JPH1010374A - Light emitting and receiving mechanism element and optical communication element and production therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting and receiving mechanism element and an optical communication element which have high transfer rates and high reliability and are suitable for a high volume production and are capable of making costs low and its manufacturing method. SOLUTION: This light emitting and receiving mechanism element is constituted by joining a light emitting and receiving element 2 and a light transmissive supporting waveguide body 3 and the light emitting and receiving element 2 forms a confocal type coupler monolithically and the light transmissive supporting waveguide 3 is provided with a concave shaped or convex shaped supporting part which supports an optical fiber 10 and is provided with a center axis. Moreover, the light emitting and receiving element 2 and the supporting waveguide 3 are joined by making the optical axis 6 of the light emitting and receiving element 2 and the center axis of the supporting waveguide body 3 coincide.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical communication device and a method for manufacturing the same, and more particularly, to a light receiving / emitting device which is an intermediate product of the optical communication device and comprises a light receiving / emitting device and a waveguide capable of supporting an optical fiber. The present invention relates to a mechanism element, an optical communication element configured using the light emitting and receiving mechanism element, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Optical communication is a system in which a light receiving / emitting element transmits and receives a modulation signal via an optical fiber, and an optical communication element is used as a main component thereof. Optical communication elements
An optical fiber is precisely mounted on a light receiving / emitting element, or an optical link element is used to mount a light receiving / emitting element on both ends of the fiber to transmit and receive an optical signal.In particular, for subscriber-based optical communication, A high-reliability, high-reliability, low-cost optical communication device and its components are essential.

In a system for performing optical communication by combining an optical fiber with a light emitting element and a light receiving element, it is necessary to process a pair of light emitting and light receiving elements bonded on both sides of the fiber with high precision in order to perform transmission and reception, and to perform more precise alignment. there were. For example, when coupling a silica-based single mode fiber and a laser diode, a high-precision mounting technique of about 1 μm was required. For this reason, in the prior art, bonding using high-output laser welding or the like has been performed while monitoring the amount of coupling light, for example.

[0004]

However, the prior art as described above is not necessarily suitable for forming an optical link having a high transmission rate with a low loss in addition to a high cost. In particular, the stabilization of optical communication quality requires packaging technology for sealing semiconductor optical devices.
There is a trade-off between such a packaging technology and high optical coupling performance. Therefore, conventionally, it has been difficult in terms of cost to achieve both, and this has been an obstacle to introduction.

Recently, it has been considered to apply an element (for example, a laser coupler) for receiving and emitting light with a hybrid optical element to optical communication. In addition, the method of fixing the element with high accuracy, the mounting of the hybrid element, the entire sealing structure, and the like are complicated, and there has been an inconvenience that it is difficult to realize cost reduction and high reliability as a whole.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems and disadvantages of the prior art, and it is an object of the present invention to provide a high transfer rate, high reliability, and low cost suitable for mass production. An object of the present invention is to provide a light emitting mechanism element and an optical communication element, and a method for manufacturing the same.

[0007]

According to the present invention, there is provided a light receiving / emitting mechanism element comprising a light receiving / emitting element and a light-transmitting support / waveguide coupled to each other. Forming a monolithically confocal coupler, the light-transmitting support / waveguide supporting an optical fiber, comprising a concave or convex support having a central axis, and further comprising the light receiving and emitting element. The light emitting / receiving element and the support / waveguide are joined so that an axis coincides with the central axis of the support / waveguide.

[0008] With the above-described configuration, an optical fiber connection can be made without the necessity of precise alignment work, and a low-loss, high-reliability, low-cost device that can transmit and receive with a single core is realized.

Further, the light receiving / emitting mechanism element according to the present invention comprises a plurality of light receiving / emitting elements arranged in an array and a plurality of light-transmitting supporting / waveguides arranged in an array. The light receiving and emitting elements are monolithically formed to form a confocal coupler, and each of the light-transmitting supports / waveguides supports an optical fiber, a concave or convex support having a central axis. Portion, further comprising the optical axis of each of the light receiving and emitting elements,
The plurality of light emitting / receiving elements arranged in the array and the plurality of supports / waveguides arranged in the array are joined by aligning the central axes of the respective support / waveguides. It is characterized by having been done.

[0010] With the above configuration, the optical fiber array is connected without the need for precise alignment work, and a device capable of transmitting and receiving at a low loss, a high reliability, and a high transmission rate is realized.

Further, when the light emitting / receiving element included in the light emitting / receiving mechanism element according to the present invention is of an edge emitting type or a surface emitting type, the light emitting / receiving configuration on the same substrate becomes easy.

Further, when a circuit mechanism for electrical connection is connected to the light emitting and receiving element included in the light emitting and receiving mechanism element according to the present invention, the electrical connection by this circuit mechanism is facilitated, and thus the light emitting and receiving mechanism is provided. The element can be used as an optical connector for connecting an optical fiber.

A method for manufacturing a light emitting and receiving mechanism element according to the present invention is characterized in that a semiconductor manufacturing wafer in which a plurality of light emitting and receiving elements having an optical axis are formed on the same wafer at predetermined intervals and directions, A plurality of sets of support / waveguides each having an axis and having a concave or convex support portion are provided with a light transmittance formed on the same wafer different from the above at the predetermined interval and direction. And the wafer is overlapped and bonded with the optical axis of the light receiving and emitting element aligned with the central axis of the support / waveguide, and the bonded wafer is cut to form the one light receiving element. The present invention is characterized in that one light receiving / emitting mechanism element in which a light emitting element and the one support / waveguide are joined is manufactured.

According to the above-described structure, individual alignment and unification of a plurality of constituent parts are performed at once at the wafer stage. Therefore, it is suitable for mass production of individual parts, and quality improvement and cost reduction can be achieved.

Further, according to the method of manufacturing a light emitting and receiving mechanism element according to the present invention, there is provided a semiconductor manufacturing wafer in which a plurality of light emitting and receiving elements having an optical axis are formed on the same wafer at a predetermined interval and direction. A plurality of sets of support / waveguides having a central axis and having a concave or convex support portion, the light being formed on the same wafer different from the above at the predetermined interval and direction. A transparent wafer, the optical axis of the light emitting and receiving element and the central axis of the support / waveguide are overlapped and bonded together, and the bonded wafer is cut to form the adjacent wafer. The invention is characterized in that a plurality of light receiving / emitting elements and the adjacent several supporting / waveguides are joined to manufacture an array of light receiving / emitting mechanism elements.

According to the above-described structure, individual alignment and unification of a plurality of constituent parts are performed at a time at the wafer stage. Therefore, it is suitable for mass production of array components, and quality improvement and cost reduction can be achieved.

Further, when the optical communication element according to the present invention is formed by joining an optical fiber to the supporting portion of the light receiving and emitting mechanism element, the optical communication element can be regarded as an electrical connector. And shortening the working time and the working cost, and at the same time, high quality communication becomes possible.

In the case where the optical communication device according to the present invention is formed by joining an arrayed optical fiber to each support portion of the arrayed light receiving and emitting mechanism element, it is regarded as an electrical connector. Therefore, the work can be simplified, the work time can be shortened, and the work cost can be reduced, and at the same time, high quality and high transfer rate communication can be performed.

Further, when the optical communication element according to the present invention is formed by forming a spherical tip at the tip of the above-mentioned optical fiber, the laser beam is effectively condensed, so that the quality of the optical fiber is small with little variation in quality. Reliable optical communication is realized.

In the case where the optical communication element according to the present invention is provided with a gradient index lens at the tip of the optical fiber, optical coupling with the gradient index lens is achieved only by cutting the optical fiber. Therefore, connection work can be performed more easily, and high quality and highly reliable optical communication can be realized.

Further, in the case where the electric circuit has a structure in which the light receiving / emitting mechanism element or the optical communication element is directly or indirectly joined, the work of connecting the optical fiber to the electric circuit is facilitated, or The work of connecting the optical fiber to the circuit is not required, and the work is simplified, the cost is reduced, and the reliability is improved.

[0022]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view illustrating a first embodiment of a light emitting and receiving mechanism element and an optical communication element according to the present invention.

As shown in the figure, the optical communication element E1 according to the first embodiment of the present invention has a substantially rectangular parallelepiped shape,
A single mode optical fiber 10 (hereinafter, referred to as a single mode fiber) is attached vertically upward in the figure.

In the figure, a rectangular parallelepiped 2 which is the lower bottom portion of the optical communication element E1 is a light receiving / emitting element. Are supported in series. The light emitting / receiving element 2 and the light-transmitting support / waveguide 3 are combined to form a light emitting / receiving mechanism element Sr1.

The light receiving / emitting element 2 includes a light emitting element LD and a light receiving element PD monolithically formed on a substrate sharing a confocal optical axis, and the light receiving element PD has a confocal point of an optical system or a confocal depth of focus. Laser coupler configuration (CLC element: Confoc) located within the diffraction limit
al Laser Coupler).

That is, in this embodiment, the light emitting element LD
And the light receiving element PD are monolithically integrated, and the inclination angle is 4
An edge-emitting CLC device (Confocal Laser Coupler) in combination with a 5 ° reflecting surface 2A
Is formed. With this configuration, the optical axis 6 is perpendicular to the upper surface of the light emitting / receiving element 2. In addition, the monolithic integration enables a reduction in price by mass production.

In this embodiment, the edge emitting type CLC element is formed as described above. However, the configuration of the present invention is not limited to such an edge emitting type CLC element. Surface-emitting VCSEL
(Vertical Cavity Surface
Emitting Laser) or a quasi-surface emitting LD having a simpler configuration can be applied. In addition, in addition to the configuration in which the light receiving element is located within the range of the confocal depth of focus, the configuration of the present invention provides the light receiving element within the range extended up to about 30% from the range of the confocal depth of focus. The configuration may be located. Therefore, in the present invention, all of the above possible configurations are put together,
It is defined as <confocal coupler>. In this specification, it is described as <confocal coupler>.

The wavelength of the laser light is 650-150.
The range of 0 nm is preferable, but there is no limitation on the wavelength in the configuration of the present invention.

The light-transmitting supporting / waveguide 3 is formed of a rectangular parallelepiped made of a transparent or translucent light-transmitting material having substantially the same low area as the light emitting / receiving element 2. The light transmitting material is preferably a transparent material such as glass, sapphire, quartz, or polymer, and is bonded and sealed to the light emitting / receiving element 2 with solder or an adhesive.

A cylindrical hole having a central axis is formed in the light-transmitting support / waveguide 3 at a position having the same dimension as the pitch of the light emitting element LD or the light receiving element PD.
Is composed. The central axis is perpendicular to the upper surface of the light emitting / receiving element 2, and the central axis is shown to coincide with the optical axis 6 in FIG. 3B is an opening of the cylindrical hole-shaped support portion 3A, 3C is its bottom, and 3D is its wall.

The light-transmitting supporting / waveguide is mounted on the light receiving and emitting element with high precision, acts as a waveguide for laser light transmitted and received by the light receiving and emitting element, and further supports the optical fiber at a correct position. Light transmitting support / waveguide 3
Can be mass-produced on a wafer scale using a glass mold or the like.

The light receiving / emitting mechanism element Sr1 is formed by connecting and merging the optical axis 6 of the light receiving / emitting element 2 and the central axis of the supporting portion 3A of the light transmitting support / waveguide 3. In the light emitting / receiving mechanism element Sr1 shown in FIG. 1, the light emitting / receiving element 2 and the light-transmitting supporting / waveguide 3 are joined at the joining portion 4 by soldering. The structure is sealed with a solder material.

Then, the single mode fiber 10 is fitted into the supporting portion 3A of the light emitting / receiving mechanism element Sr1 and united with the adhesive 7 to form the optical communication element E1.

FIG. 2 is a sectional view showing a state in which the light emitting / receiving mechanism element Sr1 shown in FIG. 1 is mounted on a circuit board. In FIG. 2, a via hole (Via-hole) VH having a hole structure penetrating the substrate of the light receiving and emitting element 2 is formed in the light receiving and emitting element 2 of the light receiving and emitting mechanism element Sr1.

The via hole VH is formed by, for example, making a hole having a diameter of about 150 μm with a carbon dioxide laser and filling a conductive paste made of copper powder, an epoxy resin, and a curing agent. The connection resistance of the via hole VH thus configured is 1 mOhm or less.

The upper end of the via hole VH has a light emitting element LD,
The lower end is connected to the light receiving element PD or the ground line, and the lower end is connected to the electrode ED provided on the bottom surface of the light receiving and emitting element 2. Electrode ED extended to the back of light emitting / receiving element 2
Is mounted on the circuit board 50 directly using the solder portion.

That is, the electrode ED is electrically connected to the connection portion 50A of the circuit board 50 directly by soldering or the like. In addition, thereby, the light emitting / receiving mechanism element Sr1 is mechanically fixed to the circuit board 50.

As described above, the light emitting / receiving mechanism element Sr1
As one of the uses, the single mode fiber 10 is fixed to the circuit board 50 in a state where the single mode fiber 10 is not inserted into the support portion 3A, and functions as an optical connector for connecting the single mode fiber 10 later.

Conversely, when the circuit board 50 is used as an electric circuit and viewed from the electric circuit side, the direct connection of the light emitting / receiving mechanism element Sr1 makes it extremely easy to connect the optical fiber to the electric circuit, thereby simplifying the operation and reducing the cost. And at the same time, highly reliable communication becomes possible.

As still another application, the single-mode fiber 10 is inserted into and connected to the support 3A in a state of a single component not fixed to a circuit board or the like, thereby forming an optical communication element E1 with a fiber. In such an optical communication element E1 with a fiber, the optical transmission portion is formed as a black box, so that it can be easily used by regarding this as an electrical connector.

Conversely, the optical communication element E1 with the fiber is directly mounted on the circuit board 50, and the circuit board 50 is used as an electric circuit. This eliminates the need for any optical fiber connection to the circuit, greatly simplifying the operation and reducing costs, and also enables highly reliable communication.

FIG. 3 is a sectional view of an optical communication device E2 according to a second embodiment of the present invention. In the figure, the support of light transmission
The waveguide 13 is provided with a concave support portion 13A, and the single mode fiber 10 is fitted therein, and the single mode fiber 10 is connected and fixed to the support / waveguide 13 by the adhesive 7. The support portion 13A is cut in two steps when pelletizing is performed by a dicer, and has a two-step structure. In addition, the same parts as those in the above configuration are denoted by the same reference numerals, and description thereof will be omitted.

The single mode fiber 10 uses a glass fiber having a core 10B at the core and a hemispherical tip 10A at the tip. The forward sphere 10A is adapted to adjust the distance and the center so that the laser beam is condensed and the fiber is efficiently coupled to the fiber, and is bonded and fixed by, for example, a UV-curable resin. The adhesive has a matching refractive index with glass so as to reduce reflection loss.

Light emitted from the element on the opposite side of the single mode fiber 10 is condensed by the front sphere 10A. Here, the light converging limit is the diffraction-limited beam diameter. For example, if the NA is 0.14 and the wavelength is 0.9 μm, the diameter of the diffraction-limited beam 17 is about 7.4 μm. Therefore, if the light emitting / receiving element 2 has a confocal coupler configuration as defined above, it is possible to form a PD within the range of the beam diameter.

The optical communication device E2 thus formed
As described above, since the light transmission portion is formed as a black box as described above, the light transmission portion can be easily mounted and used on a substrate or the like by regarding this as an electrical connector.

Next, a method for manufacturing the light emitting / receiving mechanism element according to the present invention will be described. FIG. 4 is a perspective view showing wafer bonding as one manufacturing process of the light emitting and receiving mechanism element according to the present invention. FIG. 5 is an explanatory diagram of the wafer alignment in the above-described process. FIG. 6 is a perspective view of the bonded wafer.

In FIG. 4, reference numeral 21 denotes a light emitting / receiving element L having an optical axis.
p is a plurality of semiconductor manufacturing wafers formed on the same wafer at predetermined intervals and directions. For example, there are devices such as CLC and SELD as the light receiving / emitting element Lp, and a GaAs substrate or the like is used as a semiconductor manufacturing wafer. This configuration will be described with reference to the cross-sectional view shown in FIG. 5. The plurality of light emitting / receiving elements Lp formed on the wafer 21 each have a reflecting surface 2A having an inclination angle of 45 °, and each of these reflecting surfaces 2A The optical axes y1, y2, and y3 are respectively formed in a direction perpendicular to the wafer surface. The distance between adjacent optical axes, for example, y1 and y2, is set to be a predetermined distance.

On the other hand, reference numeral 20 denotes a plurality of sets of support / waveguides having a central axis and having concave or convex support portions, and at the same interval and direction as in the light receiving / emitting element Lp, and the same wafer. It is a light-transmissive wafer built on top. This structure will be described with reference to FIG. 5. A plurality of sets of support / waveguides Cd formed on the wafer 20 include concave support portions 3A into which optical fibers are inserted, respectively. It has central axes x1, x2, x3 formed perpendicular to the plane.

Here, adjacent central axes, for example, x1 and x
It has been prefabricated so that the distance between the two is equal to the distance between y1 and y2. This relationship holds for all other central axes and optical axes.

The wafer 20 configured as described above
And 21 are connected to, for example, the optical axes y1 to y3 of the light emitting / receiving element Lp.
5 are moved relative to each other in the direction of arrow V in FIG. 5 so that, for example, the central axes x1 to x3 of the support / waveguides Cd coincide with each other.

As the adhesive 4 (see FIG. 6) used for bonding the wafers 20 and 21, Au / Sn solder is preferable in terms of reliability, but acrylic or epoxy UV adhesive, thermosetting type The use of an adhesive is also possible.

In this way, a bonded wafer as shown in FIG. 6 is obtained. Here, a hologram, a reflection film, and the like are formed on the light-transmitting wafer 20 as necessary. In addition, after lapping the back surface, we performed via hole and electrode formation processing, and then this bonded wafer was
As shown in FIG. 7, by dicing (cutting), one light receiving / emitting mechanism element Sr in which one light receiving / emitting element Lp and one support / waveguide Cd are joined is manufactured.

As is clear from the above, according to the method for manufacturing the light emitting and receiving mechanism element according to the present invention, the individual positions and arrangements of a plurality of constituent parts are formed at the stage of manufacturing each wafer, whereby two sheets are formed. Just by bonding the wafers, the alignment and unification of all the components can be performed at once. Therefore, it is suitable for mass production of individual parts, and quality improvement and cost reduction can be achieved.

Furthermore, by cutting the light receiving and emitting mechanism elements Sr for several pieces into an array while being connected by the above dicing, an array of light receiving and emitting mechanism elements is manufactured.

FIG. 8 is a sectional view showing another state of attachment to a circuit board according to the second embodiment of the light emitting and receiving mechanism element according to the present invention. As shown in the figure, the light receiving / emitting mechanism element Sr2 of the optical communication element E2 according to the present invention is installed at an angle of 90 degrees so that the optical axis 6 is parallel to the circuit board 50, and the electrode ED which stands in the vertical direction. And the connecting portion 50 </ b> A of the circuit board 50 in the horizontal direction are electrically connected indirectly via the flexible board 19. As described above, the use of the flexible substrate allows the single mode fiber 10 to be mounted in the horizontal direction. In addition, the single mode fiber 10 is supported by the fiber support 18 to improve the mechanical strength and the like.

The structure using the flexible substrate as described above has good matching with the circuit board and can be easily arranged. it can.

FIG. 9 is a sectional view of a third embodiment of a light emitting / receiving mechanism element and an optical communication element according to the present invention. As shown in the figure, the light emitting / receiving mechanism element Sr3 according to the present invention is shown.
Is composed of the light emitting / receiving element 2 and the support / waveguide 31, and the support / waveguide 31 is formed with a deep cylindrical support portion 31 </ b> A.

In the optical communication element E3 according to the present invention, a gradient index lens (GRIN lens) 32 is adhered to a supporting portion 31A of the light receiving / emitting mechanism element Sr3 with an adhesive 33, and the gradient index lens is formed. 32, the tip of a single mode fiber 30 having a flat tip is brought into contact with
The single mode fiber 30 is formed by bonding the outer periphery of the single mode fiber 30 to the inner wall of the support portion 31A with an adhesive 33.

By using the gradient index lens 32, the convergence characteristics of the laser beam can be improved with a simpler operation.

FIG. 10 is a sectional view of a fourth embodiment of a light receiving / emitting mechanism element and an optical communication element according to the present invention. In particular, the fiber diameter is large, and the confocal type coupler is compared with the fiber diameter. This shows a configuration that is made smaller. In this case, a confocal coupler is mechanically held at the fiber end by the fiber, and at the same time, is optically connected, whereby the connection stability can be ensured.

As shown in the figure, the light receiving / emitting mechanism element Sr4 according to the present invention is smaller than the diameter of the single mode fiber 40, is composed of the light receiving / emitting element 2 and the support / waveguide 41, and is supported / guided. The corrugated body 41 is formed with a shallow cylindrical support portion 41A.

In the optical communication element E4 according to the present invention, the refractive index distribution type lens 32 is adhered to the cylindrical concave portion 40A provided at the tip of the single mode fiber 40 by the adhesive 33. The tip of the mold lens 32 is configured to protrude from the tip of the single mode fiber 40. Then, the projecting portion of the refractive index distribution type lens 32 is inserted into a shallow cylindrical support portion 41A provided on the support / waveguide 41, and is fixed to the support portion 41A with an adhesive (not shown).

With the above structure, the light emitting / receiving mechanism element Sr4
And the single mode fiber 40 are not only mechanically bonded and united, but also the light receiving / emitting element 2 and the single mode fiber 40 are optically connected to each other via the light transmitting support portion 41A and the gradient index lens 32. Be combined.

As described above, in the light receiving / emitting mechanism element Sr3 according to the present invention, the optical wiring can be easily provided by connecting and bonding the optical fiber 30 cut at an arbitrary length to the supporting portion in mounting.

Moreover, the operation of fitting the protruding portion into the concave portion is extremely easy, and the alignment of the optical axes can be naturally achieved only by this fitting operation.
Improvements in workability, quality of high performance, cost reduction, and miniaturization of the device are all realized.

FIG. 11 is a sectional view of a fifth embodiment of a light emitting and receiving mechanism element and an optical communication element according to the present invention. As shown in the figure, the light emitting / receiving mechanism element Sr according to the present invention
5 is smaller than the diameter of the single mode fiber 150, is composed of the light emitting / receiving element 2 and the support / waveguide 51,
The support / waveguide 51 is formed with a shallow cylindrical support portion 51A.

In the optical communication device E5 according to the present invention, the refractive index distribution type lens 32 is fitted into a deep cylindrical concave portion 150A provided at the tip of the single mode fiber 150, and is bonded with an adhesive 33. Is removed stepwise by cutting or the like while leaving only the skirt portion 150B, and the protruding skirt portion 150B is fixed to the support / waveguide 51.
Is inserted into a shallow cylindrical support portion 51A provided on the base member, and is adhered and fixed to the support portion 51A with an adhesive (not shown).

With the above structure, the light emitting / receiving mechanism element Sr5
And the single mode fiber 150 are not only mechanically bonded and united, but also the light emitting / receiving element 2 and the single mode fiber 150 are optically connected to each other via the light transmitting support portion 51A and the gradient index lens 32. Be combined. As described above, in the present embodiment, it can be considered that the light emitting and receiving mechanism element is attached to the optical fiber side to form a kind of wiring, and therefore, it is possible to work with simple electrical wiring. . The advantages of this embodiment are as follows.
This is the same as that in FIG. Therefore, description is omitted.

FIG. 12 is a sectional view of a sixth embodiment of a light receiving / emitting mechanism element and an optical communication element according to the present invention. As shown in the figure, the light emitting / receiving mechanism element Sr according to the present invention
Numeral 6 is smaller than the diameter of the single mode fiber 60, and includes the light emitting / receiving element 2 and the support / waveguide 61. The support / waveguide 61 is formed with a protruding cylindrical support portion 61A.

In the optical communication device E6 according to the present invention, the refractive index distribution type lens 32 is inserted into the excessively deep cylindrical concave portion 60A provided at the tip of the single mode fiber 60, and is bonded with the adhesive 33. In the remaining recess 60B,
The protruding cylindrical support portion 61A is fitted, and the support portion 61A and the concave portion 60A are bonded and fixed with an adhesive (not shown).

With the above configuration, the light receiving / emitting mechanism element Sr6
And the single mode fiber 60 are not only mechanically bonded and united, but also the light emitting / receiving element 2 and the single mode fiber 60 are optically connected to each other through the light transmitting support 61A and the gradient index lens 32. Be combined. The advantages of the present embodiment are the same as those in FIG. Therefore, description is omitted.

An optical communication element with a single mode fiber can be connected by forming a connector.
FIG. 13 is a cross-sectional view of a seventh embodiment of the optical communication device according to the present invention, and shows an example of a configuration by forming such a connector.

As shown in the figure, the optical communication device E7 according to the present invention is smaller than the diameter of the single mode fiber 70, and is composed of the light receiving / emitting device 2 and the support / waveguide 71. Sr7, support / waveguide 71,
It comprises a single mode fiber 70 in which the gradient index lens 32 is inserted, and a connector 75 in which the connection terminals 76A to 76D are embedded, and in which the light emitting / receiving mechanism element Sr7 and a part of the single mode fiber 70 are sealed. I have.

The connection terminals 76A to 76D are used for common grounding, laser diode driving, laser diode monitoring, and light receiving signals, respectively.

As described above, in the present embodiment, the connection terminals 76A to 76A, which are circuit mechanisms for electrical connection to the light emitting / receiving element 2, are provided.
D is continuously provided. As a result, in the optical communication device of the present embodiment, all parts related to optical transmission are incorporated in a black box manner, and only the electric connection terminals are exposed, so that work can be performed only by electric wiring. This is particularly effective for improving productivity on site.

FIG. 14 shows an eighth embodiment of the optical communication device according to the present invention.
It is sectional drawing of embodiment. As shown in the figure, the optical communication device E8 according to the present invention includes a light emitting and receiving mechanism element Sr7, a support / waveguide 71,
A single mode fiber 70 into which the gradient index lens 32 is inserted is embedded in the connector 85, and the silicon IC 80 to which the light emitting / receiving element 2 is directly attached, and a silicon IC 80
The lead frame 81 abutting on the C80 is embedded in the connector 85, and the connection terminals 86A and 86B are embedded with the ends exposed.

The lead frame 81 improves the mechanical strength and the heat dissipation characteristics. Connection terminal 86A
Supplies power to the silicon IC 80, and the connection terminal 86B transmits signals transmitted and received from the silicon IC 80. As described above, by mounting the silicon IC 80 near the light emitting / receiving element 2, signal processing can be performed with a short connection distance, and thus a structure suitable for high frequency signal processing can be realized.

FIG. 15 shows a ninth embodiment of the optical communication device according to the present invention.
It is sectional drawing of embodiment. As shown in the figure, the optical communication element E9 according to the present invention comprises a light emitting / receiving mechanism element Sr7, a support / waveguide 71,
The single mode fiber 70 into which the gradient index lens 32 is inserted, the silicon IC 80 to which the light emitting / receiving element 2 is directly attached, and the lead frame 81 in contact with the silicon IC 80 are embedded in the connector 95, and further, the connection terminal 96
Is embedded with the tip exposed. The exposed portion of the connection terminal 96 is formed so as to hang down along the side surface of the connector 95.

The connection terminal 96 supplies power to the silicon IC 80 or transmits a transmission / reception signal from the silicon IC 80. As described above, in the present embodiment, by mounting the silicon IC 80 in contact with the light receiving / emitting element 2 and disposing the lead frame 81, it is possible to improve the high-frequency signal processing characteristics and the heat sink effect.

FIG. 16 is an exploded perspective view of a light emitting / receiving mechanism element and an optical communication element according to a tenth embodiment of the present invention. The multi-channel structure realizes a parallel mass transmission device. is there.

As shown in the figure, an optical communication element E10 according to the present invention comprises a plurality of sets of light emitting elements LD and light receiving elements PD in an array, and a reflection mirror 20 having a tilt angle of 45 °.
Light receiving / emitting element 200 having 0 A, one end having an inclination angle of 45 °
, A light-transmitting support / waveguide 100 having an array of support portions 100B to 100D formed by a plurality of cylindrical holes, and a plurality of single mode fibers 10 and 30.

The plurality of single mode fibers 10 and 30 are combined in a ribbon shape by a band 110 to form a flat fiber cable.

A plurality of sets of electrodes (not shown) are exposed on the bottom surface of the light receiving / emitting element 200, and each electrode is connected to each light emitting element LD or light receiving element PD.

The distance between the adjacent light emitting elements LD and the distance between the adjacent light receiving elements PD are predetermined, and the distance between the adjacent supporting portions 100 B to 100 D in the supporting / waveguide 100 is also determined. , Are provided at a distance corresponding to these.

In the present embodiment, the light emitting / receiving element 200 and the support / waveguide 100 are combined by bonding or the like to form the light emitting / receiving mechanism element Sr10. Therefore, the light emitting element L
D or light receiving element PD and supporting portion 100B or 10
By simply performing alignment at two locations on the array in which the pair with 0D is formed, the alignment of all other pairs is established, and thus the light emitting and receiving mechanism element Sr10 can be easily assembled.

The assembled light receiving / emitting mechanism element Sr10
Can be easily connected and attached to the connection points of the circuit board by soldering or the like. The single mode fibers 10 to 30 of the flat fiber cable are attached to the support portions 100B to 100D of the light receiving / emitting mechanism element Sr10.
Are inserted and fixed with an adhesive, and the distance between the single mode fibers 10 to 30 is previously set to the support portion 1.
By making the distance equal to the distance between 00B to 100D, a plurality of single mode fibers 10 to 30 can be easily connected and attached to a plurality of support portions 100B to 100D at once.

The single mode fiber 10 has a front ball 10A, is mounted on a support 100B suitable for mounting a single mode fiber with a front ball, and the single mode fiber 30 having a flat tip is a GRIN
It is directly attached to the support 100C having the lens 32 or the support 100D at the bottom of the cylinder. As a result, each of the light emitting element LD and the light receiving element PD and each of the single mode fibers 10 to 30 are arranged on one optical axis 6 and optically coupled.

At this time, since each optical axis 6 is refracted by 45 ° by the reflecting mirror 100A having a 45 ° tilt angle, the single mode fibers 10 to 30 are arranged in a direction parallel to the circuit board surface. The size of the device can be reduced.

In addition, the necessity of using a flexible substrate as in the embodiment of FIG. 8 is omitted, and the cost can be reduced.

In the above description, the light emitting / receiving mechanism element Sr1
0 was attached to the circuit board, and the ribbon cable-shaped single mode fibers 10 to 30 were inserted and attached. Unlike this, however, the light emitting / receiving mechanism element Sr10 was previously provided.
An optical communication element E10 having single mode fibers 10 to 30 attached thereto may be provided, and the optical communication element E10 with the fiber may be attached to a circuit board as needed. In this case, only the electrical connection is required for the mounting operation, so that, for example, the component replacement operation at the installation site of the device is facilitated, and the operation time is reduced and the operation cost is reduced.

There are various types of optical fibers applicable to the present invention that can be classified in terms of material or structure.
For example, structurally as GI fiber, Silica
Many other optical fibers including a Step-Index type (single mode or multi mode) and the like can be applied.

[0092] In addition to materials such as quartz,
A-type plastic fiber POF (Plastic
Many other optical fibers can be applied, including Optical Fiber, and combinations can be made according to the purpose. In particular, if you target low prices,
OF is preferred. In any case, the present invention is applicable particularly to materials and structures.

The optical coupling method between the optical fiber and the light receiving / emitting mechanism element may be, for example, a Fresnel lens, a spherical lens, or a hologram lens in addition to the above-mentioned fiber with a spherical head, a GRIN lens, and a butt joint (direct coupling). For example, various coupling methods are possible and can be used properly according to each purpose.

In particular, if the lens system has an NA of about 0.14 to 0.20, it can be easily applied to a confocal coupler effectively. In the case of a multi-mode fiber, it is also possible to employ a configuration in which the light receiving element PD is configured more easily by utilizing the spread of the received light beam in reverse.

[0095]

As described above, the light emitting and receiving mechanism element according to the first aspect of the present invention is constituted by connecting the light emitting and receiving element and the light-transmitting support / waveguide, and the light receiving and emitting element is monolithically formed. A confocal coupler is formed, and a light-transmitting support / waveguide supports the optical fiber.It has a concave or convex support part with a central axis, and receives and emits light by aligning the optical axis with the central axis. The element and the support / waveguide are joined together, so that an optical fiber connection can be made without the need for precise alignment work, resulting in low loss, high reliability, low cost, and single-core transmission / reception. Devices can be realized.

The light emitting and receiving mechanism element according to the second aspect of the present invention is constituted by connecting an array of light receiving and emitting elements and a light-transmitting support / waveguide, and the light receiving and emitting elements are monolithically confocal. Forming a coupler of the type, a light-transmitting support / waveguide supports the optical fiber, has a concave or convex support part with a central axis, and aligns the optical axis with the central axis to form an array, respectively. A device in which the light emitting / receiving element and the support / waveguide are joined, so that an optical fiber array can be connected without requiring precise alignment work, and a device capable of transmitting and receiving at a low loss, high reliability, and a high transmission rate. Can be realized.

The light emitting and receiving mechanism element according to claim 3 of the present invention is constituted by an edge emitting type light receiving and emitting element.
Accordingly, a light receiving and emitting structure on the same substrate can be easily realized.

The light emitting and receiving mechanism element according to claim 4 of the present invention is constituted by a surface emitting type light emitting and receiving element. Therefore, the light emitting and receiving structure on the same substrate, such as a confocal laser coupler, is used. It can be realized relatively easily.

In the light emitting / receiving mechanism element according to the fifth aspect of the present invention, since a circuit mechanism for electrical connection is connected to the light emitting / receiving element, electrical connection is easily performed by using this circuit mechanism. Thus, the light emitting and receiving mechanism element can be used as an optical connector for connecting an optical fiber, and workability can be remarkably improved.

According to a sixth aspect of the present invention, there is provided a method for manufacturing an optical communication device, comprising: a plurality of light receiving / emitting elements; a wafer formed at a predetermined interval and direction; A pair of light-transmitting wafers made at the same interval and direction are overlapped with each other with their optical axes aligned with the central axis, bonded together, and then cut into individual light receiving and emitting mechanism elements. Therefore, at the wafer stage, individual alignment and unification of a plurality of constituent parts can be performed at once. Therefore, it is suitable for mass production of individual parts, and can improve quality and reduce costs.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a light emitting and receiving mechanism element, comprising: a wafer having a plurality of light emitting and receiving elements formed at predetermined intervals and directions; A set of light-transmitting wafers made at the same interval and direction, with the optical axis and the central axis aligned, stacked and bonded, and then cut to form an array of light receiving and emitting mechanism elements Therefore, at the wafer stage, individual alignment and unification of a plurality of constituent parts can be performed at once. Therefore, it is suitable for mass production of array components, and quality improvement and cost reduction can be achieved.

An optical communication device according to claim 8 of the present invention is:
Since the optical fiber is united and joined to the support portion of the light emitting and receiving mechanism element, the optical communication element can be regarded as an electrical connector and can be operated, thereby simplifying the operation, shortening the operation time, and reducing the operation cost. And high-quality communication.

An optical communication element according to claim 9 of the present invention is:
Since the array-shaped optical fibers are joined and bonded to each support portion of the array-shaped light receiving and emitting mechanism element, the optical communication element can be regarded as an electrical connector, thereby simplifying the operation and reducing the operation time. Shortening and work costs are reduced, and high quality and high transfer rate communication can be performed.

In the optical communication device according to the tenth aspect of the present invention, since a tip of the optical fiber is formed at the tip,
Laser light can be effectively condensed by the forward sphere, so that highly reliable optical communication with little variation in quality can be realized.

In the optical communication device according to the eleventh aspect of the present invention, since the gradient index lens is provided at the tip of the optical fiber, optical coupling with the gradient index lens can be achieved only by cutting the optical fiber. Thus, optical fibers can be connected without the need for precise alignment work. That is, high-quality and high-reliability optical communication can be realized by simpler connection work.

An electric circuit according to a twelfth aspect of the present invention comprises:
Since the light receiving / emitting mechanism element or the optical communication element is directly or indirectly bonded, the work of connecting the optical fiber to the electric circuit becomes easy, or the work of connecting the optical fiber to the electric circuit becomes unnecessary. As a result, simplification of the operation, cost reduction, and improvement in reliability can be realized.

As described above, according to the present invention, it is possible to realize a device capable of transmitting and receiving data with low loss, high reliability, low cost, and a single core.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a first embodiment of a light emitting and receiving mechanism element and an optical communication element according to the present invention.

FIG. 2 is a cross-sectional view showing a state of attachment to a circuit board according to the first embodiment of the light emitting and receiving mechanism element according to the present invention.

FIG. 3 is a sectional view of a second embodiment of the optical communication device according to the present invention.

FIG. 4 is a perspective view showing wafer bonding, which is one manufacturing process of the light emitting and receiving mechanism element according to the present invention.

FIG. 5 is an explanatory diagram of wafer alignment in the step shown in FIG. 4;

FIG. 6 is a perspective view of a wafer bonded in the manufacturing process of FIG. 4;

FIG. 7 is a perspective view showing wafer dicing in a step following FIG. 4;

FIG. 8 is a sectional view showing another state of attachment to a circuit board according to the second embodiment of the light emitting and receiving mechanism element according to the present invention.

FIG. 9 is a sectional view of a third embodiment of a light receiving / emitting mechanism element and an optical communication element according to the present invention.

FIG. 10 is a sectional view of a fourth embodiment of a light emitting and receiving mechanism element and an optical communication element according to the present invention.

FIG. 11 is a sectional view of a fifth embodiment of a light receiving and emitting mechanism element and an optical communication element according to the present invention.

FIG. 12 is a sectional view of a light emitting and receiving mechanism element and an optical communication element according to a sixth embodiment of the present invention.

FIG. 13 is a sectional view of an optical communication element according to a seventh embodiment of the present invention.

FIG. 14 is a sectional view of an eighth embodiment of the optical communication device according to the present invention.

FIG. 15 is a sectional view of a ninth embodiment of the optical communication device according to the present invention.

FIG. 16 is an exploded perspective view of a light emitting and receiving mechanism element and an optical communication element according to a tenth embodiment of the present invention.

[Explanation of symbols]

E1 ... optical communication element, Sr1 ... light receiving / emitting mechanism element, 2 ...
... Light receiving / emitting element, 2A... Reflective surface, 3... Light transmitting support / waveguide, 3A... Support portion, 3B... Opening, 3C.
Bottom, 3D wall, 4 joint, 6 optical axis, 7
... adhesive, 10 ... single mode fiber, 10A
… Front sphere, LD… Light emitting element, PD… Light receiving element.

[Procedure amendment]

[Submission date] November 18, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0027

[Correction method] Change

[Correction contents]

In this embodiment, the edge emitting type CLC element is formed as described above. However, the structure of the present invention is not limited to such an edge emitting type CLC element. Surface-emitting VCSEL
(Vertical Cavity Surface
Emitting Laser) or a quasi-surface emitting LD having a simpler configuration can be applied. In addition, in addition to the configuration in which the light receiving element is located within the range of the confocal depth of focus, the configuration of the present invention provides the light receiving element within the range extended up to about 30% from the range of the confocal depth of focus. also no problem with a configuration in which position, the light-receiving
The element does not need to be within the diffraction limit. Therefore, in the present invention, all of the above possible configurations are put together,
Confocal coupler>. In this specification, it is described as <confocal coupler>.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0035

[Correction method] Change

[Correction contents]

The formation of the via hole VH is performed, for example, by using GaAs.
Making a hole of about 150 μm diameter in s substrate by RIE (Reactive Ion Etching) method and applying a partial gold plating process
To form an electrode . The connection resistance of the via hole VH thus configured is 1 mOhm or less.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

In particular, if the lens system has an NA of about 0.14 to 0.20, it can be easily applied to a confocal coupler effectively. In the case of a multi-mode fiber, it is also possible to employ a configuration in which the light receiving element PD is configured more easily by utilizing the spread of the received light beam in reverse. In the case of a butt joint, a confocal coupler
Does not work, but because the received beam spreads,
Similarly, it is possible to configure the PD more easily (without restriction on the position).
It is also possible to make it.

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 13

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification number Agency reference number FI Technical indication H04B 10/28 H04B 9/00 W 10/02 (72) Inventor Masato Doi Kitashinagawa, Shinagawa-ku, Tokyo 6-chome 7-35 Sony Corporation

Claims (12)

[Claims] 1. A light-receiving / emitting element and a light-transmitting support / waveguide are coupled to each other, wherein the light-receiving / emitting element monolithically forms a confocal coupler, and A concave or convex supporting portion having a central axis for supporting the optical fiber by the corrugated body; and the optical axis of the light emitting / receiving element and the central axis of the supporting / waveguide are aligned with each other. A light emitting and receiving mechanism element, wherein the light emitting element and the support / waveguide are joined. 2. A light receiving and emitting device comprising: a plurality of light receiving and emitting elements arranged in an array and a plurality of light-transmitting supporting / waveguides arranged in an array; The element monolithically forms a confocal coupler, the light-transmitting supporting / waveguide supports an optical fiber, and has a concave or convex supporting portion having a central axis; The optical axis and the central axis of each support / waveguide are aligned with each other, and a plurality of light emitting / receiving elements arranged in the array and a plurality of supports / lights arranged in the array are arranged. A light emitting and receiving mechanism element, wherein the light receiving and emitting mechanism element is bonded to a waveguide. 3. The light receiving and emitting mechanism element according to claim 1, wherein said light receiving and emitting element is of an edge emitting type. 4. The light emitting and receiving mechanism element according to claim 1, wherein the light emitting and receiving element is of a surface emitting type. 5. The light emitting and receiving mechanism element according to claim 1, wherein a circuit mechanism for electrical connection is connected to the light receiving and emitting element. 6. A semiconductor manufacturing wafer in which a plurality of light emitting / receiving elements having an optical axis are formed on the same wafer at a predetermined interval and direction, and a concave or convex shape having a central axis. A plurality of sets of support / waveguides each having a support portion, at the predetermined interval and direction, and a light-transmissive wafer built on another same wafer as the above, The optical axis and the central axis of the support / waveguide are aligned and overlapped and bonded, and the bonded wafer is cut, and the one light receiving / emitting element and the one support / waveguide are cut. A method for manufacturing a light receiving and emitting mechanism element, wherein one light receiving and light emitting mechanism element joined to a body is manufactured. 7. A semiconductor manufacturing wafer in which a plurality of light emitting and receiving elements having an optical axis are formed on the same wafer at a predetermined interval and direction, a concave or convex shape having a central axis, and A plurality of sets of support / waveguides each having a support portion, at the predetermined interval and direction, and a light-transmissive wafer built on another same wafer as the above, The optical axis and the center axis of the support / waveguide are aligned and bonded together, bonded and cut, and the bonded wafer is cut, so that the several adjacent light emitting and receiving elements and the several adjacent A method for manufacturing a light emitting and receiving mechanism element, comprising manufacturing a light emitting and receiving mechanism element formed in an array by joining a support / waveguide. 8. An optical communication device, wherein an optical fiber is joined to the supporting portion of the light emitting / receiving mechanism element according to claim 1, 2, 3, 4, or 5. 9. An optical communication device, wherein an array-like optical fiber is united and joined to each of the support portions of the array-like light receiving and emitting mechanism device according to claim 2, 3, 4, or 5. . 10. The optical communication device according to claim 8, wherein a tip of the optical fiber is formed with a spherical tip. 11. The optical communication device according to claim 8, wherein a gradient index lens is provided at a position of a tip of the optical fiber. 12. An electric circuit in which the light receiving / emitting mechanism element according to claim 1, 2, 3, 4 or 5 or the optical communication element according to claim 8, 9, 10 or 11 is directly or indirectly joined. .