CN115019656B - Display panel motherboard, display panel and display device - Google Patents

Display panel motherboard, display panel and display device Download PDF

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CN115019656B
CN115019656B CN202210720305.4A CN202210720305A CN115019656B CN 115019656 B CN115019656 B CN 115019656B CN 202210720305 A CN202210720305 A CN 202210720305A CN 115019656 B CN115019656 B CN 115019656B
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display panel
pad
test
protective pad
display
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CN115019656A (en
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刘子龙
彭兆基
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Vicino Technology Co ltd
Hefei Visionox Technology Co Ltd
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Vicino Technology Co ltd
Hefei Visionox Technology Co Ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

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  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides a display panel motherboard, a display panel and a display device, which solve the problem that a conductive material area on a cutting surface of the display panel causes a short circuit of a bonding pad of a circuit board for testing in the prior art. Wherein, the display panel motherboard includes: aligning marks; the test pad is positioned at one side of a cutting line formed by the alignment marks; the anti-bonding pad is positioned on the side of the test bonding pad of the cutting line, and the orthographic projection of the anti-bonding pad in the direction vertical to the display surface is intersected with the orthographic projection of the cutting line in the direction vertical to the display surface; and a load circuit connected with the anti-bonding pad for consuming the current flowing in the anti-bonding pad.

Description

显示面板母板、显示面板和显示装置Display panel motherboard, display panel and display device

技术领域Technical field

本申请涉及显示技术领域,具体涉及一种显示面板母板、显示面板和显示装置。The present application relates to the field of display technology, and specifically to a display panel motherboard, a display panel and a display device.

背景技术Background technique

在显示面板的制造过程中通常需要对大尺寸的显示面板母板进行切割,以得到小尺寸的显示面板。切割线位置通常包括有机材料,有机材料在切割过程中易发生碳化,从而在切割后得到的显示面板的切割面上形成具有导电功能的材料区域(以下简称导电材料区)。这种情况下,当将测试用电路板和切割后的显示面板连接以进行点灯测试时,测试用电路板的焊盘很可能与显示面板切割面上的导电材料区接触,从而使测试用电路板的相邻焊盘之间发生短路,短路电流会导致测试用电路板烧伤,严重的还会导致点灯测试所用的信号发生器出现异常。In the manufacturing process of display panels, it is usually necessary to cut a large-sized display panel motherboard to obtain a small-sized display panel. The position of the cutting line usually includes organic materials. Organic materials are prone to carbonization during the cutting process, thereby forming a material area with conductive function (hereinafter referred to as the conductive material area) on the cutting surface of the display panel obtained after cutting. In this case, when the test circuit board and the cut display panel are connected for lighting testing, the pads of the test circuit board are likely to come into contact with the conductive material area on the cut surface of the display panel, causing the test circuit to If a short circuit occurs between adjacent pads of the board, the short circuit current will cause the test circuit board to be burned, and in severe cases, it will cause abnormalities in the signal generator used for the lighting test.

发明内容Contents of the invention

有鉴于此,本申请实施例提供了一种显示面板母板、显示面板和显示装置,以解决现有技术中显示面板的切割面上的导电材料区导致测试用电路板的焊盘短路的问题。In view of this, embodiments of the present application provide a display panel motherboard, a display panel, and a display device to solve the problem in the prior art that the conductive material area on the cutting surface of the display panel causes the pads of the test circuit board to be short-circuited. .

本申请第一方面提供了一种显示面板母板,包括:对位标识;测试焊盘,位于对位标识形成的切割线的一侧;防护焊盘,位于切割线的测试焊盘所在侧,防护焊盘在垂直于显示面的方向上的正投影与测试焊盘在垂直于显示面的方向上正投影相交;以及负载电路,与防护焊盘连接,用于消耗掉防护焊盘中流过的电流。根据本实施例提供的显示面板,通过设置防护焊盘以及与防护焊盘连接的负载电路,防护焊盘在垂直于显示面的方向上的正投影与测试焊盘在垂直于显示面的方向上的正投影相交,沿切割线切割后得到的显示面板的切割面上即便形成导电材料区,当测试用电路板的焊盘搭接在显示面板的测试焊盘上时,因导电材料区导致测试用电路板上的焊盘短路所产生的短路电流可以通过防护焊盘导入负载电路,并被负载电路消耗掉,从而避免短路电流损坏测试用电路板,甚至点灯测试所用的信号发生器。The first aspect of this application provides a display panel motherboard, including: an alignment mark; a test pad located on one side of the cutting line formed by the alignment mark; and a protective pad located on the side of the test pad of the cutting line. The orthographic projection of the protective pad in the direction perpendicular to the display surface intersects with the orthographic projection of the test pad in the direction perpendicular to the display surface; and a load circuit connected to the protective pad for consuming the energy flowing through the protective pad. current. According to the display panel provided in this embodiment, by arranging the protective pad and the load circuit connected to the protective pad, the orthographic projection of the protective pad in the direction perpendicular to the display surface and the test pad in the direction perpendicular to the display surface are intersection of the orthographic projections, even if a conductive material area is formed on the cutting surface of the display panel after cutting along the cutting line, when the test circuit board pad is overlapped with the test pad of the display panel, the conductive material area will cause the test The short-circuit current generated by short-circuiting the pads on the circuit board can be introduced into the load circuit through the protective pad and consumed by the load circuit, thereby preventing the short-circuit current from damaging the test circuit board or even the signal generator used for lighting tests.

在一个实施例中,测试焊盘和防护焊盘同层设置。这样的好处在于,测试焊盘和防护焊盘可以通过一次构图工艺实现,制备过程更简单。In one embodiment, the test pad and the protective pad are arranged on the same layer. The advantage of this is that the test pad and protective pad can be realized through a patterning process, making the preparation process simpler.

在一个实施例中,在平行于切割线的方向上,防护焊盘和测试焊盘间隔设置。这样可以削弱不同焊盘中流过的电流之间的电磁干扰。In one embodiment, the guard pads and the test pads are spaced apart in a direction parallel to the cutting line. This weakens electromagnetic interference between currents flowing in different pads.

在一个实施例中,显示面板母板还包括接地焊盘,接地焊盘与防护焊盘连接,以作为负载电路;或显示面板母板还包括像素单元,像素单元与防护焊盘连接,以作为负载电路。利用接地焊盘作为负载电路,结构简单,易于实现。利用像素单元作为负载电路,可以基于像素单元的显示情况,确定发生短路问题的信号线的位置。In one embodiment, the display panel motherboard further includes a ground pad, which is connected to the protective pad to serve as a load circuit; or the display panel motherboard further includes a pixel unit, which is connected to the protective pad to serve as a load circuit. load circuit. Using the ground pad as the load circuit has a simple structure and is easy to implement. By using the pixel unit as a load circuit, the location of the signal line where the short circuit problem occurs can be determined based on the display condition of the pixel unit.

在一个实施例中,显示面板母板还包括热敏电阻,热敏电阻设置在与测试焊盘所连接的测试线上。热敏电阻的阻抗随着电流的增大而增大,从而将电流限定在有效电流范围内,防止大电流沿测试焊盘回流进入到测试用电路板和信号发生器,从而为测试用电路板和信号发生器提供进一步的保护。In one embodiment, the display panel motherboard further includes a thermistor, and the thermistor is disposed on a test line connected to the test pad. The impedance of the thermistor increases as the current increases, thereby limiting the current within the effective current range and preventing large currents from flowing back along the test pad and entering the test circuit board and signal generator, thereby providing the test circuit board with and signal generator provide further protection.

在一个实施例中,显示面板母板还包括与切割线接触的边框区和位于边框区远离切割线一侧的显示区,测试焊盘和防护焊盘位于边框区。In one embodiment, the display panel motherboard further includes a frame area in contact with the cutting line and a display area located on a side of the frame area away from the cutting line, and the test pad and the protective pad are located in the frame area.

本申请第二方面提供了另一种显示面板,包括:测试焊盘,测试焊盘包括相对设置的第一端和第二端,第一端连接测试线,第二端指向显示面板的一侧面;防护焊盘,防护焊盘在垂直于显示面的方向上的正投影与侧面在垂直于显示面的方向上的正投影相交;以及负载电路,与防护焊盘连接,用于消耗掉防护焊盘中流过的电流。A second aspect of this application provides another display panel, including: a test pad. The test pad includes a first end and a second end arranged oppositely. The first end is connected to a test line, and the second end points to one side of the display panel. ; Protective pad, the orthographic projection of the protective pad in the direction perpendicular to the display surface intersects with the orthographic projection of the side in the direction perpendicular to the display surface; and a load circuit connected to the protective pad for consuming the protective soldering The current flowing in the disk.

在一个实施例中,测试焊盘和防护焊盘同层设置;优选地,在平行于切割线的方向上,防护焊盘和测试焊盘间隔设置。In one embodiment, the test pads and the protective pads are arranged on the same layer; preferably, in the direction parallel to the cutting line, the protective pads and the test pads are arranged at intervals.

在一个实施例中,显示面板还包括接地焊盘,接地焊盘与防护焊盘连接,以作为负载电路;或者,显示面板还包括像素单元,像素单元与防护焊盘连接,以作为负载电路。In one embodiment, the display panel further includes a ground pad connected to the protective pad to serve as a load circuit; or the display panel further includes a pixel unit connected to the protective pad to serve as a load circuit.

本申请第三方面提供了一种显示装置,包括上述第二方面提供的显示面板。A third aspect of the present application provides a display device, including the display panel provided in the second aspect.

根据本申请实施例提供的显示面板母板、显示面板和显示装置,通过设置防护焊盘以及与防护焊盘连接的负载电路,防护焊盘在垂直于显示面的方向上的正投影与测试焊盘在垂直于显示面的方向上的正投影相交,沿切割线切割后得到的显示面板的切割面上即便形成导电材料区,当测试用电路板的焊盘搭接在显示面板的测试焊盘上时,因导电材料区导致测试用电路板上的焊盘短路所产生的短路电流可以通过防护焊盘导入负载电路,并被负载电路消耗掉,从而避免短路电流损坏测试用电路板,甚至损坏点灯测试所用的信号发生器。According to the display panel motherboard, display panel and display device provided by the embodiment of the present application, by arranging the protective pad and the load circuit connected to the protective pad, the orthographic projection of the protective pad in the direction perpendicular to the display surface is consistent with the test welding The orthographic projection of the disk in the direction perpendicular to the display surface intersects, and a conductive material area is formed on the cutting surface of the display panel obtained after cutting along the cutting line. When the pads of the test circuit board overlap the test pads of the display panel When connected, the short-circuit current generated by the short-circuit of the pads on the test circuit board caused by the conductive material area can be introduced into the load circuit through the protective pad and consumed by the load circuit, thereby preventing the short-circuit current from damaging the test circuit board or even damaging it. Signal generator used for lighting tests.

附图说明Description of the drawings

图1为常规显示面板母板的俯视图。Figure 1 is a top view of a conventional display panel motherboard.

图2为本申请一实施例提供的显示面板母板切割后得到的显示面板的结构示意图。FIG. 2 is a schematic structural diagram of a display panel obtained after cutting a display panel motherboard according to an embodiment of the present application.

图3为本申请一实施例提供的图2所示显示面板进行点灯测试时的截面结构示意图。FIG. 3 is a schematic cross-sectional structural diagram of the display panel shown in FIG. 2 during a lighting test according to an embodiment of the present application.

图4为本申请一实施例提供的图2所示显示面板进行点灯测试时的俯视图。图5为本申请第一实施例提供的显示面板母板的结构示意图。FIG. 4 is a top view of the display panel shown in FIG. 2 during a lighting test according to an embodiment of the present application. FIG. 5 is a schematic structural diagram of a display panel motherboard provided by the first embodiment of the present application.

图6为图5所示显示面板母板沿A1A2线的截面结构示意图。FIG. 6 is a schematic cross-sectional structural diagram of the display panel motherboard shown in FIG. 5 along line A1A2.

图7为本申请第二实施例提供的显示面板母板的结构示意图。FIG. 7 is a schematic structural diagram of a display panel motherboard provided by the second embodiment of the present application.

图8为图7所示显示面板母板沿B1B2线的截面结构示意图。FIG. 8 is a schematic cross-sectional structural diagram of the display panel motherboard shown in FIG. 7 along line B1B2.

图9为本申请第三实施例提供的显示面板母板的结构示意图。FIG. 9 is a schematic structural diagram of a display panel motherboard provided by the third embodiment of the present application.

图10为本申请第四实施例提供的显示面板母板的结构示意图。FIG. 10 is a schematic structural diagram of a display panel motherboard provided by the fourth embodiment of the present application.

图11为本申请第五实施例提供的显示面板母板的结构示意图。FIG. 11 is a schematic structural diagram of a display panel motherboard provided by the fifth embodiment of the present application.

图12为本申请一实施例提供的显示面板的结构示意图。FIG. 12 is a schematic structural diagram of a display panel provided by an embodiment of the present application.

图13为本申请二实施例提供的显示面板的结构示意图。FIG. 13 is a schematic structural diagram of a display panel provided by the second embodiment of the present application.

图14为本申请三实施例提供的显示面板的结构示意图。FIG. 14 is a schematic structural diagram of a display panel provided by the third embodiment of the present application.

具体实施方式Detailed ways

图1为常规显示面板母板的俯视图。如图1所示,显示面板母板包括多个显示面板10和设置在多个显示面板10之间的对位标识N,如图1中黑色实心点所示。显示面板母板上的对位标识N用于和切割设备上的对位标识对位,以在显示面板母板上确定出切割线L,切割设备沿着切割线L对显示面板母板进行切割,可以将大尺寸的显示面板母板分割成多个小尺寸的显示面板10。显示面板10包括显示区AA和至少部分环绕显示区AA的边框区。边框区包括焊盘区BB,焊盘区BB内设置有各种功能的焊盘,例如点灯测试用的测试焊盘、连接驱动芯片的驱动焊盘等,焊盘用于将外部信号传入显示区AA,以实现相应的功能。Figure 1 is a top view of a conventional display panel motherboard. As shown in FIG. 1 , the display panel motherboard includes a plurality of display panels 10 and alignment marks N disposed between the plurality of display panels 10 , as shown by black solid dots in FIG. 1 . The alignment mark N on the display panel motherboard is used to align with the alignment mark on the cutting equipment to determine the cutting line L on the display panel motherboard. The cutting equipment cuts the display panel motherboard along the cutting line L. , a large-sized display panel motherboard can be divided into multiple small-sized display panels 10 . The display panel 10 includes a display area AA and a frame area at least partially surrounding the display area AA. The frame area includes the pad area BB. The pad area BB is provided with pads with various functions, such as test pads for lighting tests, drive pads for connecting the driver chip, etc. The pads are used to transmit external signals to the display. Area AA to achieve the corresponding functions.

图2为本申请一实施例提供的显示面板母板切割后得到的显示面板的结构示意图。结合图1和图2所示,显示面板10包括至少一个因切割产生的侧面,该侧面记为切割面S,切割面S容易因切割导致碳化,从而形成导电材料区Q。显示面板10的焊盘区BB相比于显示区AA更靠近切割面S。焊盘区BB设置有至少一个测试焊盘11,测试焊盘11包括相对设置的第一端和第二端,第一端连接测试线,第二端指向切割面S。FIG. 2 is a schematic structural diagram of a display panel obtained after cutting a display panel motherboard according to an embodiment of the present application. As shown in FIGS. 1 and 2 , the display panel 10 includes at least one side surface produced by cutting, which is marked as the cutting surface S. The cutting surface S is easily carbonized due to cutting, thereby forming the conductive material area Q. The pad area BB of the display panel 10 is closer to the cutting surface S than the display area AA. The pad area BB is provided with at least one test pad 11. The test pad 11 includes a first end and a second end arranged oppositely. The first end is connected to the test line, and the second end points to the cutting surface S.

图3为本申请一实施例提供的图2所示显示面板进行点灯测试时的截面结构示意图。图4为本申请一实施例提供的图2所示显示面板进行点灯测试时的俯视图。结合图3和图4所示,当对图2所示显示面板10进行点灯测试时,需要将测试用电路板20上的焊盘21搭接在显示面板10的测试焊盘11上。这种情况下,可能由于多种原因,例如测试用电路板20在显示面板10的边缘发生弯折,从而导致测试用电路板20上的焊盘21与显示面板10的切割面S上的导电材料区Q接触,进而导致相邻焊盘20短路,短路电流会导致测试用电路板20烧伤,严重的还会导致点灯测试所用的信号发生器出现异常。FIG. 3 is a schematic cross-sectional structural diagram of the display panel shown in FIG. 2 during a lighting test according to an embodiment of the present application. FIG. 4 is a top view of the display panel shown in FIG. 2 during a lighting test according to an embodiment of the present application. As shown in FIGS. 3 and 4 , when performing a lighting test on the display panel 10 shown in FIG. 2 , the pads 21 on the test circuit board 20 need to be overlapped with the test pads 11 of the display panel 10 . In this case, it may be due to various reasons, for example, the test circuit board 20 is bent at the edge of the display panel 10 , resulting in a conductive gap between the pad 21 on the test circuit board 20 and the cutting surface S of the display panel 10 . The material area Q comes into contact, which in turn causes the adjacent pads 20 to be short-circuited. The short-circuit current may cause the test circuit board 20 to be burned. In severe cases, it may cause abnormalities in the signal generator used for the lighting test.

有鉴于此,本申请实施例提供了一种显示面板母板、显示面板和显示装置,通过在焊盘区BB设置防护焊盘以及与防护焊盘连接的负载电路,防护焊盘在垂直于显示面的方向上的正投影与切割线L在垂直于显示面的方向上的正投影相交,当沿切割线L对显示面板母板进行切割后,防护焊盘在得到的显示面板的切割面S上暴露。这种情况下,即便切割面S上形成导电材料区Q,当测试用电路板20的焊盘21搭接在显示面板10的测试焊盘11上时,因导电材料区Q导致测试用电路板20上的焊盘21短路所产生的短路电流可以通过防护焊盘导入负载电路,并被负载电路消耗掉,从而避免短路电流损坏测试用电路板20,甚至损坏点灯测试所用的信号发生器。In view of this, embodiments of the present application provide a display panel motherboard, a display panel and a display device. By arranging a protective pad in the pad area BB and a load circuit connected to the protective pad, the protective pad is positioned perpendicular to the display The orthographic projection in the direction of the surface intersects the orthographic projection of the cutting line L in the direction perpendicular to the display surface. When the display panel motherboard is cut along the cutting line L, the protective pad is on the cutting surface S of the obtained display panel. exposed. In this case, even if the conductive material area Q is formed on the cutting surface S, when the pad 21 of the test circuit board 20 overlaps the test pad 11 of the display panel 10, the conductive material area Q causes the test circuit board to be damaged. The short-circuit current generated by the short-circuit of pad 21 on 20 can be introduced into the load circuit through the protective pad and consumed by the load circuit, thereby preventing the short-circuit current from damaging the test circuit board 20 or even damaging the signal generator used for the lighting test.

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

图5为本申请第一实施例提供的显示面板母板的结构示意图。图6为图4所示显示面板母板沿A1A2线的截面结构示意图。本实施例中,以显示面板母板包括两个显示面板10为例,应当理解,显示面板10的数量可以根据实际需要合理设置。参阅图5和图6可以看出,该显示面板母板和图1所示显示面板的区别在于,显示面板母板还包括防护焊盘12和与防护焊盘12连接的负载电路。防护焊盘12位于切割线L的测试焊盘11所在侧,即防护焊盘12和测试焊盘11位于切割线L的同侧。防护焊盘12在垂直于显示面的方向上的正投影与切割线L在垂直于显示面的方向上的正投影相交。这里提到的相交可以是防护焊盘12的正投影和切割线L的正投影交叉,即防护焊盘12穿过切割线L,以从一个显示面板延伸至另一个显示面板上;或者也可以是防护焊盘12的正投影刚好延伸至切割线L上。通过设置防护焊盘12在垂直于显示面的方向上的正投影和切割线L在垂直于显示面的方向上的正投影相交,可以确保沿切割线L切割后,防护焊盘12的一端在切割面S上暴露出来,从而与切割面S上的导电材料区Q接触,进而将因导电材料区Q导致的测试用电路板20的焊盘21短路产生的短路电流导入负载电路,以被负载电路消耗掉。FIG. 5 is a schematic structural diagram of a display panel motherboard provided by the first embodiment of the present application. FIG. 6 is a schematic cross-sectional structural diagram of the display panel motherboard shown in FIG. 4 along line A1A2. In this embodiment, the display panel motherboard includes two display panels 10 as an example. It should be understood that the number of display panels 10 can be reasonably set according to actual needs. Referring to FIGS. 5 and 6 , it can be seen that the difference between the display panel motherboard and the display panel shown in FIG. 1 is that the display panel motherboard also includes a protective pad 12 and a load circuit connected to the protective pad 12 . The protective pad 12 is located on the side of the cutting line L where the test pad 11 is located, that is, the protective pad 12 and the test pad 11 are located on the same side of the cutting line L. The orthographic projection of the guard pad 12 in the direction perpendicular to the display surface intersects the orthographic projection of the cutting line L in the direction perpendicular to the display surface. The intersection mentioned here may be the intersection of the orthographic projection of the protective pad 12 and the orthographic projection of the cutting line L, that is, the protective pad 12 passes through the cutting line L to extend from one display panel to another display panel; or it may also be It is the orthographic projection of the protective pad 12 that just extends to the cutting line L. By arranging the orthographic projection of the protective pad 12 in the direction perpendicular to the display surface to intersect with the orthographic projection of the cutting line L in the direction perpendicular to the display surface, it can be ensured that after cutting along the cutting line L, one end of the protective pad 12 is The cutting surface S is exposed, thereby contacting the conductive material area Q on the cutting surface S, and then the short-circuit current generated by the short circuit of the pad 21 of the test circuit board 20 caused by the conductive material area Q is introduced into the load circuit to be loaded. The circuit is consumed.

如图6所示,从膜层结构的角度来说,显示面板母板包括阵列基板110和叠置在阵列基板110上的发光器件层120。发光器件层120包括间隔设置的第一发光器件区域121和第二发光器件区域122。对位标识N设置在第一发光器件区域121和第二发光器件区域122之间的阵列基板110上。切割面S可以将阵列基板11划分为第一阵列基板111和第二阵列基板112。第一发光器件区域121位于第一阵列基板111上,第二发光器件区域122位于第二阵列基板112上。沿切割面S切开后,第一阵列基板111和第一发光器件区域121形成第一显示面板,第一发光器件区域121形成第一显示面板的显示区AA,第一阵列基板111的未被第一发光器件区域121覆盖的区域形成第一显示面板的边框区。第二阵列基板112和第二发光器件区域122形成第二显示面板,第二发光器件区域122形成第二显示面板的显示区AA,第二阵列基板112的未被第二发光器件区域122覆盖的区域形成第二显示面板的边框区。As shown in FIG. 6 , from the perspective of film layer structure, the display panel motherboard includes an array substrate 110 and a light-emitting device layer 120 stacked on the array substrate 110 . The light-emitting device layer 120 includes a first light-emitting device region 121 and a second light-emitting device region 122 that are spaced apart. The alignment mark N is provided on the array substrate 110 between the first light-emitting device region 121 and the second light-emitting device region 122 . The cutting plane S can divide the array substrate 11 into a first array substrate 111 and a second array substrate 112 . The first light emitting device region 121 is located on the first array substrate 111 , and the second light emitting device region 122 is located on the second array substrate 112 . After cutting along the cutting plane S, the first array substrate 111 and the first light-emitting device region 121 form the first display panel. The first light-emitting device region 121 forms the display area AA of the first display panel. The first array substrate 111 is not The area covered by the first light emitting device area 121 forms a frame area of the first display panel. The second array substrate 112 and the second light emitting device region 122 form a second display panel. The second light emitting device region 122 forms the display area AA of the second display panel. The portions of the second array substrate 112 that are not covered by the second light emitting device region 122 The area forms a frame area of the second display panel.

防护焊盘12可以和测试焊盘11同层设置,也可以和测试焊盘11位于不同的层。在本实施例中,如图6所示,测试焊盘11和防护焊盘12同层设置。这样的好处在于,测试焊盘11和防护焊盘12可以通过一次构图工艺实现,制备过程更简单。在测试焊盘11和防护焊盘12同层设置的情况下,如图5所示,在平行于切割线L的方向上,测试焊盘11和防护焊盘12间隔设置;或者,测试焊盘11和防护焊盘12两两正对设置,即测试焊盘11和防护焊盘12共线,测试焊盘11和防护焊盘12所在的直线和切割线L垂直。比较而言,防护焊盘11和测试焊盘12间隔设置有利于实现窄边框。测试焊盘11和防护焊盘12之间的间隔可以根据实际需要合理设置。在一示例中,测试焊盘11和防护焊盘12的数量均为多个,在平行于切割线L的方向上,测试焊盘11和防护焊盘12间隔设置,防护焊盘12的宽度大于或等于相邻测试焊盘11之间间隔的1/3,并且小于或等于相邻测试焊盘11之间间隔的2/3。例如,相邻测试焊盘11之间的间隔为60微米,防护焊盘12的宽度为20微米。防护焊盘12宽度越大,可靠性越高,与相邻测试焊盘11之间的电磁干扰越厉害,设置防护焊盘12的宽度在相邻测试焊盘11之间的间隔的1/3~2/3之间,可以在提高防护焊盘12的可靠性和降低防护焊盘12与测试焊盘11之间的电磁干扰之间取得折中。多个防护焊盘12可沿切割线L方向线性排布,也可扇形排布等,同理,多个测试焊盘11可沿切割线L方向线性排布,也可扇形排布等。The protective pad 12 can be arranged on the same layer as the test pad 11 , or can be located on a different layer than the test pad 11 . In this embodiment, as shown in FIG. 6 , the test pad 11 and the protective pad 12 are arranged on the same layer. The advantage of this is that the test pad 11 and the protective pad 12 can be realized through one patterning process, and the preparation process is simpler. When the test pad 11 and the protective pad 12 are arranged on the same layer, as shown in Figure 5, in the direction parallel to the cutting line L, the test pad 11 and the protective pad 12 are arranged at intervals; or, the test pads 11 and the protective pad 12 are arranged facing each other, that is, the test pad 11 and the protective pad 12 are collinear, and the straight line where the test pad 11 and the protective pad 12 are located is perpendicular to the cutting line L. In comparison, the spaced arrangement of the protective pads 11 and the test pads 12 is beneficial to achieving a narrow frame. The distance between the test pad 11 and the protective pad 12 can be set reasonably according to actual needs. In an example, the number of the test pads 11 and the protective pads 12 is multiple. In the direction parallel to the cutting line L, the test pads 11 and the protective pads 12 are spaced apart, and the width of the protective pads 12 is greater than Or equal to 1/3 of the distance between adjacent test pads 11 , and less than or equal to 2/3 of the distance between adjacent test pads 11 . For example, the spacing between adjacent test pads 11 is 60 microns, and the width of the guard pad 12 is 20 microns. The larger the width of the protective pad 12, the higher the reliability, and the greater the electromagnetic interference between it and the adjacent test pads 11. The width of the protective pad 12 is set to 1/3 of the interval between adjacent test pads 11. ~2/3, a compromise can be achieved between improving the reliability of the protective pad 12 and reducing the electromagnetic interference between the protective pad 12 and the test pad 11 . The plurality of protective pads 12 may be arranged linearly along the direction of the cutting line L, or may be arranged in a fan shape. Similarly, the plurality of test pads 11 may be arranged linearly along the direction of the cutting line L, or may be arranged in a fan shape, etc.

在本实施例中,负载电路实施为接地电路。具体而言,如图5所示,阵列基板110上还设置有接地焊盘13,接地焊盘13和测试焊盘11同层设置,接地焊盘13和防护焊盘12连接,接地焊盘13及其连接的接地线共同作为负载电路。这种情况下,点灯测试过程中,测试用电路板20的焊盘21中产生的短路电流便可以通过防护焊盘12导入接地焊盘13,进而由接地线导走,从而避免对测试用电路板20,甚至信号发生器造成损伤。In this embodiment, the load circuit is implemented as a ground circuit. Specifically, as shown in Figure 5, the array substrate 110 is also provided with a ground pad 13. The ground pad 13 and the test pad 11 are arranged on the same layer. The ground pad 13 is connected to the protective pad 12. The ground pad 13 Together with its connected ground wire, it serves as a load circuit. In this case, during the lighting test, the short-circuit current generated in the pad 21 of the test circuit board 20 can be introduced into the ground pad 13 through the protective pad 12 and then conducted away by the ground wire, thereby avoiding damage to the test circuit. board 20 and even the signal generator causing damage.

图7为本申请第二实施例提供的显示面板母板的结构示意图。图8为图7所示显示面板母板沿B1B2线的截面结构示意图。结合图7和图8所示,在本实施例中,测试焊盘11和防护焊盘12分别位于不同的层,测试焊盘11和接地焊盘13位于同一层,防护焊盘12通过过孔与接地焊盘13连接。FIG. 7 is a schematic structural diagram of a display panel motherboard provided by the second embodiment of the present application. FIG. 8 is a schematic cross-sectional structural diagram of the display panel motherboard shown in FIG. 7 along line B1B2. As shown in Figure 7 and Figure 8, in this embodiment, the test pad 11 and the protective pad 12 are located on different layers, the test pad 11 and the ground pad 13 are located on the same layer, and the protective pad 12 passes through the via hole. Connect to ground pad 13.

具体而言,防护焊盘12在垂直于显示面的方向上的正投影和测试焊盘11在垂直于显示面的方向上的正投影间隔设置或两两正对设置。在本实施例中,测试焊盘11和防护焊盘12的数量均为多个,多个防护焊盘12在垂直于显示面的方向上的正投影和多个测试焊盘11在垂直于显示面的方向上的正投影交替排布,每个防护焊盘12的正投影的局部区域位于两个相邻的测试焊盘11的正投影之间。Specifically, the orthographic projection of the protective pad 12 in the direction perpendicular to the display surface and the orthographic projection of the test pad 11 in the direction perpendicular to the display surface are arranged at intervals or facing each other. In this embodiment, there are multiple test pads 11 and multiple protective pads 12 . The orthographic projection of the multiple protective pads 12 in the direction perpendicular to the display surface and the orthogonal projection of the multiple test pads 11 in the direction perpendicular to the display surface. The orthographic projections in the plane direction are alternately arranged, and the local area of the orthographic projection of each protective pad 12 is located between the orthographic projections of two adjacent test pads 11 .

根据本实施例提供的显示面板,通过将测试焊盘11和防护焊盘12设置在不同的层,相比于测试焊盘11和防护焊盘12设置在同一层的好处在于,可以减小边框区的尺寸,同时可以减小测试焊盘11和防护焊盘12之间的电磁干扰。According to the display panel provided in this embodiment, by arranging the test pad 11 and the protective pad 12 on different layers, the advantage of arranging the test pad 11 and the protective pad 12 on the same layer is that the frame can be reduced. The size of the area can reduce the electromagnetic interference between the test pad 11 and the protective pad 12 at the same time.

图9为本申请第三实施例提供的显示面板母板的结构示意图。如图9所示,该显示面板母板和上述任一实施例提供的显示面板母板的区别在于,显示面板母板还包括多个热敏电阻14,多个热敏电阻14与多个测试焊盘11一一对应。每个测试焊盘11设置在与之对应的测试焊盘11所连接的测试线上,即热敏电阻14位于测试焊盘11的远离防护焊盘12的一端。热敏电阻14的材质例如可以是Fe2O3、Al2O3等。这种情况下,结合图3所示,对显示面板母板沿切割线L进行切割后,得到的显示面板与测试用电路板20进行点灯测试时,若测试用电路板20的焊盘21发生短路,短路电流的一部分通过防护焊盘12和接地焊盘13导走,另一部分流经测试焊盘11和热敏电阻14,热敏电阻14的阻抗随着电流的增大而增大,从而将电流限定在有效电流范围内,防止大电流沿测试焊盘11回流进入到测试用电路板20和信号发生器,从而为测试用电路板20和信号发生器提供进一步的保护。应当理解,也可以单独设置热敏电阻14,而不设置负载电路,这样也可以为测试用电路板20和信号发生器提供保护,防止短路电流对它们造成损伤。FIG. 9 is a schematic structural diagram of a display panel motherboard provided by the third embodiment of the present application. As shown in Figure 9, the difference between this display panel motherboard and the display panel motherboard provided in any of the above embodiments is that the display panel motherboard also includes multiple thermistors 14, and the multiple thermistors 14 are connected with multiple test Pad 11 corresponds one to one. Each test pad 11 is disposed on a test line connected to the corresponding test pad 11 , that is, the thermistor 14 is located at an end of the test pad 11 away from the protective pad 12 . The material of the thermistor 14 may be, for example, Fe 2 O 3 , Al 2 O 3 or the like. In this case, as shown in FIG. 3 , after the display panel motherboard is cut along the cutting line L, when the display panel and the test circuit board 20 are subjected to a lighting test, if the pad 21 of the test circuit board 20 is Short circuit, part of the short-circuit current is conducted through the protective pad 12 and the ground pad 13, and the other part flows through the test pad 11 and the thermistor 14. The impedance of the thermistor 14 increases as the current increases, thus Limiting the current within the effective current range prevents large current from flowing back along the test pad 11 into the test circuit board 20 and the signal generator, thereby providing further protection for the test circuit board 20 and the signal generator. It should be understood that the thermistor 14 can also be provided separately without providing a load circuit, which can also provide protection for the test circuit board 20 and the signal generator to prevent short-circuit current from causing damage to them.

图10为本申请第四实施例提供的显示面板母板的结构示意图。如图10所示,该显示面板母板和图5、图6所示显示面板母板的区别在于,在本实施例中,负载电路实施为至少一个像素单元。具体而言,以负载电路实施为一个像素列为例,第一阵列基板111内还设置有多个像素电路15,第一发光器件区域121内设置有多个发光器件16。至少一个发光器件16连接一个像素电路15,构成一个像素单元130。第一阵列基板111内还设置有驱动信号线17,驱动信号线17连接一行像素单元130和防护焊盘12,或者连接一列像素单元130和防护焊盘12。该一行或一列像素单元例如可以是线性排布的多个绿色像素单元。FIG. 10 is a schematic structural diagram of a display panel motherboard provided by the fourth embodiment of the present application. As shown in FIG. 10 , the difference between the display panel motherboard and the display panel motherboard shown in FIGS. 5 and 6 is that in this embodiment, the load circuit is implemented as at least one pixel unit. Specifically, taking the load circuit as a pixel column as an example, a plurality of pixel circuits 15 are also provided in the first array substrate 111 , and a plurality of light-emitting devices 16 are provided in the first light-emitting device region 121 . At least one light-emitting device 16 is connected to a pixel circuit 15 to form a pixel unit 130. The first array substrate 111 is also provided with a driving signal line 17 . The driving signal line 17 connects a row of pixel units 130 and the protective pads 12 , or connects a column of pixel units 130 and the protective pads 12 . The row or column of pixel units may be, for example, a plurality of green pixel units arranged linearly.

在本实施例中,防护焊盘12和测试焊盘11同层设置,防护焊盘12和驱动信号线17位于不同的层,驱动信号线17和防护焊盘12通过过孔连接。In this embodiment, the protective pad 12 and the test pad 11 are arranged on the same layer, the protective pad 12 and the driving signal line 17 are located on different layers, and the driving signal line 17 and the protective pad 12 are connected through via holes.

根据本实施例提供的显示面板母板切割后得到的显示面板和测试用电路板20进行点灯测试时,若测试用电路板20的焊盘21发生短路,短路电流沿着防护焊盘12、驱动信号线17提供至一行或一列像素单元130。这种情况下,该行或该列像素单元130显示亮线,以此判定异常品,实现异常品的检出。When the display panel obtained after cutting the display panel motherboard provided in this embodiment and the test circuit board 20 are subjected to a lighting test, if the pad 21 of the test circuit board 20 is short-circuited, the short-circuit current will flow along the protective pad 12, drive The signal line 17 is provided to a row or column of pixel units 130. In this case, the pixel unit 130 of the row or column displays a bright line, thereby determining the abnormal product and realizing the detection of the abnormal product.

图11为本申请第五实施例提供的显示面板母板的结构示意图。如图11所示,该显示面板母板和图5、图6所示显示面板母板的区别在于,在本实施例中,防护焊盘12和测试焊盘11分别位于不同的层,防护焊盘12和驱动信号线17位于同层。FIG. 11 is a schematic structural diagram of a display panel motherboard provided by the fifth embodiment of the present application. As shown in Figure 11, the difference between this display panel motherboard and the display panel motherboard shown in Figures 5 and 6 is that in this embodiment, the protective pads 12 and the test pads 11 are located on different layers. The disk 12 and the drive signal line 17 are located on the same layer.

本申请还提供了一种显示面板。图12为本申请一实施例提供的显示面板的结构示意图。该显示面板可以是上述任一实施例提供的显示面板母板沿切割线L切割后,得到的一个显示面板。如图12所示,该显示面板包括测试焊盘11、防护焊盘12,以及负载电路。测试焊盘11包括相对设置的第一端和第二端,第一端连接测试线,第二端指向显示面板的一侧面,该侧面即为切割面S。防护焊盘12在垂直于显示面的方向上的正投影与切割面S在垂直于显示面的方向上的正投影相交。例如,边框区包括第一焊盘区N1和第二焊盘区N2,第一焊盘区N1位于显示区AA和第二焊盘区N2之间,侧面S在垂直于显示面的方向上的正投影形成第二焊盘区N2在垂直于显示面的方向上的正投影的部分边缘。测试焊盘11位于第一焊盘区N1,防护焊盘12位于第二焊盘区N2。防护焊盘12延伸至侧面S,并在侧面S暴露。负载电路实施为接地电路,接地电路包括接地焊盘13和接地线,防护焊盘12与接地焊盘13连接。测试焊盘11和防护焊盘12同层设置。这种情况下,在平行于切割线的方向上,防护焊盘12和测试焊盘11间隔设置;或者,防护焊盘12和测试焊盘11两两正对设置。This application also provides a display panel. FIG. 12 is a schematic structural diagram of a display panel provided by an embodiment of the present application. The display panel may be a display panel obtained by cutting the display panel motherboard provided in any of the above embodiments along the cutting line L. As shown in Figure 12, the display panel includes a test pad 11, a protective pad 12, and a load circuit. The test pad 11 includes a first end and a second end arranged oppositely. The first end is connected to the test line, and the second end points to one side of the display panel, and the side is the cutting surface S. The orthographic projection of the protective pad 12 in the direction perpendicular to the display surface intersects the orthographic projection of the cutting surface S in the direction perpendicular to the display surface. For example, the frame area includes a first pad area N1 and a second pad area N2. The first pad area N1 is located between the display area AA and the second pad area N2. The side S is in a direction perpendicular to the display surface. The orthographic projection forms a partial edge of the orthographic projection of the second pad area N2 in a direction perpendicular to the display surface. The test pad 11 is located in the first pad area N1, and the protective pad 12 is located in the second pad area N2. The protective pad 12 extends to the side S and is exposed on the side S. The load circuit is implemented as a ground circuit. The ground circuit includes a ground pad 13 and a ground wire. The protective pad 12 is connected to the ground pad 13 . The test pad 11 and the protective pad 12 are arranged on the same layer. In this case, in the direction parallel to the cutting line, the protective pads 12 and the test pads 11 are arranged at intervals; or, the protective pads 12 and the test pads 11 are arranged facing each other in pairs.

结合图3所示,当测试用电路板20上的焊盘21搭接在测试焊盘11上,测试用电路板20在显示面板的边缘发生弯折,从而导致测试用电路板20上的焊盘21与切割面S上的导电材料区Q接触,进而导致相邻焊盘21短路时,短路电流依次经过焊盘21、导电材料区Q、防护焊盘12、接地焊盘13,最后被接地线导走,从而避免测试用电路板20烧伤。As shown in FIG. 3 , when the solder pads 21 on the test circuit board 20 overlap the test pads 11 , the test circuit board 20 bends at the edge of the display panel, causing the solder joints on the test circuit board 20 to break. When the pad 21 comes into contact with the conductive material area Q on the cutting surface S, causing a short circuit in the adjacent pad 21, the short-circuit current passes through the pad 21, the conductive material area Q, the protective pad 12, the grounding pad 13, and is finally grounded. The wires are routed to prevent the test circuit board 20 from being burned.

图13为本申请二实施例提供的显示面板的结构示意图。该显示面板和图12所示显示面板的区别在于,在本实施例中,负载电路实施为至少一个像素单元130。具体而言,显示面板还包括多个像素单元130,多个像素单元130中的部分像素单元130与防护焊盘12连接,与防护焊盘12连接的部分像素单元130作为负载电路。作为负载电路的部分像素单元130例如可以是线性排布的多个绿色像素单元。FIG. 13 is a schematic structural diagram of a display panel provided by the second embodiment of the present application. The difference between this display panel and the display panel shown in FIG. 12 is that in this embodiment, the load circuit is implemented as at least one pixel unit 130. Specifically, the display panel also includes a plurality of pixel units 130, some of the pixel units 130 of the plurality of pixel units 130 are connected to the protective pad 12, and some of the pixel units 130 connected to the protective pad 12 serve as load circuits. The partial pixel unit 130 serving as the load circuit may be, for example, a plurality of green pixel units arranged linearly.

图14为本申请三实施例提供的显示面板的结构示意图。如图14所示,该显示面板和图12所示显示面板的区别在于,显示面板还包括热敏电阻14,热敏电阻14设置在测试焊盘11所连接的测试线上,即热敏电阻14位于测试焊盘11的远离防护焊盘12的一端。热敏电阻14的材质例如可以是Fe2O3、Al2O3等。Figure 14 is a schematic structural diagram of a display panel provided by three embodiments of the present application. As shown in Figure 14, the difference between this display panel and the display panel shown in Figure 12 is that the display panel also includes a thermistor 14. The thermistor 14 is set on the test line connected to the test pad 11, that is, the thermistor. 14 is located at one end of the test pad 11 away from the protective pad 12 . The material of the thermistor 14 may be, for example, Fe 2 O 3 , Al 2 O 3 or the like.

本申请还提供了一种显示装置,包括本申请任一实施例提供的显示面板。显示面板的具体结构参见上述显示面板实施例,这里不再赘述。This application also provides a display device, including the display panel provided in any embodiment of this application. For the specific structure of the display panel, please refer to the above-mentioned display panel embodiment and will not be described again here.

为了例示和描述的目的已经给出了以上描述。此外,此描述不意图将本申请的实施例限制到在此公开的形式。尽管以上已经讨论了多个示例方面和实施例,但是本领域技术人员将认识到其某些变型、修改、改变、添加和子组合。The foregoing description has been presented for the purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the form disclosed herein. Although various example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims (11)

1.一种显示面板母板,其特征在于,包括:1. A display panel motherboard, characterized in that it includes: 对位标识;counterpoint mark; 测试焊盘,位于所述对位标识形成的切割线的一侧;The test pad is located on one side of the cutting line formed by the alignment mark; 防护焊盘,位于所述切割线的所述测试焊盘所在侧,所述防护焊盘在垂直于显示面的方向上的正投影与所述切割线在垂直于所述显示面的方向上的正投影相交;以及A protective pad, located on the side of the cutting line where the test pad is located. The orthographic projection of the protective pad in a direction perpendicular to the display surface is the same as the orthographic projection of the cutting line in a direction perpendicular to the display surface. orthographic projection intersection; and 负载电路,与所述防护焊盘连接,用于消耗掉所述防护焊盘中流过的电流。A load circuit is connected to the protective pad and used to consume the current flowing in the protective pad. 2.根据权利要求1所述的显示面板母板,其特征在于,所述测试焊盘和所述防护焊盘同层设置。2. The display panel motherboard according to claim 1, wherein the test pad and the protective pad are arranged on the same layer. 3.根据权利要求2所述的显示面板母板,其特征在于,在平行于所述切割线的方向上,所述防护焊盘和所述测试焊盘间隔设置。3. The display panel motherboard according to claim 2, wherein the protective pads and the test pads are spaced apart in a direction parallel to the cutting line. 4.根据权利要求1-3中任一项所述的显示面板母板,其特征在于,还包括接地焊盘,所述接地焊盘与所述防护焊盘连接,以作为所述负载电路;或者,4. The display panel motherboard according to any one of claims 1 to 3, further comprising a ground pad connected to the protective pad to serve as the load circuit; or, 所述显示面板母板还包括像素单元,所述像素单元与所述防护焊盘连接,以作为所述负载电路。The display panel motherboard further includes a pixel unit connected to the protective pad to serve as the load circuit. 5.根据权利要求1-3中任一项所述的显示面板母板,其特征在于,还包括热敏电阻,所述热敏电阻设置在所述测试焊盘所连接的测试线上。5. The display panel motherboard according to any one of claims 1 to 3, further comprising a thermistor, the thermistor being disposed on a test line connected to the test pad. 6.根据权利要求1-3中任一项所述的显示面板母板,其特征在于,包括与切割线接触的边框区和位于所述边框区远离所述切割线一侧的显示区,所述测试焊盘和所述防护焊盘位于所述边框区。6. The display panel motherboard according to any one of claims 1 to 3, characterized in that it includes a frame area in contact with the cutting line and a display area located on the side of the frame area away from the cutting line, so The test pad and the protective pad are located in the frame area. 7.一种显示面板,其特征在于,包括:7. A display panel, characterized in that it includes: 测试焊盘,所述测试焊盘包括相对设置的第一端和第二端,所述第一端连接测试线,所述第二端指向所述显示面板的一侧面;A test pad, the test pad includes a first end and a second end arranged oppositely, the first end is connected to a test line, and the second end points to one side of the display panel; 防护焊盘,所述防护焊盘在垂直于显示面的方向上的正投影与所述侧面在垂直于所述显示面的方向上的正投影相交;以及A protective pad, the orthographic projection of the protective pad in a direction perpendicular to the display surface intersects the orthographic projection of the side surface in a direction perpendicular to the display surface; and 负载电路,与所述防护焊盘连接,用于消耗掉所述防护焊盘中流过的电流。A load circuit is connected to the protective pad and used to consume the current flowing in the protective pad. 8.根据权利要求7所述的显示面板,其特征在于,所述测试焊盘和所述防护焊盘同层设置。8. The display panel according to claim 7, wherein the test pad and the protective pad are arranged on the same layer. 9.根据权利要求8所述的显示面板,其特征在于,在平行于切割线的方向上,所述防护焊盘和所述测试焊盘间隔设置。9. The display panel according to claim 8, wherein the protective pads and the test pads are spaced apart in a direction parallel to the cutting line. 10.根据权利要求7-9中任一项所述的显示面板,其特征在于,还包括接地焊盘,所述接地焊盘与所述防护焊盘连接,以作为所述负载电路;或者,10. The display panel according to any one of claims 7-9, further comprising a ground pad connected to the protective pad to serve as the load circuit; or, 所述显示面板还包括像素单元,所述像素单元与所述防护焊盘连接,以作为所述负载电路。The display panel further includes a pixel unit connected to the protective pad to serve as the load circuit. 11.一种显示装置,其特征在于,包括权利要求10所述的显示面板。11. A display device, comprising the display panel according to claim 10.
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