CN115032820A - Electro-optical modulator assembly and assembling method thereof - Google Patents

Abstract

The invention discloses an electro-optical modulator assembly and an assembling method thereof, wherein a focusing lens, a modulator chip and an optical fiber are integrated together, the spatial positions among a light source, a collimating lens and the focusing lens are only needed to be considered when the electro-optical modulator assembly is used, and the relative positions among the focusing lens, the optical waveguide and the optical fiber are not needed to be adjusted, so that the coupling efficiency between the optical waveguide and the light source is greatly improved, the module is small in volume after being integrated, can be integrally packaged, and is suitable for popularization and application in the technical field of communication.

Description

Electro-optical modulator assembly and assembling method thereof

Technical Field

The invention relates to the technical field of optical communication and optical interconnection light emitting module integration, in particular to an electro-optical modulator assembly and an assembling method thereof.

Background

The trend of high-speed integration of the light emitting module in the optical communication system puts high requirements on the process of each high-speed electro-optical device and the integration of each device, wherein the key points are the high-efficiency coupling of the emitting light source and the electro-optical modulator and the matching degree of the light spot and the module spot of the two light spots. At present, most of adopted light sources are DFB 1550nm light sources, which is mainly because the DFB 1550nm light sources have better linear polarization characteristics and the wavelength is suitable for communication bands. The electro-optic modulator is a receive signal device.

In the prior art, an integrated module has two coupling modes, namely optical fiber coupling and space coupling.

The optical fiber coupling mode adopts the input end of a modulator to couple optical fibers and receives the light of the DFB light source passing through the collimating lens. The method increases the whole volume of the integrated module device and increases the high transmission loss of the system radio frequency transmission signal.

The space coupling mode adopts the input end of the modulator to couple the proper focusing lens to receive the light of the DFB light source passing through the collimating lens, and the method can reduce the whole volume of the system integration module and reduce the high transmission loss of the radio frequency transmission signal of the transmission cable. Before use, the three-dimensional adjusting frame is used for adjusting the focusing lens, the modulator chip, the optical fiber and the like to determine the relative positions of the focusing lens, the modulator chip, the optical fiber and the like. And after the test is finished, the focusing lens, the modulator chip, the optical fiber and the like are taken down from the three-dimensional adjusting frame. In practical application, because the relative positions of the focusing lens, the modulator chip and the optical fiber cannot be fixed, the coupling efficiency, the system stability and the reliability of each device of the system module are limited, and the application and the popularization of the integrated module are not facilitated.

In view of the above, it is desirable to provide an electro-optic modulator assembly and an assembly method thereof that can improve coupling efficiency and provide a stable and reliable system.

Disclosure of Invention

The present invention is directed to overcome the disadvantages of the prior art and to provide an electro-optic modulator assembly and method for assembling the same that improves coupling efficiency and provides a stable and reliable system.

The technical scheme of the invention provides an electro-optical modulator assembly, which comprises a modulator chip with an optical waveguide, a substrate with a positioning groove, a focusing lens, a positioning shaft part and an optical fiber;

the positioning groove is arranged on the top surface of the substrate and extends along the length direction of the substrate;

the modulator chip comprises a first chip end and a second chip end which are oppositely arranged, wherein the end face of the second chip end is a second end inclined plane, the waveguide incident end of the optical waveguide is positioned in the first chip end, and the waveguide emergent end of the optical waveguide is positioned in the second chip end;

the end surface of the fixed shaft part facing to the second end inclined surface side is a fixed shaft part inclined surface which is parallel to the second end inclined surface, and a fixed shaft part through hole is formed in the fixed shaft part;

the modulator chip is fixedly installed in the positioning groove, wherein a first end of the chip is located in the positioning groove, and a second end of the chip extends out of the outer side of the positioning groove;

one end of the optical fiber is bonded in the through hole of the dead axle part, the inclined plane of the dead axle part is bonded with the inclined plane of the second end, and the optical fiber is coupled with the emergent end of the waveguide;

the focusing lens is installed on one side of the first end of the chip and coupled with the waveguide incident end.

In one optional technical solution, before the inclined surface of the fixed shaft part is bonded with the inclined surface of the second end, the fixed shaft part is adjusted to couple the optical fiber and the waveguide exit end;

when the output power of the waveguide incident end is maximum, the fixed shaft part is positioned, and the inclined surface of the fixed shaft part is bonded with the inclined surface of the second end.

In an optional technical scheme, the included angle between the second end inclined surface and the positioning groove is 70-85 degrees.

In an optional technical solution, an end surface of a first end of the chip is a first end straight surface, and the first end straight surface is perpendicular to a length direction of the positioning groove;

the first end straight surface is flush with the notch at one end of the positioning groove, and the focusing lens is bonded with the first end straight surface.

In one optional solution, the waveguide incident end is aligned with an axis of the focusing lens.

In one optional technical scheme, the end surface of the first end of the chip is a first end inclined surface, and the first end inclined surface is parallel to the second end inclined surface;

the notch of the positioning groove is provided with a lens mounting groove, the first end inclined plane extends into the lens mounting groove, and the focusing lens is connected in the lens mounting groove.

In one optional technical scheme, before the focusing lens is connected in the lens mounting groove, the focusing lens and the substrate are adjusted to couple the focusing lens and the waveguide incident end;

wherein when the output power of the optical fiber is maximum, the focusing lens and the substrate are positioned, and the focusing lens is positioned in the lens mounting groove.

In one optional aspect, the focusing lens is bonded in the lens mounting groove.

The invention further provides a method for assembling an electro-optical modulator assembly according to any one of the preceding claims, comprising the steps of:

s01: connecting one end of the optical fiber to the fixed shaft part through hole of the fixed shaft part;

s02: mounting the modulator chip in the detent of the substrate with the chip first end in the detent and the chip second end extending out of the detent;

s03: bonding the dead axle portion slope of the dead axle portion to the second end slope of the chip second end and coupling the optical fiber to the waveguide exit end;

s04: and fixing the focusing lens, wherein the focusing lens is arranged on one side of the first end of the chip, and the focusing lens is coupled with the waveguide incident end.

In one optional technical solution, the step S03 further includes:

connecting one end of the optical fiber with a first light source, and connecting the incident end of the waveguide with a first optical power meter;

clamping and adjusting the fixed shaft part by adopting a first adjusting device, attaching the inclined plane of the fixed shaft part to the inclined plane of the second end, and preliminarily aligning the optical fiber with the waveguide emergent end;

applying a first preset bias voltage to the modulator chip;

finely adjusting the fixed shaft part through the first adjusting device until the display value of the first optical power meter reaches the maximum;

and bonding the inclined surface of the dead axle part with the inclined surface of the second end.

In an optional technical solution, an end surface of a first end of the chip is a first end straight surface, and the first end straight surface is perpendicular to a length direction of the positioning groove;

the step S02 further includes:

placing the first end straight surface to be flush with the notch at one end of the positioning groove;

the step S04 further includes:

the axis of the focusing lens is aligned with the waveguide incident end;

and bonding the focusing lens with the first end straight surface.

In an optional technical solution, an end surface of a first end of the chip is a first end inclined surface, and the first end inclined surface is parallel to the second end inclined surface;

a lens mounting groove is formed in the notch of the positioning groove;

the step S02 further includes:

the first end inclined plane extends into the lens mounting groove;

the step S04 further includes:

placing the focusing lens in the lens mounting groove;

arranging a second light source and a collimating lens on one side of the focusing lens far away from the first end inclined plane, wherein the collimating lens is used for enabling light emitted by the second light source to be emitted to the focusing lens in a parallel mode;

connecting the optical fiber with a second optical power meter;

clamping and adjusting the focusing lens by adopting a second adjusting device, clamping and adjusting the substrate by adopting a third adjusting device, and preliminarily aligning the focusing lens with the waveguide incident end;

applying a second preset bias voltage to the modulator chip;

fine-tuning the focusing lens through the second adjusting device and/or fine-tuning the substrate through the third adjusting device until the display value of the second optical power meter reaches the maximum;

and adhering the focusing lens in the lens mounting groove.

By adopting the technical scheme, the method has the following beneficial effects:

the invention provides an electro-optical modulator assembly and an assembling method thereof, wherein a focusing lens, a modulator chip and an optical fiber are integrated together to be used as one assembly, the spatial positions among a light source, a collimating lens and the assembly are only needed to be considered when the electro-optical modulator assembly is used, and the relative positions among the focusing lens, the modulator chip and the optical fiber are not needed to be adjusted, so that the coupling efficiency among an optical waveguide and the light source is greatly improved, wherein the light source and the collimating lens can be manufactured into another assembly, the two assemblies are aligned, coupled and fixed on the spatial positions, so that modules can be conveniently and efficiently integrated in batches, the modules are small in size after being integrated, high in stability and capable of being integrally packaged, and the electro-optical modulator assembly is suitable for popularization and application in the technical field of communication.

Drawings

The disclosure of the present invention will become more readily understood by reference to the drawings. It should be understood that: these drawings are for illustrative purposes only and are not intended to limit the scope of the present disclosure. In the figure:

FIG. 1 is a perspective view of an electro-optic modulator assembly provided in a first embodiment of the present invention;

FIG. 2 is a top view of the electro-optic modulator assembly shown in FIG. 1;

FIG. 3 is a schematic view of a modulator chip with an optical waveguide, a fixed axis portion, and an optical fiber integrated together in the electro-optic modulator assembly shown in FIG. 1;

FIG. 4 is a schematic diagram of a substrate in the electro-optic modulator assembly shown in FIG. 1;

FIG. 5 is a schematic view of a fixed shaft portion and an optical fiber integrated together;

FIG. 6 is a perspective view of an electro-optic modulator assembly provided in accordance with a second embodiment of the present invention;

FIG. 7 is a top view of the electro-optic modulator assembly shown in FIG. 6;

FIG. 8 is a schematic view of a substrate in the electro-optic modulator assembly shown in FIG. 6;

FIG. 9 is a schematic view of the modulator chip with optical waveguide, the fixed axis portion, and the optical fiber integrated together in the electro-optic modulator assembly shown in FIG. 6;

FIG. 10 is a schematic diagram of the focusing lens in the electro-optic modulator assembly of FIG. 6 coupled to the input end of a waveguide.

Detailed Description

The following further describes embodiments of the present invention with reference to the accompanying drawings. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

As shown in fig. 1-9, an electro-optic modulator assembly according to an embodiment of the present invention includes a modulator chip 2 having an optical waveguide 1, a substrate 3 having a positioning groove 31, a focusing lens 4, a centering portion 5, and an optical fiber 6.

The positioning groove 31 is provided on the top surface of the substrate 3, and the positioning groove 31 extends along the length direction of the substrate 3.

The modulator chip 2 includes a chip first end 21 and a chip second end 22, which are oppositely disposed, wherein an end surface of the chip second end 22 is a second end slope 221, the waveguide incident end 11 of the optical waveguide 1 is located in the chip first end 21, and the waveguide exit end 12 of the optical waveguide 1 is located in the chip second end 22.

The end surface of the fixed shaft portion 5 facing the second end inclined surface 221 is a fixed shaft portion inclined surface 51, the fixed shaft portion inclined surface 51 is parallel to the second end inclined surface 221, and the fixed shaft portion 5 has a fixed shaft portion through hole 52.

The modulator chip 2 is fixedly mounted in the positioning slot 31 with the chip first end 21 in the positioning slot 31 and the chip second end 22 protruding outside the positioning slot 31.

One end of the optical fiber 6 is bonded to the through hole 52 of the fixed shaft portion, the inclined surface 51 of the fixed shaft portion is bonded to the second end inclined surface 221, and the optical fiber 6 is coupled to the waveguide exit end 12.

The focusing lens 4 is mounted on one side of the first end 21 of the chip, and the focusing lens 4 is coupled to the waveguide incident end 11.

The electro-optic modulator assembly provided by the present invention integrates a modulator chip 2, a substrate 3, a focusing lens 4, a dead axle portion 5 and an optical fiber 6.

The modulator chip 2 may be a straight waveguide modulator, a Y-waveguide modulator, a lithium niobate thin film intensity modulator, an MZ-type intensity modulator, or other modulators. The modulator chip 2 has an optical waveguide 1 thereon.

The modulator chip 2 is in the form of a strip. One end of the modulator chip 2 is defined as a chip first end 21 and the other end of the modulator chip 2 is defined as a chip second end 22. The end surface of the second end 22 of the chip is a second end slope 221, which reduces back light reflection.

One end of the optical waveguide 1 is defined as a waveguide incident end 11, and the other end of the optical waveguide 1 is defined as a waveguide exit end 12. The waveguide entrance end 11 and the waveguide exit end 12 are both straight waveguides. The waveguide incident end 11 is located in the chip first end 21, and an end surface of the waveguide incident end 11 is located on an end surface of the chip first end 21. The waveguide exit end 12 is in the chip second end 22, and the end face of the waveguide exit end 12 is on the second end slope 221.

Two waveguides, specifically a first waveguide 13 and a second waveguide 14, are connected between the waveguide incident end 11 and the waveguide exit end 12. Bias electrodes 15 are respectively arranged on two sides of the first waveguide 13 and the second waveguide 14. When different bias voltages are applied to the bias electrodes 15 on both sides of the first waveguide 13 and the second waveguide 14, respectively, the refractive index of the waveguides changes, and finally the output optical power changes.

A positioning groove 31 is formed on the top surface of the substrate 3, and the positioning groove 31 extends along the length direction of the substrate 3 and penetrates the front and rear ends of the substrate 3. The positioning groove 31 has a cutout 32 in the middle thereof for allowing the user to easily place the modulator chip 2 in the positioning groove 31 or remove the modulator chip 2 from the positioning groove 31.

The focusing lens 4 is a convex lens. The fixed shaft portion 5 is a positioning block, an end surface of the fixed shaft portion 5 facing the second end inclined surface 221 side is a fixed shaft portion inclined surface 51, and an end surface of the fixed shaft portion 5 facing away from the second end inclined surface 221 side is a fixed shaft portion straight surface. The dead axle portion inclined surface 51 is parallel to the second end inclined surface 221. The fixed shaft portion 5 has a fixed shaft portion through hole 52, and the fixed shaft portion through hole 52 penetrates the fixed shaft portion straight surface and the fixed shaft portion inclined surface 51.

In assembly, one end of the optical fiber 6 is bonded to the through hole 52 of the fixed shaft. An adhesive layer is provided in the through hole 52 for bonding to the optical fiber 6.

The modulator chip 2 is then bonded in the positioning slot 31 with the first end 21 of the chip in the positioning slot 31 or flush with the notch at one end of the positioning slot 31 and the second end 22 of the chip extending outside the positioning slot 31. For further improvement of connection stability, the bonding layer is arranged in the positioning groove 31, the bottom of the bonding layer is in a horizontal plane rectangular shape, and when the modulator chip 2 is placed in the positioning groove 31, the bonding layer can be directly bonded and connected with the bonding layer, so that the glue dripping process is omitted.

Then the inclined surface 51 of the fixed shaft part is bonded with the inclined surface 221 of the second end, and the optical fiber 6 is coupled with the waveguide exit end 12, so that optical path propagation is realized. The inclined surface 51 of the fixed shaft part and/or the inclined surface 221 of the second end are/is provided with an adhesive layer, so that the adhesion between the inclined surface 51 of the fixed shaft part and the inclined surface 221 of the second end is realized.

Finally, the focusing lens 4 is installed on one side of the first end 21 of the chip, and the focusing lens 4 is coupled with the waveguide incident end 11, so that the optical path propagation is realized.

The focusing lens 4, the modulator chip 2 and the optical fiber 6, which are integrated together, are used as one assembly.

When the optical waveguide module is used, only the spatial positions among the light source, the collimating lens and the focusing lens 4 need to be considered, and the relative positions among the focusing lens 4, the modulator chip 2 and the optical fiber 6 do not need to be adjusted, so that the coupling efficiency between the optical waveguide 1 and the light source is greatly improved, the module is small in size after being integrated, can be integrally packaged, and is suitable for popularization and application in the technical field of communication.

In one embodiment, the stationary shaft portion 5 is adjusted to couple the optical fiber 6 with the waveguide exit end 12 before the stationary shaft portion ramp 51 is bonded to the second end ramp 221.

When the output power of the waveguide incident end 11 is maximum, the fixed shaft portion 5 is positioned, and the fixed shaft portion inclined surface 51 is bonded to the second end inclined surface 221.

In order to improve the coupling effect between the optical fiber 6 and the waveguide exit end 12, before the fixed-axis part slope 51 and the second end slope 221 are bonded, the following operation is adopted:

one end of the optical fiber 6 is connected to the first light source. The first light source may be a DFB light source.

The light of the first light source propagates via the optical fiber 6 to the waveguide entrance end 11.

The waveguide entrance end 11 is connected to a first optical power meter. The first optical power meter is used to monitor the output power of the waveguide entrance end 11. The fixed shaft portion 5 is held and adjusted by the first adjusting device 7. The first adjusting device 7 is an existing three-dimensional adjusting bracket. The dead-center slope 51 is attached to the second end slope 221, and the optical fiber 6 is preliminarily aligned with the waveguide exit end 12. The fixed shaft part 5, and therefore the optical fiber 6, is adjusted in position and angle by the first adjusting device 7, and the optical fiber 6 is aligned with the waveguide exit end 12.

A first preset bias voltage is applied to the bias electrode 15 in the modulator chip 2, and then the fixed shaft portion 5 is finely adjusted by the first adjusting device 7 until the display value of the first optical power meter reaches the maximum, which indicates that the coupling effect between the optical fiber 6 and the waveguide exit end 12 is best at this time, and the fixed shaft portion inclined surface 51 and the second end inclined surface 221 are adhered and fixed by glue.

In one embodiment, as shown in fig. 3 and 9, the angle between the second end slope 221 and the positioning groove 31 is between 70 ° and 85 °, and the angle between the second end slope 221 and the length direction of the positioning groove 31 is between 70 ° and 85 °, so that the light reflection preventing effect is good.

In one embodiment, as shown in fig. 1-3, the end surface of the first end 21 of the chip is a first end straight surface 211, and the first end straight surface 211 is perpendicular to the length direction of the positioning slot 31.

The first end straight surface 211 is flush with the notch at the end of the positioning groove 31, and the focusing lens 4 is bonded to the first end straight surface 211.

In this embodiment, one end of the first end 21 of the chip is a first end straight surface 211, and the other end thereof is a second end inclined surface 221. When the assembled modulator chip 2 is stuck in the positioning groove 31, the first end straight surface 211 is flush with the notch at the end of the positioning groove 31. When the focusing lens 4 is coupled with the waveguide incident end 11, the focusing lens 4 is directly bonded with the first end straight surface 211, and the focusing lens 4 is attached to the end part of the substrate 3, so that the assembly is convenient.

In one embodiment, as shown in fig. 2, when one end of the first end 21 of the chip is the first end straight surface 211, the coupling effect of the focusing lens 4 and the waveguide incident end 11 is the best when the waveguide incident end 11 is aligned with the axis of the focusing lens 4.

In one embodiment, as shown in fig. 6-9, the end surface of the first end 21 of the chip is a first end bevel 212, and the first end bevel 212 is parallel to the second end bevel 221.

The notch of the positioning groove 31 has a lens mounting groove 33, the first end slope 212 extends into the lens mounting groove 33, and the focus lens 4 is coupled in the lens mounting groove 33.

In this embodiment, one end of the first end 21 of the chip is a first end slope 212, and the other end thereof is a second end slope 221. The first end slope 212 is parallel to the second end slope 221, and the slopes play a role of preventing light reflection. A lens mounting groove 33 is opened at a notch of the positioning groove 31 at which the first end 21 of the chip is mounted. The first end slope 212 projects into the lens mounting groove 33 when the assembled modulator chip 2 is bonded into the positioning groove 31. When the focusing lens 4 is coupled with the waveguide incident end 11, the focusing lens 4 is mounted in the lens mounting groove 33, and the focusing lens 4 is not connected with the first end slope 212.

In one embodiment, the focusing lens 4 and the substrate 3 are adjusted to couple the focusing lens 4 with the waveguide incident end 11 before the focusing lens 4 is attached in the lens mounting groove 33.

Wherein when the output power of the optical fiber 6 is maximum, the focusing lens 4 and the substrate 3 are positioned, and the focusing lens 4 is positioned in the lens mounting groove 33.

As shown in fig. 10, in order to improve the coupling effect between the focusing lens 4 and the waveguide incident end 11, before the focusing lens 4 is fixed in the lens mounting groove 33, the following operations are adopted:

the focus lens 4 is placed in the lens mounting groove 33 in advance.

The second light source 100 and the collimating lens 200 are disposed at one side of the focusing lens 4, and the second light source 100 and the collimating lens 200 are used as another component. The collimating lens 200 is between the second light source 100 and the focusing lens 4. The collimating lens 200 serves to collimate the light emitted from the second light source 100 toward the focusing lens 4.

The light of the second light source 100 is collimated by the collimating lens 200 and then emitted to the focusing lens 4, and then is transmitted to the optical fiber 6 through the optical waveguide 1.

The optical fiber 6 is connected to a second optical power meter.

And clamping and adjusting the focusing lens 4 by adopting a second adjusting device 8, clamping and adjusting the substrate 3 by adopting a third adjusting device 9, finely adjusting the focusing lens 4 by adopting the second adjusting device 8 and/or finely adjusting the substrate 3 by adopting the third adjusting device 9, and realizing primary alignment of the position and the angle of the focusing lens 4 and the waveguide incident end 11.

A second preset bias voltage is applied to the bias electrode 15 in the modulator chip 2.

Then, the focusing lens 4 is finely adjusted by the second adjusting device 8 and/or the substrate 3 is finely adjusted by the third adjusting device 9 until the display value of the second optical power meter reaches the maximum value, which indicates that the coupling effect between the focusing lens 4 and the waveguide incident end 11 is best at this time, and then the focusing lens 4 is fixed in the lens mounting groove 33.

In one embodiment, the focusing lens 4 is adhered in the lens mounting groove 33, and an adhesive layer is coated in the lens mounting groove 33 in advance, so that the focusing lens 4 is conveniently fixed in the lens mounting groove 33.

The glue involved in the invention is a glue with light guide performance commonly used in the optical field, and is not described herein again.

An assembly method of an electro-optical modulator assembly provided by an embodiment of the present invention is shown in fig. 1 to 10, and includes the following steps:

s01: one end of the optical fiber 6 is connected to the fixed shaft portion through hole 52 of the fixed shaft portion 5.

S02: the modulator chip 2 is mounted in the detent 31 of the substrate 3 such that the chip first end 21 is in the detent 31 and the chip second end 22 protrudes out of the detent 31.

S03: the fixing shaft portion inclined surface 51 of the fixing shaft portion 5 is bonded to the second end inclined surface 221 of the chip second end 22, and the optical fiber 6 is coupled to the waveguide exit end 12.

S04: the focusing lens 4 is fixed with the focusing lens 4 at the side of the first end 21 of the chip and the focusing lens 4 is coupled with the waveguide entrance end 11.

The invention provides an electro-optical modulator assembly assembling method, which comprises the following assembling steps

One end of the optical fiber 6 is first bonded to the through hole 52 of the fixed shaft portion. An adhesive layer is provided in the through hole 52 for bonding to the optical fiber 6.

The modulator chip 2 is then bonded in the positioning slot 31 with the first end 21 of the chip in the positioning slot 31 or flush with the notch at one end of the positioning slot 31 and the second end 22 of the chip extending outside the positioning slot 31. For further improving connection stability, be provided with the adhesive linkage in the constant head tank 31 and the bottom is the horizontal plane rectangle, when modulator chip 2 placed in constant head tank 31, can directly with adhesive linkage, removed the process of glue dripping from.

Then the fixed shaft part inclined plane 51 is bonded with the second end inclined plane 221, and the optical fiber 6 is coupled with the waveguide emergent end 12, so that optical path propagation is realized. The inclined surface 51 of the fixed shaft part and/or the inclined surface 221 of the second end are/is provided with an adhesive layer, so that the adhesion between the inclined surface 51 of the fixed shaft part and the inclined surface 221 of the second end is realized.

Finally, the focusing lens 4 is installed on one side of the first end 21 of the chip, and the focusing lens 4 is coupled with the waveguide incident end 11, so that the optical path propagation is realized.

The focusing lens 4, the modulator chip 2 and the optical fiber 6, which are integrated together, are used as one assembly.

When the optical waveguide module is used, only the spatial positions among the light source, the collimating lens and the focusing lens 4 need to be considered, and the relative positions among the focusing lens 4, the modulator chip 2 and the optical fiber 6 do not need to be adjusted, so that the coupling efficiency between the optical waveguide 1 and the light source is greatly improved, the module is small in size after being integrated, can be integrally packaged, and is suitable for popularization and application in the technical field of communication.

In one embodiment, step S03 further includes:

one end of the optical fiber 6 is connected to the first light source, and the waveguide incident end 11 is connected to the first optical power meter.

The fixing shaft portion 5 is held and adjusted by the first adjusting device 7, the fixing shaft portion inclined surface 51 is attached to the second end inclined surface 221, and the optical fiber 6 is preliminarily aligned with the waveguide exit end 12.

A first preset bias voltage is applied to the modulator chip 2.

The setting shaft section 5 is finely adjusted by the first adjusting means 7 until the display value of the first optical power meter reaches the maximum.

The dead axle inclined surface 51 is bonded to the second end inclined surface 221.

In this embodiment, in order to improve the coupling effect between the optical fiber 6 and the waveguide exit end 12, before the fixed-axis portion inclined surface 51 is bonded to the second end inclined surface 221, the following operations are performed:

one end of the optical fiber 6 is connected to a first light source. The first light source may be a DFB light source.

The light of the first light source propagates via the optical fiber 6 to the waveguide entrance end 11.

The waveguide entrance end 11 is connected to a first optical power meter. A first optical power meter is used to monitor the output power at the entrance end 11 of the waveguide. The stationary shaft portion 5 is clamped and adjusted using the first adjusting device 7. The first adjusting device 7 is an existing three-dimensional adjusting bracket. The dead-center slope 51 is attached to the second end slope 221, and the optical fiber 6 is preliminarily aligned with the waveguide exit end 12. The fixed shaft part 5, and therefore the optical fiber 6, is adjusted in position and angle by the first adjusting device 7, and the optical fiber 6 is aligned with the waveguide exit end 12.

A first preset bias voltage is applied to the bias electrode 15 in the modulator chip 2, and then the fixed shaft portion 5 is finely adjusted by the first adjusting device 7 until the display value of the first optical power meter reaches the maximum, which indicates that the coupling effect between the optical fiber 6 and the waveguide exit end 12 is best at this time, and the fixed shaft portion inclined surface 51 and the second end inclined surface 221 are adhered and fixed by glue.

In one embodiment, the end surface of the first end 21 of the chip is a first straight surface 211, and the first straight surface 211 is perpendicular to the length direction of the positioning slot 31.

Step S02 further includes:

the first end straight surface 211 is placed flush with the notch at the end of the positioning slot 31.

Step S04 further includes:

the axis of the focusing lens 4 is aligned with the waveguide entrance end 11.

The focusing lens 4 is bonded to the first end straight surface 211.

In this embodiment, one end of the first end 21 of the chip is a first end straight surface 211, and the other end thereof is a second end inclined surface 221. When the assembled modulator chip 2 is bonded into the positioning groove 31, the first end straight surface 211 is flush with the notch at the end of the positioning groove 31. When the focusing lens 4 is coupled with the waveguide incident end 11, the focusing lens 4 is directly bonded with the first end straight surface 211, and the focusing lens 4 is attached to the end part of the substrate 3, so that the assembly is convenient.

In one embodiment, the end surface of the first end 21 of the chip is a first end slope 212, and the first end slope 212 is parallel to the second end slope 221.

The notch of the location groove 31 has a lens installation groove 33.

Step S02 further includes:

the first end slope 212 extends into the lens mounting groove 33.

Step S04 further includes:

the focusing lens 4 is placed in the lens mounting groove 33.

The second light source 100 and the collimating lens 200 are disposed on a side of the focusing lens 4 away from the first end inclined surface 212, and the collimating lens 200 is used for collimating the light emitted from the second light source 100 toward the focusing lens 4.

The optical fiber 6 is connected to a second optical power meter.

The focusing lens 4 is held and adjusted by the second adjusting device 8, and the substrate 3 is held and adjusted by the third adjusting device 9, and the focusing lens 4 is preliminarily aligned with the waveguide incident end 11.

A second preset bias voltage is applied to the modulator chip 2.

The focusing lens 4 is fine-tuned by the second adjusting means 8 and/or the substrate 3 is fine-tuned by the third adjusting means 9 until the value displayed by the second optical power meter reaches a maximum.

The focusing lens 4 is bonded in the lens mounting groove 33.

In this embodiment, one end of the first end 21 of the chip is a first end inclined surface 212, and the other end thereof is a second end inclined surface 221, which has the function of preventing light reflection. The first end slope 212 is parallel to the second end slope 221. A lens mounting groove 33 is opened at a notch of the positioning groove 31 at which the first end 21 of the chip is mounted. The first end slope 212 projects into the lens mounting groove 33 when the assembled modulator chip 2 is bonded into the positioning groove 31. When the focusing lens 4 is coupled to the waveguide incident end 11, the focusing lens 4 is mounted in the lens mounting groove 33, and the focusing lens 4 is not connected to the first end slope 212.

As shown in fig. 10, in order to improve the coupling effect between the focusing lens 4 and the waveguide incident end 11, before the focusing lens 4 is fixed in the lens mounting groove 33, the following operations are adopted:

the focus lens 4 is placed in the lens mounting groove 33 in advance.

The second light source 100 and the collimating lens 200 are disposed at one side of the focusing lens 4, and the second light source 100 and the collimating lens 200 are used as another component. The collimating lens 200 is between the second light source 100 and the focusing lens 4. The collimating lens 200 serves to collimate the light emitted from the second light source 100 toward the focusing lens 4.

The light of the second light source 100 is collimated by the collimating lens 200, then emitted to the focusing lens 4, and then transmitted to the optical fiber 6 through the optical waveguide 1.

The optical fiber 6 is connected to a second optical power meter.

And clamping and adjusting the focusing lens 4 by adopting a second adjusting device 8, clamping and adjusting the substrate 3 by adopting a third adjusting device 9, finely adjusting the focusing lens 4 by adopting the second adjusting device 8 and/or finely adjusting the substrate 3 by adopting the third adjusting device 9, and realizing primary alignment of the position and the angle of the focusing lens 4 and the waveguide incident end 11.

A second preset bias voltage is applied to the bias electrode 15 in the modulator chip 2.

Then, the focusing lens 4 is finely adjusted by the second adjusting device 8 and/or the substrate 3 is finely adjusted by the third adjusting device 9 until the display value of the second optical power meter reaches the maximum value, which indicates that the coupling effect between the focusing lens 4 and the waveguide incident end 11 is best at this time, and then the focusing lens 4 is fixed in the lens mounting groove 33.

According to the needs, the above technical schemes can be combined to achieve the best technical effect.

The foregoing is considered as illustrative only of the principles and preferred embodiments of the invention. It should be noted that, for those skilled in the art, several other modifications can be made on the basis of the principle of the present invention, and the protection scope of the present invention should be regarded.

Claims (12)

1. An electro-optic modulator assembly comprising a modulator chip having an optical waveguide, a substrate having a positioning groove, a focusing lens, a positioning shaft portion and an optical fiber;

the positioning groove is arranged on the top surface of the substrate and extends along the length direction of the substrate;

the modulator chip comprises a first chip end and a second chip end which are oppositely arranged, wherein the end face of the second chip end is a second end inclined plane, the waveguide incident end of the optical waveguide is positioned in the first chip end, and the waveguide emergent end of the optical waveguide is positioned in the second chip end;

the end surface of the fixed shaft part facing to the second end inclined surface side is a fixed shaft part inclined surface which is parallel to the second end inclined surface, and a fixed shaft part through hole is formed in the fixed shaft part;

the modulator chip is fixedly installed in the positioning groove, wherein a first end of the chip is located in the positioning groove, and a second end of the chip extends out of the outer side of the positioning groove;

one end of the optical fiber is bonded in the through hole of the dead axle part, the inclined plane of the dead axle part is bonded with the inclined plane of the second end, and the optical fiber is coupled with the emergent end of the waveguide;

the focusing lens is installed on one side of the first end of the chip and coupled with the waveguide incident end.

2. The electro-optic modulator assembly of claim 1, wherein the fixed shaft portion is adjusted to couple the optical fiber to the waveguide exit end prior to the fixed shaft portion chamfer being bonded to the second end chamfer;

when the output power of the waveguide incident end is maximum, the fixed shaft part is positioned, and the inclined surface of the fixed shaft part is bonded with the inclined surface of the second end.

3. The electro-optic modulator assembly of claim 1, wherein the second end chamfer is angled between 70 ° and 85 ° from the detent.

4. The electro-optic modulator assembly of any of claims 1-3,

the end surface of the first end of the chip is a first end straight surface, and the first end straight surface is vertical to the length direction of the positioning groove;

the first end straight surface is flush with the notch at one end of the positioning groove, and the focusing lens is bonded with the first end straight surface.

5. The electro-optic modulator assembly of claim 4, wherein the waveguide entrance end is aligned with an axis of the focusing lens.

6. The electro-optic modulator assembly of any of claims 1-3,

the end surface of the first end of the chip is a first end inclined surface, and the first end inclined surface is parallel to the second end inclined surface;

the notch of the positioning groove is provided with a lens mounting groove, the first end inclined plane extends into the lens mounting groove, and the focusing lens is connected in the lens mounting groove.

7. The electro-optic modulator assembly of claim 6,

adjusting the focusing lens and the substrate to couple the focusing lens and the waveguide incident end before the focusing lens is connected in the lens mounting groove;

wherein when the output power of the optical fiber is maximum, the focusing lens and the substrate are positioned, and the focusing lens is positioned in the lens mounting groove.

8. The electro-optic modulator assembly of claim 7, wherein the focusing lens is bonded in the lens-mounting groove.

9. A method of assembling an electro-optic modulator assembly according to any of claims 1-8, comprising the steps of:

s01: connecting one end of the optical fiber to the fixed shaft part through hole of the fixed shaft part;

s02: mounting the modulator chip in the detent of the substrate with the chip first end in the detent and the chip second end extending out of the detent;

s03: bonding the dead axle portion slope of the dead axle portion to the second end slope of the chip second end and coupling the optical fiber to the waveguide exit end;

s04: and fixing the focusing lens, wherein the focusing lens is positioned on one side of the first end of the chip, and the focusing lens is coupled with the incident end of the waveguide.

10. The method for assembling an electro-optic modulator assembly of claim 9, wherein the step S03 further comprises:

connecting one end of the optical fiber with a first light source, and connecting the incident end of the waveguide with a first optical power meter;

clamping and adjusting the fixed shaft part by adopting a first adjusting device, attaching the inclined plane of the fixed shaft part to the inclined plane of the second end, and preliminarily aligning the optical fiber with the waveguide emergent end;

applying a first preset bias voltage to the modulator chip;

finely adjusting the fixed shaft part through the first adjusting device until the display value of the first optical power meter reaches the maximum;

and bonding the inclined surface of the fixed shaft part with the inclined surface of the second end.

11. The method of assembling an electro-optic modulator assembly of claim 9, wherein the end surface of the first end of the chip is a first end straight surface, the first end straight surface being perpendicular to the length direction of the positioning groove;

the step S02 further includes:

placing the first end straight surface to be flush with the notch at one end of the positioning groove;

the step S04 further includes:

the axis of the focusing lens is aligned with the waveguide incident end;

and bonding the focusing lens with the first end straight surface.

12. The method of assembling an electro-optic modulator assembly of claim 9, wherein the end surface of the first end of the chip is a first end bevel, the first end bevel being parallel to the second end bevel;

a lens mounting groove is formed in the notch of the positioning groove;

the step S02 further includes:

the first end inclined plane extends into the lens mounting groove;

the step S04 further includes:

placing the focusing lens in the lens mounting groove;

arranging a second light source and a collimating lens on one side of the focusing lens far away from the first end inclined plane, wherein the collimating lens is used for enabling light emitted by the second light source to be emitted to the focusing lens in a parallel mode;

connecting the optical fiber with a second optical power meter;

clamping and adjusting the focusing lens by adopting a second adjusting device, clamping and adjusting the substrate by adopting a third adjusting device, and preliminarily aligning the focusing lens with the waveguide incident end;

applying a second preset bias voltage to the modulator chip;

fine-tuning the focusing lens through the second adjusting device and/or fine-tuning the substrate through the third adjusting device until the display value of the second optical power meter reaches the maximum;

and adhering the focusing lens in the lens mounting groove.

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