CN115023104A - Temperature-equalizing plate and manufacturing method thereof - Google Patents
Temperature-equalizing plate and manufacturing method thereof Download PDFInfo
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- CN115023104A CN115023104A CN202210496852.9A CN202210496852A CN115023104A CN 115023104 A CN115023104 A CN 115023104A CN 202210496852 A CN202210496852 A CN 202210496852A CN 115023104 A CN115023104 A CN 115023104A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of heat conduction, and discloses a temperature-equalizing plate and a manufacturing method thereof. According to the invention, the steel temperature-equalizing plate is passivated through chemical reaction, and after passivation, the temperature-equalizing plate can form a transition metal compound passivation film with good compactness, so that the reaction of the steel and water can be reduced in the use process of the steel temperature-equalizing plate, the heat dissipation effect can be achieved, and the service life is prolonged.
Description
Technical Field
The invention relates to the technical field of heat conduction, in particular to a temperature-equalizing plate and a manufacturing method thereof.
Background
When the electronic product is used, an electronic element inside the electronic product can generate heat, when the temperature of the electronic element is higher, adverse effect can be generated on the operation of the element, when the temperature is too high, the electronic element can be damaged, under the condition, the temperature equalization plate is additionally arranged on the electronic element and used for deriving the heat generated by the electronic element, and the heat is dissipated through the temperature equalization plate per se after being derived, so that the stable operation of the electronic element is ensured.
The existing temperature-equalizing plate is generally made of copper or copper alloy, and the Vickers hardness of copper is HV80, so when the temperature-equalizing plate is made of the copper, the limit of the hardness of the copper is caused, the strength and the supporting effect of materials are limited, and the condition that the temperature-equalizing plate deforms to reduce the heat dissipation effect can occur, therefore, the temperature-equalizing plate can be made of steel with the Vickers hardness of HV130-150, and the service life of the temperature-equalizing plate can be prolonged.
The steel serving as a high-strength supporting material is used for the uniform temperature plate to generate non-condensable gas in the using process, the uniform temperature plate cannot be used after the non-condensable gas is generated, the cover plate needs to be passivated, a passivation layer is covered on the surface of the cover plate, the uniform temperature plate can be normally used, and a better steel uniform temperature plate passivation treatment mode is not provided at present.
Disclosure of Invention
In order to overcome the above defects in the prior art, the present invention provides a vapor chamber and a manufacturing method thereof, and the technical problem to be solved by the present invention is: the problem that condensed gas generated by manufacturing the uniform temperature plate by steel cannot be used.
A temperature equalization plate comprises an upper cover plate and further comprises:
a lower cover plate: the lower cover plate is arranged at the bottom end of the upper cover plate and is fixedly connected with the upper cover plate;
a first capillary structure: the bottom end of the inner part of the upper cover plate is arranged and fixedly connected with the upper cover plate;
a support plate: the first capillary structure is arranged at the bottom end of the first container and is fixedly connected with the first container;
a second capillary structure: the support plate is arranged at the bottom end of the support plate and is fixedly connected with the support plate;
supporting columns: the second capillary structure is arranged at the bottom end of the first capillary structure and is fixedly connected with the supporting column;
passivation film: and the upper cover plate and the lower cover plate are fixedly connected with each other.
In a preferred embodiment, a mounting groove is formed in the bottom end of the upper cover plate, the first capillary structure and the support plate are located in a avoiding groove of the upper cover plate, the bottom end of the support plate and the bottom end of the upper cover plate are located on the same horizontal plane, a mounting groove is formed in the top end of the lower cover plate, the second capillary structure and the support column are located in a mounting groove of the lower cover plate, the top end of the second capillary structure and the top end of the lower cover plate are located on the same horizontal plane, and the bottom end of the support column is fixedly connected with the bottom end of the mounting groove of the lower cover plate.
In a preferred embodiment, the height of the support plate is twice the height of the first capillary structure, the support plates are uniformly distributed at the bottom end of the first capillary structure, the height of the support columns is twice the height of the second capillary structure, and the support columns are uniformly distributed at the bottom end of the second capillary structure.
A manufacturing method of a vapor chamber comprises the following steps:
s1, respectively passivating the upper cover plate and the lower cover plate, and placing the upper cover plate and the lower cover plate in passivation solution to enable the surfaces of the upper cover plate and the lower cover plate to be covered with passivation layers;
s2, respectively connecting a first capillary structure and a support plate in the mounting groove of the upper cover plate, respectively connecting a support column and a second capillary structure in the mounting groove of the lower cover plate, and attaching and sealing the upper cover plate and the lower cover plate to form a closed inner cavity;
and S3, injecting working medium from the position of the water injection pipe, absorbing the working medium in the inner cavity and the capillary by the inner capillary structure, vacuumizing the inner cavity and the capillary from the water injection port, and sealing the water injection port after the inner part is in a vacuum state.
In a preferred embodiment, the upper and lower cover plates are dried at a temperature of 70 to 100 ℃ for 5 to 30 minutes after being subjected to the passivation process.
In a preferred embodiment, the passivation solution has the composition: 50-100g of sodium nitrate, 500-800g of sodium hydroxide, 100-300g of sodium nitrite and 1000g of pure water, and then uniformly stirring the mixture after adding.
In a preferred embodiment, the passivating solution is used at the temperature of 35-65 ℃, and the passivating treatment time of the upper cover plate and the lower cover plate is 5-30 minutes.
In a preferred embodiment, the water filling port can be sealed by resistance welding, laser welding or argon arc welding, and the upper cover plate and the lower cover plate can be sealed by laser welding or metal brazing.
In a preferred embodiment, the upper cover plate and the lower cover plate are subjected to degreasing treatment and pickling treatment before being subjected to passivation treatment.
The invention has the technical effects and advantages that:
1. according to the invention, the steel temperature-uniforming plate is passivated through chemical reaction, and after passivation, the temperature-uniforming plate can form a transition metal compound passivation film with good compactness, so that the reaction of steel and water can be reduced in the use process of the steel temperature-uniforming plate, the heat dissipation effect can be achieved, and the service life is prolonged;
2. according to the invention, the steel material is used for replacing copper or copper alloy to manufacture the uniform temperature plate, so that the uniform temperature plate can keep the shape of crude oil when in use, and the strength and hardness of the steel material are higher, therefore, the uniform temperature plate has a good supporting effect when in use, the existing shape of the uniform temperature plate can be still kept after the uniform temperature plate is manufactured by the steel material for a long time, and the service life of the uniform temperature plate is prolonged;
drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is an exploded view of the overall structure of the present invention.
Fig. 3 is a schematic view of the structure of the passivation film of the present invention.
The reference signs are: 1. an upper cover plate; 2. a lower cover plate; 3. a first capillary structure; 4. a support plate; 5. a second capillary structure; 6. a support pillar; 7. and (5) passivating the film.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the drawings of the present invention, and the forms of the structures described in the following embodiments are merely examples, and the temperature-uniforming plate and the manufacturing method thereof according to the present invention are not limited to the structures described in the following embodiments, and all other embodiments obtained by a person having ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.
Referring to fig. 1 to 3, the present invention provides a vapor chamber, including an upper cover plate 1, further including:
the lower cover plate 2: the lower cover plate is arranged at the bottom end of the upper cover plate 1 and is fixedly connected with the upper cover plate 1;
first capillary structure 3: the bottom end of the inner part of the upper cover plate 1 is arranged and is fixedly connected with the upper cover plate 1;
and (4) a support plate: the first capillary structure 3 is arranged at the bottom end of the first capillary structure 3 and is fixedly connected with the first capillary structure 3;
second capillary structure 5: is arranged at the bottom end of the supporting plate 4 and is fixedly connected with the supporting plate 4;
support column 6: the second capillary structure is arranged at the bottom end of the second capillary structure 5 and is fixedly connected with the supporting column 6;
and (7) a passivation film: is arranged on the outer sides of the upper cover plate 1 and the lower cover plate 2 and is fixedly connected with the upper cover plate 1 and the lower cover plate 2.
Further, the mounting groove has been seted up to the bottom of upper cover plate 1, first capillary structure 3 is located upper cover plate 1 with backup pad 4 and keeps away a position inslot, and the bottom of backup pad 4 and the bottom of upper cover plate 1 are in same horizontal plane, the mounting groove has been seted up on the top of lower cover plate 2, second capillary structure 5 is located lower cover plate 2's mounting groove with support column 6, the top of second capillary structure 5 and lower cover plate 2's top are in same horizontal plane, the bottom of support column 6 and the bottom fixed connection of lower cover plate 2 mounting groove, through being provided with two support parts of support column 6 and backup pad 4, and be equipped with two capillary structure of first capillary structure 3 and second capillary structure 5, thereby make the produced heat of electronic component dispel the heat through first capillary structure 3 and second capillary structure 5 two parts, increase the heat-sinking capability of samming board.
Further, the height of backup pad 4 is the twice of first capillary structure 3 height, backup pad 4 evenly distributed is in first capillary structure 3's bottom, the height of support column 6 is the twice of second capillary structure 5 height, support column 6 evenly distributed is in second capillary structure 5's bottom, reach the heat through evenly distributed is in support column 6 of 5 bottoms of second capillary structure, carry out the secondary drive by backup pad 4 again, thereby make this samming board dispel the heat more evenly when the radiating efficiency is higher to electronic component.
A manufacturing method of a vapor chamber comprises the following steps:
s1, respectively passivating the upper cover plate 1 and the lower cover plate 2, and placing the upper cover plate 1 and the lower cover plate 2 in passivating solution to enable the surfaces of the upper cover plate 1 and the lower cover plate 2 to be covered with passivating layers;
s2, respectively connecting the first capillary structure 3 and the support plate 4 in the mounting groove of the upper cover plate 1, respectively connecting the support column 6 and the second capillary structure 5 in the mounting groove of the lower cover plate 2, and attaching and sealing the upper cover plate 1 and the lower cover plate 2 to form a sealed inner cavity;
and S3, injecting working medium from the position of the water injection pipe, absorbing the working medium in the inner cavity and the capillary by the inner capillary structure, vacuumizing the inner cavity and the capillary from the water injection port, and sealing the water injection port after the inner part is in a vacuum state.
Further, after the passivation treatment is performed on the upper cover plate 1 and the lower cover plate 2, the passivation layer is dried at a temperature of 70 ℃ to 100 ℃ for 5 minutes to 30 minutes, and the surface of the passivation layer is soft after the passivation layer is generated, so that the passivation film can be damaged when the passivation layer is directly used, and the passivation layer can be prevented from being damaged by drying the upper cover plate 1 and the lower cover plate 2.
Further, the passivation solution comprises the following components: 50-100g of sodium nitrate, 500-800g of sodium hydroxide, 100-300g of sodium nitrite and 1000g of pure water are added and uniformly stirred, and the composition of the passivation solution is controlled, so that the formation speed of the passivation layer is favorably improved, the price of the raw material is low, and the cost is favorably controlled.
Furthermore, the using temperature of the passivation solution is 35-65 ℃, the passivation treatment time of the upper cover plate 1 and the lower cover plate 2 is 5-30 minutes, and the temperature of the passivation solution is controlled, so that the dissolution efficiency of each component in the passivation solution is favorably improved, the components of the passivation solution are more uniform, and the thickness and the quality of the passivation layer are improved.
Furthermore, the sealing mode of the water injection port can adopt the modes of resistance welding, laser welding and argon arc welding, the upper cover plate 1 and the lower cover plate 2 form the mode of laser welding or metal material brazing in the sealing mode, different sealing modes are selected according to the actual production condition, and therefore the sealing performance of the upper cover plate 1 and the lower cover plate 2 in the sealing process is guaranteed.
Furthermore, before the passivation treatment of the upper cover plate 1 and the lower cover plate 2, oil removal treatment and acid pickling treatment are required, so that the cleanness of the surfaces of the upper cover plate 1 and the lower cover plate 2 is ensured, other substances cannot be contained in a passivation layer during the passivation treatment, the passivation layer is not easy to fall off after being formed, and the manufacturability of a finished product is improved.
The first embodiment is as follows: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 50g of sodium nitrate, 800g of sodium hydroxide, 100g of sodium nitrite and 1000g of pure water, adjusting the temperature of the passivation solution to 35 ℃, carrying out passivation treatment for 10 minutes, and drying at the temperature of 70 ℃ for 20 minutes after the passivation treatment;
example two: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 60g of sodium nitrate, 750g of sodium hydroxide, 150g of sodium nitrite and 900g of pure water, adjusting the temperature of the passivation solution to 40 ℃, carrying out passivation treatment for 10 minutes, and drying at the temperature of 70 ℃ for 20 minutes after the passivation treatment;
example four: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 70g of sodium nitrate, 700g of sodium hydroxide, 200g of sodium nitrite and 800g of pure water, adjusting the temperature of the passivation solution to 45 ℃, carrying out passivation treatment for 10 minutes, and drying at the temperature of 70 ℃ for 20 minutes after the passivation treatment;
example five: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 80g of sodium nitrate, 650g of sodium hydroxide, 250g of sodium nitrite and 700g of pure water, adjusting the temperature of the passivation solution to 50 ℃, carrying out passivation treatment for 10 minutes, and drying at the temperature of 70 ℃ for 20 minutes after the passivation treatment;
example six: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 90g of sodium nitrate, 600g of sodium hydroxide, 300g of sodium nitrite and 600g of pure water, adjusting the temperature of the passivation solution to 55 ℃, carrying out passivation treatment for 10 minutes, and drying at the temperature of 70 ℃ for 20 minutes after the passivation treatment;
example seven: putting the upper cover plate 1 and the lower cover plate 2 into a passivation solution consisting of 100g of sodium nitrate, 500g of sodium hydroxide, 200g of sodium nitrite and 500g of pure water, adjusting the temperature of the passivation solution to 60 ℃, carrying out passivation treatment for 10 minutes, and drying at the temperature of 70 ℃ for 20 minutes after passivation treatment;
example eight: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 70g of sodium nitrate, 650g of sodium hydroxide, 250g of sodium nitrite and 700g of pure water, adjusting the temperature of the passivation solution to 50 ℃, carrying out passivation treatment for 20 minutes, and drying at the temperature of 70 ℃ for 20 minutes after the passivation treatment;
example nine: putting the upper cover plate 1 and the lower cover plate 2 into passivation solution consisting of 70g of sodium nitrate, 650g of sodium hydroxide, 250g of sodium nitrite and 700g of pure water, adjusting the temperature of the passivation solution to 50 ℃, carrying out passivation treatment for 20 minutes, and drying at the temperature of 80 ℃ for 20 minutes after the passivation treatment;
| example numbering | Thickness of passivation film | Binding force | Pitting corrosion resistance |
| Example one | 30-40nm | Fail to be qualified | 3-4h |
| Example two | 55-65nm | Fail to be qualified | 4-5h |
| EXAMPLE III | 70-80nm | Qualified | 5.5-6.5h |
| Example four | 80-90nm | Qualified | 6.5-7.5h |
| EXAMPLE five | 65-75nm | Qualified | 6-7h |
| EXAMPLE six | 50-60nm | Fail to be qualified | 3.5-4.5h |
| EXAMPLE seven | 40-50nm | Fail to be qualified | 3-4h |
| Example eight | 90-100nm | Qualified | 7.5-8h |
| Example nine | 90-100nm | Qualified | 8-9h |
In conclusion, the passivation solution comprises 70g of sodium nitrate, 650g of sodium hydroxide, 250g of sodium nitrite and 700g of pure water, the temperature of the passivation solution is adjusted to 50 ℃, the passivation treatment is carried out for 20 minutes, and when the passivation solution is dried at 80 ℃ for 20 minutes after the passivation treatment, the formed passivation film is thick, strong in home interior and good in pitting corrosion resistance.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the invention, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the invention can be combined with each other without conflict;
and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.
Claims (9)
1. The utility model provides a temperature-uniforming plate, includes upper cover plate (1), its characterized in that still includes:
lower cover plate (2): the lower cover plate is arranged at the bottom end of the upper cover plate (1) and is fixedly connected with the upper cover plate (1);
first capillary structure (3): the bottom end of the inner part of the upper cover plate (1) is arranged and is fixedly connected with the upper cover plate (1);
support plate (4): the first capillary structure (3) is arranged at the bottom end of the first capillary structure (3) and is fixedly connected with the first capillary structure (3);
second capillary structure (5): the bottom end of the supporting plate (4) is fixedly connected with the supporting plate (4);
support column (6): the second capillary structure is arranged at the bottom end of the second capillary structure (5) and is fixedly connected with the supporting column (6);
passivation film (7): is arranged on the outer sides of the upper cover plate (1) and the lower cover plate (2) and is fixedly connected with the upper cover plate (1) and the lower cover plate (2).
2. A vapor chamber according to claim 1, wherein: the mounting groove has been seted up to the bottom of upper cover plate (1), first capillary structure (3) are located the avoiding inslot of upper cover plate (1) with backup pad (4), just the bottom of backup pad (4) is in same horizontal plane with the bottom of upper cover plate (1), the mounting groove has been seted up on the top of apron (2) down, second capillary structure (5) are located the mounting groove of apron (2) down with support column (6), the top of second capillary structure (5) is in same horizontal plane with the top of apron (2) down, the bottom of support column (6) and the bottom fixed connection of apron (2) mounting groove down.
3. A vapor chamber according to claim 1, wherein: the height of the supporting plate (4) is twice the height of the first capillary structure (3), the supporting plate (4) is uniformly distributed at the bottom end of the first capillary structure (3), the height of the supporting column (6) is twice the height of the second capillary structure (5), and the supporting column (6) is uniformly distributed at the bottom end of the second capillary structure (5).
4. The manufacturing method of the temperature-equalizing plate is characterized by comprising the following steps:
s1, respectively passivating the upper cover plate (1) and the lower cover plate (2), and placing the upper cover plate (1) and the lower cover plate (2) in passivating liquid to enable the surfaces of the upper cover plate (1) and the lower cover plate (2) to be covered with passivating layers;
s2, respectively connecting a first capillary structure (3) and a support plate (4) in the mounting grooves of an upper cover plate (1), respectively connecting a support column (6) and a second capillary structure (5) in the mounting groove of a lower cover plate (2), and attaching and sealing the upper cover plate (1) and the lower cover plate (2) to form a closed inner cavity;
s3, injecting working medium from the water injection pipe, absorbing the working medium by the internal capillary structure, vacuumizing the internal cavity and the capillary, and sealing the water injection hole after the internal cavity is in a vacuum state.
5. The method for manufacturing a vapor chamber as claimed in claim 4, wherein: after the upper cover plate (1) and the lower cover plate (2) are passivated, the upper cover plate and the lower cover plate are dried for 5 minutes to 30 minutes at the temperature of 70 ℃ to 100 ℃.
6. The method for manufacturing a vapor chamber as claimed in claim 4, wherein: the passivation solution comprises the following components: 50-100g of sodium nitrate, 500-800g of sodium hydroxide, 100-300g of sodium nitrite and 1000g of pure water, and then uniformly stirring the mixture after adding.
7. The method for manufacturing a vapor chamber as claimed in claim 4, wherein: the using temperature of the passivation solution is 35-65 ℃, and the passivation treatment time of the upper cover plate (1) and the lower cover plate (2) is 5-30 minutes.
8. The method for manufacturing a vapor chamber plate according to claim 4, wherein: the sealing mode of water filling port can adopt resistance weld, laser welding, argon arc to weld, upper cover plate (1) and apron (2) form can adopt laser welding or the mode of metal material brazing in airtight.
9. The method for manufacturing a vapor chamber as claimed in claim 4, wherein: before the passivation treatment is carried out on the upper cover plate (1) and the lower cover plate (2), oil removal treatment and acid pickling treatment are required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210496852.9A CN115023104A (en) | 2022-05-09 | 2022-05-09 | Temperature-equalizing plate and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210496852.9A CN115023104A (en) | 2022-05-09 | 2022-05-09 | Temperature-equalizing plate and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN115023104A true CN115023104A (en) | 2022-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210496852.9A Pending CN115023104A (en) | 2022-05-09 | 2022-05-09 | Temperature-equalizing plate and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114894015A (en) * | 2022-03-24 | 2022-08-12 | 山东大学 | Heat pipe temperature equalizing plate and heat exchange system thereof |
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2022
- 2022-05-09 CN CN202210496852.9A patent/CN115023104A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114894015A (en) * | 2022-03-24 | 2022-08-12 | 山东大学 | Heat pipe temperature equalizing plate and heat exchange system thereof |
| CN114894015B (en) * | 2022-03-24 | 2023-09-26 | 山东大学 | Heat pipe temperature equalizing plate and heat exchange system thereof |
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