CN115020059A - Composite soft magnetic material and preparation method and application thereof - Google Patents
Composite soft magnetic material and preparation method and application thereof Download PDFInfo
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- 239000000696 magnetic material Substances 0.000 title claims abstract description 106
- 239000002131 composite material Substances 0.000 title claims abstract description 58
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000004804 winding Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000006698 induction Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000035484 reaction time Effects 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000010288 cold spraying Methods 0.000 claims description 2
- 229910001431 copper ion Inorganic materials 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- 238000007735 ion beam assisted deposition Methods 0.000 claims description 2
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000007751 thermal spraying Methods 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 16
- 229910001004 magnetic alloy Inorganic materials 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 24
- 239000000523 sample Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 10
- 238000002441 X-ray diffraction Methods 0.000 description 8
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- 101710134784 Agnoprotein Proteins 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
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- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 nickel metals Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
- H01F1/14708—Fe-Ni based alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
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- Dispersion Chemistry (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The application discloses a composite soft magnetic material, which comprises a soft magnetic material and metal, wherein the metal comprises copper and silver, and the metal is coated on the surface of the soft magnetic material; the soft magnetic material comprises soft magnetic metal and soft magnetic alloy. The application further discloses a preparation method of the composite soft magnetic strip-shaped or wire-shaped material. And further utilizing the composite soft magnetic strip-shaped or wire-shaped material to prepare the inductance coil. The inductance coil has excellent quality factors under the high-frequency working condition; and the inductance is very low under the low-frequency working condition. Therefore, the inductance coil prepared by the composite soft magnetic strip-shaped or wire-shaped material has very low energy loss and is particularly suitable for large-scale application.
Description
Technical Field
The application relates to a preparation method of a composite soft magnetic material, and belongs to the field of induction coils.
Background
Systems on chip are used in modern electronic devices in large quantities to achieve high frequency, small size, light weight, high reliability, and multiple functions of devices. The normal work of the system on chip can not be separated from the high-performance chip inductor. Inductors are widely used in Alternating Current (AC) electronic devices, especially in radio devices, together with capacitors and resistors, to form the three large passive linear components of an electronic circuit. The main applications of inductors include oscillators, chokes, filters and in combination with capacitors for tuning circuits and impedance matching. With the further development of electronic information technology, the inductor, as a key component, plays a significant role in the electronic information industry, and is an important guarantee for system stability and reliability particularly in the aspects of core power modules, sensors and radio frequency circuits.
Amorphous (including nanocrystalline structure) soft magnetic material is a novel material that appeared in the 70 s of the 20 th century, and has the advantages of small iron core loss, high resistivity, good frequency characteristic, high magnetic induction intensity, strong corrosion resistance and the like, so that great attention is paid to people, and the amorphous (including nanocrystalline structure) soft magnetic material is known as a novel green energy-saving material in the 21 st century. The excellent soft magnetic characteristics of amorphous and nanocrystalline alloys are derived from the special organization structures of the amorphous and nanocrystalline alloys, and the amorphous structures have no crystal grains and crystal boundaries and are easy to magnetize; the grain size in the nanocrystalline structure is smaller than the magnetic exchange action length, resulting in small average magnetocrystalline anisotropy, and the magnetostriction of the nanocrystalline structure can be close to zero by adjusting the components.
The inductor is directly prepared from the amorphous soft magnetic material, so that the area of the inductor can be obviously reduced, and meanwhile, the performance is effectively improved, and the integration level of the electronic circuit is further improved. However, compared with common metals or alloys, amorphous materials have high resistivity, and when directly used as an inductor coil, the amorphous materials generate large ohmic loss, which adversely affects the quality factor of the inductor. The quality factor (Q) is an important parameter for an inductor. The quality factor is the ratio of the energy stored in the inductor to the energy lost, and the higher the quality factor of the inductor is, the smaller the power consumption of the inductor is, the higher the efficiency is. While amorphous soft magnetic material is used directlyAs a conductor of an inductor, since the resistivity of amorphous is much larger than that of copper (about 1.75X 10) -2 μ Ω · m). According to ohm's law, when current flows, the ohmic loss generated by the high-resistivity metal coil is much larger than that of the low-resistivity metal coil, resulting in a low Q value of the inductor.
The measures reported at present for improving the Q value of the inductance coil mainly include that a thick metal coil is made of metal with low resistivity so as to reduce ohmic loss, the thick metal coil cannot influence the mechanical stability of the inductance, but a thick photoresist photoetching process and a thick metal electroplating process are needed, the manufacturing difficulty is high, and meanwhile, the increase of the metal thickness can cause the proximity effect and the parasitic capacitance effect between the coils to tend to be obvious and influence the Q value of the inductance.
In addition, the quality factor Q of the thin film inductor can be improved by reducing substrate loss, and high resistivity silicon can be used to suppress substrate induced loss such as eddy current, but in silicon substrates and dielectrics (SiO) 2 ) The charge accumulated at the interface between the layers makes the Q factor still unsuitable for many high frequency applications.
Disclosure of Invention
According to the inductor coil, the low-resistivity metal is coated on the soft magnetic surface to prepare the inductor coil, so that ohmic loss is reduced, and the quality factor of the inductor is improved.
According to a first aspect of the present application, a composite soft magnetic material is provided.
A composite soft magnetic material comprising a soft magnetic material, a low resistivity metal;
the composite soft magnetic material is in a strip shape or a thread shape;
the low-resistivity metal is selected from at least one of copper and silver;
the low-resistivity metal is coated on the surface of the soft magnetic material.
Optionally, the ratio of the low resistivity metal to the soft magnetic material is 1:10 to 1:300 by weight.
Optionally, the saturation induction density of the composite soft magnetic material is 0.5-2.2T; the coercive force of the composite soft magnetic material is 0.01-100A/m.
Optionally, in the composite soft magnetic material, the soft magnetic material has the following chemical formula:
Fe a Co b Ni c M 100-a-b-c (ii) a at.%; 60 ≦ a + b + c ≦ 100; m is at least one selected from Si, B, P, C, Cu, Zr, Nb, Mo, Hf, Ag, Au, Cu, Ti, V, Zn, Ga, Sn, Pd, Y, W, Pt and Al.
Optionally, when any one of a, b and c is 100, the soft magnetic material does not contain an element M.
According to a second aspect of the present application, there is provided a method for the preparation of the above composite soft magnetic material.
A first method for preparing a composite soft magnetic material, comprising the steps of:
and (3) soaking the soft magnetic material in a solution containing a copper source, and reacting to obtain the composite soft magnetic material.
Optionally, the copper source is selected from at least one of copper sulfate, copper nitrate, copper chloride.
Optionally, the solution containing the copper source has a copper ion concentration of 0.05 to 0.5 mol/L.
Optionally, the reaction time is 15-120 s.
Alternatively, the soft magnetic material may also be subjected to a voltage before the reaction proceeds.
Optionally, the voltage is 1-2V.
According to a third aspect of the present application, a second method of manufacturing the above composite soft magnetic material is provided.
A second method for preparing a composite soft magnetic material, comprising the steps of:
and coating the metal copper on the surface of the soft magnetic material to obtain the composite soft magnetic material.
Optionally, the coating is selected from one of thermal spraying, ultra-sonic cold spraying, magnetron sputtering, and ion beam assisted deposition.
Based on the two methods, the surface of the soft magnetic material can be coated with a layer of low-resistivity metal, and the coating metal layer can effectively reduce the resistivity of the soft magnetic material, so that the ohmic loss of the inductance coil is reduced, and the inductance coil with high inductance value and high quality factor is further obtained.
The composite soft magnetic material obtained by the method has high saturation magnetic induction intensity, and the inductance coil prepared from the material has the characteristic of high power density output, thereby being beneficial to realizing high integration and miniaturization of devices in a large-scale integrated circuit.
The composite soft magnetic material obtained by the method has good flexibility and plasticity, can be prepared into various forms, has a simple preparation process, and has high uniformity and stable electromagnetic performance of the induction coil.
According to the fourth aspect of the application, the composite soft magnetic material and the composite soft magnetic material obtained by the two preparation methods are provided, and the composite soft magnetic material is applied to an inductance coil.
When the number of winding turns of the inductance coil is 10, the quality factor is 2-20;
when the number of winding turns of the inductance coil is 10, the inductance value is 0.5-10 muH.
The beneficial effects that this application can produce include:
1) the preparation method of the composite soft magnetic material is simple and efficient;
2) the method for preparing the composite soft magnetic material can reduce the resistivity of the soft magnetic material, so that when the composite soft magnetic material is further used for preparing the inductance coil, the inductance coil can have high power density output characteristics and high quality factors, and a solution is provided for the bottleneck problem that the excellent performance of the inductance coil in the industry is difficult to combine.
3) The preparation method of the high-quality factor inductance coil can control the thickness and the uniformity of the coating by regulating and controlling the concentration of the solution and the reaction time. The method forms a low-resistivity copper or silver plating layer on the surface of the soft magnetic material, greatly reduces the ohmic loss of the inductance coil, and finally improves the quality factor of the inductance coil. The method has simple process, controllable metal (copper/silver) coating, and can be maintained in micro-nano scale, thereby avoiding the reduction of inductance comprehensive performance caused by coil proximity effect and parasitic capacitance effect.
Drawings
FIG. 1 shows (Fe) in examples 1 to 4 of the present application 6 Co 94 ) 0.725 Si 12.5 B 15 Soft magnetic material and 0.2mol/L CuSO 4 X-ray diffraction analysis (XRD) patterns of the bands after solution reactions 15s, 30s, 45s and 60s soft magnetic material was mixed with CuSO to show the difference between the treated and untreated samples 4 A sample of reaction 0s is shown in the figure as comparative example 1.
FIG. 2 shows (Fe) of examples 1 to 4 of the present application 6 Co 94 ) 0.725 Si 12.5 B 15 Soft magnetic material and CuSO 4 Resistivity plots after solution reactions 15s, 30s, 45s and 60 s. To show the difference between the treated and untreated samples, soft magnetic material was mixed with CuSO 4 A sample of reaction 0s (as-spun) is shown in this figure as comparative example 1.
FIG. 3 shows (Fe) in examples 1 to 4 of the present application 6 Co 94 ) 0.725 Si 12.5 B 15 Soft magnetic material and 0.2mol/L CuSO 4 And winding the composite soft magnetic material after the solution reaction for 15s, 30s, 45s and 60s into an inductance value graph of the inductance coil along with the change of the frequency. To show the difference between the treated and untreated samples, soft magnetic material was mixed with CuSO 4 The sample of reaction 0s and the pure Cu material preparation sample are shown in the figure as comparative example 1.
FIG. 4 shows (Fe) of examples 1 to 4 of the present application 6 Co 94 ) 0.725 Si 12.5 B 15 Soft magnetic material and 0.2mol/L CuSO 4 And winding the composite soft magnetic material after the solution reacts for 15s, 30s, 45s and 60s to form the quality factor Q value of the inductance coil. To show the difference between the treated and untreated samples, soft magnetic material was mixed with CuSO 4 The samples of reaction 0s and the pure Cu material preparation samples are shown as comparative example 1 in the figure.
FIG. 5 shows Fe of examples 5 to 8 of the present application 73.5 Si 13.5 B 9 Cu 1 Nb 3 Soft magnetic material and 0.2mol/LCuSO (C) 4 XRD patterns of the composite soft magnetic material after solution reaction for 15s, 30s, 45s and 60 s. To show the difference between the treated and untreated samples, soft magnetic material was mixed with CuSO 4 A sample of reaction 0s is shown in the figure as comparative example 2.
FIG. 6 shows Fe of examples 5 to 8 of the present application 73.5 Si 13.5 B 9 Cu 1 Nb 3 Soft magnetic material and 0.2mol/L CuSO 4 And winding the composite soft magnetic material after the solution reaction for 15s, 30s, 45s and 60s into an inductance value graph of the inductance coil along with the change of the frequency. To show the difference between the treated and untreated samples, soft magnetic material was mixed with CuSO 4 The sample of reaction 0s and the pure Cu material preparation sample are shown in the figure as comparative example 2.
FIG. 7 shows Fe of examples 5 to 8 of the present application 73.5 Si 13.5 B 9 Cu 1 Nb 3 Soft magnetic material and 0.2mol/L CuSO 4 And winding the composite soft magnetic material after the solution reacts for 15s, 30s, 45s and 60s to form the quality factor Q value of the inductance coil. To show the difference between the treated and untreated samples, soft magnetic material was mixed with CuSO 4 A sample of reaction 0s is shown in the figure as comparative example 2.
FIG. 8 shows Fe of examples 9 to 12 of the present application 73.5 Si 13.5 B 9 Cu 1 Nb 3 The soft magnetic material is AgNO with voltage of 1.5V and 0.4mol/L 3 And winding the composite soft magnetic material after reacting for 15s, 30s, 45s and 60s in the plating solution to form an inductance value graph of the inductance coil along with the change of frequency. To show the difference between the treated and untreated samples, soft magnetic material was mixed with AgNO 3 The sample of reaction 0s and the pure Cu material preparation sample are shown in the figure as comparative example 3.
FIG. 9 shows Fe of examples 9 to 12 of the present application 73.5 Si 13.5 B 9 Cu 1 Nb 3 The soft magnetic material is AgNO with voltage of 1.5V and 0.4mol/L 3 And winding the composite soft magnetic material after reacting for 15s, 30s, 45s and 60s in the plating solution to form the quality factor Q value of the inductance coil. To show the difference between the treated and untreated samples, soft magnetic material was mixed with AgNO 3 Sample of reaction 0s and pure Cu materialA sample is shown in the figure as comparative example 3.
Detailed Description
The present application will be described in detail with reference to examples, but the present application is not limited to these examples.
Unless otherwise specified, the raw materials in the examples of the present application were purchased commercially, wherein copper sulfate pentahydrate was purchased from Shanghai Aladdin Biotech, Inc. with a purity of 99%.
The amorphous alloy soft magnetic material is prepared in a laboratory, and the specific preparation process comprises the following steps: preparing materials according to the atomic fractions of the elements of the required set components, preparing a master alloy ingot through induction melting, and preparing the required amorphous soft magnetic ribbon alloy through a single-roller strip spinning method.
Metals and other alloy type strip-shaped and wire-shaped soft magnetic materials (iron, cobalt and nickel metals) are purchased from Zhongnuo new materials (Beijing) science and technology limited.
The analytical methods in the examples of the present application are as follows:
XRD analysis was performed using a Brooks D8 DISCOVER X-ray diffraction analyzer.
And (3) carrying out resistivity test by using a four-probe method and an RTS-9 type double-electric-test four-probe tester.
An inductance value test is carried out by utilizing an Agilent 4294A precision impedance analyzer.
The quality factor (Q value) was tested using an agilent 4294A precision impedance analyzer.
Examples 1 to 4
(Fe 6 Co 94 ) 0.725 Si 12.5 B 15 And (3) preparing the composite soft magnetic material.
Will be (Fe) 6 Co 94 ) 0.725 Si 12.5 B 15 Soft magnet is placed in 0.2mol/L CuSO 4 Reactions in solution were carried out for 15s, 30s, 45s and 60s, respectively, and labeled examples 1-4; XRD was performed on the reacted strip material (strip), and as shown in FIG. 1, a characteristic peak of Cu appeared after calibration.
The resistivity of the composite soft magnetic materials described in examples 1 to 4 above was measured by the four-probe method, and as shown in fig. 2, the resistivity of the composite soft magnetic material decreased as the reaction time increased.
Will react with CuSO 4 After solution reaction (Fe) 6 Co 94 ) 0.725 Si 12.5 B 15 The composite soft magnetic material is wound into a 10-turn air-core inductance coil, and the inductance value of the amorphous soft magnetic inductance coil in the embodiment is measured by adopting an agilent 4294A precision impedance analyzer, so that the inductance value of the inductance coil wound by the strip plated with Cu is lower than that of the inductance coil wound by the original strip as shown in fig. 3; the Q value of the amorphous soft magnetic inductance coil in the present embodiment was measured by an agilent 4294A precision impedance analyzer, and as a result, the Q value of the inductance coil wound by the Cu-plated strip shown in fig. 4 was significantly improved compared to the inductance coil wound by the original strip.
Examples 5 to 8
Fe 73.5 Si 13.5 B 9 Cu 1 Nb 3 And (3) preparing the composite soft magnetic material.
Mixing Fe 73.5 Si 13.5 B 9 Cu 1 Nb 3 Soft magnetic material is placed in 0.2mol/L CuSO 4 Reacting in the solution for 15s, 30s, 45s and 60s respectively, which correspond to examples 5-8 respectively; XRD was performed on the composite soft magnetic material obtained after the reaction, as shown in FIG. 5, a characteristic peak of Cu appeared after calibration.
Will react with CuSO 4 Solution reacted Fe 73.5 Si 13.5 B 9 Cu 1 Nb 3 The composite soft magnetic material is wound into a 10-turn hollow core inductance coil, and an agilent 4294A precision impedance analyzer is adopted to measure the inductance value of the amorphous soft magnetic inductance coil in the embodiment, so that the result is shown in fig. 6, the inductance coil wound by the strip plated with Cu is lower than the inductance value of the inductance coil wound by the original strip, but the influence of different reaction times on the inductance value is not obvious; the Q value of the amorphous soft magnetic inductance coil in the present embodiment was measured by an agilent 4294A precision impedance analyzer, and as a result, as shown in fig. 7, the Q value of the inductance coil wound by the Cu-plated strip was significantly improved compared to the inductance coil wound by the original strip.
Examples 9 to 12
Fe 73.5 Si 13.5 B 9 Cu 1 Nb 3 And (3) preparing the composite soft magnetic material.
Fe 73.5 Si 13.5 B 9 Cu 1 Nb 3 AgNO of composite soft magnetic material at voltage of 1.5V and 0.4mol/L 3 The baths were reacted for 15s, 30s, 45s and 60s, respectively, corresponding to examples 9-12.
Fe after electroplating 73.5 Si 13.5 B 9 Cu 1 Nb 3 The composite soft magnetic material is wound into a 10-turn hollow inductance coil, and an agilent 4294A precision impedance analyzer is adopted to measure the inductance value of the amorphous soft magnetic inductance coil in the embodiment, so that the result is shown in fig. 8, the inductance coil wound by the strip plated with Ag is lower than the inductance value of the inductance coil wound by the original strip, but the influence of different reaction times on the inductance is not obvious; the Q value of the amorphous soft magnetic inductor coil in this embodiment was measured by an agilent 4294A precision impedance analyzer, and the result is shown in fig. 9, where the Q value of the inductor coil wound with the Ag-plated strip was significantly improved compared to the inductor coil wound with the original strip.
Comparative examples 1 to 3
Respectively reacting (Fe) 6 Co 94 ) 0.725 Si 12.5 B 15 Soft magnetic material and Fe 73.5 Si 13.5 B 9 Cu 1 Nb 3 The soft magnetic material was directly subjected to XRD test, resistivity test, and Q value and inductance test by winding the above material into 10-turn coils, respectively, and the obtained test results are shown in fig. 1 to 9, respectively, with reference to the accompanying drawings.
The application provides a preparation method of a high-inductance-value and high-Q-value inductance coil based on a soft magnetic material, and the method improves the quality factor Q of the inductance coil to a great extent. The method has the advantages of moderate cost of the adopted raw materials, simple and feasible experimental method, easy control of the process, easy obtainment of the inductance coil with high inductance value and high Q value, and contribution to the wide application and realization of large-scale mass production.
Although the present application has been described with reference to a few embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application as defined by the appended claims.
Claims (10)
1. A composite soft magnetic material, characterized in that the composite soft magnetic material comprises a soft magnetic material, a low resistivity metal;
the composite soft magnetic material is in a strip shape or a thread shape;
the low-resistivity metal is selected from at least one of copper and silver;
the low-resistivity metal is coated on the surface of the soft magnetic material.
2. The composite soft magnetic material according to claim 1, wherein the ratio of the low resistivity metal to the soft magnetic material is 1:10 to 1:300 by weight.
3. Composite soft magnetic material according to claim 1, characterized in that the saturation induction of the composite soft magnetic material is 0.5-2.2T; the coercive force of the composite soft magnetic material is 0.01-100A/m.
4. The composite soft magnetic material according to claim 1, wherein the soft magnetic material has the following chemical formula:
Fe a Co b Ni c M 100-a-b-c (ii) a at.%; 60 ≦ a + b + c ≦ 100; m is at least one selected from Si, B, P, C, Cu, Zr, Nb, Mo, Hf, Ag, Au, Cu, Ti, V, Zn, Ga, Sn, Pd, Y, W, Pt and Al;
preferably, when any one of a, b and c is 100, the soft magnetic material does not contain an element M.
5. A method for the production of a composite soft magnetic material according to any of claims 1 to 4, characterized in that the method comprises the following steps:
and (3) soaking the soft magnetic material in a solution containing a copper source, and reacting to obtain the composite soft magnetic material.
6. The production method according to claim 5, wherein the copper source is selected from at least one of copper sulfate, copper nitrate, and copper chloride;
preferably, the solution containing the copper source has the concentration of copper ions of 0.05-0.5 mol/L;
preferably, the reaction time is 15 to 120 s.
7. A method according to claim 5, characterized in that a voltage is also applied to the soft magnetic material before the reaction is carried out;
preferably, the voltage is 1-2V.
8. A method for the production of a composite soft magnetic material according to any of claims 1 to 4, characterized in that the method comprises the following steps:
and coating the metal copper on the surface of the soft magnetic material to obtain the composite soft magnetic material.
9. The method of claim 8, wherein the coating is selected from one of thermal spraying, ultra-sonic cold spraying, magnetron sputtering, and ion beam assisted deposition.
10. Use of the composite soft magnetic material according to any one of claims 1 to 4, the composite soft magnetic material obtained by the production method according to any one of claims 5 to 9, in an inductor coil;
when the number of winding turns of the inductance coil is 10, the quality factor is 2-20;
when the number of winding turns of the inductance coil is 10, the inductance value is 0.5-10 muH.
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