CN115042031A - Automatic regulating device for circuit silicon wafer manufacturing - Google Patents

Automatic regulating device for circuit silicon wafer manufacturing Download PDF

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Publication number
CN115042031A
CN115042031A CN202210803561.XA CN202210803561A CN115042031A CN 115042031 A CN115042031 A CN 115042031A CN 202210803561 A CN202210803561 A CN 202210803561A CN 115042031 A CN115042031 A CN 115042031A
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CN
China
Prior art keywords
longitudinal
transverse
driving mechanism
silicon wafer
end cover
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210803561.XA
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Chinese (zh)
Other versions
CN115042031B (en
Inventor
郭恒亮
程权
刘润杰
倪志
刘青艳
宋永亮
曹飞
张天源
张致衡
李田丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HENAN HUACHEN INTELLIGENT CONTROL TECHNOLOGY CO LTD
Zhengzhou University
Original Assignee
HENAN HUACHEN INTELLIGENT CONTROL TECHNOLOGY CO LTD
Zhengzhou University
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Application filed by HENAN HUACHEN INTELLIGENT CONTROL TECHNOLOGY CO LTD, Zhengzhou University filed Critical HENAN HUACHEN INTELLIGENT CONTROL TECHNOLOGY CO LTD
Priority to CN202210803561.XA priority Critical patent/CN115042031B/en
Publication of CN115042031A publication Critical patent/CN115042031A/en
Application granted granted Critical
Publication of CN115042031B publication Critical patent/CN115042031B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/06—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by liquid or gas pressure only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/07—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a stationary work-table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

The invention discloses an automatic adjusting device for manufacturing a circuit silicon wafer, which comprises a working table top, a transverse driving mechanism and a longitudinal driving mechanism, wherein the transverse driving mechanism and the longitudinal driving mechanism are respectively arranged at the top of the working table top; the automatic adjusting mechanism comprises a hollow cylinder, an upper end cover, a lower end cover, a sliding sleeve, a motor, a square connecting rod, a square connecting sleeve, a supporting plate, an annular plate, a clamping cylinder, a clamping plate and a friction plate. Aiming at the condition that the thickness of the grinding wheel is reduced along with the increase of the grinding time, the grinding wheel is effectively contacted with the silicon wafer, and the condition that the grinding thickness of the silicon wafer is different along with the reduction of the thickness of the grinding wheel is avoided.

Description

Automatic regulating device for circuit silicon wafer manufacturing
Technical Field
The invention relates to the technical field of circuit silicon wafer production equipment, in particular to an automatic adjusting device for circuit silicon wafer manufacturing.
Background
The thinning of the silicon wafer is a process step carried out in the manufacturing process of the silicon wafer in order to remove redundant materials on the back of a pressing sheet and reduce the packaging volume of the silicon wafer. The thinning of the silicon wafer is usually completed by mechanical polishing, but in the existing polishing equipment, the position of a grinding wheel is set in advance and is relatively fixed, and along with the accumulation of polishing time, the thickness of the grinding wheel is gradually reduced, so that the thickness of the polished silicon wafer is different, and the quality of the silicon wafer is reduced.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an automatic adjusting device for manufacturing a circuit silicon wafer.
The technical scheme adopted by the invention is as follows:
an automatic adjusting device for manufacturing circuit silicon wafers comprises a working table top, a transverse driving mechanism and a longitudinal driving mechanism, wherein the transverse driving mechanism and the longitudinal driving mechanism are respectively arranged at the top of the working table top, the output end of the transverse driving mechanism is connected with a sucker clamp for fixing the silicon wafers, the output end of the longitudinal driving mechanism is connected with an automatic adjusting mechanism, the bottom end of the automatic adjusting mechanism is connected with a grinding wheel for grinding the silicon wafers, and the automatic adjusting mechanism is positioned above a path of transverse movement of a rotating mechanism; the automatic adjusting mechanism comprises a hollow cylinder, an upper end cover, a lower end cover, a sliding sleeve, a motor, a square connecting rod, a square connecting sleeve, a supporting plate, an annular plate, a clamping cylinder, a clamping plate and a friction plate, wherein the outer side wall of the hollow cylinder is connected with the output end of the longitudinal driving mechanism, the upper end cover and the lower end cover are respectively arranged at the top and the bottom of the hollow cylinder, the motor is arranged at the top of the upper end cover, the output end of the motor penetrates through the upper end cover and is connected with the square connecting rod, a bearing is arranged between the output end of the motor and the upper end cover, the square connecting sleeve is arranged at the center of the hollow cylinder, the bottom end of the square connecting rod is arranged in the top end of the square connecting sleeve and is in sliding connection with the square connecting sleeve, the bottom end of the square connecting sleeve penetrates through the lower end cover and is connected with a grinding wheel, and the supporting plate is respectively sleeved on the top end of the square connecting sleeve and the outer side wall corresponding to the lower end cover, the middle part of backup pad has the quad slit that matches with square adapter sleeve, the periphery of backup pad is circularly, the backup pad periphery is connected with the annular slab through the bearing, is located the top be equipped with the spring between annular slab and the upper end cover, the center department of lower end cover is equipped with the sliding sleeve, is located the below the annular slab slides and locates in the sliding sleeve, the lateral wall of cavity barrel is equipped with at least three centre gripping cylinder corresponding to square adapter sleeve top backup pad department, at least three centre gripping cylinder uses square adapter sleeve to be the circumference array setting as the center, the output of centre gripping cylinder runs through square adapter sleeve's lateral wall and is connected with splint, splint are the arc that matches with the periphery of backup pad, one side that corresponding centre gripping cylinder was kept away from to splint is connected with the friction disc.
Preferably, the horizontal actuating mechanism includes horizontal spout, horizontal slider and horizontal cylinder, horizontal spout is seted up on table surface's top surface, horizontal slider slidable locates in the horizontal spout, horizontal cylinder is located one side that vertical actuating mechanism was kept away from to horizontal spout, horizontal slider is connected to horizontal cylinder's output, sucking disc anchor clamps are connected to the top surface of horizontal slider.
Preferably, the longitudinal driving mechanism comprises a longitudinal support frame, a longitudinal sliding groove, a longitudinal sliding block and a longitudinal air cylinder, the longitudinal support frame is vertically arranged on the top surface of the working table, the longitudinal sliding groove is arranged on one side surface of the longitudinal support frame for carrying out the transverse driving mechanism, the longitudinal sliding block is slidably arranged in the longitudinal sliding groove, the longitudinal air cylinder is arranged on the outer side of the top of the longitudinal sliding groove, the output end of the longitudinal air cylinder is connected with the longitudinal sliding block, and one side, far away from the longitudinal support frame, of the longitudinal sliding block is connected with the hollow cylinder.
Preferably, the spring is sleeved outside the output shaft of the motor.
Preferably, the clamping cylinder is a double-rod cylinder.
Preferably, the outer side of the annular plate located above has longitudinally distributed undulations.
The invention has the beneficial effects that: to the increase along with the time of polishing, the condition that emery wheel thickness reduces, adopt square connecting rod and square adapter sleeve's sliding fit, application of force through the spring, make emery wheel and silicon chip effective contact, the thickness of avoiding along with the emery wheel reduces the thickness of polishing that leads to the silicon chip differs, and adjust the position at the emery wheel after again through the centre gripping cylinder drive the friction disc and carry out the centre gripping to the annular plate that is located the top, the rigidity that makes the emery wheel, thereby prevent to make emery wheel position change along with the silicon chip thinization of polishing, thereby further avoid the thickness of polishing of silicon chip to differ.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of a portion A of FIG. 1;
reference numerals: 1. table surface, 2, sucking disc anchor clamps, 3, emery wheel, 4, cavity barrel, 5, upper end cover, 6, bottom end cover, 7, sliding sleeve, 8, motor, 9, square connecting rod, 10, square adapter sleeve, 11, backup pad, 12, annular plate, 13, centre gripping cylinder, 14, splint, 15, friction disc, 16, horizontal spout, 17, horizontal slider, 18, horizontal cylinder, 19, vertical support frame, 20, vertical spout, 21, vertical slider, 22, vertical cylinder, 23, the wave line.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Examples
As shown in fig. 1 and 2, an automatic adjusting device for manufacturing a circuit silicon wafer comprises a working table 1, a transverse driving mechanism and a longitudinal driving mechanism, wherein the transverse driving mechanism and the longitudinal driving mechanism are respectively arranged at the top of the working table 1, the output end of the transverse driving mechanism is connected with a sucker clamp 2 for fixing a silicon wafer, the output end of the longitudinal driving mechanism is connected with an automatic adjusting mechanism, the bottom end of the automatic adjusting mechanism is connected with a grinding wheel 3 for grinding the silicon wafer, and the automatic adjusting mechanism is positioned above a path of transverse movement of a rotating mechanism; the automatic adjusting mechanism comprises a hollow cylinder 4, an upper end cover 5, a lower end cover 6, a sliding sleeve 7, a motor 8, a square connecting rod 9, a square connecting sleeve 10, a supporting plate 11, an annular plate 12, a clamping cylinder 13, a clamping plate 14 and a friction plate 15, wherein the outer side wall of the hollow cylinder 4 is connected with the output end of the longitudinal driving mechanism, the upper end cover 5 and the lower end cover 6 are respectively arranged at the top and the bottom of the hollow cylinder 4, the motor 8 is arranged at the top of the upper end cover 5, the output end of the motor 8 penetrates through the upper end cover 5 and is connected with the square connecting rod 9, a bearing is arranged between the output end of the motor 8 and the upper end cover 5, the square connecting sleeve 10 is arranged at the center of the hollow cylinder 4, the bottom end of the square connecting rod 9 is arranged in the top end of the square connecting sleeve 10 and is in sliding connection with the square connecting sleeve, and the bottom end of the square connecting sleeve 10 penetrates through the lower end cover 6 and is connected with a grinding wheel 3, the top end of the square connecting sleeve 10 and the outer side wall corresponding to the lower end cover 6 are respectively sleeved with a supporting plate 11, the middle part of the supporting plate 11 is provided with a square hole matched with the square connecting sleeve 10, the periphery of the supporting plate 11 is circular, the periphery of the supporting plate 11 is connected with an annular plate 12 through a bearing, a spring is arranged between the annular plate 12 positioned above and the upper end cover 5, the center of the lower end cover 6 is provided with a sliding sleeve 7, the annular plate 12 positioned below is slidably arranged in the sliding sleeve 7, the outer side wall of the hollow barrel 4 is provided with at least three clamping cylinders 13 corresponding to the supporting plate 11 at the top end of the square connecting sleeve 10, the at least three clamping cylinders 13 are arranged in a circumferential array by taking the square connecting sleeve 10 as the center, the output ends of the clamping cylinders 13 penetrate through the side wall of the square connecting sleeve 10 and are connected with clamping plates 14, and the clamping plates 14 are arc-shaped and matched with the periphery of the supporting plate 11, a friction plate 15 is connected to the side of the clamping plate 14 remote from the corresponding clamping cylinder 13.
To the increase along with the time of polishing, the condition that 3 thickness of emery wheel reduces, the sliding fit of square connecting rod 9 and square connecting sleeve 10 is adopted to this embodiment, application of force through the spring, make emery wheel 3 and silicon chip effective contact, avoid reducing the thickness that leads to the silicon chip along with the thickness of emery wheel 3 and differ, and adjust the position at emery wheel 3 after again through centre gripping cylinder 13 drive friction disc 15 carry out the centre gripping to the annular plate 12 that is located the top, make emery wheel 3's rigidity, thereby prevent to make 3 position changes of emery wheel along with the silicon chip thinnings of polishing, further avoid the thickness of polishing of silicon chip to differ.
The specific using process is as follows: initially, the output end of the longitudinal driving mechanism is in a high position, the sucker clamp 2 is used for fixing the silicon wafer, the transverse driving mechanism is started again to move the sucker clamp 2 to the position below the grinding wheel 3 and then stop, the longitudinal driving mechanism is started to move the automatic adjusting mechanism to the low position and then stop, the silicon wafer applies force to the grinding wheel 3 to compress the spring, the annular plate 12 located below slides upwards in the sliding sleeve 7 to drive the square connecting sleeve 10 to move upwards so as to drive the square connecting sleeve 10 to slide upwards outside the square connecting rod 9, the clamping cylinder 13 is started again to push the annular plate 12 located above the clamping plate 14 to enable the friction plate 15 to clamp the annular plate 12 located above, so that the position of the grinding wheel 3 in the longitudinal direction is well fixed, the phenomenon that the grinding wheel 3 is pushed downwards by the spring to excessively grind the silicon wafer along with the reduction of the thickness of the silicon wafer during grinding is avoided, the thickness of the silicon wafer is kept consistent after grinding, and the grinding quality is improved, after the annular plate 12 above is clamped, the motor 8 can be started to drive the square connecting rod 9, the square connecting sleeve 10 and the grinding wheel 3 to rotate through the output shaft of the motor 8 so as to grind the silicon wafer.
In one embodiment, the transverse driving mechanism comprises a transverse sliding groove 16, a transverse sliding block 17 and a transverse air cylinder 18, the transverse sliding groove 16 is arranged on the top surface of the working table surface 1, the transverse sliding block 17 is slidably arranged in the transverse sliding groove 16, the transverse air cylinder 18 is arranged on one side of the transverse sliding groove 16 far away from the longitudinal driving mechanism, the output end of the transverse air cylinder 18 is connected with the transverse sliding block 17, and the top surface of the transverse sliding block 17 is connected with the suction cup clamp 2.
The transverse cylinder 18 is matched with the transverse sliding chute 16 and the transverse sliding block 17, the transverse driving mechanism is simple in structure and low in cost, and the output end of the transverse cylinder 18 drives the transverse sliding block 17 to slide in the transverse sliding chute 16, so that the sucker clamp 2 on the transverse sliding block 17 is moved.
In one embodiment, the longitudinal driving mechanism comprises a longitudinal supporting frame 19, a longitudinal sliding groove 20, a longitudinal sliding block 21 and a longitudinal air cylinder 22, the longitudinal supporting frame 19 is vertically arranged on the top surface of the working table 1, the longitudinal sliding groove 20 is arranged on one side surface of the longitudinal supporting frame 19 for performing a transverse driving mechanism, the longitudinal sliding block 21 is slidably arranged in the longitudinal sliding groove 20, the longitudinal air cylinder 22 is arranged on the outer side of the top of the longitudinal sliding groove 20, the output end of the longitudinal air cylinder 22 is connected with the longitudinal sliding block 21, and one side of the longitudinal sliding block 21, which is far away from the longitudinal supporting frame 19, is connected with the hollow cylinder 4.
The longitudinal cylinder 22 is matched with the longitudinal sliding groove 20 and the longitudinal sliding block 21, the longitudinal driving mechanism is simple in structure and low in cost, and the output end of the longitudinal cylinder 22 drives the longitudinal sliding block 21 to slide in the longitudinal sliding groove 20, so that the automatic adjusting mechanism on the longitudinal sliding block 21 is moved.
In one embodiment, the spring is sleeved outside the output shaft of the motor 8.
The single spring is sleeved outside the output shaft of the motor 8, namely the spring is positioned in the center of the annular plate 12, so that the phenomenon that the annular plate 12 is stressed unevenly and inclines to influence the matching between the square connecting rod 9 and the square connecting sleeve 10 is avoided.
In one embodiment, the clamping cylinder 13 is a dual rod cylinder.
The double-rod cylinder is connected with the clamping plate 14, so that the stress of the clamping plate 14 is more balanced, the contact area of the friction plate 15 and the annular plate 12 is increased to the maximum extent, and the friction plate 15 clamps the annular plate 12 more stably.
In one embodiment, the outer side of the annular plate 12 above has longitudinally distributed undulations 23.
The raised grains 23 can further increase the contact area between the annular plate 12 and the friction plate 15, so that the clamping is more stable, and the raised grains 23 can also enable the friction plate 15 and the annular plate 12 to form a longitudinal interaction force to a certain extent, so that the stability is further increased.
The above-mentioned embodiments only express the specific embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.

Claims (6)

1. The automatic adjusting device for manufacturing the circuit silicon wafer is characterized by comprising a working table top (1), a transverse driving mechanism and a longitudinal driving mechanism, wherein the transverse driving mechanism and the longitudinal driving mechanism are respectively arranged at the top of the working table top (1), the output end of the transverse driving mechanism is connected with a sucker clamp (2) for fixing the silicon wafer, the output end of the longitudinal driving mechanism is connected with an automatic adjusting mechanism, the bottom end of the automatic adjusting mechanism is connected with a grinding wheel (3) for grinding the silicon wafer, and the automatic adjusting mechanism is positioned above a path of transverse movement of a rotating mechanism; automatic adjustment mechanism includes cavity barrel (4), upper end cover (5), lower extreme cover (6), sliding sleeve (7), motor (8), square connecting rod (9), square adapter sleeve (10), backup pad (11), annular plate (12), centre gripping cylinder (13), splint (14) and friction disc (15), vertical actuating mechanism's output is connected to the lateral wall of cavity barrel (4), the top and the bottom of cavity barrel (4) are located respectively to upper end cover (5) and lower extreme cover (6), the top of upper end cover (5) is located in motor (8), the output of motor (8) runs through upper end cover (5) and connects square connecting rod (9), be equipped with the bearing between the output of motor (8) and upper end cover (5), cavity barrel (4) center department is located in square adapter sleeve (10), the bottom of square connecting rod (9) is located in the top of square adapter sleeve (10) and slides rather than The grinding wheel is connected, the bottom end of the square connecting sleeve (10) penetrates through the lower end cover (6) and is connected with the grinding wheel (3), a supporting plate (11) is sleeved on the top end of the square connecting sleeve (10) and the outer side wall corresponding to the lower end cover (6) respectively, a square hole matched with the square connecting sleeve (10) is formed in the middle of the supporting plate (11), the periphery of the supporting plate (11) is circular, an annular plate (12) is connected to the periphery of the supporting plate (11) through a bearing, a spring is arranged between the annular plate (12) located above and the upper end cover (5), a sliding sleeve (7) is arranged at the center of the lower end cover (6), the annular plate (12) located below is arranged in the sliding sleeve (7) in a sliding mode, at least three clamping cylinders (13) are arranged on the outer side wall of the hollow barrel (4) corresponding to the top end (11) of the supporting plate of the square connecting sleeve (10), at least three centre gripping cylinder (13) are circumference array setting for the center with square adapter sleeve (10), the output of centre gripping cylinder (13) runs through the lateral wall of square adapter sleeve (10) and is connected with splint (14), splint (14) are the arc that matches with the periphery of backup pad (11), one side that corresponds centre gripping cylinder (13) is kept away from in splint (14) is connected with friction disc (15).
2. The automatic adjusting device for manufacturing the circuit silicon wafer according to claim 1, wherein the transverse driving mechanism comprises a transverse sliding chute (16), a transverse sliding block (17) and a transverse air cylinder (18), the transverse sliding chute (16) is arranged on the top surface of the working table top (1), the transverse sliding block (17) is slidably arranged in the transverse sliding chute (16), the transverse air cylinder (18) is arranged on one side of the transverse sliding chute (16) far away from the longitudinal driving mechanism, the output end of the transverse air cylinder (18) is connected with the transverse sliding block (17), and the top surface of the transverse sliding block (17) is connected with the sucker clamp (2).
3. The automatic adjusting device for circuit silicon wafer manufacturing according to claim 2, wherein the longitudinal driving mechanism comprises a longitudinal supporting frame (19), a longitudinal sliding groove (20), a longitudinal sliding block (21) and a longitudinal air cylinder (22), the longitudinal supporting frame (19) is vertically arranged on the top surface of the working table top (1), the longitudinal sliding groove (20) is arranged on one side surface of the longitudinal supporting frame (19) for carrying out the transverse driving mechanism, the longitudinal sliding block (21) is slidably arranged in the longitudinal sliding groove (20), the longitudinal air cylinder (22) is arranged on the outer side of the top of the longitudinal sliding groove (20), the output end of the longitudinal air cylinder (22) is connected with the longitudinal sliding block (21), and one side of the longitudinal sliding block (21) far away from the longitudinal supporting frame (19) is connected with the hollow cylinder (4).
4. The automatic adjusting device for circuit silicon wafer manufacturing according to claim 3, wherein the spring is sleeved outside the output shaft of the motor (8).
5. The automatic adjusting device for circuit silicon wafer fabrication according to claim 4, wherein the clamping cylinder (13) is a double rod cylinder.
6. Automatic regulating device for circuit silicon wafer production according to claim 5, characterized in that the outer side of the upper annular plate (12) has longitudinally distributed undulations (23).
CN202210803561.XA 2022-07-07 2022-07-07 Automatic regulating device for manufacturing circuit silicon wafer Active CN115042031B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210803561.XA CN115042031B (en) 2022-07-07 2022-07-07 Automatic regulating device for manufacturing circuit silicon wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210803561.XA CN115042031B (en) 2022-07-07 2022-07-07 Automatic regulating device for manufacturing circuit silicon wafer

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CN115042031A true CN115042031A (en) 2022-09-13
CN115042031B CN115042031B (en) 2024-04-09

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES1027130U (en) * 1994-02-11 1994-07-16 Torres Jose Angel Casado Dual sharpener. (Machine-translation by Google Translate, not legally binding)
CN101249638A (en) * 2008-03-20 2008-08-27 北京古日机电科技有限公司 Device driven object up-down and automatic grinding mill
CN105234820A (en) * 2015-08-24 2016-01-13 哈尔滨工业大学 Non-contact online detection method for circular degree error and abrasion loss of metal based abrasion wheel and device for achieving method
JP2017094418A (en) * 2015-11-19 2017-06-01 株式会社ディスコ Grinding device
CN107030598A (en) * 2017-06-19 2017-08-11 沈阳飞机工业（集团）有限公司 The trapezoidal thread part and its processing method of hard chrome plating
CN108838867A (en) * 2018-08-13 2018-11-20 王淑东 A kind of crystal glass grinder that grinding effect is good
CN108838846A (en) * 2018-07-11 2018-11-20 祖全达 A kind of automotive hub ring flange hand-held threaded hole device for dedusting inner wall
CN108838845A (en) * 2017-03-15 2018-11-20 广东省陶瓷研究所 Mechanical device for being renovated to ceramic burning-resisting board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES1027130U (en) * 1994-02-11 1994-07-16 Torres Jose Angel Casado Dual sharpener. (Machine-translation by Google Translate, not legally binding)
CN101249638A (en) * 2008-03-20 2008-08-27 北京古日机电科技有限公司 Device driven object up-down and automatic grinding mill
CN105234820A (en) * 2015-08-24 2016-01-13 哈尔滨工业大学 Non-contact online detection method for circular degree error and abrasion loss of metal based abrasion wheel and device for achieving method
JP2017094418A (en) * 2015-11-19 2017-06-01 株式会社ディスコ Grinding device
CN108838845A (en) * 2017-03-15 2018-11-20 广东省陶瓷研究所 Mechanical device for being renovated to ceramic burning-resisting board
CN107030598A (en) * 2017-06-19 2017-08-11 沈阳飞机工业（集团）有限公司 The trapezoidal thread part and its processing method of hard chrome plating
CN108838846A (en) * 2018-07-11 2018-11-20 祖全达 A kind of automotive hub ring flange hand-held threaded hole device for dedusting inner wall
CN108838867A (en) * 2018-08-13 2018-11-20 王淑东 A kind of crystal glass grinder that grinding effect is good

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