CN115020389B - Optical packaging structure, display screen and electronic equipment - Google Patents

Optical packaging structure, display screen and electronic equipment Download PDF

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CN115020389B
CN115020389B CN202111369532.9A CN202111369532A CN115020389B CN 115020389 B CN115020389 B CN 115020389B CN 202111369532 A CN202111369532 A CN 202111369532A CN 115020389 B CN115020389 B CN 115020389B
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light
layer
substrate
optical package
package structure
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CN115020389A (en
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袁高
刘湘绮
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Honor Device Co Ltd
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Honor Device Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements

Abstract

The embodiment of the application provides an optical packaging structure, a display screen and electronic equipment, and the optical packaging structure at least comprises: a substrate, a light homogenizing layer and at least one light emitting element positioned on the substrate; at least one light-emitting element is positioned between the substrate and the light-homogenizing layer, and a packaging layer is arranged on one side of the substrate facing the light-homogenizing layer, and the packaging layer coats at least part of the light-emitting elements; the light homogenizing layer is provided with at least one first protruding part on one surface facing the packaging layer, so that the forward emergent capability of light rays can be increased, and the collimation emergent effect of the light rays can be improved.

Description

Optical packaging structure, display screen and electronic equipment
The present application claims priority from chinese patent office, application number 202111284061.1, application name "optical package structure, display panel and electronic device," filed on month 11 and 01 of 2021, the entire contents of which are incorporated herein by reference.
Technical Field
The embodiment of the application relates to the technical field of chip packaging, in particular to an optical packaging structure, a display screen and electronic equipment.
Background
At present, electronic equipment such as mobile phones and computers are indistinguishable from our lives, are visible everywhere in life, and greatly improve the living standard of people. With the rapid development of the technology of communication equipment, the related LCD (Liquid Crystal Display ) industry is also developed, so that the application range of the LCD is wider and wider, however, the LCD is a non-luminous display screen, and the function of displaying pictures can be achieved only by means of a backlight source, which is a core component of the non-luminous display screen product.
In the related art, a main body Light Emitting structure in a display screen generally includes a substrate, a Light-Emitting Diode (LED), a diffusion layer, a prism layer and a display layer that are sequentially stacked, where the number of the LEDs may be multiple, the LEDs are disposed on the substrate, and a packaging layer is further disposed on a surface of the LEDs facing the diffusion layer, that is, the packaging layer is located between the substrate and the diffusion layer.
However, in the above solution, the forward emitting capability of the light emitted by the light emitting diode is poor, so that the collimating and emitting effect of the light is poor.
Disclosure of Invention
The embodiment of the application provides an optical packaging structure, a display screen and electronic equipment, which can increase the forward emergent capability of light rays, thereby improving the collimation emergent effect of the light rays.
In a first aspect, embodiments of the present application provide an optical package structure, including at least: a substrate, a light homogenizing layer and at least one light emitting element positioned on the substrate; the at least one light-emitting element is positioned between the substrate and the light homogenizing layer, and a packaging layer is arranged on one side of the substrate facing the light homogenizing layer, and at least part of the light-emitting element is coated by the packaging layer; the light homogenizing layer is provided with at least one first protruding part on one surface facing the packaging layer.
According to the optical packaging structure provided by the embodiment of the application, at least one first protruding portion is arranged on one face, facing the packaging layer, of the light homogenizing layer, light emitted by the light emitting element passes through the packaging layer and irradiates on the first protruding portion of the light homogenizing layer, and due to the fact that the refractive index of the first protruding portion is higher than that of air, light can be refracted on the forward light emitting direction of the light emitting element, and collimation and emergence of the light are facilitated. Therefore, the embodiment of the application can increase the forward emergent capability of the light, so that the collimation emergent effect of the light can be improved.
In a possible implementation manner, at least one groove is arranged on one surface of the packaging layer facing the light homogenizing layer; and the groove is arranged opposite to the first protruding part. By means of the concave design of the packaging layer, the upper surface of the packaging layer (namely, the surface of the packaging layer facing the light homogenizing layer) can be equivalently formed into a concave lens, so that when light rays emitted by the light-emitting element pass through the packaging layer, the light rays are diffused to two sides (namely, the directions deviating from the central axis of the groove) by the concave lens to deflect, and the central emergent light can be refracted all around to form emergent light rays, so that the emergent light uniformity in the area where the light-emitting element is located is improved.
In one possible implementation, the shape of the recess is adapted to the shape of the first protrusion. Therefore, the light emitted by the light-emitting element is diffused to the periphery by the grooves of the packaging layer, the diffused emergent light irradiates onto the first protruding part of the light homogenizing layer, and the light can be refracted in the forward light-emitting direction of the light-emitting element due to the fact that the refractive index of the first protruding part is higher than that of air, namely, the diffused emergent light irradiates onto the first protruding part to generate upward refraction, so that the collimation and emergence of the light are realized. The shape of the groove is matched with the shape of the first protruding portion, so that the collimation emergent effect of light rays is better.
In one possible implementation, the central axis of the groove coincides with the central axis of the first protrusion. Therefore, the grooves and the first protruding portions can be ensured to be opposite to each other, and the light rays emitted by the grooves after being diffused are enabled to be irradiated onto the first protruding portions, so that the collimation and emission effects of the light rays are better.
In one possible implementation, a dimension of the first protrusion perpendicular to the thickness direction of the substrate is larger than a dimension of the groove perpendicular to the thickness direction of the substrate. Due to the diffusion effect of the grooves of the encapsulation layer, the dimension of the first protruding portion in the thickness direction perpendicular to the substrate is larger than the dimension of the grooves in the thickness direction perpendicular to the substrate, so that the alignment effect of as much diffuse light as possible can be ensured while taking the lamination tolerance into consideration.
In one possible implementation, a perpendicular distance between the central axis of the first protrusion and the edge of the first protrusion is 50um greater than a perpendicular distance between the central axis of the groove and the edge of the groove; wherein the edge of the first protruding portion is an edge of the first protruding portion in a thickness direction perpendicular to the substrate; the edges of the grooves are edges of the grooves in a thickness direction perpendicular to the substrate.
In one possible implementation, the first protrusion has a dimension along the thickness direction of the substrate of 20um to 500um. The larger the dimension of the first protruding portion along the thickness direction of the substrate (i.e., the higher the height of the first protruding portion), the better the collimating exit effect of the light.
In one possible implementation, the dimension of the encapsulation layer in the thickness direction perpendicular to the substrate becomes gradually smaller in the direction away from the substrate. Therefore, the packaging layer can form the trapezoid prism, when light emitted by the light-emitting element reaches the hypotenuse of the packaging layer by utilizing the hypotenuse design of the trapezoid prism, the hypotenuse can deflect the refraction occurrence point normally to a certain extent, so that the uniformity of light intensity distribution of emergent light in the area where the light-emitting element is located can be realized, and the light-emitting effect is improved.
In one possible implementation manner, at least one second protruding portion is further arranged on one surface of the light homogenizing layer facing the light emitting element; the second boss is located at an outer periphery of the first boss. Like this, when the light that the luminescent element launched passes through the recess of encapsulation layer, the emergent ray after being diffused by the recess can't reach on the first bellying of even light layer, owing to be provided with at least one second bellying by the periphery of first bellying, can shine on the second bellying of even light layer by the emergent ray after the recess diffusion, still can make the light take place the refraction in the forward light-emitting direction of orientation luminescent element like this, and then realize the collimation outgoing of light.
In one possible implementation, the number of the second protrusions is a plurality; the plurality of second protrusions become smaller in size in a direction away from the first protrusions. The first protrusion has a collimation exit effect for a large amount of diffused light due to the diffusion effect of the grooves of the encapsulation layer. The second protruding portion has the effect of collimating and emitting a small amount of diffuse light which cannot reach the first protruding portion on the basis of the first protruding portion. The size of a plurality of second bellying is along keeping away from the direction of first bellying and becoming gradually little, can be when satisfying the collimation emergence effect of light, save material cost and space design, avoid the setting of second bellying to occupy too much space to and cause the interference to other structures in the optical package structure.
In one possible implementation, the shape of the second protrusion is the same as the shape of the first protrusion. The shape of the second protruding part is the same as that of the first protruding part, so that the collimation emergent effect of light rays is better.
In one possible implementation, the encapsulation layer includes: at least one sub-packaging layer; at least one groove is formed in one face, facing the light homogenizing layer, of each sub-packaging layer, and the grooves are opposite to the first protruding portions.
In one possible implementation, the method further includes: at least one grille; the grid is positioned between the substrate and the light homogenizing layer; and the grating is positioned at the periphery of the sub-packaging layer. The light emitted by the light-emitting element and emitted laterally passes through the hypotenuse of the packaging layer, is refracted by the hypotenuse and directly irradiates into the gap between the grid and the sub-packaging layer upwards, and can improve the brightness in the gap between the grid and the packaging layer. Due to the grooves of the packaging layer, the central light intensity emitted by the light-emitting element is refracted to the periphery to form diffused emergent light, so that the uniformity of illuminance in the whole area is enhanced. Meanwhile, the light emitted by the light-emitting element and emitted by the light-emitting element is totally reflected after being irradiated to one surface of the grille facing the sub-packaging layer, so that illuminance and uniformity in a gap between the grille and the packaging layer can be enhanced.
In one possible implementation, the grid is disposed between two adjacent sub-packaging layers. Therefore, when the light rays emitted by the light-emitting element pass through the grooves or the oblique sides of the sub-packaging layers, interference between the emergent light rays diffused by the two adjacent sub-packaging layers can be avoided. In addition, the arrangement of the grating also helps to improve the brightness, illuminance and uniformity in the gap between the grating and the encapsulation layer.
In one possible implementation, the method further includes: a light conversion film; the light conversion film is positioned on one side of the light homogenizing layer, which is away from the substrate.
In a second aspect, embodiments of the present application provide a display screen, where the display screen includes at least: a liquid crystal layer, a polarizer, a cover plate and an optical package structure as described in any one of the above; the liquid crystal layer, the polaroid and the cover plate are sequentially stacked along the direction away from the optical packaging structure.
The embodiment of the application provides a display screen, this display screen includes optical packaging structure at least, this optical packaging structure is through being provided with at least one first bellying in the one side of even light layer orientation encapsulation layer, and the light that light emitting element sent shines back on the first bellying of even light layer through the encapsulation layer, because the refracting index of first bellying is higher than the refracting index of air, the light can take place towards the refraction on the forward light-emitting direction of light emitting element, helps realizing the collimation outgoing of light. Therefore, the embodiment of the application can increase the forward emergent capability of the light, so that the collimation emergent effect of the light can be improved.
In a third aspect, an embodiment of the present application provides an electronic device, including at least: the display screen comprises a middle frame, a circuit board, a battery, a rear cover and the display screen; the circuit board and the battery are arranged on one surface of the middle frame, which faces the rear cover, and the display screen and the rear cover are respectively positioned on two sides of the middle frame.
The embodiment of the application provides electronic equipment, this electronic equipment includes at least the display screen, this display screen includes at least optical packaging structure, this optical packaging structure is through being provided with at least one first bellying in the even light layer towards the one side of encapsulation layer, the light that light-emitting component sent shines back on the first bellying of even light layer through the encapsulation layer, because the refracting index of first bellying is higher than the refracting index of air, the light can take place towards the refraction on the forward light-emitting direction of light-emitting component, help realizing the collimation outgoing of light. Therefore, the embodiment of the application can increase the forward emergent capability of the light, so that the collimation emergent effect of the light can be improved.
Drawings
Fig. 1 is a schematic overall structure of an electronic device according to an embodiment of the present application;
fig. 2 is a schematic diagram of a split structure of an electronic device according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of a display screen in an electronic device according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of an optical package structure in the prior art;
FIG. 5 is a schematic diagram of another prior art optical package structure;
FIG. 6 is a schematic structural diagram of an optical package structure according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram illustrating an operation principle of an optical package structure according to an embodiment of the present application;
FIG. 8 is a schematic diagram illustrating the working principle of an optical package structure according to an embodiment of the present disclosure;
FIG. 9 is a schematic diagram illustrating an operation principle of an optical package structure according to an embodiment of the present disclosure;
FIG. 10 is a schematic structural diagram of an optical package structure according to an embodiment of the present disclosure;
FIG. 11 is a schematic diagram illustrating the working principle of an optical package structure according to an embodiment of the present disclosure;
FIG. 12 is a schematic structural diagram of an optical package structure according to an embodiment of the present disclosure;
fig. 13 is a schematic diagram illustrating an operation principle of an optical package structure according to an embodiment of the present disclosure;
FIG. 14 is a schematic structural diagram of an optical package structure according to an embodiment of the present disclosure;
fig. 15 is a schematic diagram illustrating an operation principle of an optical package structure according to an embodiment of the present application.
Reference numerals illustrate:
100-an optical package structure; 110-a substrate; 120-homogenizing layer;
121-a first boss; 122-a second boss; 130-a light emitting element;
140-packaging layer; 141-a sub-packaging layer; 1411-grooves;
1412-beveled edge; 150-grating; 160-gap;
170-a light conversion film; l1-a first emergent ray; l2-a second emergent ray;
l3-third emergent ray; l4-fourth emergent ray; 200-a liquid crystal layer;
300-polarizer; 400-cover plate; 500-mobile phone;
510—a display screen; 511-opening holes; 520-middle frame;
521-a metal middle plate; 522-a bezel; 530-a circuit board;
540-a battery; 550-rear cover.
Detailed Description
The terminology used in the description of the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.
Embodiments of the present application provide an electronic device, which may include, but is not limited to, a mobile or fixed terminal with a display screen, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a handheld computer, an intercom, a Point of sale (POS) device, a personal digital assistant (personal digital assistant, PDA), a wearable device, a virtual reality device, a wireless U-disc, a bluetooth sound/earphone, or a vehicle-mounted front-mounted device, a vehicle recorder, a security device, and the like.
In this embodiment of the present application, the mobile phone 500 is taken as an example of the electronic device, and the mobile phone 500 provided in this embodiment of the present application may be a curved screen mobile phone 500 or a flat screen mobile phone 500, and in this embodiment of the present application, the flat screen mobile phone 500 is taken as an example for illustration. Fig. 1 and fig. 2 show an overall structure and a split structure of a mobile phone 500, respectively, and a display screen 510 of the mobile phone 500 provided in this embodiment of the present application may be a water drop screen, a Liu Haibing screen, a full screen or a hole digging screen (see an opening 511 in fig. 1), and the following description will take the hole digging screen as an example.
Referring to fig. 2, the mobile phone 500 may include: the display screen 510, the middle frame 520, the circuit board 530 and the rear cover 550, wherein the circuit board 530 may be disposed on the middle frame 520, for example, the circuit board 530 may be disposed on a side of the middle frame 520 facing the rear cover 550 (as shown in fig. 2), or the circuit board 530 may be disposed on a side of the middle frame 520 facing the display screen 510, and the display screen 510 and the rear cover 550 are respectively located at both sides of the middle frame 520.
In some other examples, the handset 500 may further include a battery 540, the battery 540 may be disposed on a side of the bezel 520 facing the back cover 550 (as shown in fig. 2), or the battery 540 may be disposed on a side of the bezel 520 facing the display 510. For example, a side of the middle frame 520 facing the rear cover 550 may have a battery compartment (not shown) in which the battery 540 is mounted. The battery 80 typically has a battery interface (not shown) electrically connected to the circuit board 60.
The middle frame 520 may include a metal middle plate 521 and a rim 522, the rim 522 being disposed around the outer circumference of the metal middle plate 521. In general, the bezel 522 may include a top edge, a bottom edge, a left side edge, and a right side edge that enclose the bezel 522 in a square ring configuration.
When the mobile phone 500 is a flat screen mobile phone 500, the display 510 may be an Organic Light-Emitting Diode (OLED) display or a liquid crystal display (Liquid Crystal Display, LCD), and when the mobile phone 500 is a curved screen mobile phone 500, the display 510 may be an OLED display.
It should be understood that the structure illustrated in the embodiments of the present application does not constitute a specific limitation on the mobile phone 500. In other embodiments of the present application, the handset 500 may include more or fewer components than shown, or certain components may be combined, or certain components may be split, or different arrangements of components may be provided. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.
Referring to fig. 3, the display screen 510 may include an optical package structure, and a liquid crystal layer 200, a polarizer 300, and a cover plate 400 sequentially stacked, wherein the liquid crystal layer 200, the polarizer 300, and the cover plate 400 are covered over the optical package structure, and the liquid crystal layer 200, the polarizer 300, and the cover plate 400 are sequentially stacked in a direction away from the optical package structure.
In the related art, as shown in fig. 4, the mainstream optical packaging structure generally includes a substrate, a light emitting element (i.e. an LED light source), a diffusion layer, a prism layer and a display layer, where the number of LED light sources may be plural, the plural LED light sources are disposed on the substrate, and a packaging layer is further disposed on a surface of the plural LED light sources facing the diffusion layer, i.e. the packaging layer is located between the substrate and the diffusion layer. However, in the structure shown in fig. 4, the design of the left and right emission efficiency of the encapsulation layer and the lamp distance between the LED light sources tends to increase the lamp shadow phenomenon. In order to solve the problem of the lamp shadow, in the related art, as shown in fig. 5, the light shielding structure is added on the whole packaging material to inhibit, and the scheme adopts the light shielding of the top part of the light source, so that the emergent proportion of emergent light is reduced, and larger brightness loss occurs. That is, the forward emergent ability of the light emitted by the light emitting diode is poor, so that the collimation emergent effect of the light is poor.
Based on theoretical analysis, light rays at the light source are reflected, refracted and scattered, and for simplifying an analysis model, fig. 4 schematically shows outgoing light rays at different angles.
Under the condition of considering the interface reflection at the light source, as shown in fig. 4, three sparse dotted lines in the diagram are reference lines of angles at which total reflection occurs, corresponding positions b1, b2 and b3, the interface position of light corresponding to a denser dotted line in the diagram reaching the diffusion layer is c point, the interface position of light corresponding to a right solid line in the diagram reaching the diffusion layer is d point, the secondary reflection positions of the light source on the corresponding LED light source or the substrate (for example, glass substrate) are e point and f point respectively, and under the condition of not considering the side refraction and reflection factors of part of the light source (the actual most of light is reflected downwards and refracted and absorbed), the following analysis conclusion is given:
when the total reflection generating line is located at the leftmost b1, the denser dotted line in the figure and two light rays corresponding to the right Fang Shixian in the figure have been totally reflected before, the actual action interval of the light source is a-b1, (c and d are all totally reflected light rays, so that c and d can be on the right side of the total reflection generating line.
When the total reflection generating line is at the middle position b2, the actual action interval of the corresponding light source is a-c, wherein the interface reflection light ray in the c-b2 interval is blocked by the adjacent pixel point.
When the total reflection generating line is at b3, the corresponding light source action interval is (a-c) + (d-b 3), wherein the interface reflection light of the c-d interval is blocked by the adjacent pixel point.
Therefore, it is known that, to increase the light emission efficiency and reduce the occurrence of the lamp shadow, the total reflection line of the light needs to be located at b3 as much as possible, so that the light utilization efficiency can be maximized. Based on the total reflection angle a=arcsin (n photophobs/n photophobs), sinθ=n1/n 2, to ensure a maximum, the photophobs/photophobs ratio needs to be increased, so two approaches can be selected: the first is to select an photophobic optical film (i.e., a diffusion film) with a larger refractive index n 1; the second is to select an optically hermetic package layer (i.e., an encapsulation layer) of smaller refractive index n 2.
Ideal uniform illumination refers to an LED array using a minimum system thickness or a maximum LED pitch without appreciable non-uniform illumination. The single LED is generally a generalized lambertian light source (uniform light), the light intensity distribution curve of which is I (θ, Φ) =i0cosmθ, and the m size depends on the LED light emitting area and the packaging material property, and the m value can be determined by the half-light intensity angle θ1/2 of the LED lamp bead (m= -ln2/ln (cos θ1/2)). The more concentrated the light emitted by the LED lamp beads, the smaller the half-light intensity angle is, and the larger the m value is.
The illuminance distribution at any point on the plane perpendicular to the optical axis of the single LED light source is:
Figure GDA0004085200410000061
the illumination of the single lamp bead on the vertical light axis surface achieves the same uniformity, and the smaller the m value is, the smaller the required height z is, and the thinner the display thickness is.
Based on the above description, the embodiment of the application provides an optical package structure, where at least one first protruding portion is disposed on a surface of a light homogenizing layer, which faces to a packaging layer, and after a light ray emitted by a light emitting element is irradiated onto the first protruding portion of the light homogenizing layer through the packaging layer, since a refractive index of the first protruding portion is higher than that of air, the light ray can be refracted in a forward light emitting direction of the light emitting element, which is conducive to realizing collimation and emission of the light ray. Therefore, the embodiment of the application can increase the forward emergent capability of the light, so that the collimation emergent effect of the light can be improved.
The specific structure of the optical package structure will be described in detail with reference to the accompanying drawings.
Referring to fig. 6 and 7, an embodiment of the present application provides an optical package structure 100, where the optical package structure 100 may include at least: the light emitting device comprises a substrate 110, a light homogenizing layer 120 and at least one light emitting element 130 positioned on the substrate 110, wherein the at least one light emitting element 130 is positioned between the substrate 110 and the light homogenizing layer 120.
The light emitting element 130 may be an LED, and, as shown in fig. 6, an encapsulation layer 140 is disposed on a side of the substrate 110 facing the light homogenizing layer 120, and the encapsulation layer 140 encapsulates at least a portion of the light emitting element 130. In one possible implementation, the encapsulation layer 140 may be a 3D encapsulation glue layer.
In the embodiment of the present application, a surface of the light homogenizing layer 120 facing the encapsulation layer 140 may have at least one first protrusion 121. In this way, after the light emitted by the light emitting element 130 irradiates onto the first protruding portion 121 of the light homogenizing layer 120 through the encapsulation layer 140, since the refractive index of the first protruding portion 121 is higher than that of air, the light will be refracted in the forward light emitting direction of the light emitting element 130, which is helpful for achieving collimation and emission of the light. Therefore, the embodiment of the application can increase the forward emergent capability of the light, so that the collimation emergent effect of the light can be improved.
As shown in fig. 6, at least one groove 1411 may be disposed on a surface of the encapsulation layer 140 facing the light homogenizing layer 120, and the groove 1411 is disposed opposite to the first protrusion 121. By means of the concave design of the encapsulation layer 140, the upper surface of the encapsulation layer 140 (i.e. the surface of the encapsulation layer 140 facing the light homogenizing layer 120) can be equivalently formed as a concave lens, so that when the light emitted by the light emitting element 130 passes through the encapsulation layer 140, the light is diffused to two sides (i.e. the direction deviating from the central axis of the groove 1411) by the concave lens to deflect, and the central emergent light can be refracted to the periphery to form emergent light, so that the emergent light uniformity in the area where the light emitting element 130 is located is improved.
Due to the existence of the grooves 1411, as shown in fig. 8, the position of the original first emergent ray L1 is changed into the second emergent ray L2 with the grooves 1411, so that the refraction of the central emergent ray emitted by the light emitting element 130 to the periphery is finally realized, and the uniformity of the emergent ray in the area where the light emitting element 130 is located is improved.
Referring to fig. 6, in the embodiment of the present application, the dimension of the encapsulation layer 140 in the thickness direction perpendicular to the substrate 110 may be gradually smaller in the direction away from the substrate 110. In this way, the encapsulation layer 140 may form a trapezoid prism, and when the light emitted by the light emitting element 130 reaches the hypotenuse 1412 of the encapsulation layer 140 by using the hypotenuse design of the trapezoid prism, the hypotenuse 1412 deflects the refraction generating point normally to a certain extent, which is helpful for realizing the uniformity of light intensity distribution of the light emitted in the area where the light emitting element 130 is located and improving the light emitting effect.
Specifically, as shown in fig. 9, due to the existence of the hypotenuse 1412 of the trapezoidal prism, the outgoing light is changed from the original third outgoing light L3 to the deflected fourth outgoing light L4, and the effect of improving the outgoing light uniformity in the area where the light emitting element 130 is located is finally achieved.
In one possible implementation, the shape of the recess 1411 may be adapted to the shape of the first protrusion 121. In this way, the light emitted by the light emitting element 130 passes through the groove 1411 of the encapsulation layer 140, and is diffused and refracted by the groove 1411, and the diffused outgoing light irradiates onto the first protruding portion 121 of the light homogenizing layer 120, and because the refractive index of the first protruding portion 121 is higher than that of air, the light can be refracted in the forward light emitting direction of the light emitting element 130, that is, the diffused outgoing light irradiates onto the first protruding portion 121 and is refracted upwards, so as to realize collimation and outgoing of the light. Thus, the shape of the groove 1411 is matched with the shape of the first protrusion 121, so that the collimating and emitting effect of the light can be better.
As shown in fig. 6 or 7, the first protrusion 121 may have a hemispherical shape, and the recess 1411 may have a hemispherical recess. Alternatively, as shown in fig. 10 or 11, the first protrusion 121 may have a pyramid shape, and the groove 1411 may be a pyramid-shaped groove. Specifically, when the first protruding portion 121 has a pyramid shape, the first protruding portion 121 may have a triangular pyramid shape, a quadrangular pyramid shape, a hexagonal pyramid shape, an octagon pyramid shape, or the like. When the groove 1411 is a pyramid-shaped groove, the groove 1411 may be a triangular pyramid-shaped groove, a rectangular pyramid-shaped groove, a hexagonal pyramid-shaped groove, an eight pyramid-shaped groove, or the like.
Taking the first protruding portion 121 with a quadrangular pyramid shape as an example, the groove 1411 is a quadrangular pyramid groove, as shown in fig. 11, the light emitted by the light emitting element 130 passes through the quadrangular pyramid groove of the encapsulation layer 140, and the quadrangular pyramid groove diffuses the central oblique light further to the periphery. The oblique diffuse light irradiates on the first protruding portion 121 with a quadrangular pyramid shape, and because the refractive index of the first protruding portion 121 is higher than that of air, upward refraction is generated after the oblique diffuse light irradiates on the first protruding portion 121, and therefore collimation and emergence of light rays are achieved.
Of course, in some other embodiments, the shape of the recess 1411 may be different from the shape of the first protrusion 121. For example, in fig. 12 and 13, the first protrusion 121 may have a pyramid shape, and the groove 1411 may be a hemispherical groove. Specifically, the first protruding portion 121 may have a triangular pyramid shape, a quadrangular pyramid shape, a hexagonal pyramid shape, an octagon pyramid shape, or the like. The grooves 1411 of the encapsulation layer 140 and the first protrusions 121 of the light homogenizing layer 120 may be any asymmetric arrangement such as hemispherical, triangular pyramid, quadrangular pyramid, hexagonal pyramid, or octagon pyramid.
As shown in fig. 13, for the hemispherical recess of the encapsulation layer 140 and the first protrusion 121 of the light homogenizing layer 120, the light emitted by the light emitting element 130 passes through the hemispherical recess of the encapsulation layer 140, and the hemispherical recess diffuses the central oblique light further to the periphery. The oblique diffuse light irradiates on the quadrangular pyramid-shaped first protruding portion 121, and since the refractive index of the first protruding portion 121 is higher than that of air, upward refraction is generated after the oblique diffuse light irradiates on the first protruding portion 121, so that collimation and emergence of light rays are realized.
In addition, in the embodiment of the present application, the central axis of the groove 1411 may coincide with the central axis of the first protrusion 121. In this way, the arrangement of the grooves 1411 and the first protruding portions 121 can be ensured, and the collimation and emission effects of the light rays are better after the light rays diffused by the grooves 1411 are irradiated on the first protruding portions 121.
It is understood that in the embodiment of the present application, the dimension of the first protrusion 121 perpendicular to the thickness direction of the substrate 110 may be larger than the dimension of the groove 1411 perpendicular to the thickness direction of the substrate 110. Due to the diffusion effect of the grooves 1411 of the encapsulation layer 140, the dimension of the first protrusions 121 perpendicular to the thickness direction of the substrate 110 is larger than the dimension of the grooves 1411 perpendicular to the thickness direction of the substrate 110, so that it is possible to ensure the collimation effect of as much diffuse light as possible while taking into consideration the lamination tolerance.
Specifically, referring to fig. 6, 10, or 12, a vertical distance between a central axis of the first protrusion 121 and an edge of the first protrusion 121 may be 50um greater than a vertical distance between a central axis of the groove 1411 and an edge of the groove 1411, wherein the edge of the first protrusion 121 is an edge of the first protrusion 121 in a thickness direction perpendicular to the substrate 110, and the edge of the groove 1411 is an edge of the groove 1411 in a thickness direction perpendicular to the substrate 110.
For example, a difference D1 between a vertical distance between a central axis of the first protrusion 121 and an edge of the first protrusion 121 and a vertical distance between a central axis of the groove 1411 and an edge of the groove 1411 may be 50um, 60um, 70um, 80um, 90um, 100um, or the like, which is not limited in the embodiment of the present application.
It should be noted that, in the embodiment of the present application, the dimension of the first protruding portion 121 along the thickness direction of the substrate 110 may be 20um to 500um. The larger the dimension of the first protruding portion 121 along the thickness direction of the substrate 110 (i.e., the higher the height of the first protruding portion 121), the better the collimating exit effect of the light.
For example, the first protrusion 121 may have a size of 20um, 100um, 200um, 300um, 400um, 500um, or the like along the thickness direction of the substrate 110, which is not limited in the embodiment of the present application.
It should be noted that, the numerical values and the numerical ranges referred to in the embodiments of the present application are approximate values, and may have a certain range of errors under the influence of the manufacturing process, and those errors may be considered to be negligible by those skilled in the art.
In some embodiments, as shown in fig. 14 and 15, at least one second protrusion 122 may be further disposed on a side of the light homogenizing layer 120 facing the light emitting element 130, wherein the second protrusion 121 may be located at an outer circumference of the first protrusion 121. In this way, when the light emitted by the light emitting element 130 passes through the groove 1411 of the encapsulation layer 140 and the emergent light diffused by the groove 1411 cannot reach the first protrusion 121 of the light homogenizing layer 120, since at least one second protrusion 122 is disposed on the periphery of the first protrusion 121, the emergent light diffused by the groove 1411 can irradiate onto the second protrusion 122 of the light homogenizing layer 120, so that refraction in the forward light emitting direction of the light emitting element 130 can still occur, and collimation and emergence of the light can be further realized.
It can be understood that, because the refractive index of the central first protruding portion 121 is higher than that of air, the inclined surface of the first protruding portion 121 far away from the chip deflects the oblique diffuse light upward, so as to realize collimation and emergence of light, and the inclined surface of the first protruding portion 121 near the chip deflects the oblique diffuse light outward, so that the light emergence uniformity of the whole grid is improved.
As shown in fig. 14, the projection area of the second protrusion 122 on the light homogenizing layer 120 does not overlap with the projection area of the first protrusion 121 on the light homogenizing layer 120. Specifically, in fig. 14, in addition to providing the first protruding portions 121 on the surface of the light-homogenizing layer 120 facing the light-emitting element 130, a plurality of second protruding portions 122 may be arranged in a gaussian distribution around the first protruding portions 121.
In the embodiment of the present application, the number of the second protrusions 122 may be plural, and the size of the plurality of second protrusions 122 may be gradually smaller in a direction away from the first protrusions 121. That is, the size of the plurality of second protrusions 122 gradually decreases from the center to the outside.
The first protrusions 121 have already a collimating exit effect for a large amount of diffused light due to the diffusion effect of the grooves 1411 of the encapsulation layer 140. The second protruding portion 122 serves to collimate and emit a small amount of diffuse light that cannot reach the first protruding portion 121 on the basis of the first protruding portion 121. The dimensions of the second protruding portions 122 gradually decrease along the direction away from the first protruding portions 121, so that the material cost and the space design can be saved while the collimation and emergence effects of the light rays are met, and the situation that the second protruding portions 122 occupy excessive space and interfere with other structures in the optical package structure 100 is avoided.
It is understood that in the present embodiment, the shape of the second protrusion 122 may be the same as the shape of the first protrusion 121. The shape of the second protruding portion 122 is the same as that of the first protruding portion 121, so that the collimating and emitting effect of the light is better. For example, in fig. 14 and 15, the shape of each of the first protruding portion 121 and the sub first protruding portion 121 may be a triangular pyramid, a quadrangular pyramid, a hexagonal pyramid, an octagon pyramid, or the like.
It should be noted that, the first protruding portion 121 may have a structure as shown in fig. 6, that is, the first protruding portion 121 may include a prismatic structure and a hemispherical structure connected to the prismatic structure. Alternatively, the first protruding portion 121 may include only a hemispherical structure (not shown), which is not limited in the embodiment of the present application.
Also, the first protrusion 121 may be a structure as shown in fig. 10 and 12, i.e., the first protrusion 121 may include a prismatic structure and a pyramid-shaped structure connected to the prismatic structure. Alternatively, the first protrusion 121 may have a structure as shown in fig. 14, that is, may include only a pyramid-shaped structure, which is not limited in the embodiment of the present application.
As shown in fig. 6, 10, or 12, the encapsulation layer 140 may include: at least one sub-encapsulation layer 141, wherein at least one groove 1411 may be provided on a side of each sub-encapsulation layer 141 facing the light homogenizing layer 120, and the groove 1411 may be disposed opposite to the first protrusion 121. For example, in fig. 6, the package layer includes three sub-package layers 141, and one recess 1411 is disposed on each of the three sub-package layers 141 facing the light homogenizing layer 120, and each recess 1411 is disposed opposite to the first protrusion 121.
It is readily understood that in embodiments of the present application, the optical package structure 100 may further include: the light conversion film 170, wherein, as shown in fig. 6, 10 or 12, the light conversion film 170 may be positioned at a side of the light homogenizing layer 120 facing away from the substrate 110.
With continued reference to fig. 6, 10, or 12, in an embodiment of the present application, the optical package structure 100 may further include: at least one grating 150, wherein the grating 150 is located between the substrate 110 and the light homogenizing layer 120, and the grating 150 is located at the outer circumference of the sub-encapsulation layer 141.
The light emitted from the light emitting element 130 and emitted laterally passes through the oblique side 1412 of the encapsulation layer 140, is refracted upward by the oblique side 1412, and directly irradiates the gap 160 between the grid 150 and the sub-encapsulation layer 141, thereby improving the brightness in the gap 160 between the grid 150 and the encapsulation layer 140. Due to the grooves 1411 of the encapsulation layer 140, the central light intensity emitted by the light emitting element 130 is refracted to the periphery to form diffused emergent light, so that the uniformity of illuminance in the whole area is enhanced.
Meanwhile, the light emitted by the light emitting element 130 with a large angle is totally reflected after being irradiated to the surface of the grid 150 facing the sub-packaging layer 141, so that illuminance and uniformity in the gap 160 between the grid 150 and the packaging layer 140 can be enhanced.
However, due to the presence of the grooves 1411 of the encapsulation layer 140, the grooves 1411 may exacerbate the oblique emission of light from the light emitting element 130 for further oblique emission. This causes the obliquely outgoing light in the grating 150 to be emitted further obliquely in the light-equalizing layer 120 and the light-converting film 170, and thus causes the pixels above the adjacent grating 150 to be lit up, forming halos. In this embodiment, by disposing the first protruding portion 121 on the surface of the light homogenizing layer 120 facing the light emitting element 130, the emergent light diffused by the groove 1411 of the encapsulation layer 140 irradiates the first protruding portion 121 to generate refraction, and the light is folded upwards, so that the collimation and emergence of the light are realized, and the halation phenomenon can be suppressed.
Specifically, the method of brushing, spraying and dispensing with a single lamp (i.e. a single light emitting element 130) may be used to superimpose the grille 150 in the XY direction with the halo suppressing design (the grille 150 is all around the light emitting element 130), and meanwhile, the concave groove 1411 design of the encapsulation layer 140 and the trapezoidal prism design of the encapsulation layer 140 are used to increase the uniformity of light intensity distribution in the single grille 150, and in addition, the light homogenizing layer 120 has the first convex portion 121 disposed towards the light emitting element 130, so as to increase the forward emergent capability of light.
It is understood that in the embodiment of the present application, a grid 150 may be disposed between two adjacent sub-package layers 141. Thus, when light emitted from the light emitting element 130 passes through the groove 1411 or the oblique side 1412 of the sub-package layer 141, interference between the light emitted from the adjacent two sub-package layers 141 can be avoided. In addition, the provision of the grid 150 also helps to improve brightness, illuminance, and uniformity in the gap 160 between the grid 150 and the encapsulation layer 140.
It should be noted that, in some embodiments, one end of the grid 150 may be connected to the substrate 110, and the other end of the grid 150 may be connected to the light homogenizing layer 120.
In addition, it should be noted that, the optical package structure 100 provided in the embodiment of the present application is an optimization scheme of comprehensive brightness, contrast, light efficiency and power consumption applied to the field of Mini (Mini) LED display, and the display screen with the optical package structure 100 is suitable for electronic devices such as a mobile phone 500, a tablet computer, a personal computer (Personal Computer, PC), a display, a whiteboard and a large screen terminal with Mini LED functions. Wherein Mini LED refers to an LED chip with a size of 100 μm.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
The embodiments or implications herein must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the embodiments herein. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless specifically stated otherwise.
The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of implementation in sequences other than those illustrated or described herein, for example. Furthermore, the terms "may include" and "have," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing embodiments are merely for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto, and although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some or all of the technical features may be replaced equivalently, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments in this application.

Claims (14)

1. An optical package structure, comprising at least:
a substrate, a light homogenizing layer and at least one light emitting element positioned on the substrate;
the at least one light-emitting element is positioned between the substrate and the light homogenizing layer, and a packaging layer is arranged on one side of the substrate facing the light homogenizing layer, and at least part of the light-emitting element is coated by the packaging layer;
the surface of the light homogenizing layer facing the packaging layer is provided with at least one first protruding part;
the dimension of the encapsulation layer in the thickness direction perpendicular to the substrate becomes gradually smaller in the direction away from the substrate;
at least one second protruding part is arranged on one surface of the light homogenizing layer facing the light-emitting element;
the second protruding part is positioned at the periphery of the first protruding part;
the number of the second protruding parts is a plurality;
the plurality of second protrusions become smaller in size in a direction away from the first protrusions.
2. The optical package structure according to claim 1, wherein at least one groove is disposed on a surface of the encapsulation layer facing the light homogenizing layer;
and the groove is arranged opposite to the first protruding part.
3. The optical package structure of claim 2, wherein the shape of the recess is adapted to the shape of the first protrusion.
4. The optical package of claim 3, wherein a central axis of the recess coincides with a central axis of the first protrusion.
5. The optical package structure according to claim 4, wherein a dimension of the first protruding portion in a thickness direction perpendicular to the substrate is larger than a dimension of the recess in a thickness direction perpendicular to the substrate.
6. The optical package structure of claim 5, wherein a perpendicular distance between the central axis of the first protrusion and the edge of the first protrusion is greater than a perpendicular distance between the central axis of the groove and the edge of the groove by 50um;
wherein the edge of the first protruding portion is an edge of the first protruding portion in a thickness direction perpendicular to the substrate; the edges of the grooves are edges of the grooves in a thickness direction perpendicular to the substrate.
7. The optical package structure according to any one of claims 1 to 6, wherein a dimension of the first protruding portion along a thickness direction of the substrate is 20um to 500um.
8. The optical package structure of claim 7, wherein the second protrusion has a shape that is the same as the shape of the first protrusion.
9. The optical package structure according to any one of claims 2-6, 8, wherein the encapsulation layer comprises: at least one sub-packaging layer;
at least one groove is formed in one face, facing the light homogenizing layer, of each sub-packaging layer, and the grooves are opposite to the first protruding portions.
10. The optical package structure of claim 9, further comprising: at least one grille; the grid is positioned between the substrate and the light homogenizing layer;
and the grating is positioned at the periphery of the sub-packaging layer.
11. The optical package of claim 10, wherein the grating is disposed between two adjacent sub-package layers.
12. The optical package structure of any one of claims 1-6, 8, 10-11, further comprising: a light conversion film; the light conversion film is positioned on one side of the light homogenizing layer, which is away from the substrate.
13. A display screen, comprising at least: a liquid crystal layer, a polarizer, a cover plate and an optical package structure according to any one of the preceding claims 1-12;
the liquid crystal layer, the polaroid and the cover plate are sequentially stacked along the direction away from the optical packaging structure.
14. An electronic device, comprising at least: a middle frame, a circuit board, a battery, a rear cover and a display screen as claimed in claim 13;
the circuit board and the battery are arranged on one surface of the middle frame, which faces the rear cover, and the display screen and the rear cover are respectively positioned on two sides of the middle frame.
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CN101430072B (en) * 2006-01-19 2012-03-28 清华大学 Assembled uniform surface light source
CN206610054U (en) * 2016-09-30 2017-11-03 深圳市玲涛光电科技有限公司 Light source assembly and its display device
CN106896583B (en) * 2017-05-05 2019-10-25 京东方科技集团股份有限公司 Display base plate and preparation method thereof, display panel and display device
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