cooling the copper-clad plate or tin plate to room temperature, weighing the weight of the copper-clad plate or tin plate with an analytical balance, and recording the weight as w 1 (g)；
The deplating rate is calculated according to the following formula:
ρ is the density of tin or copper in (g/cm) 3 )
By adopting the technical scheme, the invention can achieve the following beneficial effects:
1. the tin stripping rate of the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared by the environment-friendly hanger tin-stripping copper stripping solution can reach more than 10 microns/min, and is not influenced by temperature.
2. The copper stripping rate of the rack stripping liquid of a sulfuric acid-hydrogen peroxide system prepared by adopting the environment-friendly rack tin and copper stripping liquid can reach 8-20 microns/min at the operating temperature of 30-40 ℃, and can be adjusted by the temperature and the using amount of hydrogen peroxide.
3. After the sulfuric acid/hydrogen peroxide deplating system replaces a nitric acid deplating system, the stripping effect is good, and the relevant requirements of actual production can be met.
4. After the sulfuric acid/hydrogen peroxide deplating system replaces a nitric acid deplating system, the cost is reduced by 3722.10 yuan/month, and the invisible cost of ammonia nitrogen treatment of wastewater of a sewage treatment station is not contained.
5. The ammonia nitrogen of the sewage treatment station of the circuit board factory is mainly sourced from the washing water after the nitric acid and the alkaline etching washing water are hung, and the pressure of the sewage treatment station for treating the ammonia nitrogen can be effectively relieved by using a sulfuric acid/hydrogen peroxide deplating system.
6. The sulfuric acid/hydrogen peroxide deplating system can prevent the generation of toxic gases such as nitrogen dioxide and the like, improve the workshop environment and contribute to the health of staff.
7. In consideration of development of a circuit board factory and environmental protection policies, a sulfuric acid/hydrogen peroxide stripping system is introduced into a graphic electroplating line for use, so that the health of workers is protected, the environment is protected, clean production is realized by enterprises, and meanwhile, the follow-up ammonia nitrogen environmental protection tightening standard of a wastewater station is facilitated to have countermeasures.
8. The stripping liquid can effectively prevent hydrogen peroxide from being decomposed, is suitable for a sulfuric acid-hydrogen peroxide system, can achieve the purpose of quickly stripping tin-copper coatings by adopting the stripping liquid of the sulfuric acid-hydrogen peroxide system prepared by the stripping liquid of the environment-friendly hanger, simultaneously does not contain nitrogen compounds and fluoride, effectively reduces the pollution to the environment, simultaneously can collect micro-etching waste water or high-acid waste water, is discharged into a comprehensive waste water tank after being neutralized, is simple to treat, does not need outsourcing treatment cost, does not need additional facilities, and has low cost; the water of the washing tank and the back washing water do not contain nitrogen, the sewage treatment pressure of the wastewater treatment station of the circuit board plant is effectively relieved, and the circuit board plant still has enough counter measures under the condition that the environmental standards of the total nitrogen and the ammonia nitrogen of follow-up countries are continuously tightened.
Detailed Description
The invention will be further described in detail with reference to the following examples for better understanding, but the scope of the invention as claimed is not limited to the scope shown in the examples.
The method for measuring the tin and copper stripping rate comprises the following steps:
taking a double-sided copper-clad plate or a tin plate with the thickness of 4cm multiplied by 4cm, and recording the area as s (cm) 2 ) Drying in a forced air drier at 105 deg.C for 30 min, transferring into a drying oven, cooling to room temperature, weighing with an analytical balance, and recording as w 0 (g) And is ready for use;
soaking the dried copper-clad plate or tin plate into the environment-friendly hanger tin-copper stripping solution, and recording the soaking time as t (min);
thirdly, washing the deplated copper-clad plate or tin plate with water, transferring the copper-clad plate or tin plate into a blast drier, drying the copper-clad plate or tin plate for 30 minutes at 105 ℃, transferring the copper-clad plate or tin plate into a drying box, cooling the copper-clad plate or tin plate to room temperature, weighing the weight of the copper-clad plate or tin plate with an analytical balance, and recording the weight as w 1 (g)；
The deplating rate is calculated according to the following formula:
rho is the density of tin or copper, and has the unit of (g/cm) 3 )
Example 1
The preparation of the environment-friendly hanger tin-stripping copper stripping liquid comprises the following steps: 30mL of phenolsulfonic acid, 40mL of propylene glycol, 7mL of polyethylene glycol 400 and 5g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the volume is fixed to 1L by using the pure water, so that the environment-friendly hanger tin-stripping copper stripping liquid is obtained.
Application example 1
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 460mL of sulfuric acid (with a mass percentage concentration of 50%), 100mL of hydrogen peroxide (with a mass percentage concentration of 50%), 100mL of the environment-friendly hanger tin and copper stripping liquid prepared in example 1 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 1 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, the plate is deplated for 30 seconds, and the tin layer and the copper layer on the plate are completely deplated in 7 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 12 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 10 microns/min; the copper stripping rate at 35 ℃ is 14 microns/min; the copper stripping rate at 40 ℃ was 19 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 1 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 2
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 500mL of sulfuric acid (with a mass percent concentration of 50%), 140mL of hydrogen peroxide (with a mass percent concentration of 50%), 180mL of the environment-friendly hanger tin and copper stripping solution prepared in example 1 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 2 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 40 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed within 6 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 10 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 14 microns/min; the copper stripping rate at 35 ℃ is 19 microns/min; the copper stripping rate at 40 ℃ was 20 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 2 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 3
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 560mL of sulfuric acid (with a mass percent concentration of 50%), 80mL of hydrogen peroxide (with a mass percent concentration of 50%), 80mL of the environment-friendly hanger tin and copper stripping solution prepared in example 1 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 3 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 20 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed in 8 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 15 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 8 microns/min; the copper stripping rate at 35 ℃ is 14 microns/min; the copper stripping rate at 40 ℃ was 17 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 3 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Example 2
The preparation of the environment-friendly hanger tin-stripping copper stripping liquid comprises the following steps: 60mL of phenolsulfonic acid, 60mL of propylene glycol, 5mL of polyethylene glycol 4005 and 15g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the volume is determined to 1L by using the pure water, so that the environment-friendly hanger tin and copper stripping solution is obtained.
Application example 4
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 460mL of sulfuric acid (with a mass percent concentration of 50%), 100mL of hydrogen peroxide (with a mass percent concentration of 50%), 100mL of the environment-friendly hanger tin and copper stripping liquid prepared in the embodiment 2 are added into 100mL of pure water under a continuous stirring condition, and finally the volume of the environment-friendly hanger tin and copper stripping liquid is fixed to 1L by using the pure water, so that the sulfuric acid-hydrogen peroxide system hanger stripping liquid is prepared.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 4 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, the plate is deplated for 30 seconds, and the tin layer and the copper layer on the plate are completely deplated in 7 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 12 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 10 microns/min; the copper stripping rate at 35 ℃ is 14 microns/min; the copper stripping rate at 40 ℃ was 20 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 4 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 5
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 500mL of sulfuric acid (with a mass percentage concentration of 50%), 140mL of hydrogen peroxide (with a mass percentage concentration of 50%), 180mL of the environment-friendly hanger tin and copper stripping solution prepared in example 2 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 5 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 40 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed within 6 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 10 microns/minute.
The copper removing rate is as follows: the copper stripping rate at 30 ℃ is 14 microns/min; the copper stripping rate at 35 ℃ is 18 microns/min; the copper stripping rate at 40 ℃ was 20 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 5 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 6
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 560mL of sulfuric acid (with a mass percent concentration of 50%), 80mL of hydrogen peroxide (with a mass percent concentration of 50%), 80mL of the environment-friendly hanger tin and copper stripping solution prepared in example 2 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 6 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 20 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed in 8 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 15 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 8 microns/min; the copper stripping rate at 35 ℃ is 12 microns/min; the copper stripping rate at 40 ℃ was 15 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 6 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Example 3
The preparation of the environment-friendly hanger tin-stripping copper stripping liquid comprises the following steps: 70mL of phenolsulfonic acid, 80mL of propylene glycol, 4003mL of polyethylene glycol and 25g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the volume is determined to 1L by using the pure water, so that the environment-friendly hanger tin and copper stripping solution is obtained.
Application example 7
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 460mL of sulfuric acid (with a mass percent concentration of 50%), 100mL of hydrogen peroxide (with a mass percent concentration of 50%), 100mL of the environment-friendly hanger tin and copper stripping solution prepared in example 3 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 7 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, the plate is deplated for 30 seconds, and the tin layer and the copper layer on the plate are completely deplated in 7 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 12 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 10 microns/min; the copper stripping rate at 35 ℃ is 14 microns/min; the copper stripping rate at 40 ℃ was 19 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 7 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 8
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 500mL of sulfuric acid (with a mass percentage concentration of 50%), 140mL of hydrogen peroxide (with a mass percentage concentration of 50%), 180mL of the environment-friendly hanger tin and copper stripping solution prepared in example 3 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 8 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 40 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed within 6 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 10 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 14 microns/min; the copper stripping rate at 35 ℃ is 17 microns/min; the copper stripping rate at 40 ℃ was 20 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 8 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 9
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 560mL of sulfuric acid (with a mass percent concentration of 50%), 80mL of hydrogen peroxide (with a mass percent concentration of 50%), 80mL of the environment-friendly hanger tin and copper stripping solution prepared in example 3 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 9 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 20 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed in 8 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 15 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 8 microns/min; the copper stripping rate at 35 ℃ is 12 microns/min; the copper stripping rate at 40 ℃ was 15 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 9 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Example 4
The preparation of the environment-friendly hanger tin-stripping copper stripping liquid comprises the following steps: 90mL of phenolsulfonic acid, 20mL of propylene glycol, 4009mL of polyethylene glycol and 35g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the volume is determined to 1L by using the pure water, thus obtaining the environment-friendly tin and copper stripping solution for the hanger.
Application example 10
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 460mL of sulfuric acid (with a mass percentage concentration of 50%), 100mL of hydrogen peroxide (with a mass percentage concentration of 50%), 100mL of the environment-friendly hanger tin and copper stripping solution prepared in example 4 were added to 100mL of pure water under a continuous stirring condition, and finally, the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 10 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, the plate is deplated for 30 seconds, and the tin layer and the copper layer on the plate are completely deplated in 7 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 12 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 12 microns/min; the copper stripping rate at 35 ℃ is 16 microns/min; the copper stripping rate at 40 ℃ was 20 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 10 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 11
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 500mL of sulfuric acid (with a mass percentage concentration of 50%), 140mL of hydrogen peroxide (with a mass percentage concentration of 50%), 180mL of the environment-friendly hanger tin and copper stripping solution prepared in example 4 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 11 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 40 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed within 6 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 10 microns/min.
The copper stripping rate is as follows: the copper stripping rate at 30 ℃ is 14 microns/min; the copper stripping rate at 35 ℃ is 19 microns/min; the copper stripping rate at 40 ℃ was 23 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 11 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 12
Preparing a rack deplating solution of a sulfuric acid-hydrogen peroxide system: 560mL of sulfuric acid (with a mass percent concentration of 50%), 80mL of hydrogen peroxide (with a mass percent concentration of 50%), 80mL of the environment-friendly hanger tin and copper stripping solution prepared in example 4 were added to 100mL of pure water under a continuous stirring condition, and finally the volume was fixed to 1L with pure water, so as to obtain the sulfuric acid-hydrogen peroxide system hanger stripping solution.
The sulfuric acid-hydrogen peroxide system hanger deplating solution prepared according to the application example 12 is used for treating a plating accompanying plate at the temperature of 30 ℃, wherein a tin layer of the plating accompanying plate is about 6 microns, a copper layer of the plating accompanying plate is about 52 microns, the plate is soaked and swung, tin is removed within 20 seconds, and the tin layer and the copper layer on the plating accompanying plate are completely removed in 8 minutes.
Measured according to the method for measuring the tin and copper stripping rate
The tin stripping rate is as follows: the tin stripping rate at 15 ℃, 25 ℃ and 35 ℃ is 15 microns/min.
The copper removing rate is as follows: the copper stripping rate at 30 ℃ is 8 microns/min; the copper stripping rate at 35 ℃ is 12 microns/min; the copper stripping rate at 40 ℃ was 15 μm/min.
After the rack deplating liquid of the sulfuric acid-hydrogen peroxide system prepared in the application example 12 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
The environment-friendly hanger tin and copper stripping solution (stripping agent) prepared in the embodiment 1 is practically applied to a 30-ten-thousand-square-foot graphic power and board power production line of a certain factory, and the main control parameters of a sulfuric acid/hydrogen peroxide stripping system are as follows:
1. process parameters
Table one process parameters
2. Supplement mode
Sulfuric acid, added manually after analysis;
hydrogen peroxide and a stripping agent are mainly added automatically and manually after analysis, and the adding proportion is that hydrogen peroxide: the volume ratio of the stripping agent is 2: 1
3. Cost comparison
After 6 months of online trial, the sulfuric acid/hydrogen peroxide deplating system can replace a nitric acid deplating system, and the operating environment is greatly improved. The amount of the deplating waste liquid is small, the microetching waste liquid is merged into the deplating waste liquid for recycling, and the treatment cost can be ignored. The cost is saved by 3722.10 yuan each month.
Comparison of two costs
4. Nitric acid and stripping agent tank liquor and post-washing ammonia nitrogen contrast
And the ammonia nitrogen contents of the bath solution and the post-washing water of the sulfuric acid/hydrogen peroxide stripping system and the nitric acid stripping system are compared, and the results are shown in the table III.
Ammonia nitrogen contrast of surface three two process tank liquor and after-washing
From the third table, after the sulfuric acid/hydrogen peroxide stripping system replaces the nitric acid stripping system, the ammonia nitrogen content of the bath solution and the back washing water is greatly reduced, the pressure of the circuit board factory sewage treatment station is effectively relieved, and reliable guarantee is provided for the ammonia nitrogen environmental protection tightening standard of the subsequent waste water station.
5. Conclusion
After the sulfuric acid/hydrogen peroxide deplating system replaces a nitric acid deplating system, the stripping and hanging effect is good, and relevant requirements of actual production can be met.
After a sulfuric acid/hydrogen peroxide deplating system replaces a nitric acid deplating system, the cost is reduced by 3722.10 yuan/month, and the invisible cost of ammonia nitrogen treatment of wastewater of a sewage treatment station is not contained.
And the ammonia nitrogen of the sewage treatment station of the circuit board plant is mainly sourced from the washing water after the nitrate is hung and the alkaline etching washing water, and the pressure of the sewage treatment station for treating the ammonia nitrogen can be effectively relieved by using a sulfuric acid/hydrogen peroxide deplating system.
And a sulfuric acid/hydrogen peroxide deplating system is used, so that toxic gases such as nitrogen dioxide can be prevented from being generated, the workshop environment is improved, and the health of staff is facilitated.
Fifthly, from the development of a circuit board factory and the consideration of environmental protection policies, a sulfuric acid/hydrogen peroxide solution deplating system is introduced into the pattern electroplating line for use, so that the health of workers is protected, the environment is protected, clean production is realized for enterprises, and the ammonia nitrogen environmental protection tightening standards of subsequent wastewater stations are facilitated to take countermeasures.
Claims (10)
1. The preparation method of the environment-friendly hanger tin-stripping copper stripping liquid is characterized by comprising the following steps of: adding phenolsulfonic acid, propylene glycol, polyethylene glycol 400 and ferrous sulfate into water under the condition of continuous stirring, and finally adding water to a constant volume to obtain the environment-friendly hanger tin and copper stripping solution.
2. The method for preparing the environment-friendly hanger tin-stripping copper stripping solution as claimed in claim 1, wherein the volume of phenolsulfonic acid added in each liter of environment-friendly hanger tin-stripping copper stripping solution is 30-90 mL.
3. The method for preparing the environment-friendly hanger tin-stripping copper stripping solution as claimed in claim 1, wherein the volume of propylene glycol added in each liter of environment-friendly hanger tin-stripping copper stripping solution is 20-80 mL.
4. The method for preparing the environment-friendly hanger tin-stripping copper stripping solution as claimed in claim 1, wherein the volume of polyethylene glycol 400 added in each liter of environment-friendly hanger tin-stripping copper stripping solution is 3-9 mL.
5. The method for preparing the environment-friendly hanger tin-removed copper stripping liquid as claimed in claim 1, wherein the weight of ferrous sulfate added to each liter of environment-friendly hanger tin-removed copper stripping liquid is 5-35 g.
6. The environment-friendly hanger tin and copper stripping solution prepared by the preparation method of any one of claims 1 to 5.
7. The environment-friendly hanger tin and copper stripping solution as claimed in claim 6 is used in the process of removing tin and copper from a hanger of a sulfuric acid/hydrogen peroxide system.
8. The environment-friendly hanger tin and copper stripping solution used for the hanger tin and copper stripping process of the sulfuric acid/hydrogen peroxide system according to claim 7 is characterized in that 460-560 mL of sulfuric acid is added into each liter of sulfuric acid/hydrogen peroxide system hanger stripping solution in the hanger tin and copper stripping process of the sulfuric acid/hydrogen peroxide system.
9. The environment-friendly hanger tin and copper stripping solution used for the hanger tin and copper stripping process of the sulfuric acid/hydrogen peroxide system according to claim 7 is characterized in that in the hanger tin and copper stripping process of the sulfuric acid/hydrogen peroxide system, 80-140 mL of hydrogen peroxide is added into per liter of the hanger stripping solution of the sulfuric acid/hydrogen peroxide system.
10. The environment-friendly hanger tin and copper stripping solution for the hanger tin and copper stripping process of the sulfuric acid/hydrogen peroxide system according to claim 7 is characterized in that 80-180 mL of the environment-friendly hanger tin and copper stripping solution is added into per liter of the sulfuric acid/hydrogen peroxide system hanger stripping solution in the hanger tin and copper stripping process of the sulfuric acid/hydrogen peroxide system.
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| CN114351145A (en) * | 2021-12-30 | 2022-04-15 | 华南理工大学 | Tin and copper stripping liquid additive for hanger and preparation method and application thereof |
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2022
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| US4215005A (en) * | 1978-01-30 | 1980-07-29 | Allied Chemical Corporation | Organic stripping compositions and method for using same |
| US6258294B1 (en) * | 1997-10-01 | 2001-07-10 | Morton International, Inc. | Composition for stripping solder and tin from printed circuit boards |
| CN102061477A (en) * | 2010-12-31 | 2011-05-18 | 深圳市格林美高新技术股份有限公司 | Solder removing liquid, preparation method and application thereof |
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| CN114351145A (en) * | 2021-12-30 | 2022-04-15 | 华南理工大学 | Tin and copper stripping liquid additive for hanger and preparation method and application thereof |
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