CN115036235A - Chip cleaning, circulating, overturning and material pouring system - Google Patents
Chip cleaning, circulating, overturning and material pouring system Download PDFInfo
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- CN115036235A CN115036235A CN202210128584.5A CN202210128584A CN115036235A CN 115036235 A CN115036235 A CN 115036235A CN 202210128584 A CN202210128584 A CN 202210128584A CN 115036235 A CN115036235 A CN 115036235A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Cleaning In General (AREA)
Abstract
The invention discloses a chip cleaning, circulating, overturning and material pouring system, which comprises: a fixed seat; the washing tanks are transversely arranged and are fixed in the inner part of the upper end surface of the fixed seat in an embedded manner; the connecting frame is transversely erected on one side of the upper end face of the fixed seat; the transmission positioning frame bodies are arranged in a plurality of groups, and each transmission positioning frame body can be arranged below the connecting frame in a relatively sliding manner; the circulating turnover assemblies are transversely arranged and are fixed below the conveying positioning frame body, and are used for clamping and positioning the edges of the chips and circularly turning over the chips in cleaning; and the high-frequency swing assemblies are arranged in one-to-one correspondence to the circulating turnover assemblies, and can provide horizontal reciprocating displacement motion in chip cleaning so as to facilitate inertial separation of impurities adhered to the surfaces of the chips.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a chip cleaning, circulating, overturning and material pouring system.
Background
After the production of the wafer is finished, the chip products need to be transferred from the plastic tray to the metal tray with the upper cover before entering the cleaning machine for protecting the products, and the chip products need to be transferred from the metal tray to the plastic tray after the cleaning and drying are finished. At present, the most common method is to adopt a vacuum chuck to suck the chip and then transfer and place the chip. However, in the cleaning of chips with different specifications and sizes, the negative pressure adsorption effect of the vacuum chuck is relatively low, the falling risk is easy to exist, and the chuck jig needs to be replaced manually, so that the efficiency is low; in particular, in the cleaning process, the chip still needs to be inverted in a circulating manner to ensure that the impurities on the surface of the chip can be completely separated, and the contact area between the vacuum chuck and the chip is large, so that the complete cleaning effect cannot be achieved.
Therefore, a chip cleaning cycle flip-flop system is provided by those skilled in the art to solve the above problems in the background art.
Disclosure of Invention
In order to achieve the purpose, the invention provides the following technical scheme: a chip cleaning circulation upset system of falling material, it includes:
a fixed seat;
the washing tanks are transversely arranged and are fixed in the inner part of the upper end surface of the fixed seat in an embedded manner;
the connecting frame is transversely erected on one side of the upper end face of the fixed seat;
the transmission positioning frame bodies are arranged in multiple groups, and each transmission positioning frame body can be arranged below the connecting frame in a relatively sliding manner;
the circulating turnover assemblies are transversely arranged and are fixed below the conveying positioning frame body, and are used for clamping and positioning the edges of the chips and circularly turning the chips during cleaning; and
the high-frequency swing assemblies are arranged in one-to-one correspondence with the circulating turnover assemblies and can provide horizontal reciprocating displacement motion in chip cleaning so that impurities adhered to the surfaces of the chips are separated from the chips through inertia.
Further, as a preferred option, the transmission positioning frame body includes:
the inner screw rod is transversely arranged below the connecting frame in a relatively rotatable manner;
the driving motor is arranged on one side of the connecting frame, and the output end of the driving motor is connected and fixed with one end of the inner screw rod;
the guide seat is arranged on the inner screw rod in a sliding manner through a thread meshing effect; and
and the bearing frame is transversely fixed below the guide seat.
Further, preferably, the high-frequency oscillating assembly includes:
a support frame;
the guide rod is transversely fixed on the lower end surface of the support frame;
the driving seat is arranged on the guide rod in a relatively sliding manner, outer brackets are transversely fixed on the driving seat, and two ends of the circulating overturning assembly are transversely erected between the outer brackets;
the main wheel piece is arranged on one side of the supporting frame in a relatively rotating mode, and a linkage rod is hinged to the main wheel piece;
the supporting spring is transversely fixed on one side of the driving seat, and the other end of the supporting spring is connected with the linkage rod; and
and the reset spring is transversely connected with the other side of the driving seat, and the other end of the reset spring is connected and fixed with the supporting frame.
Further, preferably, the circulation reversing assembly comprises:
the outer supports are symmetrically arranged left and right, and each outer support is fixed below the high-frequency swing assembly;
the rotating shaft piece is arranged on the outer support in a relatively rotating manner through a bearing and is driven to rotate by a micro motor arranged on the outer support;
the telescopic guide frame is transversely fixed at one end of the rotating shaft piece and is constructed into a two-section type telescopic supporting rod structure; and
the adaptive clamping devices are arranged in a plurality and correspondingly fixed at one end of each telescopic guide frame, and are used for limiting and clamping the edge parts of the chips.
Further, preferably, the fitting jig device includes:
fixing the body member;
hinge shaft brackets arranged inside the fixed trunk, wherein each hinge shaft bracket is constructed into a two-section type foldable structure;
the outer expanding plate is connected to one end of the hinge shaft frame;
the electric telescopic rod is transversely fixed inside the fixed body part, and the output end of the electric telescopic rod is connected with the outer expansion plate; and
the anti-skidding membrane piece, the laminating sets up keep away from on the outer board that expands one side of electric telescopic handle, the anti-skidding membrane piece is used for carrying out the anti-skidding clamp to the chip and protects.
Further, as a preferred option, the outer expanding plate is made of a high elastic compression plastic material, and the cross section of the outer expanding plate is configured into an arc-shaped structure.
Further, preferably, the anti-slip film member includes:
an inflatable air bag;
the exhaust pipe is communicated with one end of the inflatable air bag;
the internal connecting pipe is coaxially arranged in the exhaust pipe, one end of the internal connecting pipe extends into the inflatable air bag and is positioned at the other side of the inflatable air bag, and the other ends of the internal connecting pipe and the exhaust pipe are communicated with an external air pump; and
and the flow control pieces are symmetrically fixed at two sides of the interior of the inflatable air bag and divide the inflatable air bag into three sections of air pressure cavities.
Further, preferably, the flow control member is provided with an air pressure hole, and the air pressure hole can introduce air flow at two ends into the middle of the inflatable air bag after the pressure at the two ends of the inflatable air bag reaches a threshold value.
Compared with the prior art, the invention has the beneficial effects that:
in the invention, a plurality of cleaning tanks are arranged in a fixed seat, a circular overturning assembly is arranged at the upper end of the fixed seat in a sliding frame, each circular overturning assembly can clamp and position the edge of a chip, the chip is immersed into each cleaning tank one by one, and the chip is circularly overturned in the cleaning process, so that the high-efficiency cleaning effect is achieved; the high-frequency swinging assembly can provide a transverse reciprocating swinging effect when the chip is cleaned so that impurities adhered to the surface of the chip can be separated from the chip in an inertial manner; especially still be provided with adaptation clamping device, adaptation clamping device can correspond the adjustment according to chip specification size, prevents that the chip from producing the phenomenon that drops in wasing, still is provided with anti-skidding membrane spare simultaneously for border is spacing about the chip, especially can effectively avoid the chip landing in the upset is washd.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic structural view of a transmission positioning frame of the present invention;
FIG. 3 is a schematic diagram of a high frequency swing assembly according to the present invention;
FIG. 4 is a schematic structural diagram of a cyclical turnover assembly of the present invention;
FIG. 5 is a schematic view of an adaptive clamping device according to the present invention;
FIG. 6 is a schematic structural view of the anti-slip film member according to the present invention;
in the figure: the device comprises a fixed seat 1, a cleaning tank 11, a connecting frame 2, a transmission positioning frame body 3, a bearing frame 31, an internal screw rod 32, a driving motor 33, a guide seat 34, a high-frequency swinging assembly 4, a support frame 41, a guide rod 42, a driving seat 43, a main wheel element 44, an external support 45, a support spring 46, a return spring 47, a circulating turnover assembly 5, an external support 51, a rotating shaft element 52, a telescopic guide frame 53, an adaptive clamping device 6, a fixed body element 61, a hinged shaft frame 62, an electric telescopic rod 63, an external expansion plate 64, an antiskid membrane element 7, an inflatable airbag 71, an exhaust pipe 72, an internal connecting pipe 73 and a flow control element 74.
Detailed Description
Referring to fig. 1, in an embodiment of the present invention, a system for cleaning, circulating, turning and discharging a chip includes:
a fixed seat 1;
a plurality of cleaning tanks 11 which are arranged transversely, wherein each cleaning tank 11 is embedded and fixed in the inner part of the upper end surface of the fixed seat;
the connecting frame 2 is transversely erected on one side of the upper end face of the fixed seat 1;
the transmission positioning frame bodies 3 are arranged in a plurality of groups, and each transmission positioning frame body 3 is arranged below the connecting frame 2 in a relatively sliding manner;
the circulating turnover assemblies 5 are arranged transversely, and each circulating turnover assembly 5 is fixed below the conveying positioning frame body 3 and used for clamping and positioning the edge of the chip and circularly turning over the chip in cleaning; and
high frequency swing subassembly 4, with each 5 one-to-one settings of circulation upset subassembly, high frequency swing subassembly 4 can provide horizontal reciprocating displacement motion in the chip washs to chip surface adhesion impurity inertia breaks away from, and wherein each washing tank can provide the cleaning performance of different degree to the chip, can carry out the multifrequency adjustment by circulation upset subassembly cooperation high frequency swing subassembly simultaneously.
In this embodiment, the transmission positioning frame body 3 includes:
an inner screw 32 which is transversely arranged below the connecting frame 2 in a relatively rotatable manner;
the driving motor 33 is installed at one side of the connecting frame 2, and the output end of the driving motor 33 is connected and fixed with one end of the inner screw 32;
a guide seat 34 slidably disposed on the inner screw 32 by a screw engagement; and
and the bearing frame 31 is transversely fixed below the guide seat 34 so as to drive each circulating turnover assembly to transversely displace.
As a preferred embodiment, the high frequency oscillating assembly 4 comprises:
a support frame 41;
a guide bar 42 fixed transversely to the lower end surface of the support frame 41;
the driving seat 43 is arranged on the guide rod 42 in a relatively sliding way, an outer bracket 45 is transversely fixed on the driving seat 43, and two ends of the circulating overturning assembly 5 are transversely arranged between the outer brackets 45 in an overhead way;
the main wheel piece 44 is arranged on one side of the supporting frame 41 in a relatively rotatable manner, and a linkage rod is hinged on the main wheel piece 44;
the supporting spring 46 is transversely fixed on one side of the driving seat 43, and the other end of the supporting spring 46 is connected with the linkage rod; and
the return spring 47 is transversely connected to the other side of the driving seat 43, the other end of the return spring 47 is connected and fixed with the supporting frame 41, and particularly in cleaning with certain strength, along with the increase of the rotating speed of the main wheel part, the compression or stretching degrees of the supporting spring and the return spring are increased, so that the swing amplitude is adjusted, and the chips with different specifications can be adjusted.
In this embodiment, the circulation reversing assembly 5 includes:
the number of the outer supports 51 is two, and the two outer supports 51 are arranged in bilateral symmetry, and each outer support 51 is fixed below the high-frequency swing assembly 4;
a rotating shaft member 52, which is relatively rotatably disposed on the outer support 51 through a bearing and is driven to rotate by a micro motor (not shown) disposed on the outer support 51;
a telescopic guide 53 transversely fixed at one end of the rotating shaft member 52, the telescopic guide 53 being constructed in a two-section telescopic strut structure; and
the adaptive clamping devices 6 are arranged in a plurality and correspondingly fixed at one end of each telescopic guide frame 53, and the adaptive clamping devices 6 are used for limiting and clamping the edge parts of the chips.
In this embodiment, the adaptive clamping device 6 includes:
a fixed body member 61;
hinge brackets 62 provided inside the fixed torso member 61, each hinge bracket 62 being constructed in a two-stage foldable structure;
an outer expanding plate 64 connected to one end of the hinge bracket 62;
the electric telescopic rod 63 is transversely fixed inside the fixed body part 61, and the output end of the electric telescopic rod 63 is connected with the external expansion plate 64; and
In this embodiment, the outward-expanding plate 65 is made of a high elastic compression plastic material, and the cross section of the outward-expanding plate 65 is configured into an arc-shaped structure.
As a preferred embodiment, the anti-slip film member 7 includes:
an inflatable air bag 71;
an exhaust pipe 72 communicating with one end of the inflatable air bag 71;
the internal connecting pipe 73 is coaxially arranged in the exhaust pipe 72, one end of the internal connecting pipe 73 extends into the inflatable air bag 71 and is positioned at the other side of the inflatable air bag 71, and the other ends of the internal connecting pipe 73 and the exhaust pipe 72 are both communicated with an external air pump (not shown in the figure); and
and the flow control pieces 74 are symmetrically fixed at two sides of the interior of the inflatable air bag 71 and divide the inflatable air bag 71 into three sections of air pressure cavities.
In this embodiment, the flow control member 74 is provided with an air pressure hole, the air pressure hole can introduce air flow at two ends into the middle of the inflatable airbag 71 after the pressure at two ends of the inflatable airbag 71 reaches a threshold value, specifically, in the primary clamping of the chip, at this time, the inner connecting tube can supply air to the lower end of the inflatable airbag, and after the lower end of the inflatable airbag expands and contracts to a certain extent, the flow control member transmits pressurized air to the middle of the inflatable airbag, the middle of the inflatable airbag is elastically pressed and fixed in contact with the chip, and then the exhaust tube supplies air to the upper end of the inflatable airbag, so as to realize the limit clamping protection of the chip, especially when the chip is swung and cleaned, the inflatable airbag at one side can be elastically pressed and protected by the chip, and simultaneously the pressurized air at the middle of the inflatable airbag is transmitted in a pressurized manner at two sides, and the inflatable airbag at the other side can transmit air from the end to the middle, the chip is prevented from sliding down; particularly, the contact area with the chip is small in chip cleaning, and a certain protection effect is achieved.
Specifically, in the upset of chip washing circulation is fallen the material, each chip can be fixed a position the centre gripping by adaptation clamping device, and at this moment, transmission location support body drive displacement to each washing tank top is with the chip dip each washing tank in one by one, and the high frequency swing subassembly provides the horizontal reciprocal swing effect simultaneously to the impurity inertia of chip surface adhesion breaks away from, and micro motor can rotary drive adaptation clamping device, thereby realizes that the circulation upset is fallen the material, high cleaning effect.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent substitutions or changes according to the technical solution and the inventive concept of the present invention should be covered by the scope of the present invention.
Claims (8)
1. The utility model provides a chip washs circulation upset system of falling material which characterized in that: it comprises the following steps:
a fixed seat 1;
a plurality of cleaning tanks 11 which are arranged transversely, wherein each cleaning tank 11 is embedded and fixed in the inner part of the upper end surface of the fixed seat;
the connecting frame 2 is transversely erected on one side of the upper end face of the fixed seat 1;
the conveying positioning frame bodies 3 are arranged in a plurality of groups, and each conveying positioning frame body 3 can be arranged below the connecting frame 2 in a relatively sliding manner;
the circulating turnover assemblies 5 are arranged transversely, and each circulating turnover assembly 5 is fixed below the conveying positioning frame body 3 and used for clamping and positioning the edge of the chip and circularly turning over the chip in cleaning; and
the high-frequency swing assemblies 4 are arranged in one-to-one correspondence to the circulating turnover assemblies 5, and the high-frequency swing assemblies 4 can provide horizontal reciprocating displacement motion in chip cleaning so that impurities adhered to the surfaces of the chips can be separated from the chips in an inertial mode.
2. The chip cleaning cycle turning and dumping system of claim 1, further comprising: the transmission positioning frame body 3 includes:
an inner screw 32 which is transversely arranged below the connecting frame 2 in a relatively rotatable manner;
the driving motor 33 is installed at one side of the connecting frame 2, and the output end of the driving motor 33 is connected and fixed with one end of the inner screw 32;
a guide seat 34 slidably disposed on the inner screw 32 by a screw engagement; and
and the bearing frame 31 is transversely fixed below the guide seat 34.
3. The system of claim 1, wherein the system comprises: the high-frequency oscillating assembly 4 comprises:
a support frame 41;
a guide bar 42 fixed transversely to the lower end surface of the support frame 41;
the driving seat 43 is arranged on the guide rod 42 in a relatively sliding way, an outer bracket 45 is transversely fixed on the driving seat 43, and two ends of the circulating overturning assembly 5 are transversely arranged between the outer brackets 45 in an overhead way;
the main wheel piece 44 is arranged on one side of the supporting frame 41 in a relatively rotatable manner, and a linkage rod is hinged on the main wheel piece 44;
the supporting spring 46 is transversely fixed on one side of the driving seat 43, and the other end of the supporting spring 46 is connected with the linkage rod; and
and the return spring 47 is transversely connected and arranged on the other side of the driving seat 43, and the other end of the return spring 47 is connected and fixed with the supporting frame 41.
4. The chip cleaning cycle turning and dumping system of claim 1, further comprising: the circulation overturning assembly 5 comprises:
the number of the outer supports 51 is two, and the two outer supports 51 are arranged in bilateral symmetry, and each outer support 51 is fixed below the high-frequency swing assembly 4;
a rotating shaft 52 which is relatively rotatably arranged on the outer support 51 through a bearing and is driven to rotate by a micro motor arranged on the outer support 51;
a telescopic guide 53 transversely fixed at one end of the rotating shaft member 52, the telescopic guide 53 being constructed in a two-section telescopic strut structure; and
the adaptive clamping devices 6 are arranged in a plurality and correspondingly fixed at one end of each telescopic guide frame 53, and the adaptive clamping devices 6 are used for limiting and clamping the edge parts of the chips.
5. The chip cleaning cycle turning and dumping system of claim 4, wherein: the fitting holding device 6 includes:
a fixed body member 61;
hinge brackets 62 provided inside the fixed torso member 61, each hinge bracket 62 being constructed in a two-stage foldable structure;
an outward expansion plate 64 connected to one end of the hinge bracket 62;
the electric telescopic rod 63 is transversely fixed inside the fixed body part 61, and the output end of the electric telescopic rod 63 is connected with the external expansion plate 64; and
and the anti-skidding membrane part 7 is attached to the outer expansion plate 64 and is far away from one side of the electric telescopic rod 63, and the anti-skidding membrane part 7 is used for carrying out anti-skidding clamping protection on the chip.
6. The chip cleaning cycle turning and dumping system of claim 5, wherein: expand board 65 outward and adopt high elastic pressure plasticity material, just expand the cross section of board 65 outward and be constructed into the arc structure.
7. The chip cleaning cycle turning and dumping system of claim 5, wherein: the anti-slip film member 7 includes:
an inflatable air bag 71;
an exhaust pipe 72 communicating with one end of the inflatable air bag 71;
the internal connecting pipe 73 is coaxially arranged in the exhaust pipe 72, one end of the internal connecting pipe 73 extends into the inflatable air bag 71 and is positioned at the other side of the inflatable air bag 71, and the other ends of the internal connecting pipe 73 and the exhaust pipe 72 are both communicated with an external air pump; and
and the flow control pieces 74 are symmetrically fixed at two sides of the interior of the inflatable air bag 71 and divide the inflatable air bag 71 into three sections of air pressure cavities.
8. The chip cleaning cycle turning and dumping system of claim 7, further comprising: the flow control member 74 is provided with an air pressure hole, and the air pressure hole can introduce air flow at two ends into the middle of the inflatable air bag 71 after the pressure at two ends of the inflatable air bag 71 reaches a threshold value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210128584.5A CN115036235A (en) | 2022-02-11 | 2022-02-11 | Chip cleaning, circulating, overturning and material pouring system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210128584.5A CN115036235A (en) | 2022-02-11 | 2022-02-11 | Chip cleaning, circulating, overturning and material pouring system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115036235A true CN115036235A (en) | 2022-09-09 |
Family
ID=83120067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210128584.5A Withdrawn CN115036235A (en) | 2022-02-11 | 2022-02-11 | Chip cleaning, circulating, overturning and material pouring system |
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| CN (1) | CN115036235A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11942356B2 (en) * | 2020-10-20 | 2024-03-26 | Semsysco Gmbh | Clipping mechanism for fastening a substrate for a surface treatment of the substrate |
-
2022
- 2022-02-11 CN CN202210128584.5A patent/CN115036235A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11942356B2 (en) * | 2020-10-20 | 2024-03-26 | Semsysco Gmbh | Clipping mechanism for fastening a substrate for a surface treatment of the substrate |
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Application publication date: 20220909 |
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