CN115020310A - Chip processing equipment - Google Patents

Chip processing equipment Download PDF

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Publication number
CN115020310A
CN115020310A CN202110235371.8A CN202110235371A CN115020310A CN 115020310 A CN115020310 A CN 115020310A CN 202110235371 A CN202110235371 A CN 202110235371A CN 115020310 A CN115020310 A CN 115020310A
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CN
China
Prior art keywords
chip
mounting
rotating
linear motor
suction nozzle
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Pending
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CN202110235371.8A
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Chinese (zh)
Inventor
殷茂林
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Beijing Autotech Electric Equipment Co ltd
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Beijing Autotech Electric Equipment Co ltd
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Application filed by Beijing Autotech Electric Equipment Co ltd filed Critical Beijing Autotech Electric Equipment Co ltd
Priority to CN202110235371.8A priority Critical patent/CN115020310A/en
Publication of CN115020310A publication Critical patent/CN115020310A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses chip processing equipment, which comprises a chip stripping device, a suction nozzle device and a chip mounting device, wherein the suction nozzle device comprises at least two suction nozzles, the suction nozzle device can move to the chip stripping device to absorb a chip stripped by the chip stripping device, and the suction nozzle device is provided with a mounting station; the chip mounting device is provided with a clamp for fixing a mounting piece, and can adjust the relative positions of the mounting piece and the suction nozzles positioned at the mounting station so as to mount at least two chips on the mounting piece. The problem of two or more different chips being precisely mounted on the base at one time is solved, and the processes of mounting for multiple times are reduced.

Description

Chip processing equipment
Technical Field
The invention relates to the technical field of chip processing, in particular to chip processing equipment.
Background
As the times have progressed, the use of chips has become more widespread, and thus the demand for processing of chips has also increased. The existing chip processing equipment can only carry out blue film stripping and mounting on one chip at a time. However, the structure and function of the existing product are complex, and a plurality of chips are often required to be mounted on one mounting piece. However, the chip is processed by using the device capable of only blue film peeling and mounting one chip at a time, which not only wastes peeling time, but also cannot simultaneously mount chips of different sizes if a plurality of chips of different sizes need to be mounted on one mounting member. And a plurality of processing procedures are added.
Disclosure of Invention
The invention provides a chip processing device, which solves the problem that two or more different chips are precisely mounted on a base at one time and reduces the processes of mounting for multiple times.
In order to achieve the above object, the present invention provides the following technical solutions:
a chip handling apparatus, comprising:
a chip peeling device;
the suction nozzle device comprises at least two suction nozzles, the suction nozzle device can move to the chip stripping device to suck the chips stripped by the chip stripping device, and the suction nozzle device is provided with a mounting station;
the chip mounting device is provided with a clamp for fixing a mounting part, and can adjust the relative positions of the mounting part and suction nozzles positioned at the mounting station so as to mount at least two chips on the mounting part at the same time.
Optionally, the chip mounting device includes a connection platform and a mounting positioning seat disposed on the connection platform, the connection platform is provided with a plurality of connection holes for fixing the fixture, and the mounting positioning seat is provided with a positioning groove.
Optionally, the device comprises an XY linear motor module, and the connection table is connected to the XY linear motor module; the XY linear motor module can drive the connecting table to move horizontally along the X-axis direction and/or the Y-axis direction.
Optionally, the connecting table is provided with a bonding part for bonding and connecting the XY linear motor module and an extending part extending out of the XY linear motor module, and the extending part is provided with a through connecting hole.
Optionally, the XY linear motor module is connected to the rotating device, and the rotating device can drive the XY linear motor module to rotate.
Optionally, the rotating device includes a fixed part and a rotating part; the chip processing equipment further comprises an XY manual sliding table, the fixing part is connected to the XY manual sliding table, and the XY linear motor module is connected to the rotating part.
Optionally, the XY manual sliding table further comprises two position sensors arranged on the XY manual sliding table, and the two position sensors are sequentially arranged around the circumference of the rotating device;
a position sensor generates a sensing signal when the rotating part rotates to a first limit position; the other position sensor generates a sensing signal in a state where the rotating portion is rotated to a second limit position.
Optionally, be connected with down and extend the piece on the rotating part, position sensor includes emission portion and receiving part, form the portion of passing through that supplies to extend the piece rotation under and pass through between emission portion and the receiving part.
Optionally, the XY manual sliding table is fixedly connected to the base, and four corners of the base are provided with fixing holes.
Optionally, the chip processing apparatus further includes a linear module, and the suction nozzle device is connected to the linear module; the linear module is further connected with a visual camera, the visual camera collects images of the attaching parts on the chip attaching device, and displacement parameters and rotation angle parameters of the chip attaching device are calculated according to the images.
By adopting the technical scheme, the invention has the following beneficial effects:
the chip processing equipment solves the problem that two or more different chips are precisely pasted on the base at one time, and reduces the process of pasting for multiple times.
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention to its proper form. It is obvious that the drawings in the following description are only some embodiments and that for a person skilled in the art, other drawings can also be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic structural view of a chip mounting device of a chip handling apparatus provided by the present invention;
FIG. 2 is a side view of a chip mounter of a chip handling apparatus provided by the present invention;
FIG. 3 is a diagram of a chip mounting device and a linear module of the chip processing apparatus according to the present invention;
FIG. 4 is a schematic structural diagram of an ejector mechanism of a chip processing apparatus provided in the present invention;
FIG. 5 is a top view of an ejector pin mechanism of the chip handling apparatus provided in the present invention;
FIG. 6 is a schematic diagram of the ejector mechanism of the chip processing apparatus provided in the present invention;
FIG. 7 is a schematic structural diagram of a blue film chip peeling device of the chip processing apparatus provided by the present invention;
FIG. 8 is a side view of a blue film chip peeling device of the chip handling apparatus provided in the present invention;
fig. 9 is a schematic diagram of the blue film chip stripping device and the suction nozzle of the chip processing apparatus provided by the invention.
In the figure, a base 1, an XY manual sliding table 2, a position sensor 3, a rotating device 4, an XY linear motor module 5, a mounting positioning seat 6, a lower extension sheet 7, a suction nozzle 8, a suction nozzle device 9, a vision camera 10, a mounting positioning seat 11 and a suction nozzle rod 15;
the device comprises a lifting component 1a, a bottom platform 2a, an ejector pin cap fixing component 3a, an ejector pin cap 4a, an ejector pin assembly 5a, an ejector pin cap lifting mechanism 6a, a shielding plate 7a, a first inductor 8a, a cam bearing 9a, a second guide rail part 10a, a second inductor 11a, a shielding piece 12a, a first guide rail part 13a, a slide block 14a, a blue film plate 16a and a chip 17 a;
a first translation mechanism 1b, a second translation mechanism 2b, a third translation mechanism 3b, a third translation mechanism 4b, a first blue film tray 5b, a second blue film tray 6b, a translation platform 7b, a second ejector mechanism 8b, a first ejector mechanism 9b, a first suction nozzle 10b, a second suction nozzle 11b, and a suction nozzle direction slide rail 14 b.
It should be noted that the drawings and the description are not intended to limit the scope of the inventive concept in any way, but to illustrate it by a person skilled in the art with reference to specific embodiments.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the following embodiments are used for illustrating the present invention and are not intended to limit the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or assembly must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
Example one
Referring to fig. 1 to 9, an embodiment of the present application provides a chip handling apparatus including a chip peeling device, a nozzle device 9, and a chip mounting device. The suction nozzle device 9 comprises at least two suction nozzles 8, the suction nozzle device 9 can move to the chip peeling device to suck the chips peeled by the chip peeling device, and the suction nozzle device 9 is provided with a mounting station. The chip mounting device is provided with a clamp for fixing a mounting piece, and can adjust the relative position of the mounting piece and each suction nozzle 8 positioned at the mounting station so as to mount at least two chips on the mounting piece. The two suction nozzles 8 respectively suck the chip to be attached to the attaching part in advance, the attaching part is clamped on the chip attaching device, and the chip attaching device drives the clamping part to adjust the angle and the position of the attaching part, so that the chip on each suction nozzle 8 is aligned with the corresponding position of the attaching part in advance. The chip processing equipment solves the problem that two or more different chips are precisely pasted on the base at one time, and reduces the process of pasting for multiple times.
Further, the chip mounting device comprises a connecting table and a mounting positioning seat 116 arranged on the connecting table, a plurality of connecting holes for fixing the fixture are formed in the connecting table, and a positioning groove is formed in the mounting positioning seat 116. The position of pasting and installing positioning seat 116 can identify the chip to adjust the pasting and installing piece to align with the chip position, and the pasting and installing piece is installed through the connecting table, so that the installation is convenient and fast, and the structure is stable.
Further, the device comprises an XY linear motor module 5, wherein the connecting table is connected to the XY linear motor module 5; the XY linear motor module 5 can drive the connecting table to move in the X-axis direction and/or the Y-axis direction. The position of the mounting connecting table is adjusted to drive the mounting part to be adjusted on the plane so as to align the suction nozzle 8.
Furthermore, the connecting platform is provided with a bonding part for bonding and connecting the XY linear motor module 5 and an extending part extending out of the XY linear motor module 5, and the extending part is provided with a through connecting hole. So set up, the installed part of anchor clamps can not influence the adjustment of pasting dress connection table position.
Further, the device comprises a rotating device 4, the XY linear motor module 5 is connected to the rotating device 4, and the rotating device 4 can drive the XY linear motor module 5 to rotate. Because a plurality of chips are mounted on the mounting member, the position of the chip carried by the suction nozzle 8 and the pre-mounting position on the mounting member may form a certain angle on the XY plane, and the chip needs to be rotated for angle adjustment.
Further, the rotating device 4 comprises a fixed part and a rotating part; the chip processing equipment further comprises an XY manual sliding table 2, the fixing part is connected to the XY manual sliding table 2, and the XY linear motor module 5 is connected to the rotating part. The position and the angle of all parts above the manual sliding table can be preset, so that the position and the angle of the XY linear motor module 5 and the rotating device 4 which need to be corrected at each time are reduced to the maximum extent, time is saved, the device is protected, and the whole service life of the device is prolonged.
Further, the XY manual sliding table comprises two position sensors 3 arranged on the XY manual sliding table 2, and the two position sensors 3 are sequentially arranged around the circumference of the rotating device 4. A position sensor 3 generates a sensing signal in a state where the rotating portion is rotated to a first limit position; in a state where the rotating portion is rotated to a second limit position, the other position sensor 3 generates a sensing signal. The rotation angle of the rotating device 4 is measured.
Wherein, be connected with down on the rotating part and extend piece 7, position sensor 3 includes emission portion and receiving part, form the passing portion that supplies down to extend piece 7 and rotate and pass through between emission portion and the receiving part.
Further, still include base 1, XY manual slip table 2 fixed connection be in on the base 1, four angle departments of base 1 are provided with the fixed orifices. Carry out holistic fixed through base 1, make the structure fixed more firm, job stabilization nature is stronger.
Further, the chip processing equipment further comprises a linear module, and the suction nozzle device 9 is connected to the linear module; the linear module is further connected with a visual camera 10, the visual camera 10 collects images of the attached parts on the chip attaching device, and displacement parameters and rotation angle parameters of the chip attaching device are calculated according to the images. The position and the angle of the mounting part of the current pre-mounted chip are shot and compared with those of the pre-stored part, so that the chip is aligned with the pre-mounted position, and what position adjustment and angle adjustment are required to be carried out on the mounting part.
Example two
On the basis of the first embodiment, referring to fig. 4 to 6, a further chip peeling apparatus includes a thimble mechanism including a base 2a, a first guide portion 13a, a second guide portion 10a, a lifting member 1a, a thimble assembly 5a, and a thimble cap assembly. The first guide rail portion 13a is fixedly attached to the base 2a, and the second guide rail portion 10a is slidably attached to the first guide rail portion 13 a. The lifting member 1a is connected to the base 2a, and the lifting member 1a is drivingly connected to the second guide rail portion 10 a. The thimble assembly 5a includes a thimble rod and a thimble connected to the thimble rod, and the thimble rod is connected to the second guide rail portion 10 a. The thimble cap subassembly includes thimble cap 4a, slider 14a and thimble cap elevating system 6a, thimble cap 4a slidable ground cover is established on thimble assembly 5a, just thimble cap 4a connects on the slider 14a, slider 14a slidable ground connects on the second guide rail, thimble cap elevating system 6a fixed connection be in on second guide rail portion 10a, and with slider 14a drive connection. In the first step, the thimble is hidden in the thimble cap 4a, and the lifting component 1a drives the second guide rail part 10a, the thimble assembly 5a and the thimble cap assembly to rise along the first guide rail part 13a until the second guide rail part, the thimble assembly and the thimble cap assembly abut against the blue film. And secondly, a through hole is formed in the top of the thimble cap 4a, the thimble cap lifting mechanism 6a drives the sliding block 14a to drive the thimble cap 4a to slide downwards along the second guide rail part 10a, the tip of the thimble extends out of the through hole, and the chip 17a is jacked up and simultaneously punctures the blue membrane. Meanwhile, the suction nozzle rod 15 matched with the thimble mechanism vacuumizes the inside of the suction nozzle rod 15 when the thimble cap 4a moves downwards to expose the thimble to puncture the blue film, and the suction nozzle 8 sucks the chip 17a to move upwards, so that the chip 17a is smoothly peeled off from the blue film. The thimble mechanism of this embodiment makes chip 17a peel off the blue membrane easily, improves production efficiency, lower chip 17a breakage rate, reduces manufacturing cost.
Further, the thimble cap lifting mechanism 6a comprises a bracket connected to the second guide rail portion 10a and a motor connected to the bracket, a rotor of the motor is connected with a cam bearing 9a, and the cam bearing 9a abuts against the slide block 14 a. In the first step, the cam bearing 9a pushes against the slide block 14a to drive the thimble cap 4a to be at the highest position, and in the second step, the cam bearing 9a rotates to enable the slide block 14a to descend to drive the thimble cap 4a to move downwards. The process is realized by using the cam bearing 9a, the structure is simple and convenient, and the accuracy is high.
Further, the cam bearing 9a includes a central body and an annular body wound outside the central body, and balls are disposed between the central body and the annular body. The central body is connected with an eccentric shaft, and a rotor of the motor is fixedly connected with the eccentric shaft. The ball increases the distance of up-and-down motion and plays the effect of reducing friction power, extension equipment life reduces the maintenance number of times.
Further, the second guide rail portion 10a is provided with an escape groove that escapes the cam bearing 9 a. The cam bearing 9a is larger in volume than the slider 14a, and in order to ensure smooth movement of the slider 14a, the cam bearing 9a does not generate friction with the second rail portion 10a, and therefore, an escape groove for escaping the cam bearing 9a is provided in the second rail portion 10 a.
Further, the magnetic shielding device further comprises a first position sensor, the first position sensor comprises a first inductor 8a and a shielding disc 7a, the first inductor 8a is fixedly connected with the second guide rail part 10a, the shielding disc 7a is fixedly connected with the rotor, the first inductor 8a is provided with a first transmitting part and a first receiving part, an accommodating area is formed between the first transmitting part and the first receiving part, part of disc surface of the shielding disc 7a is located in the accommodating area, and a through part is arranged on the shielding disc 7 a. Wherein, the through part is a narrow through groove, and the rotation angle of the fixed cam bearing 9a can be detected when the through part guided by the shielding plate 7a rotates to a position between the first transmitting part and the first receiving part, so as to control the movement of the thimble cap assembly and the position of the thimble cap 4 a.
Furthermore, one end of the rotor, which is far away from the cam bearing 9a, is connected with the shielding disc 7a, the first position sensor further comprises an extension plate, one end of the extension plate is fixed on the bracket, the other end of the extension plate extends towards the tail of the motor, and the tail end of the extension plate is connected with the first inductor 8 a. The first position sensor is arranged on one side, deviating from the cam bearing 9a, of the rotor, so that the installation is convenient, and the observation and the maintenance are convenient.
Further, still include second position sensor, second position sensor includes along two second inductors 11a that first guide rail portion 13a vertically set gradually and connects shield 12a on second guide rail portion 10a, second position sensor includes second transmitting terminal and second receiving terminal, form between second transmitting terminal and the second receiving terminal and supply the passing area that shield 12a passed through. The second position sensor senses the position of the second guide rail part 10a, the thimble assembly 5a and the whole thimble cap assembly driven by the lifting part 1a, and judges whether the thimble contacts the blue film disc 16 a.
Furthermore, a thimble cap fixing part 3a is connected to the slider 14a, the thimble cap fixing part 3a includes a first fixing part and a second fixing part, the first fixing part is fixedly connected to the slider 14a, and the second fixing part is connected to the first fixing part so as to clamp the thimble cap 4 a. The thimble cap 4a and the sliding block 14a are fixed, so that the thimble cap 4a can be conveniently lifted.
Furthermore, an ejector pin fixing part is connected to the second guide rail part 10a, and the ejector pin fixing part includes a third fixing part and a fourth fixing part, the third fixing part is fixedly connected to the second guide rail part 10a, and the fourth fixing part is fixedly connected to the third fixing part to clamp the ejector pin rod. The thimble is fixedly connected to the second guide rail portion 10a without being affected by the elevation of the thimble cap 4 a.
Further, the third fixing portion and the second guide rail portion 10a enclose a through groove, and the slider 14a is disposed through the through groove. The side of the thimble fixing part close to the second guide rail part 10a is provided with a groove avoiding the slide block 14a, so that the thimble cap component is not influenced to drive the thimble cap 4a to slide up and down along the second guide rail part 10 a.
EXAMPLE III
On the basis of the first embodiment and the second embodiment, referring to fig. 7 to 9, the further chip peeling apparatus further includes a moving platform 7b, at least two blue film assemblies, at least two ejector mechanisms, and a first translation mechanism 1 b. The blue membrane components are all arranged on the moving platform 7b, and the ejector pin mechanisms are all arranged on the moving platform 7b and located below the corresponding blue membrane components. The first translation mechanism 1b is in transmission connection with the moving platform 7b and is used for driving the moving platform 7b to translate along a first direction. The blue membrane chip stripping device of the embodiment enables chips of different specifications to be in a double blue membrane mode in one-step mounting, each blue membrane disc is provided with an independent ejector pin, and the problem that different chips of different sizes and specifications cannot be mounted simultaneously due to the fact that a single blue membrane single ejector pin or multiple blue membranes share one ejector pin is solved.
Preferably, two blue film assemblies are included, the two blue film assemblies respectively including the first blue film disk 5b and the chips thereon and the second blue film disk 6b and the chips thereon. Preferably, the ejector pin mechanism comprises two ejector pin mechanisms, wherein the two ejector pin mechanisms are a first ejector pin mechanism 9b and a second ejector pin mechanism 8b respectively; comprises two nozzle rods 15, and the nozzle rods 15 are provided with a first nozzle 10b and a second nozzle 11 b. When the device works, the suction nozzle rod 15 is firstly positioned above the first blue film plate 5b, the first ejector pin mechanism 9b punctures and ejects a chip on the first blue film plate 5b, and the first suction nozzle 10b sucks up the chip; then the first translation mechanism 1b drives the moving platform 7b and the blue membrane component and the ejector pin mechanism arranged thereon to move synchronously, so that the suction nozzle rod 15 is positioned above the second blue membrane disk 6b, the second ejector pin mechanism 8b punctures and jacks up two chips on the second blue membrane disk 6b, and the second suction nozzle 11b sucks up the chip. Therefore, the film can be pasted on the chips with different specifications on the same machine.
Wherein the first translation mechanism 1b is movable back and forth in the Y direction.
Further, the first translation mechanism 1b comprises a first motor, a first lead screw and a first translation block in threaded connection with the first lead screw; the first motor is in driving connection with the lead screw; the moving platform 7b is connected to the translation block. The lead screw rotates towards different directions to enable the first translation block to drive the moving platform 7b to move back and forth along the Y direction, and therefore switching of the suction nozzle among different blue film discs is achieved.
Further, the first translation mechanism 1b further comprises a housing, guide rails are arranged on two sides of the housing, a containing cavity for containing the lead screw is formed between the two guide rails, and the moving platform 7b is slidably connected to the guide rails. The moving platform 7b slides on the guide rail, and the moving stability can be maintained.
Further, the moving platform 7b includes a top plate and lower extension plates connected to both side edges of the top plate, and the lower extension plates shield the guide rails. The lower extension plate can protect internal structures such as the guide rail, the first lead screw and the first translation block.
Further, the device also comprises a plane coordinate adjusting device, wherein the plane coordinate adjusting device is connected to the moving platform 7b, each blue membrane component is connected to the plane coordinate adjusting device, and the plane coordinate adjusting device adjusts the relative positions of the blue membrane component and the corresponding ejector pin mechanism. The thimble mechanism can be adjusted to correspond to the chips on the corresponding blue membrane assembly, and then the position is changed after one chip is jacked to jack up a second chip.
Further, the plane coordinate adjusting device includes a second translation mechanism 2b and a third translation mechanism, the third translation mechanism is connected to the second translation mechanism 2b, the translation directions of the second translation mechanism 2b and the first translation mechanism 1b are the same, the translation direction of the third translation mechanism is perpendicular to the translation direction of the second translation mechanism 2b, and each blue membrane module is respectively connected to the corresponding third translation mechanism. The second translation mechanism 2b can drive the blue film assembly to move back and forth along the Y direction, and the third translation mechanism can drive the blue film assembly to move back and forth along the X direction, so that any point in the plane of the blue film disc can be opposite to the ejector pin mechanism fixedly connected with the moving platform 7 b. The device comprises at least two third translation mechanisms, and each ejector pin mechanism corresponds to one third translation mechanism. Preferably, two third translation mechanisms are included, which are the third translation mechanism 3b and the third translation mechanism 4b, respectively.
Further, the second translation mechanism 2b extends along one length of the moving platform 7b, and the ejector mechanisms are sequentially arranged along the other length of the moving platform 7 b. Thus, the stability can be maintained.
The second translation mechanism 2b comprises a second motor, a second lead screw and at least two second translation blocks in threaded connection with the second lead screw, and the second motor is in driving connection with the second lead screw. The blue film chip stripping device also comprises connecting seats, wherein the connecting seats are respectively connected with the second translation blocks, and the third translation mechanisms are respectively connected to the connecting seats.
The third translation mechanism comprises a third motor, a third lead screw and a third translation block in threaded connection with the third lead screw, and the blue membrane assembly is connected to the third translation block. The position is controlled to be changed by the lead screw, so that the control is accurate and the change is accurate.
Further, including two blue membrane subassemblies, blue membrane subassembly includes blue membrane installation department and connection the connecting portion of blue membrane installation department, two blue membrane installation department of blue membrane subassembly sets up in opposite directions. Two blue membrane subassemblies set up reducible in opposite directions, and the production time is saved to the interval between the two.
Further, the suction nozzle support, the suction nozzle rod 15 is installed at the suction nozzle support, still is provided with the cylinder on the suction nozzle support, is provided with the suction nozzle between suction nozzle rod 15 and the suction nozzle support to slide rail 14b, and the cylinder can drive suction nozzle rod 15 to do the reciprocating motion of Z orientation along the suction nozzle to slide rail 14 b.
Wherein, the Z direction is a direction perpendicular to the X and Y directions to form a plane. In this way, the suction nozzle can be moved closer to or away from the blue film disk.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A chip handling apparatus, comprising:
a chip peeling device;
the suction nozzle device comprises at least two suction nozzles, the suction nozzle device can move to the chip stripping device to suck the chips stripped by the chip stripping device, and the suction nozzle device is provided with a mounting station;
the chip mounting device is provided with a clamp for fixing a mounting part, and can adjust the relative positions of the mounting part and suction nozzles positioned at the mounting station so as to mount at least two chips on the mounting part at the same time.
2. The chip processing apparatus according to claim 1, wherein the chip mounting device comprises a connecting table and a mounting positioning seat disposed on the connecting table, the connecting table is provided with a plurality of connecting holes for fixing the fixture, and the mounting positioning seat is provided with a positioning groove.
3. The chip handling apparatus of claim 2, comprising an XY linear motor module, the connection station being connected to the XY linear motor module; the XY linear motor module can drive the connecting table to translate along the X-axis direction and/or the Y-axis direction.
4. The apparatus according to claim 3, wherein the connection stage has a fitting portion for fitting and connecting the XY linear motor modules and an extension portion extending out of the XY linear motor modules, and the extension portion is provided with a through connection hole.
5. The apparatus of claim 3, further comprising a rotating device, wherein the XY linear motor modules are coupled to the rotating device, and wherein the rotating device is capable of rotating the XY linear motor modules.
6. The chip processing apparatus of claim 5, wherein the rotating means comprises a stationary portion and a rotating portion; the chip processing equipment further comprises an XY manual sliding table, the fixing part is connected to the XY manual sliding table, and the XY linear motor module is connected to the rotating part.
7. The apparatus according to claim 6, further comprising two position sensors provided on the XY manual slide table, the two position sensors being disposed in sequence around a circumferential direction of the rotating means;
a position sensor generates a sensing signal when the rotating part rotates to a first limit position; the other position sensor generates a sensing signal in a state where the rotating portion is rotated to a second limit position.
8. The chip processing apparatus according to claim 7, wherein the rotating portion is connected to a lower extension piece, the position sensor comprises a transmitting portion and a receiving portion, and a passing portion for the lower extension piece to rotate through is formed between the transmitting portion and the receiving portion.
9. The chip processing apparatus according to claim 6, further comprising a base, wherein the XY manual sliding table is fixedly connected to the base, and four corners of the base are provided with fixing holes.
10. The apparatus of claim 1, further comprising a linear module, wherein the nozzle device is connected to the linear module; the linear module is further connected with a visual camera, the visual camera collects images of the attaching parts on the chip attaching device, and displacement parameters and rotation angle parameters of the chip attaching device are calculated according to the images.
CN202110235371.8A 2021-03-03 2021-03-03 Chip processing equipment Pending CN115020310A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110235371.8A CN115020310A (en) 2021-03-03 2021-03-03 Chip processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110235371.8A CN115020310A (en) 2021-03-03 2021-03-03 Chip processing equipment

Publications (1)

Publication Number Publication Date
CN115020310A true CN115020310A (en) 2022-09-06

Family

ID=83064787

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110235371.8A Pending CN115020310A (en) 2021-03-03 2021-03-03 Chip processing equipment

Country Status (1)

Country Link
CN (1) CN115020310A (en)

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