CN115026977A - Temperature-adjustable LED packaging structure - Google Patents
Temperature-adjustable LED packaging structure Download PDFInfo
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- CN115026977A CN115026977A CN202210555509.7A CN202210555509A CN115026977A CN 115026977 A CN115026977 A CN 115026977A CN 202210555509 A CN202210555509 A CN 202210555509A CN 115026977 A CN115026977 A CN 115026977A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 238000009434 installation Methods 0.000 claims abstract description 21
- 230000033228 biological regulation Effects 0.000 claims abstract description 8
- 230000008844 regulatory mechanism Effects 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims description 16
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 5
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 5
- 241001330002 Bambuseae Species 0.000 claims description 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 5
- 239000011425 bamboo Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 230000007306 turnover Effects 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 20
- 238000000034 method Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/307—Mould plates mounted on frames; Mounting the mould plates; Frame constructions therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a temperature-adjustable LED packaging structure, and relates to the technical field of LED packaging. Including the rectangle case, fixed mounting has the baffle between the inner wall of rectangle case, the baffle is separated the rectangle case from last to separating for installation room and regulation room down, fixed mounting has fixture on the inner wall about the corresponding rectangle case of installation room on the inner wall, the rectangle opening has been seted up with mould body corresponding position to the last lateral wall of rectangle case, ball nut passes through guiding mechanism and rectangle case rear side inner wall swing joint, be provided with temperature regulation mechanism in the regulation room. The die body is convenient to disassemble and assemble and is more firmly fixed, the temperature of the die body is convenient to adjust through the temperature adjusting mechanism, the die can keep constant temperature under different environments, the die is convenient to glue, the level of the die body can be adjusted through the level adjusting mechanism, glue in the die is full, and the glue pouring quality is better.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a temperature-adjustable LED packaging structure.
Background
The LED package is a package of a light emitting chip, and is different from an integrated circuit package, and the package of the LED not only requires to protect a wick, but also needs to transmit light, so the package of the LED has special requirements for a package material, generally, the package has a function of providing sufficient protection for the chip, and the chip is prevented from being exposed in the air for a long time or being damaged mechanically and losing efficacy, so as to improve the stability of the chip, and also needs to have good light extraction efficiency and good heat dissipation, and during the LED package process, the LED needs to be encapsulated, but the existing LED package is encapsulated, and the following problems also exist:
among the prior art, the mould that LED packaging structure used is difficult to fix, can appear inclining or toppling over at the in-process mould of encapsulating, cause glue to spill, it is inconvenient to use, the mould that LED packaging structure used does not possess the temperature regulation function, under the temperature environment of difference, the mould temperature is also different, the phenomenon that glue can appear solidifying or be difficult to solidify in leading to the mould, cause between the encapsulating relatively poor, the difficult regulatory level of mould that LED packaging structure used, the mould can incline after placing, glue can spill over in the mould, and the mould is interior glue can't fill plump, cause the encapsulating failure.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a temperature-adjustable LED packaging structure to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a temperature-adjustable LED packaging structure comprises a rectangular box, wherein a partition plate is fixedly arranged between the inner walls of the rectangular box, the rectangular box is divided into an installation chamber and an adjustment chamber by the partition plate from top to bottom, clamping mechanisms are fixedly arranged on the inner walls of the left and right inner walls of the rectangular box corresponding to the installation chamber, each clamping mechanism comprises a lead screw, a bearing seat, a rotating handle, a ball nut and a clamping plate, the lead screw is fixedly arranged between the left and right inner walls of the rectangular box through the bearing seats, the right side surface of the lead screw is inserted outside the rectangular box, the rotating handle is fixedly arranged on the right side surface of the lead screw, the upper thread of the lead screw is reversely arranged along the center in the left and right directions, the ball nuts are symmetrically arranged on the lead screw close to the left and right positions, clamping plates are fixedly arranged on the upper surfaces of the ball nuts, a die body is fixedly arranged between the clamping plates, and rectangular openings are formed in the corresponding positions of the upper side wall of the rectangular box and the die body, the utility model discloses a temperature regulation device for a refrigerator, including splint, ball nut, heating plate, cold head, heat exchange tube, fan and temperature sensor, the last fixed surface of splint installs the baffle, and the baffle upper surface is laminated with rectangle case upside inner wall mutually, ball nut passes through guiding mechanism and rectangle case rear side inner wall swing joint, be provided with temperature regulation mechanism in the adjustment chamber, temperature regulation mechanism includes heating plate, cold head, heat exchange tube, fan and temperature sensor, the even fixed mounting of heating plate is in the baffle lower surface, cold head fixed mounting is in rectangle case left surface, fixed mounting has the heat exchange tube on the business turn over liquid mouth of cold head, and the heat exchange tube inserts and locate in the adjustment chamber, be provided with the fan about being close to on the baffle, the corresponding rectangle case front side inner wall middle part fixed mounting of installation room has temperature sensor, the lower surface of rectangle case passes through horizontal adjustment mechanism fixed mounting and has the bottom plate.
As a preferred technical scheme of the invention, the front side and the rear side of the baffle are attached to the front inner wall and the rear inner wall of the rectangular box, and the baffle is attached to the left inner wall and the right inner wall of the rectangular box when the ball nuts are close to the left inner wall and the right inner wall of the rectangular box.
As a preferable technical scheme of the invention, the guide mechanism comprises a guide block and a guide groove, the guide block is fixedly arranged at the back of the ball nut, the guide grooves are formed in the inner walls of the rear sides of the rectangular boxes corresponding to the guide block, and the guide block is movably inserted into the guide groove.
As a preferable technical scheme of the invention, the front side and the rear side of the die body are attached to the front inner wall and the rear inner wall of the rectangular opening, and the upper surface of the die body is 1.5cm-3cm higher than the upper surface of the rectangular box.
As a preferred technical scheme of the invention, the front and rear inner walls and the left and right inner walls of the rectangular box corresponding to the installation chamber and the adjusting chamber are fixedly provided with heat insulation plates.
As a preferable technical scheme of the invention, a mounting hole for mounting the fan is formed in the position, corresponding to the fan, of the partition plate, and a ventilation hole is formed in the position, close to the front side, of the partition plate.
As a preferable technical scheme of the invention, a safety exhaust valve is fixedly arranged at the position of the lower surface of the rectangular box corresponding to the adjusting chamber.
As a preferred technical scheme, the horizontal adjusting mechanism comprises a turntable, threaded cylinders, bolt rods and a level meter, wherein the turntable is rectangular and fixedly arranged at four corners of the lower surface of a rectangular box, the threaded cylinders are fixedly arranged on the lower surfaces of the turntable, the bolt rods are arranged on the lower surfaces of the threaded cylinders in a threaded mode, the lower surfaces of the bolt rods are fixedly connected with the upper surface of a bottom plate, and the level meter is fixedly arranged in the middle of the lower surface of the rectangular box.
As a preferable technical scheme of the invention, the lower surface of the bottom plate is fixedly provided with an anti-skid rubber pad.
As a preferred technical scheme of the invention, the heat exchange tube is a U-shaped circulating pipeline, and the right side surface of the heat exchange tube is attached to the inner wall of the right side of the rectangular box.
Compared with the prior art, the invention provides a temperature-adjustable LED packaging structure, which has the following beneficial effects:
1. this temperature adjustable LED packaging structure, screw drive ball nut removes through setting up fixture, make ball nut drive and remove about splint, splint are fixed with mould body centre gripping, be convenient for carry out the dismouting to the mould body, the mould body is fixed more firm, avoid the mould to empty a bit, heating plate or heat exchange tube adjust the interior temperature of regulating room through setting up among the temperature regulation mechanism, rethread fan blows in the air in the regulating room installation room, adjust the temperature of the mould body in the installation room, make the mould all can keep constant temperature under different environment, make the mould body be convenient for the encapsulating, glue makes things convenient for the LED work piece to insert more in the mould body, avoid glue to solidify.
2. This temperature adjustable LED packaging structure, it is rotatory through setting up a screw thread section of thick bamboo among the horizontal adjustment mechanism, make the shank of bolt reciprocate in a screw thread section of thick bamboo, make the shank of bolt drive the bottom plate and go up to remove, highly adjust the bottom plate four corners, the horizontality of rectangle case is looked over to the rethread spirit level meter, can adjust the level of mould body, make the internal glue surface level of mould, and glue is plump in the mould body, the encapsulating quality is better, through setting up the removal about ball nut about the baffle along with, adjust opening distance about the rectangle open-ended, can satisfy multiple mould body and place, and seal the installation room, reduce the temperature loss, the temperature regulation effect is better.
Drawings
Fig. 1 is a schematic structural diagram of a temperature-adjustable LED package structure according to the present invention;
FIG. 2 is a cross-sectional view of an LED package structure with adjustable temperature according to the present invention;
FIG. 3 is a top view of a rectangular box of a temperature-adjustable LED package structure according to the present invention;
FIG. 4 is a top cross-sectional view of a rectangular box of a temperature-tunable LED package structure according to the present invention;
fig. 5 is a top view of a heat exchange tube of a temperature-adjustable LED package structure according to the present invention.
In the figure: 1. a rectangular box; 2. a partition plate; 3. an installation chamber; 4. a conditioning chamber; 5. a clamping mechanism; 501. a screw rod; 502. a bearing seat; 503. rotating the handle; 504. a ball nut; 505. a splint; 6. a mold body; 7. a rectangular opening; 8. a baffle plate; 9. a guide mechanism; 901. a guide block; 902. a guide groove; 10. a temperature adjustment mechanism; 101. heating plates; 102. cooling the head; 103. a heat exchange pipe; 104. a fan; 105. a temperature sensor; 11. a horizontal adjustment mechanism; 111. a turntable; 112. a threaded barrel; 113. a bolt shank; 114. a level gauge; 12. a base plate; 13. a heat-insulating board; 14. mounting holes; 15. a vent hole; 16. a safety exhaust valve; 17. anti-skid rubber pad.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-5, a temperature-adjustable LED package structure includes a rectangular box 1, a partition plate 2 is fixedly installed between inner walls of the rectangular box 1, the rectangular box 1 is divided into an installation chamber 3 and an adjustment chamber 4 by the partition plate 2 from top to bottom, clamping mechanisms 5 are fixedly installed on inner walls of left and right inner walls of the rectangular box 1 corresponding to the installation chamber 3, each clamping mechanism 5 includes a screw rod 501, a bearing seat 502, a rotating handle 503, a ball nut 504 and a clamping plate 505, the screw rod 501 is fixedly installed between the left and right inner walls of the rectangular box 1 through the bearing seat 502, a right side surface of the screw rod 501 is inserted into an outer side of the rectangular box 1, the rotating handle 503 is fixedly installed on the right side surface of the screw rod 501, a thread on the screw rod 501 is reversely arranged along a center, the ball nuts 504 are symmetrically arranged near left and right positions, the upper surface of the screw rod 501 is fixedly installed with the clamping plate 505, a mold body 6 is fixedly arranged between the clamping plates 505 in a clamping manner, a rectangular opening 7 is arranged at the position, corresponding to the mold body 6, of the upper side wall of the rectangular box 1, a baffle 8 is fixedly arranged on the upper surface of the clamping plates 505, the upper surface of the baffle 8 is attached to the inner wall of the upper side of the rectangular box 1, the ball nut 504 is movably connected with the inner wall of the rear side of the rectangular box 1 through a guide mechanism 9, a temperature adjusting mechanism 10 is arranged in the adjusting chamber 4, the temperature adjusting mechanism 10 comprises a heating plate 101, a cold head 102, a heat exchange tube 103, a fan 104 and a temperature sensor 105, the heating plate 101 is uniformly and fixedly arranged on the lower surface of the partition plate 2, the cold head 102 is fixedly arranged on the left side surface of the rectangular box 1, the heat exchange tube 103 is fixedly arranged on a liquid inlet and outlet of the cold head 102, the heat exchange tube 103 is inserted in the adjusting chamber 4, and the fan 104 is arranged on the partition plate 2 near the left and right sides, a temperature sensor 105 is fixedly installed in the middle of the inner wall of the front side of the rectangular box 1 corresponding to the installation chamber 3, and a bottom plate 12 is fixedly installed on the lower surface of the rectangular box 1 through a horizontal adjusting mechanism 11.
The LED packaging structure with adjustable temperature drives the ball nut 504 to move by arranging the screw 501 in the clamping mechanism 5, so that the ball nut 504 drives the clamping plate 505 to move left and right, the clamping plate 505 clamps and fixes the die body 6 to be convenient for dismounting and mounting the die body 6, the die body 6 is more firmly fixed and is prevented from being toppled somewhat, the temperature in the adjusting chamber 4 is adjusted by arranging the heating plate 101 or the heat exchange tube 103 in the temperature adjusting mechanism 10, then air in the adjusting chamber 4 is blown into the mounting chamber 3 by the fan 104, the temperature of the die body 6 in the mounting chamber 3 is adjusted, so that the die can be kept at constant temperature under different environments, the glue is convenient for pouring the die body 6, the LED workpiece can be more conveniently inserted into the die body 6 to avoid the glue solidification, the screw cylinder 112 rotates by arranging the horizontal adjusting mechanism 11, so that the bolt rod 113 moves up and down in the screw cylinder 112, make 113 drive bottom plate 12 of shank of bolt and go up the removal, highly adjust the bottom plate 12 four corners, the horizontality of rectangle case 1 is looked over through spirit level 114 again, can adjust the level of mould body 6, make mould body 6 internal glue surface level, and glue is full in mould body 6, the encapsulating quality is better, through setting up the removal about ball nut 504 about baffle 8 is along with, open distance adjusts about rectangle opening 7, can satisfy multiple mould body 6 and place, and seal up installation chamber 3, reduce the temperature loss, the temperature regulation effect is better.
As a specific technical scheme of this embodiment, the front and back side of baffle 8 laminates with the front and back inner wall of rectangle case 1 mutually, and baffle 8 laminates with the left and right inner wall of rectangle case 1 when ball nut 504 is close to the left and right inner wall of rectangle case 1, and baffle 8 moves about along with ball nut 504, adjusts the open area about rectangle opening 7, can satisfy the mould body 6 of multiple length and place the use.
As a specific technical solution of this embodiment, the guide mechanism 9 includes a guide block 901 and a guide groove 902, the guide block 901 is fixedly installed at the rear of the ball nut 504, the guide grooves 902 are respectively formed on the inner walls of the rear sides of the rectangular boxes 1 corresponding to the guide block 901, the guide block 901 is movably inserted into the guide groove 902, and the guide block 901 moves left and right in the guide groove 902 along with the ball nut 504, and moves the ball nut 504 left and right, so that the ball nut 504 moves left and right.
As a specific technical solution of this embodiment, the front and rear side surfaces of the mold body 6 are attached to the front and rear inner walls of the rectangular opening 7, the upper surface of the mold body 6 is 1.5cm to 3cm higher than the upper surface of the rectangular box 1, and the front and rear side surfaces of the mold body 6 seal the front and rear side surfaces of the rectangular opening 7 to reduce temperature loss.
As a specific technical scheme of this embodiment, equal fixed mounting has heated board 13 around installation room 3 and the corresponding rectangle case 1 of control room 4 on the inner wall about and, heated board 13 makes rectangle case 1's heat preservation effect more, reduces the temperature and runs off.
As a specific technical scheme of this embodiment, a mounting hole 14 for installing the fan 104 is formed in a position, corresponding to the fan 104, on the partition board 2, a vent hole 15 is formed in a position, close to the front side, on the partition board 2, the mounting hole 14 facilitates installation of the fan 104, and the vent hole 15 and the fan 104 are matched to enable air in the rectangular box 1 to flow, so that the temperature is uniform, and the temperature regulation efficiency is higher.
As a specific technical solution of this embodiment, a safety exhaust valve 16 is fixedly installed at a position corresponding to the adjustment chamber 4 on the lower surface of the rectangular box 1, and the safety exhaust valve 16 prevents the air pressure in the rectangular box 1 from being too high, so that the use is safer.
As a specific technical solution of this embodiment, the horizontal adjustment mechanism 11 includes a rotary table 111, a thread cylinder 112, a bolt bar 113 and a level meter 114, the rotary table 111 is rectangular and fixedly mounted at four corners of the lower surface of the rectangular box 1, the thread cylinders 112 are fixedly mounted on the lower surface of the rotary table 111, the bolt bar 113 is threadedly mounted on the lower surface of the thread cylinder 112, the lower surface of the bolt bar 113 is fixedly connected with the upper surface of the bottom plate 12, the level meter 114 is fixedly mounted in the middle of the lower surface of the rectangular box 1, the rotary table 111 enables the thread cylinder 112 to rotate, the thread cylinder 112 rotates to enable the bolt bar 113 to move up and down, and the bolt bar 113 drives the bottom plate 12 to move up and down to adjust the level of the rectangular box 1.
As a specific technical solution of this embodiment, the anti-skid rubber pad 17 is fixedly installed on the lower surface of the bottom plate 12, and the anti-skid rubber pad 17 makes the bottom plate 12 more stably placed and not easy to slide.
As a specific technical scheme of this embodiment, the heat exchange tube 103 is a U-shaped circulation pipeline, and the right side of the heat exchange tube 103 is attached to the inner wall of the right side of the rectangular box 1, so that the heat exchange effect of the heat exchange tube 103 is better, and the area is wider.
The working principle and the using process of the invention are as follows: when the mould is used, the mould body 6 is placed in the rectangular box 1 through the rectangular opening 7, the mould body 6 is placed on the upper surface of the partition plate 2, the screw rod 501 is driven to rotate through the rotating handle 503 in the clamping mechanism 5, the screw rod 501 drives the left and right ball nuts 504 to move, the ball nuts 504 drive the clamping plate 505 to move left and right, the clamping plate 505 clamps and fixes the mould body 6, the mould body 6 is more firmly fixed, the mould is prevented from toppling, the threaded cylinder 112 can rotate through the middle rotating disc 111 of the horizontal adjusting mechanism 11, the threaded cylinder 112 rotates, the bolt rod 113 moves up and down in the threaded cylinder 112, the bolt rod 113 drives the bottom plate 12 to move, the heights of four corners of the bottom plate 12 are adjusted, the horizontal state of the rectangular box 1 is checked through the level meter 114, the level of the mould body 6 can be adjusted, and the glue water upper surface in the mould body 6 is leveled, and glue is plump in mould body 6, encapsulating quality is better, when external temperature is lower, heat plate 101 adjusts the temperature in adjustment chamber 4 through among temperature regulation mechanism 10, rethread fan 104 will adjust the indoor air blow into installation room 3 of 4, adjust the temperature of mould body 6 in installation room 3, make mould body 6 temperature can not hang down excessively, when in the higher environment of temperature, make cold head 102 cool down adjustment chamber 4 through heat exchange tube 103, thereby cool down mould body 6, mould body 6 all can keep constant temperature under different environment, make mould body 6 be convenient for the encapsulating, glue makes things convenient for the LED work piece to insert more in mould body 6, avoid glue to solidify.
To sum up, this temperature adjustable's LED packaging structure is convenient for carry out the dismouting to mould body 6, and is fixed more firm, and rethread temperature regulation mechanism 10 is convenient for adjust the temperature of mould body 6, makes mould body 6 all can keep constant temperature under different environment, makes mould body 6 be convenient for the encapsulating, and rethread horizontal adjustment mechanism 11 can adjust the level of mould body 6, makes the interior glue of mould body 6 plump, and the encapsulating quality is better.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a temperature adjustable LED packaging structure, includes rectangle case (1), its characterized in that: a partition plate (2) is fixedly arranged between the inner walls of the rectangular boxes (1), the rectangular boxes (1) are divided into an installation chamber (3) and an adjusting chamber (4) by the partition plate (2) from top to bottom, and clamping mechanisms (5) are fixedly arranged on the inner walls of the left inner wall and the right inner wall of the rectangular boxes (1) corresponding to the installation chamber (3);
the clamping mechanism (5) comprises a screw rod (501), a bearing seat (502), a rotating handle (503), ball nuts (504) and clamping plates (505), the screw rod (501) is fixedly arranged between the left inner wall and the right inner wall of the rectangular box (1) through the bearing seat (502), the right side surface of the screw rod (501) is inserted in the outer side of the rectangular box (1), the rotating handle (503) is fixedly arranged on the right side surface of the screw rod (501), the upper thread of the screw rod (501) is reversely arranged along the left side and the right side of the center, the ball nuts (504) are symmetrically arranged on the screw rod (501) close to the left side and the right side, the clamping plates (505) are fixedly arranged on the upper surface of the ball nuts (504), a die body (6) is fixedly arranged between the clamping plates (505), and a rectangular opening (7) is formed in the corresponding position of the upper side wall of the rectangular box (1) and the die body (6), a baffle (8) is fixedly arranged on the upper surface of the clamping plate (505), the upper surface of the baffle (8) is attached to the inner wall of the upper side of the rectangular box (1), the ball nut (504) is movably connected with the inner wall of the rear side of the rectangular box (1) through a guide mechanism (9), and a temperature adjusting mechanism (10) is arranged in the adjusting chamber (4);
temperature regulation mechanism (10) are including hot plate (101), cold head (102), heat exchange tube (103), fan (104) and temperature sensor (105), the even fixed mounting of hot plate (101) is in baffle (2) lower surface, cold head (102) fixed mounting is in rectangle case (1) left surface, fixed mounting has heat exchange tube (103) on the business turn over liquid mouth of cold head (102), and heat exchange tube (103) insert locate in regulation room (4), be close to about being provided with fan (104) on baffle (2), corresponding rectangle case (1) front side inner wall middle part fixed mounting of installation room (3) has temperature sensor (105), the lower surface of rectangle case (1) has bottom plate (12) through horizontal adjustment mechanism (11) fixed mounting.
2. The LED package structure with adjustable temperature of claim 1, wherein: the front side and the rear side of the baffle (8) are attached to the front inner wall and the rear inner wall of the rectangular box (1), and the baffle (8) is attached to the left inner wall and the right inner wall of the rectangular box (1) when the ball nut (504) is close to the left inner wall and the right inner wall of the rectangular box (1).
3. The LED package structure with adjustable temperature of claim 1, wherein: the guide mechanism (9) comprises guide blocks (901) and guide grooves (902), the guide blocks (901) are fixedly mounted on the back of the ball nut (504), the guide grooves (902) are formed in the inner walls of the back sides of the rectangular boxes (1) corresponding to the guide blocks (901), and the guide blocks (901) are movably inserted into the guide grooves (902).
4. The LED package structure with adjustable temperature of claim 1, wherein: the front side and the rear side of the die body (6) are attached to the front inner wall and the rear inner wall of the rectangular opening (7), and the upper surface of the die body (6) is 1.5cm-3cm higher than the upper surface of the rectangular box (1).
5. The LED package structure with adjustable temperature of claim 1, wherein: and heat insulation plates (13) are fixedly arranged on the front and rear inner walls and the left and right inner walls of the rectangular box (1) corresponding to the mounting chamber (3) and the adjusting chamber (4).
6. The LED package structure with adjustable temperature of claim 1, wherein: the upper portion of the partition board (2) corresponds to the position of the fan (104) and is provided with a mounting hole (14) for mounting the fan (104), and the upper portion of the partition board (2) close to the front side is provided with a vent hole (15).
7. The LED package structure with adjustable temperature of claim 1, wherein: and a safety exhaust valve (16) is fixedly arranged at the position of the lower surface of the rectangular box (1) corresponding to the adjusting chamber (4).
8. The LED package structure with adjustable temperature of claim 1, wherein: horizontal adjustment mechanism (11) are including carousel (111), a screw thread section of thick bamboo (112), shank of bolt (113) and spirit level (114), carousel (111) are rectangle fixed mounting in rectangle case (1) lower surface four corners, the equal fixed mounting of lower surface of carousel (111) has a screw thread section of thick bamboo (112), the lower surface threaded mounting of a screw thread section of thick bamboo (112) has shank of bolt (113), fixed surface is connected on shank of bolt (113) lower surface and bottom plate (12), the lower surface middle part fixed mounting of rectangle case (1) has spirit level (114).
9. The LED package structure with adjustable temperature of claim 1, wherein: and an anti-skidding rubber pad (17) is fixedly arranged on the lower surface of the bottom plate (12).
10. The LED package structure with adjustable temperature of claim 1, wherein: the heat exchange tube (103) is a U-shaped circulating pipeline, and the right side surface of the heat exchange tube (103) is attached to the inner wall of the right side of the rectangular box (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210555509.7A CN115026977B (en) | 2022-05-19 | 2022-05-19 | Temperature-adjustable LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210555509.7A CN115026977B (en) | 2022-05-19 | 2022-05-19 | Temperature-adjustable LED packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN115026977A true CN115026977A (en) | 2022-09-09 |
| CN115026977B CN115026977B (en) | 2024-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210555509.7A Active CN115026977B (en) | 2022-05-19 | 2022-05-19 | Temperature-adjustable LED packaging structure |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108858960A (en) * | 2018-06-26 | 2018-11-23 | 芜湖博康汽车饰件有限公司 | A kind of automobile decoration piece injection-moulding device |
| CN212579152U (en) * | 2020-05-29 | 2021-02-23 | 南通格霖莱特汽车零部件有限公司 | Cooling protection device for mold temperature controller |
| CN113284828A (en) * | 2021-07-14 | 2021-08-20 | 潍坊市工程技师学院 | Constant temperature type packaging hardware is used in electronic product production |
| CN215318191U (en) * | 2021-04-26 | 2021-12-28 | 吉安米田科技有限公司 | CNC tool structure is used in processing of panel computer back of body lid |
-
2022
- 2022-05-19 CN CN202210555509.7A patent/CN115026977B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108858960A (en) * | 2018-06-26 | 2018-11-23 | 芜湖博康汽车饰件有限公司 | A kind of automobile decoration piece injection-moulding device |
| CN212579152U (en) * | 2020-05-29 | 2021-02-23 | 南通格霖莱特汽车零部件有限公司 | Cooling protection device for mold temperature controller |
| CN215318191U (en) * | 2021-04-26 | 2021-12-28 | 吉安米田科技有限公司 | CNC tool structure is used in processing of panel computer back of body lid |
| CN113284828A (en) * | 2021-07-14 | 2021-08-20 | 潍坊市工程技师学院 | Constant temperature type packaging hardware is used in electronic product production |
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| Publication number | Publication date |
|---|---|
| CN115026977B (en) | 2024-05-31 |
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