CN115074045A - Packaging support film for chip packaging and packaging structure thereof - Google Patents
Packaging support film for chip packaging and packaging structure thereof Download PDFInfo
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- CN115074045A CN115074045A CN202210998343.6A CN202210998343A CN115074045A CN 115074045 A CN115074045 A CN 115074045A CN 202210998343 A CN202210998343 A CN 202210998343A CN 115074045 A CN115074045 A CN 115074045A
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- packaging
- film
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- package
- plate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Abstract
The invention discloses a packaging support film for packaging a chip and a packaging structure thereof, the packaging support film comprises a chip body and a packaging support film body, the packaging support film body comprises an upper glue film layer, a polyimide film layer, an organic silicon pressure-sensitive adhesive film and an epoxy resin film, the polyimide film layer is adhered to the top and the bottom of the chip body, the organic silicon pressure-sensitive adhesive film is adhered to the polyimide film layer and the outer part of the chip body, and the four corners of the outer part of the chip body are all adhered with a pressure mask layer. The consumed packaging time is short, and the packaging effect is good.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a packaging support film for chip packaging and a packaging structure thereof.
Background
The chip is generally a miniature electronic device or component of an integrated circuit, and is a miniaturization mode of a circuit semiconductor device and the like, elements such as a transistor, a resistor, an inductor and the like required in the circuit and wiring are interconnected together, and the chip packaging is a shell for mounting a semiconductor integrated circuit chip, and has the functions of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance.
If the chip package needs to be processed tightly and stably, the time consumed by the package structure during the chip package is long during the operation period, the package effect is not ideal, the consumption of the package support film used by the chip package is high, and the structure of the package support film is single and not stable enough.
Disclosure of Invention
The invention aims to provide a packaging support film for chip packaging and a packaging structure thereof, so as to solve the defects in the prior art.
In order to achieve the above purpose, the invention provides the following technical scheme:
the utility model provides a encapsulation support membrane for chip package, includes chip body and encapsulation support membrane body, the encapsulation support membrane body includes rubberizing rete, polyimide rete, organosilicon pressure sensitive adhesive film and epoxy resin film, the polyimide rete bonds in the top and the bottom of chip body, organosilicon pressure sensitive adhesive film bonds in the outside of polyimide rete and chip body, the pressure mask layer all bonds in the outside four corners department of chip body, the rubberizing rete bonds between pressure mask layer and chip body, epoxy resin film fixed mounting is in the outside of pressure mask layer.
Preferably, a coating film is bonded on the outer wall of the packaging supporting film body, the chip body is fixedly mounted inside the packaging supporting film body, and the polyimide film layer and the organic silicon pressure-sensitive adhesive film are arranged in a crossed manner.
Preferably, the thickness of the polyimide film layer and the thickness of the organic silicon pressure-sensitive adhesive film are both 0.07 mm, and the thickness of the epoxy resin film is 0.05 mm.
A packaging structure for chip packaging comprises the packaging support film for chip packaging, which comprises a packaging top plate, a packaging bottom plate and a packaging shell, wherein a connecting plate is fixedly arranged inside the packaging shell, a spring is welded at the bottom of the connecting plate, a pushing strip is fixedly arranged at the bottom end of the spring, a baffle is welded on the outer wall of the pushing strip, a movable groove is formed inside the packaging shell, a movable shaft is arranged inside the movable groove, a packaging clamping piece is arranged outside the movable shaft,
the outer wall of encapsulation shell has seted up the depressed groove, the inner wall fixed mounting of depressed groove has the baffle, there is the screw thread post inside of baffle through bearing swing joint, and the outside threaded connection of screw thread post has outer sleeve spare, slope plug-in components are installed through the bolt to outer wall of outer sleeve spare.
Preferably, the two sides of the interior of the package base plate are fixedly provided with transverse plates, the top of each transverse plate is provided with a heat conducting fin, one side of each transverse plate is provided with a clamping mechanism, each clamping mechanism comprises a top plate, a threaded rod and a bottom plate, and the threaded rods are in threaded connection with the interior of the transverse plates.
Preferably, the top plate is welded at the top end of the threaded rod, the bottom plate is welded at the bottom end of the threaded rod, side grooves are formed in two sides of the outer wall of the threaded rod, elastic clamping pieces are arranged inside the side grooves, and the top plate is arranged on two sides of the heat conducting fins.
Preferably, both sides of the packaging bottom plate are provided with side plates through bolts, the outer wall of each side plate is welded with a plurality of circulation pipes, and the outer wall of one end of each circulation pipe is in threaded connection with a blocking plug.
Preferably, the encapsulation top plate and the encapsulation bottom plate are arranged outside the coating film, a rotating handle is welded at one end of the threaded column, and the two sides of the bottom of the encapsulation bottom plate are provided with the adjusting grooves.
Preferably, the bottom of the packaging shell is welded with a mounting frame, the inside of the mounting frame is connected with a fastening bolt in a threaded manner, the fastening bolt is inserted into the packaging bottom plate, and a limiting groove is formed in the packaging shell.
Preferably, slots are formed in the two sides of the packaging bottom plate, the inclined plug-in units are inserted into the slots, clamping grooves are formed in the two sides of the outer wall of the top of the packaging top plate, and one side of the packaging clamping unit is clamped inside the clamping grooves.
In the technical scheme, the packaging support film for chip packaging and the packaging structure thereof provided by the invention have the advantages that through the arrangement of the inclined plug-in and the packaging clamping piece, after the inclined plug-in is pushed by the outer sleeve piece, the pushing strip can move on the inclined plane of the inclined plug-in, the pushing strip pushes the packaging clamping piece by using the baffle while moving upwards, the packaging clamping piece and the inclined plug-in can be inserted into the packaging top plate and the packaging bottom plate together, the chip body and the packaging support film body in the packaging top plate and the packaging bottom plate can be tightly attached to be packaged, the packaging of the chip body can be completed only by rotating the threaded columns, the consumed packaging time is short, and the packaging effect is good; the rotating handle is convenient for the rotation of the threaded column through the arranged spring and the rotating handle, and after the threaded column is reversely rotated, the spring can extrude the pushing strip and the baffle plate, so that the pushing strip is downwards arranged, the packaging clamping piece can return to the original position without being influenced by the baffle plate, the inclined plug-in piece and the packaging clamping piece do not limit the packaging top plate and the packaging bottom plate, and the packaging top plate and the packaging bottom plate are convenient to disassemble; through the arranged clamping mechanism, the threaded rod in the clamping mechanism can support the elastic clamping piece to the edge of the heat conducting strip after rotating, so that the heat conducting strip is replaced in time, the using effect of the heat conducting strip is improved, and the heat conducting strip can timely transmit the heat of the chip body out of the packaging bottom plate; through the encapsulation support membrane body that sets up, rubberizing rete, polyimide rete and the laminating of organosilicon pressure sensitive glue membrane in the encapsulation support membrane body cover in the outside of chip body, and formed a stable cross structure, can support the encapsulation to the chip body, the encapsulation membrane outside the encapsulation support membrane body carries out whole sealed oil removal protection to the chip body.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a schematic perspective view of a package support film for chip packaging and a package structure thereof according to an embodiment of the present invention.
Fig. 2 is a top view of a package support film for chip packaging and a package structure thereof according to an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of a package support film for chip packaging and a package structure thereof according to an embodiment of the invention.
Fig. 4 is a partial cross-sectional view a of a package support film for chip packaging and a package structure thereof according to an embodiment of the invention.
Fig. 5 is a schematic diagram of a package support film for chip packaging and a package housing according to an embodiment of the package support film for chip packaging.
Fig. 6 is a schematic partial cross-sectional view B of a package support film for chip packaging and a package structure thereof according to an embodiment of the invention.
Fig. 7 is a cross-sectional view of a clamping mechanism provided in an embodiment of a package support film for chip packaging and a package structure thereof according to the invention.
Fig. 8 is a schematic cross-sectional view of a package support film for chip packaging and a package structure thereof according to an embodiment of the invention.
Fig. 9 is a schematic view of a conventional supporting film body provided in an embodiment of a package supporting film for chip packaging and a package structure thereof of the invention.
Description of reference numerals:
the packaging structure comprises a packaging top plate 1, a packaging bottom plate 2, a packaging shell 3, a chip body 4, a packaging supporting film body 5, a coating film 6, an inclined plug-in 7, a mounting rack 8, a sleeve 9, a threaded column 10, a partition plate 11, a rotating handle 12, a concave groove 13, a push strip 14, a packaging clamping piece 15, a movable shaft 16, a baffle plate 17, a connecting plate 18, a spring 19, a movable groove 20, a limiting groove 21, a clamping groove 22, a fastening bolt 23, a slot 24, a mask layer 25, a glue coating film layer 26, a polyimide film layer 27, a silicone pressure-sensitive adhesive film 28, an epoxy film 29, a heat conducting sheet 30, a side plate 31, a 32 blocking plug, a flow pipe 33, a transverse plate 34, a clamping mechanism 35, a top plate 36, a threaded rod 37, a side groove 38, a bottom plate 39, an elastic clamping piece 40 and an adjusting groove 41.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1 to 9, an embodiment of the present invention provides a packaging support film for chip packaging, including a chip body 4 and a packaging support film body 5, where the packaging support film body 5 includes an upper adhesive film layer 26, a polyimide film layer 27, a silicone pressure-sensitive adhesive film 28 and an epoxy resin film 29, the polyimide film layer 27 is adhered to the top and the bottom of the chip body 4, the polyimide film layer 27 has radiation and high temperature resistance and chemical corrosion resistance, the silicone pressure-sensitive adhesive film 28 is adhered to the outsides of the polyimide film layer 27 and the chip body 4, the polyimide film layer 27 and the silicone pressure-sensitive adhesive film 28 are arranged in a crossing manner, the four corners of the outside of the chip body 4 are all adhered with a pressure mask layer 25, the upper adhesive film layer 26 is adhered between the pressure mask layer 25 and the chip body 4, the upper adhesive film layer 26 is fixed between the pressure mask layer 25, the materials of the upper adhesive film layer 26, the polyimide film layer 27 and the silicone pressure-sensitive adhesive film 28 are less, meanwhile, the upper adhesive film layer 26, the polyimide film layer 27 and the organic silicon pressure-sensitive adhesive film 28 are bonded in a staggered manner outside the chip body 4, a net layer is formed outside the chip body 4 to support and fix the chip body 4, the organic silicon pressure-sensitive adhesive film 28 covers the polyimide film layer 27, the upper adhesive film layer 26 covers the organic silicon pressure-sensitive adhesive film 28 after being staggered, (as shown in the attached figure 8 of the specification), the coating film 6 is further arranged outside the packaging support film body 5, the coating film 6 can integrally protect the packaging support film body 5 to prevent external oil stains and the like from penetrating into the chip body 4, the upper adhesive film layer 26, the polyimide film layer 27 and other film layers in the packaging support film body 5 only further improve the performance of the packaging support film body 5, and the main functions of the upper adhesive film layer 26, the polyimide film layer 27 and other film layers are that under the condition of using less materials, supporting the chip body 4;
sending a crossed film structure formed by films such as an upper glue film layer 26 and a polyimide film layer 27 in a packaging supporting film body 5 and an existing completely-coated integral film structure onto an experiment platform (the completely-coated integral film structure is supported outside a chip body 4 in a completely-covered manner as shown in an attached drawing 9 of the specification), starting an experiment press machine to continuously and uniformly apply pressure to the crossed film structure and the completely-coated film structure, wherein the pressure of the experiment in the crossed film structure and the pressure of the experiment in the completely-coated film structure are consistent, the pressure applying duration is consistent until test pieces of the crossed film structure and the completely-coated film structure are damaged, recording the damage pressure value, and comparing through the experiment, if the pressure detection value of the press machine reaches 3.5N (Newton), the completely-coated film structure firstly breaks; reuse experiment stretcher with cross membranous layer structure and complete coating film layer structure carry out tensile experiment, the pulling force size of experiment is unanimous, and the time length of pulling is unanimous, and both initial elasticity is unanimous, and tensile experiment destroys until test piece between them to the record destroys the pulling force value, compares through the experiment, if when the pulling force detection value reached 2.3N (newton), the damaged condition appeared at complete coating film layer structure first-out.
It can be known from the above experiments that under the condition that the pressure value and the tension value applied by the experimental press and the stretcher are the same, the completely-coated integral film structure can firstly have the damaged condition, so that the supporting strength effect of the crossed film structure of the packaging supporting film body 5 on the chip body 4 is better.
The epoxy resin film 29 is fixedly arranged outside the pressure mask layer 25, the epoxy resin film 29 can integrally cover the pressure mask layer 25 and the outer surface of the chip body 4, so that the chip body 4 is supported and stabilized in the epoxy resin film 29, the epoxy resin film 29 is made of a transparent material and covers the outer part of the pressure mask layer 25, the epoxy resin film 29 is coated outside the coating film layers such as the gluing film layer 26 and the polyimide film layer 27, the attached figure 8 of the specification can illustrate the coating state of the epoxy resin film 29, and the epoxy resin film 29 has a certain anti-corrosion effect and can reduce the damage of the chip body 4.
In another embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, a cover film 6 is adhered to an outer wall of the package supporting film body 5, the cover film 6 further forms a protection film on an outer portion of the chip body 4, so as to reduce damage of the chip body 4 between the package top plate 1 and the package bottom plate 2, and the chip body 4 is fixedly mounted inside the package supporting film body 5.
In another embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the thicknesses of the polyimide film 27 and the silicone pressure-sensitive adhesive film 28 are both 0.07 mm, the thickness of the epoxy resin film 29 is 0.05 mm, and the thicknesses of the polyimide film 27, the silicone pressure-sensitive adhesive film 28 and the epoxy resin film 29 are thinner, so that the occupied space of the film can be reduced.
A packaging structure for packaging a chip comprises a packaging support film for packaging the chip, which comprises a packaging top plate 1, a packaging bottom plate 2 and a packaging shell 3, wherein a chip body 4 is arranged between the packaging top plate 1 and the packaging bottom plate 2, a connecting plate 18 is fixedly arranged inside the packaging shell 3, a spring 19 is welded at the bottom of the connecting plate 18, a pushing strip 14 is fixedly arranged at the bottom end of the spring 19, a baffle 17 is welded on the outer wall of the pushing strip 14, a movable groove 20 is formed inside the packaging shell 3, a movable shaft 16 is arranged inside the movable groove 20, a packaging clamping piece 15 is arranged outside the movable shaft 16, the packaging clamping piece 15 moves inside the movable groove 20, the baffle 17 can limit the movement of the packaging clamping piece 15, a concave groove 13 is formed in the outer wall of the packaging shell 3, a partition plate 11 is fixedly arranged on the inner wall of the concave groove 13, a threaded column 10 is movably connected inside the partition plate 11 through a bearing, and the external thread of the threaded column 10 is connected with an outer sleeve member 9, the outer wall of the outer sleeve member 9 is provided with an inclined plug-in member 7 through a bolt, the outer sleeve member 9 has to push the inclined plug-in member 7 to move after the threaded column 10 rotates, the inclined plug-in member 7 is far away from the partition plate 11 after moving towards the left side, the bottom of the pushing strip 14 moves upwards along the inclined surface of the inclined plug-in member 7, the packaging clamping member 15 moves away from one side of the baffle plate 17, one side of the packaging clamping member 15 is clamped in the packaging top plate 1, the chip body 4 is packaged between the packaging top plate 1 and the packaging bottom plate 2, after the inclined plug-in member 7 moves towards the other side, the spring 19 extends, the bottom end of the spring 19 pushes the pushing strip 14, the pushing strip 14 downwards enables the packaging clamping member 15 not to be limited and extruded by the baffle plate 17, and the packaging clamping member 15 can be separated from the packaging top plate 1.
In another embodiment of the present invention, as shown in fig. 1, 5, 6 and 7, a transverse plate 34 is fixedly installed on each of two sides of the inside of the package base plate 2, a heat conducting fin 30 is installed on the top of the transverse plate 34, the heat conducting fin 30 transmits the heat of the chip body 4 out of the inside of the package base plate 2, a fastening mechanism 35 is installed on one side of the transverse plate 34, the fastening mechanism 35 includes a top plate 36, a threaded rod 37 and a base plate 39, the threaded rod 37 is screwed into the inside of the transverse plate 34, and the threaded rod 37 is inserted into the inside of the transverse plate 34 after being rotated.
In another embodiment of the present invention, as shown in fig. 1, 5, 6 and 7, a top plate 36 is welded on a top end of a threaded rod 37, a bottom plate 39 is welded on a bottom end of the threaded rod 37, side grooves 38 are respectively formed on two sides of an outer wall of the threaded rod 37, an elastic clip 40 is arranged inside the side grooves 38, after the threaded rod 37 is rotated, the threaded rod 37 moves downward, so that one side of the elastic clip 40 is ejected out of the side grooves 38, the top plate 36 is arranged on two sides of the heat conducting strip 30, the elastic clip 40 is clipped on a bottom of the transverse plate 34, and one side of the top plate 36 presses an edge position of the heat conducting strip 30, so that the heat conducting strip 30 is located between the transverse plate 34 and the top plate 36, the heat conducting strip 30 is of a convex structure, and edge positions of two sides of the heat conducting strip 30 are located between the top plate 36 and the transverse plate 34.
In another embodiment of the present invention, as shown in fig. 1 and 3, side plates 31 are installed on both sides of the package base plate 2 by bolts, a plurality of circulation pipes 33 are welded on the outer walls of the side plates 31, a blocking plug 32 is screwed on the outer wall of one end of each circulation pipe 33, and the blocking plug 32 is taken out after being rotated, so that heat around the chip body 4 is dissipated from the circulation pipes 33, and the temperature of the chip body 4 is reduced.
In another embodiment of the present invention, as shown in fig. 1, 3, 5 and 6, the package top plate 1 and the package bottom plate 2 are disposed outside the coating film 6, a rotation handle 12 is welded to one end of the threaded column 10, the rotation handle 12 facilitates the rotation of the threaded column 10, adjustment grooves 41 are formed on both sides of the bottom of the package bottom plate 2, and the adjustment grooves 41 facilitate the rotation operation of the bottom plate 39 by extending into the lower side of the threaded rod 37.
In another embodiment of the present invention, as shown in fig. 1, 3 and 4, a mounting frame 8 is welded at the bottom of the package housing 3, a fastening bolt 23 is connected to the inside of the mounting frame 8 through a thread, the mounting frame 8 and the package housing 3 are mounted on two sides of the package base plate 2 through the fastening bolt 23, the fastening bolt 23 is inserted into the package base plate 2, a limiting groove 21 is formed in the package housing 3, and the limiting groove 21 facilitates the movement of the spring 19.
In another embodiment provided by the present invention, as shown in fig. 1, fig. 3 and fig. 4, two sides of the package bottom plate 2 are both provided with slots 24, the inclined plug-in 7 is inserted into the slots 24, so that the package housing 3 is attached to the package bottom plate 2, the package housing 3 and the package bottom plate 2 are fixedly connected, two sides of the outer wall of the top of the package top plate 1 are both provided with slots 22, one side of the package clamping piece 15 is clamped inside the slots 22, one end of the package clamping piece 15 is clamped inside the slots 22 after being moved, and the package top plate 1 is fixed on the package bottom plate 2 by pressing.
The working principle is as follows: the packaging support film body 5 is arranged outside the chip body 4, the polyimide film layer 27 is adhered to the outside of the chip body 4, the polyimide film layer 27 has the performances of high temperature resistance, radiation resistance and chemical corrosion resistance, then the organic silicon pressure-sensitive adhesive films 28 are arranged outside the polyimide film layer 27 in a staggered mode, the mask layers 25 are arranged at the four corners of the chip body 4, the gluing film layers 26 are arranged between the mask layers 25 in a crossed mode, the gluing film layers 26 enable parts of the chip body 4 to be jointed and arranged into a whole, the chip body 4 is supported by the polyimide film layer 27, the organic silicon pressure-sensitive adhesive films 28 and the gluing film layers 26 under the condition that few materials are used, the chip body 4 is fixed in each staggered film, the epoxy film layer 29 covers the gluing film layers 26, the epoxy film layer 29 is good in corrosion resistance, after the wrapping film 6 is arranged outside the packaging support film body 5, a person installs the mounting frame 8 and the packaging shell 3 on the two sides of the packaging bottom plate 2 through the fastening bolts 23, and the encapsulation top plate 1 is covered on the chip body 4, the operator rotates the rotating handle 12, the threaded column 10 drives the outer sleeve 9 to move, the outer sleeve 9 pushes the inclined plug-in 7 to insert the inclined plug-in 7 into the slot 24 of the encapsulation bottom plate 2, meanwhile, the bottom of the pushing strip 14 is influenced by the inclined surface of the inclined plug-in 7, the pushing strip 14 has to move upwards when the inclined plug-in 7 is pushed into the slot 24, the baffle 17 on the pushing strip 14 pushes the right side of the encapsulation clamping piece 15 upwards, the left side of the encapsulation clamping piece 15 inclines downwards, the encapsulation clamping piece 15 can be clamped in the clamping slot 22 of the encapsulation top plate 1, at the moment, the encapsulation clamping piece 15 is clamped on the encapsulation top plate 1, the inclined plug-in 7 is inserted into the encapsulation bottom plate 2, the encapsulation top plate 1 and the encapsulation bottom plate 2 are sealed and attached to encapsulate the chip body 4, the rotating handle 12 rotates reversely, the inclined plug-in 7 is drawn out of the slot 24, the pushing strip 14 is pushed downwards by the elasticity of the spring 19, the bottom of the pushing strip 14 moves downwards along the inclined plane of the inclined plug-in unit 7, the right side of the packaging clamping piece 15 is not affected by the pressure of the baffle 17, the packaging clamping piece 15 can be separated from the clamping groove 22, a person rotates the threaded rod 37 through the adjusting groove 41, one side of the elastic clamping piece 40 in the threaded rod 37 is separated from the side groove 38, the top of the elastic clamping piece 40 abuts against the lower side of the transverse plate 34, the heat conducting piece 30 is clamped between the chip body 4 and the transverse plate 34, the heat conducting piece 30 can be separated along with the inclined plug 32, and after the blocking plug 32 is opened, the heat conducting piece 30 transmits the temperature of the chip body 4 out of the circulating pipe 33.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (10)
1. The utility model provides a encapsulation supporting film for chip package, includes chip body (4) and encapsulation supporting film body (5), its characterized in that, encapsulation supporting film body (5) are including rubberizing rete (26), polyimide rete (27), organosilicon pressure sensitive adhesive film (28) and epoxy film (29), polyimide rete (27) bond in the top and the bottom of chip body (4), organosilicon pressure sensitive adhesive film (28) bond in the outside of polyimide rete (27) and chip body (4), chip body (4) outside four corners department all bonds and has pressed mask layer (25), rubberizing rete (26) bond between pressed mask layer (25) and chip body (4), epoxy film (29) fixed mounting is in the outside of pressed mask layer (25).
2. The packaging support film for chip packaging according to claim 1, wherein a cover film (6) is bonded to an outer wall of the packaging support film body (5), the chip body (4) is fixedly mounted inside the packaging support film body (5), and the polyimide film layer (27) and the silicone pressure sensitive adhesive film (28) are arranged in a crossed manner.
3. The supporting film for packaging chip as claimed in claim 1, wherein the thickness of the polyimide film layer (27) and the thickness of the silicone pressure sensitive adhesive film (28) are both 0.07 mm, and the thickness of the epoxy resin film (29) is 0.05 mm.
4. A packaging structure for chip packaging, comprising the packaging support film for chip packaging as claimed in any one of claims 1-3, comprising a packaging top plate (1), a packaging bottom plate (2) and a packaging shell (3), characterized in that a connecting plate (18) is fixedly mounted inside the packaging shell (3), a spring (19) is welded at the bottom of the connecting plate (18), a pushing strip (14) is fixedly mounted at the bottom end of the spring (19), a baffle plate (17) is welded on the outer wall of the pushing strip (14), a movable groove (20) is formed inside the packaging shell (3), a movable shaft (16) is arranged inside the movable groove (20), a packaging clamping piece (15) is arranged outside the movable shaft (16),
sunken groove (13) have been seted up to the outer wall of encapsulation shell (3), the inner wall fixed mounting of sunken groove (13) has baffle (11), there are screw thread post (10) inside of baffle (11) through bearing swing joint, and the outside threaded connection of screw thread post (10) has outer cover spare (9), slope plug-in components (7) are installed through the bolt to the outer wall of outer cover spare (9).
5. The package structure for chip packaging according to claim 4, wherein a transverse plate (34) is fixedly mounted on both sides of the inside of the package base plate (2), a heat conducting fin (30) is disposed on the top of the transverse plate (34), a clamping mechanism (35) is disposed on one side of the transverse plate (34), the clamping mechanism (35) comprises a top plate (36), a threaded rod (37) and a bottom plate (39), and the threaded rod (37) is screwed inside the transverse plate (34).
6. The package structure for chip packaging according to claim 5, wherein the top plate (36) is welded to a top end of the threaded rod (37), the bottom plate (39) is welded to a bottom end of the threaded rod (37), side grooves (38) are formed on two sides of an outer wall of the threaded rod (37), elastic clips (40) are arranged inside the side grooves (38), and the top plate (36) is arranged on two sides of the heat conducting strip (30).
7. The packaging structure for chip packaging according to claim 4, wherein side plates (31) are mounted on both sides of the packaging bottom plate (2) through bolts, a plurality of flow pipes (33) are welded on the outer walls of the side plates (31), and a blocking plug (32) is screwed on the outer wall of one end of each flow pipe (33).
8. The chip package structure according to claim 4, wherein the package top plate (1) and the package bottom plate (2) are disposed outside the cover film (6), a rotation handle (12) is welded to one end of the threaded column (10), and adjustment grooves (41) are formed on both sides of the bottom of the package bottom plate (2).
9. The chip package structure of claim 4, wherein a mounting frame (8) is welded to the bottom of the package housing (3), a fastening bolt (23) is connected to the mounting frame (8) through a thread, the fastening bolt (23) is inserted into the package base plate (2), and a limiting groove (21) is formed in the package housing (3).
10. The package structure for chip packaging according to claim 4, wherein the package bottom plate (2) has slots (24) formed on both sides thereof, the inclined plug-in unit (7) is inserted into the slots (24), the top plate (1) has slots (22) formed on both sides thereof, and one side of the package clip (15) is engaged with the slots (22).
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| CN202210998343.6A CN115074045B (en) | 2022-08-19 | 2022-08-19 | Packaging support film for chip packaging and packaging structure thereof |
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| CN202210998343.6A CN115074045B (en) | 2022-08-19 | 2022-08-19 | Packaging support film for chip packaging and packaging structure thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102656675A (en) * | 2009-10-16 | 2012-09-05 | Lg化学株式会社 | Die attach film |
| US20210175210A1 (en) * | 2019-12-04 | 2021-06-10 | Sj Semiconductor (Jiangyin) Corporation | Three-Dimensional Chip Packaging Structure And Method Thereof |
| CN113568220A (en) * | 2020-04-28 | 2021-10-29 | 海信视像科技股份有限公司 | Display device |
| CN214693974U (en) * | 2020-12-25 | 2021-11-12 | 浙江荷清柔性电子技术有限公司 | Flexible chip bonding film and packaging structure of flexible chip |
| CN216389413U (en) * | 2021-11-11 | 2022-04-26 | 深圳市瑞丰光电子股份有限公司 | Bracket component and LED module |
| CN114823597A (en) * | 2021-01-22 | 2022-07-29 | 半导体元件工业有限责任公司 | Semiconductor device package and method of manufacturing the same |
-
2022
- 2022-08-19 CN CN202210998343.6A patent/CN115074045B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102656675A (en) * | 2009-10-16 | 2012-09-05 | Lg化学株式会社 | Die attach film |
| US20210175210A1 (en) * | 2019-12-04 | 2021-06-10 | Sj Semiconductor (Jiangyin) Corporation | Three-Dimensional Chip Packaging Structure And Method Thereof |
| CN113568220A (en) * | 2020-04-28 | 2021-10-29 | 海信视像科技股份有限公司 | Display device |
| CN214693974U (en) * | 2020-12-25 | 2021-11-12 | 浙江荷清柔性电子技术有限公司 | Flexible chip bonding film and packaging structure of flexible chip |
| CN114823597A (en) * | 2021-01-22 | 2022-07-29 | 半导体元件工业有限责任公司 | Semiconductor device package and method of manufacturing the same |
| CN216389413U (en) * | 2021-11-11 | 2022-04-26 | 深圳市瑞丰光电子股份有限公司 | Bracket component and LED module |
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| CN115074045B (en) | 2022-11-11 |
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Address after: Nancun Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province, 215000 Patentee after: Suzhou Hengyue New Material Co.,Ltd. Address before: Nancun Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province, 215000 Patentee before: SUZHOU HENGYUE NEW MATERIAL Co.,Ltd. |
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