CN115091107A - High-precision clamping device and method for laser processing - Google Patents
High-precision clamping device and method for laser processing Download PDFInfo
- Publication number
- CN115091107A CN115091107A CN202211015796.9A CN202211015796A CN115091107A CN 115091107 A CN115091107 A CN 115091107A CN 202211015796 A CN202211015796 A CN 202211015796A CN 115091107 A CN115091107 A CN 115091107A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- horizontal adjusting
- adjusting device
- edge
- microscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a high-precision clamping device and a clamping method for laser processing, which relate to the technical field of ultra-precision processing devices and comprise a structural support group, a low-speed rotating shaft, a two-degree-of-freedom micro-displacement platform with two-degree-of-freedom translation, a horizontal adjusting device, a high-power microscope and a microscope support; the high-power microscope is mounted on the microscope support and positioned above the horizontal adjusting device, and concentric annular marking lines and a positioning center which are convenient for placing and initially positioning workpieces are arranged on the upper surface of the horizontal adjusting device; the invention can improve the consistency of the processing precision and the processing quality of different positions of the surface of the workpiece in the laser processing process.
Description
Technical Field
The invention relates to the technical field of ultra-precision machining devices, in particular to the technical field of a high-precision clamping device and a clamping method for laser machining.
Background
Laser processing is a processing mode for realizing material removal by utilizing interaction between high-energy heat flow generated by a laser beam at a focusing position and materials, particularly, pulse laser processing has the advantages of high efficiency, accuracy, universality and diversity of processed materials and the like, and is an effective means for precisely processing various materials, so that the laser processing is widely applied to processing key parts in the fields of optics, electronics, aerospace and the like. With the rapid development in the fields of optics, electronics, aerospace, machinery and the like, the requirements on the aspects of laser processing efficiency, processing precision, processing quality and the like of key parts are higher and higher.
However, because the laser energy belongs to gaussian distribution, the size of a laser spot and the laser energy density can be changed due to different defocusing amounts, a laser focal spot and a workpiece can move relatively in the laser processing process, and if the flatness of the workpiece is not high, the defocusing amounts of different processing positions on the surface of the workpiece can be changed, so that the processing quality of the different positions on the surface of the workpiece and the consistency of the processing precision are directly influenced; in addition, for the processing of the rotational symmetric structure (such as ring grating, spherical and aspherical lenses, radial spline curve, etc.) on the surface of the workpiece, the high coaxial precision rotational motion of the workpiece needs to be realized in the processing process.
Therefore, in order to ensure the consistency of the processing precision and the processing quality of different positions of the surface of the workpiece in the laser processing process and realize the laser processing of high coaxial precision of a rotational symmetric structure (such as a ring grating, a spherical and aspheric lens, a radial spline curve and the like) of the surface of the workpiece, a high-precision clamping device and a clamping method which are specially used for the laser processing and can adjust the surface flatness and the rotational coaxiality of the surface of the workpiece need to be designed.
Disclosure of Invention
The invention aims to: in order to solve the above technical problems, the present invention provides a high precision clamping apparatus and a clamping method for laser processing, which can realize high precision adjustment of workpiece surface flatness and coaxiality between a workpiece center and a rotation center, not only can improve consistency of processing precision and processing quality of different positions of the workpiece surface in a laser processing process, but also can realize laser processing of a rotation symmetrical structure (such as a ring grating, a spherical and aspherical lens, a radial spline curve, etc.) with high coaxiality precision.
The invention specifically adopts the following technical scheme for realizing the purpose:
a high-precision clamping device for laser processing comprises a structural support group, a low-speed rotating shaft, a two-degree-of-freedom micro-displacement platform for realizing two-degree-of-freedom translation of a workpiece in XY directions, a horizontal adjusting device, a high-power microscope for assisting in determining the flatness and coaxiality of the workpiece, and a microscope support;
the high-power microscope is characterized in that the low-speed rotating shaft is vertically arranged on the structure support group through a bearing seat, the top of the low-speed rotating shaft penetrates through the structure support group and is connected with the bottom of the two-degree-of-freedom micro-displacement platform through a screw and a shaft sleeve, a horizontal adjusting device is mounted at the top of the two-degree-of-freedom micro-displacement platform, the microscope support is movably arranged on one side of the structure support group, the high-power microscope is mounted on the microscope support and is located above the horizontal adjusting device, and concentric annular marked lines and a positioning center which are convenient for placing and initial positioning of workpieces are arranged on the upper surface of the horizontal adjusting device.
Further, horizontal adjusting device includes horizontal adjusting device upper flat surface, horizontal adjusting device lower flat surface, connects four elastic bolt subassemblies in horizontal adjusting device upper flat surface and horizontal adjusting device lower flat surface four corners department, and elastic bolt subassembly establishes the spring on horizontal adjusting screw between horizontal adjusting device upper flat surface and horizontal adjusting device lower flat surface including running through horizontal adjusting device upper flat surface and horizontal adjusting device lower flat surface horizontal adjusting screw and cover, horizontal adjusting device upper flat surface top has laser etching to process the interval and is 2 mm's concentric circles marking and positioning center to the placing and preliminary location of work piece are convenient for.
Furthermore, the structural support group comprises a reverse-U-shaped support frame with a downward opening and two support ear plates arranged at two sides of the bottom of the reverse-U-shaped support frame, and a reinforcing rib plate is arranged between each support ear plate and the reverse-U-shaped support frame.
Furthermore, the high power microscope has scales, the magnification is 21-150 times, the pixel size is 2.75 microns, the microscope support comprises a movable seat fixed on the structure support group through bolts and an L-shaped mounting rack movably inserted on the movable seat, the L-shaped mounting rack comprises a vertical rod movably inserted in the movable seat and a horizontal rod connected with the top of the vertical rod, the high power microscope is mounted at the tail end of the horizontal rod, and the position of the microscope can be moved by rotating a shaft of the high power microscope support during working.
Furthermore, the two-degree-of-freedom micro-displacement platform comprises a Y-direction movable plate, an X-direction movable plate and a fixed bottom plate, wherein the Y-direction movable plate and the X-direction movable plate are sequentially arranged from top to bottom, the fixed bottom plate is arranged at the top of the low-speed rotating shaft, a Y-direction roller guide rail is arranged between the Y-direction movable plate and the X-direction movable plate, an X-direction roller guide rail is arranged between the X-direction movable plate and the fixed bottom plate, and the Y-direction roller guide rail and the X-direction roller guide rail form a cross roller guide rail assembly.
A high-precision clamping method for laser processing comprises the following steps:
the method comprises the following steps: firstly, fixing a structural support group on a machine tool;
step two: preliminarily positioning a workpiece with the diameter of 4mm and the thickness of 1mm at the center of an upper plane by referring to an upper surface marking and a positioning center of the horizontal adjusting device;
step three: after a workpiece is fixed on the upper surface of a horizontal adjusting device, a high-power microscope is used for in-place observation, the clockwise four directions of the edge of an annular marking on the upper surface of the horizontal adjusting device are defined as A, B, C, D, four elastic bolt assemblies are defined as E, F, G, H, A is the inner side, E is the inner left side, firstly, a microscope support is rotated, a high-power microscope is aligned to the edge in the A direction and focused, and at the moment, the focus is at the same height as the edge of the workpiece;
step four: the workpiece is driven to rotate 90 degrees counterclockwise at a low speed through the low-speed rotating shaft, and a defocusing phenomenon appears in the rotating process to the edge in the direction B, which indicates that the surface of the workpiece is not horizontal;
step five: finding that the defocusing direction is positive through the high-power microscope, adjusting an F, G elastic bolt component corresponding to the B side in the leveling device by using an inner hexagonal wrench for fine adjustment, loosening a spring to enable the plane to be adjusted upwards until the picture in the high-power microscope is clear again, and then adjusting the edge in the B direction to be the same as the edge in the A direction;
step six: the workpiece is driven to rotate 90 degrees counterclockwise at a low speed through the low-speed rotating shaft to the edge in the direction C, and a defocusing phenomenon still occurs in the rotating process, so that the surface of the workpiece is not horizontal;
step seven: finding that the defocusing direction is still positive through a high-power microscope, adjusting an G, H elastic bolt component corresponding to the side C in the leveling device by using an inner hexagonal wrench for fine adjustment, and loosening a spring to enable the plane to be adjusted upwards until the picture in the microscope display is clear again;
step eight: the workpiece is continuously driven to rotate at a low speed anticlockwise through the low-speed rotating shaft, the phenomenon of defocusing does not occur in the rotating process, and the levelness adjustment of the workpiece is finished;
step nine: firstly, rotating a structural support group to enable a lens to be aligned to the edge A of a circular workpiece, and calibrating the point to be N through a high power microscope;
step ten: rotating the rotating shaft at a low speed anticlockwise by 180 degrees to the edge in the C direction, observing that the edge in the C direction of the workpiece is not overlapped with a marking point N in a view field, and marking the point as an M point;
step eleven: measuring the distance L (unit mum) between MNs through the high-power microscope scales, manually adjusting through a two-degree-of-freedom micro-displacement platform, and moving the distance L/2 in the direction A;
step twelve: rotating the structural support group to align the lens to the edge B direction of the circular workpiece, calibrating the point to be N1 by a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge D direction, calibrating the point to be M1 point, and measuring the distance L1;
step thirteen: the workpiece is moved to the direction B by a distance L1/2 by manually adjusting the two-degree-of-freedom micro-displacement platform;
fourteen steps: rotating the structural support group to enable the view field of the structural support group to be aligned to the edge C direction of the circular workpiece, calibrating the point to be N2 through a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge of the direction A, calibrating the point to be M2 point, and measuring the distance L2;
step fifteen: the workpiece is moved to the C direction by a distance L2/2 by manually adjusting the two-degree-of-freedom micro-displacement platform;
sixthly, the steps are as follows: rotating the structural support group to enable the lens to be aligned to the edge D of the circular workpiece, calibrating the point to be N3 through a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge in the direction B, calibrating the point to be M3 point, and measuring the distance L3;
a fifteenth step: the workpiece is moved to the direction B by a distance L3/2 by manually adjusting the two-degree-of-freedom micro-displacement platform;
sixthly, the step of: and continuing to rotate the workpiece at a low speed, and observing that no deviation phenomenon occurs at the edge of the workpiece in each direction in the rotating process, thus proving that the coaxiality adjustment of the workpiece is finished.
The invention has the following beneficial effects:
the invention can solve the problem of high-precision clamping and positioning of a workpiece in the laser processing process, can realize high-precision adjustment of the flatness of the surface of the workpiece and the coaxiality of the center of the workpiece and a rotation center, and the precision can reach within 3 mu m, not only can improve the processing precision and the consistency of the processing quality of different positions of the surface of the workpiece in the laser processing process, but also can realize the laser processing of a rotation symmetrical structure (such as an annular grating, a spherical and non-spherical lens, a radial spline curve and the like) with high coaxiality precision.
The working principle is as follows:
the workpiece levelness adjusting method comprises the following steps: fixing a workpiece on the upper plane of a horizontal adjusting device, observing in place through a high power microscope, firstly rotating a rotating shaft of a microscope bracket, aligning a lens to the edge of the round workpiece in the A direction of a reticle and focusing, wherein the focus of the microscope and the edge of the workpiece are at the same height, then driving the workpiece to rotate 90 degrees to the edge in the B direction at a low speed anticlockwise through the rotating shaft of a motor, indicating that the surface of the workpiece is not horizontal if a defocusing phenomenon occurs in the rotating process, adjusting a bolt corresponding to the B side in the leveling device by using an inner hexagon wrench at the moment, if the defocusing direction is positive, adjusting a bolt to loosen a spring to adjust the plane upwards, if the defocusing direction is negative, tightening a bolt to compress the spring to adjust the plane downwards, observing in place through the high power microscope in the adjusting process until the picture is clear again, and sequentially rotating 90 degrees to C, D degrees in the anticlockwise, and repeating the steps until the workpiece is rotated without defocusing, and finishing the levelness adjustment of the workpiece.
The coaxiality adjusting method of the workpiece and the rotation center of the low-speed rotating shaft comprises the following steps: firstly, rotating a structural support group to enable a lens to be aligned to the edge of a circular workpiece in the A direction, calibrating the point to be N through a high power microscope, rotating a rotating shaft 180 degrees to the edge of the C direction anticlockwise, when the center of the workpiece is not coaxial with the rotating center, observing that the edge of the workpiece in the C direction is not coincident with the point N in a view field, calibrating the point to be M, measuring the distance value L through the scale of the high power microscope, manually adjusting through a micro-displacement platform, and moving the distance L/2 to the A direction; and then, rotating a rotating shaft of the high power microscope bracket to enable the lens to be aligned to the edge of the circular workpiece in the B direction, calibrating the point to be N1 through the high power microscope, rotating the rotating shaft 180 degrees anticlockwise to the edge of the D direction, calibrating the point to be M1, measuring the distance L, and repeating the steps until the center of the workpiece is coaxial with the rotation center of the low-speed rotating shaft.
Drawings
Fig. 1 is a schematic view of the overall structure of the invention.
Fig. 2 is a schematic view of the leveling device.
Fig. 3 is a top plan view of the leveling device.
Fig. 4 is a schematic view of a stent set and a rib.
Fig. 5 is a schematic view of a high power camera and its mount.
Fig. 6(a) is a schematic view of the coaxiality adjusting method.
Fig. 6(b) is another schematic diagram of the coaxiality adjusting method.
Fig. 7 is a schematic structural diagram of a two-degree-of-freedom micro-displacement platform.
Fig. 8 is a schematic structural view of a low-speed rotating shaft.
Description of the drawings: the microscope comprises a microscope support 1, a microscope slide 1, a movable seat 1, a microscope slide 2, a microscope high power microscope 3, a horizontal adjusting device upper plane, a horizontal adjusting screw 4, a spring 5, a horizontal adjusting device lower plane 6, a two-degree-of-freedom micro-displacement platform 7, a 7-1-Y-direction movable plate 7, a 7-2-X-direction movable plate 7, a fixed bottom plate 7, a 7-4-Y-direction roller guide rail 7, a 5-X-direction roller guide rail 8, a low-speed rotating shaft 9, a structural support group 9, a reversed U-shaped support frame 9, a support ear plate 2 and a reinforcing rib plate 9, wherein the two-degree-of freedom micro-displacement platform is arranged on the microscope slide 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships usually placed when the products of the present invention are used, and are only used for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed in specific orientations, and operate, and therefore, should not be construed as limiting the present invention.
Example 1
As shown in fig. 1 to 8, the present embodiment provides a high precision clamping device for laser processing, which includes a structural support set 9, a low-speed rotating shaft 8, a two-degree-of-freedom micro-displacement platform 7 for implementing two-degree-of-freedom translation of a workpiece in XY directions, a horizontal adjustment device 3, a high power microscope 2 for assisting in determining flatness and coaxiality of the workpiece, and a microscope support 1;
the high-power microscope is characterized in that a low-speed rotating shaft 8 is vertically arranged on a structure support group 9 through a bearing seat, the top of the low-speed rotating shaft 8 penetrates through the structure support group 9 and is connected with the bottom of a two-degree-of-freedom micro-displacement platform 7 through a screw and a shaft sleeve, a horizontal adjusting device 3 is arranged at the top of the two-degree-of-freedom micro-displacement platform 7, a microscope support 1 is movably arranged on one side of the structure support group 9, a high-power microscope 2 is arranged on the microscope support 1 and is located above the horizontal adjusting device 3, and concentric annular marked lines and a positioning center which are convenient for placing and initial positioning of workpieces are arranged on the upper surface of the horizontal adjusting device 3.
The upper plane 3 of the horizontal adjusting device and the lower plane 6 of the horizontal adjusting device are direction plane plates stacked up and down, through holes are formed in four corners of the upper plane 3 and the lower plane 6 of the horizontal adjusting device, each elastic bolt assembly is arranged at one group of through holes, the spring sleeves the horizontal adjusting screws 4 and is in a compression state and used for supporting the upper plane 3 of the horizontal adjusting device, and the elastic bolt assemblies can loosen or tighten the spring by adjusting the horizontal adjusting screws 4 so as to adjust the angles of the horizontal adjusting screws 4.
The structural support group 9 comprises a reverse U-shaped support frame 9-1 with a downward opening and two support ear plates 9-2 arranged at two sides of the bottom of the reverse U-shaped support frame 9-1, and a reinforcing rib plate 9-3 is arranged between each support ear plate 9-2 and the reverse U-shaped support frame 9-1.
The high-power microscope 2 is provided with scales, the magnification is 21-150 times, the pixel size is 2.75 micrometers, the microscope support 1 comprises a movable seat 1-1 fixed on the structure support group 9 through bolts and an L-shaped mounting rack 1-2 movably inserted on the movable seat 1-1, the L-shaped mounting rack 1-2 comprises a vertical rod movably inserted in the movable seat 1-1 and a horizontal rod connected with the top of the vertical rod, the high-power microscope 2 is installed at the tail end of the horizontal rod, and the position of the microscope can be moved by rotating the shaft of the high-power microscope support during working.
The two-degree-of-freedom micro-displacement platform 7 comprises a Y-direction movable plate 7-1, an X-direction movable plate 7-2 and a fixed bottom plate 7-3 arranged at the top of a low-speed rotating shaft 8, which are sequentially arranged from top to bottom, a Y-direction roller guide rail 7-4 is arranged between the Y-direction movable plate 7-1 and the X-direction movable plate 7-2, an X-direction roller guide rail 7-5 is arranged between the X-direction movable plate 7-2 and the fixed bottom plate 7-3, and the Y-direction roller guide rail 7-4 and the X-direction roller guide rail 7-5 form a cross roller guide rail assembly.
The two-degree-of-freedom micro-displacement platform 7 is made of high-strength aluminum alloy, light in weight and 60mm in table top size. The cross roller guide rail is suitable for high-precision occasions, and can realize two-degree-of-freedom translation of a workpiece in the XY direction, wherein the XY direction strokes are +/-6.5 mm respectively, and the motion precision is 0.1 mm.
Example 2
A high-precision clamping method for laser processing comprises the following steps:
the method comprises the following steps: firstly, a structural support group 9 is fixed on a machine tool, a support group bottom plate is connected with the machine tool through a screw with the model M4, the support group is made of No. 45 steel, and a rib plate on the support group can keep the support stable and not deformed. When the clamp is installed on a machine tool as shown in fig. 1, the clamp bottom plate of the bracket set is connected with the machine tool through screws, as shown in fig. 4;
step two: preliminarily positioning a single-side polished CVD diamond workpiece with the diameter of 4mm and the thickness of 1mm at the center of an upper plane by referring to an upper surface marking and a positioning center of the horizontal adjusting device 3;
step three: after a CVD diamond workpiece is fixed on the upper surface of a horizontal adjusting device 3, through in-place observation of a high power microscope 2, the clockwise four directions of the edge of an annular marking on the upper surface of the horizontal adjusting device 3 are defined as A, B, C, D, four elastic bolt components are defined as E, F, G, H clockwise, A is the inner side, E is the inner left side, firstly, a microscope bracket 1 is rotated, the high power microscope 2 is aligned to the edge of the A direction and focused, and at the moment, the focus is at the same height with the edge of the workpiece;
step four: the workpiece is driven by the low-speed rotating shaft 8 to rotate 90 degrees counterclockwise at a low speed to the edge in the direction B, and a defocusing phenomenon appears in the rotating process, which indicates that the surface of the workpiece is not horizontal;
step five: finding that the defocusing direction is positive through the high-power microscope 2, adjusting an F, G elastic bolt component corresponding to the B side in the leveling device by using an inner hexagonal wrench for fine adjustment, and loosening a spring to enable the plane to be adjusted upwards until the picture in the high-power microscope 2 is clear again, which shows that the edge in the B direction is adjusted to be the same as the edge in the A direction at the moment;
step six: the workpiece is driven to rotate 90 degrees counterclockwise at a low speed through the low-speed rotating shaft 8 again, and a defocusing phenomenon still occurs in the rotating process to the edge in the direction C, which indicates that the surface of the workpiece is not horizontal;
step seven: finding that the defocusing direction is still positive through the high power microscope 2, adjusting an G, H elastic bolt component corresponding to the C side in the leveling device by using an inner hexagonal wrench for fine adjustment, and loosening a spring to enable the plane to be adjusted upwards until the picture in the microscope display is clear again;
step eight: the workpiece is continuously driven to rotate at a low speed anticlockwise through the low-speed rotating shaft 8, the phenomenon of defocusing does not occur in the rotating process, and the levelness adjustment of the workpiece is finished;
step nine: firstly, rotating a structural support group 9 to enable a lens to be aligned to the edge A direction of a circular workpiece, and calibrating the point to be N through a high power microscope, as shown in FIG. 6 (a);
step ten: rotating the rotating shaft at a low speed anticlockwise by 180 degrees to the edge in the C direction, observing that the edge in the C direction of the workpiece is not coincident with a marking point N in a view field, and marking the marking point as an M point, as shown in FIG. 6 (b);
step eleven: measuring the distance L between MNs in unit mum through the scales of the high power microscope 2, manually adjusting the distance L/2 to the A direction through the two-degree-of-freedom micro-displacement platform 7;
step twelve: rotating the structural support group 9 to align the lens to the edge B direction of the circular workpiece, calibrating the point to be N1 by a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge D direction, calibrating the point to be M1 point, and measuring the distance L1;
step thirteen: the workpiece is moved to the direction B by a distance L1/2 by manually adjusting the two-degree-of-freedom micro-displacement platform 7;
fourteen steps: rotating the structural support group 9 to enable the view field of the structural support group to be aligned to the edge C direction of the circular workpiece, calibrating the point to be N2 through a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge of the direction A, calibrating the point to be M2 point, and measuring the distance L2;
step fifteen: the workpiece is moved to the direction C by a distance L2/2 by manually adjusting the two-degree-of-freedom micro-displacement platform 7;
sixthly, the steps are as follows: rotating the structural support group 9 to align the lens to the edge D of the circular workpiece, calibrating the point to be N3 by a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge in the direction B, calibrating the point to be M3 point, and measuring the distance L3;
step fifteen: manually adjusting the two-degree-of-freedom micro-displacement platform 7 to enable the workpiece to move to the B direction by a distance L3/2;
sixthly, the steps are as follows: and continuing to rotate the workpiece at a low speed, and observing that no deviation phenomenon occurs at the edge of the workpiece in each direction in the rotating process, thus proving that the coaxiality adjustment of the CVD diamond workpiece is finished.
Claims (6)
1. A high-precision clamping device for laser processing is characterized by comprising a structure support group (9), a low-speed rotating shaft (8), a two-degree-of-freedom micro-displacement platform (7) for realizing two-degree-of-freedom translation of a workpiece in XY directions, a horizontal adjusting device (3), a high-power microscope (2) for assisting in determining the flatness and coaxiality of the workpiece, and a microscope support (1);
the microscope support is characterized in that a low-speed rotating shaft (8) is vertically arranged on a structure support group (9) through a bearing seat, the top of the low-speed rotating shaft (8) penetrates through the structure support group (9) to be connected with the bottom of a two-degree-of-freedom micro-displacement platform (7) through a screw and a shaft sleeve, a horizontal adjusting device (3) is installed at the top of the two-degree-of-freedom micro-displacement platform (7), a microscope support (1) is movably arranged on one side of the structure support group (9), a high-power microscope (2) is installed on the microscope support (1) and located above the horizontal adjusting device (3), and a concentric annular marking and a positioning center which are convenient for placing and initial positioning of workpieces are arranged on the upper surface of the horizontal adjusting device (3).
2. A high-precision clamping device for laser processing according to claim 1, the horizontal adjusting device (3) comprises a horizontal adjusting device upper plane (3), a horizontal adjusting device lower plane (6), four elastic bolt components connected at four corners of the horizontal adjusting device upper plane (3) and the horizontal adjusting device lower plane (6), each elastic bolt component comprises a horizontal adjusting screw (4) penetrating through the horizontal adjusting device upper plane (3) and the horizontal adjusting device lower plane (6) and a spring (5) sleeved on the horizontal adjusting screw (4) between the horizontal adjusting device upper plane (3) and the horizontal adjusting device lower plane (6), the upper plane (3) of the horizontal adjusting device is provided with concentric circle marked lines and a positioning center which are processed by laser etching and have a distance of 2mm, so that the workpiece can be conveniently placed and preliminarily positioned.
3. A high precision clamping device for laser processing according to claim 2, characterized in that the structure support group (9) comprises a downward opening n-shaped support frame (9-1) and two support ear plates (9-2) arranged at two sides of the bottom of the n-shaped support frame (9-1), and a rib plate (9-3) is arranged between each support ear plate (9-2) and the n-shaped support frame (9-1).
4. A high precision clamping device for laser processing according to claim 3, characterized in that the high power microscope (2) has scales, the microscope stand (1) comprises a movable seat (1-1) fixed on the structural support group (9) by bolts, and an L-shaped mounting bracket (1-2) movably inserted on the movable seat (1-1), the L-shaped mounting bracket (1-2) comprises a vertical rod movably inserted in the movable seat (1-1) and a horizontal rod connected with the top of the vertical rod, and the high power microscope (2) is mounted at the end of the horizontal rod.
5. The high-precision clamping device for laser processing according to claim 4, wherein the two-degree-of-freedom micro-displacement platform (7) comprises a Y-direction movable plate (7-1), an X-direction movable plate (7-2) and a fixed bottom plate (7-3) arranged on the top of the low-speed rotating shaft (8) from top to bottom, a Y-direction roller guide rail (7-4) is arranged between the Y-direction movable plate (7-1) and the X-direction movable plate (7-2), an X-direction roller guide rail (7-5) is arranged between the X-direction movable plate (7-2) and the fixed bottom plate (7-3), and the Y-direction roller guide rail (7-4) and the X-direction roller guide rail (7-5) form a cross roller guide rail assembly.
6. A high-precision clamping method for laser processing, which uses the high-precision clamping device for laser processing according to claim 5, and is characterized by comprising the following steps:
the method comprises the following steps: firstly, fixing a structural support group (9) on a machine tool;
step two: preliminarily positioning a workpiece with the diameter of 4mm and the thickness of 1mm at the center of an upper plane by referring to the upper surface mark line and the positioning center of the horizontal adjusting device (3);
step three: after a workpiece is fixed on the upper surface of a horizontal adjusting device (3), a high power microscope (2) is used for in-place observation, the clockwise four directions of the edge of an annular marking on the upper surface of the horizontal adjusting device (3) are defined as A, B, C, D, the clockwise E, F, G, H of four elastic bolt components are defined, A is the inner side, and E is the inner left side, firstly, a microscope bracket (1) is rotated, the high power microscope (2) is aligned to the edge of the A direction and focused, and the focus and the edge of the workpiece are at the same height at the moment;
step four: the workpiece is driven by the low-speed rotating shaft (8) to rotate 90 degrees anticlockwise at a low speed to the edge in the direction B, and a defocusing phenomenon appears in the rotating process, so that the surface of the workpiece is not horizontal;
step five: the high-power microscope (2) finds that the defocusing direction is positive, an F, G elastic bolt component corresponding to the B side in the leveling device is adjusted by an inner hexagonal wrench for fine adjustment, a spring is loosened to enable the plane to be adjusted upwards until the picture in the high-power microscope (2) is clear again, and the edge in the B direction is adjusted to be the same as the edge in the A direction;
step six: the workpiece is driven to rotate 90 degrees counterclockwise at a low speed by the low-speed rotating shaft (8) again, and a defocusing phenomenon still occurs in the rotating process to the edge in the direction C, which indicates that the surface of the workpiece is not horizontal;
step seven: the high power microscope (2) finds that the defocusing direction is still positive, an G, H elastic bolt component corresponding to the C side in the leveling device is adjusted by an inner hexagonal wrench for fine adjustment, and a spring is loosened to enable the plane to be adjusted upwards until the picture in the microscope display is clear again;
step eight: the workpiece is continuously driven to rotate at a low speed anticlockwise through the low-speed rotating shaft (8), the phenomenon of defocusing does not occur in the rotating process, and the levelness adjustment of the workpiece is finished;
step nine: firstly, rotating a structural support group (9) to enable a lens to be aligned to the edge A of a circular workpiece, and calibrating the point to be N through a high power microscope;
step ten: rotating the rotating shaft at a low speed anticlockwise by 180 degrees to the edge in the C direction, observing that the edge in the C direction of the workpiece is not overlapped with a marking point N in a view field, and marking the point as an M point;
step eleven: measuring the distance L between the MNs through the scales of the high-power microscope (2), manually adjusting the distance L/2 in the direction A through the two-degree-of-freedom micro-displacement platform (7);
step twelve: rotating the structural support group (9) to align the lens to the edge B direction of the circular workpiece, calibrating the point to be N1 by a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge D direction, calibrating the point to be M1 point, and measuring the distance L1;
step thirteen: the workpiece is moved to the B direction by a distance L1/2 by manually adjusting a two-degree-of-freedom micro-displacement platform (7);
fourteen steps: rotating the structure support group (9) to enable the view field of the structure support group to be aligned to the C direction of the edge of the circular workpiece, calibrating the point to be N2 through a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge of the A direction, calibrating the point to be M2 point, and measuring the distance L2;
a fifteenth step: the workpiece is moved to the direction C by a distance L2/2 by manually adjusting a two-degree-of-freedom micro-displacement platform (7);
sixthly, the step of: rotating the structural support group (9) to align the lens to the D direction of the edge of the circular workpiece, calibrating the point to be N3 by a high power microscope, rotating the rotating shaft 180 degrees counterclockwise at a low speed to the edge of the B direction, calibrating the point to be M3 point, and measuring the distance L3;
step fifteen: the workpiece is moved to the B direction by a distance L3/2 by manually adjusting a two-degree-of-freedom micro-displacement platform (7);
sixthly, the steps are as follows: and continuing to rotate the workpiece at a low speed, and observing that no deviation phenomenon occurs at the edge of the workpiece in each direction in the rotating process, thus proving that the coaxiality adjustment of the workpiece is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211015796.9A CN115091107B (en) | 2022-08-24 | 2022-08-24 | High-precision clamping device and clamping method for laser processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211015796.9A CN115091107B (en) | 2022-08-24 | 2022-08-24 | High-precision clamping device and clamping method for laser processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115091107A true CN115091107A (en) | 2022-09-23 |
| CN115091107B CN115091107B (en) | 2023-04-25 |
Family
ID=83299910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211015796.9A Active CN115091107B (en) | 2022-08-24 | 2022-08-24 | High-precision clamping device and clamping method for laser processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115091107B (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06137842A (en) * | 1992-10-26 | 1994-05-20 | Nachi Fujikoshi Corp | Method and device for measuring rotary tool blade part form |
| US6031201A (en) * | 1993-06-04 | 2000-02-29 | Seiko Epson Corporation | Laser machining apparatus with rotatable phase grating |
| JP2003007602A (en) * | 2001-06-26 | 2003-01-10 | Nikon Corp | Instrument and method for measurement, and system and method for exposure |
| US20050049129A1 (en) * | 2003-08-28 | 2005-03-03 | Philip Morris Usa, Inc. | High speed laser perforation of cigarette tipping paper |
| US20060126921A1 (en) * | 2002-10-25 | 2006-06-15 | Spencer Shorte | Method and device for 3 dimensional imaging of suspended micro-objects providing high-resolution microscopy |
| CN202021422U (en) * | 2011-04-21 | 2011-11-02 | 中科中涵激光设备（福建）股份有限公司 | Piezoelectric transducer (PZT)-based laser scanning device for micro round holes |
| US20130242396A1 (en) * | 2012-03-14 | 2013-09-19 | Takaoka Electric Mfg. Co., Ltd. | Focus position changing apparatus and confocal optical apparatus using the same |
| CN103395090A (en) * | 2013-07-19 | 2013-11-20 | 长春理工大学 | Testing apparatus for mechanical grating ruling process |
| CN205096731U (en) * | 2015-11-22 | 2016-03-23 | 苏州光韵达光电科技有限公司 | A optic fibre cutting head for on optic fibre laser cutting machine |
| CN106352842A (en) * | 2016-10-24 | 2017-01-25 | 中国工程物理研究院机械制造工艺研究所 | Device for measuring flatness and parallelism of disc parts |
| JP2017228615A (en) * | 2016-06-21 | 2017-12-28 | 株式会社ディスコ | Processing device |
| US20190118326A1 (en) * | 2017-10-25 | 2019-04-25 | United Technologies Corporation | Method and apparatus for aligning a process gas jet nozzle and laser machining beam |
| CN111089835A (en) * | 2020-01-02 | 2020-05-01 | 河北科技大学 | Manual super-hydrophobic surface adhesion testing system stable in operation and accurate in testing |
| CN111421228A (en) * | 2020-04-08 | 2020-07-17 | 华中科技大学 | Sample precision clamp for cross-scale two-photon polymerization processing and leveling method |
| CN112108902A (en) * | 2020-08-31 | 2020-12-22 | 西安精雕精密机械工程有限公司 | Leveling structure and leveling method |
| CN112935849A (en) * | 2021-03-29 | 2021-06-11 | 山东大学 | Two-axis linkage machining method for micro-lens array |
| CN112947007A (en) * | 2021-01-19 | 2021-06-11 | 上海集成电路装备材料产业创新中心有限公司 | Rotary device of rotary platform of photoetching machine |
| CN113075219A (en) * | 2021-03-24 | 2021-07-06 | 上海御微半导体技术有限公司 | Leveling and focusing device |
| CN114509923A (en) * | 2022-01-28 | 2022-05-17 | 复旦大学 | Focusing and leveling device in design of deep ultraviolet objective lens and application thereof |
| CN114518081A (en) * | 2021-12-28 | 2022-05-20 | 西南技术物理研究所 | Supplementary subsides of unit class device concentricity pastes dress device |
| CN114871604A (en) * | 2022-05-26 | 2022-08-09 | 洛阳科品实业有限公司 | Special clamp for laser welding head and leveling and defocusing measuring method |
-
2022
- 2022-08-24 CN CN202211015796.9A patent/CN115091107B/en active Active
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06137842A (en) * | 1992-10-26 | 1994-05-20 | Nachi Fujikoshi Corp | Method and device for measuring rotary tool blade part form |
| US6031201A (en) * | 1993-06-04 | 2000-02-29 | Seiko Epson Corporation | Laser machining apparatus with rotatable phase grating |
| JP2003007602A (en) * | 2001-06-26 | 2003-01-10 | Nikon Corp | Instrument and method for measurement, and system and method for exposure |
| US20060126921A1 (en) * | 2002-10-25 | 2006-06-15 | Spencer Shorte | Method and device for 3 dimensional imaging of suspended micro-objects providing high-resolution microscopy |
| US20050049129A1 (en) * | 2003-08-28 | 2005-03-03 | Philip Morris Usa, Inc. | High speed laser perforation of cigarette tipping paper |
| CN202021422U (en) * | 2011-04-21 | 2011-11-02 | 中科中涵激光设备（福建）股份有限公司 | Piezoelectric transducer (PZT)-based laser scanning device for micro round holes |
| US20130242396A1 (en) * | 2012-03-14 | 2013-09-19 | Takaoka Electric Mfg. Co., Ltd. | Focus position changing apparatus and confocal optical apparatus using the same |
| CN103395090A (en) * | 2013-07-19 | 2013-11-20 | 长春理工大学 | Testing apparatus for mechanical grating ruling process |
| CN205096731U (en) * | 2015-11-22 | 2016-03-23 | 苏州光韵达光电科技有限公司 | A optic fibre cutting head for on optic fibre laser cutting machine |
| JP2017228615A (en) * | 2016-06-21 | 2017-12-28 | 株式会社ディスコ | Processing device |
| CN106352842A (en) * | 2016-10-24 | 2017-01-25 | 中国工程物理研究院机械制造工艺研究所 | Device for measuring flatness and parallelism of disc parts |
| US20190118326A1 (en) * | 2017-10-25 | 2019-04-25 | United Technologies Corporation | Method and apparatus for aligning a process gas jet nozzle and laser machining beam |
| CN111089835A (en) * | 2020-01-02 | 2020-05-01 | 河北科技大学 | Manual super-hydrophobic surface adhesion testing system stable in operation and accurate in testing |
| CN111421228A (en) * | 2020-04-08 | 2020-07-17 | 华中科技大学 | Sample precision clamp for cross-scale two-photon polymerization processing and leveling method |
| CN112108902A (en) * | 2020-08-31 | 2020-12-22 | 西安精雕精密机械工程有限公司 | Leveling structure and leveling method |
| CN112947007A (en) * | 2021-01-19 | 2021-06-11 | 上海集成电路装备材料产业创新中心有限公司 | Rotary device of rotary platform of photoetching machine |
| CN113075219A (en) * | 2021-03-24 | 2021-07-06 | 上海御微半导体技术有限公司 | Leveling and focusing device |
| CN112935849A (en) * | 2021-03-29 | 2021-06-11 | 山东大学 | Two-axis linkage machining method for micro-lens array |
| CN114518081A (en) * | 2021-12-28 | 2022-05-20 | 西南技术物理研究所 | Supplementary subsides of unit class device concentricity pastes dress device |
| CN114509923A (en) * | 2022-01-28 | 2022-05-17 | 复旦大学 | Focusing and leveling device in design of deep ultraviolet objective lens and application thereof |
| CN114871604A (en) * | 2022-05-26 | 2022-08-09 | 洛阳科品实业有限公司 | Special clamp for laser welding head and leveling and defocusing measuring method |
Non-Patent Citations (4)
| Title |
|---|
| 宋颖慧: "基于CCD传感器的超精密车床光学精确对刀及其应用", 《制造技术与机床》 * |
| 张伟等: "保偏光纤对轴中的同轴度调节", 《光学精密工程》 * |
| 张楚鹏等: "大口径高精度四维调整工作台设计", 《设计与研究》 * |
| 马浩慧;邢敏剑;: "水平仪的发展及应用" * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115091107B (en) | 2023-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105181600A (en) | Large-aperture curved surface optical element micro-defect detection and laser restoration apparatus | |
| CN105880827A (en) | Micron-sized ultraviolet laser micro processing platform | |
| CN113210636B (en) | Device and method for machining shift-centering type micro lens array | |
| CN204366662U (en) | Radius of curvature adjustable aspheric surface concavees lens processing unit (plant) | |
| CN110000606B (en) | Tool setting method for machining terahertz slow-wave structural part | |
| CN212109914U (en) | High-precision arc edge diamond cutter cutting edge profile optical measurement device | |
| CN111545923A (en) | Laser marking device for irregular curved surface workpiece | |
| CN115091107A (en) | High-precision clamping device and method for laser processing | |
| CN111561880A (en) | High-precision arc edge diamond cutter cutting edge profile optical measurement device | |
| CN111964611A (en) | Axle type part straightness accuracy error measuring device based on machine vision | |
| CN111230689A (en) | Double-gantry dicing saw with symmetrical YZ plane | |
| CN112935849B (en) | Two-axis linkage machining method for micro-lens array | |
| CN115302246A (en) | Combined machining tool | |
| CN113601257B (en) | Microstructure array processing device and method based on variable-pitch fly cutter cutting | |
| CN114290177A (en) | Non-contact type precise tool setting method for grinding aspheric optical element | |
| CN210361979U (en) | Brittle material standard jig that punches | |
| CN209623645U (en) | Optical centering device for the prepackage of civilian nuclear facilities | |
| CN213998866U (en) | High-precision prism processing jig | |
| CN212470468U (en) | Optical alignment device of clamping type diamond micro milling cutter | |
| CN112025414A (en) | Positioning and measuring device for satisfying different-size numerical control machining spaces | |
| CN219997409U (en) | Large-stroke gantry microscope | |
| CN218694555U (en) | Germanium lens processing equipment | |
| CN210173048U (en) | Bearing device for engraving and milling machine | |
| CN218744867U (en) | High-precision optical lens processing device | |
| CN213986969U (en) | Optical cement lens center calibration anchor clamps |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |