CN115015817B - Device and method for detecting abnormal state and abnormal contact of probe on line - Google Patents
Device and method for detecting abnormal state and abnormal contact of probe on line Download PDFInfo
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- CN115015817B CN115015817B CN202210549414.4A CN202210549414A CN115015817B CN 115015817 B CN115015817 B CN 115015817B CN 202210549414 A CN202210549414 A CN 202210549414A CN 115015817 B CN115015817 B CN 115015817B
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- probe
- controller
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- comparator
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a device for detecting abnormal states and abnormal contact of probes on line, which comprises a detection head, wherein a bedplate is fixedly connected below the detection head, a probe is arranged below the bedplate, and the device also comprises a controller, a vibration detection sensor, an inclination sensor A, an inclination sensor B, a side vertical plate, an infrared detection assembly and a resistance transmitter. The invention relates to the technical field of electronic equipment, in particular to a device and a method for detecting abnormal states and abnormal contact of a probe on line.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a device and a method for detecting abnormal states and abnormal contact of probes on line.
Background
In the semiconductor field, probes are mostly used in the wafer testing stage, and in actual working, a corresponding detection system is not available, and on-line detection is not available, so that when abnormality of the probes or abnormal contact occurs, such as inclination of the probes, breakage of the probes, foreign matters carried on the surface of the probes, etc., the probes cannot be detected timely, and a large number of wafer failed in semiconductor detection or without detection can be directly generated.
Based on the occurrence of the problem, I develop a device for detecting the abnormal state and the contact abnormal state of the probe on line, can detect the probe on line, and is used for finding out the abnormality of the probe in time and ensuring the quality of products.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a device and a method for detecting the abnormal state and the abnormal contact of a probe on line, which solve the problem that the probe cannot detect the abnormal state of the probe on line.
In order to achieve the above purpose, the present invention is realized by the following technical scheme: the device for detecting the abnormal state and abnormal contact of the probe on line comprises a detection head, wherein a table plate is fixedly connected below the detection head, a probe is arranged below the table plate, a side panel and a rear panel are fixedly connected on the side surface and the rear of the lower part of the table plate respectively, and the device further comprises;
the controller is used for controlling the pushing and retracting work of the detection head;
the vibration detection sensor is fixedly connected below the bedplate and is in contact with the probe, and is used for detecting the vibration frequency of the probe and is electrically connected with the controller;
the inclination sensor A is fixedly connected to the side panel and used for detecting whether the probe is inclined or not and is electrically connected with the controller;
the inclination sensor B is fixedly connected to the rear panel and used for detecting whether the probe is inclined or not and is electrically connected with the controller;
the side vertical plate is arranged on one side of the detection head, is arranged in parallel with the detection head and is opposite to the side panel, an imaging device is arranged on the side vertical plate and is used for collecting the integral integrity of the probe, and the imaging device is electrically connected with the controller;
the infrared detection assembly comprises an infrared transmitter and an infrared receiver which are oppositely arranged, wherein the infrared transmitter is fixedly connected to the inner lower side of the side panel, the infrared receiver is fixedly connected to the inner lower side of the side vertical plate, and the infrared transmitter and the infrared receiver are electrically connected with the controller.
Preferably, the electric resistance sensor further comprises a resistance transmitter, wherein the two ends of the probe and the resistance transmitter are respectively connected with a current detector A and a current detector B through connecting wires, the current detector A and the current detector B are respectively connected with a comparator A and a comparator B through connecting wires, the comparator A and the comparator B are electrically connected with a controller, and the controller is electrically connected with a display.
Preferably, the infrared transmitter and the infrared receiver are positioned at the same horizontal plane with the bottom end of the probe.
A method of detecting probe status anomalies and contact anomalies on-line, the method comprising:
1) When the probe retracts to the original point after the wafer is inspected, the vibration detection sensor detects the amplitude of the probe, and when the amplitude is too large to cause abnormality, the machine stops to detect whether the probe is damaged;
2) The inclination sensor A and the inclination sensor B detect whether the probes incline at two sides, and if the inclination occurs, the machine stops to detect whether the probes are damaged;
3) The infrared transmitter transmits an infrared signal, and when the infrared receiver receives the signal, the machine stops detecting whether the probe is in shortage or inclined;
4) The imaging device shoots a film of the probe, and when the controller compares the film with the film, and the foreign matters or notch shadows are found on the surface of the probe, the machine stops to detect whether the probe is damaged;
5) The current detector A and the current detector B are electrified to collect the current of the probe and the resistance transmitter, the collected current signals are transmitted to the comparator A and the comparator B, whether the probe and the resistance transmitter are in a normal state or not is determined through comparison with a preset value, and when the current is abnormal or no current, the controller stops the operation and gives an alarm prompt through the display.
Advantageous effects
The invention provides a device and a method for detecting abnormal states and abnormal contact of probes on line. The beneficial effects are as follows: the device and the method for detecting the abnormal state and the abnormal contact of the probe on line can detect the probe on line, are used for finding out the abnormality of the probe in time, such as the vertical state of the probe, and ensure that the probe is damaged or not, and the detection work of the semiconductor is carried out under the normal condition of the probe, so that the quality of products can be ensured.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a bottom view of the platen of the present invention;
FIG. 3 is a schematic block diagram of the current sensing of the probe and resistance transducer of the present invention.
In the figure: 1. the detection head, 2, the platen, 3, the vibration detection sensor, 4, the probe, 5, the back panel, 6, the side panel, 7, the inclination sensor a,8, the infrared transmitter, 9, the side vertical plate, 10, the imaging device, 11, the infrared receiver, 12, the inclination sensor B,13, the display, 14, the controller, 15, the comparator a,16, the comparator B,17, the current detector a,18, the current detector B,19, the resistance transmitter.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
1-2, a device for detecting abnormal states and abnormal contact of probes on line comprises a detection head 1, wherein the detection head 1 is a telescopic mechanism for pushing a platen 2 to push down and pull back, the mechanism is a hydraulic cylinder or an electric cylinder, the platen 2 is fixedly connected below the detection head 1, a probe 4 is arranged below the platen 2, and a side panel 6 and a rear panel 5 are fixedly connected on the side surface and the rear of the lower side of the platen 2 respectively;
the utility model also comprises;
a controller 14 for controlling the pushing and retracting operations of the detection head 1;
the vibration detection sensor 3 is fixedly connected below the platen 2 and is in contact with the probe 4, and is used for detecting the vibration frequency of the probe 4 and is electrically connected with the controller 14. The vibration detection sensor 3 detects the amplitude of the probe 4, and if the amplitude is too large to cause an abnormality, the detection probe 4 is stopped to detect whether it is broken.
The inclination sensor A7 is fixedly connected to the side panel 6 and is used for detecting whether the probe 4 is inclined or not and is electrically connected with the controller 14;
the inclination sensor B12 is fixedly connected to the rear panel 5 and is used for detecting whether the probe 4 is inclined or not and is electrically connected with the controller 14;
the tilt sensor A7 and the tilt sensor B12 detect whether the probe 4 is tilted on both sides, and if a tilt situation occurs, the detection probe 4 is stopped to be broken.
A side vertical plate 9, which is arranged on one side of the detection head 1, is arranged in parallel with the detection head 1 and is opposite to the side panel 6, and an imaging device 10 is arranged on the side vertical plate 9 and is used for collecting the integral integrity of the probe 4, and the imaging device 10 is electrically connected with a controller 14;
the imaging device 10 photographs a film of the probe 4, and detects whether the probe 4 is broken or not when foreign matter or a notch shadow is found on the surface of the probe 4 after comparison by the controller 14.
The infrared detection assembly comprises an infrared transmitter 8 and an infrared receiver 11 which are oppositely arranged, wherein the infrared transmitter 8 is fixedly connected to the lower inner side of the side panel 6, the infrared receiver 11 is fixedly connected to the lower inner side of the side vertical plate 9, the infrared transmitter 8 and the infrared receiver 11 are electrically connected with a controller 14, and the infrared transmitter 8 and the infrared receiver 11 are positioned on the same horizontal plane with the bottom end of the probe 4;
the infrared transmitter 8 transmits an infrared signal, and when the infrared receiver 11 receives the signal, the stoppage-detecting probe 4 is stopped for detecting whether it is in shortage or inclined, and if so, the stoppage-detecting probe is stopped.
Embodiment two:
as can be seen from fig. 3, the device further comprises a resistance transmitter 19, wherein both ends of the probe 4 and the resistance transmitter 19 are respectively connected with a current detector a17 and a current detector B18 through connecting wires, the current detector a17 and the current detector B18 are respectively connected with a comparator a15 and a comparator B16 through connecting wires, the comparator a15 and the comparator B16 are respectively and electrically connected with a controller 14, and the controller 14 is electrically connected with a display 13;
in the specific implementation process, it is worth particularly pointing out that the current of the probe 4 and the resistance transducer 19 is collected by the current detector a17 and the current detector B18 in advance as a set value, and in the actual working process, detection can be performed after the single probe 4 works or after the N times of probe 4 works, and in the detection process, the current of the probe 4 and the resistance transducer 19 is collected by the current detector a17 and the current detector B18, the comparison with the set value is performed by the comparator a15 and the comparator B16, and when the current is abnormal or no current, the controller 14 performs shutdown operation and gives an alarm prompt through the display 13.
Embodiment III:
1-3, a method for detecting abnormal states and abnormal contacts of a probe on line, the method comprising:
1) When the probe 4 retracts to the original point after the wafer is inspected, the vibration detection sensor 3 detects the amplitude of the probe 4, and when the amplitude is too large to cause abnormality, the detection probe 4 is stopped to detect whether the probe is damaged;
2) The inclination sensor A7 and the inclination sensor B12 detect whether the probe 4 is inclined at both sides, and if an inclination occurs, the detection probe 4 is stopped to be broken;
3) The infrared transmitter 8 transmits an infrared signal, and when the infrared receiver 11 receives the signal, the stop detection probe 4 is in shortage or inclined;
4) The imaging device 10 shoots a film of the probe 4, and when the controller 14 compares the film and finds that the surface of the probe 4 has foreign matters or notch shadows, the controller stops to detect whether the probe 4 is damaged;
5) The current detector A17 and the current detector B18 are electrified to collect the current of the probe 4 and the resistance transducer 19, the collected current signals are transmitted to the comparator A15 and the comparator B16, whether the probe 4 and the resistance transducer 19 are in a normal state or not is determined through comparison with a preset value, and when the current is abnormal or no current, the controller 14 performs shutdown operation and gives an alarm prompt through the display 13.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a device of on-line measuring probe state is unusual and contact is unusual, includes detection head (1), the below rigid coupling of detection head (1) has platen (2), the below of platen (2) is provided with probe (4), its characterized in that: the side panel (6) and the rear panel (5) are fixedly connected to the lower side surface and the rear of the bedplate (2) respectively, and the multifunctional table further comprises;
the controller (14) is used for controlling pushing and retracting work of the detection head (1);
the vibration detection sensor (3) is fixedly connected below the bedplate (2) and is in contact with the probe (4) for detecting the vibration frequency of the probe (4) and is electrically connected with the controller (14);
the inclination sensor A (7) is fixedly connected to the side panel (6) and is used for detecting whether the probe (4) is inclined or not and is electrically connected with the controller (14);
the inclination sensor B (12) is fixedly connected to the rear panel (5) and is used for detecting whether the probe (4) is inclined or not and is electrically connected with the controller (14);
the side vertical plate (9) is arranged on one side of the detection head (1), is arranged in parallel with the detection head (1) and is opposite to the side panel (6), an imaging device (10) is arranged on the side vertical plate (9) and is used for collecting the integral integrity of the probe (4), and the imaging device (10) is electrically connected with the controller (14);
the infrared detection assembly comprises an infrared transmitter (8) and an infrared receiver (11) which are oppositely arranged, wherein the infrared transmitter (8) is fixedly connected to the inner lower side of the side panel (6), the infrared receiver (11) is fixedly connected to the inner lower side of the side vertical plate (9), and the infrared transmitter (8) and the infrared receiver (11) are electrically connected with the controller (14).
2. The apparatus for on-line detection of probe status anomalies and contact anomalies of claim 1, wherein: the electric resistance detector is characterized by further comprising a resistance transmitter (19), wherein the two ends of the probe (4) and the resistance transmitter (19) are respectively connected with a current detector A (17) and a current detector B (18) through connecting wires, the current detector A (17) and the current detector B (18) are respectively connected with a comparator A (15) and a comparator B (16) through connecting wires, the comparator A (15) and the comparator B (16) are electrically connected with a controller (14), and the controller (14) is electrically connected with a display (13).
3. The apparatus for on-line detection of probe status anomalies and contact anomalies of claim 1, wherein: the infrared transmitter (8) and the infrared receiver (11) are positioned on the same horizontal plane with the bottom end of the probe (4).
4. A method for detecting abnormal states and abnormal contacts of a probe on line, which is characterized in that: the method comprises the following steps:
1) When the probe (4) retracts to the original point after the wafer is inspected, the vibration detection sensor (3) detects the amplitude of the probe (4), and when the amplitude is too large to cause abnormality, the machine stops to detect whether the probe (4) is damaged;
2) The inclination sensor A (7) and the inclination sensor B (12) detect whether the probe (4) is inclined at two sides, and if the inclination occurs, the machine stops to detect whether the probe (4) is damaged;
3) An infrared transmitter (8) transmits an infrared signal, and when an infrared receiver (11) receives the signal, the machine stops detecting whether the probe (4) is in shortage or inclined;
4) The imaging device (10) shoots a film of the probe (4), and when the controller (14) compares the film to find that foreign matters or notch shadows exist on the surface of the probe (4), the machine stops to detect whether the probe (4) is damaged;
5) The current detector A (17) and the current detector B (18) are electrified to collect the current of the probe (4) and the resistor transmitter (19), collected current signals are transmitted to the comparator A (15) and the comparator B (16), whether the probe (4) and the resistor transmitter (19) are in a normal state or not is determined through comparison with a preset value, and when the current is abnormal or no current, the controller (14) performs shutdown operation and performs alarm prompt through the display (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549414.4A CN115015817B (en) | 2022-05-20 | 2022-05-20 | Device and method for detecting abnormal state and abnormal contact of probe on line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549414.4A CN115015817B (en) | 2022-05-20 | 2022-05-20 | Device and method for detecting abnormal state and abnormal contact of probe on line |
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| Publication Number | Publication Date |
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| CN115015817A CN115015817A (en) | 2022-09-06 |
| CN115015817B true CN115015817B (en) | 2023-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210549414.4A Active CN115015817B (en) | 2022-05-20 | 2022-05-20 | Device and method for detecting abnormal state and abnormal contact of probe on line |
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| CN (1) | CN115015817B (en) |
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| JP2007071765A (en) * | 2005-09-08 | 2007-03-22 | Tokyo Seimitsu Co Ltd | Probe control apparatus and probe control method for measuring probe position |
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| CN208921847U (en) * | 2018-08-29 | 2019-05-31 | 武汉电信器件有限公司 | A kind of laser driving probe unit |
| CN111600383A (en) * | 2020-05-12 | 2020-08-28 | 合肥中科类脑智能技术有限公司 | Intelligent integrated inspection device for power transmission line |
| CN112325923A (en) * | 2020-07-29 | 2021-02-05 | 国网湖北省电力有限公司襄阳供电公司 | Distribution network overhead line defect real-time supervision device |
| CN113671339A (en) * | 2021-09-22 | 2021-11-19 | 广州粤芯半导体技术有限公司 | Apparatus and method for verifying probe abnormality and contact abnormality and wafer testing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4190828B2 (en) * | 2002-08-21 | 2008-12-03 | Ｎｅｃエレクトロニクス株式会社 | Probe inspection apparatus and method |
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2022
- 2022-05-20 CN CN202210549414.4A patent/CN115015817B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007071765A (en) * | 2005-09-08 | 2007-03-22 | Tokyo Seimitsu Co Ltd | Probe control apparatus and probe control method for measuring probe position |
| JP2009162723A (en) * | 2008-01-10 | 2009-07-23 | Fujitsu Microelectronics Ltd | Testing device and testing method |
| CN201331816Y (en) * | 2009-01-06 | 2009-10-21 | 西安同步电气有限责任公司 | Anti-theft device for video monitoring transmission line |
| CN102646307A (en) * | 2012-04-28 | 2012-08-22 | 成都电业局 | Monitoring device capable of preventing external force damage of power transmission line pole tower |
| CN204946279U (en) * | 2015-09-16 | 2016-01-06 | 国家电网公司 | Based on Fusion electric power line pole tower abnormity early warning device |
| CN107436373A (en) * | 2016-05-26 | 2017-12-05 | 中芯国际集成电路制造(上海)有限公司 | A kind of clear needle system of card grinding and method for being used to test probe oxidation |
| CN208921847U (en) * | 2018-08-29 | 2019-05-31 | 武汉电信器件有限公司 | A kind of laser driving probe unit |
| CN111600383A (en) * | 2020-05-12 | 2020-08-28 | 合肥中科类脑智能技术有限公司 | Intelligent integrated inspection device for power transmission line |
| CN112325923A (en) * | 2020-07-29 | 2021-02-05 | 国网湖北省电力有限公司襄阳供电公司 | Distribution network overhead line defect real-time supervision device |
| CN113671339A (en) * | 2021-09-22 | 2021-11-19 | 广州粤芯半导体技术有限公司 | Apparatus and method for verifying probe abnormality and contact abnormality and wafer testing method |
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|---|---|
| CN115015817A (en) | 2022-09-06 |
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