CN115101468A - Wafer adsorption method - Google Patents

Wafer adsorption method Download PDF

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Publication number
CN115101468A
CN115101468A CN202210789918.3A CN202210789918A CN115101468A CN 115101468 A CN115101468 A CN 115101468A CN 202210789918 A CN202210789918 A CN 202210789918A CN 115101468 A CN115101468 A CN 115101468A
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CN
China
Prior art keywords
wafer
tooth block
adsorption
groove
spiral groove
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CN202210789918.3A
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Chinese (zh)
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CN115101468B (en
Inventor
朱伟
王强
金永斌
贺涛
丁宁
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Lanzer Semiconductor Technology Wuhu Co ltd
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Lanzer Semiconductor Technology Wuhu Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer adsorption method, which belongs to the technical field of semiconductor testing; the wafer adsorption method sequentially executes the steps of wafer placement, slider movement, tooth block occlusion and slider stop; after the wafer is placed on the circular truncated cone, the tooth blocks are sequentially pulled downwards from the starting point of the spiral groove through the pull head, so that an adsorption groove which is covered by the wafer and communicated with the air hole is formed in the spiral groove, the adsorption groove is gradually prolonged along with the movement of the pull head, a wafer which is adaptive to the irregular shape is formed, the spiral which is as large as possible is completely covered by the wafer, and the adsorption groove is communicated with the air hole, so that the adsorption groove can be adaptive to the adsorption of the wafers in different shapes, and meanwhile, the adsorption groove which is as large as possible is formed, and the stability of the adsorption of the wafer adsorption table to the irregular wafers is guaranteed.

Description

Wafer adsorption method
Technical Field
The invention discloses a wafer adsorption method, and belongs to the technical field of semiconductor testing.
Background
The probe station is mainly applied to the semiconductor industry, the photoelectric industry, the integrated circuit and the packaging test, and is distinguished from the operation that: manual, semi-automatic, and fully automatic. In the wafer production process, the probe card is mainly used for reliably contacting the wafer, so as to perform electrical performance test and wafer test on the integrated circuit on the wafer, and judge whether the integrated circuit is good or not.
The probe platform mainly comprises a wafer adsorption platform, an optical element, a probe (a probe card), a manipulator and a network analyzer, wherein the wafer adsorption platform is mainly used for placing and adsorbing a wafer, the wafer is placed in the middle of the wafer adsorption platform through tweezers or a mechanical arm, when the wafer is placed, a wafer is ensured to completely cover an adsorption groove and an air hole in the wafer adsorption platform, and a negative pressure is formed through a vacuum pump, so that the adsorption force of the wafer adsorption platform on the wafer is ensured, when the adsorption force of the wafer is insufficient, the wafer is easy to move in a needle inserting process, the contact between the probe and a contact is poor, and the probe is easy to damage in serious cases.
The adsorption tank on the existing wafer adsorption platform is designed to be fixed mostly, the wafer has a wafer with an irregular shape due to different cutting modes, the existing adsorption tank adsorbs the wafer, the adsorption tank with the large diameter on the outer side is not completely covered, and can only adsorb through the adsorption tank with the small diameter on the inner side, and the wafer is unstable due to the small diameter and insufficient adsorption force.
Disclosure of Invention
Aiming at the problem that the wafer with the irregular shape cannot be stably adsorbed on the wafer adsorption platform, the invention provides the adjustable wafer adsorption platform and the wafer adsorption method.
In order to achieve the purpose, the invention provides the following technical scheme:
a wafer adsorption method comprising the steps of:
step a, wafer placement: placing the wafer at the center of the circular table, and completely covering the air holes;
step b, moving the puller: the puller moves from the starting point of the spiral groove to the tail part of the spiral groove along the spiral groove;
step c, moving the tooth block: the puller pulls the toothed block downwards, so that the top of the toothed block moves downwards to the inside of the spiral groove from the position aligned with the surface of the circular truncated cone, and the top of the toothed block and the side surface of the spiral groove form an adsorption groove communicated with the air hole;
step d, meshing of the tooth blocks: the slider continues to move and pulls the tooth blocks downwards, and the pulled tooth blocks are meshed with the tooth blocks pulled downwards firstly, so that all the tooth blocks pulled downwards are kept at the bottom of the spiral groove to form an adsorption groove spirally extending outwards from the starting point of the spiral groove;
step e, stopping the puller: and the pulling head continues to move until the pulling head stops when the next tooth block is not completely covered by the wafer, and the wafer is sucked through the suction groove formed at the moment.
Further, the adjustable wafer adsorption platform is applied to the adjustable wafer adsorption platform, and the adjustable wafer adsorption platform comprises: round platform, helicla flute, tooth piece, pull head and gas pocket.
Compared with the prior art, the invention provides an adjustable wafer adsorption platform and an adsorption method thereof, and the adjustable wafer adsorption platform has the following beneficial effects:
the invention discloses an adjustable wafer adsorption platform, which comprises: the upper surface of the circular truncated cone is provided with a spiral groove, the interior of the spiral groove is filled with a plurality of tooth blocks, the air hole is arranged at the starting point of the spiral groove, the pull head is arranged below the tooth block, and by the structure, the effect can be realized, after the wafer is placed on the circular table, when the irregular wafer can not completely cover the spiral groove, the pulling head pulls the tooth blocks downwards in sequence from the starting position of the spiral groove, so that an adsorption groove which is covered by the wafer and is communicated with the air hole is formed in the spiral groove, the adsorption groove is gradually prolonged along with the movement of the pulling head, thereby forming a wafer which is suitable for irregular shape, has a spiral shape as large as possible, is completely covered by the wafer, and the adsorption tank is communicated with the air holes, so that the adsorption tank can be suitable for the adsorption of wafers of different shapes, an adsorption groove as large as possible is formed, and the stability of the wafer adsorption table for adsorbing the wafer with the irregular shape is guaranteed.
The invention discloses a wafer adsorption method, which comprises the following steps: step a, placing a wafer; step b, moving the puller; step c, moving the tooth block; d, meshing the tooth blocks; step e, stopping the puller; the suction groove can be gradually prolonged along with the movement of the pull head, so that a wafer adaptive to the irregular shape is formed, the spiral shape is completely covered by the wafer as much as possible, and the suction groove is communicated with the air hole and is adaptive to the suction of the wafer with the irregular shape.
Drawings
FIG. 1 is a schematic view of the overall structure of a wafer chuck of the present invention.
Fig. 2 is a schematic structural view of a cross section of the wafer chuck of fig. 1.
FIG. 3 is a schematic view of a wafer chuck according to the present invention.
Fig. 4 is a schematic structural view of the circular truncated cone.
Fig. 5 is a schematic cross-sectional view of the tooth block after being pulled down.
Fig. 6 is a schematic cross-sectional view of the tooth block before it is pulled down.
Fig. 7 is a schematic structural view of the meshing of the tooth blocks.
Fig. 8 is a schematic perspective view of the tooth block.
Fig. 9 is a schematic structural view of the slider.
Fig. 10 is a schematic top view of the slider.
FIG. 11 is a flowchart illustrating a wafer chucking method according to the present invention.
Wherein: 1. a circular truncated cone; 2. a helical groove; 3. a tooth block; 4. a slider; 5. air holes; 1-1, a table body; 1-2, a cover plate; 1-3, a tooth block groove; 3-1, block body; 3-2, a plug; 3-3, reed; 3-4, an occlusion block; 3-5, an occlusion groove; 3-6, a guide rod; 4-1, a chute; 4-2, a pull head seat; 4-3, a slide bar; 4-4 drive rings; 4-5, driving a motor; 4-6, a guide block; 4-7, a guide groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the present invention, and not all of it. All other embodiments that can be derived by a person skilled in the art from the detailed description of the invention without inventive step are within the scope of the invention.
Detailed description of the invention
The following is a specific embodiment of an adjustable wafer chuck table according to the present invention.
An adjustable wafer chuck table comprising: the circular truncated cone comprises a circular truncated cone 1, a spiral groove 2, a tooth block 3, a pull head 4 and an air hole 5, wherein the upper surface of the circular truncated cone 1 is provided with the spiral groove 2, the spiral groove 2 is a spiral groove with a starting point located at the head and the tail of the circle center of the circular truncated cone 1, the tooth block 3 is filled in the spiral groove 2, the top of the filled tooth block 3 is aligned with the upper surface of the circular truncated cone 1, the air hole 5 is arranged at the starting point of the spiral groove 2, the pull head 4 is arranged below the tooth block 3, the tooth block 3 can be pulled downwards in sequence when the spiral groove 2 slides along the pull head 4, and the tooth blocks 3 pulled downwards can be mutually meshed and kept to be located at the bottom of the spiral groove 2.
In order to solve the problem that the wafer can not completely cover the adsorption groove, a spiral groove 2 is adopted, the spiral groove 2 extends outwards spirally from the middle position of a circular table 1, the inner part of the spiral groove 2 is filled with a plurality of tooth blocks 3, the bottom of each tooth block 3 is provided with a pull head 4, an air hole 5 is arranged at the starting position of the spiral groove 2, the understanding is easy, after the wafer is placed on the circular table 1, when the wafer with an irregular shape can not completely cover the spiral groove 2, the tooth blocks 3 are sequentially pulled downwards from the starting position of the spiral groove 2 to the tail part of the spiral groove 2 through the pull head 4, the top of the pulled tooth blocks 3 fall into the bottom of the spiral groove 2, so that the adsorption groove which is covered by the wafer and is communicated with the air hole 5 is formed in the spiral groove 2, the adsorption groove is gradually prolonged along with the movement of the pull head 4 until the next tooth block 3 which is not covered by the wafer stops, and a wafer with an irregular shape is formed, a spiral shape as large as possible, which is completely covered by the wafer and is communicated with the air holes 5. The adsorption groove can be formed as large as possible according to the shape of the wafer, the wafer is adsorbed, and the adsorption groove as large as possible is formed while the adsorption groove is adaptive to adsorption of wafers in different shapes.
As shown in fig. 3, in this schematic diagram, the spiral groove 2 is unfolded into a linear groove, so as to facilitate understanding, the tooth blocks 3 filled in the spiral groove 2 fill up the spiral groove 2, so that the upper surface of the circular truncated cone 1 is a flat surface, the air hole 5 is arranged at the starting point of the spiral groove 2, when the slider 4 slides to the tail along the starting point of the spiral groove 2, the tooth blocks 3 are sequentially pulled downwards, the pulled tooth blocks 3 are engaged with each other and kept at the bottom of the spiral groove 2, and an adsorption groove is formed at the same time, the length of the slider 4 is greater than the distance between two tooth blocks 3, so that the slider 4 keeps pulling the tooth blocks 3 downwards when moving.
Specifically, as shown in fig. 4, the circular truncated cone 1 includes: the novel table comprises a table body 1-1, a cover plate 1-2 and a tooth block groove 1-3, wherein the table body 1-1 is hollow, the cover plate 1-2 covers the top of the table body 1-1, a spiral groove 2 is formed in the cover plate 1-2, and the tooth block groove 1-3 is formed in the bottom of the spiral groove 2.
In order to solve the problem of up-and-down sliding of the tooth block 3, the tooth block grooves 1-3 are arranged in the cover plate 1-2, so that the tooth block grooves 1-3 are easy to understand and serve as sliding grooves for up-and-down sliding of the tooth block 3, and the distance and the position of up-and-down sliding of the tooth block 3 are limited through the tooth block grooves 1-3.
Specifically, as shown in fig. 5, the tooth block 3 includes: the block body 3-1 is arranged in the tooth block groove 1-3 in a sliding mode, and the plug 3-2 is arranged at the top of the block body 3-1.
The block 3-1 is arranged in the tooth block groove 1-3 in a sliding mode, the spiral groove 2 is plugged through the plug 3-2 at the upper end of the block 3-1, and as can be easily understood, when the tooth block 3 is pulled downwards by the pull head 4, the plug 3-2 can move downwards along with the block 3-1, so that an adsorption groove is formed in the spiral groove 2.
Specifically, as shown in fig. 6, the tooth block 3 further includes: the spring 3-3 is arranged at the bottom of the block 3-1, and the lower end of the spring 3-3 is in contact with the bottom of the tooth block groove 1-3.
In order to solve the resetting problem of the tooth block 3, the spring 3-3 is arranged at the bottom of the block body 3-1, and as the lower end of the spring 3-3 is contacted with the bottom of the tooth block groove 1-3, the spring 3-3 is compressed after the tooth block 3 is pulled down, and the spring 3-3 is restored after the tooth block 3 is released, so that the block body 3-1 is pushed to slide upwards for resetting, which is easy to understand.
Specifically, as shown in fig. 7, the tooth block 3 further includes: the spiral groove 2 is arranged on the block 3-1, the upper end of one side of the starting point of the spiral groove 2, facing the block 3-1, is provided with an occluding block 3-4, and the other side of the block 3-1 is correspondingly provided with an occluding groove 3-5.
In order to solve the occlusion problem of the tooth block 3, the tooth block 3 is provided with an occlusion block 3-4 and an occlusion groove 3-5, which is easy to understand, before the tooth block 3 is pulled down by a slider 4, the tooth block 3 is kept at a high position by a reed 3-3, when the tooth block 3 is pulled down by the slider 4, the occlusion groove 3-5 at the front end of the pulled-down tooth block 3 is separated from the occlusion block 3-4 of the tooth block 3 at the front end thereof, at the same time, the tooth block 3 at the rear end of the pulled-down tooth block 3 is kept at a low position by the slider 4, after the pulled-down tooth block 3 is pulled to the low position, the occlusion block 3-4 at the rear end of the pulled-down tooth block 3 is embedded into the occlusion groove 3-5 at the front end of the tooth block 3 at the rear end of the pulled-down tooth block 3, at the lower position by the pulled-down tooth block 3, the tooth block 3 at the rear end of the pulled-down tooth block 3 is kept at the low position by the occlusion block 3-4, the tooth blocks 3 pulled down by the sliders 4 are all kept at a low position, and meshing is realized.
Specifically, as shown in fig. 7 and 8, the tooth block 3 further includes: the upper end of the guide rod 3-6 is fixedly connected to the bottom of the block body 3-1, the lower end of the guide rod 3-6 penetrates through the bottom of the tooth block groove 1-3 and extends into the table body 1-1, and a sliding block is arranged at the bottom of the guide rod 3-6.
In order to ensure the stability of the tooth block 3 when sliding up and down and avoid the play of the tooth block 3, the design that the lower end of the guide rod 3-6 penetrates through the bottom of the tooth block groove 1-3 is adopted, and the guide rod 3-6 guides the tooth block 3 when the tooth block 3 slides up and down, which is easy to understand.
Specifically, as shown in connection with fig. 9, the slider 4 includes: the device comprises a sliding chute 4-1, a pull head seat 4-2, a sliding rod 4-3, a driving ring 4-4 and a driving motor 4-5, wherein the bottom of the sliding chute 4-1 is fixedly connected with the pull head seat 4-2, the pull head seat 4-2 is arranged on the sliding rod 4-3 in a sliding mode, the outer end of the sliding rod 4-3 is fixedly connected to the inner side of the driving ring 4-4, and the driving ring 4-4 is connected with the driving motor 4-5.
In order to solve the driving problem of the puller 4, the puller seat 4-2 is arranged on the slide bar 4-3 in a sliding mode, the outer end of the slide bar 4-3 is fixedly connected to the inner side of the driving ring 4-4, the puller 4 can slide on the slide bar 4-3, the radial movement of the puller 4 is achieved, the driving ring 4-4 is rotated through the driving motor 4-5, the circumferential movement of the puller 4 is achieved, and the puller 4 can move along the spiral groove 2 by combining the radial movement and the circumferential movement.
Specifically, as shown in fig. 10, the slider 4 further includes: the device comprises guide blocks 4-6 and guide grooves 4-7, wherein the guide blocks 4-6 are arranged at the bottom of the pull head seat 4-2, the guide blocks 4-6 are arranged in the guide grooves 4-7 in a sliding mode, and the guide grooves 4-7 are arranged corresponding to the spiral grooves 2.
In order to facilitate the movement of the slider 4 along the spiral groove 2, the guide grooves 4-7 are arranged corresponding to the spiral groove 2, and it is easy to understand that the slider 4 can be guided by the guide blocks 4-6 sliding in the guide grooves 4-7 when the drive ring 4-4 rotates.
Detailed description of the invention
The following is a specific embodiment of a wafer adsorption method of the present invention.
A flowchart of a wafer adsorbing method in this embodiment is shown in fig. 11, and includes the following steps:
step a, wafer placement: placing a wafer at the center of the circular truncated cone 1, and completely covering the air hole 5;
step b, moving the puller: the slider 4 moves from the starting point of the spiral groove 2 to the tail part of the spiral groove 2 along the spiral groove 2;
step c, moving the tooth block: the puller 4 pulls the tooth block 3 downwards, so that the top of the tooth block 3 moves downwards to the inside of the spiral groove 2 from a position aligned with the surface of the circular truncated cone 1, and the top of the tooth block 3 and the side surface of the spiral groove 2 form an adsorption groove communicated with the air hole 5;
step d, meshing of the tooth blocks: the slider 4 continues to move and pulls the tooth block 3 downwards, and the tooth block 3 pulled downwards is meshed with the tooth block 3 pulled downwards firstly, so that all the tooth blocks 3 pulled downwards are kept at the bottom of the spiral groove 2 to form an adsorption groove which is spirally extended outwards from the starting point of the spiral groove 2;
step e, stopping the puller: the slider 4 continues to move until it stops when the next block 3 is not completely covered with the wafer, and the wafer is sucked through the suction groove formed at this time.
Specifically, the adjustable wafer adsorption platform is applied to the adjustable wafer adsorption platform, and the adjustable wafer adsorption platform comprises: the device comprises a circular truncated cone 1, a spiral groove 2, a tooth block 3, a pull head 4 and an air hole 5.
Although particular embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these particular embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (2)

1. A wafer adsorption method is characterized by comprising the following steps:
step a, placing a wafer: placing a wafer at the central position of the circular table (1), and completely covering the air hole (5);
step b, moving the puller: the slider (4) starts to move from the starting point of the spiral groove (2) to the tail part of the spiral groove (2) along the spiral groove (2);
step c, moving the tooth block: the puller (4) pulls the tooth block (3) downwards, so that the top of the tooth block (3) moves downwards to the inside of the spiral groove (2) from a position aligned with the surface of the circular truncated cone (1), and a section of adsorption groove communicated with the air hole (5) is formed between the top of the tooth block (3) and the side surface of the spiral groove (2);
step d, meshing of the tooth blocks: the slider (4) continues to move and pulls the tooth block (3) downwards, and the tooth block (3) pulled downwards afterwards is meshed with the tooth block (3) pulled downwards firstly, so that all the tooth blocks (3) pulled downwards are kept at the bottom of the spiral groove (2) to form an adsorption groove which is spirally extended outwards from the starting point of the spiral groove (2);
step e, stopping the puller: the slider (4) continues to move until the next tooth block (3) is stopped when the next tooth block is not completely covered by the wafer, and the wafer is sucked through the suction groove formed at the moment.
2. The wafer chucking method as claimed in claim 1, applied to an adjustable wafer chuck table comprising: the device comprises a circular table (1), a spiral groove (2), a tooth block (3), a pull head (4) and an air hole (5).
CN202210789918.3A 2022-07-06 2022-07-06 Wafer adsorption method Active CN115101468B (en)

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CN115101468B CN115101468B (en) 2023-07-25

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001105261A (en) * 1999-09-30 2001-04-17 Matsushita Electric Ind Co Ltd Board holding device
JP2006351572A (en) * 2005-06-13 2006-12-28 Toppan Printing Co Ltd Vacuum sucking tool for wafer
CN202549910U (en) * 2012-04-18 2012-11-21 吴晓 Absorbing device for locating LED chip carrier
KR20130131799A (en) * 2012-05-24 2013-12-04 이상진 Block for a vacuum chuck
CN104570419A (en) * 2014-12-26 2015-04-29 深圳市华星光电技术有限公司 Sucking type carrier and sucking method thereof
CN106711076A (en) * 2016-12-02 2017-05-24 北京中电科电子装备有限公司 Vacuum ceramic sucker for absorbing multiple chips
CN108766927A (en) * 2018-05-29 2018-11-06 李涵 A kind of semiconductor chip production technology
CN210092053U (en) * 2019-07-05 2020-02-18 南通鑫晶电子科技有限公司 Wafer pad pasting device of compatible multiple size
CN113555309A (en) * 2021-06-29 2021-10-26 葛力 Wafer scribing machine for chip manufacturing
CN216773213U (en) * 2022-03-01 2022-06-17 河北西五科技有限公司 Wafer sucking disc of adjustable wafer size

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001105261A (en) * 1999-09-30 2001-04-17 Matsushita Electric Ind Co Ltd Board holding device
JP2006351572A (en) * 2005-06-13 2006-12-28 Toppan Printing Co Ltd Vacuum sucking tool for wafer
CN202549910U (en) * 2012-04-18 2012-11-21 吴晓 Absorbing device for locating LED chip carrier
KR20130131799A (en) * 2012-05-24 2013-12-04 이상진 Block for a vacuum chuck
CN104570419A (en) * 2014-12-26 2015-04-29 深圳市华星光电技术有限公司 Sucking type carrier and sucking method thereof
CN106711076A (en) * 2016-12-02 2017-05-24 北京中电科电子装备有限公司 Vacuum ceramic sucker for absorbing multiple chips
CN108766927A (en) * 2018-05-29 2018-11-06 李涵 A kind of semiconductor chip production technology
CN210092053U (en) * 2019-07-05 2020-02-18 南通鑫晶电子科技有限公司 Wafer pad pasting device of compatible multiple size
CN113555309A (en) * 2021-06-29 2021-10-26 葛力 Wafer scribing machine for chip manufacturing
CN216773213U (en) * 2022-03-01 2022-06-17 河北西五科技有限公司 Wafer sucking disc of adjustable wafer size

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