CN115084353A - Packaging structure and magnetic chip packaging piece - Google Patents

Abstract

The invention provides a packaging structure and a magnetic chip packaging piece. Through adopting six faces of first packaging part and second packaging part parcel magnetic chip plastic-sealed piece, add the packaging part of establishing by high magnetic conductivity material again in addition outside magnetic chip plastic-sealed piece, improve the magnetic screen effect to the magnetic chip. Each packaging part is provided with a connecting plate and two integrated bending plates, and the two packaging parts can be nested together to wrap six surfaces of the magnetic chip plastic packaging part. The package parts can be prefabricated firstly, and the two package parts are directly nested together to finish the assembly. The first packaging part and the second packaging part surround the pin hole for penetrating the pin outside the packaging structure, and the length and the width of the packaging parts are controlled only, so that when the packaging parts are nested together, the edges of the two packaging parts can surround the pin hole. When the packaging piece is processed, a hole opening process is not needed, and the processing of the packaging piece is simplified.

Description

Packaging structure and magnetic chip packaging piece

Technical Field

The invention relates to the technical field of semiconductor manufacturing, in particular to a packaging structure and a magnetic chip packaging piece.

Background

Magnetic Random Access Memory (MRAM) records information by using different orientations of magnetic moments, and has the characteristics of non-volatility, high-speed reading and writing, high writing frequency and the like. Data of an MRAM is stored in an array of magnetoresistive elements, each of which contains a magnetic reference layer and a magnetic free layer. When the magnetic moment directions of the two layers are the same, the element is in a low resistance state (logic 0); when the magnetic moments of the two layers are in opposite directions, the device is in a high resistance state (logic 1). In the element design, the magnetic moment direction of the magnetic reference layer has higher stability, and the magnetic moment direction of the magnetic free layer is easier to change, so that the magnetic moment direction of the magnetic free layer can be changed in various ways, and information input is realized.

The interaction of magnetic fields with magnetic moments is a fundamental property of magnetic systems. The magnetic moment of the magnetic free layer with weaker stability can be easier to turn under the external magnetic field in different directions and can also be harder to turn. The former causes errors in the stored information of the chip, and the latter causes the write voltage of the chip to rise. Therefore, the applied magnetic field must be effectively shielded for the magnetic random access memory chip. Current MRAM magnetostatic shielding solutions also focus on the level of the plastic package during the formation of the plastic package from the packaged die or the design level of the MTJ (Magnetic Tunnel Junctions) within the die. And limited by size and process issues, the shielding effectiveness of these two layers is relatively limited.

Disclosure of Invention

The invention provides a packaging structure and a magnetic chip packaging piece, which are used for improving the magnetic shielding effect of a magnetic chip, simplifying the packaging structure and facilitating processing and assembly.

In a first aspect, the present invention provides a package structure for packaging a magnetic chip package having leads. The packaging structure comprises a first packaging piece and a second packaging piece which are made of high-permeability materials. The first package comprises a rectangular first connecting plate, and two first bending plates bent towards the same direction are arranged at two opposite edges of the first connecting plate. The second package comprises a rectangular second connecting plate, and two second bending plates bent towards the same direction are arranged at two opposite edges of the second connecting plate. The first packaging part and the second packaging part are arranged in a nested mode, the first connecting plate is opposite to the second connecting plate in position, and the first connecting plate, the second connecting plate, the two first bending plates and the two second bending plates wrap six faces of the magnetic chip plastic packaging part. And at the position opposite to the pins, the first packaging part and the second packaging part enclose at least one pin hole for penetrating the pins out of the packaging structure.

In the scheme, the first packaging piece and the second packaging piece are used for wrapping six faces of the magnetic chip plastic packaging piece, and the packaging piece made of the high-permeability material is additionally arranged outside the magnetic chip plastic packaging piece, so that the magnetic shielding effect on the magnetic chip is improved. Meanwhile, each packaging part is provided with a connecting plate and two integrated bending plates, and the two packaging parts can be simply nested together to wrap six surfaces of the magnetic chip plastic packaging part. When the magnetic chip packaging piece is used, the packaging piece can be prefabricated firstly, and after the magnetic chip packaging piece is packaged, the two packaging pieces are directly nested together to complete assembly, so that the magnetic chip packaging piece is convenient to install. And the first packaging part and the second packaging part surround the pin hole for penetrating the pin outside the packaging structure, and the length size and the width size of the packaging parts are controlled only, so that when the packaging parts are nested together, the edges of the two packaging parts can surround the pin hole. Therefore, when the packaging part is processed, a large number of pin holes are formed without a hole opening process, the processing difficulty is reduced, and the processing of the packaging part is simplified.

In one embodiment, the magnetic chip molding compound has a first surface and a second surface opposite to each other, and four side surfaces respectively connecting the first surface and the second surface, wherein the area of the first surface and the second surface is larger than that of each side surface. The first surface of the magnetic chip plastic package piece is fixed on the first connecting plate, and the second connecting plate is buckled on the second surface of the magnetic chip plastic package piece. Each of the pin holes is surrounded by an edge of the first connection plate, an edge of the second bending plate, and a part of an edge of each of the first bending plates.

In a particular embodiment, each first bending panel is flush with the outer surface of the second web, or each first bending panel is higher than the outer surface of the second web. To improve the magnetic shielding effect on the perpendicular magnetic field.

In a specific embodiment, the thickness of the second connecting plate is greater than that of the first connecting plate to improve the magnetic shielding efficiency, while preventing the first connecting plate from being too thick to affect the pin soldering.

In one embodiment, the magnetic chip plastic package has a first surface and a second surface opposite to each other, and four side surfaces respectively connecting the first surface and the second surface, wherein the area of the first surface and the second surface is larger than that of each side surface, and the four side surfaces include the first side surface and the second side surface opposite to each other. The first surface and the second surface of the magnetic chip plastic package piece are respectively fixed on the two first bending plates, the first connecting plate is arranged opposite to the first side surface, and the second connecting plate is arranged opposite to the second side surface. The edge opposite to the pin position on the second bending plate is provided with a notch, and each pin hole is surrounded by the notch and the edge of one first bending plate.

In a specific embodiment, of the two first bending plates, the thickness of the first bending plate opposite to the first surface is smaller than that of the second bending plate opposite to the second surface. To improve the magnetic shielding effect on the perpendicular magnetic field.

In a specific embodiment, when the first package and the second package are nested together, the width of the gap between any two boards is less than 25 microns, and the distance between each surface of the magnetic chip plastic package and the nearest bending board or connecting board is less than 25 microns. So as to form a magnetic flux loop and improve the magnetic shielding effect.

In a specific embodiment, the high magnetic conductivity material is pure iron, silicon steel or permalloy, so that the connecting plate and the bent plate with a single-layer structure can be conveniently processed.

In a specific embodiment, the first package and the second package are both manufactured by machining or pouring, so that the packages meeting the specification requirements can be prefabricated, and the magnetic chip plastic package can be packaged again only by nesting and installing.

In a specific embodiment, the magnetic chip molding is a magnetic memory chip molding, a sensor chip using a magnetoresistive element, or an integrated circuit chip molding using a magnetoresistive element.

In a second aspect, the present invention further provides a magnetic chip package, which includes a magnetic chip molding package having a pin, and any one of the package structures for packaging the magnetic chip molding package.

In the scheme, the first packaging piece and the second packaging piece are used for wrapping six faces of the magnetic chip plastic packaging piece, and the packaging piece made of the high-permeability material is additionally arranged outside the magnetic chip plastic packaging piece, so that the magnetic shielding effect on the magnetic chip is improved. Meanwhile, each packaging part is provided with a connecting plate and two integrated bending plates, and the two packaging parts can be simply nested together to wrap six surfaces of the magnetic chip plastic packaging part. When the magnetic chip packaging piece is applied, the packaging pieces can be prefabricated firstly, and after the magnetic chip plastic packaging piece is packaged, the two packaging pieces are directly nested together to finish assembly, so that the magnetic chip packaging piece is convenient to install. And the first packaging part and the second packaging part surround the pin hole for penetrating the pin outside the packaging structure, and the length size and the width size of the packaging parts are controlled only, so that when the packaging parts are nested together, the edges of the two packaging parts can surround the pin hole. Therefore, when the packaging part is processed, a large number of pin holes are formed without a pin hole process, the processing difficulty is reduced, and the processing of the packaging part is simplified.

Drawings

Fig. 1 is a schematic structural diagram illustrating an assembled package structure according to an embodiment of the present invention;

fig. 2 and fig. 3 are schematic structural diagrams of a first package and a second package in the package structure provided in fig. 1, respectively;

FIG. 4 is a schematic structural view of another package structure according to an embodiment of the present invention when assembled together;

fig. 5 and fig. 6 are schematic structural diagrams of a first package and a second package in the package structure provided in fig. 4, respectively;

fig. 7 is a schematic diagram of experimental test data of a package structure according to an embodiment of the present invention.

Reference numerals:

10-first package 11-first connection plate 12-first bending plate

20-second package 21-second connecting plate 22-second bending plate

23-notch 30-pin hole 40-pin

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

To facilitate understanding of the package structure provided in the embodiment of the present invention, an application scenario of the package structure provided in the embodiment of the present invention is first described below, where the package structure is applied to a magnetic chip package process for packaging a magnetic chip package having a pin. The package structure will be described in detail with reference to the accompanying drawings.

Referring to fig. 1 to 6, a package structure according to an embodiment of the present invention includes two packages, namely a first package 10 and a second package 20, and the two packages are made of a high magnetic permeability material. The first package 10 includes a rectangular first connection plate 11, and two first bending plates 12 bent in the same direction are provided at opposite edges of the first connection plate 11. The second package 20 includes a rectangular second connecting plate 21, and two second bending plates 22 bent in the same direction are provided at opposite edges of the second connecting plate 21. The first package 10 and the second package 20 are nested, the first connecting plate 11 is opposite to the second connecting plate 21, the first connecting plate 11, the second connecting plate 21, the two first bending plates 12 and the two second bending plates 22 wrap six faces of the magnetic chip plastic package, and each connecting plate or each bending plate wraps one face of the magnetic chip plastic package. And at a position opposite to the pin 40, the first package 10 and the second package 20 enclose at least one pin hole 30 for passing the pin 40 outside the package structure.

In the above scheme, the first package member 10 and the second package member 20 are used to wrap six faces of the magnetic chip plastic package member, and a package member made of a material with high magnetic permeability is additionally arranged outside the magnetic chip plastic package member, so as to improve the magnetic shielding effect on the magnetic chip. Meanwhile, each packaging part is provided with a connecting plate and two integrated bending plates, and the two packaging parts can be simply nested together to wrap six surfaces of the magnetic chip plastic packaging part. When the magnetic chip packaging piece is applied, the packaging pieces can be prefabricated firstly, and after the magnetic chip plastic packaging piece is packaged, the two packaging pieces are directly nested together to finish assembly, so that the magnetic chip packaging piece is convenient to install. And the first package part 10 and the second package part 20 enclose the pin hole 30 for inserting the pin 40 outside the package structure, and the length and width of the package parts are controlled only, so that the edges of the two package parts can enclose the pin hole 30 when the two package parts are nested together. Therefore, when the packaging part is processed, a large number of pin holes are formed without a hole opening process, the processing difficulty is reduced, and the processing of the packaging part is simplified. The above-described respective structures will be described in detail with reference to the accompanying drawings.

Referring to fig. 1, 2, 3, 4, 5, and 6, each of the first package 10 and the second package 20 includes a rectangular connecting plate, and two bending plates bent in the same direction are disposed at two opposite edges of the connecting plate, so that the two bending plates on each package are opposite to each other. And the two packages are nested, in particular nesting, the first connecting plate 11 in the first package 10 is opposite to the second connecting plate 21 in the second package 20, and the magnetic chip plastic package is placed between the first connecting plate 11 and the second connecting plate 21. The two first bending plates 12 in the first package 10 and the two second bending plates 22 in the second package 20 are arranged in a mutually crossing manner, that is, two sides of each first bending plate 12 are respectively adjacent to the sides of the two second bending plates 22, and two sides of each second bending plate 22 are respectively adjacent to the sides of the two first bending plates 12, so that the first package 10 and the second package 20 enclose a more closed structure similar to a cube, and the magnetic chip plastic package is wrapped in the structure.

The magnetic chip plastic package part is provided with a first surface and a second surface which are opposite to each other, and four side surfaces which are respectively connected with the first surface and the second surface, wherein the areas of the first surface and the second surface are larger than the area of each side surface. Namely, the magnetic chip plastic package is in a flat cubic structure. When determining the type of the magnetic chip plastic package, the magnetic chip plastic package may be a magnetic memory chip plastic package, a sensor chip using a magnetoresistive element, or an integrated circuit chip plastic package using a magnetoresistive element. The magnetic chip plastic package part can be a plastic package part subjected to primary plastic package, and also can be a plastic package part subjected to secondary plastic package or multiple times of plastic package. The plastic package is the plastic package in the process of packaging the bare chip by plastic package, and is not the nested packaging mode of two packages in the embodiment of the invention.

Referring to fig. 1 and 4, after the first package member 10 and the second package member 20 are nested together to package the magnetic chip plastic package member, each surface of the magnetic chip plastic package member is wrapped by a connecting plate or a bending plate, so that six surfaces of the magnetic chip plastic package member are wrapped by magnetic shielding plates made of high-permeability materials, thereby improving the magnetic shielding effect on the magnetic chip plastic package member. When the magnetic chip packaging piece is applied, the packaging pieces can be prefabricated firstly, and after the magnetic chip plastic packaging piece is packaged, the two packaging pieces are directly nested together to finish assembly, so that the magnetic chip packaging piece is convenient to install. At least one surface of the magnetic chip plastic package piece can be bonded on the adjacent connecting plate or the bending plate so as to fix the magnetic chip plastic package piece and prevent the magnetic chip plastic package piece from shaking. Specifically, the two packages may be fixed to the surface of the magnetic chip mold using an adhesive such as epoxy resin. The thickness of the connecting plate and the thickness of the bending plate can be adjusted, so that the thickness of the magnetic shielding material on the periphery of the magnetic chip plastic package part is adjusted, and different magnetic shielding capabilities are obtained.

In addition, when the first package 10 and the second package 20 are nested together, the width of the gap between any two boards can be smaller than 25 micrometers, specifically, the width of the gap between any two boards can be controlled to be any value smaller than 25 micrometers, such as 24 micrometers, 20 micrometers, 16 micrometers, 12 micrometers, 8 micrometers, 4 micrometers, and the like, so as to form a magnetic flux loop and improve the magnetic shielding effect. Certainly, the distance between each face of the magnetic chip plastic package and the nearest bending plate or connecting plate can be smaller than 25 micrometers, specifically, the distance between each face of the magnetic chip plastic package and the nearest bending plate or connecting plate can be controlled to be any value smaller than 25 micrometers, such as 24 micrometers, 20 micrometers, 16 micrometers, 12 micrometers, 8 micrometers, 4 micrometers and the like, so that a magnetic flux loop is formed, and the magnetic shielding effect is improved.

Referring to fig. 1 and 4, a pin 40 is further disposed on the magnetic chip molding for electrically connecting an external signal and an electrical device inside the magnetic chip molding. The leads 40 may be disposed on the side surface of the chip package, or may be disposed on the edge line connecting the first surface or the second surface of the chip package with the side surface. As shown in fig. 1 and 4, after the first package 10 and the second package 20 package the magnetic chip molding, at a position opposite to the pin 40, the first package 10 and the second package 20 enclose at least one pin hole 30 for passing the pin 40 through the package structure. That is, the pin hole 30 for passing the pin 40 is not formed on the first package 10 or the second package 20, but is surrounded by the edges of the first package 10 and the second package 20, a part of the hole wall of the pin hole 30 is located at the edge of the first package 10, and a part of the hole wall of the pin hole 30 is located at the edge of the second package 20. When the package is processed, the length and width of the package are controlled, so that the edges of the two packages can enclose the pin holes 30 when the two packages are nested together. A large number of pin holes are formed without a hole opening process, so that the processing difficulty is reduced, and the processing of the packaging piece is simplified. In addition, the structure shape, such as the position of the pin hole 30, and the length and thickness of the connection board and the bending board can be further adjusted, so that the pin 40 of the magnetic chip plastic package is not covered and does not contact the edges of the two packages. Because the pin holes 30 of the two packages do not contact the pins 40, the pins 40 do not need to be insulated, and the process steps are saved. The number of the pin holes 30 may be specifically determined according to the distribution of the pins 40.

When the material for preparing the packaging part is determined, the high-magnetic-conductivity material can be pure iron, silicon steel or permalloy so as to conveniently process a connecting plate and a bending plate with a single-layer structure. It is to be explained that a high permeability material means: ferromagnetic materials with permeability above about 100. When the packaging piece is selected, silicon steel is taken as the raw material for preparing the packaging piece as the best choice, and the magnetic shielding efficiency and good machinability are ensured. When two packaging parts are specifically prefabricated, the first packaging part 10 and the second packaging part 20 can be manufactured in a machining mode, and specifically, machining processes such as milling, grinding and extrusion forming can be adopted, so that the packaging parts meeting the specification requirements can be prefabricated, and the magnetic chip plastic packaging parts can be packaged again only by nesting and mounting. Of course, other processes may be used to manufacture the package, for example, a casting process may be used to prepare the first package 10 and the second package 20. Specifically, a mold for casting the first package member 10 and the second package member 20 may be machined in advance, and then the first package member 10 and the second package member 20 are machined in a casting manner, so as to facilitate rapid batch machining. In addition, the first package 10 and the second package 20 may be subjected to insulation and rust prevention to prevent electrical defects such as short circuit of the leads 40 when the leads 40 are contacted. Meanwhile, the insulating property and the service life of the packaging part are prevented from being influenced by rusting.

Because the magnetic chip plastic package part is of a flat cubic structure, when two package parts are specifically arranged, two different structures can be designed according to the mode that the first connecting plate 11 and the second connecting plate 21 respectively correspond to the first surface and the second surface of the magnetic chip plastic package part with larger areas, or respectively correspond to the two side surfaces of the magnetic chip plastic package part with smaller areas. These two structures are described in detail below.

First, the design of the first connecting plate 11 and the second connecting plate 21 corresponding to the first surface and the second surface of the magnetic chip plastic package with larger areas will be described. As shown in fig. 1, which is a schematic structural diagram of the first package 10 and the second package 20 assembled together, the pins 40 of the magnetic chip molding compound are led out from the pin holes 30 surrounded by the edges of the first package 10 and the second package 20. Fig. 2 is a schematic structural diagram of the second package 20 in the package structure shown in fig. 1, wherein the second connecting plate 21 is located on the second surface of the magnetic chip plastic package, i.e. the upper surface of the magnetic plastic package in fig. 1. Fig. 3 is a schematic structural diagram of the first package 10 in the package structure shown in fig. 1, wherein the first connection board 11 is located on a first surface of the magnetic chip molding, i.e., a lower surface of the magnetic molding in fig. 1. In other words, in this design, when the magnetic chip plastic package is placed horizontally, the first package member 10 and the second package member 20 are nested by being buckled up and down. The first package 10 is a lower package, the second package 20 is an upper package, and the second package 20 is vertically and snap-fitted on the first package 10.

At this time, the area of the connecting plates of the two packages is larger, so as to completely cover the first surface and the second surface of the magnetic chip plastic package. During packaging, the first surface of the magnetic chip plastic package is fixed on the first connecting plate 11, and specifically, the first surface of the magnetic chip plastic package can be bonded on the inner surface of the first connecting plate 11 by using an epoxy resin bonding method. The inner surface here means a surface facing in the direction of the first folding plate 12. The second connecting plate 21 is fastened to the second surface of the magnetic chip plastic package, and specifically, the second connecting plate 21 may also be fixed to the second surface of the magnetic chip plastic package by using an adhesive method. Referring to fig. 1, each of the pin holes 30 is surrounded by an edge of the first connection plate 11, an edge of the second bending plate 22, and a portion of an edge of each of the first bending plates 12. I.e., each pin hole 30 is located at a lower position.

In a specific arrangement, referring to fig. 2, the second bending plates 22 are bent downward and are respectively opposite to two opposite side positions of the magnetic chip plastic package (referring to fig. 2, the two second bending plates 22 respectively cover the front side and the back side of the magnetic chip plastic package). And the two second bending plates 22 are bent downward by a short length so as not to contact the pins 40. The length of the second connecting plate 21 is the same as that of the magnetic chip plastic package, the width of the second connecting plate 21 can be larger than that of the magnetic chip plastic package (without the pin 40) by hundreds of micrometers to several millimeters, and the size of the pin 40 of the magnetic chip plastic package and the like can be determined according to the shielding requirement, so that enough arrangement space is reserved for the pin 40. The distance between the two second bending plates 22 can be made slightly larger than the width of the magnetic chip plastic package to accommodate a certain processing error. In addition, referring to fig. 2, the second connecting plate 21 can be made thicker to improve the magnetic shielding efficiency.

As shown in fig. 3, in the first package 10, two first bending plates 12 are bent upward and respectively opposite to two opposite side positions of the magnetic chip plastic package. And the two first folding plates 12 may be made to entirely cover the left and right sides of the magnetic chip mold (refer to the structure shown in fig. 3). In addition, each first bending plate 12 may be flush with the outer surface of the second connecting plate 21, or each first bending plate 12 may be higher than the outer surface of the second connecting plate 21. To improve the magnetic shielding effect on the perpendicular magnetic field. The width of the first connecting plate 11 may be the same as the width of the magnetic chip plastic package, and the length of the first connecting plate 11 may be several hundred micrometers to several millimeters greater than the length of the magnetic chip plastic package, which may be specifically determined according to the shielding requirement and the like. The distance between the two first bending plates 12 may be slightly larger than the length of the magnetic chip plastic package, but should be smaller than 50 micrometers, which is compatible with the processing error on one hand, and does not have a great influence on the magnetic flux loop on the other hand. The thickness of the first connection plate 11 may be limited so as not to affect the soldering of the pins 40. Specifically, the thickness of the second connecting plate 21 may be made larger than that of the first connecting plate 11 to improve the magnetic shielding efficiency while preventing the first connecting plate 11 from being too thick to affect the soldering of the pins 40.

Next, the manner in which the first connecting plate 11 and the second connecting plate 21 correspond to the two side surfaces of the magnetic chip package having a small area, respectively, will be described. The four sides of the magnetic chip plastic package part comprise a first side and a second side which are opposite. The first connection plate 11 of the first package 10 is opposite to the first side position, and the second connection plate 21 of the second package 20 is opposite to the second side position. As shown in fig. 4, which is a schematic structural diagram of the first package 10 and the second package 20 when they are assembled together, the pins 40 of the magnetic chip molding are led out from the pin holes 30 surrounded by the edges of the first package 10 and the second package 20. Fig. 5 is a schematic structural diagram of the first package 10 in the package structure shown in fig. 1, wherein the first connection board 11 is opposite to a left side (first side) of the magnetic chip plastic package (refer to the structures shown in fig. 4, fig. 5 and fig. 6, the same applies below). Fig. 6 is a schematic structural diagram of the second package 20 in the package structure shown in fig. 4, wherein the second connecting plate 21 is opposite to the right side (second side) of the magnetic chip plastic package. In other words, in this design, when the magnetic chip plastic package is placed horizontally, the first package 10 and the second package 20 are nested by being fastened from left to right. The first package 10 is a package on the left side, the second package 20 is a package on the right side, and the second package 20 is snap-fitted on the first package 10 in the left-right direction.

At this time, the areas of the connecting plates of the two packaging parts are smaller, and the right side surface and the left side surface of the magnetic chip plastic packaging part are completely covered. During packaging, the magnetic chip plastic package is located between the two first bending plates 12 of the first package 10, and the first and second surfaces of the magnetic chip plastic package are respectively fixed on the two first bending plates 12, which may be specifically fixed by an adhesive such as epoxy resin. And the first connecting plate 11 is disposed opposite to the first side surface (left side surface), and the second connecting plate 21 is disposed opposite to the second side surface (right side surface). Referring to fig. 6, the second bending plate 22 has notches 23 at edges opposite to the positions of the leads 40, and each of the lead holes 30 is defined by the notches 23 and an edge of one of the first bending plates 12. I.e., each pin hole 30 is located at a lower position.

In a specific arrangement, referring to fig. 5, the second bending plates 22 are bent rightward and are respectively opposite to the first surface and the second surface of the magnetic chip plastic package (e.g., the upper surface and the lower surface of the magnetic chip plastic package in fig. 4). The height of the first connecting plate 11 is low, so that the distance between the two first bending plates 12 is small, the magnetic chip plastic package can be accommodated, and the distance between the first bending plates 12 which are closest to the upper surface and the lower surface of the magnetic chip plastic package can be ensured to be less than 25 micrometers. And the length of the two second bending plates 22 bent rightwards is longer so as to completely cover the upper surface and the lower surface of the whole magnetic chip plastic package. Referring to fig. 4, the thickness of the first bending plate 12, which is located opposite to the first face (lower face), of the two first bending plates 12 may be made smaller than the thickness of the second bending plate 22, which is located opposite to the second face (upper face). To improve the magnetic shielding effect on the vertical magnetic field while preventing the first bending plate 12 located below from being too thick to affect the soldering of the pins 40.

As shown in fig. 6, in the second package 20, two second bending plates 22 are bent leftward and are respectively opposite to two opposite side surfaces (front side surface and back side surface) of the magnetic chip mold. In order to not shield the pins 40, the second bending plate 22 needs to cut off a part of the magnetic shielding structure to form the notch 23, so that when the second package 20 is nested on the first package 10, each pin hole 30 can be ensured to be surrounded by the notch 23 and the edge of one first bending plate 12. And through forming breach 23 on second folded sheet 22 to minimize the size of the magnetic screen structure of excision, make the magnetic screen structure who remains on second folded sheet 22 more, improve magnetic screen effect. It should be explained that the thickness of the connection board or the bending board in the first package 10 and the second package 20 can be adjusted from several hundreds of micrometers to several millimeters, which can be determined according to the specific situations such as shielding requirement, the size of the lead 40, the die bonding condition, etc.

The packaging structure disclosed by the embodiment of the invention has a good magnetic shielding effect through experimental tests. Referring specifically to fig. 7, the package structure according to the embodiment of the present invention may achieve a shielding efficiency of 85% for a 700Oe horizontal magnetic field and 40% for a 1300Oe vertical magnetic field.

The first packaging piece 10 and the second packaging piece 20 are used for wrapping six faces of the magnetic chip plastic packaging piece, and the packaging piece made of a high-permeability material is additionally arranged outside the magnetic chip plastic packaging piece, so that the magnetic shielding effect on the magnetic chip is improved. Meanwhile, each packaging part is provided with a connecting plate and two integrated bending plates, and the two packaging parts can be simply nested together to wrap six surfaces of the magnetic chip plastic packaging part. When the magnetic chip packaging piece is applied, the packaging pieces can be prefabricated firstly, and after the magnetic chip plastic packaging piece is packaged, the two packaging pieces are directly nested together to finish assembly, so that the magnetic chip packaging piece is convenient to install. And the first package part 10 and the second package part 20 enclose the pin hole 30 for inserting the pin 40 outside the package structure, and the length and width of the package parts are controlled only, so that the edges of the two package parts can enclose the pin hole 30 when the two package parts are nested together. Therefore, when the packaging part is processed, a large number of pin holes are formed without a hole opening process, the processing difficulty is reduced, and the processing of the packaging part is simplified.

In addition, the embodiment of the invention also provides a magnetic chip packaging piece, which comprises a magnetic chip plastic packaging piece with the pin 40 and any one of the packaging structures for packaging the magnetic chip plastic packaging piece. The first packaging piece 10 and the second packaging piece 20 are used for wrapping six faces of the magnetic chip plastic packaging piece, and the packaging piece made of a high-permeability material is additionally arranged outside the magnetic chip plastic packaging piece, so that the magnetic shielding effect on the magnetic chip is improved. Meanwhile, each packaging part is provided with a connecting plate and two integrated bending plates, and the two packaging parts can be simply nested together to wrap six surfaces of the magnetic chip plastic packaging part. When the magnetic chip packaging piece is applied, the packaging pieces can be prefabricated firstly, and after the magnetic chip plastic packaging piece is packaged, the two packaging pieces are directly nested together to finish assembly, so that the magnetic chip packaging piece is convenient to install. And the first package part 10 and the second package part 20 enclose the pin hole 30 for inserting the pin 40 outside the package structure, and the length and width of the package parts are controlled only, so that the edges of the two package parts can enclose the pin hole 30 when the two package parts are nested together. Therefore, when the packaging part is processed, a large number of pin holes are formed without a hole forming process, the processing difficulty is reduced, and the processing of the packaging part is simplified.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A package structure for packaging a magnetic chip package having leads, comprising:

the first packaging piece is made of a high-permeability material and comprises a rectangular first connecting plate, and two first bending plates bent towards the same direction are arranged at two opposite edges of the first connecting plate;

the second packaging piece is made of a high-permeability material and comprises a rectangular second connecting plate, and two second bending plates bent towards the same direction are arranged at two opposite edges of the second connecting plate;

the first packaging piece and the second packaging piece are nested, the first connecting plate is opposite to the second connecting plate in position, and the first connecting plate, the second connecting plate, the two first bending plates and the two second bending plates wrap six faces of the magnetic chip plastic packaging piece; and at the position opposite to the pins, the first packaging part and the second packaging part enclose at least one pin hole for penetrating the pins out of the packaging structure.

2. The package structure of claim 1, wherein the magnetic chip molding compound has a first surface and a second surface opposite to each other, and four side surfaces respectively connecting the first surface and the second surface, wherein the first surface and the second surface have an area larger than that of each side surface;

the first surface of the magnetic chip plastic package piece is fixed on the first connecting plate, and the second connecting plate is buckled on the second surface of the magnetic chip plastic package piece;

each pin hole is surrounded by an edge of the first connection plate, an edge of the second bending plate, and a part of an edge of each first bending plate.

3. The package structure of claim 2, wherein each first bending panel is flush with or higher than an outer surface of the second web.

4. The package structure of claim 2, wherein a thickness of the second connection plate is greater than a thickness of the first connection plate.

5. The package structure of claim 1, wherein the magnetic chip molding compound has a first surface and a second surface opposite to each other, and four side surfaces respectively connecting the first surface and the second surface; the area of each of the first surface and the second surface is larger than that of each side surface, and the four side surfaces comprise opposite first side surfaces and second side surfaces;

the first surface and the second surface of the magnetic chip plastic package piece are respectively fixed on the two first bending plates, the first connecting plate is arranged opposite to the first side surface, and the second connecting plate is arranged opposite to the second side surface;

and the edge of the second bending plate opposite to the pin position is provided with a notch, and each pin hole is surrounded by the notch and the edge of one first bending plate.

6. The package structure of claim 5, wherein a thickness of a first bending plate of the two first bending plates, which is opposite to the first surface, is smaller than a thickness of a first bending plate of the two first bending plates, which is opposite to the second surface.

7. The package structure of claim 1, wherein when the first package and the second package are nested together, the width of the gap between any two boards is less than 25 microns, and the distance between each side of the magnetic chip plastic package and the nearest bending board or connecting board is less than 25 microns.

8. The package structure of claim 1, wherein the high permeability material is pure iron, silicon steel, or permalloy.

9. The package structure of claim 8, wherein the first package member and the second package member are machined or cast.

10. A magnetic chip package, comprising:

a magnetic chip plastic package with pins;

the package structure of any one of claims 1 to 9 for packaging the magnetic chip plastic package.

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