CN115107360A - Tin paste printing abnormal area positioning system and method based on grid clustering - Google Patents
Tin paste printing abnormal area positioning system and method based on grid clustering Download PDFInfo
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- CN115107360A CN115107360A CN202110286686.5A CN202110286686A CN115107360A CN 115107360 A CN115107360 A CN 115107360A CN 202110286686 A CN202110286686 A CN 202110286686A CN 115107360 A CN115107360 A CN 115107360A
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- 238000007639 printing Methods 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 24
- 230000002159 abnormal effect Effects 0.000 title claims description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title description 2
- 238000003466 welding Methods 0.000 claims abstract description 81
- 238000004458 analytical method Methods 0.000 claims abstract description 66
- 229910000679 solder Inorganic materials 0.000 claims description 104
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 11
- 230000010354 integration Effects 0.000 claims description 11
- 230000008676 import Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000011897 real-time detection Methods 0.000 description 3
- 238000003070 Statistical process control Methods 0.000 description 2
- 238000012351 Integrated analysis Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/0036—Devices for scanning or checking the printed matter for quality control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
An analysis device performs grid division on circuit board size information according to grid size information to generate a plurality of divided grids, when the total number of poor welding points is judged to be greater than or equal to a dense threshold value, the analysis device sets the corresponding divided grids as high-dense grids, and integrates the divided grids which are connected with each other and are the high-dense grids into respective poor welding point high-dense areas, so that the technical effect of positioning the poor welding points by integrating the poor welding point high-dense areas can be achieved.
Description
Technical Field
A system and a method for positioning an area, in particular to a system and a method for positioning an abnormal area of solder paste printing based on grid clustering.
Background
Solder paste printing is a key process of a surface-mount soldering technology production process, a statistical process control tool is mainly used for performing statistical process control when the quality of a printed product is evaluated currently, whether the process capability reaches the standard can be judged, but abnormity diagnosis cannot be performed on solder paste printing detection only according to a control chart, namely, a region with poor solder spots concentrated cannot be obtained.
For the solder paste printing unqualified product, the position information and other detection information of the bad welding point can be obtained only from the equipment, and the bad area cannot be covered.
In summary, it is known that the problem of detecting bad solder joints in the circuit board in the prior art has existed for a long time that only bad solder joints can be detected and no regional integrated analysis of bad solder joints is provided, and therefore, it is necessary to provide improved technical means to solve the problem.
Disclosure of Invention
In view of the problem that the prior art only can detect each bad welding point in the detection of the bad welding points in the existing circuit board and does not have the regional integration analysis of the bad welding points, the invention discloses a grid clustering-based solder paste printing abnormal region positioning system and a method thereof, wherein:
the invention discloses a solder paste printing abnormal area positioning system based on grid clustering, which comprises: solder paste detection machine and analytical equipment, analytical equipment further includes: the device comprises a receiving module, a grid generating module, a grid attribution module, a bad welding spot counting module, a grid setting module and a region integration module.
The receiving module of the analysis device is used for receiving the circuit board size information and the at least one bad welding point position information of the detected circuit board from the solder paste detector; the grid generating module of the analysis device is used for carrying out grid division on the circuit board size information according to the grid size information to generate a plurality of divided grids; the grid attribution module of the analysis device is used for attributing the position information of at least one bad welding point to one of the generated divided grids correspondingly; the bad welding spot counting module of the analysis device is used for counting the total number of the bad welding spots attributed to each divided grid; the grid setting module of the analysis device is used for setting the corresponding divided grids as high-density grids when the total number of the bad welding spots is judged to be greater than or equal to the density threshold value; the area integration module of the analysis device is used for judging whether the adjacent divided grids of each high-density grid are high-density grids or not, and integrating all the adjacent high-density grids into at least one bad welding point high-density area according to the minimum description length principle so as to find out all the bad welding point high-density areas.
The invention discloses a method for positioning an abnormal area of solder paste printing based on grid clustering, which comprises the following steps:
firstly, a solder paste detection machine carries out real-time detection on the circuit board provided with solder paste by a solder paste printer so as to detect position information of at least one bad solder joint on the circuit board; then, the analysis device receives the circuit board dimension information and at least one bad welding point position information of the detected circuit board from the solder paste detector; then, the analysis device performs grid division on the circuit board size information according to the grid size information to generate a plurality of divided grids; then, the analysis device correspondingly attributes the position information of at least one bad welding spot to one of the generated plurality of divided grids; then, the analysis device counts the total number of the bad welding spots attributed to each divided grid; then, when the total number of the bad welding spots is judged to be larger than or equal to the dense threshold value, the analysis device sets the corresponding divided grids as high-dense grids; and finally, judging whether the adjacent divided grids of each high-density grid are high-density grids by an analysis device, and integrating all the adjacent high-density grids into at least one bad welding point high-density area according to the minimum description length principle so as to find out all the bad welding point high-density areas.
The system and the method disclosed by the invention have the difference from the prior art that the analysis device performs grid division on the circuit board size information according to the grid size information to generate a plurality of divided grids, when the total number of the bad welding points is judged to be more than or equal to the dense threshold value, the analysis device sets the corresponding divided grids as high-dense grids, and the analysis device integrates the divided grids which are mutually connected and are the high-dense grids into respective high-dense areas of the bad welding points so as to quickly and intuitively position the bad welding points.
Through the technical means, the invention can achieve the technical effect of providing the positioning of the bad welding spots by integrating the high-density areas of the bad welding spots.
Drawings
FIG. 1 is a block diagram of a system for locating abnormal areas in solder paste printing based on grid clustering according to the present invention.
FIG. 2 is a schematic view of grid division for positioning abnormal solder paste printing areas based on grid clustering according to the present invention.
FIG. 3 is a schematic diagram of a grid cluster-based high-density grid for locating abnormal areas in solder paste printing.
FIG. 4 is a schematic diagram showing a high-density area of bad solder joints in the abnormal area location of solder paste printing based on grid clustering according to the present invention.
FIG. 5 is a flowchart illustrating a method for locating abnormal areas in solder paste printing based on grid clustering according to the present invention.
Description of reference numerals:
10 solder paste detector
20 analysis device
21 receiving module
Grid generating Module
23 mesh attribution module
24 poor welding spot counting module
25 mesh setting module
26 regional integration Module
41 dividing grid
416 sixth division grid
4119 dividing the grid into nineteenth grid
4120 twentieth division of the grid
4121 the twenty-first division grid
4133 thirty-third division grid
4134 thirty-fourth division grid
4135 thirty-fifth division of the grid
4136 thirty-sixth division grid
4148 forty-eighth division grid
4149 the forty-ninth division grid
4164 sixty-fourth division grid
4177 seventy-seventh division grid
4178 seventy-eighth division grid
4179 seventy-ninth division grid
4192 the ninety second division grid
421 first bad solder joint position information
51 high dense area of first bad solder joint
52 high dense area of second bad solder point
101, the solder paste detection machine carries out real-time detection on the circuit board provided with the solder paste by the solder paste printer so as to detect the position information of at least one bad solder joint on the circuit board
102, the analysis device receives the circuit board dimension information and at least one bad welding point position information of the detected circuit board from the solder paste detection machine
104, the analysis device correspondingly assigns the position information of the at least one bad welding spot to one of the generated plurality of divided grids
105, the analysis device counts the total number of the bad welding spots attributed to each divided grid
106, when the total number of the bad welding spots is judged to be more than or equal to the dense threshold value, the analysis device sets the corresponding divided grids as the high-dense grids
Detailed Description
The embodiments of the present invention will be described in detail with reference to the drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present invention can be fully understood and implemented.
The following description will first describe the system for locating abnormal solder paste printing areas based on grid clustering, and please refer to fig. 1, where fig. 1 is a block diagram of the system for locating abnormal solder paste printing areas based on grid clustering.
The invention discloses a solder paste printing abnormal area positioning system based on grid clustering, which comprises: the solder paste tester 10 and the analyzer 20, the analyzer 20 further includes: the system comprises a receiving module 21, a grid generating module 22, a grid attributing module 23, a bad welding spot counting module 24, a grid setting module 25 and an area integrating module 26.
The solder paste is arranged at a specific position in the circuit board by the solder paste printer, the circuit board with the solder paste arranged by the solder paste detector 10 is detected in real time to detect the position information of at least one bad solder joint on the circuit board, when the circuit board is detected in real time by the solder paste detector 10, basic information about the circuit board, that is, the circuit board dimension information of the circuit board, is loaded, the solder paste tester 10 may pre-store the basic information about the circuit board, when the solder paste tester 10 tests the corresponding circuit board, the circuit board dimension information of the circuit board is obtained according to the basic information related to the loaded circuit board, or when the solder paste tester 10 tests the circuit board in real time, the circuit board size information of the circuit board is obtained by image recognition, which is only an example and is not intended to limit the application scope of the present invention.
The analyzer 20 and the solder paste tester 10 are connected by a wired transmission method or a wireless transmission method, for example: cable networks, fiber networks …, and the like, the wireless transmission methods are, for example: Wi-Fi, mobile communication network (e.g., 3G, 4G, 5G …, etc.) …, etc., which are only used for illustration and are not intended to limit the scope of the invention.
The receiving module 21 of the analyzing apparatus 20 can receive the circuit board dimension information of the circuit board to be tested and the position information of at least one bad solder joint from the solder paste tester 10, specifically, the circuit board dimension information of the circuit board is, for example: 675 times 625, 550 times 350 …, etc., and the defective welding spot position information, i.e., the coordinate point information, is, for example: (123,456), (343,543), …, etc., are merely illustrative and are not intended to limit the scope of the invention.
Then, the grid generating module 22 of the analyzing apparatus 20 performs grid division on the circuit board size information according to the grid size information to generate a plurality of divided grids, where the grid size information includes, for example: 50 by 50, i.e. the size of a grid is 50 by 50; 100 by 50, i.e. the size of a grid is 100 by 50; it can be understood from the above examples that the length and width of the grid dimension information may be the same or different values, and the grid dimension information may be preset in the analysis device 20, or the analysis device 20 receives the grid dimension information from an external device through a wired transmission manner or a wireless transmission manner, which is only an example and is not limited to the application scope of the present invention.
Specifically, assuming that the circuit board size information of the circuit board is 700 times 650, and the grid size information 50 times 50, the grid generating module 22 of the analyzing apparatus 20 can divide the circuit board into 14 times 13 times 182 grids of the divided grid 41, which is only for illustration and is not intended to limit the application scope of the present invention, the schematic diagram of the divided grid 41 is shown in fig. 2, and fig. 2 is a schematic diagram of the divided grid for positioning the abnormal solder paste printing area based on grid clustering according to the present invention.
After the grid generating module 22 of the analyzing apparatus 20 grids the circuit board size information in accordance with the grid size information to generate a plurality of divided grids, the grid attribution module 23 of the analysis device 20 may correspondingly attribute the at least one bad solder joint position information to one of the generated plurality of divided grids, specifically, assuming that the first bad solder joint position information 421 is (275,75), the grid range of the twentieth divided grid 4120 is between the pixel coordinate ranges of (251,51), (301,51), (251,100) and (301,100), the first bad solder joint location information 421 is (275,75) that is located within the grid range of the twentieth divided grid 4120, so the grid attribution module 23 of the analysis apparatus 20 correspondingly attributes the first bad solder joint location information 421 to the twentieth divided grid 4120, which is only for illustration and is not intended to limit the application scope of the present invention.
After the grid attribution module 23 of the analysis device 20 is able to correspondingly attribute all the bad solder joint position information to one of the generated divided grids, the bad solder joint counting module 24 of the analysis device 20 is configured to count the total number of the bad solder joints attributed in each divided grid, specifically, assuming that the grid range of the twentieth divided grid 4120 is attributed with 20 bad solder joint position information, the bad solder joint counting module 24 of the analysis device 20 is able to count the total number of the bad solder joints attributed in the twentieth divided grid 4120 as 20; assuming that the grid range of the thirty-fourth divided grid 4134 is attributed to 35 bad solder joint position information, the bad solder joint counting module 24 of the analysis device 20 can count that the total number of the bad solder joints attributed in the thirty-fourth divided grid 4134 is 35; assuming that the grid range of the thirty-fifth divided grid 4135 is attributed to the position information of 23 bad welding spots, the bad welding spot counting module 24 of the analysis device 20 can count that the total number of the bad welding spots attributed in the thirty-fifth divided grid 4135 is 23; the above description is only illustrative, and not intended to limit the scope of the present invention.
After the bad solder joint counting module 24 of the analysis device 20 counts the number of bad solder joints attributed in each divided grid, the grid setting module 25 of the analysis device 20 is configured to set the corresponding divided grid as a high-density grid when determining that the number of bad solder joints is greater than or equal to the density threshold, and it should be noted that the density threshold may be preset in the analysis device 20, or the analysis device 20 receives the density threshold from an external device through a wired transmission manner or a wireless transmission manner, which is only for illustration and is not limited to the application scope of the present invention.
Specifically, assuming that the dense threshold is 15, the bad solder joint counting module 24 of the analysis device 20 counts that the total number of bad solder joints attributed to the twentieth divided grid 4120 is greater than the dense threshold of 15, and the grid setting module 25 of the analysis device 20 may set the twentieth divided grid 4120 as the high dense grid; the bad solder joint counting module 24 of the analysis device 20 counts that the total number of the bad solder joints attributed to the thirty-fourth divided grid 4134 is 35 and is greater than the dense threshold value of 15, and the grid setting module 25 of the analysis device 20 can set the thirty-fourth divided grid 4134 as a high dense grid; the bad solder joint counting module 24 of the analysis device 20 counts that the total number of the bad solder joints attributed to the thirty-fifth divided grid 4135 is greater than the dense threshold value of 15, and the grid setting module 25 of the analysis device 20 can set the thirty-fifth divided grid 4135 as a high dense grid; the bad solder joint counting module 24 of the analysis device 20 counts that the total number of the bad solder joints attributed to the seventy-eighth divided grid 4178 is 30 and is greater than the dense threshold value of 15, and the grid setting module 25 of the analysis device 20 can set the seventy-eighth divided grid 4178 as a high dense grid; referring to fig. 3, fig. 3 is a schematic diagram of the high-density grid for positioning the abnormal region of solder paste printing based on grid clustering according to the present invention, and the high-density grid is only illustrated in a dot filling manner in fig. 3, which is not limited by the present invention, and the high-density grid may also be illustrated in a color manner, a diagonal filling manner …, and the "fig. 3" is an illustration of a part of the divided grid taken out in fig. 2.
After the grid setting module 25 of the analysis device 20 sets the division grids corresponding to the dense threshold value, which is determined that the total number of the bad welding points is greater than or equal to the total number of the bad welding points, as the high-dense grids, the area integration module 26 of the analysis device 20 is used for determining whether each division grid adjacent to the high-dense grid is the high-dense grid, and then integrating all the adjacent high-dense grids into at least one bad welding point high-dense area according to the minimum description length principle, so as to find out all the bad welding point high-dense areas.
Referring to fig. 3 and fig. 4, fig. 4 is a schematic diagram of a high-density area of bad solder joints positioned in an abnormal solder paste printing area based on grid clustering according to the present invention.
The region integration module 26 of the analysis device 20 determines that the divided grids adjacent to the twentieth divided grid 4120 are the sixth divided grid 416, the nineteenth divided grid 4119, the twenty-first divided grid 4121, and the thirty-fourth divided grid 4134 in the thirty-fourth divided grid 4134, respectively, to be the high-density grid; judging that the divided grids adjacent to the thirty-fourth divided grid 4134 are the twentieth divided grid 4120, the thirty-third divided grid 4133, the thirty-fifth divided grid 4135, and the twentieth divided grid 4120 and the thirty-fifth divided grid 4135 in the forty-eighth divided grid 4148 as the high-density grid, respectively; judging that the divided grids adjacent to the thirty-fifth divided grid 4135 are the twenty-first divided grid 4121, the thirty-fourth divided grid 4134, the thirty-sixth divided grid 4136, and the thirty-fourth divided grid 4134 in the forty-ninth divided grid 4149, respectively, as the high-density grid; and determining that the divided grids adjacent to the seventy-eighth divided grid 4178 are not highly dense grids of the sixty-fourth divided grid 4164, the seventy-seventh divided grid 4177, the seventy-ninth divided grid 4179, and the ninety-second divided grid 4192, respectively.
The area integration module 26 of the analysis device 20 integrates all the adjacent high-density grids, namely the twentieth, thirty-fourth and thirty-fifth divided grids 4120, 4134 and 4135, into the first defective welding point high-density area 51 according to the minimum description length principle, and the area integration module 26 of the analysis device 20 integrates the high-density grid, namely the seventy-eighth divided grid 4178, into the second defective welding point high-density area 52 according to the minimum description length principle, so that the area integration module 26 of the analysis device 20 can find out that all the defective welding point high-density areas are the first defective welding point high-density area 51 and the second defective welding point high-density area 52, and the schematic reference of the first defective welding point high-density area 51 and the second defective welding point high-density area 52 is shown in "fig. 4", and in "fig. 4" the first defective welding point high-density area 51 and the second defective welding point high-density area 52 are only filled with oblique lines, the first bad welding point high-density area 51 and the second bad welding point high-density area 52 are different in oblique line direction and are used for distinguishing different bad welding point high-density areas, the present invention is not limited to this, the first bad welding point high-density area 51 and the second bad welding point high-density area 52 can be indicated by a color mode, a dot filling mode …, etc., and "fig. 4" is an indication of a part of the divided grid in fig. 2.
Next, the operation method of the present invention will be described below, and please refer to fig. 5, where fig. 5 is a flowchart illustrating the method for positioning abnormal areas in solder paste printing based on grid clustering according to the present invention.
Firstly, a solder paste detection machine carries out real-time detection on a circuit board provided with solder paste by a solder paste printer so as to detect position information of at least one bad solder joint on the circuit board (step 101); then, the analysis device receives the circuit board dimension information of the detected circuit board and at least one piece of bad welding point position information from the solder paste detection machine (step 102); then, the analysis device performs mesh division on the circuit board size information according to the mesh size information to generate a plurality of division meshes (step 103); then, the analysis device correspondingly attributes the position information of at least one bad welding point to one of the generated plurality of divided grids (step 104); then, the analyzing device counts the total number of the bad welding points which are attributed in each divided grid (step 105); then, when the total number of the bad welding spots is judged to be more than or equal to the dense threshold value, the analysis device sets the corresponding divided grids as high-dense grids (step 106); finally, the analysis device determines whether the divided grid adjacent to each high-density grid is a high-density grid, and integrates all adjacent high-density grids into at least one defective welding point high-density area according to the minimum description length principle, so as to find out all the defective welding point high-density areas (step 107).
In summary, it can be seen that the difference between the present invention and the prior art is that the analyzing device performs mesh division on the circuit board size information according to the mesh size information to generate a plurality of divided meshes, when it is determined that the total number of bad solder joints is greater than or equal to the dense threshold, the analyzing device sets the corresponding divided meshes as high-dense meshes, and the analyzing device integrates the divided meshes that are connected with each other and are the high-dense meshes into respective bad solder joint high-dense areas, thereby providing a quick and intuitive positioning of the bad solder joints.
The technical means can solve the problems that the detection of the bad welding spots in the existing circuit board in the prior art can only detect each bad welding spot and does not have the regional integration analysis of the bad welding spots, and further achieves the technical effect of providing the positioning of the bad welding spots by integrating the high-density regions of the bad welding spots.
Although the embodiments of the present invention have been disclosed, the disclosure is not intended to limit the scope of the invention. Workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the disclosure. The scope of the present invention is defined by the appended claims.
Claims (10)
1. A solder paste printing abnormal area positioning system based on grid clustering is characterized by comprising:
an analysis device, the analysis device further comprising:
the receiving module is used for receiving circuit board dimension information and at least one bad welding point position information of a detected circuit board from the solder paste detector;
the grid generating module is used for carrying out grid division on the circuit board size information according to grid size information so as to generate a plurality of divided grids;
the grid attribution module is used for correspondingly attributing the position information of the at least one bad welding point to one of the generated plurality of divided grids;
the bad welding spot counting module is used for counting the total number of the bad welding spots which are attributed in each divided grid;
the grid setting module is used for setting the corresponding divided grid as a high-density grid when judging that the total number of the bad welding spots is greater than or equal to a density threshold value; and
and the area integration module is used for judging whether the divided grids adjacent to each high-density grid are high-density grids or not, and integrating all the adjacent high-density grids into at least one bad welding point high-density area according to the minimum description length principle so as to find out all the bad welding point high-density areas.
2. The system of claim 1, wherein the solder paste tester imports basic information related to the circuit board, the basic information related to the circuit board includes dimension information of the circuit board, and the solder paste tester performs real-time testing after a solder paste printer performs solder paste placement on a specific location of the circuit board to detect location information of at least one bad solder joint on the circuit board.
3. The grid clustering-based solder paste printing abnormal area positioning system of claim 1, wherein the solder paste detection machine obtains the circuit board dimension information of the circuit board in an image recognition manner when detecting the circuit board in real time.
4. The solder paste printing abnormal area positioning system based on grid clustering of claim 1, wherein the grid generating module performs grid division on the circuit board size information according to the grid size information to generate a plurality of divided grids, the divided grids are divided according to pixel coordinates, each divided grid is in a rectangular shape, and the length size and the width size of the grid size information are the same value or different values.
5. The system of claim 1, wherein the threshold is preset in the analyzing device, or the analyzing device receives the threshold from an external device through a wired transmission method or a wireless transmission method.
6. A method for positioning an abnormal area of solder paste printing based on grid clustering is characterized by comprising the following steps:
an analysis device receives circuit board size information of a detected circuit board and position information of at least one bad welding spot from a solder paste detector;
the analysis device performs grid division on the circuit board size information according to grid size information to generate a plurality of divided grids;
the analysis device correspondingly attributes the at least one piece of poor welding point position information to one of the generated plurality of divided grids;
the analysis device counts the total number of the bad welding spots attributed to each divided grid;
when the total number of the bad welding spots is judged to be more than or equal to a dense threshold value, the analysis device sets the corresponding divided grids as high-dense grids;
the analysis device judges whether the divided grids adjacent to each high-density grid are high-density grids or not, and integrates all adjacent high-density grids into at least one poor welding point high-density area according to the minimum description length principle so as to find out all the poor welding point high-density areas.
7. The method of claim 6, wherein the solder paste tester imports basic information related to the circuit board, the basic information related to the circuit board includes dimension information of the circuit board, and the solder paste tester performs real-time testing after a solder paste printer performs solder paste placement on a specific location of the circuit board to detect location information of at least one bad solder joint on the circuit board.
8. The method of claim 6, wherein the circuit board dimension information of the circuit board is obtained by image recognition when the solder paste tester performs real-time testing on the circuit board.
9. The method of claim 6, wherein the step of the analyzing device meshing the circuit board size information according to the mesh size information to generate a plurality of meshes is performed according to pixel coordinates, each mesh is rectangular, and the length and width of the mesh size information are equal or different values.
10. The method of claim 6, wherein the threshold is preset in the analyzer, or the analyzer receives the threshold from an external device via a wired transmission method or a wireless transmission method.
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1609623A (en) * | 2003-10-24 | 2005-04-27 | 三井金属矿业株式会社 | Electric checkup apparatus and method for thin film carrying belt for mounting electronic elements |
| JP2009098123A (en) * | 2007-09-26 | 2009-05-07 | Toshiba Corp | Defect analyzer and defect analyzing method |
| JP2011191896A (en) * | 2010-03-12 | 2011-09-29 | Jsol Corp | Apparatus and method for generating mesh and computer program |
| TW201415971A (en) * | 2012-10-01 | 2014-04-16 | Lite On Electronics Guangzhou | Solder inspection and auto re-soldering system and method thereof |
| CN105196690A (en) * | 2015-09-06 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | SMT (surface mounting technology) welding technology and SMT stencil |
| CN107677949A (en) * | 2017-08-08 | 2018-02-09 | 上海交通大学 | Integrated circuit batch detector methods |
| CN109238586A (en) * | 2018-11-20 | 2019-01-18 | 汇德新创（天津）科技有限公司 | A kind of printed circuit board through-hole solder joint leak inductance device and detection method |
| CN109952019A (en) * | 2017-12-21 | 2019-06-28 | 株式会社高永科技 | Whether printed circuit board checking device, perception soldering paste abnormal method and computer can interpretation recording mediums |
| CN111421954A (en) * | 2019-01-10 | 2020-07-17 | 鸿富锦精密电子(天津)有限公司 | Intelligent judgment feedback method and device |
| CN111735850A (en) * | 2020-06-24 | 2020-10-02 | 哈尔滨工业大学 | Scanning type circuit board solder joint insufficient solder joint automatic detection system and detection method |
| CN112004629A (en) * | 2018-04-27 | 2020-11-27 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| US20220163461A1 (en) * | 2020-11-24 | 2022-05-26 | Inventec (Pudong) Technology Corporation | Defective Soldering Point Intensive Extent Analysis System For Solder Paste Inspection And Method Thereof |
-
2021
- 2021-03-17 CN CN202110286686.5A patent/CN115107360A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1609623A (en) * | 2003-10-24 | 2005-04-27 | 三井金属矿业株式会社 | Electric checkup apparatus and method for thin film carrying belt for mounting electronic elements |
| JP2009098123A (en) * | 2007-09-26 | 2009-05-07 | Toshiba Corp | Defect analyzer and defect analyzing method |
| JP2011191896A (en) * | 2010-03-12 | 2011-09-29 | Jsol Corp | Apparatus and method for generating mesh and computer program |
| TW201415971A (en) * | 2012-10-01 | 2014-04-16 | Lite On Electronics Guangzhou | Solder inspection and auto re-soldering system and method thereof |
| CN105196690A (en) * | 2015-09-06 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | SMT (surface mounting technology) welding technology and SMT stencil |
| CN107677949A (en) * | 2017-08-08 | 2018-02-09 | 上海交通大学 | Integrated circuit batch detector methods |
| CN109952019A (en) * | 2017-12-21 | 2019-06-28 | 株式会社高永科技 | Whether printed circuit board checking device, perception soldering paste abnormal method and computer can interpretation recording mediums |
| CN112004629A (en) * | 2018-04-27 | 2020-11-27 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| CN109238586A (en) * | 2018-11-20 | 2019-01-18 | 汇德新创（天津）科技有限公司 | A kind of printed circuit board through-hole solder joint leak inductance device and detection method |
| CN111421954A (en) * | 2019-01-10 | 2020-07-17 | 鸿富锦精密电子(天津)有限公司 | Intelligent judgment feedback method and device |
| CN111735850A (en) * | 2020-06-24 | 2020-10-02 | 哈尔滨工业大学 | Scanning type circuit board solder joint insufficient solder joint automatic detection system and detection method |
| US20220163461A1 (en) * | 2020-11-24 | 2022-05-26 | Inventec (Pudong) Technology Corporation | Defective Soldering Point Intensive Extent Analysis System For Solder Paste Inspection And Method Thereof |
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