CN115045168A - Dual-wavelength laser glue removing device and method - Google Patents
Dual-wavelength laser glue removing device and method Download PDFInfo
- Publication number
- CN115045168A CN115045168A CN202210893812.8A CN202210893812A CN115045168A CN 115045168 A CN115045168 A CN 115045168A CN 202210893812 A CN202210893812 A CN 202210893812A CN 115045168 A CN115045168 A CN 115045168A
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- Prior art keywords
- laser
- dual
- cleaning
- wavelength
- wavelength laser
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 47
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 230000000694 effects Effects 0.000 claims abstract description 4
- 239000013307 optical fiber Substances 0.000 claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims 2
- 229920000715 Mucilage Polymers 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 abstract description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000000809 air pollutant Substances 0.000 description 1
- 231100001243 air pollutant Toxicity 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C23/00—Auxiliary devices or arrangements for constructing, repairing, reconditioning, or taking-up road or like surfaces
- E01C23/06—Devices or arrangements for working the finished surface; Devices for repairing or reconditioning the surface of damaged paving; Recycling in place or on the road
- E01C23/08—Devices or arrangements for working the finished surface; Devices for repairing or reconditioning the surface of damaged paving; Recycling in place or on the road for roughening or patterning; for removing the surface down to a predetermined depth high spots or material bonded to the surface, e.g. markings; for maintaining earth roads, clay courts or like surfaces by means of surface working tools, e.g. scarifiers, levelling blades
- E01C23/085—Devices or arrangements for working the finished surface; Devices for repairing or reconditioning the surface of damaged paving; Recycling in place or on the road for roughening or patterning; for removing the surface down to a predetermined depth high spots or material bonded to the surface, e.g. markings; for maintaining earth roads, clay courts or like surfaces by means of surface working tools, e.g. scarifiers, levelling blades using power-driven tools, e.g. vibratory tools
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- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C9/00—Special pavings; Pavings for special parts of roads or airfields
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01H—STREET CLEANING; CLEANING OF PERMANENT WAYS; CLEANING BEACHES; DISPERSING OR PREVENTING FOG IN GENERAL CLEANING STREET OR RAILWAY FURNITURE OR TUNNEL WALLS
- E01H1/00—Removing undesirable matter from roads or like surfaces, with or without moistening of the surface
- E01H1/10—Hydraulically loosening or dislodging undesirable matter; Raking or scraping apparatus ; Removing liquids or semi-liquids e.g., absorbing water, sliding-off mud
- E01H1/101—Hydraulic loosening or dislodging, combined or not with mechanical loosening or dislodging, e.g. road washing machines with brushes or wipers
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a dual-wavelength laser glue removing device and method, which can realize high-precision and high-efficiency removal of a glue layer of a runway. The device comprises a fiber laser, a laser emitting device, a control system and the like. According to the invention, a dual-wavelength laser output mode is adopted, and rough cleaning laser and fine cleaning laser are utilized to realize high-precision and high-efficiency cleaning effect on the adhesive layer, so that the safety of the airport runway is effectively protected.
Description
Technical Field
The invention relates to the technical field of airfield runway glue removal, in particular to a dual-wavelength laser glue removal device and method.
Background
In the taking-off and landing process of the airplane, rubber particles can fall off due to the friction between the tire and the runway pavement, so that rubber marks are adhered to the runway pavement in the airport. The accumulated rubber marks of the runway rubber can seriously reduce the road surface skid resistance and influence the taking-off and landing safety of the civil aviation passenger plane. In the aspect of traditional cleaning, currently, glue removing equipment adopted in an airport mainly comprises a high-pressure cleaning machine, a ground milling machine, a movable shot blasting machine and a runway rubber burner, wherein the high-pressure cleaning machine mainly realizes cleaning of glue marks on a runway through a high-pressure water gun, and although the high-pressure cleaning machine has the advantages of being clean in cleaning and high in efficiency, the equipment is high in cost and serious in pollution; although the cleaning cost of the ground milling machine and the movable shot blasting machine is low, the damage to the surface of the runway is large, and the efficiency is low; the rubber burner has good cleaning effect and high efficiency, but the rubber burner is easy to damage the surface of the runway and generates more air pollutants; in conclusion, the traditional clearing modes have respective technical advantages, but have the problems of low efficiency, poor quality and easy damage to the runway pavement. The dual-wavelength laser removing method can effectively solve the problems, the laser with the wavelength of 1 is used as the rough cleaning laser, most of the adhesive layer is efficiently cleaned firstly, the laser with the wavelength of 2 is used for realizing fine removal of the adhesive layer, and the road surface cannot be damaged. The mode of utilizing the dual-wavelength laser to realize rough cleaning and fine cleaning of the adhesive layer can efficiently remove adhesive marks on the surface of the runway, and is a brand-new adhesive mark removing mode.
Disclosure of Invention
Aiming at the defects in the prior art, the embodiment of the invention provides a dual-wavelength laser degumming method which can simultaneously meet two cleaning modes, namely a coarse cleaning mode and a fine cleaning mode, can efficiently and highly accurately remove rubber marks on an airport runway under the condition of not damaging the runway, and can ensure the skid resistance of the runway, thereby ensuring the safe taking off and landing of an airplane.
The embodiment of the invention provides a dual-wavelength laser degumming device, which comprises: the system comprises two optical fiber lasers, two laser emission systems and a control system;
the two optical fiber lasers are used for emitting two kinds of lasers with different wavelengths and capable of modulating and stabilizing, two rough cleaning modes and two fine cleaning modes are met, and high-precision and high-efficiency cleaning of glue marks can be achieved according to different cleaning requirements;
the two laser emission systems are used for performing two-dimensional adjustment on laser emitted by the laser;
the two optical fiber lasers are respectively connected with the two laser emission systems through transmission optical fibers;
the control system is mainly used for controlling the work of the two lasers and the two laser emitting systems;
preferably, the two lasers are both optical fiber lasers, and have the advantages of small size, light weight, high power density, long service life, strong adaptability and the like;
optionally, the two fiber lasers may output laser light in the form of continuously modulatable pulses of 0-1000W and 0-2W, and the central wavelengths of the emitted laser light are 1080nm and 1950nm, respectively;
the 1-wavelength laser is rough cleaning laser, and the 2-wavelength laser is fine cleaning laser, so that the high-precision and high-efficiency cleaning effect on the adhesive layer is realized;
optionally, the fiber laser is connected to the laser emission system through a transmission fiber;
optionally, the focal length of the laser emission system of the fiber laser 1 is 200mm, the spot 2 position is adjusted (x axis is less than or equal to 150 mm; y axis is less than or equal to 150mm), the emission angle is +/-15 degrees, and the swing frequency is 1Hz-1000Hz tunable;
optionally, the focal length of the laser emission system of the fiber laser 2 is 400mm, the spot 2 position is adjusted (x axis is less than or equal to 150 mm; y axis is less than or equal to 150mm), the emission angle is +/-15 degrees, and the swing frequency is 1Hz-1000Hz tunable;
preferably, the control system is pad with the size of 10 inches, and the control system comprises the functions of modulating and controlling the laser and the emitting system;
the beneficial effects of the invention include:
the invention provides a runway laser glue removing system which can remove glue marks attached to an airport runway efficiently and accurately by using dual-wavelength laser. The device can output laser in the form of continuously modulated pulses of 0-1000W and 0-200W, and the central wavelengths of the laser emitted by the two lasers are 1080nm and 1950nm respectively. The dual-wavelength laser glue removing method can simultaneously meet two cleaning modes of rough cleaning and fine cleaning, the laser with the wavelength of 1 is used as rough cleaning laser, most of glue layers are cleaned efficiently, and then the laser with the wavelength of 2 is used as fine cleaning laser. The rough cleaning and the fine cleaning are matched with each other to remove the glue, so that the energy utilization rate can be improved, meanwhile, the efficient removal of the glue marks on the airfield runway is realized, and because the laser glue removing process is completely contactless with the pavement, no friction force is generated, the damage of the pavement of the airfield caused by the friction force in the traditional glue removing method is fundamentally avoided, and the safety of the aircraft during taking off and landing is greatly improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. In the drawings:
fig. 1 is a schematic structural view of a dual-wavelength laser glue removing device according to a preferred embodiment of the invention.
Detailed Description
Hereinafter, an embodiment of the urban railway landscape construction promotion simulation presentation system apparatus of the present invention will be described with reference to the accompanying drawings.
The embodiments described herein are specific embodiments of the present invention, and are intended to be illustrative and exemplary of the concepts of the present invention and should not be construed as limiting the scope of the embodiments of the present invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification of the present application, and these technical solutions include technical solutions which make any obvious replacement or modification for the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It is noted that the drawings are not necessarily to the same scale so as to clearly illustrate the structures of the various elements of the embodiments of the invention. Like reference numerals are used to denote like parts.
In order to make the objects, technical solutions and advantages of the present invention more clearly and completely understood, the technical solutions in the embodiments of the present invention are described below with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, an embodiment of the present invention provides a dual-wavelength laser glue removing method capable of simultaneously satisfying two cleaning modes, namely a rough cleaning mode and a fine cleaning mode, where the dual-wavelength laser glue removing apparatus includes two fiber lasers, two laser emission systems, and a control system.
The two optical fiber lasers are used for emitting two kinds of lasers with different wavelengths and capable of being modulated stably, two rough cleaning modes and two fine cleaning modes are met simultaneously, and high-precision and high-efficiency cleaning of glue marks can be achieved according to different cleaning requirements.
The two laser emission systems are used for carrying out two-dimensional adjustment on laser emitted by the laser.
The two optical fiber lasers are respectively connected with the two laser emission systems through transmission optical fibers.
The control system is mainly used for controlling the work of the two lasers and the two laser emission systems.
Preferably, the two lasers are both fiber lasers, and the two lasers have the advantages of small size, light weight, high power density, long service life, strong adaptability and the like.
Referring to fig. 1, in an embodiment of the present invention, a fiber laser 1, a fiber laser 2, a laser emission system 3, a laser emission system 4, and a control system 5 form a dual-wavelength laser glue removing device.
The optical fiber laser 1 and the optical fiber laser 2 are arranged in parallel and used for emitting two kinds of laser with different wavelengths and capable of modulating and stabilizing.
Specifically, the optical fiber laser 1 is used for outputting laser with tunable output power (0-1000W tunable), multimode (M2 is less than 1.5), infrared (center wavelength is 1080nm) and stability superior to 5%, and is used as rough cleaning laser to efficiently clean most of glue layers.
Specifically, the optical fiber laser 2 is used for outputting laser with tunable power (0-200W), tunable frequency (0-20 kHz), single-mode (M2 is less than 1.1) middle infrared (central wavelength is 1950nm) and stability superior to 5%, and the laser is used as fine cleaning laser to perform fine glue layer removal without damaging a substrate.
The laser emission system 3 is connected with the optical fiber laser 1 through a transmission optical fiber and is used for carrying out two-dimensional adjustment on laser emitted by the laser, and the length of the transmission optical fiber is 2 m.
The laser emission system 4 is connected with the optical fiber laser 2 through a transmission optical fiber and is used for carrying out two-dimensional adjustment on laser emitted by the laser, and the length of the transmission optical fiber is 2 m.
Specifically, the focal length of the laser emission system 3 is 200mm, the two-dimensional adjustment of light spots (the x axis is less than or equal to 150mm, the y axis is less than or equal to 150mm), the emission angle is +/-15 degrees, and the swing frequency is 1Hz-1000Hz tunable.
Specifically, the focal length of the laser emission system 4 is 400mm, the light spot dimension is adjusted (the x axis is less than or equal to 150mm, the y axis is less than or equal to 150mm), the emission angle is +/-15 degrees, and the swing frequency is 1Hz-1000Hz tunable.
Specifically, the control system 5 is located outside the overall glue removing device and is used for controlling the work of the dual-wavelength laser glue removing system.
Preferably, the control system is pad, 10 "in size, and includes the modulation and control functions for the laser and the transmission system
The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims (8)
1. A dual wavelength laser removes mucilage binding and puts includes: the system comprises two optical fiber lasers, two laser emitting systems and a control system;
the two optical fiber lasers are used for emitting two kinds of lasers with different wavelengths and capable of modulating and stabilizing, two rough cleaning modes and two fine cleaning modes are met, and high-precision and high-efficiency cleaning of glue marks can be achieved according to different cleaning requirements;
the two laser emission systems are used for carrying out two-dimensional adjustment on laser emitted by the laser;
the two optical fiber lasers are respectively connected with the two laser emission systems through transmission optical fibers;
the control system is mainly used for controlling the work of the two lasers and the two laser emitting systems.
2. The dual-wavelength laser degumming device according to claim 1, wherein said two fiber lasers are capable of outputting 0-1000W and 0-200W continuous laser light, the central wavelengths of the emitted laser light being 1080nm and 1950nm, respectively.
3. The dual-wavelength laser degumming device as claimed in claim 1, wherein the 1080nm wavelength laser is a rough cleaning laser and the 1950nm wavelength laser is a fine cleaning laser, thereby achieving a high precision and high efficiency cleaning effect for the glue layer.
4. The dual-wavelength laser degumming device according to claim 1, wherein said fiber laser is connected with said laser emitting system by a transmission fiber.
5. The apparatus of claim 1, wherein the focal length of the laser emitting system of one of the two fiber lasers is 200mm, the spot is adjusted in two dimensions, and the x-axis is not more than 150 mm; the y axis is less than or equal to 150mm, the emission angle is +/-15 degrees, and the swing frequency is 1Hz-1000Hz tunable.
6. The dual-wavelength laser degumming device according to claim 1, wherein the laser emitting system of the other of said two fiber lasers has a focal length of 400mm and a spot adjusted in two dimensions, wherein the x-axis is less than or equal to 150 mm; the y axis is less than or equal to 150mm, the emission angle is +/-15 degrees, and the swing frequency is 1Hz-1000Hz tunable.
7. The dual-wavelength laser degumming device according to claim 1, wherein said control system is a pad.
8. A dual wavelength laser degumming process, said process being suitable for use in a device according to any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210893812.8A CN115045168A (en) | 2022-07-27 | 2022-07-27 | Dual-wavelength laser glue removing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210893812.8A CN115045168A (en) | 2022-07-27 | 2022-07-27 | Dual-wavelength laser glue removing device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115045168A true CN115045168A (en) | 2022-09-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210893812.8A Pending CN115045168A (en) | 2022-07-27 | 2022-07-27 | Dual-wavelength laser glue removing device and method |
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| Country | Link |
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| CN (1) | CN115045168A (en) |
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| TW563002B (en) * | 1999-11-05 | 2003-11-21 | Asml Netherlands Bv | Lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured by the method |
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| CN216405238U (en) * | 2021-09-06 | 2022-04-29 | 河南广宇场道工程有限公司 | Novel airport runway laser removes glues device |
-
2022
- 2022-07-27 CN CN202210893812.8A patent/CN115045168A/en active Pending
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| TW563002B (en) * | 1999-11-05 | 2003-11-21 | Asml Netherlands Bv | Lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured by the method |
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