CN115101338A - Manufacturing method of laminated capacitor capable of being pasted on two sides - Google Patents
Manufacturing method of laminated capacitor capable of being pasted on two sides Download PDFInfo
- Publication number
- CN115101338A CN115101338A CN202210404450.1A CN202210404450A CN115101338A CN 115101338 A CN115101338 A CN 115101338A CN 202210404450 A CN202210404450 A CN 202210404450A CN 115101338 A CN115101338 A CN 115101338A
- Authority
- CN
- China
- Prior art keywords
- positive electrode
- capacitor
- negative electrode
- manufacturing
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 143
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 61
- 239000011888 foil Substances 0.000 claims abstract description 88
- 239000000178 monomer Substances 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims abstract description 27
- 238000000605 extraction Methods 0.000 claims abstract description 6
- 239000002002 slurry Substances 0.000 claims description 85
- 238000006116 polymerization reaction Methods 0.000 claims description 69
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 54
- 239000004033 plastic Substances 0.000 claims description 53
- 229920003023 plastic Polymers 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- 229910052709 silver Inorganic materials 0.000 claims description 47
- 239000004332 silver Substances 0.000 claims description 47
- 229920001940 conductive polymer Polymers 0.000 claims description 39
- 238000005520 cutting process Methods 0.000 claims description 37
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 36
- 238000002360 preparation method Methods 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000004544 sputter deposition Methods 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 abstract description 15
- 238000012360 testing method Methods 0.000 abstract description 6
- 238000001035 drying Methods 0.000 description 37
- 239000000853 adhesive Substances 0.000 description 33
- 230000001070 adhesive effect Effects 0.000 description 33
- 239000000243 solution Substances 0.000 description 23
- 238000007598 dipping method Methods 0.000 description 22
- 238000005470 impregnation Methods 0.000 description 21
- 229910002804 graphite Inorganic materials 0.000 description 20
- 239000010439 graphite Substances 0.000 description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 18
- 238000003466 welding Methods 0.000 description 18
- 239000002904 solvent Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- 239000002019 doping agent Substances 0.000 description 16
- 239000000654 additive Substances 0.000 description 14
- 230000000996 additive effect Effects 0.000 description 14
- 239000008151 electrolyte solution Substances 0.000 description 13
- 229920000128 polypyrrole Polymers 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 12
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 12
- 230000001590 oxidative effect Effects 0.000 description 11
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000011049 filling Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 239000007800 oxidant agent Substances 0.000 description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- 239000011259 mixed solution Substances 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 6
- 229930192474 thiophene Natural products 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- 108010077895 Sarcosine Proteins 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 229920006243 acrylic copolymer Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229920000123 polythiophene Polymers 0.000 description 4
- FSYKKLYZXJSNPZ-UHFFFAOYSA-N sarcosine Chemical compound C[NH2+]CC([O-])=O FSYKKLYZXJSNPZ-UHFFFAOYSA-N 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 235000009518 sodium iodide Nutrition 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ICLYJLBTOGPLMC-KVVVOXFISA-N (z)-octadec-9-enoate;tris(2-hydroxyethyl)azanium Chemical compound OCCN(CCO)CCO.CCCCCCCC\C=C/CCCCCCCC(O)=O ICLYJLBTOGPLMC-KVVVOXFISA-N 0.000 description 3
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 3
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 229940117013 triethanolamine oleate Drugs 0.000 description 3
- HOMQUHGCYPKWEY-UHFFFAOYSA-N 1,3-dioxo-1h,3h-benzo[de]isochromene-6-sulfonic acid Chemical compound O=C1OC(=O)C2=CC=CC3=C2C1=CC=C3S(=O)(=O)O HOMQUHGCYPKWEY-UHFFFAOYSA-N 0.000 description 2
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- UNDJACIXRKPCJI-UHFFFAOYSA-N 3-carbamoylbenzenesulfonic acid Chemical compound NC(=O)C1=CC=CC(S(O)(=O)=O)=C1 UNDJACIXRKPCJI-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- FYMCOOOLDFPFPN-UHFFFAOYSA-K iron(3+);4-methylbenzenesulfonate Chemical compound [Fe+3].CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 FYMCOOOLDFPFPN-UHFFFAOYSA-K 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229940043230 sarcosine Drugs 0.000 description 2
- 229940006186 sodium polystyrene sulfonate Drugs 0.000 description 2
- 229940048098 sodium sarcosinate Drugs 0.000 description 2
- ZUFONQSOSYEWCN-UHFFFAOYSA-M sodium;2-(methylamino)acetate Chemical compound [Na+].CNCC([O-])=O ZUFONQSOSYEWCN-UHFFFAOYSA-M 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a method for manufacturing a double-sided mounting laminated capacitor, which comprises the following steps: step11, preparing a monomer; step12, laminating; step13, manufacturing conductive terminal paste; step14, packaging; step15, manufacturing extraction electrode: arranging a negative electrode film on the side edge of the capacitor monoblock and electrically connecting the negative electrode film with the local negative conductive foil, wherein two ends of the negative electrode film are respectively extended and arranged on the upper side and the lower side of the capacitor monoblock; and arranging a positive electrode film at the side edge of the capacitor block and electrically connecting the positive electrode film with the local positive conductive foil, wherein two ends of the positive electrode film are respectively extended and arranged at the upper side and the lower side of the capacitor block. According to the invention, the electrodes (the positive electrode film and the negative electrode film) on two side edges of the single capacitor block are extended and pasted, so that double-sided test taping and pasting can be carried out, taping and pasting can be directly tested without alignment, and the test taping and pasting efficiency is improved.
Description
Technical Field
The application relates to the technical field of surface-mounted capacitors, in particular to a manufacturing method of a double-surface-mountable laminated capacitor.
Background
With the development of science and technology, in order to meet the requirements of Surface Mount Technology (SMT) for electronic products with miniaturization, high frequency and high reliability, the laminated capacitor made of the conductive polymer material with high conductivity has the advantages of smaller volume, better performance and longer service life, and is more and more concerned.
The preparation process of the prior laminated capacitor mainly comprises the steps of sequentially forming a conductive polymer solid electrolyte layer, a carbon-containing cathode layer and a silver-containing cathode layer on the surface of a cathode region of an aluminum foil to form capacitor units, then laminating a plurality of capacitor units, adhering the capacitor units to a lead frame, respectively leading out an anode and a cathode from lead terminals, then packaging the capacitor units by using epoxy resin, and finally bending and molding the lead terminals, wherein the structure is shown in the specification drawings 3-5 disclosed in Chinese patent CN 108109841A; also like the structure shown in figure 1 of the specification disclosed in the Chinese utility model patent CN 208173426U. However, the prior art has the following defects in the concrete practice:
(1) in the prior art, a frame stacking technology is adopted, electrodes are all in a protruding design, and the risk of pin fracture and insufficient soldering exists; the electrode needs to be bent during molding, and the leakage current of the capacitor is increased due to stress caused by bending;
(2) the prior art adopts a single-sided weldable electrode design, the test braid needs to be adjusted to the front side and then is tested when a product is tested, the test braid efficiency is low, manual adjustment is needed after the product braid is reversely woven, and the production efficiency is low;
(3) the prior art adopts the traditional welding technology, an anode welding area is needed, the available area of a cathode area is reduced under the condition that the volume of a capacitor is not changed, and the capacity of a product is reduced, multiple layers are needed to meet the capacity requirement, so that the cost is increased, the thickness of the whole capacitor is thickened, and the thinning is difficult;
(4) in the prior art, a traditional packaging technology is adopted, a draft angle a of 4-12 degrees exists, the effective use area of a plastic package in the length and width directions becomes thin and small, multiple layers are needed under the condition that the volume of a capacitor is not changed and the capacity requirement is met, the cost is increased, and the thickness of the whole capacitor is thickened; meanwhile, the wall thickness of the plastic package body in the length direction and the width direction is reduced, and the reliability of the capacitor product is unstable.
Disclosure of Invention
The technical problem to be solved by the embodiment of the application is to provide a manufacturing method of a double-sided mounting lamination capacitor.
In order to solve the technical problem, the following technical scheme is adopted in the application:
a method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step11, preparation of monomer: dividing a valve metal sheet with a dielectric layer on the surface into a positive electrode area and a negative electrode area through insulating glue, sequentially preparing a conductive polymer film, a conductive carbon film and a conductive silver film on the negative electrode area, and cutting the positive electrode area into micro positive electrodes;
step12, stacking: stacking at least one monomer, aligning and electrically connecting the cathode regions, and aligning the micro anodes to obtain a stacked body;
step13, manufacturing conductive terminal paste: covering a negative electrode end slurry and a positive electrode end slurry on the side end of the negative electrode area and the side end of the micro positive electrode area of the laminated body respectively, inserting a negative electrode conductive foil and a positive electrode conductive foil into the negative electrode end slurry and the positive electrode end slurry respectively, and then curing the negative electrode end slurry and the positive electrode end slurry to obtain the laminated body to be packaged;
step14, packaging: arranging a plurality of laminates to be packaged in a matrix manner in a die cavity for plastic packaging to form a plastic package body wrapping all laminates to be packaged, and linearly cutting the plastic package body to obtain a plurality of capacitor single blocks, wherein a local negative electrode conductive foil and a local positive electrode conductive foil are respectively exposed at two sides of each capacitor single block;
step15, manufacturing a leading electrode: arranging a negative electrode film on the side edge of the capacitor single block and electrically connecting the negative electrode film with the local negative electrode conductive foil, wherein two ends of the negative electrode film are respectively extended and arranged on the upper side and the lower side of the capacitor single block; and arranging a positive electrode film at the side edge of the capacitor block and electrically connecting the positive electrode film with the local positive conductive foil, wherein two ends of the positive electrode film are respectively extended and arranged at the upper side and the lower side of the capacitor block.
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step21, preparation of monomer: dividing a valve metal sheet with a dielectric layer on the surface into a positive electrode area and a negative electrode area through insulating glue, sequentially carrying out primary formation, conductive polymer film preparation, secondary formation, conductive polymer film preparation, conductive carbon film preparation and conductive silver film preparation on the negative electrode area, and cutting the positive electrode area into micro positive electrodes;
step22, stacking: stacking at least one monomer, aligning and electrically connecting the cathode regions, and aligning the micro anodes to obtain a stacked body;
step23, manufacturing conductive terminal paste: covering a negative electrode end slurry and a positive electrode end slurry on the side end of a negative electrode area and the side end of a micro positive electrode of the laminated body respectively, inserting a negative electrode conductive foil and a positive electrode conductive foil into the negative electrode end slurry and the positive electrode end slurry respectively, and then curing the negative electrode end slurry and the positive electrode end slurry to obtain a laminated body to be packaged;
step24, packaging: arranging a plurality of laminates to be packaged in a matrix in a die cavity for plastic packaging to form a plastic packaging body wrapping all laminates to be packaged, and linearly cutting the plastic packaging body to obtain a plurality of capacitor single blocks, wherein a local negative electrode conductive foil and a local positive electrode conductive foil are respectively exposed at two sides of each capacitor single block;
step25, manufacturing a leading electrode: arranging a negative electrode film on the side edge of the capacitor monoblock and electrically connecting the negative electrode film with the local negative conductive foil, wherein two ends of the negative electrode film are respectively extended and arranged on the upper side and the lower side of the capacitor monoblock; and arranging a positive electrode film at the side edge of the capacitor block and electrically connecting the positive electrode film with the local positive conductive foil, wherein two ends of the positive electrode film are respectively extended and arranged at the upper side and the lower side of the capacitor block.
Further, in steps 11 and 21, the length of the micro positive electrode is 0mm to 0.1 mm.
Further, in the steps of 13 and 23, the coverage length of the cathode end slurry and the anode end slurry is controlled to be 0.05-0.3 mm.
Specifically, silver paste is selected for the negative electrode end slurry and the positive electrode end slurry, and the negative electrode area end side and the micro positive electrode end side are coated with the silver paste to cover the silver paste on the end sides to form the negative electrode end slurry and the positive electrode end slurry, wherein the particle size of the silver paste is preferably 5-10 micrometers, and the content of the silver paste is 60-75%.
The material of the positive electrode conductive foil and the negative electrode conductive foil is one of gold foil, silver foil, copper foil, tin foil and zinc foil, and the thickness of the positive electrode conductive foil and the negative electrode conductive foil is 0.001 mm-0.02 mm. The curing temperature is 80-150 ℃, and the curing time is 0.1-2 h.
Preferably, but not limited to, the width of the cured negative end slurry and the positive end slurry is less than the width of the plastic package body by 0.2-1.0 mm in the width direction, and the height of the cured negative end slurry and the cured positive end slurry is 80-120% of the height of the laminated body in the height direction.
Further, the curing temperature is controlled to be 80-150 ℃, and the curing time is controlled to be 0.1-2 h.
Further, in Step11, the conductive polymer film may be formed by a chemical polymerization method, a combination of a chemical polymerization method and an electrolytic polymerization method, or a vacuum electrolytic polymerization method, wherein the former two forming methods are conventional methods for conductive polymer films in existing laminated capacitors and are not described in detail herein. The vacuum electrolytic polymerization method is to carry out vacuum electrolytic polymerization on the negative electrode zone impregnated electrolytic polymerization liquid to obtain a conductive polymer film; the electrolytic polymerization liquid comprises 2.5-20% of a monomer, 1-15% of a doping agent, 1-10% of an oxidizing agent, 0.5-1% of an additive and the balance of a solvent, wherein the additive comprises at least one of a fluorinated acrylic copolymer, a hydroquinone derivative, triethanolamine oleate and sarcosine sodium oleate; preferably but not limited to, the vacuum degree of vacuum electrolytic polymerization is-90 Kpa to-100 Kpa, the polymerization temperature is 2 ℃ to 40 ℃, the polymerization current is 0.05A to 3A, and the polymerization time is 0.3h to 12 h.
Further, in Step21, the conductive polymer film is obtained by impregnating the negative electrode region with a dispersion liquid containing a conductive polymer, and drying the dispersion liquid, wherein the impregnation temperature is 40 to 60 ℃ and the impregnation time is 1 to 5 min.
In Step21, the conductive polymer film may be formed by an electrolytic polymerization method or a vacuum electrolytic polymerization method, wherein the former forming method is a conventional method of conductive polymer films in existing laminated capacitors and is not described in detail herein. The vacuum electrolytic polymerization method is to immerse the negative electrode region with the conductive polymer film into an electrolytic solution for vacuum electrolytic polymerization to obtain a conductive polymer film; the electrolytic solution comprises 0.5-15 wt% of monomer, 2.5-6 wt% of dopant and 0.5-2 wt% of additive, and the balance is solvent, wherein the additive comprises at least one of fluorinated acrylic copolymer, hydroquinone derivative, triethanolamine oleate and sarcosine oleate sodium; preferably but not limited to, the vacuum degree is-90 Kpa to-100 Kpa during vacuum electrolytic polymerization, the polymerization temperature is 2 ℃ to 10 ℃, the polymerization current is 0.004A to 0.5A, and the polymerization time is 1h to 23 h.
Further, in steps 14 and 24, a plurality of the laminates to be packaged are supported in the mold cavity at intervals by filling plastic particles.
The method comprises the following specific steps: placing a to-be-packaged laminated body in a mould cavity in a matrix arrangement mode of multiple rows and multiple columns, filling the rows and the columns with small-particle-size granular plastic package particles, closing the mould cavity, heating at high temperature, and curing for a certain time to form a plastic package body; the plastic package body completely covers and wraps the laminated body, the anode end slurry, the cathode end slurry, the positive conductive foil and the negative conductive foil of each laminated body to be packaged; and then the product is linearly cut by a diamond saw blade (grinding wheel) or a laser method, such as transverse cutting and/or vertical cutting, only partial positive conductive foil and partial negative conductive foil are exposed after cutting, and the rest part is completely covered by the plastic package body.
Preferably, but not limitatively, the said multiple rows and multiple columns, wherein the number of rows is 3 to 30 rows, the number of columns is 3 to 30 columns; the distance between the rows is 5 mm-33 mm, and the distance between the columns is 20 mm-40 mm; the diameter of the plastic particles is 1 mm-5 mm; the high temperature is 150-240 ℃; the certain time is 60-200 s; the plastic package particles and the plastic package material are one of epoxy resin, phenolic resin, polyimide resin and polyether ether ketone.
Further, in steps Step15 and Step25, the Step of manufacturing the extraction electrode specifically includes: and sequentially sputtering a copper layer and a tin-electroplated layer-forming side U-shaped negative electrode film on one side of the capacitor monolith having the partial negative electrode conductive foil, and sequentially sputtering a copper layer and a tin-electroplated layer-forming side U-shaped positive electrode film on one side of the capacitor monolith having the partial positive electrode conductive foil. Preferably, but not limited to, the copper layer has a thickness of 1 to 2 μm, and the tin layer has a thickness of 2 to 8 μm.
Further, the widths of the negative and positive electrode films are smaller than the width of the capacitor monoblock. By the design, the positive electrode film and the negative electrode film have non-coverage areas away from two sides of the plastic package body in the width direction, so that the short circuit caused by tin climbing and tin whisker between capacitors can be prevented.
The length of the negative electrode film and the positive electrode film covering the upper side and the lower side of the capacitor monolith in the longitudinal direction is about 0.5 to 2 mm; the width of the non-covered area in the width direction is about 0.2 to 1.0 mm.
Compared with the prior art, the embodiment of the application mainly has the following beneficial effects:
the invention replaces the traditional welding technology by the lead-free frame connecting technology combining the micro positive electrode without welding property with the end slurry and the conductive foil, thereby not only canceling the positive electrode welding area, but also being beneficial to further increasing the effective area of the negative electrode under the original volume, greatly improving the product capacity of the laminated capacitor, reducing the lamination layer number and being beneficial to thinning; or the ESR of the laminated capacitor can be greatly reduced under the condition of not reducing the number of laminated layers; the existing lead frame structure is omitted, the appearance is attractive, the risk of pin fracture and insufficient soldering is avoided, the forming and bending are not needed, and the leakage current of the capacitor is not increased; through extending and pasting the electrodes (the positive electrode film and the negative electrode film) on two sides of the single capacitor block, the double-sided test taping and the mounting can be carried out, the taping and the mounting can be directly tested without adjusting, and the test taping and the mounting efficiency are improved. Furthermore, the novel packaging technology is adopted to replace the traditional packaging technology, so that the actual effective area of a packaging body is increased, the product capacity of the capacitor is greatly improved, and the number of laminated layers can be reduced; under the condition of not reducing the number of laminated layers, the thickness of the effective protective wall of the encapsulating body can be greatly increased, and the high-temperature resistance of a capacitor product is favorably improved.
The invention has the advantages that the lead-free frame connection technology combining the micro-positive electrode, the end paste and the conductive foil is mutually cooperated with the novel packaging technology to promote, so that the consistency of the leakage current of the capacitor product is better, and the high temperature resistance, the high temperature resistance and the high humidity resistance of the product are better.
Drawings
Fig. 1 is a longitudinal sectional view of a double-sided mountable laminated capacitor according to the present invention.
Wherein, 1-negative electrode region, 2-positive electrode region, 3-conductive polymer film, 4-conductive carbon film, 5-conductive silver film, 6-bonding body, 7-negative electrode end paste, 8-positive electrode end paste, 9-negative electrode conductive foil, 10-positive electrode conductive foil, 11-negative electrode film, 12-positive electrode film and 13-plastic package body.
Detailed Description
The present invention will be described in detail with reference to examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention. It should be noted that the length, width and height related to the present invention correspond to the dimensions of the capacitor product in the length direction, width direction and height direction, respectively.
Example 1
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step11, preparation of monomer:
cutting a valve metal sheet with a thickness of 50 mu m and a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through insulating glue with the thickness of 0.01mm, and then carrying out chemical polymerization on the negative electrode area by alternately dipping a monomer solution and an oxidizing solution to prepare a conductive polymer film; the monomer solution comprises 5.3 wt% of monomer pyrrole, 86 wt% of solvent water and 8.7 wt% of dopant toluenesulfonic acid; the oxidizing solution comprises 6.8 wt% of ferric p-toluenesulfonate oxidant and 93.2 wt% of solvent water; firstly soaking monomer solution for 25s, then conducting 50 ℃/10min, then soaking oxidizing solution for 20s, then conducting 50 ℃/10min, and repeating the steps for 15 times to prepare polypyrrole conductive polymer;
dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the anode area originally used for welding, and leaving a micro anode with the width of 0.01mm to obtain a monomer.
Step12, stacking:
and (3) mutually connecting and laminating the cathode regions of the 2 single bodies through an adhesive to achieve the designed capacity, aligning and laminating the micro anodes, connecting the micro anodes without adopting the adhesive, and drying after lamination to obtain the laminated body. The grain diameter of the adopted conductive silver paste adhesive is 5 mu m, the content is 65 percent, and then the connection is carried out by adopting 100 ℃/3 h.
Step13, manufacturing conductive terminal paste:
coating silver paste on the side end of the negative electrode area and the side end of the micro positive electrode of the laminated body respectively to obtain negative electrode end paste and positive electrode end paste covering the side end of the negative electrode area and the side end of the micro positive electrode, wherein the particle size of the silver paste is 5 mu m, and the content of the silver paste is 75%. The thickness of the negative end slurry and the thickness of the positive end slurry are both 0.05mm, and the height of the negative end slurry and the height of the positive end slurry are both 80% of the height of the laminated body; and respectively splicing gold foils with the thickness of 0.001mm on the positive electrode end slurry and the negative electrode end slurry to serve as a positive electrode conductive foil and a negative electrode conductive foil, and then curing at the temperature of 80 ℃/2h to obtain a to-be-packaged laminated body.
Step14, packaging:
placing the to-be-packaged laminated body in a mode of 3 rows (the distance between the rows is 33mm) and 3 columns (the distance between the columns is 40mm) in a die cavity, filling the rows and the columns with granular epoxy resin plastic package particles with the diameter of 1mm, closing the die cavity, performing high-temperature injection molding at 150 ℃, keeping the temperature for 200s, and curing to form a plastic package body, wherein the laminated body, anode end slurry, cathode end slurry, positive conductive foil and negative conductive foil of each to-be-packaged laminated body are completely covered and wrapped by the plastic package body; and then vertically cutting the plastic package body by a laser method to obtain a plurality of capacitor single blocks, wherein only two sides of each capacitor single block are respectively exposed out of the local positive electrode conductive foil and the local negative electrode conductive foil, and the rest parts are completely covered by the plastic package body.
Step15, manufacturing a leading electrode:
and sequentially sputtering a 1-micron copper layer and a 2-micron tin layer on one side of the capacitor monoblock with the local negative electrode conductive foil to form a side-U-shaped negative electrode film, and sequentially sputtering a 1-micron copper layer and a 2-micron tin layer on one side of the capacitor monoblock with the local positive electrode conductive foil to form a side-U-shaped positive electrode film, wherein the upper end and the lower end of the positive electrode film extend to be arranged on the upper side and the lower side of the capacitor monoblock respectively, and the upper end and the lower end of the negative electrode film extend to be arranged on the upper side and the lower side of the capacitor monoblock respectively, as shown in figure 1. The length of the negative electrode film and the positive electrode film covering the upper side and the lower side of the capacitor monolith in the longitudinal direction is about 0.5 mm; in the width direction, the regions of two sides of the negative electrode film, which are respectively away from two edges of the capacitor block, are non-covered regions, the regions of two sides of the positive electrode film, which are respectively away from two edges of the capacitor block, are non-covered regions, and the width of each non-covered region is about 1.0 mm.
A laminated capacitor with a specification of 2V/82 muF is prepared, and the height of the product is 0.695 mm.
Example 2
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step11, preparation of monomer:
cutting a valve metal sheet with a thickness of 100 mu m and a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through polyurethane glue cathode and anode blocking glue with the thickness of 0.075mm, and then performing chemical polymerization on the negative electrode area by alternately dipping monomer solution and oxidizing solution, wherein the monomer solution comprises 5.3 wt% of monomer thiophene, 86 wt% of solvent water and 8.7 wt% of dopant toluenesulfonic acid; the oxidizing solution comprises 6.8 wt% of ferric p-toluenesulfonate oxidant and 93.2 wt% of solvent water; the polythiophene conductive polymer is prepared by firstly soaking the monomer solution for 25 seconds, then conducting 50 ℃/10min, then soaking the oxidizing solution for 20 seconds, then conducting 50 ℃/10min, and repeating the steps for 5 times. Continuously covering the prepared polythiophene conductive polymer with an electrolytic polymerization method, wherein the polymerization temperature is 21 ℃, the polymerization current is 1.525A, and the polymerization time is 6.15 h; the electrolytic polymerization solution comprises 10.5 wt% of monomer thiophene, 80 wt% of ethanol and 9.5 wt% of dopant toluenesulfonic acid;
dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.05mm to obtain the monomer.
Step12, stacking:
and (3) mutually connecting and laminating the cathode regions of the 2 single bodies through an adhesive to achieve the designed capacity, aligning and laminating the micro anodes, connecting the micro anodes without adopting the adhesive, and drying after lamination to obtain the laminated body. The grain diameter of the adopted conductive silver paste adhesive is 10 mu m, the content is 75 percent, and then the conductive silver paste adhesive is dried at 150 ℃/1.525 h.
Step13, manufacturing conductive terminal paste:
coating silver paste on the side end of the negative electrode area and the side end of the micro positive electrode of the laminated body respectively to obtain negative electrode end paste and positive electrode end paste covering the side end of the negative electrode area and the side end of the micro positive electrode, wherein the particle size of the silver paste is 7.5 mu m, and the content of the silver paste is 67.5%. The thickness of the negative end slurry and the thickness of the positive end slurry are both 0.1525mm, and the height of the negative end slurry and the height of the positive end slurry are both 100% of the height of the laminated body; and respectively splicing gold foils with the thickness of 0.0105mm on the anode end slurry and the cathode end slurry to serve as an anode conductive foil and a cathode conductive foil, and then curing at the temperature of 115 ℃/1h to obtain a to-be-packaged laminated body.
Step14, packaging:
placing the to-be-packaged laminated bodies in a mode of 20 rows (the distance between the rows is 15mm) and 20 columns (the distance between the columns is 30mm) in a die cavity, filling the rows and the columns with granular polyimide resin plastic package particles with the diameter of 3mm, closing the die cavity, performing high-temperature injection molding at 190 ℃, keeping for 120s, and curing to form a plastic package body, wherein the plastic package body completely covers and wraps the laminated bodies, the anode end slurry, the cathode end slurry, the positive conductive foil and the negative conductive foil of each to-be-packaged laminated body; and then vertically cutting the plastic package body by a laser method to obtain a plurality of capacitor single blocks, wherein only two sides of each capacitor single block are respectively exposed with a partial positive electrode conductive foil and a partial negative electrode conductive foil, and the rest parts are completely covered by the plastic package body.
Step15, manufacturing a leading electrode:
and sequentially sputtering a 1.5 mu m copper layer and a 5 mu m tin layer plated to form a side U-shaped negative electrode film on one side of the capacitor monolith with the local negative electrode conductive foil, and sequentially sputtering a 1.5 mu m copper layer and a 5 mu m tin layer plated to form a side U-shaped positive electrode film on one side of the capacitor monolith with the local positive electrode conductive foil, wherein the upper end and the lower end of the positive electrode film extend to be arranged on the upper side and the lower side of the capacitor monolith respectively, and the upper end and the lower end of the negative electrode film extend to be arranged on the upper side and the lower side of the capacitor monolith respectively. The length of the negative electrode film and the positive electrode film covering the upper side and the lower side of the capacitor monolith in the longitudinal direction is about 1.25 mm; in the width direction, the regions of two sides of the negative electrode film, which are respectively away from two edges of the capacitor block, are non-covered regions, the regions of two sides of the positive electrode film, which are respectively away from two edges of the capacitor block, are non-covered regions, and the width of each non-covered region is about 0.6 mm.
A laminated capacitor with a specification of 2.5V/150 muF is prepared, and the height of the product is 0.713 mm.
Example 3
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step11, preparation of monomer:
cutting a 150-micrometer-thick valve metal sheet with a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through a 0.15-mm-thick fluorine-containing resin adhesive negative and positive barrier adhesive, and preparing a conductive polymeric membrane on the negative electrode area by adopting a vacuum electrolysis one-step polymerization method, wherein the vacuum degree is-100 Kpa, the polymerization temperature is 2 ℃, the polymerization current is 3A, and the polymerization time is 0.3 h; the electrolytic polymerization solution comprises 14 wt% of monomer aniline, 70 wt% of mixed solution of solvent water and ethanol, 5 wt% of doping agent sodium iodide, 10 wt% of oxidant hydrogen peroxide and 1 wt% of additive hydroquinone;
dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.1mm to obtain the monomer.
Step12, stacking:
in the embodiment, only 1 layer of monomers is needed, the designed capacity can be achieved without being connected and laminated through the adhesive, and the conductive end slurry can be manufactured after the monomers are dried at the temperature of 200 ℃/0.05 h.
Step13, manufacturing conductive terminal paste:
coating silver paste on the side end of the negative electrode area and the side end of the micro positive electrode of the laminated body respectively to obtain negative electrode end paste and positive electrode end paste covering the side ends of the negative electrode area and the micro positive electrode area, wherein the particle size of the silver paste is 10 mu m, and the content of the silver paste is 60%. The thickness of the negative end slurry and the thickness of the positive end slurry are both 0.3mm, and the height of the negative end slurry and the height of the positive end slurry are both 120% of the height of the laminated body; and respectively splicing gold foils with the thickness of 0.02mm on the anode end slurry and the cathode end slurry to serve as an anode conductive foil and a cathode conductive foil, and then curing at the temperature of 150 ℃/1h to obtain a to-be-packaged laminated body.
Step14, packaging:
placing the to-be-packaged laminated body in a mode of 30 rows (the distance between the rows is 5mm) and 30 columns (the distance between the columns is 20mm) in a die cavity, filling the rows and the columns with granular polyether-ether-ketone plastic package particles with small grain diameters of 5mm, closing the die cavity, performing high-temperature injection molding at 240 ℃, keeping the temperature for 60s, and curing to form a plastic package body, wherein the laminated body, the anode end slurry, the cathode end slurry, the anode conductive foil and the cathode conductive foil of each to-be-packaged laminated body are completely covered and wrapped by the plastic package body; and then vertically cutting the plastic package body through a diamond saw blade to obtain a plurality of capacitor single blocks, wherein only two sides of each capacitor single block are respectively exposed out of the local positive conductive foil and the local negative conductive foil, and the rest parts are completely covered by the plastic package body.
Step15, manufacturing extraction electrode:
and sequentially sputtering a 2 mu m copper layer and an 8 mu m tin layer on one side of the capacitor monobloc with the local negative electrode conductive foil to form a side U-shaped negative electrode film, and sequentially sputtering a 2 mu m copper layer and an 8 mu m tin layer on one side of the capacitor monobloc with the local positive electrode conductive foil to form a side U-shaped positive electrode film, wherein the upper end and the lower end of the positive electrode film extend to be arranged on the upper side and the lower side of the capacitor monobloc respectively, and the upper end and the lower end of the negative electrode film extend to be arranged on the upper side and the lower side of the capacitor monobloc respectively. The length of the negative electrode film and the positive electrode film covering the upper side and the lower side of the capacitor monolith in the longitudinal direction is about 2 mm; in the width direction, the regions of two sides of the negative electrode film, which are respectively away from two edges of the capacitor monoblock, are non-covering regions, the regions of two sides of the positive electrode film, which are respectively away from two edges of the capacitor monoblock, are non-covering regions, and the width of each non-covering region is about 0.2 mm.
A laminated capacitor with a specification of 2V/100 muF is prepared, and the height of the product is 0.562 mm.
Example 4
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step11, preparation of monomer:
cutting a valve metal sheet with a thickness of 75 mu m and a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through epoxy resin adhesive cathode and anode barrier adhesive with a thickness of 0.03mm, and preparing a conductive polymeric film on the negative electrode area by adopting a vacuum electrolysis one-step polymerization method, wherein the vacuum degree is-97 Kpa, the polymerization temperature is 5 ℃, the polymerization current is 0.1A, and the polymerization time is 10 h; the electrolytic polymerization liquid comprises 2.5 wt% of monomer 3, 4-ethylenedioxythiophene, 95 wt% of solvent water, 1 wt% of doping agent sodium polystyrene sulfonate, 1 wt% of oxidant ammonium persulfate and 0.5 wt% of additive fluorinated acrylic copolymer;
dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.02mm to obtain the monomer.
Step12, stacking:
in the embodiment, only 1 layer of monomers is needed, the designed capacity can be achieved without being connected and laminated through adhesives, and the conductive end slurry can be manufactured after the monomers are dried at 125 ℃/0.8 h.
Step13, manufacturing conductive terminal paste:
coating silver paste on the side end of the negative region and the side end of the micro positive electrode of the laminated body respectively to obtain negative electrode end paste and positive electrode end paste which cover the side end of the negative region and the side end of the micro positive electrode, wherein the particle size of the silver paste is 6.5 mu m, and the content of the silver paste is 63%. The thickness of the negative end slurry and the thickness of the positive end slurry are both 0.1mm, and the height of the negative end slurry and the height of the positive end slurry are both 90% of the height of the laminated body; and respectively splicing silver foils with the thickness of 0.008mm on the positive electrode end slurry and the negative electrode end slurry to serve as a positive electrode conductive foil and a negative electrode conductive foil, and then curing at the temperature of 95 ℃/1.5h to obtain a to-be-packaged laminated body.
Step14, packaging:
placing the to-be-packaged laminated body in a mode of 12 rows (the distance between the rows is 10mm) and 12 columns (the distance between the columns is 25mm) in a die cavity, filling the rows and the columns with phenolic resin plastic package particles with small particle size of 2mm in diameter, closing the die cavity, performing high-temperature injection molding at 170 ℃, keeping the temperature for 120s, and curing to form a plastic package body, wherein the laminated body, anode end slurry, cathode end slurry, positive conductive foil and negative conductive foil of each to-be-packaged laminated body are completely covered and wrapped by the plastic package body; and then vertically cutting the plastic package body by a laser method to obtain a plurality of capacitor single blocks, wherein only two sides of each capacitor single block are respectively exposed out of the local positive electrode conductive foil and the local negative electrode conductive foil, and the rest parts are completely covered by the plastic package body.
Step15, manufacturing extraction electrode:
and sequentially sputtering a 1-micron copper layer and a 3.5-micron tin layer on one side of the capacitor monoblock with the local negative electrode conductive foil to form a side U-shaped negative electrode film, and sequentially sputtering a 1-micron copper layer and a 3.5-micron tin layer on one side of the capacitor monoblock with the local positive electrode conductive foil to form a side U-shaped positive electrode film, wherein the upper end and the lower end of the positive electrode film extend to be arranged on the upper side and the lower side of the capacitor monoblock respectively, and the upper end and the lower end of the negative electrode film extend to be arranged on the upper side and the lower side of the capacitor monoblock respectively. The length of the negative electrode film and the positive electrode film covering the upper side and the lower side of the capacitor monolith in the longitudinal direction is about 0.8 mm; in the width direction, the regions of two sides of the negative electrode film, which are respectively away from two edges of the capacitor monoblock, are non-covering regions, the regions of two sides of the positive electrode film, which are respectively away from two edges of the capacitor monoblock, are non-covering regions, and the width of each non-covering region is about 0.4 mm.
A laminated capacitor having a specification of 6.3V/47 muF was prepared, and the height of the product was 0.494 mm.
Example 5
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step11, preparation of monomer:
cutting a 125-micrometer-thick valve metal sheet with a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through a 0.125-mm-thick acrylic resin adhesive negative and positive barrier adhesive, and preparing a conductive polymeric membrane on the negative electrode area by adopting a vacuum electrolysis one-step polymerization method, wherein the vacuum degree is-95 Kpa, the polymerization temperature is 30 ℃, the polymerization current is 2A, and the polymerization time is 0.8 h; the electrolytic polymerization solution comprises 20 wt% of monomer thiophene, 70 wt% of mixed solution of solvent water and ethanol, 8 wt% of dopant 4-sulfo-1, 8-naphthalic anhydride, 1.25 wt% of oxidant sulfurous acid and 0.75 wt% of additive triethanolamine oleate;
dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.08mm to obtain the monomer.
Step12, stacking:
the embodiment only has 1 layer of monomer, and the volume that can reach the design need not to range upon range of through bonding body interconnect, and the monomer adopts 175 ℃/2.3h to make electrically conductive end paste after drying.
Step13, manufacturing conductive terminal paste:
coating silver paste on the side end of the negative electrode area and the side end of the micro positive electrode of the laminated body respectively to obtain negative electrode end paste and positive electrode end paste covering the side ends of the negative electrode area and the micro positive electrode area, wherein the particle size of the silver paste is 9 micrometers, and the content of the silver paste is 71%. The covering length is 0.2mm, and the heights of the covering layers are all 110% of the height of the laminated body; and respectively splicing 0.015mm thick tin foils serving as a positive conductive foil and a negative conductive foil on the positive end slurry and the negative end slurry, and then curing at the temperature of 130 ℃/0.5 h.
Step14, packaging:
placing the laminates to be packaged in a mode of 25 rows (the distance between the rows is 20mm) and 25 columns (the distance between the columns is 35mm) in a die cavity, filling the rows and the columns with granular polyether-ether-ketone plastic package particles with small particle sizes of 4mm in diameter, closing the die cavity, performing high-temperature injection molding at 220 ℃, keeping the temperature for 160s, and curing to form a plastic package body, wherein the laminate, anode end slurry and cathode end slurry, and a positive conductive foil and a negative conductive foil of each laminate to be packaged are completely covered and wrapped by the plastic package body; and then vertically cutting the plastic package body through a diamond saw blade to obtain a plurality of capacitor single blocks, wherein only two sides of each capacitor single block are respectively exposed out of the local positive conductive foil and the local negative conductive foil, and the rest parts are completely covered by the plastic package body.
Step15, manufacturing a leading electrode:
and sequentially sputtering a 2 mu m copper layer and a 6.5 mu m tin layer plated on one side of the capacitor monoblock with the local negative electrode conductive foil to form a side U-shaped negative electrode film, and sequentially sputtering a 2 mu m copper layer and a 6.5 mu m tin layer plated on one side of the capacitor monoblock with the local positive electrode conductive foil to form a side U-shaped positive electrode film, wherein the upper end and the lower end of the positive electrode film extend to be arranged on the upper side and the lower side of the capacitor monoblock respectively, and the upper end and the lower end of the negative electrode film extend to be arranged on the upper side and the lower side of the capacitor monoblock respectively. The length of the negative electrode film and the positive electrode film covering the upper side and the lower side of the capacitor monolith in the longitudinal direction is about 1.6 mm; in the width direction, the regions of two sides of the negative electrode film, which are respectively away from two edges of the capacitor block, are non-covered regions, the regions of two sides of the positive electrode film, which are respectively away from two edges of the capacitor block, are non-covered regions, and the width of each non-covered region is about 0.8 mm.
A laminated capacitor having a specification of 10V/56 μ F was prepared, and the height of the product was 0.525 mm.
Example 6
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step21, preparation of monomer: performing primary formation by using the impregnation formation liquid, impregnating the dispersion liquid containing polypyrrole,
cutting a valve metal sheet with a thickness of 100 mu m and a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area by insulating glue with a thickness of 0.004mm, impregnating the positive electrode area and the negative electrode area with a forming solution for one-time forming, then impregnating the positive electrode area and the negative electrode area with a dispersion liquid containing polypyrrole, wherein the impregnation temperature is 40 ℃, the impregnation time is 5min, airing the dispersion liquid for 20min after impregnation is finished, and drying the dispersion liquid at the speed of 100 ℃/13min to obtain the valve metal sheet with the conductive polymer film. Then carrying out secondary formation, then impregnating electrolytic solution, and forming a conductive polymeric membrane by adopting an electrolytic polymerization method, wherein the polymerization temperature is 10 ℃, the polymerization current is 0.004A, and the polymerization time is 23 h; the electrolytic solution comprises 0.5 wt% of monomer pyrrole, 97 wt% of solvent water and 2.5 wt% of doping agent sodium polyvinyl sulfonate;
dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste, and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0mm to obtain the monomer.
Step22, stacking:
and (3) mutually connecting and laminating the cathode regions of the two monomers through the adhesive to achieve the designed capacity, aligning and laminating the micro anodes, connecting the micro anodes without the adhesive, and drying after lamination to obtain the laminated body. The grain diameter of the adopted conductive silver paste adhesive is 2 mu m, the content is 75wt percent for connection, and then drying is carried out at 100 ℃/3 h.
Step23, manufacturing conductive end paste;
step24, packaging;
step25, manufacturing a leading electrode;
step23-25 is the same as Step13-15 of example 1 and will not be described in detail.
A laminated capacitor having a 25V/22 μ F gauge was prepared with a product height of 0.728 mm.
Example 7
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step21, preparation of monomer:
cutting a 110-micrometer-thick valve metal sheet with a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through a 0.006-mm-thick polyurethane adhesive negative and positive barrier adhesive, applying an impregnation forming solution to carry out primary forming, then impregnating a dispersion liquid containing polythiophene, wherein the impregnation temperature is 50 ℃, the impregnation time is 3min, airing for 11min after impregnation is finished, and then drying at 115 ℃/8min to obtain the valve metal sheet with the conductive polymer film. Then carrying out secondary formation, and then forming a conductive polymeric membrane by using a vacuum electrolytic polymerization method by impregnating electrolytic solution, wherein the vacuum degree is-95 Kpa, the polymerization temperature is 6 ℃, the polymerization current is 0.252A, and the polymerization time is 12 h; the electrolytic solution comprises 7.75 wt% of monomer thiophene, 86.75 wt% of solvent ethanol, 4.25 wt% of doping agent m-sulfobenzamide and 1.25 wt% of additive sodium sarcosinate.
Dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.05mm to obtain the monomer.
Step22, stacking:
in this embodiment, only 1 single body is used, and the designed capacity can be achieved without laminating the single bodies to each other through an adhesive.
Step23, manufacturing conductive terminal paste;
step24, packaging;
step25, manufacturing a leading electrode;
step23-25 is the same as Step13-15 of example 2 and will not be described in detail.
A laminated capacitor with a specification of 25V/10 muF is prepared, and the height of the product is 0.527 mm.
Example 8
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step21, preparation of monomer:
cutting a valve metal sheet with a thickness of 120 mu m and a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through a fluorine-containing resin adhesive cathode-anode blocking adhesive with a thickness of 0.008mm, applying an impregnation formation solution to carry out primary formation, then impregnating a dispersion solution containing polyaniline, wherein the impregnation temperature is 60 ℃, the impregnation time is 1min, airing for 2min after the impregnation is finished, and drying at 130 ℃/3min to obtain the valve metal sheet with the conductive polymer film. Then carrying out secondary formation, and then forming a conductive polymeric membrane by using a vacuum electrolytic polymerization method by impregnating electrolytic solution, wherein the vacuum degree is-100 Kpa, the polymerization temperature is 2 ℃, the polymerization current is 0.5A, and the polymerization time is 1 h; the electrolytic solution comprises 15 wt% of monomer aniline, 82 wt% of mixed solution of solvent water and ethanol, 2.5 wt% of doping agent sodium iodide and 0.5 wt% of additive hydroquinone.
Dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.1mm to obtain the monomer.
Step22, stacking:
and (3) mutually connecting and laminating the cathode regions of the two monomers through the adhesive to achieve the designed capacity, aligning and laminating the micro anodes, connecting the micro anodes without the adhesive, and drying after lamination to obtain the laminated body. The grain diameter of the adopted conductive silver paste adhesive is 16 mu m, the content is 75wt percent for connection, and then drying is carried out at 200 ℃/0.05 h.
Step23, manufacturing conductive end paste;
step24, packaging;
step25, manufacturing an extraction electrode;
steps 23-25 are the same as Step13-15 in example 3, and are not described in detail.
A laminated capacitor having a specification of 16V/33 μ F was prepared, and the product height was 0.762 mm.
Example 9
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step21, preparation of monomer:
cutting a 105-micrometer-thick valve metal sheet with a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through a 0.005-mm-thick epoxy resin adhesive cathode-anode blocking adhesive, applying an impregnation forming solution to carry out primary forming, impregnating a dispersion liquid containing poly 3, 4-ethylenedioxythiophene, wherein the impregnation temperature is 45 ℃, the impregnation time is 2min, airing for 7min after impregnation is finished, and drying at 105 ℃/6min to obtain the valve metal sheet with the conductive polymer film. Then carrying out secondary formation, and then forming a conductive polymeric membrane by using a vacuum electrolytic polymerization method by impregnating electrolytic solution, wherein the vacuum degree is-97 Kpa, the polymerization temperature is 4 ℃, the polymerization current is 0.12A, and the polymerization time is 8 h; the electrolytic solution comprises 5.25 wt% of monomer 3, 4-ethylenedioxythiophene, 90.75 wt% of solvent water, 3.25 wt% of doping agent sodium polystyrene sulfonate and 0.75 wt% of additive fluorinated acrylic copolymer.
Dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.02mm to obtain the monomer.
Step22, stacking:
and (3) mutually connecting and laminating the cathode regions of the two monomers through the adhesive to achieve the designed capacity, aligning and laminating the micro anodes, connecting the micro anodes without the adhesive, and drying after lamination to obtain the laminated body. The grain diameter of the adopted conductive silver paste adhesive is 6 mu m, the content is 60wt percent for connection, and then drying is carried out at 125 ℃/0.8 h.
Step23, manufacturing conductive terminal paste;
step24, packaging;
step25, manufacturing a leading electrode;
step23-25 is the same as Step13-15 of example 4 and will not be described in detail.
A laminated capacitor with a specification of 20V/33 muF is prepared, and the height of the product is 0.755 mm.
Example 10
A method of manufacturing a double-sided mountable laminated capacitor, comprising the steps of:
step21, preparation of monomer:
cutting a valve metal sheet with a thickness of 115 mu m and a dielectric layer, dividing the valve metal sheet into a positive electrode area and a negative electrode area through acrylic resin adhesive cathode and anode barrier adhesive with a thickness of 0.007mm, impregnating the positive electrode area and the negative electrode area with a forming solution for primary forming, impregnating a dispersion liquid containing polythiophene, wherein the impregnation temperature is 55 ℃, the impregnation time is 4min, airing the dispersion liquid for 15min after the impregnation is finished, and drying the dispersion liquid at 125 ℃/10min to obtain the valve metal sheet with the conductive polymer film. Then carrying out secondary formation, and then forming a conductive polymeric membrane by using a vacuum electrolytic polymerization method by impregnating electrolytic solution, wherein the vacuum degree is-95 Kpa, the polymerization temperature is 8 ℃, the polymerization current is 0.38A, and the polymerization time is 16 h; the electrolytic solution comprises 12.25 wt% of monomer thiophene, 80.7 wt% of mixed solution of solvent water and ethanol, 5.3 wt% of dopant 4-sulfo-1, 8-naphthalic anhydride and 1.75 wt% of additive sodium sarcosinate.
Dipping the valve metal sheet covered with the polypyrrole conductive polymer into graphite slurry and drying to form a conductive carbon film;
dipping the valve metal sheet covered with the conductive graphite into the silver paste and drying to form a conductive silver film;
and cutting off the positive electrode area originally used for welding, and only leaving the micro positive electrode with the width of 0.08mm to obtain the monomer.
Step22, stacking:
the embodiment only has 1 layer of monomer, and the volume that can reach the design need not to range upon range of through bonding body interconnect, and the monomer adopts 175 ℃/2.3h to make electrically conductive end paste after drying.
Step23, manufacturing conductive terminal paste;
step24, packaging;
step25, manufacturing a leading electrode;
step23-25 is the same as Step13-15 of example 1 and will not be described in detail.
A laminated capacitor having a specification of 25V/10 μ F was prepared, and the height of the product was 0.539 mm.
Comparative example 1
This comparative example is based on example 1, differing from example 1 only in that: cutting off the positive electrode area for welding, and leaving the positive electrode area with the width of 0.8mm to form a single body with a welding area; and (3) mutually laminating the cathode regions of the 2 single bodies and the cathode lead frames through bonding bodies to achieve the designed capacity, simultaneously welding, aligning and laminating the anode regions and the anode lead frames, and drying after lamination.
Because there is the lead frame, can't adopt the novel packaging technology of embodiment 1, so adopt current 8 draft angle packaging technology, specifically do: placing the laminated body in an encapsulating mold, wherein a cavity in the mold has a demoulding angle of 8 degrees so as to facilitate demoulding of the plastic-sealed body; and after the solidification is finished, bending the anode lead frame and the cathode lead frame exposed out of the plastic package body to the bottom of the plastic package body.
Comparative example 2
This comparative example is based on example 2, differing from example 2 only in that: the normal pressure electrolytic polymerization method is adjusted to be a vacuum electrolytic polymerization method, and the vacuum degree is set to be 95 Kpa.
Comparative example 3
This comparative example is based on example 3, differing from example 3 only in that: the electrolytic polymerization solution comprises 14 wt% of monomer aniline, 80 wt% of mixed solution of solvent water and ethanol, 5 wt% of doping agent sodium iodide and 1 wt% of additive hydroquinone.
Comparative example 4
This comparative example is based on example 3, differing from example 3 only in that: the electrolytic polymerization solution comprises 14 wt% of monomer aniline, 71 wt% of mixed solution of solvent water and ethanol, 5 wt% of doping agent sodium iodide and 10 wt% of oxidizing agent hydrogen peroxide.
Comparative example 5
This comparative example is based on example 3, differing from example 3 only in that: the additive of the electrolytic polymerization liquid is sodium dodecyl sulfate.
Comparative example 6
This comparative example is based on example 3, differing from example 3 only in that: the additive of the electrolytic polymerization liquid is changed into dibutyl hydroxy toluene.
Comparative example 7
This comparative example is based on example 7, differing from example 7 only in that: the electrolytic solution comprises 7.75 wt% of monomer thiophene, 88 wt% of solvent ethanol and 4.25 wt% of doping agent m-sulfobenzamide.
Comparative data of electrical properties of the above examples 1 to 10 and comparative examples 1 to 7 are shown in the following table:
it should be understood that the above-described embodiments are merely illustrative of some, but not all, embodiments of the present application, and that the present invention is not limited by the scope of the appended claims. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that modifications can be made to the embodiments described in the foregoing detailed description, or equivalents can be substituted for some of the features described therein. All equivalent structures made by using the contents of the specification and the attached drawings of the present application are directly or indirectly applied to other related technical fields, and are within the protection scope of the present application patent.
Claims (12)
1. A method for manufacturing a double-sided-mountable laminated capacitor is characterized by comprising the following steps:
step11, preparation of monomer: dividing a valve metal sheet with a dielectric layer on the surface into a positive electrode area and a negative electrode area through insulating glue, sequentially preparing a conductive polymer film, a conductive carbon film and a conductive silver film on the negative electrode area, and cutting the positive electrode area into micro positive electrodes;
step12, stacking: stacking at least one monomer, aligning and electrically connecting the cathode regions, and aligning the micro anodes to obtain a stacked body;
step13, manufacturing conductive terminal paste: covering a negative electrode end slurry and a positive electrode end slurry on the side end of the negative electrode area and the side end of the micro positive electrode area of the laminated body respectively, inserting a negative electrode conductive foil and a positive electrode conductive foil into the negative electrode end slurry and the positive electrode end slurry respectively, and then curing the negative electrode end slurry and the positive electrode end slurry to obtain the laminated body to be packaged;
step14, packaging: arranging a plurality of laminates to be packaged in a matrix in a die cavity for plastic packaging to form a plastic packaging body wrapping all laminates to be packaged, and linearly cutting the plastic packaging body to obtain a plurality of capacitor single blocks, wherein a local negative electrode conductive foil and a local positive electrode conductive foil are respectively exposed at two sides of each capacitor single block;
step15, manufacturing a leading electrode: arranging a negative electrode film on the side edge of the capacitor monoblock and electrically connecting the negative electrode film with the local negative conductive foil, wherein two ends of the negative electrode film are respectively extended and arranged on the upper side and the lower side of the capacitor monoblock; and arranging a positive electrode film at the side edge of the capacitor block and electrically connecting the positive electrode film with the local positive conductive foil, wherein two ends of the positive electrode film are respectively extended and arranged at the upper side and the lower side of the capacitor block.
2. A method for manufacturing a double-sided-mountable laminated capacitor is characterized by comprising the following steps of:
step21, preparation of monomer: dividing a valve metal sheet with a dielectric layer on the surface into a positive electrode area and a negative electrode area through insulating glue, sequentially carrying out primary formation, conductive polymer film preparation, secondary formation, conductive polymer film preparation, conductive carbon film preparation and conductive silver film preparation on the negative electrode area, and cutting the positive electrode area into micro positive electrodes;
step22, stacking: stacking at least one monomer, aligning and electrically connecting the cathode regions, and aligning the micro anodes to obtain a stacked body;
step23, manufacturing conductive terminal paste: covering a negative electrode end slurry and a positive electrode end slurry on the side end of a negative electrode area and the side end of a micro positive electrode of the laminated body respectively, inserting a negative electrode conductive foil and a positive electrode conductive foil into the negative electrode end slurry and the positive electrode end slurry respectively, and then curing the negative electrode end slurry and the positive electrode end slurry to obtain a laminated body to be packaged;
step24, packaging: arranging a plurality of laminates to be packaged in a matrix in a die cavity for plastic packaging to form a plastic packaging body wrapping all laminates to be packaged, and linearly cutting the plastic packaging body to obtain a plurality of capacitor single blocks, wherein a local negative electrode conductive foil and a local positive electrode conductive foil are respectively exposed at two sides of each capacitor single block;
step25, manufacturing a leading electrode: arranging a negative electrode film on the side edge of the capacitor monoblock and electrically connecting the negative electrode film with the local negative conductive foil, wherein two ends of the negative electrode film are respectively extended and arranged on the upper side and the lower side of the capacitor monoblock; and arranging a positive electrode film at the side edge of the capacitor block and electrically connecting the positive electrode film with the local positive conductive foil, wherein two ends of the positive electrode film are respectively extended and arranged at the upper side and the lower side of the capacitor block.
3. The method of manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein the length of the micro positive electrode is 0mm to 0.1 mm.
4. The method for manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein the coverage length of the negative electrode end paste and the positive electrode end paste is controlled to be 0.05 to 0.3 mm.
5. The method for manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein the curing temperature is controlled to 80 ℃ to 150 ℃ and the curing time is controlled to 0.1h to 2 h.
6. The method of manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein said conductive polymer film is prepared by vacuum electrolytic polymerization.
7. The method of claim 2, wherein the conductive polymer film is obtained by impregnating a dispersion liquid.
8. The method for manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein a plurality of said stacked bodies to be packaged are filled with plastic particles in the mold cavity to be supported at intervals.
9. The method for manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein the matrix arrangement is arranged in a plurality of rows and columns, the distance between the rows is 5-33 mm, and the distance between the columns is 20-40 mm.
10. The method for manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein the step of manufacturing the extraction electrode specifically comprises: and sequentially sputtering a copper layer and a tin-electroplated layer-forming side U-shaped negative electrode film on one side of the capacitor monolith having the partial negative electrode conductive foil, and sequentially sputtering a copper layer and a tin-electroplated layer-forming side U-shaped positive electrode film on one side of the capacitor monolith having the partial positive electrode conductive foil.
11. The method of manufacturing a double-sided mountable laminated capacitor as claimed in claim 10, wherein the copper layer has a thickness of 1 to 2 μm and the tin layer has a thickness of 2 to 8 μm.
12. The method for manufacturing a double-sided mountable laminated capacitor as claimed in claim 1 or 2, wherein the widths of the negative electrode film and the positive electrode film are smaller than the width of the post-package mold body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210404450.1A CN115101338A (en) | 2022-04-18 | 2022-04-18 | Manufacturing method of laminated capacitor capable of being pasted on two sides |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210404450.1A CN115101338A (en) | 2022-04-18 | 2022-04-18 | Manufacturing method of laminated capacitor capable of being pasted on two sides |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115101338A true CN115101338A (en) | 2022-09-23 |
Family
ID=83287661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210404450.1A Pending CN115101338A (en) | 2022-04-18 | 2022-04-18 | Manufacturing method of laminated capacitor capable of being pasted on two sides |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115101338A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020092029A (en) * | 2001-06-01 | 2002-12-11 | 삼성에스디아이 주식회사 | Lithium-sulfur battery |
| CN104637690A (en) * | 2015-02-06 | 2015-05-20 | 肇庆绿宝石电子科技股份有限公司 | Solid electrolyte aluminum electrolytic capacitor and manufacturing method thereof |
| CN105738827A (en) * | 2016-03-28 | 2016-07-06 | 合肥国轩高科动力能源有限公司 | Comprehensive performance evaluation method for conductive slurry of lithium ion battery |
| CN207199469U (en) * | 2017-06-06 | 2018-04-06 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | A kind of novel multi-layer sheets type ceramic dielectric capacitor |
| CN108109841A (en) * | 2017-11-18 | 2018-06-01 | 湖南艾华集团股份有限公司 | Stacked capacitor and manufacturing method |
| CN110349762A (en) * | 2019-07-22 | 2019-10-18 | 丰宾电子（深圳）有限公司 | A kind of manufacturing method of solid electrolyte/aluminum electrolytic capacitor |
| CN113643901A (en) * | 2021-07-07 | 2021-11-12 | 张彩欣 | Chip type solid aluminum electrolytic capacitor and preparation method thereof |
-
2022
- 2022-04-18 CN CN202210404450.1A patent/CN115101338A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020092029A (en) * | 2001-06-01 | 2002-12-11 | 삼성에스디아이 주식회사 | Lithium-sulfur battery |
| CN104637690A (en) * | 2015-02-06 | 2015-05-20 | 肇庆绿宝石电子科技股份有限公司 | Solid electrolyte aluminum electrolytic capacitor and manufacturing method thereof |
| CN105738827A (en) * | 2016-03-28 | 2016-07-06 | 合肥国轩高科动力能源有限公司 | Comprehensive performance evaluation method for conductive slurry of lithium ion battery |
| CN207199469U (en) * | 2017-06-06 | 2018-04-06 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | A kind of novel multi-layer sheets type ceramic dielectric capacitor |
| CN108109841A (en) * | 2017-11-18 | 2018-06-01 | 湖南艾华集团股份有限公司 | Stacked capacitor and manufacturing method |
| CN110349762A (en) * | 2019-07-22 | 2019-10-18 | 丰宾电子（深圳）有限公司 | A kind of manufacturing method of solid electrolyte/aluminum electrolytic capacitor |
| CN113643901A (en) * | 2021-07-07 | 2021-11-12 | 张彩欣 | Chip type solid aluminum electrolytic capacitor and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113012942B (en) | Solid electrolytic capacitor | |
| CN100466124C (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| CN109791844B (en) | Solid electrolytic capacitor | |
| KR101142312B1 (en) | Solid electrolytic capacitor element and method for producing solid electrolytic capacitor element | |
| EP1215691B1 (en) | Solid electrolytic capacitor and method of manufacture thereof | |
| US20090195968A1 (en) | Solid electrolytic capacitor | |
| US6906912B2 (en) | Solid electrolytic capacitor and method of producing the same | |
| US11915886B2 (en) | Solid electrolytic capacitor | |
| US20230368980A1 (en) | Electrolytic capacitor and method for manufacturing electrolytic capacitor | |
| CN103366957A (en) | Multi-core-combined ceramic capacitor and manufacturing method thereof | |
| CN112164589B (en) | Solid-state aluminum electrolytic capacitor and preparation method thereof | |
| CN105428062A (en) | Multi-core assembly ceramic capacitor with low ESR value and manufacturing method thereof | |
| CN115064385A (en) | Manufacturing method of chip capacitor, polymerization solution and polymerization method | |
| CN115101338A (en) | Manufacturing method of laminated capacitor capable of being pasted on two sides | |
| CN109637811A (en) | A kind of chip-type laminated solid aluminum electrolytic capacitor of ultrathin type polymer and preparation method | |
| CN113990664B (en) | Manufacturing method of laminated chip type solid aluminum electrolytic capacitor | |
| CN205452049U (en) | Low ceramic capacitor of ESR value multicore group | |
| CN215644140U (en) | Large-scale aluminum electrolytic capacitor packaging cover plate and aluminum electrolytic capacitor | |
| JP2020167267A (en) | Electrolytic capacitor and manufacturing method thereof | |
| WO2023153432A1 (en) | Electrolytic capacitor element | |
| US11515098B2 (en) | Solid electrolytic capacitor and method of producing solid electrolytic capacitor | |
| CN115101344A (en) | Manufacturing method of wide-temperature high-capacity ultrathin capacitor | |
| CN204215901U (en) | The solid electrolytic capacitor of metal anode improvement | |
| CN114334468A (en) | Chip type laminated solid-state aluminum electrolytic capacitor and preparation method thereof | |
| WO2023090141A1 (en) | Electrolytic capacitor element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |