CN115038265B - Automatic pressing device for circuit board processing - Google Patents

Automatic pressing device for circuit board processing Download PDF

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Publication number
CN115038265B
CN115038265B CN202210767846.2A CN202210767846A CN115038265B CN 115038265 B CN115038265 B CN 115038265B CN 202210767846 A CN202210767846 A CN 202210767846A CN 115038265 B CN115038265 B CN 115038265B
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China
Prior art keywords
circuit board
welded
operation platform
connecting plate
plate
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CN115038265A (en
Inventor
陈斐健
左旭文
张维说
谢彬彬
黄仁浪
韩志远
周园园
林利
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Meizhou Benchuang Electronics Co ltd
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Meizhou Benchuang Electronics Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Press Drives And Press Lines (AREA)

Abstract

The invention relates to the technical field of circuit board processing, and discloses an automatic pressing device for circuit board processing. The invention comprises an operation platform, a lower die, an L-shaped connecting plate, a hydraulic cylinder II, an operation panel, a screw II and an upper die, wherein clamping grooves I are formed in the inner side walls of the two sides of the operation platform, a fixing plate I is connected to the inner surface of the clamping grooves I of the operation platform in a sliding manner, the upper surface of the fixing plate I is welded with the L-shaped connecting plate II, clamping grooves are formed in the inner side walls of the two sides of the inner part of the lower die, a movable baffle is connected to the inner surface of the clamping grooves of the lower die in a sliding manner, a supporting plate II is movably connected to the lower surface of the movable baffle through the screw II, the upper surface of the L-shaped connecting plate II is welded to the lower surface of the supporting plate, the movable baffle is pushed to move upwards by pushing the fixing plate I, and meanwhile, a circuit board pressed inside the movable baffle is pushed to move out of the lower die by the movable baffle, so that a worker can take out the circuit board from the inside the lower die conveniently.

Description

Automatic pressing device for circuit board processing
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to an automatic pressing device for circuit board processing.
Background
The names of the circuit boards are ceramic circuit boards, aluminum oxide ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper plates, impedance boards, PCBs, ultrathin circuit boards, printed (copper etching technology) circuit boards and the like, and the circuit boards enable circuits to be miniaturized and visualized, play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and the circuit boards are divided into three major classifications of single-sided boards, double-sided boards and multi-layer circuit boards according to the number of layers.
The existing laminating device is used for laminating the circuit board, and the circuit board needs to be manually taken out from the laminating device by a worker, so that long time is consumed, and meanwhile, the worker lacks protection in the process of taking out the circuit board, so that the problem that the circuit board needs to be manually taken out from the laminating device by the worker after the circuit board is laminated by the existing laminating device is solved by the automatic laminating device for processing the circuit board.
Disclosure of Invention
The invention aims at: in order to solve the problem that the circuit board needs to be manually taken out from the inside of the pressing device by a worker after the circuit board is pressed by the conventional pressing device, the automatic pressing device for processing the circuit board is provided.
The technical scheme adopted by the invention is as follows:
the automatic pressing device comprises an operation platform, a lower die, an L-shaped connecting plate, a hydraulic cylinder II, an operation panel, a screw II and an upper die, wherein clamping grooves I are formed in the inner side walls of two sides of the operation platform, a fixing plate I is slidably connected to the inner surface of the clamping grooves I of the operation platform, the upper surface of the fixing plate I is welded with the L-shaped connecting plate II, clamping grooves are formed in the inner side walls of two sides of the inner side of the lower die, a movable baffle is slidably connected to the inner surface of the clamping grooves of the lower die, a threaded hole is formed in the lower surface of the movable baffle, the screw I is connected with an inner thread of the movable baffle, a support plate II is connected with an outer thread of the screw I, the lower surface of the support plate II is welded to the upper surface of one side, away from the fixing plate I, of the L-shaped connecting plate II, and an output end of the operation panel is electrically connected with an access end of the hydraulic cylinder II;
the draw-in groove has been seted up to the inside wall of L type connecting plate, just the inside surface sliding connection of draw-in groove of L type connecting plate has the slider one, the welding of draw-in groove inner wall top of L type connecting plate has electric telescopic handle one, electric telescopic handle one's output welding is in the upper surface of slider one, slider one is kept away from one side welding of L type connecting plate has electric telescopic handle two, electric telescopic handle two's output welding has the fly leaf, just control the output of panel with electric telescopic handle one with electric telescopic handle two's access carries out electric connection between.
Through adopting above-mentioned technical scheme, the staff upwards removes through promoting the fixed plate for L type connecting plate two promote movable baffle and remove, make the movable baffle promote the inside circuit board after the inside pressfitting of bed die shift out the inside of bed die simultaneously, thereby be convenient for the staff to a certain extent take out the circuit board from the bed die inside.
In a preferred embodiment, two groups of threaded holes are formed in the upper surface of the operation platform, the internal threads of the two groups of threaded holes of the operation platform are connected with screws, one end, close to the L-shaped connecting plate, of each screw is welded with a first supporting plate, and the first supporting plates are located at the right lower end of the connecting plate.
Through adopting above-mentioned technical scheme, restrict through the shift position of a pair of connecting plate of backup pad for the upper die can't excessively extrude the inside circuit board of bed die to the upper die in the in-process that the connecting plate promoted the upper die to remove, thereby avoid the circuit board to produce the damage at the in-process of pressfitting as far as possible.
In a preferred embodiment, four sets of universal wheels are welded to the lower surface of the operating platform.
Through adopting above-mentioned technical scheme, drive the inside pulley of universal wheel through pushing operation platform and rotate for operation platform moving speed accelerates, thereby reduced staff's amount of labour to a certain extent.
In a preferred embodiment, a protective pad is adhered to the upper surface of the first support plate.
Through adopting above-mentioned technical scheme, protect the upper surface of backup pad one through the protection pad for the sound of connecting plate when removing the striking to backup pad one upper surface reduces.
In a preferred embodiment, the upper surface of the operation platform is provided with two groups of clamping grooves II, the inner surfaces of the two groups of clamping grooves II of the operation platform are both connected with a sliding block II in a sliding manner, and the upper surface of the sliding block II is adhered with a ruler.
Through adopting above-mentioned technical scheme, with the adjacent one side butt of two sets of straightedge in two sets of backup pads one opposite side to the staff of being convenient for carries out accurate regulation to the height of backup pad one according to the scale of straightedge.
In a preferred embodiment, a second fixing plate is welded on one side of the operation platform, and a collecting box is welded on the upper surface of the second fixing plate.
Through adopting above-mentioned technical scheme, through the storage box to operation platform draw-in groove two inside dismantlement ruler and slider two after the removal to the staff of being convenient for can take out the use fast at the in-process of using the ruler next time.
In a preferred embodiment, the first hydraulic cylinder is welded to the inner side walls of two sides of the operation platform, the fixing blocks are welded to the upper surfaces of the first hydraulic cylinders, the output ends of the fixing blocks are abutted to the upper surface of the first fixing plate, and the output ends of the control panel are electrically connected with the access ends of the first hydraulic cylinders.
Through adopting above-mentioned technical scheme, through controlling the panel start-up pneumatic cylinder one for the output of pneumatic cylinder one promotes fixed plate one and removes in operation platform's draw-in groove one inside, consequently makes the first substitution staff of pneumatic cylinder promote fixed plate one and removes, thereby has reduced staff's the amount of labour to a certain extent.
In a preferred embodiment, a handle is welded to the end of the threaded rod remote from the first support plate.
Through adopting above-mentioned technical scheme, drive backup pad one through rotating the handle and rotate for staff's rotation rate when rotating backup pad one accelerates, thereby avoid backup pad one to avoid lacking the stress point and lead to the staff to consume longer time at the in-process of rotating backup pad one as far as possible.
In a preferred embodiment, the upper surfaces of the two groups of first support plates are provided with threaded holes, the internal threads of the two groups of first support plates are connected with bolts, and the external threads of the two groups of bolts penetrate through the two groups of first support plates to be connected inside the upper surface of the operation platform.
Through adopting above-mentioned technical scheme, through rotating the bolt, pass the backup pad one and connect behind operation platform's upper surface is inside with the bolt for backup pad one's position is fixed in operation platform's upper end by the bolt, thereby avoids backup pad one to produce the removal to the in-process that the connecting plate supported as far as possible.
In a preferred embodiment, a protection plate is welded to the side of the operating platform away from the first electric telescopic rod.
Through adopting above-mentioned technical scheme, protect the circuit board after the electric telescopic handle second promotes movable baffle upper surface pressfitting through the guard plate to avoid electric telescopic handle second to drop to ground and lead to the circuit board impaired at the in-process circuit board that promotes the circuit board removal as far as possible.
In conclusion, by adopting the technical scheme, the invention has the beneficial effects that:
1. according to the invention, a worker moves upwards by pushing the fixing plate, so that the L-shaped connecting plate II pushes the movable baffle to move, and meanwhile, the movable baffle pushes the circuit board pressed in the lower die to move out of the lower die, so that the worker can conveniently take out the circuit board from the lower die to a certain extent, the machining efficiency of the device is improved to a certain extent, and in addition, after the worker stops pushing the fixing plate I, the movable baffle and the fixing plate I fall down due to gravity and then reset, so that the worker does not need to adjust manually, and the labor capacity of the worker is reduced to a certain extent.
2. According to the invention, the position of the electric telescopic rod I for pushing the movable plate is started to be adjusted through controlling the control panel, so that the lower surface of the movable plate is moved to be parallel to the upper surface of the movable baffle after pushing, and meanwhile, the electric telescopic rod II is started to push the movable plate to be moved through controlling the control panel, so that the movable plate pushes the circuit board after pressing the upper surface of the movable baffle to be moved, and therefore, the circuit board is moved out of the processing range of the upper die, and the safety of workers in taking out the circuit board after pressing is improved to a certain extent.
3. According to the invention, the moving positions of the pair of connecting plates are limited by the supporting plate, so that the upper die cannot excessively extrude the circuit board in the lower die in the process of pushing the upper die to move by the connecting plate, and damage to the circuit board in the laminating process is avoided as much as possible.
Drawings
FIG. 1 is a schematic diagram of a front structure of a pressing device of the present invention;
FIG. 2 is a schematic side view of a pressing device according to the present invention;
FIG. 3 is a schematic top view of the pressing device of the present invention;
FIG. 4 is an enlarged view of the invention at A in FIG. 1;
fig. 5 is an enlarged view of the present invention at B in fig. 2.
The marks in the figure: 1. an operating platform; 2. a universal wheel; 3. a lower die; 4. a first fixing plate; 5. a fixed block; 6. a first hydraulic cylinder; 7. a handle; 8. a screw; 9. a collection box; 10. a second fixing plate; 11. an L-shaped connecting plate I; 12. a second hydraulic cylinder; 13. a connecting plate; 14. a ruler; 15. a control panel; 16. an electric telescopic rod I; 17. a first sliding block; 18. an electric telescopic rod II; 19. a protection plate; 20. a first screw; 21. a protective pad; 22. an upper die; 23. a second screw; 24. a first supporting plate; 25. a bolt; 26. an L-shaped connecting plate I; 27. a movable plate; 28. a second supporting plate; 29. a second slide block; 30. a movable baffle.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples:
with reference to figures 1-5 of the drawings,
the utility model provides an automatic compression fittings of circuit board processing, including operation platform 1, bed die 3, L type connecting plate 11, pneumatic cylinder two 12, control panel 15, screw two 23 and last mould 22, draw-in groove one has been seted up to operation platform 1's both sides inside wall, and operation platform 1 draw-in groove one's internal surface sliding connection has fixed plate one 4, the upper surface welding of fixed plate one 4 has L type connecting plate two 26, the draw-in groove has all been seted up to bed die 3's inside both sides inside wall, and the draw-in groove internal surface sliding connection of bed die 3 has movable baffle 30, threaded hole has been seted up to movable baffle 30's lower surface, and movable baffle 30's internal thread connection has screw one 20, screw one 20's external thread connection has backup pad two 28, the lower surface welding of backup pad two 28 is kept away from one side upper surface of fixed plate one 4 at L type connecting plate two 26, and carry out electric connection between the access end of control panel 15 and pneumatic cylinder two 12.
The staff upwards moves through promoting fixed plate one 4 for L type connecting plate two 26 promote movable baffle 30 and remove, make the movable baffle 30 promote the inside circuit board after the inside pressfitting of bed die 3 to shift out the inside of bed die 3 simultaneously, thereby be convenient for the staff to a certain extent take out the circuit board from bed die 3 inside, consequently improve the machining efficiency of the device to a certain extent, in addition, after the staff stops promoting fixed plate one 4, movable baffle 30 and fixed plate one 4 reset because of the weight whereabouts, make the staff need not to adjust through manual, thereby reduced the amount of labour of staff to a certain extent.
The draw-in groove has been seted up to the inside wall of L type connecting plate 11, and the inside surface sliding connection of draw-in groove of L type connecting plate 11 has slider one 17, the welding of draw-in groove inner wall top of L type connecting plate 11 has electric telescopic handle one 16, electric telescopic handle one 16's output welds the upper surface at slider one 17, one side welding that slider one 17 kept away from L type connecting plate 11 has electric telescopic handle two 18, electric telescopic handle two 18's output welds movable plate 27, and control panel 15's output and electric telescopic handle one 16 and electric telescopic handle two 18's access between carry out electric connection.
The first electric telescopic rod 16 is started to push the movable plate 27 through controlling the control panel 15 to adjust the position, so that the lower surface of the movable plate 27 moves to be parallel to the upper surface of the movable baffle 30 after pushing up, and meanwhile, the second electric telescopic rod 18 is started to push the movable plate 27 to move through controlling the control panel 15, so that the movable plate 27 pushes the circuit board after pressing the upper surface of the movable baffle 30 to move, and therefore the circuit board moves out of the processing range of the upper die 22, and the safety of workers when taking out the circuit board after pressing is improved to a certain extent.
Two groups of threaded holes are formed in the upper surface of the operation platform 1, the internal threads of the two groups of threaded holes of the operation platform 1 are connected with screws 8, one ends of the two groups of screws 8, which are close to the L-shaped connecting plate 11, are welded with first support plates 24, and the first support plates 24 are located at the right lower ends of the connecting plates 13.
The moving position of the connecting plate 13 is limited through the first supporting plate 24, so that the upper die 22 cannot excessively extrude the circuit board inside the lower die 3 in the process that the connecting plate 13 pushes the upper die 22 to move, damage to the circuit board in the process of pressing is avoided as much as possible, meanwhile, the first supporting plate 24 is pushed to move by the screw 8 through rotating the screw 8, and meanwhile, the position of the first supporting plate 24 can be adjusted, so that the height of the first supporting plate 24 can be adjusted by staff according to the thickness of the circuit board to a certain extent.
The lower surface welding of operation platform 1 has four sets of universal wheels 2, drives the inside pulley of universal wheel 2 through promoting operation platform 1 and rotates for operation platform 1 travel speed accelerates, thereby has reduced staff's the amount of labour to a certain extent.
The upper surface of the first support plate 24 is adhered with a protection pad 21, and the protection pad 21 protects the upper surface of the first support plate 24, so that the sound of the connecting plate 13 is reduced when the connecting plate moves to strike the upper surface of the first support plate 24.
Two groups of clamping grooves II are formed in the upper surface of the operation platform 1, the inner surfaces of the two groups of clamping grooves II of the operation platform 1 are connected with a sliding block II 29 in a sliding mode, and a ruler 14 is adhered to the upper surface of the sliding block II 29.
Through promoting ruler 14, with the adjacent one side butt of two sets of rulers 14 in two sets of backup pads one 24 opposite one side to the staff of being convenient for carries out accurate regulation to backup pad one 24's height according to the scale of ruler 14, simultaneously, can remove at operation platform 1's draw-in groove two inside through slider two 29, make slider two 29 can follow operation platform 1's draw-in groove two inside dismantlement, thereby avoid this equipment to carry out the in-process of pressfitting to the circuit board to cause the extrusion to ruler 14 and lead to ruler 14 to produce the damage as far as possible.
One side of the operation platform 1 is welded with a second fixing plate 10, the upper surface of the second fixing plate 10 is welded with a collecting box 9, and the ruler 14 and the second sliding block 29 which are removed and moved in the clamping groove of the operation platform 1 are stored through the collecting box 9, so that workers can quickly take out and use the ruler 14 in the next use process.
The inside both sides inside wall of operation platform 1 all welds there is fixed block 5, and the upper surface of two sets of fixed blocks 5 all welds there is pneumatic cylinder one 6, and the output of two sets of pneumatic cylinders one 6 all butt is at the upper surface of fixed plate one 4, and controls the output of panel 15 and carries out electric connection between the access end of pneumatic cylinder one 6.
The first hydraulic cylinder 6 is started by controlling the control panel 15, so that the first hydraulic cylinder 6 is driven to move in the first clamping groove of the operating platform 1 by the output end of the first hydraulic cylinder 6, and meanwhile, the first hydraulic cylinder 6 replaces a worker to drive the first hydraulic cylinder 4 to move, so that the labor capacity of the worker is reduced to a certain extent.
One end of the screw rod 8, which is far away from the first support plate 24, is welded with a handle 7, and the first support plate 24 is driven to rotate by rotating the handle 7, so that the rotating speed of a worker when the first support plate 24 is rotated is increased, and the first support plate 24 is prevented from being lack of stress points, so that the worker consumes a long time in the process of rotating the first support plate 24.
Threaded holes are formed in the upper surfaces of the two groups of first support plates 24, bolts 25 are connected to the internal threads of the two groups of first support plates 24, and the external threads of the two groups of bolts 25 penetrate through the two groups of first support plates 24 to be connected to the inside of the upper surface of the operation platform 1.
By rotating the bolt 25, after the bolt 25 passes through the first support plate 24 and is connected to the inside of the upper surface of the operation platform 1, the position of the first support plate 24 is fixed at the upper end of the operation platform 1 by the bolt 25, so that movement of the first support plate 24 in the process of supporting the connecting plate 13 is avoided as much as possible.
One side of the operation platform 1, which is far away from the first electric telescopic rod 16, is welded with a protection plate 19, and the circuit board after the upper surface of the movable baffle 30 is pushed by the second electric telescopic rod 18 to be pressed is protected through the protection plate 19, so that the circuit board is prevented from being damaged as far as possible due to the fact that the circuit board falls to the ground in the process of pushing the circuit board to move by the second electric telescopic rod 18.
The implementation principle of the embodiment of the automatic laminating device for circuit board processing is as follows:
the staff upwards moves through promoting fixed plate one 4 for L type connecting plate two 26 promote movable baffle 30 and remove, make the movable baffle 30 promote the inside circuit board after the inside pressfitting of bed die 3 to shift out the inside of bed die 3 simultaneously, thereby be convenient for the staff to a certain extent take out the circuit board from bed die 3 inside, consequently improve the machining efficiency of the device to a certain extent, in addition, after the staff stops promoting fixed plate one 4, movable baffle 30 and fixed plate one 4 reset because of the weight whereabouts, make the staff need not to adjust through manual, thereby reduced the amount of labour of staff to a certain extent.
The first electric telescopic rod 16 is started to push the movable plate 27 through controlling the control panel 15 to adjust the position, so that the lower surface of the movable plate 27 moves to be parallel to the upper surface of the movable baffle 30 after pushing up, and meanwhile, the second electric telescopic rod 18 is started to push the movable plate 27 to move through controlling the control panel 15, so that the movable plate 27 pushes the circuit board after pressing the upper surface of the movable baffle 30 to move, and therefore the circuit board moves out of the processing range of the upper die 22, and the safety of workers when taking out the circuit board after pressing is improved to a certain extent.
The moving position of the connecting plate 13 is limited through the first supporting plate 24, so that the upper die 22 cannot excessively extrude the circuit board inside the lower die 3 in the process that the connecting plate 13 pushes the upper die 22 to move, damage to the circuit board in the process of pressing is avoided as much as possible, meanwhile, the first supporting plate 24 is pushed to move by the screw 8 through rotating the screw 8, and meanwhile, the position of the first supporting plate 24 can be adjusted, so that the height of the first supporting plate 24 can be adjusted by staff according to the thickness of the circuit board to a certain extent.
Through promoting ruler 14, with the adjacent one side butt of two sets of rulers 14 in two sets of backup pads one 24 opposite one side to the staff of being convenient for carries out accurate regulation to backup pad one 24's height according to the scale of ruler 14, simultaneously, can remove at operation platform 1's draw-in groove two inside through slider two 29, make slider two 29 can follow operation platform 1's draw-in groove two inside dismantlement, thereby avoid this equipment to carry out the in-process of pressfitting to the circuit board to cause the extrusion to ruler 14 and lead to ruler 14 to produce the damage as far as possible.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The utility model provides an automatic compression fittings of circuit board processing, includes operation platform (1), bed die (3), L type connecting plate (11), pneumatic cylinder two (12), connecting plate (13), control panel (15), screw two (23) and last mould (22), its characterized in that: the clamping grooves are formed in the inner side walls of the two sides of the operation platform (1), the first fixing plate (4) is connected to the inner surface of the first clamping groove of the operation platform (1) in a sliding mode, the second L-shaped connecting plate (26) is welded to the upper surface of the first fixing plate (4), the clamping grooves are formed in the inner side walls of the two sides of the inner side of the lower die (3), the movable baffle (30) is connected to the inner surface of the clamping groove of the lower die (3) in a sliding mode, threaded holes are formed in the lower surface of the movable baffle (30), the first screw (20) is connected to the inner threads of the movable baffle (30), the second supporting plate (28) is connected to the outer threads of the first screw (20), the lower surface of the second supporting plate (28) is welded to the upper surface of one side, away from the first fixing plate (4), of the second L-shaped connecting plate (26), and the output end of the control panel (15) is electrically connected with the access end of the second hydraulic cylinder (12);
the clamping groove is formed in the inner side wall of the L-shaped connecting plate (11), a first sliding block (17) is connected to the inner surface of the clamping groove of the L-shaped connecting plate (11) in a sliding mode, a first electric telescopic rod (16) is welded to the top of the inner wall of the clamping groove of the L-shaped connecting plate (11), the output end of the first electric telescopic rod (16) is welded to the upper surface of the first sliding block (17), a second electric telescopic rod (18) is welded to one side, far away from the L-shaped connecting plate (11), of the first sliding block (17), a movable plate (27) is welded to the output end of the second electric telescopic rod (18), and the output end of the control panel (15) is electrically connected with the first electric telescopic rod (16) and the access end of the second electric telescopic rod (18).
2. An automated bonding apparatus for circuit board processing as defined in claim 1, wherein: two sets of screw holes have been seted up to the upper surface inside of operation platform (1), just the internal thread of two sets of screw holes of operation platform (1) all is connected with screw rod (8), two sets of screw rod (8) are close to one end of L type connecting plate (11) all welds backup pad one (24), and two sets of backup pad one (24) all are located the just lower extreme of connecting plate (13).
3. An automated bonding apparatus for circuit board processing as defined in claim 1, wherein: four groups of universal wheels (2) are welded on the lower surface of the operating platform (1).
4. An automated bonding apparatus for circuit board processing as defined in claim 2, wherein: the upper surface of the first supporting plate (24) is stuck with a protective pad (21).
5. An automated bonding apparatus for circuit board processing as defined in claim 1, wherein: two groups of clamping grooves II are formed in the upper surface of the operation platform (1), sliding blocks II (29) are connected to the inner surfaces of the two groups of clamping grooves II of the operation platform (1) in a sliding mode, and a ruler (14) is adhered to the upper surface of the sliding blocks II (29).
6. An automated bonding apparatus for circuit board processing as defined in claim 1, wherein: one side of the operation platform (1) is welded with a second fixing plate (10), and the upper surface of the second fixing plate (10) is welded with a collecting box (9).
7. An automated bonding apparatus for circuit board processing as defined in claim 1, wherein: the hydraulic cylinder I (6) is welded on the inner side walls of the two sides of the operation platform (1), the fixing blocks (5) are welded on the upper surfaces of the hydraulic cylinder I (6), the output ends of the fixing blocks (5) are abutted to the upper surface of the fixing plate I (4), and the output ends of the control panel (15) are electrically connected with the access ends of the hydraulic cylinder I (6).
8. An automated bonding apparatus for circuit board processing as defined in claim 2, wherein: one end of the screw rod (8) far away from the first supporting plate (24) is welded with a handle (7).
9. An automated bonding apparatus for circuit board processing as defined in claim 2, wherein: threaded holes are formed in the upper surfaces of the first support plates (24), bolts (25) are connected to the internal threads of the first support plates (24), and the external threads of the bolts (25) penetrate through the first support plates (24) to be connected to the inside of the upper surface of the operating platform (1).
10. An automated bonding apparatus for circuit board processing as defined in claim 1, wherein: and a protection plate (19) is welded on one side of the operation platform (1) far away from the first electric telescopic rod (16).
CN202210767846.2A 2022-06-30 2022-06-30 Automatic pressing device for circuit board processing Active CN115038265B (en)

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Application Number Priority Date Filing Date Title
CN202210767846.2A CN115038265B (en) 2022-06-30 2022-06-30 Automatic pressing device for circuit board processing

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CN115038265A CN115038265A (en) 2022-09-09
CN115038265B true CN115038265B (en) 2024-02-02

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Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000102882A (en) * 1998-09-30 2000-04-11 Matsushita Electric Ind Co Ltd Device and method for compression bonding
JP2006073808A (en) * 2004-09-02 2006-03-16 Fujitsu I-Network Systems Ltd Connector press fit unit for printed wiring board
CN207011109U (en) * 2017-07-27 2018-02-13 奥士康科技股份有限公司 A kind of press fit device of full-automatic pcb board internal layer circuit plate
CN108946277A (en) * 2018-08-26 2018-12-07 惠州市新视觉实业有限公司 Circuit board feeding device and its circuit board rubberizing equipment
JP2020009987A (en) * 2018-07-12 2020-01-16 株式会社荏原製作所 Substrate transfer device and substrate processing apparatus including substrate transfer device
CN111343787A (en) * 2020-03-05 2020-06-26 许昌学院 A compression fittings for circuit board production
CN211880726U (en) * 2020-01-13 2020-11-06 李家保 PCB circuit board folding device
CN212183833U (en) * 2020-07-09 2020-12-18 武汉倍普科技有限公司 Automatic feeding device for pressing printed circuit board
CN213462504U (en) * 2020-10-27 2021-06-15 广州泰华多层电路股份有限公司 Adjustable printed circuit board processing device
CN213485277U (en) * 2020-12-20 2021-06-18 孙宁 A compression fittings for circuit board processing
CN113068330A (en) * 2021-03-20 2021-07-02 福建闽威科技股份有限公司 Accurate two-sided printed wiring board processing is with compression fittings
CN214125654U (en) * 2021-01-21 2021-09-03 温州市永利电子有限公司 PCB circuit board folding device with mechanism of rectifying
CN214481563U (en) * 2021-01-29 2021-10-22 深圳市精美诚电路科技有限公司 Multilayer circuit board compression fittings
CN214627539U (en) * 2021-04-28 2021-11-05 江西科纳科技有限公司 Multilayer circuit board compression fittings
CN214960312U (en) * 2021-04-06 2021-11-30 上海莱翱电子科技有限公司 Novel press-fit device for printed circuit board and reinforcing plate
CN215581966U (en) * 2021-04-25 2022-01-18 奥士康科技股份有限公司 Positioner is used in production of PCB pressfitting folded sheet
CN215999307U (en) * 2021-11-04 2022-03-11 王悦冰 Welding equipment for electrical engineering and automation thereof
CN114173480A (en) * 2021-11-15 2022-03-11 龙南骏亚电子科技有限公司 PP (polypropylene) dust-removing type cutting and temporary storage equipment for circuit board pressing automatic laminated board line
CN114269078A (en) * 2021-12-28 2022-04-01 深圳市深合达电子有限公司 A pressfitting machine for printed circuit board production
TWM627329U (en) * 2021-12-24 2022-05-21 捷凌股份有限公司 Inspection structure of electronic device
CN114615832A (en) * 2022-03-11 2022-06-10 周剑斌 Forming equipment for producing high-frequency high-speed multilayer circuit board and implementation method thereof
CN216721678U (en) * 2021-06-08 2022-06-10 杭州华宇智迅科技有限公司 Press fitting device is used in processing of PCB circuit board
CN216830643U (en) * 2021-11-19 2022-06-28 付文博 Electronic mechanical equipment assembling platform

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000102882A (en) * 1998-09-30 2000-04-11 Matsushita Electric Ind Co Ltd Device and method for compression bonding
JP2006073808A (en) * 2004-09-02 2006-03-16 Fujitsu I-Network Systems Ltd Connector press fit unit for printed wiring board
CN207011109U (en) * 2017-07-27 2018-02-13 奥士康科技股份有限公司 A kind of press fit device of full-automatic pcb board internal layer circuit plate
JP2020009987A (en) * 2018-07-12 2020-01-16 株式会社荏原製作所 Substrate transfer device and substrate processing apparatus including substrate transfer device
CN108946277A (en) * 2018-08-26 2018-12-07 惠州市新视觉实业有限公司 Circuit board feeding device and its circuit board rubberizing equipment
CN211880726U (en) * 2020-01-13 2020-11-06 李家保 PCB circuit board folding device
CN111343787A (en) * 2020-03-05 2020-06-26 许昌学院 A compression fittings for circuit board production
CN212183833U (en) * 2020-07-09 2020-12-18 武汉倍普科技有限公司 Automatic feeding device for pressing printed circuit board
CN213462504U (en) * 2020-10-27 2021-06-15 广州泰华多层电路股份有限公司 Adjustable printed circuit board processing device
CN213485277U (en) * 2020-12-20 2021-06-18 孙宁 A compression fittings for circuit board processing
CN214125654U (en) * 2021-01-21 2021-09-03 温州市永利电子有限公司 PCB circuit board folding device with mechanism of rectifying
CN214481563U (en) * 2021-01-29 2021-10-22 深圳市精美诚电路科技有限公司 Multilayer circuit board compression fittings
CN113068330A (en) * 2021-03-20 2021-07-02 福建闽威科技股份有限公司 Accurate two-sided printed wiring board processing is with compression fittings
CN214960312U (en) * 2021-04-06 2021-11-30 上海莱翱电子科技有限公司 Novel press-fit device for printed circuit board and reinforcing plate
CN215581966U (en) * 2021-04-25 2022-01-18 奥士康科技股份有限公司 Positioner is used in production of PCB pressfitting folded sheet
CN214627539U (en) * 2021-04-28 2021-11-05 江西科纳科技有限公司 Multilayer circuit board compression fittings
CN216721678U (en) * 2021-06-08 2022-06-10 杭州华宇智迅科技有限公司 Press fitting device is used in processing of PCB circuit board
CN215999307U (en) * 2021-11-04 2022-03-11 王悦冰 Welding equipment for electrical engineering and automation thereof
CN114173480A (en) * 2021-11-15 2022-03-11 龙南骏亚电子科技有限公司 PP (polypropylene) dust-removing type cutting and temporary storage equipment for circuit board pressing automatic laminated board line
CN216830643U (en) * 2021-11-19 2022-06-28 付文博 Electronic mechanical equipment assembling platform
TWM627329U (en) * 2021-12-24 2022-05-21 捷凌股份有限公司 Inspection structure of electronic device
CN114269078A (en) * 2021-12-28 2022-04-01 深圳市深合达电子有限公司 A pressfitting machine for printed circuit board production
CN114615832A (en) * 2022-03-11 2022-06-10 周剑斌 Forming equipment for producing high-frequency high-speed multilayer circuit board and implementation method thereof

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