CN115044306A - Sensor production method based on high-frequency induction heating - Google Patents
Sensor production method based on high-frequency induction heating Download PDFInfo
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- CN115044306A CN115044306A CN202210979448.7A CN202210979448A CN115044306A CN 115044306 A CN115044306 A CN 115044306A CN 202210979448 A CN202210979448 A CN 202210979448A CN 115044306 A CN115044306 A CN 115044306A
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- strain gauge
- frequency induction
- induction heating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
- G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
- G01G3/14—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of electrical resistance
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Induction Heating (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a sensor production method based on high-frequency induction heating, which belongs to the technical field of sensor manufacturing and comprises the steps of elastomer processing, surface mounting processing, inspection and packaging, wherein the surface mounting processing comprises the following steps; s1, marking; marking a positioning mark on the position of the elastic body needing to be pasted with the patch, and S2 brushing glue; brushing glue on the elastic body and the strain gauge; s3, pasting a strain gauge; aligning the center line of the strain gauge to the mark position on the elastic body, and pasting; s4, mounting a tool clamp; applying pressure to the strain gauge by using a tool clamp; s5, high-frequency heating; and heating and curing the workpiece by using a high-frequency induction heating machine. According to the invention, by utilizing high-frequency heating, procedures such as pre-curing, post-curing and the like are saved, so that the curing time of the paster is greatly shortened, and the production efficiency is greatly improved.
Description
Technical Field
The invention belongs to the technical field of sensor manufacturing, and particularly relates to a sensor production method based on high-frequency induction heating.
Background
At present, the manufacturing method of a common weighing sensor generally comprises the steps of blank forging, machining, heat treatment, surface treatment, pasting of a resistance strain gauge, pressure curing and the like, the working principle of the weighing sensor is that an elastic body is subjected to micro-strain under the action of external force, and then the resistance of a bridge circuit is changed, so that the voltage output is changed, wherein the strain gauge is a key force-sensitive carrier. Therefore, the sticking of the resistance strain gauge is an important step.
The Chinese patent application No. 2007101647589 discloses a method for manufacturing a weighing sensor used in a high-temperature environment, which comprises an elastomer processing technology, a strain bridge processing technology and a surface protection layer processing technology, wherein the elastomer processing technology sequentially comprises the following steps: forging a lower blank, machining, performing heat treatment and performing surface treatment, wherein the machining process of the strain bridge sequentially comprises the following steps of: high-temperature tin soldering, patch bridging, high-temperature curing, high-temperature compensation debugging and high-temperature glue packaging. Compared with the prior art, the manufacturing process of the invention is simple and practical, and the weighing sensor manufactured by the method can work for a long time under the condition of 250 ℃ without changing the performance. However, as in the prior art, when the resistance strain gauge is adhered, the resistance strain gauge is covered with a silicon rubber plate and a metal pressure plate, the pressure is increased to 0.05Mpa to 0.1Mpa and kept constant, the resistance strain gauge is put into an oven for curing, then the temperature is increased from room temperature to 100 ℃ to 120 ℃, the temperature is kept for 2 hours, then the temperature is increased to 180 ℃, the temperature is kept for 3 hours, the pressure is released after the resistance strain gauge is cooled to room temperature along with the oven, and the temperature is increased to 180 ℃ and kept for 2 hours. The defects of the patent and the prior art are that one elastic body is bonded with one strain gauge for curing, the temperature is required to be raised and cured twice, each time is required to be close to 5 hours, a large amount of electric energy is required to be consumed, the production efficiency is low, and the production cost of an enterprise is high.
Disclosure of Invention
In order to solve the problems, the invention provides a sensor production method based on high-frequency induction heating, which comprises the steps of elastomer processing, surface mounting, inspection and packaging, and is characterized in that: the patch processing comprises the following steps;
s1, marking; marking a positioning mark on the position of the elastic body needing to be pasted with the patch;
s2, brushing glue; brushing glue on the elastic body and the strain gauge;
s3, pasting a strain gauge; aligning the central line of the strain gauge to the mark position on the elastic body, and pasting;
s4, mounting a tool clamp; applying pressure to the strain gauge by using a tool clamp;
s5, high-frequency heating; and heating and curing the workpiece by using a high-frequency induction heating machine.
Preferably, a step S31 is provided between the steps S3 and S4, wherein the step S31 is pressing; pressure is applied to the axial position of the strain gauge, causing the air bubble between the strain gauge and the elastomer to squeeze out.
Preferably, the glue applied in step S2 is an epoxy resin glue, and the method for manufacturing the epoxy resin glue includes:
A. mixing bisphenol A epoxy resin, water, a defoaming agent and an anti-settling agent, heating to 50-80 ℃, and uniformly stirring to obtain a component A;
B. mixing trimellitic anhydride, maleic anhydride and a defoaming agent, heating to 50-80 ℃, and uniformly stirring to obtain a component B;
C. and B, mixing the component A and the component B obtained in the step A and the step B to obtain the epoxy resin adhesive.
Preferably, the weight ratio of the component A to the component B is 8: 2.
preferably, the weight ratio of the trimellitic anhydride to the maleic anhydride is 11: 9.
preferably, the component B also comprises an active toughening agent epoxy hydroxyl-terminated polybutadiene acrylonitrile.
Preferably, the component A and the component B in the step C are mixed in a stirring kettle, the temperature is increased to 85 ℃, the vacuum degree is greater than 0.095MPa, the mixture lasts for 30min, and air bubbles are removed by vacuumizing.
Preferably, the component A also contains SiO2 filler.
Preferably, the glue brushed on the elastomer in the step S2 is a primer layer, and the thickness of the primer layer is 0.01-0.03 mm.
Preferably, the area of the bottom glue layer is 1.5 times that of the strain gauge.
The invention has the following beneficial effects;
1. according to the invention, high-frequency heating is utilized, so that the curing efficiency is greatly improved, one patch can be cured within 10 seconds, and one high-frequency heater can be used for replacing a plurality of conventional ovens, so that the energy consumption is saved, the labor is saved, and the production cost of an enterprise is reduced.
2. The adhesive used by the invention has increased elastic modulus through a special process, and can improve the sensitivity of the sensor; meanwhile, the adhesive also has good insulativity, and the phenomena of zero drift and unstable numerical value of the sensor are avoided.
Drawings
FIG. 1 is a flow chart of the steps of the patch processing of the present invention;
FIG. 2 is a graph of specific elastic modulus of different composite curing agents;
FIG. 3 is a graph showing the elastic modulus curves of trimellitic anhydride and maleic anhydride in different proportions.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1
As shown in figure 1, a sensor production method based on high-frequency induction heating comprises elastomer processing treatment, patch treatment, inspection and packaging, wherein the elastomer processing comprises elastomer polishing and cleaning, then patch treatment is carried out, some pretreatment work is required before the patch treatment, the appearance of a strain gauge is inspected, whether a substrate and a cover layer are damaged or not is checked, whether rust spots exist on a sensitive grid or not is checked, whether the sensitive grid is arranged orderly or not, whether gaps and deformation exist or not is checked, then the strain gauge is cleaned, the strain gauge is cleaned by soaking absorbent cotton in absolute ethyl alcohol, dried by an infrared ray or other drying devices after being cleaned, the position where the elastomer is adhered is cleaned after the strain gauge is treated, oil stains and rust spots on the surface of the position are cleaned and dried in time, a primer layer is coated on the position where the elastomer is adhered after a positioning mark is marked on the elastomer, the area of the primer layer is 1.5 times of the area of the strain gauge, the thickness of the primer layer is controlled to be 0.01-0.03mm, the primer layer is properly cured, then adhesive glue is uniformly coated on the surface of the strain gauge, a formal surface mounting stage can be carried out after the adhesive glue is coated, the thickness of the adhesive coating layer on the strain gauge can be controlled to be 0.01-0.02mm, and the thicknesses of the primer on the elastomer and the adhesive on the strain gauge are controlled to be in the thinner range as much as possible, so that the stronger strain transmission capability can be kept, the non-uniformity of the adhesive layer is reduced, and the creep deformation and the sensitivity coefficient dispersion are reduced.
When the strain gauge is pasted, the center line of the strain gauge is aligned to the positioning mark of the elastic body and accurately pasted, a polytetrafluoroethylene film is covered, the strain gauge is rolled for 3-4 times by fingers along the axial direction of the strain gauge, bubbles are exhausted, excessive glue solution is extruded out, the polytetrafluoroethylene film is removed after natural drying for proper time, the end with a no-lead wire is removed, the force is applied to be parallel to the pasting surface as far as possible so as to prevent the strain gauge from being taken up, after pasting, the strain gauge needs to be seriously checked, and when damage is found or the position of a pasted sheet is incorrect, the strain gauge needs to be pasted again in time. Before curing, the strain gauge is laid with a teflon film and a silicone rubber plate and pressed by a clamp.
And finally, in the curing stage, the elastomer to be heated and the strain gauge are placed in the center of the induction coil, the surrounding gaps are basically the same, the elastomer and the induction coil cannot collide with each other, the heating and curing operation of the bonding adhesive can be completed within 10 seconds, and the subsequent natural cooling is performed. This embodiment utilizes the high frequency to heat, very big promotion solidification efficiency, and a paster only needs 10 seconds to accomplish the solidification, utilizes a high frequency heater can replace a plurality of ovens in the past, has saved energy resource consumption, can save the manual work simultaneously, has reduced enterprise manufacturing cost.
Example 2
The embodiment optimizes the bonding glue in the embodiment 1, the bonding glue is epoxy resin glue, and the manufacturing method of the epoxy resin glue comprises the following steps:
A. mixing 75-85g of bisphenol A epoxy resin, 0.5g of defoaming agent and 0.5g of anti-settling agent, heating to 50-80 ℃, and uniformly stirring to obtain a component A;
B. mixing and heating triphenylhexachloro anhydride, maleic anhydride and 0.2g defoaming agent with the total weight of 15-25g to 50-80 ℃ and uniformly stirring to obtain a component B;
C. and B, mixing the component A and the component B obtained in the step A and the step B to obtain the epoxy resin adhesive. Preferably, the weight ratio of the component A to the component B is 8: 2. in this embodiment, trimellitic anhydride and maleic anhydride are selected as the compound curing agent, so that the elastic modulus of the epoxy resin adhesive can be effectively increased, the compound curing agent is increased, and the change of the elastic modulus of the epoxy resin adhesive is as shown in fig. 2, when the component B, that is, the compound curing agent, accounts for the total mixture in the interval from 1% to 20%, the elastic modulus of the epoxy resin adhesive gradually increases, and when the compound curing agent accounts for more than 20% of the total mixture, the elastic modulus of the epoxy resin adhesive decreases, and the elastic modulus has a great influence on the sensitivity of the sensor, so that the influence of the epoxy resin adhesive under different elastic moduli on the sensitivity of the sensor is detected. The epoxy resin adhesive used by the sensors 1, 2 and 3 has the compound curing agent accounting for 10 percent and the elastic modulus of about 0.8PGPa, while the epoxy resin adhesive used by the sensors 4, 5 and 6 has the compound curing agent accounting for 14 percent, 18 percent and 20 percent respectively, and the sensitivity test ratio calibration detection results of the sensors are expressed as follows:
it can be seen from the table that the sensitivity of the sensors 1-3 is much less than that of the sensors 4-6 due to the low elastic modulus of the epoxy glue used, while the sensitivity of the sensors 4-6 is gradually increased due to the gradually increasing elastic modulus of the epoxy glue used. Thus, it can be concluded that the greater the elastic modulus of the epoxy glue, the progressively increased the sensitivity of the sensor. As shown in fig. 2, when the percentage of component B, i.e., the compound curing agent, in the total mixture is increased to 20%, the elastic modulus of the epoxy resin adhesive is maximized, and the sensor sensitivity can be optimized by applying the epoxy resin adhesive to the sensor.
Example 3
This example further investigated how to increase the elastic modulus of epoxy resin adhesive on the basis of example 2, and for this purpose, the weight ratio of trimellitic anhydride to maleic anhydride was adjusted by experiment to change the weight ratio of trimellitic anhydride to maleic anhydride from 1: and 19, continuously increasing the ratio of the triphenhexaformic anhydride to the maleic anhydride, and reducing the ratio of the maleic anhydride to the triphenhexaformic anhydride until the weight ratio of the triphenhexaformic anhydride to the maleic anhydride reaches 1: 19. the elastic modulus of the epoxy resin glue produced by the curing agent with different weight ratio is recorded, and the graph is shown in fig. 3, and it can be seen from the graph that when the weight ratio of the trimellitic anhydride to the maleic anhydride is 11: the elastic modulus of the epoxy glue is the greatest at 9, about 1.9GPa, from which it can be concluded that the elastic modulus of the epoxy glue is greatest when the percentage of the compound curing agent to the total mixture is increased to 20%, whereas when the weight ratio of trimellitic anhydride to maleic anhydride is 11: and when 9, the elastic modulus of the epoxy resin adhesive is further optimized to reach a maximum value, and particularly, the sensitivity of a sensor formed by bonding is optimal.
Example 4
In this embodiment, the embodiment 2 is further optimized, 1g of SiO2 filler is added to the component a, 0.4g of active toughening agent epoxy hydroxyl-terminated polybutadiene acrylonitrile is added to the component B, the epoxy hydroxyl-terminated polybutadiene acrylonitrile can improve the brittleness of epoxy resin cured products and eliminate cracking phenomena, the insulation performance can be obviously improved, the SiO2 filler can also play a role in improving the insulation performance, in order to ensure the sensitivity, the epoxy resin adhesive layer between the strain gauge and the elastomer must be sufficiently thin, but the insulation effect of the epoxy resin adhesive layer is affected, so that the phenomenon that the zero drift indication value of the sensor is unstable and the like occurs, and the formula is added, so that the insulation performance of the epoxy resin adhesive layer can be increased, and the situation can be avoided.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A production method of a sensor based on high-frequency induction heating comprises the steps of elastomer processing, surface mounting, inspection and packaging, and is characterized in that: the patch processing comprises the following steps;
s1, marking; marking a positioning mark on the position of the elastic body needing to be pasted with the patch;
s2, brushing glue; brushing glue on the elastic body and the strain gauge;
s3, pasting a strain gauge; aligning the central line of the strain gauge to the mark position on the elastic body, and pasting;
s4, mounting a tool clamp; applying pressure to the strain gauge by using a tool clamp;
s5, high-frequency heating; and heating and curing the workpiece by using a high-frequency induction heating machine.
2. The high-frequency induction heating-based sensor production method according to claim 1, characterized in that: a step S31 is arranged between the step S3 and the step S4, and the step S31 is pressing; pressure is applied to the axial position of the strain gauge, causing the air bubble between the strain gauge and the elastomer to squeeze out.
3. The production method of a sensor based on high-frequency induction heating according to claim 2, characterized in that: the glue brushed in the step S2 is epoxy resin glue, and the manufacturing method of the epoxy resin glue comprises the following steps:
A. mixing bisphenol A epoxy resin, water, a defoaming agent and an anti-settling agent, heating to 50-80 ℃, and uniformly stirring to obtain a component A;
B. mixing trimellitic anhydride, maleic anhydride and a defoaming agent, heating to 50-80 ℃, and uniformly stirring to obtain a component B;
C. and B, mixing the component A and the component B obtained in the step A and the step B to obtain the epoxy resin adhesive.
4. The high-frequency induction heating-based sensor production method according to claim 3, characterized in that: the weight ratio of the component A to the component B is 8: 2.
5. the high-frequency induction heating-based sensor production method according to claim 4, characterized in that: the weight ratio of the trimellitic anhydride to the maleic anhydride is 11: 9.
6. the high-frequency induction heating-based sensor production method according to claim 5, characterized in that: the component B also comprises an active toughening agent epoxy hydroxyl-terminated polybutadiene acrylonitrile.
7. The high-frequency induction heating-based sensor production method according to claim 6, characterized in that: and C, mixing the component A and the component B in the step C in a stirring kettle, heating to 85 ℃, keeping the vacuum degree of more than 0.095MPa for 30min, and vacuumizing to remove bubbles.
8. The high-frequency induction heating-based sensor production method according to claim 7, characterized in that: the component A also contains SiO2 filler.
9. The production method of a sensor based on high-frequency induction heating according to claim 8, characterized in that: the glue brushed on the elastic body in the step S2 is a primer layer, and the thickness of the primer layer is 0.01-0.03 mm.
10. The high-frequency induction heating-based sensor production method according to claim 9, characterized in that: the area of the bottom glue layer is 1.5 times that of the strain gauge.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210979448.7A CN115044306A (en) | 2022-08-16 | 2022-08-16 | Sensor production method based on high-frequency induction heating |
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| CN202210979448.7A CN115044306A (en) | 2022-08-16 | 2022-08-16 | Sensor production method based on high-frequency induction heating |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105136014A (en) * | 2015-07-07 | 2015-12-09 | 宁波工程学院 | Producing and preparing technology of strain gauge |
| CN113532259A (en) * | 2021-07-23 | 2021-10-22 | 中国航发贵阳发动机设计研究所 | Process for sticking strain gauge by using M-610 adhesive |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105136014A (en) * | 2015-07-07 | 2015-12-09 | 宁波工程学院 | Producing and preparing technology of strain gauge |
| CN113532259A (en) * | 2021-07-23 | 2021-10-22 | 中国航发贵阳发动机设计研究所 | Process for sticking strain gauge by using M-610 adhesive |
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Application publication date: 20220913 |
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