CN115110080B - Environment-friendly hanger tin-copper stripping liquid and preparation method and application thereof - Google Patents
Environment-friendly hanger tin-copper stripping liquid and preparation method and application thereof Download PDFInfo
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- CN115110080B CN115110080B CN202210727122.5A CN202210727122A CN115110080B CN 115110080 B CN115110080 B CN 115110080B CN 202210727122 A CN202210727122 A CN 202210727122A CN 115110080 B CN115110080 B CN 115110080B
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- tin
- copper
- stripping
- hydrogen peroxide
- hanger
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 239000007788 liquid Substances 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 118
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 86
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 44
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000003756 stirring Methods 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims abstract description 17
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 claims abstract description 9
- 235000003891 ferrous sulphate Nutrition 0.000 claims abstract description 9
- 239000011790 ferrous sulphate Substances 0.000 claims abstract description 9
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims abstract description 9
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims abstract description 9
- 229940044654 phenolsulfonic acid Drugs 0.000 claims abstract description 9
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims abstract description 6
- 229960001781 ferrous sulfate Drugs 0.000 claims abstract description 3
- 229960004063 propylene glycol Drugs 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 118
- 229910052802 copper Inorganic materials 0.000 claims description 118
- 239000010949 copper Substances 0.000 claims description 118
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 99
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 28
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 abstract description 25
- 239000010865 sewage Substances 0.000 abstract description 17
- 238000005406 washing Methods 0.000 abstract description 17
- 239000002351 wastewater Substances 0.000 abstract description 17
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 14
- 239000002699 waste material Substances 0.000 abstract description 13
- 230000007613 environmental effect Effects 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 4
- 238000011001 backwashing Methods 0.000 abstract description 4
- 229910017464 nitrogen compound Inorganic materials 0.000 abstract description 3
- 150000002830 nitrogen compounds Chemical class 0.000 abstract description 3
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 65
- 238000007747 plating Methods 0.000 description 61
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 19
- 229910017604 nitric acid Inorganic materials 0.000 description 19
- 238000002791 soaking Methods 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000005028 tinplate Substances 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 230000036541 health Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000002341 toxic gas Substances 0.000 description 3
- 238000004065 wastewater treatment Methods 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical group Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- BYMHXIQVEAYSJD-UHFFFAOYSA-M sodium;4-sulfophenolate Chemical compound [Na+].OC1=CC=C(S([O-])(=O)=O)C=C1 BYMHXIQVEAYSJD-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses an environment-friendly hanger tin-copper stripping liquid and a preparation method and application thereof, wherein the preparation method comprises the following steps: under the condition of continuous stirring, adding phenolsulfonic acid, propylene glycol, polyethylene glycol 400 and ferrous sulfate into water, and finally, using water to fix the volume to obtain the environment-friendly hanger tin-copper stripping liquid. The invention is suitable for the tin-copper removing process of the hanger of sulfuric acid/hydrogen peroxide system, can remove tin-copper at the same time, has high stripping speed, can meet the process requirements, and can effectively prevent hydrogen peroxide from decomposing; the stripping liquid contains no nitrogen compound, the waste liquid is easy to treat, and the waste liquid can be converged into microetching waste water or high-acid waste water for treatment; the washing tank water and the back washing water do not contain nitrogen, so that the environmental protection pressure of continuously tightening the total nitrogen and ammonia nitrogen emission standards related to the national environmental protection policy faced by the sewage treatment station of the printed circuit board factory can be effectively relieved.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to an environment-friendly hanger tin-copper stripping liquid and a preparation method and application thereof.
Background
In the processing process of the printed circuit board, after the procedures of drilling and electroless copper plating (the thickness of a copper layer is 0.3-0.5 mu m), copper plating (primary copper plating, the thickness of the copper layer is 5-8 mu m) and pattern electroplating (secondary copper plating, the thickness of the copper layer is 10-15 mu m) are generally required to be carried out on the copper-clad plate, so that the thickness of the copper layer can reach the technological requirements, and after copper plating, tin plating (the thickness of a tin layer is 5-8 mu m) is also required, wherein the typical flow is as follows:
base plate, drilling, electroless copper deposition, full plate electroplating (copper plating), image transfer, pattern electroplating (copper plating and tin plating), film stripping, etching and …
In the whole plate electroplating and pattern electroplating processes, copper plating or copper plating and tin plating operations are finished, a layer of metal is plated on the hanger for supporting the plated piece, and the hanger needs to be used repeatedly, so that the metal plating on the hanger needs to be thoroughly removed, and the problem that the quality of products is caused by the fact that metal powder is generated by tip discharge of the metal plating on the hanger falls into a plating tank is avoided. High-concentration nitric acid is commonly used as stripping liquid in printed circuit board factories. The nitric acid stripping solution has the advantages of high stripping rate, cleanliness and thoroughness, no need of assistance of other conditions and simple operation. However, the high-concentration nitric acid has strong oxidizing property and strong volatility, and can generate toxic nitric oxide and nitrogen dioxide gas when removing metals such as copper, tin and the like, so that the environment is seriously polluted, great harm is caused to human bodies, great corrosion is caused to equipment and plants, meanwhile, the stripping waste liquid contains a large amount of heavy metals such as copper, tin and the like, the recycling of heavy metals is not facilitated due to the strong oxidizing property of the nitric acid, the recycling process is complex, more raw materials are required, a printed circuit board factory generally adopts an external commission mode, and commission is made to a third party mechanism for treatment, and the treatment cost per ton is about 3000-5000 yuan; and secondly, the total nitrogen and ammonia nitrogen content in the washing tank water and the post-washing water is high, so that the load of a sewage treatment station is increased.
In order to overcome the defects of the nitric acid type stripping liquid, a sulfuric acid-hydrogen peroxide stripping system is widely studied. The stripping solution and the stripping solution method for the electroplating rack disclose that monoethanolamine is added into a sulfuric acid-hydrogen peroxide stripping system as a complexing agent, n-octylamine is used as an accelerator, the copper stripping speed is only 4-8 microns/min, and the copper stripping speed is low. The patent application does not mention the tin stripping effect nor the waste liquid treatment measures and the treatment problems with respect to total nitrogen and ammonia nitrogen in the wash and backwash water. An environment-friendly stripping agent is disclosed, which adopts a double-liquid method to remove tin and copper on a fixture, and a test piece is sequentially put into a first stripping agent and a second stripping agent to quickly remove the tin and copper. The method is not suitable for established factories, and the portal frame picture electric production line of most circuit board factories is compact in structure, generally only has one deplating groove, and is additionally provided with one deplating groove, so that the difficulty is high and the cost is high. The tin stripping combination solution and the tin stripping method disclose that tin and copper on a clamp are stripped by adopting a double-liquid method, namely, solution A tin stripping, water washing and solution B copper stripping. The solution A is a sulfuric acid-hydrogen peroxide system containing organic amine and the like, and is specially used for removing tin, and the solution B is a ferric trichloride system and is specially used for removing copper. The method needs to add a washing tank and a deplating tank, and is not suitable for established factories for the reasons; in addition, the patent application adopts a ferric trichloride system to remove copper, which possibly brings chloride ion pollution; this patent application also uses more organic amines and other nitrogen-containing compounds and does not address the waste liquid, wash tank water and post-wash water disposal problems. An environment-friendly tin-copper plating layer stripping liquid and a stripping method thereof disclose that organic amine is used as a hydrogen peroxide stabilizer, and three steps of dilute sulfuric acid soaking, water washing and stripping are adopted to strip tin-copper, and the plating layer is also required to be inflated. This method requires two tanks and pumping equipment and is difficult to use in an established factory. An environment-friendly hanger stripping agent for a circuit board nitrate hanger discloses that sodium p-hydroxybenzenesulfonate and diethylene glycol monobutyl ether are added into a sulfuric acid-hydrogen peroxide stripping system to achieve the purpose of stripping, and the patent application only discloses a formula, does not mention the problems of stripping speed and the like, and does not disclose a using method. The novel environment-friendly tin stripping hanging liquid and the preparation method and the using method thereof disclose three steps of tin stripping by adopting dilute sulfuric acid soaking, pure water washing and tin stripping by the tin stripping hanging liquid, wherein the tin stripping speed is less than 4 microns/min, and no mention is made of whether copper can be stripped or not. An environment-friendly stripping rack liquid for stripping copper and tin and a stripping method using the same, which discloses that an organic amine, sulfamic acid, alcohols and other auxiliary agents are added in a sulfuric acid-hydrogen peroxide system, so that the stripping speed of tin and copper is high, the process requirements are met, and the stripping rack liquid can replace nitric acid stripping rack liquid. The patent application does not mention the problems of waste liquid, wash tank water and post-wash water treatment, and the stripping rack additive contains more nitrogenous substances such as organic amine and the like, so that the waste water treatment pressure of the sewage station of the circuit board factory can be increased.
In conclusion, the sulfuric acid-hydrogen peroxide type stripping solution can meet the process requirements instead of the nitric acid type stripping solution, so that toxic gases such as nitrogen dioxide and the like are prevented from being generated, the workshop environment is improved, and the health of staff is facilitated. However, the additive of the common sulfuric acid-hydrogen peroxide stripping system often contains a large amount of organic amines, the total nitrogen and ammonia nitrogen content of the stripping waste liquid is extremely high, the waste liquid is generally converged into microetching waste water or high-acid waste water, and is discharged into a comprehensive waste water tank after neutralization, and is treated and discharged after reaching standards. Compared with the external delegation treatment of the nitric acid type stripping waste liquid, the common sulfuric acid-hydrogen peroxide type stripping system has the advantages that the total nitrogen and ammonia nitrogen treatment pressure of the sewage treatment station of the printed circuit board factory is not relieved, but the total nitrogen and ammonia nitrogen treatment pressure of the sewage treatment station of the circuit board factory is greatly increased. The washing tank water and the back washing water of the common sulfuric acid-hydrogen peroxide stripping system still belong to high ammonia nitrogen sewage, and considerable pressure still exists on a sewage treatment station of a circuit board factory. The total nitrogen and ammonia nitrogen in the wastewater of the circuit board factory mainly originate from a nitric acid stripping rack and alkaline etching, and the total nitrogen and ammonia nitrogen concentration is a main monitoring item for sewage discharge in the circuit board industry. At present, circuit board factories face extremely high environmental protection pressure, the total nitrogen and ammonia nitrogen emission standard is continuously tightened, and the sulfuric acid-hydrogen peroxide solution type stripping solution still needs further improvement to achieve the purpose of practicality.
Disclosure of Invention
Aiming at the problems, the invention aims to provide an environment-friendly hanger tin-copper stripping liquid and a preparation method and application thereof, wherein the stripping liquid is applicable to a sulfuric acid-hydrogen peroxide system, the sulfuric acid-hydrogen peroxide system hanger stripping liquid prepared by adopting the environment-friendly hanger tin-copper stripping liquid can achieve the aim of rapidly removing tin-copper plating, and meanwhile, the stripping liquid contains no nitrogen compound and fluoride, so that the pollution to the environment is effectively reduced, and waste liquid can be led into microetching waste water or high-acid waste water, and is discharged into a comprehensive waste water tank after neutralization, so that the treatment is simple, the external commission treatment cost is not needed, additional facilities are also not needed, and the cost is low; the washing tank water and the back washing water contain no nitrogen, so that the sewage treatment pressure of a waste water treatment station of the circuit board factory is effectively relieved, and the circuit board factory still has enough countermeasure under the condition that the total nitrogen and ammonia nitrogen environmental protection standards of the following countries are continuously tightened.
The aim of the invention is achieved by the following technical scheme:
the invention provides a preparation method of an environment-friendly hanger tin-copper stripping solution, which comprises the following steps:
adding phenolsulfonic acid, propylene glycol, polyethylene glycol 400 and ferrous sulfate into water under the condition of continuous stirring, and finally, using water to fix the volume to obtain the environment-friendly stripping solution for removing tin and copper of the hanger.
Further, the volume of adding phenolsulfonic acid into each liter of environment-friendly hanger tin-copper stripping liquid is 30-90 mL.
Further, the volume of propylene glycol added into each liter of the environment-friendly hanger tin-copper stripping liquid is 20-80 mL.
Further, the volume of polyethylene glycol 400 added into each liter of environment-friendly hanger tin-copper stripping liquid is 3-9 mL.
Further, the mass of the ferrous sulfate added into each liter of the environment-friendly hanging tool tin-copper stripping liquid is 5-35 g.
The invention provides an environment-friendly hanger tin-copper stripping solution prepared by the preparation method.
The invention also provides a working procedure of the environment-friendly hanger tin-copper stripping liquid for stripping tin and copper of the hanger of the sulfuric acid/hydrogen peroxide system.
Further, the environment-friendly hanger tin-copper stripping solution is matched with sulfuric acid-hydrogen peroxide for use, and the sulfuric acid-hydrogen peroxide system hanger stripping solution comprises the following components:
460-560 mL of sulfuric acid (with the mass percentage concentration of 50%) is added into each liter of sulfuric acid-hydrogen peroxide system hanger stripping solution, 80-140 mL of hydrogen peroxide (with the mass percentage concentration of 50%) is added into each liter of sulfuric acid-hydrogen peroxide system hanger stripping solution, and 80-180 mL of environment-friendly hanger stripping solution for stripping tin and copper.
The tin-copper stripping rate was determined as follows
Taking a 4cm multiplied by 4cm double-sided copper-clad plate or tin plate, and recording the area as s (cm) 2 ) Drying in a blast drier at 105deg.C for 30 min, cooling to room temperature, weighing with analytical balance, and recording as w 0 (g) Standby;
secondly, immersing the dried copper-clad plate or tin plate into the environment-friendly hanger tin-copper stripping liquid for soaking, and recording the soaking time as t (min);
thirdly, cleaning the deplated copper-clad plate or tin plate with water, transferring into a blast drier, drying for 30 minutes at 105 ℃, transferring into a drying box, cooling to room temperature, weighing the weight of the copper-clad plate or tin plate by using an analytical balance, and recording as w 1 (g)；
The stripping rate is calculated as:
ρ is the density of tin or copper in units of (g/cm 3 )
The invention can achieve the following beneficial effects by adopting the technical scheme:
1. the tin stripping rate of the sulfuric acid-hydrogen peroxide system hanger stripping liquid prepared by adopting the environment-friendly hanger tin stripping copper stripping liquid can reach more than 10 microns/min, and is not affected by temperature.
2. The copper stripping rate of the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared by adopting the environment-friendly hanger stripping solution can reach 8-20 microns/min at the operating temperature of 30-40 ℃, and the copper stripping rate can be adjusted by the temperature and the hydrogen peroxide consumption.
3. After the sulfuric acid/hydrogen peroxide stripping system replaces the nitric acid stripping system, the stripping and hanging effect is good, and the related requirements of actual production can be met.
4. After the sulfuric acid/hydrogen peroxide stripping system replaces the nitric acid stripping system, the cost is reduced by 3722.10 yuan/month, and the invisible cost of ammonia nitrogen treatment of wastewater of a sewage treatment station is not contained.
5. The ammonia nitrogen in the sewage treatment station of the circuit board factory is mainly sourced from the washing water after nitric acid is hung and the alkaline etching washing water, and the pressure of the sewage treatment station for treating the ammonia nitrogen can be effectively relieved by using a sulfuric acid/hydrogen peroxide stripping system.
6. The sulfuric acid/hydrogen peroxide stripping system can prevent toxic gases such as nitrogen dioxide from being generated, improve the workshop environment and be beneficial to the health of staff.
7. From the development of circuit board factories and environmental protection policy, the sulfuric acid/hydrogen peroxide stripping system is led into the graphic plating line for use, thereby being beneficial to protecting the health of staff and environment, realizing clean production for enterprises, and simultaneously being convenient for the subsequent environmental protection tightening standard of ammonia nitrogen in the waste water station.
8. The stripping liquid can effectively prevent hydrogen peroxide from decomposing, is suitable for a sulfuric acid-hydrogen peroxide system, can achieve the aim of rapidly removing tin and copper plating by adopting the sulfuric acid-hydrogen peroxide system hanger stripping liquid prepared by the environment-friendly hanger tin and copper stripping liquid, does not contain nitrogen compounds and fluorides in the stripping liquid, effectively reduces pollution to the environment, can be used for collecting microetching wastewater or high-acid wastewater, and is discharged into a comprehensive wastewater tank after neutralization, so that the treatment is simple, the treatment cost is not required by external commission, additional facilities are not required, and the cost is low; the washing tank water and the back washing water contain no nitrogen, so that the sewage treatment pressure of a waste water treatment station of the circuit board factory is effectively relieved, and the circuit board factory still has enough countermeasure under the condition that the total nitrogen and ammonia nitrogen environmental protection standards of the following countries are continuously tightened.
Detailed Description
For a better understanding of the present invention, the present invention will be described in further detail with reference to the following examples, but the scope of the present invention is not limited to the scope of the examples.
The method for measuring the tin-copper stripping rate is as follows:
taking a 4cm multiplied by 4cm double-sided copper-clad plate or tin plate, and recording the area as s (cm) 2 ) Drying in a blast drier at 105deg.C for 30 min, cooling to room temperature, weighing with analytical balance, and recording as w 0 (g) Standby;
secondly, immersing the dried copper-clad plate or tin plate into the environment-friendly hanger tin-copper stripping liquid for soaking, and recording the soaking time as t (min);
thirdly, cleaning the deplated copper-clad plate or tin plate with water, transferring into a blast drier, drying for 30 minutes at 105 ℃, transferring into a drying box, cooling to room temperature, weighing the weight of the copper-clad plate or tin plate by using an analytical balance, and recording as w 1 (g)；
The stripping rate is calculated as:
ρ is the density of tin or copper in units of (g/cm 3 )
Example 1
Preparing an environment-friendly hanger tin-copper stripping solution: adding 30mL of phenolsulfonic acid, 40mL of propylene glycol, 7mL of polyethylene glycol 400 and 5g of ferrous sulfate into 500mL of pure water under continuous stirring, and finally, fixing the volume to 1L by using pure water to obtain the environment-friendly rack tin-copper stripping liquid.
Application example 1
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 460mL of sulfuric acid (the mass percentage concentration is 50%), 100mL of hydrogen peroxide (the mass percentage concentration is 50%), 100mL of the environment-friendly hanging tool tin-copper stripping solution prepared in the example 1 are added into 100mL of pure water under the continuous stirring condition, and finally the pure water is used for constant volume to 1L.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 1 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the plating partner plate is immersed and swung, the tin is stripped for 30 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped for 7 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 12 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 10 microns/min; the copper removal rate at 35 ℃ was 14 microns/min; the copper removal rate at 40 ℃ was 19 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 1 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 2
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 500mL of sulfuric acid (the mass percentage concentration is 50%), 140mL of hydrogen peroxide (the mass percentage concentration is 50%), 180mL of the environment-friendly hanging tool tin-copper stripping solution prepared in the example 1 are added into 100mL of pure water under the continuous stirring condition, and finally the pure water is used for constant volume to 1L.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 2 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 40 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 6 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 10 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 14 microns/min; the copper removal rate at 35 ℃ was 19 microns/min; the copper removal rate at 40 ℃ was 20 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 2 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 3
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 560mL of sulfuric acid (the mass percentage concentration is 50%) and 80mL of hydrogen peroxide (the mass percentage concentration is 50%) are added into 100mL of pure water under the continuous stirring condition, 80mL of the environment-friendly hanging tool tin-copper stripping solution prepared in the example 1 is finally used for fixing the volume to 1L.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 3 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 20 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 8 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates at 15 ℃, 25 ℃ and 35 ℃ were 15 microns/min.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 8 microns/min; the copper removal rate at 35 ℃ was 14 microns/min; the copper removal rate at 40 ℃ was 17 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 3 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Example 2
Preparing an environment-friendly hanger tin-copper stripping solution: 60mL of phenolsulfonic acid, 60mL of propylene glycol, 4005mL of polyethylene glycol and 15g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the pure water is used for fixing the volume to 1L, so that the environment-friendly rack tin-copper stripping liquid is obtained.
Application example 4
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 460mL of sulfuric acid (the mass percentage concentration is 50%), 100mL of hydrogen peroxide (the mass percentage concentration is 50%), 100mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 2 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 4 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the plating partner plate is immersed and swung, the tin is stripped for 30 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped for 7 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 12 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 10 microns/min; the copper removal rate at 35 ℃ was 14 microns/min; the copper removal rate at 40 ℃ was 20 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 4 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 5
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 500mL of sulfuric acid (the mass percentage concentration is 50%), 140mL of hydrogen peroxide (the mass percentage concentration is 50%), 180mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 2 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 5 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 40 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 6 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 10 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 14 microns/min; the copper removal rate at 35 ℃ was 18 microns/min; the copper removal rate at 40 ℃ was 20 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 5 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 6
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 560mL of sulfuric acid (the mass percentage concentration is 50%), 80mL of hydrogen peroxide (the mass percentage concentration is 50%), 80mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 2 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 6 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 20 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 8 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates at 15 ℃, 25 ℃ and 35 ℃ were 15 microns/min.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 8 microns/min; the copper removal rate at 35 ℃ was 12 microns/min; the copper removal rate at 40 ℃ was 15 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 6 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Example 3
Preparing an environment-friendly hanger tin-copper stripping solution: 70mL of phenolsulfonic acid, 80mL of propylene glycol, 4003mL of polyethylene glycol and 25g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the pure water is used for fixing the volume to 1L, so that the environment-friendly rack tin-copper stripping liquid is obtained.
Application example 7
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 460mL of sulfuric acid (the mass percentage concentration is 50%), 100mL of hydrogen peroxide (the mass percentage concentration is 50%), 100mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 3 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 7 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the plating partner plate is immersed and swung, the tin is stripped for 30 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped for 7 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 12 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 10 microns/min; the copper removal rate at 35 ℃ was 14 microns/min; the copper removal rate at 40 ℃ was 19 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 7 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 8
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 500mL of sulfuric acid (the mass percentage concentration is 50%), 140mL of hydrogen peroxide (the mass percentage concentration is 50%), 180mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 3 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 8 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 40 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 6 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 10 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 14 microns/min; the copper removal rate at 35 ℃ was 17 microns/min; the copper removal rate at 40 ℃ was 20 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 8 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 9
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 560mL of sulfuric acid (the mass percentage concentration is 50%), 80mL of hydrogen peroxide (the mass percentage concentration is 50%), 80mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 3 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 9 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 20 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 8 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates at 15 ℃, 25 ℃ and 35 ℃ were 15 microns/min.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 8 microns/min; the copper removal rate at 35 ℃ was 12 microns/min; the copper removal rate at 40 ℃ was 15 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 9 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Example 4
Preparing an environment-friendly hanger tin-copper stripping solution: 90mL of phenolsulfonic acid, 20mL of propylene glycol, 4009mL of polyethylene glycol and 35g of ferrous sulfate are added into 500mL of pure water under the condition of continuous stirring, and finally the pure water is used for fixing the volume to 1L, so that the environment-friendly rack tin-copper stripping liquid is prepared.
Application example 10
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 460mL of sulfuric acid (the mass percentage concentration is 50%), 100mL of hydrogen peroxide (the mass percentage concentration is 50%), 100mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 4 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 10 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the plating partner plate is immersed and swung, the tin is stripped for 30 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped for 7 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 12 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 12 microns/min; the copper removal rate at 35 ℃ was 16 microns/min; the copper removal rate at 40 ℃ was 20 microns/min.
The concentration of hydrogen peroxide is unchanged after the rack stripping solution of the sulfuric acid-hydrogen peroxide system prepared in application example 10 is placed for 10 days.
Application example 11
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 500mL of sulfuric acid (the mass percentage concentration is 50%), 140mL of hydrogen peroxide (the mass percentage concentration is 50%), 180mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 4 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 11 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 40 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 6 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates were 10 μm/min at 15 ℃, 25 ℃, 35 ℃.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 14 microns/min; the copper removal rate at 35 ℃ was 19 microns/min; the copper removal rate at 40 ℃ was 23 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 11 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
Application example 12
Preparing a sulfuric acid-hydrogen peroxide system hanger stripping solution: 560mL of sulfuric acid (the mass percentage concentration is 50%), 80mL of hydrogen peroxide (the mass percentage concentration is 50%), 80mL of the environment-friendly hanger tin-copper stripping solution prepared in the example 4 are added into 100mL of pure water under the condition of continuous stirring, and finally pure water is used for constant volume to 1L, so that the sulfuric acid-hydrogen peroxide system hanger stripping solution is prepared.
The plating partner plate is treated by the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in the application example 12 at 30 ℃, the tin layer of the plating partner plate is about 6 microns, the copper layer is about 52 microns, the tin is stripped after soaking and swinging for 20 seconds, and the tin layer and the copper layer on the plating partner plate are completely stripped after 8 minutes.
Measured by the method for measuring the tin-copper stripping rate
The tin stripping rate is as follows: the tin stripping rates at 15 ℃, 25 ℃ and 35 ℃ were 15 microns/min.
The copper removal rate is as follows: the copper removal rate at 30 ℃ was 8 microns/min; the copper removal rate at 35 ℃ was 12 microns/min; the copper removal rate at 40 ℃ was 15 microns/min.
After the sulfuric acid-hydrogen peroxide system hanger stripping solution prepared in application example 12 is placed for 10 days, the concentration of hydrogen peroxide is unchanged.
The environment-friendly hanger tin-copper stripping solution (stripping agent) prepared in the embodiment 1 is practically applied to a power line and a board line of 30 ten thousand square feet in a certain factory, and the main control parameters of a sulfuric acid/hydrogen peroxide stripping system are as follows:
1. process parameters
Table one process parameters
2. Additional mode
Sulfuric acid, manually added after analysis;
the hydrogen peroxide and the stripping agent are mainly added automatically, and are manually added after analysis, wherein the adding proportion is hydrogen peroxide: volume ratio of stripping agent = 2:1
3. Cost comparison
After 6 months of online trial, the sulfuric acid/hydrogen peroxide stripping system can replace a nitric acid stripping system, and the operation environment is greatly improved. The water content of the deplating waste liquid is not large, and the deplating waste liquid is collected into the microetching waste liquid for cyclic utilization, so that the treatment cost is negligible. The monthly savings is 3722.10 yuan.
Table cost comparison
4. Nitric acid and stripping agent tank liquor and ammonia nitrogen comparison after water washing
The ammonia nitrogen content of the bath solution and the backwash water of the sulfuric acid/hydrogen peroxide stripping system and the nitric acid stripping system are compared, and the results are shown in Table III.
Comparison of ammonia nitrogen in three kinds of process tank liquor and post-washing
From the third table, it can be seen that after the sulfuric acid/hydrogen peroxide stripping system replaces the nitric acid stripping system, the ammonia nitrogen content of the bath solution and the post-washing water is greatly reduced, the pressure of the sewage treatment station of the circuit board factory is effectively relieved, and reliable guarantee is provided for the ammonia nitrogen environment-friendly tightening standard of the subsequent wastewater station.
5. Conclusion(s)
After the sulfuric acid/hydrogen peroxide stripping system replaces the nitric acid stripping system, the stripping effect is good, and the related requirements of actual production can be met.
After the sulfuric acid/hydrogen peroxide stripping system replaces the nitric acid stripping system, the cost is reduced by 3722.10 yuan/month, and the invisible cost of ammonia nitrogen treatment of wastewater of the sewage treatment station is not contained.
According to the method, ammonia nitrogen in the sewage treatment station of the circuit board factory is mainly sourced from the water washing water after nitric acid is hung and the alkaline etching water washing water, and the pressure of the sewage treatment station for treating the ammonia nitrogen can be effectively relieved by using a sulfuric acid/hydrogen peroxide stripping system.
The sulfuric acid/hydrogen peroxide deplating system is adopted to prevent toxic gases such as nitrogen dioxide from being generated, improve the workshop environment and be beneficial to the health of staff.
And (5) in consideration of development of a circuit board factory and environmental protection policy, the sulfuric acid/hydrogen peroxide deplating system is led into the graphic plating line for use, so that the health of staff and the environment are protected, the enterprise also realizes clean production, and meanwhile, the environment-friendly tightening standard of ammonia nitrogen in the subsequent waste water station is also convenient to take countermeasures.
Claims (6)
1. The preparation method of the environment-friendly hanger tin-copper stripping liquid is characterized by comprising the following steps of: adding phenolsulfonic acid, propylene glycol, polyethylene glycol 400 and ferrous sulfate into water under the condition of continuous stirring, and finally, using water to fix the volume to obtain an environment-friendly hanger tin-copper stripping solution; the volume of the phenolsulfonic acid added into each liter of environment-friendly hanger tin-copper stripping liquid is 30-90 mL; propylene glycol is added into each liter of environment-friendly hanger tin-copper stripping liquid in a volume of 20-80 mL; the volume of polyethylene glycol 400 added into each liter of environment-friendly hanger tin-copper stripping liquid is 3-9 mL; the mass of the ferrous sulfate added into each liter of environment-friendly hanger tin-copper stripping liquid is 5-35 g.
2. The environment-friendly hanger tin-copper stripping solution prepared by the preparation method of claim 1.
3. The process of removing tin and copper from the hanger used for sulfuric acid/hydrogen peroxide system according to claim 2.
4. The process for stripping tin and copper from a hanger for a sulfuric acid/hydrogen peroxide system according to claim 3, wherein in the process for stripping tin and copper from a hanger for a sulfuric acid/hydrogen peroxide system, sulfuric acid is added into the stripping solution for stripping tin and copper from a hanger for a sulfuric acid/hydrogen peroxide system by 460-560 mL per liter.
5. The process for stripping tin and copper from a hanger of a sulfuric acid/hydrogen peroxide system according to claim 3, wherein hydrogen peroxide is added into each liter of the stripping solution of the hanger of the sulfuric acid/hydrogen peroxide system in the process for stripping tin and copper from the hanger of the sulfuric acid/hydrogen peroxide system, wherein hydrogen peroxide is 80-140 mL.
6. The process for stripping tin and copper from the hanger of the sulfuric acid/hydrogen peroxide system according to claim 1, wherein 80-180 mL of the environment-friendly hanger tin and copper stripping solution is added into each liter of the sulfuric acid/hydrogen peroxide system hanger stripping solution in the process for stripping tin and copper from the hanger of the sulfuric acid/hydrogen peroxide system.
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| US4215005A (en) * | 1978-01-30 | 1980-07-29 | Allied Chemical Corporation | Organic stripping compositions and method for using same |
| US6258294B1 (en) * | 1997-10-01 | 2001-07-10 | Morton International, Inc. | Composition for stripping solder and tin from printed circuit boards |
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