CN115101487A

CN115101487A - Heat sink for dual in-line package integrated circuit and electrical device

Info

Publication number: CN115101487A
Application number: CN202210776923.0A
Authority: CN
Inventors: 王羿; 许孙龙; 孙亮; 吴洋; 邹鹏; 骆冬根
Original assignee: Hefei Institutes of Physical Science of CAS
Current assignee: Hefei Institutes of Physical Science of CAS
Priority date: 2022-07-04
Filing date: 2022-07-04
Publication date: 2022-09-23

Abstract

The invention provides a heat sink for a dual in-line package integrated circuit and an electric device, which can efficiently dissipate heat with a small volume. The heat sink of the dual in-line package integrated circuit (10) of the present invention comprises: an upper heat-conducting plate (40) in surface contact with a top surface of the dual in-line package integrated circuit (10); a lower heat-conducting plate (30) disposed between the bottom surface of the dual in-line package integrated circuit (10) and the printed circuit board (20); and a circuit board outer frame (50) which is in surface contact with the upper heat conducting plate (40) and the lower heat conducting plate (30) and is used as a shell of the printed circuit board (20), wherein heat generated during the operation of the dual in-line package integrated circuit is transferred to the circuit board outer frame through the upper heat conducting plate and the lower heat conducting plate.

Description

Heat sink for dual in-line package integrated circuit and electrical device

Technical Field

The present invention relates to a heat sink for dissipating heat from a dual in-line package integrated circuit, and an electric device having the dual in-line package integrated circuit and the heat sink.

Background

In the prior art, there are four devices for dissipating heat from an integrated circuit, namely, a semiconductor cooling device, a fin passive heat dissipation device, a fan heat dissipation device, and a case flange heat dissipation device. The semiconductor refrigeration device is a device for absorbing and releasing heat by utilizing the Peltier property of a semiconductor element, a fin passive heat dissipation device is a device for dissipating heat by air passing through dense fins, a fan heat dissipation device is a heat dissipation device for dissipating heat by generating airflow through a fan, and a shell flange heat dissipation device is a heat dissipation device for forming a flange on a shell of an integrated circuit and using the flange as a heat dissipation fin.

Among the four heat dissipation devices, the semiconductor refrigeration device needs to provide extra energy to realize heat dissipation, and the fin passive heat dissipation device and the fan heat dissipation device both need air to dissipate heat, wherein the fin passive heat dissipation device has a large volume, the fan heat dissipation device has a large volume and needs to provide extra energy, the shell flange heat dissipation device is usually adopted by a power supply integrated circuit or a module, and a flange is formed to be large in order to improve the heat dissipation efficiency, so that the integrated circuit or the module using the flange to dissipate heat has a large appearance.

Disclosure of Invention

Technical problem to be solved by the invention

Dual in-line packaging is a common packaging approach for integrated circuits. For a high-power dual in-line package integrated circuit with power exceeding 1W, the use requirement cannot be met only by radiating through pins of the integrated circuit, and the high-power dual in-line package integrated circuit has the risk of burning due to overhigh temperature, so that a radiating device needs to be additionally arranged for radiating.

The four heat dissipation devices either need to provide extra energy to realize heat dissipation or have a large volume, and any one of the four heat dissipation devices is adopted by a high-power dual in-line package integrated circuit, so that the problems of increased energy consumption and/or increased volume exist.

Therefore, the invention provides a heat dissipation device of a dual in-line package integrated circuit, which not only does not consume extra energy, but also can realize higher heat dissipation efficiency with smaller volume.

Technical scheme for solving technical problem

A heat sink for a printed circuit board mounted dual in-line package integrated circuit according to a first aspect of the present invention includes: an upper thermal plate in surface contact with a top surface of the dual in-line package integrated circuit; a lower heat conducting plate disposed between the bottom surface of the dual in-line package integrated circuit and the printed circuit board; and a circuit board outer frame which is in surface contact with the upper heat conducting plate and the lower heat conducting plate and is used as a shell of the printed circuit board, wherein heat generated during the operation of the dual in-line package integrated circuit is transferred to the circuit board outer frame through the upper heat conducting plate and the lower heat conducting plate.

A heat sink for an ic of a second aspect of the present invention is the heat sink for an ic of a first aspect, wherein a heat conductive pad is attached or coated with silicone rubber between the ic and the upper and lower heat conductive plates and between the circuit board outer frame and the upper and lower heat conductive plates.

A heat sink for a dip ic according to a third aspect of the present invention is the heat sink for a dip ic according to the first aspect, wherein the upper heat conductive plate covers the entire top surface of the dip ic, and the lower heat conductive plate covers the entire area between two rows of pins of the dip ic.

A heat sink for a dip integrated circuit according to a fourth aspect of the present invention is the heat sink for a dip integrated circuit according to the first aspect, wherein the dip integrated circuit is a high-power dip integrated circuit having a power of 1W or more.

A heat sink for a dip integrated circuit according to a fifth aspect of the present invention is the heat sink for a dip integrated circuit according to the first aspect, wherein the upper heat transfer plate and the lower heat transfer plate are made of copper or aluminum.

In addition, according to a sixth aspect of the present invention, there is provided an electrical device formed by laminating a plurality of printed circuit boards, comprising: a printed circuit board having a dual in-line package integrated circuit mounted thereon, wherein the heat sink of the dual in-line package integrated circuit according to claim 1 is provided, the circuit board outer frame of each layer of the printed circuit board is fixedly connected to form a housing of the electrical device, and heat generated during operation of the dual in-line package integrated circuit is transferred to the housing formed by the circuit board outer frame via the upper heat-conducting plate and the lower heat-conducting plate corresponding to the dual in-line package integrated circuit.

A seventh aspect of the present invention is the electrical equipment according to the sixth aspect, wherein a hole through which a long screw is passed is formed at a predetermined position of the circuit board outer frame of each of the printed circuit boards, the long screw is passed through the circuit board outer frame of each of the printed circuit boards to connect and fix the printed circuit boards together, stepped structures are formed at a top end and a bottom end of a wall constituting the circuit board outer frame, respectively, and when a plurality of the printed circuit boards are stacked, the stepped structure of the circuit board outer frame of any one of the printed circuit boards is matched with the stepped structures of the circuit board outer frames of the printed circuit boards of the previous and next layers thereof, so that the printed circuit boards are stacked on a straight line.

An electrical device according to an eighth aspect of the present invention is the electrical device according to the sixth aspect, wherein an electrical connector for electrical connection with the printed circuit boards of the other layers is formed on each of the printed circuit boards.

An electric apparatus according to a ninth aspect of the present invention is the electric apparatus according to the eighth aspect, wherein a guide post for positioning and electrically connecting the electric connector of the printed circuit board in an adjacent layer is formed on a back surface portion of the printed circuit board corresponding to a portion where the electric connector is formed.

Advantageous effects

The heat sink of the dual in-line package integrated circuit can efficiently transfer the heat of the dual in-line package integrated circuit to the circuit board outer frame of the printed circuit board, not only does not consume extra energy, but also can realize higher heat dissipation efficiency with smaller volume. In an electric apparatus formed by laminating a plurality of printed circuit boards, the heat of the dual in-line package integrated circuit on each printed circuit board can be transferred to a case of the electric apparatus to be radiated, and high radiation efficiency can be realized with a small volume.

Drawings

FIG. 1 is a schematic diagram illustrating a dual in-line package integrated circuit.

Fig. 2 is a schematic diagram showing a heat sink for a dual in-line package integrated circuit.

Fig. 3 is a schematic view showing an electric device composed of a printed circuit board and a double-layer outer frame thereof.

Fig. 4 is a plan view of the lower heat-conducting plate when the dip package ic is not mounted.

Fig. 5 is a plan view of the lower heat transfer plate when the dip package integrated circuit is mounted.

Fig. 6 is a real view of the upper heat transfer plate as viewed from the back.

Fig. 7 is a plan view of the upper heat transfer plate mounted thereon.

Detailed Description

The following describes a specific embodiment of the present invention with reference to the drawings.

In the following embodiments, when a number or the like (including a number, a numerical value, an amount, a range, and the like) of an element is referred to, the number is not limited to a specific number unless specifically stated or clearly limited to the specific number in principle, and may be equal to or greater than the specific number.

In the following embodiments, the structural elements are not necessarily essential unless explicitly stated otherwise or clearly understood as essential in principle, and elements not explicitly mentioned in the description may be included, which is not necessarily to be construed.

Description of the preferred embodiment

FIG. 1 is a schematic diagram illustrating a dual in-line package integrated circuit. As shown in fig. 1, the dual in-line package integrated circuit 10 includes an integrated circuit body 11 having a rectangular parallelepiped shape and two rows of pins 12 extending from edges of two long sides on one surface of the integrated circuit body 11, the two rows of pins 12 being symmetrically arranged. The number of pins 12 shown in fig. 1 is 15 per row, for a total of 30, but the number of pins 12 is not limited to this, and differs depending on the integrated circuit.

Fig. 2 is a schematic diagram illustrating a heat dissipation device for the dual in-line package integrated circuit 10. This figure is a cross-sectional view of the heat sink taken from substantially the center of the dual in-line package integrated circuit 10 along the direction of the array of the two rows of pins 12 of the dual in-line package integrated circuit 10.

As shown in fig. 2, the dual in-line packaged integrated circuit 10 is mounted on the printed circuit board 20 via the lower heat-conducting plate 30. The lower heat conduction plate 30 includes a heat conduction portion 31 in a flat plate shape, a connection portion 32 vertically extending from one end of the heat conduction portion 31, and a protruding portion 33 horizontally protruding from an extended top of the connection portion 32.

The thermal conductor 31 is mounted between the dual in-line package integrated circuit 10 and the printed circuit board 20, specifically, between the printed circuit board 20 and a region between two rows of pins 12 of the dual in-line package integrated circuit 10. In order to efficiently transfer heat from the dual in-line package integrated circuit 10, the lower thermally conductive plate 30 preferably covers the entire area between the two rows of pins 12 of the dual in-line package integrated circuit 10. Gaps are provided between the thermal conductor 31 and the dual in-line package integrated circuit 10 and between the thermal conductor 31 and the printed circuit board 20, which are actually adhered via a thermal pad or silicone rubber, as shown in fig. 2. That is, a thermal pad is provided between the thermal conduction portion 31 and the dual in-line package integrated circuit 10 or silicone rubber is coated, so that heat from the dual in-line package integrated circuit 10 can be transmitted to the thermal conduction portion 31 via the thermal pad or silicone rubber.

The connecting portion 32 serves to connect the heat conduction portion 31 and the protruding portion 33, and is formed at right angles to both the heat conduction portion 31 and the protruding portion 33 in fig. 2. However, the angle formed by the connection portion 32, the heat conduction portion 31, and the extension portion 33 is not limited to a right angle, and the angle formed therebetween may be matched to the shape of the circuit board frame 50 described later, and the connection portion 32 and the extension portion 33 can be brought into close contact with the circuit board frame 50 by the matching, thereby performing better heat transfer. Also, the connection portion 32 itself may be in contact with the circuit board outer frame 50. The circuit board outer frame 50 is a metal frame that modularizes the printed circuit board 20 to form a housing of the printed circuit board 20.

The protruding portion 33 is in surface contact with the circuit board frame 50, and is used for transferring heat generated during the operation of the dual in-line package integrated circuit 10 to the circuit board frame 50 and dissipating the heat from the circuit board frame 50 to the outside. The contact of the protruding portion 33 with the circuit board outer frame 50 may be via a thermal pad or silicone rubber.

The heat-conducting portion 31, the connecting portion 32, and the extending portion 33 can be used for heat transfer, and therefore, they are made of a material having high heat conductivity, for example, a metal such as aluminum or copper. Also, for ease of production, it is preferable that the heat conduction portion 31, the connection portion 32, and the extension portion 33 be integrally formed of the same material. Of course, they may be made of different materials as long as they are both materials having good thermal conductivity.

The lower heat-conducting plate 30 can be attached by screwing, for example. For example, holes for passing bolts may be formed in the extension 33 of the lower heat conductive plate 30, and screw holes matching the threads of the bolts or nuts may be additionally provided at corresponding positions of the circuit board outer frame 50. The bolt passes through the extension 33 and is screwed into a screw hole of the circuit board frame 50 or a nut provided separately, thereby fixing the extension 33 to the circuit board frame 50. On the opposite side of the heat-conducting portion 31 from the protruding portion 33, a hole for passing a bolt is also formed, and a screw hole matching the thread of the bolt or a nut is additionally provided at a corresponding position of the printed circuit board 20. The bolt passes through the heat conduction portion 31 and is screwed into a screw hole of the printed circuit board 20 or a nut provided separately, thereby fixing the heat conduction portion 31 to the printed circuit board 20. The lower heat conduction plate 30 can be stably installed by fixing from two positions of the lower heat conduction plate 30. Of course, the lower heat transfer plate 30 may be attached not only by screwing but also by bonding or the like, and may be attached by combining a plurality of fixing methods.

The upper surface of the dual in-line package integrated circuit 10 is covered with an upper heat conductive plate 40, and in order to efficiently transfer the heat of the dual in-line package integrated circuit 10, the upper heat conductive plate 40 preferably covers the entire upper surface of the dual in-line package integrated circuit 10. The upper heat conduction plate 40 includes a heat conduction portion 41 having a flat plate shape and a connection portion 42 vertically extending from one end of the heat conduction portion 41.

The area of the heat conduction portion 41 is preferably equal to or larger than the area of the top surface of the dual in-line package integrated circuit 10, so that the heat conduction portion 41 can contact the entire top surface of the dual in-line package integrated circuit 10, and if the area of the heat conduction portion 41 is too large, the volume of the entire heat sink increases, and therefore the area of the heat conduction portion 41 is preferably equal to the area of the top surface of the dual in-line package integrated circuit 10. As in the case of the lower heat-conducting plate 30, the heat-conducting portion 41 shown in fig. 2 has a gap with the dip-in package integrated circuit 10, and in fact, they are closely attached via a heat-conducting pad or silicone rubber. That is, a thermal pad is provided between the thermal conduction portion 41 and the dual in-line package integrated circuit 10 or silicon rubber is coated, so that heat from the dual in-line package integrated circuit 10 can be transmitted to the thermal conduction portion 41 via the thermal pad or the silicon rubber.

The connection portion 42 serves to connect the heat conduction portion 41 and the circuit board frame 50 so that heat transferred from the heat conduction portion 41 can be transferred to the circuit board frame 50 via the connection portion 42. For convenience of illustration, the shape of the connection portion 42 shown in fig. 2 is a rectangle and the short side of the rectangle is in contact with the circuit board outer frame 50, but in order to enhance the effect of heat transfer, the contact area of the connection portion 42 and the circuit board outer frame 50 is preferably large. That is, the connection portion 42 is preferably a flat sheet, one surface of which is connected to the heat conduction portion 41 and the other surface of which is connected to the circuit board frame 50. The contact between the connection portion 42 and the circuit board frame 50 may be made via a thermal pad or silicone rubber.

As with the lower heat-conducting plate 30, the heat-conducting portion 41 and the connecting portion 42 of the upper heat-conducting plate 40 are each made of a material having good heat conductivity, and may be made of a metal such as aluminum or copper. Also, for ease of production, it is preferable that the heat conduction portion 41 and the connection portion 42 be integrally formed of the same material. Of course, they may be made of different materials as long as they are both materials having good thermal conductivity.

The upper heat-conducting plate 40 can also be mounted by screwing. For example, a plurality of holes for passing bolts are formed at the edge of the heat conductive part 41 of the upper heat conductive plate 30, and screw holes matching the threads of the bolts or nuts are additionally provided at the corresponding positions of the circuit board outer frame 50 and the printed circuit board 20. The bolts pass through the heat conduction part 41 and are screwed into nuts separately provided in screw holes of the circuit board frame 50 and the printed circuit board 20, thereby fixing the heat conduction part 41 to the circuit board frame 50 and the printed circuit board 20. Holes for passing the bolts are also formed in the connecting portions 42, and screw holes matching the threads of the bolts are additionally provided in corresponding positions of the printed circuit board 20. The bolts pass through the connection portions 42 and are screwed into screw holes of the circuit board frame 50 or into nuts provided separately, thereby fixing the connection portions 42 to the circuit board frame 50. The lower heat-conducting plate 30 can be stably mounted by fixing from a plurality of positions of the upper heat-conducting plate 40. Since the upper heat conductive plate 40 has a large area, in order to firmly fix the upper heat conductive plate 40 and prevent it from being tilted, screw-fixing is performed at a plurality of places. The number of the fixing portions is not limited as long as the upper heat conductive plate 40 can be stably fixed and prevented from being tilted. The upper heat transfer plate 40 is not limited to being screwed, and may be attached by means of adhesion or the like, or may be attached by a combination of a plurality of fixing means.

In the example shown in fig. 2, the lower heat conductive plate 30 is divided into the heat conductive portion 31, the connection portion 32 and the extension portion 33, and the upper heat conductive plate 40 is divided into the heat conductive portion 41 and the connection portion 42, but actually, the lower heat conductive plate 30 and the upper heat conductive plate 40 are both integrally formed members, and as long as they have a portion in contact with the dip integrated circuit 10 and a portion in contact with the circuit board outer frame 50, they can achieve a function of transferring heat generated when the dip integrated circuit 10 operates to the circuit board outer frame 50, and are not limited to having or being divided into the heat conductive portion 31, the connection portion 32 and the extension portion 33, and the heat conductive portion 41 and the connection portion 42.

By constituting the heat sink as described above, the upper heat conductive plate 40 is brought into close contact with the top surface of the integrated circuit main body 11, transferring the heat of the integrated circuit main body 11 to the upper heat conductive plate 40. Since the upper heat conductive plate 40 is connected to the circuit board outer frame 50, heat can be transferred to the circuit board outer frame 50.

A heat conducting pad is arranged between the upper heat conducting plate 40 and the integrated circuit main body 11 or silicon rubber is coated on the heat conducting pad, so that on one hand, the contact thermal resistance is reduced, on the other hand, the integrated circuit main body 11 and the upper heat conducting plate 40 are buffered, and the dual in-line package integrated circuit 10 is prevented from being damaged due to relative movement of the integrated circuit main body and the upper heat conducting plate during vibration.

The lower heat-conducting plate 30 is mounted on the "belly" of the dual in-line package integrated circuit 10, i.e., between two rows of pins 12, and is capable of transferring heat of the integrated circuit main body 11 to the lower heat-conducting plate 30. Since the lower heat conductive plate 30 is coupled to the circuit board outer frame 50, heat can be transferred to the circuit board outer frame 50.

Thermal conductive pads or silicone rubber is mounted on the contact surfaces of the lower thermal conductive plate 30 with the printed circuit board 20 and the contact surfaces with the integrated circuit main body 11, so that the contact thermal resistance is reduced.

In addition, the contact surfaces of the upper and lower heat-conducting

plates

40 and 30 and the circuit board outer frame 50 are coated with silicon rubber, so that the thermal resistance can be reduced.

The heat dissipation structure of the dual in-line package integrated circuit 10 on the single-layered printed circuit board 20 is described above. In order to provide a satisfactory electronic device, a plurality of different printed circuit boards 20 are often required, each printed circuit board 20 having a relatively independent function. In order to integrate these different printed circuit boards 20 together, they are usually modularized separately, and the modularized printed circuit boards 20 are stacked and combined into one electronic device by adding a cover plate and a connection screw. In the modularization, the printed circuit board 20, the electrical connector, and the guide post are fixed to a circuit board frame 50 having a predetermined size and a predetermined shape to form a module.

An example of the electronic device 100 configured by stacking a plurality of modularized printed circuit boards 20 will be described below.

As shown in fig. 3, the electric apparatus 100 has 3-layer modules, an upper layer module 101, a middle layer module 102, and a lower layer module 103, respectively, the modules of the layers including a circuit board housing 50 and a printed circuit board 20 mounted in the circuit board housing 50. The printed circuit board 20 can be mounted in the circuit board frame 50 by screws, for example, and the modules of the respective layers can be connected and fixed to each other by a plurality of long screws passing through holes formed in the respective circuit board frames 50. The side walls of the periphery of the circuit board outer frame 50 are formed in a stepped structure, for example, the outer periphery of the side wall of the top surface of the circuit board outer frame 50 is formed higher and the inner periphery is formed lower, and accordingly, the outer periphery of the side wall of the bottom surface of the circuit board outer frame 50 is formed lower and the inner periphery is formed higher. In this way, when the two circuit board frames 50 are stacked together, the concave-convex structure of the side wall of the bottom surface of the circuit board frame 50 stacked above is matched with the concave-convex structure of the side wall of the top surface of the circuit board frame 50 stacked below, so that the respective modules can be stacked on a straight line, the contact area between the interfaces is increased, and the heat conduction efficiency can be improved.

Since the upper module 101, the middle module 102, and the lower module 103 shown in fig. 3 are in a stacked state, only the case of the upper module 101 is shown in fig. 3. Hereinafter, the description will be given only by taking the upper module 101 as an example, and the middle module 102 and the lower module 103 have the same structure as the upper module 101.

One printed circuit board 20 is mounted in the upper module 101, and an electrical connector 110 for electrical connection with the modules of the other layers is mounted on the printed circuit board 20. To facilitate the aligned mounting of the modules together, guide posts 111 are formed at a rear portion of the printed circuit board 20 corresponding to a portion where the electrical connector 110 is mounted. In the example of fig. 3, 2 electrical connectors 110 are provided at the center of the upper module 101 in the short direction, and 1 guide post 111 is provided at each of 4 ends of the 2 electrical connectors 110. The guide posts 111 of the upper module 101 are used to position and electrically connect the electrical connectors of the middle module 102.

The number of layers of the electrical device 100, the number of the electrical connectors 110 and the number and the arrangement positions of the guide posts 111 are not limited to those shown in fig. 3. For example, the number of layers of the electrical device 100 may be any number of layers of 2 or more, one electrical connector 110 may be provided along the edge of the circuit board frame 50, one guide post 111 may be provided at each of the four corners of the circuit board frame 50, and the number of layers of the electrical device 100, the number of the electrical connectors 110, and the number and the installation position of the guide posts 111 may be set as necessary.

At least one dual in-line package integrated circuit 10 is arranged on the printed circuit board 20 of the upper module 101, preferably at the edge of the printed circuit board 20. The upper and lower portions of the dip package integrated circuit 10 are respectively mounted with an upper heat conduction plate 40 and a lower heat conduction plate 30 shown in fig. 2, the upper heat conduction plate 40 includes a heat conduction part 41 having a flat plate shape and a connection part 42 vertically extending from one end of the heat conduction part 41, and the connection part 42 is in contact with a circuit board outer frame 50. The lower heat conduction plate 30 includes a heat conduction portion 31 having a flat plate shape, a connection portion 32 vertically extending from one end of the heat conduction portion 31, and an extension portion 33 horizontally extending from an extended top of the connection portion 32, and the connection portion 32 and the extension portion 33 are in contact with the circuit board outer frame 50.

By configuring the upper module 101 as described above, the heat of the dip package integrated circuit 10 can be transferred to the circuit board outer frame 50 through the upper heat transfer plate 40 and the lower heat transfer plate 30. In the upper module 101 shown in fig. 3, one dual in-line package integrated circuit 10 is disposed at each corner of the printed circuit board 20, and heat of the two dual in-line package integrated circuits 10 is directly transferred to the circuit board housing 50.

The middle module 102 and the lower module 103 include a circuit board housing 50 at the outer periphery and a printed circuit board 20 mounted in the circuit board housing 50, as in the upper module 101. However, the printed circuit boards 20 in the upper module 101, the middle module 102, and the lower module 103 may be printed circuit boards different from each other by function and device kind, in which the dual in-line package integrated circuit 10 is not necessarily provided. If the dual in-line package integrated circuit 10 is provided, the heat of the dual in-line package integrated circuit 10 can be transferred to the circuit board outer frame 50 via the upper heat conductive plate 40 and the lower heat conductive plate 30. If there is a printed circuit board 20 on which the dip integrated circuit 10 is not mounted, a heat dissipation structure including the upper heat conduction plate 40 and the lower heat conduction plate 30 may be used for a component having a large amount of heat generation in the printed circuit board 20 to dissipate the heat of the component. If there is no component with a large heat generation amount, the heat dissipation device may not be provided, and only the circuit board outer frame 50 may be provided for transferring and dissipating heat.

Accordingly, the heat of the components having a large heat generation amount, including the dual in-line package integrated circuit 10, on the printed circuit board 20 of each module of the entire electrical apparatus 100 can be transferred to the housing formed by the circuit board frame 50 of each module, and the heat can be radiated by the housing by heat radiation or heat transfer.

In the electrical apparatus 100 of the present invention, the heat generated by the components in the printed circuit board 20 of each layer of module can be transferred to the circuit board frame 50, and the circuit board frame 50 of each layer increases the contact area between the interfaces through the concave-convex structure, thereby forming a good heat spreading and heat conducting path and improving the heat conducting efficiency. That is, heat of the components inside the electric apparatus 100, particularly the dip ic, can be transferred to the case of the electric apparatus 100, and efficient heat dissipation is achieved. In addition, the modules of the respective layers of the electrical device 100 according to the present invention are connected and fixed by the long screws while being in contact with each other by the concave-convex structure of the circuit board frame 50, so that the strength and rigidity of the entire electrical device 100 can be ensured.

According to the heat dissipating apparatus of the dual in-line package integrated circuit 10, the heat of the dual in-line package integrated circuit 10 can be efficiently transferred to the circuit board frame 50 of the printed circuit board 20, and a high heat dissipating efficiency can be realized with a small volume without additional energy consumption. In the electric apparatus 100 configured by stacking a plurality of printed circuit boards 20, the heat of the dual in-line package integrated circuits 10 on the printed circuit boards 20 of the respective layers can be transferred to the housing of the electric apparatus 100 to be radiated, and high radiation efficiency can be realized with a small volume.

Examples

Specific embodiments of the present invention will be described below with reference to fig. 4 to 7.

As an example of the heat sink and the electric device to which the dip ic of the present invention is applied, there is a satellite-borne motor control device which is installed on an artificial earth satellite for controlling a motor in the artificial earth satellite, and is used in an environment close to vacuum.

A power H-bridge MOSFET integrated circuit manufactured by Texas Instruments (TI) of America is installed in the satellite-borne motor control equipment, and is of a model LMD 18200-2D/883. The integrated circuit has an output current of 3A, a maximum supply voltage of 55V, a dip package and no case flange heat dissipation, and is an example of a high-power dip integrated circuit 10 having a power of 1W or more according to the present invention.

Fig. 4 is a physical diagram of lower heat-conducting plate 30 in a plan view of a power H-bridge MOSFET integrated circuit in which dual in-line package integrated circuit 10 is not mounted. As shown in fig. 4, the heat conductive portion 31 of the lower heat conductive plate 30 is fixed to the printed circuit board 20 by bolts and nuts, and the protruding portion 33 is fixed to the circuit board outer frame 50 by bolts and nuts. Two rows of welding points are formed on both sides of the lower heat-conducting plate 30, corresponding to the pins 12 of the power H-bridge MOSFET integrated circuit one to one, for welding each pin 12.

Fig. 5 is a schematic plan view of lower heat transfer plate 30 when power H-bridge MOSFET integrated circuits having dual in-line package integrated circuits 10 mounted thereon are viewed from above. At this time, the region between the two rows of pins 12 of the power H-bridge MOSFET integrated circuit is in close contact with the upper surface of the lower heat conductive plate 30, and the heat thereof can be transferred from the bottom surface to the circuit board outer frame 50 via the lower heat conductive plate 30.

Fig. 6 is a real view of the upper heat transfer plate 40 as viewed from the back. The upper heat conductive plate 40 has a substantially rectangular shape, and has a plurality of screw holes formed on both long sides thereof, respectively, for fixing to the printed circuit board 20 and the circuit board outer frame 50. A connecting portion 42 is formed on one short side, and the connecting portion 42 is formed in a substantially rectangular shape covering the entire short side of the upper heat transfer plate 40. Since the upper heat conductive plate 40 is installed at one corner of the circuit board outer frame 50 and a hole through which a long screw for fixing the multi-layered module passes is formed at the corner, a notch corresponding to the shape of the corner of the circuit board outer frame 50 is formed at the corner of the connection part 42. Besides the notch, a small portion of the connecting portion 42 extends in the longitudinal direction.

Fig. 7 is a top view of the upper heat transfer plate 40 mounted thereon. The heat conducting portion 41 of the upper heat conducting plate 40 is in close contact with the upper surface of the power H-bridge MOSFET integrated circuit, the portion along the short side of the connecting portion 42 is in contact with one side of the circuit board outer frame 50, and the portion along the long side of the connecting portion 42 is in contact with the other side of the circuit board outer frame 50. The heat of the power H-bridge MOSFET integrated circuit can be reliably transferred from the top surface to the circuit board housing 50 via the upper thermally conductive plate 40.

As described above, the silicon rubber is coated between the upper heat conducting plate 40, the lower heat conducting plate 30 and the power H-bridge MOSFET integrated circuit, so that the contact thermal resistance is reduced, and the power H-bridge MOSFET integrated circuit, the upper heat conducting plate 40 and the lower heat conducting plate 30 are buffered, so that damage to the power H-bridge MOSFET integrated circuit due to relative motion during vibration is avoided, and the contact thermal resistance can be reduced. In addition, the contact surfaces of the upper and lower heat-conducting

plates

For the satellite-borne motor control equipment, if the semiconductor cooling device, the fin passive cooling device, the fan cooling device and the housing flange cooling device in the prior art are adopted, the fin passive cooling device and the fan cooling device cannot work due to the absence of air, the semiconductor cooling device consumes precious energy, and the housing flange cooling device occupies precious space. The heat sink of the dual in-line package integrated circuit 10 according to the present invention can efficiently transfer the heat of the dual in-line package integrated circuit 10 to the circuit board outer frame 50 of the printed circuit board 20, and thus, not only does not consume additional energy, but also can achieve a high heat dissipation efficiency with a small volume. In a motor control device on board a satellite, which is configured by stacking a plurality of printed circuit boards 20, the heat of the dual in-line package integrated circuits 10 on the printed circuit boards 20 of the respective layers can be transferred to a housing of the motor control device on board a satellite for heat dissipation, and high heat dissipation efficiency can be achieved with a small volume.

Claims

1. A heat dissipation device for a dual in-line package integrated circuit mounted on a printed circuit board, comprising:

an upper thermal plate in surface contact with a top surface of the dual in-line package integrated circuit;

a lower heat-conducting plate disposed between the bottom surface of the dual in-line package integrated circuit and the printed circuit board; and

a circuit board outer frame which is in surface contact with the upper heat conducting plate and the lower heat conducting plate and is used as a shell of the printed circuit board,

the heat generated by the dual in-line package integrated circuit during working is transferred to the outer frame of the circuit board through the upper heat conducting plate and the lower heat conducting plate.

2. The heat dissipation device of claim 1, wherein:

and a heat conducting pad or coated with silicon rubber is arranged between the dual in-line package integrated circuit and the upper heat conducting plate as well as between the circuit board outer frame and the upper heat conducting plate as well as between the dual in-line package integrated circuit and the lower heat conducting plate.

3. The heat dissipation device of claim 1, wherein:

the upper heat-conducting plate covers the entire top surface of the dual in-line package integrated circuit,

the lower heat conducting plate covers the whole area between two rows of pins of the dual in-line package integrated circuit.

4. The heat dissipation device of claim 1, wherein:

the dual in-line package integrated circuit is a high-power dual in-line package integrated circuit with the power of more than 1W.

5. The heat dissipation device of claim 1, wherein:

the upper heat conducting plate and the lower heat conducting plate are made of copper or aluminum.

6. An electrical apparatus constructed by laminating a plurality of printed circuit boards, characterized in that:

the heat sink for a dual in-line package integrated circuit according to claim 1 is provided on a printed circuit board on which the dual in-line package integrated circuit is mounted,

the outer frame of the printed circuit board is connected and fixed to form the outer shell of the electrical equipment, and heat generated by the dual in-line package integrated circuit during working is transferred to the outer shell formed by the outer frame of the printed circuit board through the upper heat-conducting plate and the lower heat-conducting plate corresponding to the dual in-line package integrated circuit.

7. The electrical device of claim 6, wherein:

holes for long screws to pass through are formed at the specified positions of the circuit board outer frames of the printed circuit boards, the long screws pass through the circuit board outer frames of the printed circuit boards to connect and fix the printed circuit boards together,

step structures are respectively formed at the top end and the bottom end of the wall forming the circuit board outer frame, and when a plurality of printed circuit boards are stacked, the step structure of the circuit board outer frame of any one printed circuit board is matched with the step structures of the circuit board outer frames of the printed circuit boards of the previous layer and the next layer, so that the printed circuit boards are stacked on a straight line.

8. The electrical device of claim 6, wherein:

and an electric connector used for being electrically connected with the printed circuit boards of other layers is formed on each layer of the printed circuit board.

9. The electrical device of claim 8, wherein:

and a guide post is formed on the back surface of the printed circuit board corresponding to the part where the electric connector is formed, and the guide post is used for positioning and electrically connecting the electric connector of the printed circuit board of the adjacent layer.