CN115026977B - Temperature-adjustable LED packaging structure - Google Patents
Temperature-adjustable LED packaging structure Download PDFInfo
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- CN115026977B CN115026977B CN202210555509.7A CN202210555509A CN115026977B CN 115026977 B CN115026977 B CN 115026977B CN 202210555509 A CN202210555509 A CN 202210555509A CN 115026977 B CN115026977 B CN 115026977B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 230000001105 regulatory effect Effects 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims abstract description 13
- 238000005192 partition Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 24
- 238000000034 method Methods 0.000 description 9
- 230000033228 biological regulation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 241000217776 Holocentridae Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/307—Mould plates mounted on frames; Mounting the mould plates; Frame constructions therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a temperature-adjustable LED packaging structure, and relates to the technical field of LED packaging. Including the rectangle case, fixed mounting has the baffle between the inner wall of rectangle case, the baffle separates the rectangle case from top to bottom into installation room and regulating chamber, fixed mounting has fixture on the inner wall about the corresponding rectangle case of installation room, the rectangle opening has been seted up with the corresponding position of mould body to the last lateral wall of rectangle case, ball nut passes through guiding mechanism and rectangle case rear side inner wall swing joint, be provided with temperature regulating mechanism in the regulating chamber. The invention is convenient for disassembling and assembling the die body, is more firm in fixation, and is convenient for adjusting the temperature of the die body through the temperature adjusting mechanism, so that the die can keep constant temperature in different environments, the die is convenient for glue filling, and the level of the die body can be adjusted through the level adjusting mechanism, so that the glue in the die is full, and the glue filling quality is better.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a temperature-adjustable LED packaging structure.
Background
The LED package refers to a package of a light emitting chip, and compared with an integrated circuit package, the LED package not only requires protection of a lamp wick, but also requires light transmission, so that the LED package has special requirements on a packaging material, and generally has the function of providing sufficient protection for the chip to prevent the chip from being exposed in air for a long time or being damaged mechanically to fail, so as to improve the stability of the chip, but also needs to have good light extraction efficiency and good heat dissipation, and in the process of LED package, the LED needs to be encapsulated, but the following problems are also existed in the process of encapsulating the existing LED package:
among the prior art, the mould that LED packaging structure used is difficult to fix, can appear the slope or empty at the in-process mould of encapsulating, causes glue to incline and spills, uses inconveniently, and the mould that LED packaging structure used does not possess temperature regulation function, and under different temperature environment, mould temperature is also different, leads to the glue to appear solidifying or be difficult to the phenomenon that solidifies in the mould, causes worse between the encapsulating, and the mould that LED packaging structure used is difficult to adjust the level, and the mould can incline after placing, and glue can overflow in the mould, and the unable filling of glue in the mould is full, causes the encapsulating failure.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an LED packaging structure with adjustable temperature, which solves the problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a temperature-adjustable LED packaging structure, includes the rectangle case, fixed mounting has the baffle between the inner wall of rectangle case, the baffle separates the rectangle case from top to bottom into installation room and regulating chamber, fixed mounting has fixture on the corresponding rectangle case of installation room about inner wall, fixture includes lead screw, bearing frame, twist grip, ball nut and splint, the lead screw passes through bearing frame fixed mounting between the inner wall about the rectangle case, the right flank of lead screw inserts the rectangle case outside, the right flank fixed mounting of lead screw has the twist grip, screw upper thread is about the center reverse arrangement, be close to left and right position symmetry on the lead screw is provided with ball nut, ball nut's upper surface all fixed mounting has splint, centre gripping fixed mounting has the mould body between the splint, rectangular opening has been seted up to the corresponding position of the upper side wall of rectangle case and mould body, the upper surface fixed mounting of splint has the baffle, and the upper side inner wall looks of rectangle case, ball nut passes through guiding mechanism and rectangle case rear side inner wall swing joint, the indoor temperature regulating mechanism that is provided with the cartridge, the temperature-adjusting mechanism is close to left and right side heat exchanger tube, the temperature-sensing device installs in the heat exchanger tube, the heat exchanger tube is installed in the corresponding to the side of rectangle, the cold and the heat exchanger tube is installed to the left and right side, the cold and the heat exchanger is fixed in the side, the heat exchanger is equipped with the corresponding to the heat exchanger tube, and the cold exchanger is installed in the side, and the air conditioner is installed in the side respectively, the lower surface of the rectangular box is fixedly provided with a bottom plate through a horizontal adjusting mechanism.
The front side and the rear side of the baffle are attached to the front inner wall and the rear inner wall of the rectangular box, and the baffle is attached to the left inner wall and the right inner wall of the rectangular box when the ball nut is close to the left inner wall and the right inner wall of the rectangular box.
The guide mechanism comprises guide blocks and guide grooves, the guide blocks are fixedly installed at the back of the ball nut, the guide grooves are formed in the inner walls of the rear sides of the rectangular boxes corresponding to the guide blocks, and the guide blocks are movably inserted into the guide grooves.
The front side surface and the rear side surface of the die body are attached to the front inner wall and the rear inner wall of the rectangular opening, and the upper surface of the die body is 1.5cm-3cm higher than the upper surface of the rectangular box.
And heat insulation plates are fixedly arranged on the front and rear and left and right inner walls of the rectangular box corresponding to the mounting chamber and the adjusting chamber.
The baffle plate is provided with a mounting hole for mounting the fan at a position corresponding to the fan, and the baffle plate is provided with a vent hole close to the front side.
And a safety exhaust valve is fixedly arranged on the lower surface of the rectangular box at a position corresponding to the regulating chamber.
The horizontal adjusting mechanism comprises a rotary table, thread barrels, bolt rods and a level meter, wherein the rotary table is fixedly installed at four corners of the lower surface of a rectangular box, the thread barrels are fixedly installed on the lower surface of the rotary table, the bolt rods are installed on the lower surface of the thread barrels in a threaded mode, the lower surface of the bolt rods is fixedly connected with the upper surface of a bottom plate, and the level meter is fixedly installed in the middle of the lower surface of the rectangular box.
The heat exchange tube is a U-shaped circulating pipeline, and the right side face of the heat exchange tube is attached to the right side inner wall of the rectangular box.
As a preferable technical scheme of the invention, the lower surface of the bottom plate is fixedly provided with an anti-skid rubber pad.
Compared with the prior art, the invention provides the LED packaging structure with adjustable temperature, which has the following beneficial effects:
1. This temperature adjustable's LED packaging structure drives ball nut through setting up in the fixture and removes, make ball nut drive splint and control the removal, splint are fixed with mould body centre gripping, be convenient for carry out the dismouting to the mould body, the mould body is fixed more firm, some avoid the mould to empty, adjust the interior temperature of regulation through heating plate or heat exchange tube in setting up temperature adjustment mechanism, the rethread fan is with adjusting indoor air and blowing in the installation room, adjust the temperature of installing indoor mould body, make the mould all can keep constant temperature under different environment, make the mould body be convenient for glue filling, glue makes things convenient for the LED work piece to insert more in the mould body, avoid glue to solidify.
2. This temperature adjustable LED packaging structure, screw thread section of thick bamboo is rotatory in through setting up horizontal adjustment mechanism, make the bolt pole reciprocate in screw thread section of thick bamboo, make the bolt pole drive the bottom plate and reciprocate, adjust the height of bottom plate four corners, the rethread spirit level looks over the horizontality of rectangle case, can adjust the level of mould body, make this internal glue upper surface level of mould, and glue is full in the mould body, it is better to irritate the colloid quality, through setting up the baffle and controlling the ball nut and controlling the removal, adjust rectangular opening's left and right opening distance, can satisfy multiple mould body and place, and seal the installing chamber, reduce the temperature loss, the temperature regulation effect is better.
Drawings
Fig. 1 is a schematic structural diagram of a temperature-adjustable LED package structure according to the present invention;
FIG. 2 is a cross-sectional view of a temperature-adjustable LED package structure according to the present invention;
FIG. 3 is a top view of a rectangular box of a temperature-adjustable LED package structure according to the present invention;
FIG. 4 is a top cross-sectional view of a rectangular box of a temperature-tunable LED package structure according to the present invention;
fig. 5 is a top view of a heat exchange tube of the temperature-adjustable LED package structure according to the present invention.
In the figure: 1. a rectangular box; 2. a partition plate; 3. a mounting chamber; 4. a conditioning chamber; 5. a clamping mechanism; 501. a screw rod; 502. a bearing seat; 503. rotating the handle; 504. a ball nut; 505. a clamping plate; 6. a die body; 7. a rectangular opening; 8. a baffle; 9. a guide mechanism; 901. a guide block; 902. a guide groove; 10. a temperature adjusting mechanism; 101. a heating plate; 102. a cold head; 103. a heat exchange tube; 104. a fan; 105. a temperature sensor; 11. a horizontal adjustment mechanism; 111. a turntable; 112. a thread cylinder; 113. a bolt rod; 114. a level gauge; 12. a bottom plate; 13. a thermal insulation board; 14. a mounting hole; 15. a vent hole; 16. a safety exhaust valve; 17. an anti-skid rubber pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-5, a temperature-adjustable LED package structure comprises a rectangular box 1, wherein a partition plate 2 is fixedly installed between inner walls of the rectangular box 1, the partition plate 2 partitions the rectangular box 1 into an installation chamber 3 and an adjustment chamber 4 from top to bottom, a clamping mechanism 5 is fixedly installed on left and right inner walls of the rectangular box 1 corresponding to the installation chamber 3, the clamping mechanism 5 comprises a screw rod 501, a bearing seat 502, a rotating handle 503, a ball nut 504 and a clamping plate 505, the screw rod 501 is fixedly installed between the left and right inner walls of the rectangular box 1 through the bearing seat 502, the right side surface of the screw rod 501 is inserted into the outer side of the rectangular box 1, the right side surface of the screw rod 501 is fixedly provided with a rotating handle 503, upper threads of the screw rod 501 are reversely arranged along the center, the ball nut 504 is symmetrically arranged on the screw rod 501 near the left and right positions, the upper surfaces of the ball nuts 504 are fixedly provided with clamping plates 505, the mold body 6 is clamped and fixedly arranged between the clamping plates 505, rectangular openings 7 are formed in positions, corresponding to the mold body 6, of the upper side walls of the rectangular box 1, the upper surfaces of the clamping plates 505 are fixedly provided with baffle plates 8, the upper surfaces of the baffle plates 8 are attached to the inner walls of the upper sides of the rectangular box 1, the ball nuts 504 are movably connected with the inner walls of the rear sides of the rectangular box 1 through guide mechanisms 9, the temperature regulating mechanisms 10 are arranged in the regulating chambers 4, the temperature regulating mechanisms 10 comprise heating plates 101, cold heads 102, heat exchange tubes 103, fans 104 and temperature sensors 105, the heating plates 101 are uniformly and fixedly arranged on the lower surfaces of the partition plates 2, the cold heads 102 are fixedly arranged on the left sides of the rectangular box 1, heat exchange tubes 103 are fixedly arranged on liquid inlet and outlet openings of the cold heads 102, and the heat exchange tubes 103 are inserted into the regulating chambers 4, fans 104 are respectively arranged on the partition plate 2 close to the left side and the right side, a temperature sensor 105 is fixedly arranged in the middle of the inner wall of the front side of the rectangular box 1 corresponding to the installation chamber 3, and a bottom plate 12 is fixedly arranged on the lower surface of the rectangular box 1 through a horizontal adjusting mechanism 11.
This temperature adjustable LED packaging structure drives ball nut 504 through setting up in fixture 5 and removes, make ball nut 504 drive splint 505 and control the removal, splint 505 is fixed with mould body 6 centre gripping, be convenient for carry out the dismouting to mould body 6, mould body 6 is fixed more firm, some avoid the mould to empty, heat board 101 or heat exchange tube 103 are adjusted the temperature in the regulating chamber 4 in through setting up temperature adjustment mechanism 10, rethread fan 104 is with the air in the regulating chamber 4 in installation room 3, the temperature of mould body 6 is adjusted in installation room 3, make the mould all can keep constant temperature under different environment, make mould body 6 be convenient for glue filling, glue makes things convenient for the LED work piece to insert more in mould body 6, avoid the glue to solidify, through setting up screw mandrel 112 in the horizontal adjustment mechanism 11 and rotate, make the screw mandrel 113 reciprocate in screw mandrel 112, make the screw mandrel 113 drive the upward movement of bottom plate 12, adjust the height of bottom plate 12, rethread level gauge 114 looks over the horizontality of rectangle case 1, can adjust the level of mould body 6, make the glue on the mould body 6, make the surface full in the mould body 6, and glue filling volume is better in the setting up the opening size of the mould body 6, the opening is better, the temperature is adjusted along with the opening is more than the opening is adjusted to the mould body 6, the size is adjusted along with the setting up the temperature is more than the opening is 3, the opening is more convenient for the left and is adjusted, the opening is more than the window 6.
As a specific technical scheme of this embodiment, the front and back sides of baffle 8 are laminated with the front and back inner walls of rectangular box 1, and baffle 8 is laminated with the left and right inner walls of rectangular box 1 when ball nut 504 is close to the left and right inner walls of rectangular box 1, baffle 8 moves left and right along with ball nut 504, and the left and right opening area of rectangular opening 7 is adjusted, so that the die body 6 with various lengths can be placed and used.
As a specific technical scheme of this embodiment, the guide mechanism 9 includes a guide block 901 and a guide groove 902, the guide blocks 901 are fixedly mounted at the rear of the ball nut 504, the guide grooves 902 are formed on the inner walls of the rear sides of the rectangular boxes 1 corresponding to the guide blocks 901, the guide blocks 901 are movably inserted into the guide grooves 902, the guide blocks 901 move left and right in the guide grooves 902 along with the ball nut 504, and the ball nut 504 moves left and right to make the ball nut 504 move left and right.
As a specific technical scheme of the embodiment, the front side and the rear side of the die body 6 are attached to the front and the rear inner walls of the rectangular opening 7, the upper surface of the die body 6 is 1.5cm-3cm higher than the upper surface of the rectangular box 1, and the front side and the rear side of the die body 6 seal the front side and the rear side of the rectangular opening 7 to reduce temperature loss.
As a specific technical scheme of the embodiment, the heat insulation plates 13 are fixedly arranged on the front, back, left and right inner walls of the rectangular box 1 corresponding to the installation chamber 3 and the adjusting chamber 4, and the heat insulation plates 13 enable the heat insulation effect of the rectangular box 1 to be more and reduce the temperature loss.
As a specific technical scheme of this embodiment, the mounting hole 14 for the fan 104 to be mounted is provided on the partition board 2 at a position corresponding to the fan 104, the vent hole 15 is provided on the partition board 2 near the front side, the mounting hole 14 facilitates the fan 104 to be mounted, and the vent hole 15 cooperates with the fan 104 to enable air in the rectangular box 1 to flow, so that the temperature is uniform, and the temperature adjustment efficiency is faster.
As a specific technical scheme of this embodiment, the lower surface of the rectangular box 1 is fixedly provided with a safety exhaust valve 16 at a position corresponding to the adjusting chamber 4, and the safety exhaust valve 16 prevents the air pressure in the rectangular box 1 from being too high, so that the use is safer.
As a specific technical scheme of this embodiment, the horizontal adjustment mechanism 11 includes a turntable 111, a thread cylinder 112, a bolt rod 113 and a level gauge 114, the turntable 111 is rectangular and fixedly installed at four corners of the lower surface of the rectangular box 1, the thread cylinder 112 is fixedly installed on the lower surface of the turntable 111, the bolt rod 113 is installed on the lower surface of the thread cylinder 112 in a threaded manner, the lower surface of the bolt rod 113 is fixedly connected with the upper surface of the bottom plate 12, the level gauge 114 is fixedly installed in the middle of the lower surface of the rectangular box 1, the turntable 111 enables the thread cylinder 112 to rotate, the bolt rod 113 is enabled to move up and down by rotation of the thread cylinder 112, and the bolt rod 113 drives the bottom plate 12 to move up and down to adjust the level of the rectangular box 1.
As a specific technical scheme of this embodiment, the anti-slip rubber pad 17 is fixedly mounted on the lower surface of the bottom plate 12, and the anti-slip rubber pad 17 makes the bottom plate 12 more stable to be placed and not easy to slip.
As a specific technical scheme of this embodiment, the heat exchange tube 103 is a U-shaped circulation pipeline, and the right side surface of the heat exchange tube 103 is attached to the right side inner wall of the rectangular box 1, so that the heat exchange effect of the heat exchange tube 103 is better, and the area is wider.
The working principle and the using flow of the invention are as follows: when in use, the die body 6 is placed in the rectangular box 1 through the rectangular opening 7, the die body 6 is placed on the upper surface of the partition plate 2, the screw rod 501 is driven to rotate by the rotating handle 503 in the clamping mechanism 5, the screw rod 501 drives the left and right ball nuts 504 to move, the ball nuts 504 drive the clamping plates 505 to move left and right, the clamping plates 505 clamp and fix the die body 6, the die body 6 is more firmly fixed, the die is prevented from toppling, the screw thread cylinder 112 can rotate through the turntable 111 in the horizontal adjusting mechanism 11, the screw thread cylinder 112 rotates, the bolt rod 113 moves up and down in the screw thread cylinder 112, the bolt rod 113 drives the bottom plate 12 to move, the heights of four corners of the bottom plate 12 are adjusted, the horizontal state of the rectangular box 1 is checked through the level gauge 114, can adjust the level of mould body 6, make mould body 6 internal glue upper surface level, and glue is full in mould body 6, the encapsulating quality is better, when outside temperature is lower, heat board 101 is adjusted to the temperature in the regulating chamber 4 through among the temperature adjustment mechanism 10, rethread fan 104 blows into the mounting chamber 3 with the air in the regulating chamber 4, adjust the temperature of mould body 6 in the mounting chamber 3, make mould body 6 temperature can not be too low, when in the higher environment of temperature, make cold head 102 cool down to regulating chamber 4 through heat exchange tube 103, thereby cool down mould body 6, mould body 6 all can keep constant temperature under different environment, make mould body 6 be convenient for the encapsulating, the glue is more convenient for the LED work piece to insert in mould body 6, avoid the glue to solidify.
To sum up, this temperature adjustable LED packaging structure is convenient for carry out the dismouting to mould body 6, and is fixed more firm, and rethread temperature adjustment mechanism 10 is convenient for adjust the temperature of mould body 6, makes mould body 6 all can keep constant temperature under different environment, makes mould body 6 be convenient for glue filling, and rethread level adjustment mechanism 11 can adjust the level of mould body 6, makes mould body 6 internal glue full, and glue filling quality is better.
It should be noted that in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (2)
1. The utility model provides a temperature adjustable LED packaging structure, includes rectangle case (1), its characterized in that: a partition plate (2) is fixedly arranged between the inner walls of the rectangular box (1), the partition plate (2) divides the rectangular box (1) into an installation chamber (3) and an adjusting chamber (4) from top to bottom, and clamping mechanisms (5) are fixedly arranged on the left inner wall and the right inner wall of the rectangular box (1) corresponding to the installation chamber (3);
The clamping mechanism (5) comprises a screw rod (501), a bearing seat (502), a rotating handle (503), ball nuts (504) and clamping plates (505), wherein the screw rod (501) is fixedly installed between the left inner wall and the right inner wall of the rectangular box (1) through the bearing seat (502), the right side surface of the screw rod (501) is inserted into the outer side of the rectangular box (1), the rotating handle (503) is fixedly installed on the right side surface of the screw rod (501), the upper threads of the screw rod (501) are reversely arranged along the left and right sides of the center, the ball nuts (504) are symmetrically arranged on the screw rod (501) at positions close to the left and right, the clamping plates (505) are fixedly installed on the upper surfaces of the ball nuts (504), a die body (6) is fixedly installed between the clamping plates (505), a rectangular opening (7) is formed in the position corresponding to the upper side wall of the rectangular box (1) and the die body (6), a baffle plate (8) is fixedly installed on the upper surface of the clamping plate (505), the upper surface of the baffle plate (8) is attached to the upper inner wall of the rectangular box (1), the ball nuts (504) are symmetrically arranged on the inner wall of the rectangular box (1) through a guide mechanism (9), and the inner wall of the rectangular box (4) is movably connected with the temperature adjusting mechanism (10);
The temperature regulating mechanism (10) comprises a heating plate (101), a cold head (102), heat exchange pipes (103), fans (104) and temperature sensors (105), wherein the heating plate (101) is uniformly and fixedly arranged on the lower surface of a partition plate (2), the cold head (102) is fixedly arranged on the left side surface of a rectangular box (1), the heat exchange pipes (103) are fixedly arranged on liquid inlet and outlet openings of the cold head (102), the heat exchange pipes (103) are inserted into a regulating chamber (4), the fans (104) are respectively arranged on the partition plate (2) close to the left side and the right side, the temperature sensors (105) are fixedly arranged in the middle of the inner wall of the front side of the rectangular box (1) corresponding to the mounting chamber (3), and a bottom plate (12) is fixedly arranged on the lower surface of the rectangular box (1) through a horizontal regulating mechanism (11);
The front side surface and the rear side surface of the baffle plate (8) are attached to the front inner wall and the rear inner wall of the rectangular box (1), and the baffle plate (8) is attached to the left inner wall and the right inner wall of the rectangular box (1) when the ball nut (504) is close to the left inner wall and the right inner wall of the rectangular box (1);
The guide mechanism (9) comprises guide blocks (901) and guide grooves (902), the guide blocks (901) are fixedly arranged behind the ball nuts (504), the guide grooves (902) are formed in the inner walls of the rear sides of the rectangular boxes (1) corresponding to the guide blocks (901), and the guide blocks (901) are movably inserted into the guide grooves (902);
The front side surface and the rear side surface of the die body (6) are attached to the front inner wall and the rear inner wall of the rectangular opening (7), and the upper surface of the die body (6) is 1.5cm-3cm higher than the upper surface of the rectangular box (1);
The heat insulation plates (13) are fixedly arranged on the front, rear, left and right inner walls of the rectangular box (1) corresponding to the adjusting chamber (4) in the mounting chamber (3);
A mounting hole (14) for mounting the fan (104) is formed in the partition board (2) at a position corresponding to the fan (104), and a vent hole (15) is formed in the partition board (2) close to the front side;
A safety exhaust valve (16) is fixedly arranged on the lower surface of the rectangular box (1) at a position corresponding to the regulating chamber (4);
The horizontal adjusting mechanism (11) comprises a rotary table (111), a threaded cylinder (112), a bolt rod (113) and a level meter (114), wherein the rotary table (111) is fixedly installed at four corners of the lower surface of a rectangular box (1) in a rectangular shape, the threaded cylinder (112) is fixedly installed on the lower surface of the rotary table (111), the bolt rod (113) is installed on the lower surface of the threaded cylinder (112) in a threaded manner, the lower surface of the bolt rod (113) is fixedly connected with the upper surface of a bottom plate (12), and the level meter (114) is fixedly installed in the middle of the lower surface of the rectangular box (1);
The heat exchange tube (103) is a U-shaped circulating pipeline, and the right side surface of the heat exchange tube (103) is attached to the right side inner wall of the rectangular box (1).
2. The temperature-adjustable LED package structure of claim 1, wherein: an anti-skid rubber pad (17) is fixedly arranged on the lower surface of the bottom plate (12).
Priority Applications (1)
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108858960A (en) * | 2018-06-26 | 2018-11-23 | 芜湖博康汽车饰件有限公司 | A kind of automobile decoration piece injection-moulding device |
| CN212579152U (en) * | 2020-05-29 | 2021-02-23 | 南通格霖莱特汽车零部件有限公司 | Cooling protection device for mold temperature controller |
| CN113284828A (en) * | 2021-07-14 | 2021-08-20 | 潍坊市工程技师学院 | Constant temperature type packaging hardware is used in electronic product production |
| CN215318191U (en) * | 2021-04-26 | 2021-12-28 | 吉安米田科技有限公司 | CNC tool structure is used in processing of panel computer back of body lid |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108858960A (en) * | 2018-06-26 | 2018-11-23 | 芜湖博康汽车饰件有限公司 | A kind of automobile decoration piece injection-moulding device |
| CN212579152U (en) * | 2020-05-29 | 2021-02-23 | 南通格霖莱特汽车零部件有限公司 | Cooling protection device for mold temperature controller |
| CN215318191U (en) * | 2021-04-26 | 2021-12-28 | 吉安米田科技有限公司 | CNC tool structure is used in processing of panel computer back of body lid |
| CN113284828A (en) * | 2021-07-14 | 2021-08-20 | 潍坊市工程技师学院 | Constant temperature type packaging hardware is used in electronic product production |
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