CN115050858A - Mini/Micro LED chip pneumatic huge transfer device - Google Patents

Mini/Micro LED chip pneumatic huge transfer device Download PDF

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Publication number
CN115050858A
CN115050858A CN202210631736.3A CN202210631736A CN115050858A CN 115050858 A CN115050858 A CN 115050858A CN 202210631736 A CN202210631736 A CN 202210631736A CN 115050858 A CN115050858 A CN 115050858A
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China
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chip
guide rail
longitudinal
moving assembly
substrate
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Inventor
刘强
徐杰
俞建荣
赵甜甜
袁野
李晶
桑建
王子羲
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Beijing Haiju Electronic Technology Co ltd
Beijing Institute of Petrochemical Technology
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Beijing Haiju Electronic Technology Co ltd
Beijing Institute of Petrochemical Technology
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Priority to CN202210631736.3A priority Critical patent/CN115050858A/en
Publication of CN115050858A publication Critical patent/CN115050858A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a pneumatic huge transfer device for a Mini/Micro LED chip, which mainly comprises a chip carrier system, a substrate carrier system and a pneumatic vision system, wherein the chip carrier system mainly comprises: the device comprises a marble base, a support, an outer guide rail, a linear motor, a chip linear moving assembly, a longitudinal grating ruler reading head, a chip rotation adjusting assembly and a chip carrier plate; the substrate stage system mainly includes: the device comprises a lower grating ruler, a lower grating ruler reading head, an inner guide rail, an inner motor, a substrate longitudinal moving assembly and a substrate transverse moving assembly; the pneumatic visual system mainly comprises: the device comprises a support beam, an upper guide rail, an upper linear motor, an upper transverse moving assembly, a pressure regulating valve, a high-frequency electromagnetic valve, a transverse grating ruler reading head, a transverse grating ruler, a fixing base plate, a fixing base, an industrial CCD camera and an air faucet. The invention adopts a pneumatic mode to carry out mass transfer, has high transfer efficiency, high precision and high yield, does not damage the substrate and the chip, does not pollute the working environment, and accords with the green production safety concept.

Description

Mini/Micro LED chip pneumatic huge transfer device
Technical Field
The invention relates to a huge transfer technology of a Micro light-emitting diode, in particular to a pneumatic huge transfer device of a Mini/Micro LED chip.
Background
From early stones, bamboo slips and linen to paper and then to electronic display, the displayed carrier is continuously updated and iterated along with the development of human beings, and the transmission efficiency and transmission quality of visual information are improved unprecedentedly. The display equipment can present more and richer contents, has the characteristics of vivid image, liveness, strong infectivity and the like, and gives strong liveness impression to people. The display device is used as an interactive window between human beings and machines, and information near 2/3 is transmitted through the display, so that the display device plays an extremely important role. The new display technology is a core technology of the electronic information industry following computer technology, communication technology, integrated circuit technology and the like, and is the foundation of strategic high and new technologies and the most active electronic information industry.
The Cathode Ray Tube (CRT) invented by Braun in Germany in 1897 opened the way of display technology. The CRT has advantages of high chroma and high response speed, but its imaging principle causes defects of high power consumption, high radiation and large volume, and is gradually eliminated. In 1983, the Japanese scientist made some improvements to the traditional reflective Liquid Crystal Display (LCD) to the transmissive color LCD, and since then, a new era of flat panel Display was created. The LCD is the most popular display device at present because of its advantages of low power consumption, no flicker, low radiation, small volume, low price, etc., but its defects of low contrast, small viewing angle, slow response speed, inflexibility, etc. make the display effect not good enough. Compared with the LCD, the Organic Light-Emitting Diode (OLED) has the greatest characteristic of self-luminescence without a backlight source, and thus has many advantages: the light-emitting diode has the advantages of high luminous efficiency, quick response time, high contrast, low power consumption, lightness, thinness and flexibility, but due to material characteristics, the service life of pixel points is not long, and the luminous efficiency and the luminous brightness are reduced along with the accumulation of working time, so that the display effect is influenced. The Mini/Micro LED is used as a new generation display technology, an arrayed inorganic self-luminous micron-sized LED chip is adopted, the defect that an OLED display screen is short in service life is overcome, response time, power consumption and the like are further reduced, brightness, resolution, contrast and the like are improved, however, tens of thousands to tens of millions of micron-sized LEDs need to be placed on a driving circuit board in the manufacturing process of the Mini/Micro LED display screen, namely, the huge transfer of the chip is caused, the manufacturing cost is high due to the double constraints of precision and efficiency, and numerous huge transfer methods are provided in the industry for solving the bottleneck.
The mass transfer method is divided into four genres. One is fluid self-assembly: the chip and the target substrate are specially processed, the substrate and the chip are placed in a solution, the chip is transferred into the capture well of the target substrate by utilizing fluid force and chip gravity, the number of the capture wells in the initial vacancy state is large in the process, the transfer speed is high, the number of the capture wells in the initial vacancy state is reduced along with the transfer process, the transfer speed is low, the chips collide with each other in the solution, the damage is caused, and the yield is low. The second is roller transfer printing: the method has simple structure and low use cost, but the difficulty is how to control the matching of the translation speed of the substrate bearing table and the angular speed of the roller and the clearance between the roller and the substrate bearing table. The third is an elastic seal: the original substrate is required to be processed by transferring the seal with adhesiveness from the original substrate adhesion chip to the target substrate, so that the chip is only fixed on the substrate through the anchor points and the broken chains, the adhesion force of each stage is required to be accurately controlled, and the difficulty is high. And fourthly, laser release transfer: the basic mechanism is the interface action of the laser and the transfer crystal film, so that the viscosity of the chip and the transfer crystal film is obviously reduced or bubbles are generated to transfer the chip, the efficiency and the precision are highest in four huge transfer modes, and the chip has the future prospect, but the laser cost is high, the transfer crystal film cannot be recycled, and a gas product pollutes the working environment.
The bulk transfer method of fluid-assembly-based micro LED displays described in chinese patent 202111275465.4, which uses fluid assembly, requires re-processing of the chip structure and has no selective release capability, a stamp substrate with an array of trapping sites and a keel extending from the bottom surface of the micro LEDs;
according to the massive transfer roller transfer technology disclosed in the Chinese patent 202111083038.6, a PDMS pressure roller is controlled by a roller transfer system to extract and release chips, the chips need to be rearranged, the workload is increased, and the transfer process is extremely difficult to control;
according to the crystal film for the massive transfer of the liquid-gas binary Mini/Micro LED chip and the manufacturing method thereof disclosed in Chinese patent 202210327336.3, laser spots are used for irradiating a liquid-gas binary medium and a bonding layer, the liquid-gas binary medium is heated to be changed into a gas state, and meanwhile, the bonding force of the bonding layer is reduced to transfer the chip;
the bulk transfer device based on the microporous medium gasification primary crystal membrane described in the chinese patent 202210697. X uses micropores to limit the bubble expansion direction, thereby improving the transfer precision and the yield, but when the laser is applied, the thermal effect still occurs, and there is a possibility of damaging the chip.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The invention aims to provide a through hole blowing type Mini/Micro LED chip pneumatic huge transfer device, which is used for solving the technical problems in the prior art and realizing the transfer of chips without damage, pollution, high efficiency and high yield.
The invention relates to a pneumatic huge transfer device of a Mini/Micro LED chip, which mainly comprises a chip carrier system, a substrate carrier system and a pneumatic vision system, wherein the chip carrier system mainly comprises: the device comprises a marble base 1, a left support 2A, a right support 2B, an outer left guide rail 3A, an outer right guide rail 3B, a left linear motor 4A, a right linear motor 4B, a chip linear moving assembly 5, an upper longitudinal grating ruler 6, an upper longitudinal grating ruler reading head 7, a chip rotation adjusting assembly 8 and a chip support plate 9; the substrate stage system mainly includes: the device comprises a lower longitudinal grating ruler 10, a lower longitudinal grating ruler reading head 11, an inner longitudinal left guide rail 12A, an inner longitudinal right guide rail 12B, an inner longitudinal motor stator 13, an inner longitudinal motor rotor 14, a substrate longitudinal moving assembly 15, a lower transverse grating ruler 16, a lower transverse grating ruler reading head 17 and a substrate transverse moving assembly 18; the pneumatic visual system mainly comprises: the device comprises a support beam 19, an upper outer guide rail 20A, an upper inner guide rail 20B, an upper linear motor 21, an upper transverse moving assembly 22, a ball screw module 23, a pressure regulating valve 24, a high-frequency electromagnetic valve 25, an upper transverse grating ruler reading head 26, an upper transverse grating ruler 27, a fixing seat bottom plate 28, a left fixing seat 29A, a right fixing seat 29B, an industrial CCD camera 30 and an air nozzle 31. The marble base 1 is positioned below a left support 2A, a right support 2B, an outer left guide rail 3A and an outer right guide rail 3B, the left support 2A and the right support 2B are respectively positioned at the left side and the right side of the upper surface of the marble base 1 and are installed on the marble base 1 through fastening screws, the outer left guide rail 3A is positioned at the right side of the upper surface of the left support 2A and is installed on the left support 2A through fastening screws, the outer right guide rail 3B is positioned at the left side of the upper surface of the right support 2B and is installed on the right support 2B through fastening screws, a left linear motor 4A and a right linear motor 4B are respectively positioned above the left side of the outer left guide rail 3A and above the right side of the outer right guide rail 3B, a left linear motor 4A and a right linear motor 4B are respectively positioned at the left side of the upper surface of the left support 2A and the right side of the upper surface of the right support 2B and are respectively installed on the left support 2A and the right support 2B through fastening screws, the chip linear moving assembly 5 is positioned above the marble base 1, the left support 2A, the right support 2B, the outer left guide rail 3A and the outer right guide rail 3B, the chip linear moving assembly 5 is positioned on the right side of the left linear motor 4A and the left side of the right linear motor 4B, and is clamped on the outer left guide rail 3A and the outer right guide rail 3B through a sliding block at the bottom of the chip linear moving assembly 5, the chip linear moving assembly 5 is connected with a rotor of the left linear motor 4A and a rotor of the right linear motor 4B through fastening screws, the upper longitudinal grating ruler 6 is positioned on the upper side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, the upper longitudinal grating ruler reading head 7 is positioned on the left side of the front surface of the chip linear moving assembly 5, the upper longitudinal grating ruler reading head 7 is positioned on the right side of the upper longitudinal grating ruler 6 and is installed on the chip linear moving assembly 5 through the fastening screws, the chip rotation adjusting assembly 8 is positioned in the center of the upper surface of the linear moving assembly 5, and are connected with a bearing through a gear rack, a chip carrier plate 9 is positioned above the marble base 1, the chip carrier plate 9 is positioned at the right side of a left support 2A and the left side of a right support 2B, the chip carrier plate 9 is positioned below a chip rotation adjusting component 8 and is adsorbed and fixed through a sucker of the chip rotation adjusting component 8, a lower longitudinal grating ruler 10 is positioned at the lower side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, a lower longitudinal grating ruler reading head 11 is positioned at the right side of the left support 2A, the lower longitudinal grating ruler reading head 11 is positioned at the front side of the left surface of a substrate longitudinal moving component 15 and is installed on the substrate longitudinal moving component 15 through fastening screws, an inner longitudinal left guide rail 12A and an inner longitudinal right guide rail 12B are respectively positioned at the left side and the right side of the upper surface of the marble base 1, the inner longitudinal left guide rail 12A and the inner longitudinal right guide rail 12B are respectively positioned at the right side of the left support 2A and the left side of the right support 2B, and is installed on the marble base 1 by fastening screws, the inner longitudinal motor stator 13 is located on the central line of the upper surface of the marble base 1, the inner longitudinal motor stator 13 is located on the right side of the inner longitudinal left guide rail 12A and the left side of the inner longitudinal right guide rail 12B, and is installed on the marble base 1 by fastening screws, the inner longitudinal motor mover 14 is located right above the inner longitudinal motor stator 13, the inner longitudinal motor mover 14 is located right below the substrate longitudinal moving assembly 15 and is installed on the substrate longitudinal moving assembly 15 by fastening screws, the substrate longitudinal moving assembly 15 is located right side of the left support 2A and left side of the right support 2B, the substrate longitudinal moving assembly 15 is located above the inner longitudinal left guide rail 12A, the inner longitudinal right guide rail 12B, the inner longitudinal motor stator 13 and the inner longitudinal motor mover 14, the substrate longitudinal moving assembly 15 is located below the chip linear moving assembly 5, the chip rotation adjusting assembly 8 and the chip carrier plate 9, a sliding block at the bottom of a substrate longitudinal moving component 15 is clamped on an inner longitudinal left guide rail 12A and an inner longitudinal right guide rail 12B, a lower transverse grating ruler 16 is positioned on the front surface of the substrate longitudinal moving component 15 and is adhered on the substrate longitudinal moving component 15 through epoxy resin glue, a lower transverse grating ruler reading head 17 is positioned on the right side of the front surface of a substrate transverse moving component 18 and is installed on a substrate transverse moving component 18 through fastening screws, the substrate transverse moving component 18 is positioned on the right side of a left support 2A and the left side of a right support 2B, the substrate transverse moving component 18 is positioned above the substrate longitudinal moving component 15, the substrate transverse moving component 18 is positioned below a chip linear moving component 5, a chip rotation adjusting component 8 and a chip carrier plate 9 and is clamped on the substrate longitudinal moving component 15 through the sliding block at the bottom of the substrate transverse moving component 18, and a supporting beam 19 is positioned above a marble base 1, a supporting beam 19 is positioned outside the left and right supports 2A and 2B and is mounted on the marble base 1 by fastening screws, an upper outer guide rail 20A and an upper inner guide rail 20B are positioned on the upper side of the front surface of the supporting beam 19 and are mounted on the supporting beam 19 by fastening screws, an upper outer guide rail 20A is positioned above the upper inner guide rail 20B, an upper linear motor 21 is positioned on the upper surface of the supporting beam 19 and is mounted on the supporting beam 19 by fastening screws, an upper traverse assembly 22 is positioned above the chip traverse assembly 5 and the chip rotation adjusting assembly 8, an upper traverse assembly 22 is positioned on the front side of the supporting beam 19 and is clamped on the upper outer guide rail 20A and the upper inner guide rail 20B by a slider at the bottom of the upper traverse assembly 22, a ball screw module 23 is positioned on the front surface of the upper traverse assembly 22 and is mounted on the upper traverse assembly 22 by fastening screws, a pressure regulating valve 24 and a high frequency solenoid valve 25 are positioned on the upper right side of the front surface of the upper traverse assembly 22, the pressure regulating valve 24 is positioned above the high-frequency electromagnetic valve 25, the upper transverse grating ruler reading head 26 is positioned on the upper side of the right surface of the upper transverse moving assembly 22 and is arranged on the upper transverse moving assembly 22 through a fastening screw, the upper transverse grating ruler 27 is positioned on the upper side of the front surface of the supporting beam 19, the upper transverse grating ruler 27 is positioned on the upper side of the upper outer guide rail 20A, the upper transverse grating ruler 27 is positioned on the rear side of the upper transverse moving assembly 22 and the upper transverse grating ruler reading head 26 and is glued on the supporting beam 19 through epoxy resin, the fixing seat bottom plate 28 is positioned on the front side of the ball screw module 23 and is arranged on the ball screw module 23 through a fastening screw, the left fixing seat 29A and the right fixing seat 29B are respectively positioned on the left side of the front surface of the fixing seat bottom plate 28 and on the fixing seat bottom plate 28 through a fastening screw, the industrial CCD camera 30 and the air nozzle 31 are respectively positioned in a clamping groove in the middle part of the left fixing seat 29A and the right fixing seat 29B, and are respectively mounted on the left and right holders 29A and 29B by fastening screws.
Compared with the prior art, the invention has the advantages that:
compared with a fluid self-assembly mode, the invention avoids the need of special structure treatment on the substrate and the chip; compared with the elastic seal mode, the method avoids the need of special structure processing on the original substrate; compared with a roller transfer printing mode, the high-precision position adjustment of a roller system and a substrate system is avoided; compared with a laser release transfer mode, the pneumatic mode is adopted, so that the defects of high price and unstable thermochemical effect of a laser are overcome, the thermochemical effect is avoided in the transfer process, any special treatment on the substrate and the chip is not needed, and the pneumatic laser release transfer device has the advantages of low cost, reusability, no pollution, no damage, high precision, high efficiency and high yield.
Drawings
FIG. 1 is a schematic three-dimensional structure diagram of a Mini/Micro LED chip pneumatic bulk transfer device according to an embodiment of the present invention;
fig. 2 is a schematic three-dimensional structure diagram of a chip carrier system according to an embodiment of the present invention;
fig. 3 is a schematic three-dimensional structure diagram of a substrate stage system according to an embodiment of the invention;
FIG. 4 is a schematic three-dimensional structure of an embodiment of the invention;
FIG. 5a is a schematic diagram of a three-dimensional top view of a chip linear motion assembly according to an embodiment of the present invention;
FIG. 5b is a schematic diagram of a three-dimensional bottom view of a chip linear motion assembly according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a three-dimensional top view of a chip rotation adjustment assembly according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a chip carrier according to an embodiment of the invention;
FIG. 8a is a schematic diagram of a three-dimensional top view of a substrate longitudinal movement assembly according to an embodiment of the present invention;
FIG. 8b is a schematic three-dimensional bottom view of a substrate longitudinal movement assembly according to an embodiment of the present invention;
FIG. 9 is a schematic three-dimensional bottom view of a substrate traversing assembly according to an embodiment of the present invention;
FIG. 10 is a schematic three-dimensional rear view of an upper traverse assembly according to an embodiment of the present invention
Fig. 11 is a schematic diagram illustrating relative positions of a chip carrier and a chip according to an embodiment of the invention;
FIG. 12a is a schematic diagram illustrating relative positions of an air nozzle and a chip carrier according to an embodiment of the present invention;
fig. 12b is a schematic diagram of a transfer principle according to an embodiment of the present invention.
Detailed Description
The technical scheme in the embodiment of the invention is clearly and completely described below by combining the attached drawings in the embodiment of the invention; it is to be understood that the described embodiments are merely exemplary of the invention, and are not intended to limit the invention to the particular forms disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The terms that may be used herein are first described as follows:
the term "and/or" means that either or both can be achieved, for example, X and/or Y means that both cases include "X" or "Y" as well as three cases including "X and Y".
The terms "comprising," "including," "containing," "having," or other similar terms of meaning should be construed as non-exclusive inclusions. For example: including a feature (e.g., material, component, ingredient, carrier, formulation, material, dimension, part, component, mechanism, device, process, procedure, method, reaction condition, processing condition, parameter, algorithm, signal, data, product, or article of manufacture), is to be construed as including not only the particular feature explicitly listed but also other features not explicitly listed as such which are known in the art.
The term "consisting of … …" is meant to exclude any technical feature elements not explicitly listed. If used in a claim, the term shall render the claim closed except for the usual impurities associated therewith which do not include the technical features other than those explicitly listed. If the term occurs in only one clause of the claims, it is defined only to the elements explicitly recited in that clause, and elements recited in other clauses are not excluded from the overall claims.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "secured," etc., are to be construed broadly, as for example: can be fixedly connected, can also be detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms herein can be understood by those of ordinary skill in the art as appropriate.
The terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in an orientation or positional relationship that is indicated based on the orientation or positional relationship shown in the drawings for ease of description and simplicity of description only, and are not intended to imply or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting herein.
Details which are not described in detail in the embodiments of the invention belong to the prior art which is known to the person skilled in the art. Those not specifically mentioned in the examples of the present invention were carried out according to the conventional conditions in the art or conditions suggested by the manufacturer. The reagents or instruments used in the examples of the present invention are not specified by manufacturers, and are all conventional products available by commercial purchase.
The invention relates to a pneumatic huge transfer device of a Mini/Micro LED chip, which mainly comprises a chip carrier system, a substrate carrier system and a pneumatic vision system, wherein the chip carrier system mainly comprises: the device comprises a marble base 1, a left support 2A, a right support 2B, an outer left guide rail 3A, an outer right guide rail 3B, a left linear motor 4A, a right linear motor 4B, a chip linear moving assembly 5, an upper longitudinal grating ruler 6, an upper longitudinal grating ruler reading head 7, a chip rotation adjusting assembly 8 and a chip support plate 9; the substrate stage system mainly includes: the device comprises a lower longitudinal grating ruler 10, a lower longitudinal grating ruler reading head 11, an inner longitudinal left guide rail 12A, an inner longitudinal right guide rail 12B, an inner longitudinal motor stator 13, an inner longitudinal motor rotor 14, a substrate longitudinal moving assembly 15, a lower transverse grating ruler 16, a lower transverse grating ruler reading head 17 and a substrate transverse moving assembly 18; the pneumatic visual system mainly comprises: the device comprises a support beam 19, an upper outer guide rail 20A, an upper inner guide rail 20B, an upper linear motor 21, an upper transverse moving assembly 22, a ball screw module 23, a pressure regulating valve 24, a high-frequency electromagnetic valve 25, an upper transverse grating ruler reading head 26, an upper transverse grating ruler 27, a fixing seat bottom plate 28, a left fixing seat 29A, a right fixing seat 29B, an industrial CCD camera 30 and an air nozzle 31. The marble base 1 is positioned below a left support 2A, a right support 2B, an outer left guide rail 3A and an outer right guide rail 3B, the left support 2A and the right support 2B are respectively positioned at the left side and the right side of the upper surface of the marble base 1 and are installed on the marble base 1 through fastening screws, the outer left guide rail 3A is positioned at the right side of the upper surface of the left support 2A and is installed on the left support 2A through fastening screws, the outer right guide rail 3B is positioned at the left side of the upper surface of the right support 2B and is installed on the right support 2B through fastening screws, a left linear motor 4A and a right linear motor 4B are respectively positioned above the left side of the outer left guide rail 3A and above the right side of the outer right guide rail 3B, a left linear motor 4A and a right linear motor 4B are respectively positioned at the left side of the upper surface of the left support 2A and the right side of the upper surface of the right support 2B and are respectively installed on the left support 2A and the right support 2B through fastening screws, the chip linear moving assembly 5 is positioned above the marble base 1, the left support 2A, the right support 2B, the outer left guide rail 3A and the outer right guide rail 3B, the chip linear moving assembly 5 is positioned on the right side of the left linear motor 4A and the left side of the right linear motor 4B, and is clamped on the outer left guide rail 3A and the outer right guide rail 3B through a sliding block at the bottom of the chip linear moving assembly 5, the chip linear moving assembly 5 is connected with a rotor of the left linear motor 4A and a rotor of the right linear motor 4B through fastening screws, the upper longitudinal grating ruler 6 is positioned on the upper side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, the upper longitudinal grating ruler reading head 7 is positioned on the left side of the front surface of the chip linear moving assembly 5, the upper longitudinal grating ruler reading head 7 is positioned on the right side of the upper longitudinal grating ruler 6 and is installed on the chip linear moving assembly 5 through the fastening screws, the chip rotation adjusting assembly 8 is positioned in the center of the upper surface of the linear moving assembly 5, and are connected with a bearing through a gear rack, a chip carrier plate 9 is positioned above the marble base 1, the chip carrier plate 9 is positioned at the right side of a left support 2A and the left side of a right support 2B, the chip carrier plate 9 is positioned below a chip rotation adjusting component 8 and is adsorbed and fixed through a sucker of the chip rotation adjusting component 8, a lower longitudinal grating ruler 10 is positioned at the lower side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, a lower longitudinal grating ruler reading head 11 is positioned at the right side of the left support 2A, a lower longitudinal grating ruler reading head 11 is positioned at the front side of the left surface of a substrate longitudinal moving component 15 and is installed on the substrate longitudinal moving component 15 through fastening screws, an inner longitudinal left guide rail 12A and an inner longitudinal right guide rail 12B are respectively positioned at the left side and the right side of the upper surface of the marble base 1, the inner longitudinal left guide rail 12A and the inner longitudinal right guide rail 12B are respectively positioned at the right side of the left support 2A and the left side of the right support 2B, and is installed on the marble base 1 by fastening screws, the inner longitudinal motor stator 13 is located on the central line of the upper surface of the marble base 1, the inner longitudinal motor stator 13 is located on the right side of the inner longitudinal left guide rail 12A and the left side of the inner longitudinal right guide rail 12B, and is installed on the marble base 1 by fastening screws, the inner longitudinal motor mover 14 is located right above the inner longitudinal motor stator 13, the inner longitudinal motor mover 14 is located right below the substrate longitudinal moving assembly 15 and is installed on the substrate longitudinal moving assembly 15 by fastening screws, the substrate longitudinal moving assembly 15 is located right side of the left support 2A and left side of the right support 2B, the substrate longitudinal moving assembly 15 is located above the inner longitudinal left guide rail 12A, the inner longitudinal right guide rail 12B, the inner longitudinal motor stator 13 and the inner longitudinal motor mover 14, the substrate longitudinal moving assembly 15 is located below the chip linear moving assembly 5, the chip rotation adjusting assembly 8 and the chip carrier plate 9, a sliding block at the bottom of a substrate longitudinal moving component 15 is clamped on an inner longitudinal left guide rail 12A and an inner longitudinal right guide rail 12B, a lower transverse grating ruler 16 is positioned on the front surface of the substrate longitudinal moving component 15 and is adhered on the substrate longitudinal moving component 15 through epoxy resin glue, a lower transverse grating ruler reading head 17 is positioned on the right side of the front surface of a substrate transverse moving component 18 and is installed on a substrate transverse moving component 18 through fastening screws, the substrate transverse moving component 18 is positioned on the right side of a left support 2A and the left side of a right support 2B, the substrate transverse moving component 18 is positioned above the substrate longitudinal moving component 15, the substrate transverse moving component 18 is positioned below a chip linear moving component 5, a chip rotation adjusting component 8 and a chip carrier plate 9 and is clamped on the substrate longitudinal moving component 15 through the sliding block at the bottom of the substrate transverse moving component 18, and a supporting beam 19 is positioned above a marble base 1, a supporting beam 19 is positioned outside the left and right supports 2A and 2B and is mounted on the marble base 1 by fastening screws, an upper outer guide rail 20A and an upper inner guide rail 20B are positioned on the upper side of the front surface of the supporting beam 19 and are mounted on the supporting beam 19 by fastening screws, an upper outer guide rail 20A is positioned above the upper inner guide rail 20B, an upper linear motor 21 is positioned on the upper surface of the supporting beam 19 and is mounted on the supporting beam 19 by fastening screws, an upper traverse assembly 22 is positioned above the chip traverse assembly 5 and the chip rotation adjusting assembly 8, an upper traverse assembly 22 is positioned on the front side of the supporting beam 19 and is clamped on the upper outer guide rail 20A and the upper inner guide rail 20B by a slider at the bottom of the upper traverse assembly 22, a ball screw module 23 is positioned on the front surface of the upper traverse assembly 22 and is mounted on the upper traverse assembly 22 by fastening screws, a pressure regulating valve 24 and a high frequency solenoid valve 25 are positioned on the upper right side of the front surface of the upper traverse assembly 22, the pressure regulating valve 24 is positioned above the high-frequency electromagnetic valve 25, the upper transverse grating ruler reading head 26 is positioned on the upper side of the right surface of the upper transverse moving assembly 22 and is arranged on the upper transverse moving assembly 22 through a fastening screw, the upper transverse grating ruler 27 is positioned on the upper side of the front surface of the supporting beam 19, the upper transverse grating ruler 27 is positioned on the upper side of the upper outer guide rail 20A, the upper transverse grating ruler 27 is positioned on the rear side of the upper transverse moving assembly 22 and the upper transverse grating ruler reading head 26 and is glued on the supporting beam 19 through epoxy resin, the fixing seat bottom plate 28 is positioned on the front side of the ball screw module 23 and is arranged on the ball screw module 23 through a fastening screw, the left fixing seat 29A and the right fixing seat 29B are respectively positioned on the left side of the front surface of the fixing seat bottom plate 28 and on the fixing seat bottom plate 28 through a fastening screw, the industrial CCD camera 30 and the air nozzle 31 are respectively positioned in a clamping groove in the middle part of the left fixing seat 29A and the right fixing seat 29B, and are respectively mounted on the left and right holders 29A and 29B by fastening screws.
The chip linear movement assembly 5 mainly includes a chip linear movement bottom plate 501, a rotating motor 502, a gear 503, a bearing 504, a chip linear movement left front slider 505A, a chip linear movement left rear slider 505B, a chip linear movement right front slider 505C and a chip linear movement right rear slider 505D.
The chip rotation adjustment assembly 8 mainly includes a chip rotation adjustment base plate 801, a rack 802, a left front suction cup 803A, a left rear suction cup 803B, a right front suction cup 803C, and a right rear suction cup 803D.
The chip carrier 9 mainly includes a carrier 901, an elastic film 902, and an adhesive layer 903.
The base plate longitudinal moving assembly 15 mainly comprises a base plate longitudinal moving bottom plate 1501, an inner transverse motor stator 1502, an inner transverse front guide rail 1503A, an inner transverse rear guide rail 1503B, an inner longitudinal left front slider 1504A, an inner longitudinal left rear slider 1504B, an inner longitudinal right front slider 1504C and an inner longitudinal right rear slider 1504D.
The substrate lateral movement assembly 18 mainly includes a substrate lateral movement base plate 1801, an inner lateral motor mover 1802, an inner lateral left front slider 1803A, an inner lateral left rear slider 1803B, an inner lateral right front slider 1803C, and an inner lateral right rear slider 1803D.
The working time gap range between the upper surface of the chip carrier plate 9 and the lower end of the air tap 31 is 0.1mm-5 mm.
The pressure regulating valve 24, the high-frequency electromagnetic valve 25 and the air tap 31 are communicated with an external air source, and the air pressure is 0.1-3 MPa.
The carrier 901 is one of glass, sapphire, silicon and silicon carbide materials with good rigidity and light transmittance, the light transmittance of the carrier is larger than 88%, and the carrier has array through holes with the cross section geometric dimension of 5 micrometers multiplied by 5 micrometers-500 micrometers multiplied by 500 micrometers.
The elastic membrane 902 is one of PDMS, TPE, TPEE, TPU, TPR, and TPV materials having excellent restorable deformation ability.
The principle of the scheme is as follows:
as shown in figure 1, a Mini/Micro LED chip pneumatic huge transfer device adopts a high-precision motor, a guide rail slide block and a grating ruler to realize the position alignment work, utilizes a pressure regulating valve, a high-frequency electromagnetic valve and a gas nozzle to realize the chip transfer, when the chip is aligned with the target position, the high-frequency electromagnetic valve receives the communication signal to enable the air nozzle to be communicated with an external air source, the air nozzle blows out high-pressure air to enable the elastic layer and the bonding layer to deform downwards and push the chip adhered to the bonding layer to move downwards, when the lower surface of the bonding layer chip is contacted with the solder paste or the conductive adhesive, the high-frequency electromagnetic valve receives a disconnection signal, so that the air tap is disconnected with an external air source, the air pressure in the through hole is reduced, the elastic layer is upwards restored to the original position, and the chip is peeled off to the target substrate from the bonding layer because the adhesive force of the upper surface of the chip and the bonding layer is smaller than that of the lower surface of the chip and the solder paste or the conductive adhesive, so that the chip is transferred.
Compared with the prior art, the invention has the advantages that:
compared with a fluid self-assembly mode, the invention avoids the need of special structure treatment on the substrate and the chip; compared with the elastic seal mode, the method avoids the need of special structure treatment on the original substrate; compared with a roller transfer printing mode, the high-precision position adjustment of a roller system and a substrate system is avoided; compared with a laser release transfer mode, the pneumatic mode is adopted, so that the defects of high price and unstable thermochemical effect of a laser are overcome, the thermochemical effect is avoided in the transfer process, any special treatment on the substrate and the chip is not needed, and the pneumatic laser release transfer device has the advantages of low cost, reusability, no pollution, no damage, high precision, high efficiency and high yield.
In summary, the pneumatic bulk transfer device for the Mini/Micro LED chips in the embodiment of the invention can be used for ensuring the high efficiency, high precision and good product rate of the bulk transfer of the Mini/Micro LED chips, does not damage the substrate and the chips, does not pollute the working environment, and accords with the safety concept of green production.
In order to more clearly show the technical solutions and the technical effects provided by the present invention, the following detailed description is provided for the embodiments of the present invention with specific embodiments.
Example 1
As shown in fig. 1, a Mini/Micro LED chip pneumatic huge transfer device mainly comprises a chip carrier system, a substrate carrier system and a pneumatic vision system, and is characterized in that the chip carrier system mainly comprises: the device comprises a marble base 1, a left support 2A, a right support 2B, an outer left guide rail 3A, an outer right guide rail 3B, a left linear motor 4A, a right linear motor 4B, a chip linear moving assembly 5, an upper longitudinal grating ruler 6, an upper longitudinal grating ruler reading head 7, a chip rotation adjusting assembly 8 and a chip support plate 9; the substrate stage system mainly includes: the device comprises a lower longitudinal grating ruler 10, a lower longitudinal grating ruler reading head 11, an inner longitudinal left guide rail 12A, an inner longitudinal right guide rail 12B, an inner longitudinal motor stator 13, an inner longitudinal motor rotor 14, a substrate longitudinal moving assembly 15, a lower transverse grating ruler 16, a lower transverse grating ruler reading head 17 and a substrate transverse moving assembly 18; the pneumatic visual system mainly comprises: the device comprises a support beam 19, an upper outer guide rail 20A, an upper inner guide rail 20B, an upper linear motor 21, an upper transverse moving assembly 22, a ball screw module 23, a pressure regulating valve 24, a high-frequency electromagnetic valve 25, an upper transverse grating ruler reading head 26, an upper transverse grating ruler 27, a fixing seat bottom plate 28, a left fixing seat 29A, a right fixing seat 29B, an industrial CCD camera 30 and an air nozzle 31. The marble base 1 is positioned below a left support 2A, a right support 2B, an outer left guide rail 3A and an outer right guide rail 3B, the left support 2A and the right support 2B are respectively positioned at the left side and the right side of the upper surface of the marble base 1 and are installed on the marble base 1 through fastening screws, the outer left guide rail 3A is positioned at the right side of the upper surface of the left support 2A and is installed on the left support 2A through fastening screws, the outer right guide rail 3B is positioned at the left side of the upper surface of the right support 2B and is installed on the right support 2B through fastening screws, a left linear motor 4A and a right linear motor 4B are respectively positioned above the left side of the outer left guide rail 3A and above the right side of the outer right guide rail 3B, a left linear motor 4A and a right linear motor 4B are respectively positioned at the left side of the upper surface of the left support 2A and the right side of the upper surface of the right support 2B and are respectively installed on the left support 2A and the right support 2B through fastening screws, the chip linear moving assembly 5 is positioned above the marble base 1, the left support 2A, the right support 2B, the outer left guide rail 3A and the outer right guide rail 3B, the chip linear moving assembly 5 is positioned on the right side of the left linear motor 4A and the left side of the right linear motor 4B, and is clamped on the outer left guide rail 3A and the outer right guide rail 3B through a sliding block at the bottom of the chip linear moving assembly 5, the chip linear moving assembly 5 is connected with a rotor of the left linear motor 4A and a rotor of the right linear motor 4B through fastening screws, the upper longitudinal grating ruler 6 is positioned on the upper side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, the upper longitudinal grating ruler reading head 7 is positioned on the left side of the front surface of the chip linear moving assembly 5, the upper longitudinal grating ruler reading head 7 is positioned on the right side of the upper longitudinal grating ruler 6 and is installed on the chip linear moving assembly 5 through the fastening screws, the chip rotation adjusting assembly 8 is positioned in the center of the upper surface of the linear moving assembly 5, and are connected with a bearing through a gear rack, a chip carrier plate 9 is positioned above the marble base 1, the chip carrier plate 9 is positioned at the right side of a left support 2A and the left side of a right support 2B, the chip carrier plate 9 is positioned below a chip rotation adjusting component 8 and is adsorbed and fixed through a sucker of the chip rotation adjusting component 8, a lower longitudinal grating ruler 10 is positioned at the lower side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, a lower longitudinal grating ruler reading head 11 is positioned at the right side of the left support 2A, a lower longitudinal grating ruler reading head 11 is positioned at the front side of the left surface of a substrate longitudinal moving component 15 and is installed on the substrate longitudinal moving component 15 through fastening screws, an inner longitudinal left guide rail 12A and an inner longitudinal right guide rail 12B are respectively positioned at the left side and the right side of the upper surface of the marble base 1, the inner longitudinal left guide rail 12A and the inner longitudinal right guide rail 12B are respectively positioned at the right side of the left support 2A and the left side of the right support 2B, and is installed on the marble base 1 by fastening screws, the inner longitudinal motor stator 13 is located on the central line of the upper surface of the marble base 1, the inner longitudinal motor stator 13 is located on the right side of the inner longitudinal left guide rail 12A and the left side of the inner longitudinal right guide rail 12B, and is installed on the marble base 1 by fastening screws, the inner longitudinal motor mover 14 is located right above the inner longitudinal motor stator 13, the inner longitudinal motor mover 14 is located right below the substrate longitudinal moving assembly 15 and is installed on the substrate longitudinal moving assembly 15 by fastening screws, the substrate longitudinal moving assembly 15 is located right side of the left support 2A and left side of the right support 2B, the substrate longitudinal moving assembly 15 is located above the inner longitudinal left guide rail 12A, the inner longitudinal right guide rail 12B, the inner longitudinal motor stator 13 and the inner longitudinal motor mover 14, the substrate longitudinal moving assembly 15 is located below the chip linear moving assembly 5, the chip rotation adjusting assembly 8 and the chip carrier plate 9, a sliding block at the bottom of a substrate longitudinal moving component 15 is clamped on an inner longitudinal left guide rail 12A and an inner longitudinal right guide rail 12B, a lower transverse grating ruler 16 is positioned on the front surface of the substrate longitudinal moving component 15 and is adhered on the substrate longitudinal moving component 15 through epoxy resin glue, a lower transverse grating ruler reading head 17 is positioned on the right side of the front surface of a substrate transverse moving component 18 and is installed on a substrate transverse moving component 18 through fastening screws, the substrate transverse moving component 18 is positioned on the right side of a left support 2A and the left side of a right support 2B, the substrate transverse moving component 18 is positioned above the substrate longitudinal moving component 15, the substrate transverse moving component 18 is positioned below a chip linear moving component 5, a chip rotation adjusting component 8 and a chip carrier plate 9 and is clamped on the substrate longitudinal moving component 15 through the sliding block at the bottom of the substrate transverse moving component 18, and a supporting beam 19 is positioned above a marble base 1, a supporting beam 19 is positioned outside the left and right supports 2A and 2B and is mounted on the marble base 1 by fastening screws, an upper outer guide rail 20A and an upper inner guide rail 20B are positioned on the upper side of the front surface of the supporting beam 19 and are mounted on the supporting beam 19 by fastening screws, an upper outer guide rail 20A is positioned above the upper inner guide rail 20B, an upper linear motor 21 is positioned on the upper surface of the supporting beam 19 and is mounted on the supporting beam 19 by fastening screws, an upper traverse assembly 22 is positioned above the chip traverse assembly 5 and the chip rotation adjusting assembly 8, an upper traverse assembly 22 is positioned on the front side of the supporting beam 19 and is clamped on the upper outer guide rail 20A and the upper inner guide rail 20B by a slider at the bottom of the upper traverse assembly 22, a ball screw module 23 is positioned on the front surface of the upper traverse assembly 22 and is mounted on the upper traverse assembly 22 by fastening screws, a pressure regulating valve 24 and a high frequency solenoid valve 25 are positioned on the upper right side of the front surface of the upper traverse assembly 22, the pressure regulating valve 24 is positioned above the high-frequency electromagnetic valve 25, the upper transverse grating ruler reading head 26 is positioned on the upper side of the right surface of the upper transverse moving assembly 22 and is arranged on the upper transverse moving assembly 22 through a fastening screw, the upper transverse grating ruler 27 is positioned on the upper side of the front surface of the supporting beam 19, the upper transverse grating ruler 27 is positioned on the upper side of the upper outer guide rail 20A, the upper transverse grating ruler 27 is positioned on the rear side of the upper transverse moving assembly 22 and the upper transverse grating ruler reading head 26 and is glued on the supporting beam 19 through epoxy resin, the fixing seat bottom plate 28 is positioned on the front side of the ball screw module 23 and is arranged on the ball screw module 23 through a fastening screw, the left fixing seat 29A and the right fixing seat 29B are respectively positioned on the left side of the front surface of the fixing seat bottom plate 28 and on the fixing seat bottom plate 28 through a fastening screw, the industrial CCD camera 30 and the air nozzle 31 are respectively positioned in a clamping groove in the middle part of the left fixing seat 29A and the right fixing seat 29B, and are respectively arranged on the left fixed seat 29A and the right fixed seat 29B through fastening screws
As shown in fig. 2, which is a schematic three-dimensional structure diagram of a chip carrier system according to an embodiment of the present invention, the chip carrier system mainly includes: the device comprises a marble base 1, a left support 2A, a right support 2B, an outer left guide rail 3A, an outer right guide rail 3B, a left linear motor 4A, a right linear motor 4B, a chip linear moving assembly 5, an upper longitudinal grating ruler 6, an upper longitudinal grating ruler reading head 7, a chip rotation adjusting assembly 8 and a chip support plate 9; the marble base 1 is positioned below a left support 2A, a right support 2B, an outer left guide rail 3A and an outer right guide rail 3B, the left support 2A and the right support 2B are respectively positioned at the left side and the right side of the upper surface of the marble base 1 and are installed on the marble base 1 through fastening screws, the outer left guide rail 3A is positioned at the right side of the upper surface of the left support 2A and is installed on the left support 2A through fastening screws, the outer right guide rail 3B is positioned at the left side of the upper surface of the right support 2B and is installed on the right support 2B through fastening screws, a left linear motor 4A and a right linear motor 4B are respectively positioned above the left side of the outer left guide rail 3A and above the right side of the outer right guide rail 3B, a left linear motor 4A and a right linear motor 4B are respectively positioned at the left side of the upper surface of the left support 2A and the right side of the upper surface of the right support 2B and are respectively installed on the left support 2A and the right support 2B through fastening screws, the chip linear moving assembly 5 is positioned above the marble base 1, the left support 2A, the right support 2B, the outer left guide rail 3A and the outer right guide rail 3B, the chip linear moving assembly 5 is positioned on the right side of the left linear motor 4A and the left side of the right linear motor 4B, and is clamped on the outer left guide rail 3A and the outer right guide rail 3B through a sliding block at the bottom of the chip linear moving assembly 5, the chip linear moving assembly 5 is connected with a rotor of the left linear motor 4A and a rotor of the right linear motor 4B through fastening screws, the upper longitudinal grating ruler 6 is positioned on the upper side of the right surface of the left support 2A and is glued on the left support 2A through epoxy resin, the upper longitudinal grating ruler reading head 7 is positioned on the left side of the front surface of the chip linear moving assembly 5, the upper longitudinal grating ruler reading head 7 is positioned on the right side of the upper longitudinal grating ruler 6 and is installed on the chip linear moving assembly 5 through the fastening screws, the chip rotation adjusting assembly 8 is positioned in the center of the upper surface of the linear moving assembly 5, and is connected with the bearing through the rack and pinion, and chip carrier plate 9 is located marble base 1 top, and chip carrier plate 9 is located left support 2A right side and right support 2B left side, and chip carrier plate 9 is located chip rotation adjusting component 8 below to adsorb fixedly through the sucking disc of chip rotation adjusting component 8.
As shown in fig. 3, which is a schematic three-dimensional structure diagram of a substrate stage system according to an embodiment of the present invention, the substrate stage system mainly includes: the device comprises a lower longitudinal grating ruler 10, a lower longitudinal grating ruler reading head 11, an inner longitudinal left guide rail 12A, an inner longitudinal right guide rail 12B, an inner longitudinal motor stator 13, an inner longitudinal motor rotor 14, a substrate longitudinal moving assembly 15, a lower transverse grating ruler 16, a lower transverse grating ruler reading head 17 and a substrate transverse moving assembly 18; the lower longitudinal grating ruler 10 is positioned at the left side of the lower longitudinal grating ruler reading head 11 and the substrate longitudinal moving assembly 15, the lower longitudinal grating ruler 10 is positioned at the left upper part of the inner longitudinal left guide rail 12A, the lower longitudinal grating ruler reading head 11 is positioned at the right side of the lower longitudinal grating ruler 10, the lower longitudinal grating ruler reading head 11 is positioned at the front side of the left surface of the substrate longitudinal moving assembly 15 and is installed on the substrate longitudinal moving assembly 15 through fastening screws, the inner longitudinal left guide rail 12A and the inner longitudinal right guide rail 12B are respectively positioned at the left side and the right side of the inner longitudinal motor stator 13, the inner longitudinal left guide rail 12A and the inner longitudinal right guide rail 12B are respectively positioned at the left side and the right side of the lower surface of the substrate longitudinal moving assembly 15, the inner longitudinal motor stator 13 is positioned at the right side of the inner longitudinal left guide rail 12A and the left side of the inner longitudinal right guide rail 12B, the inner longitudinal motor mover 14 is positioned right above the inner longitudinal motor stator 13, the inner longitudinal motor mover 14 is positioned right below the substrate longitudinal moving assembly 15, and is mounted on a base plate longitudinal moving assembly 15 through fastening screws, the base plate longitudinal moving assembly 15 is positioned above the inner longitudinal left guide rail 12A, the inner longitudinal right guide rail 12B, the inner longitudinal motor stator 13 and the inner longitudinal motor mover 14, and is clamped on the inner longitudinal left guide rail 12A and the inner longitudinal right guide rail 12B through a slide block at the bottom of the substrate longitudinal moving assembly 15, the lower transverse grating ruler 16 is positioned on the front surface of the substrate longitudinal moving assembly 15, and is adhered on the substrate longitudinal moving component 15 by epoxy resin glue, the lower transverse grating ruler reading head 17 is positioned at the right side of the front surface of the substrate transverse moving component 18, and is mounted on a base plate transverse moving component 18 through fastening screws, the base plate transverse moving component 18 is positioned above the inner longitudinal left guide rail 12A, the inner longitudinal right guide rail 12B, the inner longitudinal motor stator 13 and the base plate longitudinal moving component 15, and is caught on the base plate longitudinal moving assembly 15 by a slider at the bottom of the base plate lateral moving assembly 18.
As shown in fig. 4, which is a schematic three-dimensional structure diagram of the pneumatic vision system according to the embodiment of the present invention, the pneumatic vision system mainly includes: the device comprises a support beam 19, an upper outer guide rail 20A, an upper inner guide rail 20B, an upper linear motor 21, an upper transverse moving assembly 22, a ball screw module 23, a pressure regulating valve 24, a high-frequency electromagnetic valve 25, an upper transverse grating ruler reading head 26, an upper transverse grating ruler 27, a fixing seat bottom plate 28, a left fixing seat 29A, a right fixing seat 29B, an industrial CCD camera 30 and an air nozzle 31; a support beam 19 is positioned at the rear side of an upper outer guide rail 20A, an upper inner guide rail 20B and an upper traverse assembly 22, the support beam 19 is positioned at the lower side of an upper linear motor 21, the upper outer guide rail 20A and the upper inner guide rail 20B are positioned at the upper side of the front surface of the support beam 19 and are mounted on the support beam 19 by fastening screws, the upper outer guide rail 20A is positioned above the upper inner guide rail 20B, the upper linear motor 21 is positioned at the upper surface of the support beam 19 and is mounted on the support beam 19 by fastening screws, the upper traverse assembly 22 is positioned at the front side of the support beam 19, the upper outer guide rail 20A, the upper inner guide rail 20B and the upper linear motor 21 and is clamped on the upper outer guide rail 20A and the upper inner guide rail 20B by a slider at the bottom of the upper traverse assembly 22, a ball screw module 23 is positioned at the front surface of the upper traverse assembly 22 and is mounted on the upper traverse assembly 22 by fastening screws, a pressure regulating valve 24 and a high frequency solenoid valve 25 are positioned at the upper right side of the front surface of the upper traverse assembly 22, the pressure regulating valve 24 is positioned above the high-frequency electromagnetic valve 25, the upper transverse grating ruler reading head 26 is positioned on the upper side of the right surface of the upper transverse moving assembly 22 and is arranged on the upper transverse moving assembly 22 through a fastening screw, the upper transverse grating ruler 27 is positioned on the upper side of the front surface of the supporting beam 19, the upper transverse grating ruler 27 is positioned on the upper side of the upper outer guide rail 20A, the upper transverse grating ruler 27 is positioned on the rear side of the upper transverse moving assembly 22 and the upper transverse grating ruler reading head 26 and is glued on the supporting beam 19 through epoxy resin, the fixing seat bottom plate 28 is positioned on the front side of the ball screw module 23 and is arranged on the ball screw module 23 through a fastening screw, the left fixing seat 29A and the right fixing seat 29B are respectively positioned on the left side of the front surface of the fixing seat bottom plate 28 and on the fixing seat bottom plate 28 through a fastening screw, the industrial CCD camera 30 and the air nozzle 31 are respectively positioned in a clamping groove in the middle part of the left fixing seat 29A and the right fixing seat 29B, and are respectively mounted on the left and right holders 29A and 29B by fastening screws.
Fig. 5a is a schematic three-dimensional top view structure diagram of the chip linear motion assembly 5 according to the embodiment of the present invention, and fig. 5b is a schematic three-dimensional bottom view structure diagram of the chip linear motion assembly 5 according to the embodiment of the present invention, in which the chip linear motion assembly 5 mainly includes: a chip linear movement bottom plate 501, a rotating motor 502, a gear 503, a bearing 504, a chip linear movement left front slider 505A, a chip linear movement left rear slider 505B, a chip linear movement right front slider 505C and a chip linear movement right rear slider 505D; the chip linear moving bottom plate 501 is positioned above a rotary motor 502, a chip linear moving left front slide block 505A, a chip linear moving left rear slide block 505B, a chip linear moving right front slide block 505C and a chip linear moving right rear slide block 505D, the rotary motor 502 is positioned below the left side of a hollow area in the middle of the chip linear moving bottom plate 501, the rotary motor 502 is positioned at the right side of the chip linear moving left front slide block 505A and the chip linear moving left rear slide block 505B, the rotary motor 502 is positioned at the left side of the chip linear moving right front slide block 505C and the chip linear moving right rear slide block 505D and is installed on the chip linear moving bottom plate 501 through a fastening screw, a gear 503 is positioned above the chip linear moving bottom plate 501 and the rotary motor 502 and is installed on a rotating shaft of the rotary motor 502 through a key groove and a key, a bearing 504 is positioned in a counter bore at the right side of the hollow area in the middle of the chip linear moving bottom plate 501, the chip straight-line movement left front slider 505A, the chip straight-line movement left rear slider 505B, the chip straight-line movement right front slider 505C and the chip straight-line movement right rear slider 505D are respectively positioned in the left front, left rear, right front and right rear of the lower surface of the chip straight-line movement bottom plate 501, and are mounted on the chip straight-line movement bottom plate 501 by fastening screws.
Fig. 6 is a schematic three-dimensional top view structure diagram of the chip rotation adjustment assembly 8 according to the embodiment of the present invention, wherein the chip rotation adjustment assembly 8 mainly includes: a chip rotation adjusting bottom plate 801, a rack 802, a left front suction cup 803A, a left rear suction cup 803B, a right front suction cup 803C and a right rear suction cup 803D; the chip rotation adjusting bottom plate 801 is located on the right side of the rack 802, the chip rotation adjusting bottom plate 801 is located on the outer sides of the left front sucker 803A, the left rear sucker 803B, the right front sucker 803C and the right rear sucker 803D, the rack 802 is located in the middle of the left surface of the chip rotation adjusting bottom plate 801 and is mounted on the chip rotation adjusting bottom plate 801 through fastening screws, and the left front sucker 803A, the left rear sucker 803B, the right front sucker 803C and the right rear sucker 803D are located in the left front, the left rear, the right front and the right rear of a hollow area in the middle of the chip rotation adjusting bottom plate 801 respectively and are mounted on the chip rotation adjusting bottom plate 801 through fastening screws.
Fig. 7 is a schematic structural diagram of a chip carrier 9 according to an embodiment of the present invention, where the chip carrier 9 mainly includes: the carrier plate 901 is positioned above the elastic film 902 and the viscous layer 903, the elastic film 902 is positioned below the carrier plate 901 and above the viscous layer 903, the viscous layer 903 is positioned below the carrier plate 901 and below the elastic film 902, the carrier plate 901 is one of glass, sapphire, silicon and silicon carbide materials with good rigidity and light transmittance, the light transmittance of the carrier plate is larger than 88%, the carrier plate has array through holes with the cross-sectional geometric dimension of 5μm multiplied by 5μm to 500μm multiplied by 500μm, the elastic film 902 is one of PDMS, recoverable, TPEE, TPU, TPR and TPV materials with good deformation capability, the viscous layer 903 adopts one of organic silicon adhesive, epoxy resin adhesive and polyurethane adhesive, and the viscous force of the viscous layer to a chip is smaller than that of tin paste or conductive adhesive to the chip.
Fig. 8a is a schematic three-dimensional top view structure diagram of the substrate longitudinal moving assembly 15 according to the embodiment of the present invention, and fig. 8b is a schematic three-dimensional bottom view structure diagram of the substrate longitudinal moving assembly 15 according to the embodiment of the present invention, in which the substrate longitudinal moving assembly 15 mainly includes: a base plate longitudinal movement bottom plate 1501, an inner transverse motor stator 1502, an inner transverse front rail 1503A, an inner transverse rear rail 1503B, an inner longitudinal left front slider 1504A, an inner longitudinal left rear slider 1504B, an inner longitudinal right front slider 1504C, and an inner longitudinal right rear slider 1504D; the substrate longitudinal movement bottom plate 1501 is located below an inner lateral motor stator 1502, an inner lateral front rail 1503A and an inner lateral rear rail 1503B, the substrate longitudinal movement bottom plate 1501 is located above an inner longitudinal left front slider 1504A, an inner longitudinal left rear slider 1504B, an inner longitudinal right front slider 1504C and an inner longitudinal right rear slider 1504D, the inner lateral motor stator 1502 is located above the substrate longitudinal movement bottom plate 1501, the inner lateral motor stator 1502 is located intermediate the inner lateral front rail 1503A and the inner lateral rear rail 1503B and is mounted on the substrate longitudinal movement bottom plate 1501 by fastening screws, the inner lateral front rail 1503A and the inner lateral rear rail 1503B are located respectively on the front side and the rear side of the upper surface of the substrate longitudinal movement bottom plate 1501 and are mounted on the substrate longitudinal movement bottom plate 1501 by fastening screws, the inner longitudinal left front slider A, the inner longitudinal left rear slider 1504B, the inner longitudinal right front slider 1504C and the inner longitudinal right rear slider 1504D are located respectively on the front left, front, rear, left front, right front, and rear of the lower surface of the substrate longitudinal movement bottom plate 1501, Left rear, right front and right rear, and is mounted on the base plate longitudinal movement bottom plate 1501 by fastening screws.
Fig. 9 is a schematic diagram of a three-dimensional bottom view structure of a substrate transverse moving assembly 18 according to an embodiment of the present invention, where the substrate transverse moving assembly 18 mainly includes a substrate transverse moving base plate 1801, an inner transverse motor mover 1802, an inner transverse left front slider 1803A, an inner transverse left rear slider 1803B, an inner transverse right front slider 1803C, and an inner transverse right rear slider 1803D; a substrate lateral motion base plate 1801 is positioned above an inner lateral motor mover 1802, an inner lateral left front slider 1803A, an inner lateral left rear slider 1803B, an inner lateral right front slider 1803C and an inner lateral right rear slider 1803D, the inner lateral motor mover 1802 is positioned in the middle of the lower surface of the substrate lateral motion base plate 1801, the inner lateral motor mover 1802 is positioned behind the inner lateral left front slider 1803A and the inner lateral right front slider 1803C, the inner lateral motor mover 1802 is positioned in front of the inner lateral left rear slider 1803B and the inner lateral right rear slider 1803D, and is mounted on the substrate lateral movement bottom plate 1801 by fastening screws, and the inner lateral left front slider 1803A, the inner lateral left rear slider 1803B, the inner lateral right front slider 1803C and the inner lateral right rear slider 1803D are respectively positioned at the left front, the left rear, the right front and the right rear of the lower surface of the substrate lateral movement bottom plate 1801 and are mounted on the substrate lateral movement bottom plate 1801 by fastening screws.
Fig. 10 is a schematic three-dimensional rear view of the upper transverse moving assembly 22 according to the embodiment of the present invention, wherein the upper transverse moving assembly 22 mainly includes: an upper lateral movement floor 2201, a left upper slide 2202A, a right upper slide 2202B, a left lower slide 2202C, and a right lower slide 2202D; the upper lateral movement base plate 2201 is located at the rear side of the upper left slider 2202A, the upper right slider 2202B, the lower left slider 2202C, and the lower right slider 2202D, and the upper left slider 2202A, the upper right slider 2202B, the lower left slider 2202C, and the lower right slider 2202D are located at the upper left, upper right, lower left, and lower right of the upper front surface of the upper lateral movement base plate 2201, respectively, and are mounted on the upper lateral movement base plate 2201 by fastening screws.
Fig. 11 is a schematic diagram illustrating relative positions of a chip carrier 9 and a chip 32 according to an embodiment of the invention; the die 32 is located under the carrier 901, the elastic film 902 and the adhesive layer 903, and is adhered to the lower surface of the adhesive layer 903 by the adhesion of the adhesive layer 903, the length and width of the die 32 are larger than the size of the through holes of the carrier 901, and preferably, more than 3 through holes correspond to one die 32.
Fig. 12a is a schematic diagram of a relative position of the air faucet 31 and the chip carrier 9 during operation according to an embodiment of the present invention, and fig. 12b is a schematic diagram of a transfer principle according to an embodiment of the present invention, during operation, when the ball screw module 23 operates to drive the fixing base bottom plate 28, the industrial CCD camera 30 and the air faucet 31 to move downward to a specified position, the operation of the ball screw module 23 stops, a gap exists between a lower end of the air faucet 31 and an upper surface of the chip carrier 9, the range of the gap is 0.1mm-5mm, at this time, the high-frequency electromagnetic valve 25 receives a conducting signal, the air faucet 31 is connected to an external air source, high-pressure air is blown out, so that the elastic film 902 forms a convex deformation downward, the lower surface of the chip 32 adhered to the adhesive layer 903 contacts the solder paste or the conductive adhesive 332 on the target substrate 331, the high-frequency electromagnetic valve 25 receives a disconnection signal, the air faucet 31 is disconnected from the external air source, the elastic film 902 recovers upward, because a bonding force between the upper surface of the chip 32 and the adhesive layer 903 is smaller than a bonding force between the upper surface of the chip 32 and the solder paste or the conductive adhesive paste 332, the chip 32 is peeled off to the target substrate 331, completing the transfer. In addition, according to the elasticity of the elastic membrane 902 and the gap between the chip 32 and the solder paste or the conductive adhesive 332, the deformation amount of the elastic membrane 902 is controlled by adjusting the pressure of the introduced external air source by the pressure adjusting valve 24, so as to achieve better transferring effect.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known to a person skilled in the art.

Claims (10)

1. The utility model provides a pneumatic huge transfer device of Mini/Micro LED chip, mainly comprises chip microscope carrier system, base plate microscope carrier system and pneumatic vision system, and its characterized in that, chip microscope carrier system mainly includes: the device comprises a marble base (1), a left support (2A), a right support (2B), an outer left guide rail (3A), an outer right guide rail (3B), a left linear motor (4A), a right linear motor (4B), a chip linear moving assembly (5), an upper longitudinal grating ruler (6), an upper longitudinal grating ruler reading head (7), a chip rotation adjusting assembly (8) and a chip support plate (9); the substrate stage system mainly includes: the device comprises a lower longitudinal grating ruler (10), a lower longitudinal grating ruler reading head (11), an inner longitudinal left guide rail (12A), an inner longitudinal right guide rail (12B), an inner longitudinal motor stator (13), an inner longitudinal motor rotor (14), a substrate longitudinal moving assembly (15), a lower transverse grating ruler (16), a lower transverse grating ruler reading head (17) and a substrate transverse moving assembly (18); the pneumatic visual system mainly comprises: the device comprises a support beam (19), an upper outer guide rail (20A), an upper inner guide rail (20B), an upper linear motor (21), an upper transverse moving assembly (22), a ball screw module (23), a pressure regulating valve (24), a high-frequency electromagnetic valve (25), an upper transverse grating ruler reading head (26), an upper transverse grating ruler (27), a fixing seat bottom plate (28), a left fixing seat (29A), a right fixing seat (29B), an industrial CCD camera (30) and an air faucet (31). The marble base (1) is positioned below a left support (2A), a right support (2B), an outer left guide rail (3A) and an outer right guide rail (3B), the left support (2A) and the right support (2B) are respectively positioned at the left side and the right side of the upper surface of the marble base (1) and are installed on the marble base (1) through fastening screws, the outer left guide rail (3A) is positioned at the right side of the upper surface of the left support (2A) and is installed on the left support (2A) through fastening screws, the outer right guide rail (3B) is positioned at the left side of the upper surface of the right support (2B) and is installed on the right support (2B) through fastening screws, a left linear motor (4A) and a right linear motor (4B) are respectively positioned above the left side of the outer left guide rail (3A) and above the right side of the outer right guide rail (3B), the left linear motor (4A) and the right linear motor (4B) are respectively positioned at the left side of the upper surface of the left support (2A) and the right side of the upper surface of the right support (2B), the device is respectively arranged on a left support (2A) and a right support (2B) through fastening screws, a chip linear moving assembly (5) is positioned above a marble base (1), the left support (2A), the right support (2B), an outer left guide rail (3A) and an outer right guide rail (3B), the chip linear moving assembly (5) is positioned on the right side of a left linear motor (4A) and the left side of a right linear motor (4B) and is clamped on the outer left guide rail (3A) and the outer right guide rail (3B) through a sliding block at the bottom of the chip linear moving assembly (5), the chip linear moving assembly (5) is connected with a rotor of the left linear motor (4A) and a rotor of the right linear motor (4B) through the fastening screws, an upper longitudinal grating ruler (6) is positioned on the upper side of the right surface of the left support (2A) and is adhered to the left support (2A) through epoxy resin adhesive, and a reading head (7) is positioned on the left side of the front surface of the chip linear moving assembly (5), an upper longitudinal grating ruler reading head (7) is positioned at the right side of an upper longitudinal grating ruler (6) and is arranged on a chip linear moving assembly (5) through a fastening screw, a chip rotary adjusting assembly (8) is positioned at the center of the upper surface of the linear moving assembly (5) and is connected with a bearing through a gear rack, a chip carrier plate (9) is positioned above a marble base (1), the chip carrier plate (9) is positioned at the right side of a left support (2A) and the left side of a right support (2B), the chip carrier plate (9) is positioned below the chip rotary adjusting assembly (8) and is adsorbed and fixed through a sucker of the chip rotary adjusting assembly (8), a lower longitudinal grating ruler (10) is positioned at the lower side of the right surface of the left support (2A) and is adhered to the left support (2A) through epoxy resin adhesive, a lower longitudinal grating ruler reading head (11) is positioned at the right side of the left support (2A), and a lower longitudinal grating ruler reading head (11) is positioned at the front side of the left surface of a substrate longitudinal moving assembly (15), the marble base is arranged on the marble base (1) through fastening screws, an inner longitudinal left guide rail (12A) and an inner longitudinal right guide rail (12B) are respectively positioned at the left side and the right side of the upper surface of the marble base (1), the inner longitudinal left guide rail (12A) and the inner longitudinal right guide rail (12B) are respectively positioned at the right side of a left support (2A) and the left side of a right support (2B) and are arranged on the marble base (1) through the fastening screws, an inner longitudinal motor stator (13) is positioned on the central line of the upper surface of the marble base (1), the inner longitudinal motor stator (13) is positioned at the right side of the inner longitudinal left guide rail (12A) and the left side of the inner longitudinal right guide rail (12B) and is arranged on the marble base (1) through the fastening screws, an inner longitudinal motor rotor (14) is positioned right above the inner longitudinal motor stator (13), the inner longitudinal motor rotor (14) is positioned right below the base longitudinal moving assembly (15), the device is arranged on a substrate longitudinal moving assembly (15) through fastening screws, the substrate longitudinal moving assembly (15) is positioned on the right side of a left support (2A) and the left side of a right support (2B), the substrate longitudinal moving assembly (15) is positioned above an inner longitudinal left guide rail (12A), an inner longitudinal right guide rail (12B), an inner longitudinal motor stator (13) and an inner longitudinal motor rotor (14), the substrate longitudinal moving assembly (15) is positioned below a chip linear moving assembly (5), a chip rotation adjusting assembly (8) and a chip carrier plate (9), and is clamped on the inner longitudinal left guide rail (12A) and the inner longitudinal right guide rail (12B) through a sliding block at the bottom of the substrate longitudinal moving assembly (15), a lower transverse grating ruler (16) is positioned on the front surface of the substrate longitudinal moving assembly (15) and is adhered on the substrate longitudinal moving assembly (15) through epoxy resin adhesive, and a reading head (17) of the lower transverse grating ruler is positioned on the right side of the front surface of the substrate transverse moving assembly (18), the device is arranged on a substrate transverse moving component (18) through fastening screws, the substrate transverse moving component (18) is positioned on the right side of a left support (2A) and the left side of a right support (2B), the substrate transverse moving component (18) is positioned above a substrate longitudinal moving component (15), the substrate transverse moving component (18) is positioned below a chip linear moving component (5), a chip rotation adjusting component (8) and a chip carrier plate (9) and clamped on the substrate longitudinal moving component (15) through a sliding block at the bottom of the substrate transverse moving component (18), a supporting beam (19) is positioned above a marble base (1), the supporting beam (19) is positioned on the outer sides of the left support (2A) and the right support (2B) and is arranged on the marble base (1) through the fastening screws, an upper outer guide rail (20A) and an upper inner guide rail (20B) are positioned on the upper side of the front surface of the supporting beam (19), and is mounted on a support beam (19) by fastening screws, an upper outer guide rail (20A) is positioned above an upper inner guide rail (20B), an upper linear motor (21) is positioned on the upper surface of the support beam (19) and is mounted on the support beam (19) by fastening screws, an upper transverse moving assembly (22) is positioned above a chip linear moving assembly (5) and a chip rotation adjusting assembly (8), the upper transverse moving assembly (22) is positioned on the front side of the support beam (19) and is clamped on the upper outer guide rail (20A) and the upper inner guide rail (20B) by a sliding block at the bottom of the upper transverse moving assembly (22), a ball screw module (23) is positioned on the front surface of the upper transverse moving assembly (22) and is mounted on the upper transverse moving assembly (22) by fastening screws, a pressure regulating valve (24) and a high-frequency electromagnetic valve (25) are positioned on the upper right upper side of the front surface of the upper transverse moving assembly (22) and are mounted on the upper transverse moving assembly (22) by fastening screws, the pressure regulating valve (24) is positioned above the high-frequency electromagnetic valve (25), the upper transverse grating ruler reading head (26) is positioned on the upper side of the right surface of the upper transverse moving assembly (22) and is installed on the upper transverse moving assembly (22) through a fastening screw, the upper transverse grating ruler (27) is positioned on the upper side of the front surface of the supporting beam (19), the upper transverse grating ruler (27) is positioned on the upper side of the upper outer guide rail (20A), the upper transverse grating ruler (27) is positioned on the rear side of the upper transverse moving assembly (22) and the upper transverse grating ruler reading head (26) and is adhered to the supporting beam (19) through epoxy resin glue, the fixing seat bottom plate (28) is positioned on the front side of the ball screw module (23) and is installed on the ball screw module (23) through a fastening screw, the left fixing seat (29A) and the right fixing seat (29B) are respectively positioned on the left side and the right side of the front surface of the fixing seat bottom plate (28) and are installed on the fixing seat bottom plate (28) through a fastening screw, an industrial CCD camera (30) and an air nozzle (31) are respectively positioned in a clamping groove in the middle of the left fixing seat (29A) and the right fixing seat (29B) and are respectively installed on the left fixing seat (29A) and the right fixing seat (29B) through fastening screws.
2. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the chip linear moving assembly (5) mainly comprises a chip linear moving bottom plate (501), a rotating motor (502), a gear (503), a bearing (504), a chip linear moving left front slide block (505A), a chip linear moving left rear slide block (505B), a chip linear moving right front slide block (505C) and a chip linear moving right rear slide block (505D).
3. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the chip rotation adjusting assembly (8) mainly comprises a chip rotation adjusting bottom plate (801), a rack (802), a left front sucker (803A), a left rear sucker (803B), a right front sucker (803C) and a right rear sucker (803D).
4. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the chip carrier plate (9) mainly comprises a carrier plate (901), an elastic film (902) and an adhesive layer (903).
5. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the substrate longitudinal moving assembly (15) mainly comprises a substrate longitudinal moving bottom plate (1501), an inner transverse motor stator (1502), an inner transverse front guide rail (1503A), an inner transverse rear guide rail (1503B), an inner longitudinal left front slider (1504A), an inner longitudinal left rear slider (1504B), an inner longitudinal right front slider (1504C) and an inner longitudinal right rear slider (1504D).
6. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the substrate transverse moving assembly (18) mainly comprises a substrate transverse moving base plate (1801), an inner transverse motor rotor (1802), an inner transverse left front slider (1803A), an inner transverse left rear slider (1803B), an inner transverse right front slider (1803C) and an inner transverse right rear slider (1803D).
7. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the working time gap range between the upper surface of the chip carrier plate (9) and the lower end of the air nozzle (31) is 0.1mm-5 mm.
8. The Mini/Micro LED chip pneumatic bulk transfer device of claim 1, wherein: the pressure regulating valve (24), the high-frequency electromagnetic valve (25) and the air tap (31) are communicated with an external air source, and the air pressure is 0.1MPa-3 MPa.
9. The Mini/Micro LED chip pneumatic bulk transfer device of claim 4, wherein: the carrier plate (901) is one of glass, sapphire, silicon and silicon carbide materials with good rigidity and light transmittance, the light transmittance of the carrier plate is larger than 88%, and the carrier plate is provided with array through holes with the cross section geometric dimension of 5 micrometers multiplied by 5 micrometers-500 micrometers multiplied by 500 micrometers.
10. The Mini/Micro LED chip pneumatic bulk transfer device of claim 4, wherein: the elastic membrane (902) is one of PDMS, TPE, TPEE, TPU, TPR and TPV materials with excellent recoverable deformability.
CN202210631736.3A 2022-06-06 2022-06-06 Mini/Micro LED chip pneumatic huge transfer device Pending CN115050858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210631736.3A CN115050858A (en) 2022-06-06 2022-06-06 Mini/Micro LED chip pneumatic huge transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210631736.3A CN115050858A (en) 2022-06-06 2022-06-06 Mini/Micro LED chip pneumatic huge transfer device

Publications (1)

Publication Number Publication Date
CN115050858A true CN115050858A (en) 2022-09-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210631736.3A Pending CN115050858A (en) 2022-06-06 2022-06-06 Mini/Micro LED chip pneumatic huge transfer device

Country Status (1)

Country Link
CN (1) CN115050858A (en)

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