CN115011303B - Double-component high-temperature-resistant high-shear-strength organic silica gel adhesive and preparation method thereof - Google Patents
Double-component high-temperature-resistant high-shear-strength organic silica gel adhesive and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention provides a bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive and a preparation method thereof, wherein the adhesive comprises the following components in percentage by mass: the component A and the component B of (3-6); the component A comprises 30 to 75 weight percent of alpha, omega-dihydroxy polydimethylsiloxane, 0.3 to 1.5 weight percent of silane coupling agent and 25 to 70 weight percent of inorganic filler; the component B comprises 98 to 99.5 weight percent of polysilazane cross-linking agent and 0.5 to 2 weight percent of catalyst. The high-temperature-resistant high-shear-strength organic silica gel adhesive prepared by the crosslinking agent and the inorganic filler in combination with other additives has good high-temperature resistance, and the shear strength of the organic silica gel adhesive can be more than 1.5MPa at 300 ℃; the prepared double-component high-temperature-resistant high-shear-strength organic silica gel adhesive is particularly suitable for the working condition requirements of high-temperature-resistant high-shear-strength of aerospace, nuclear technology and automobiles.
Description
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to a bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive and a preparation method thereof.
Background
The organic silica gel adhesive has excellent cold and heat resistance and durability, is widely applied to various industrial fields, such as aerospace, nuclear technology, automobiles, construction, electronic appliances, mechanical industry and the like, and is gradually developed along with the development and development of the organic silica gel adhesive, and the organic silica gel adhesive has the characteristics of no toxicity, environmental protection, wide temperature resistant range, convenient operation and the like, can realize the diversification of process uses, and is increasingly applied to the fields.
However, in the continuous development process of the whole market, the requirements of customers on products are also higher and higher, and the requirements on the performance of the products are higher and higher. The high-temperature-resistant high-shear-strength organic silica gel adhesive in the current market generally has the problems that the temperature resistance is insufficient and the shear strength is too low to meet the requirements.
Disclosure of Invention
In view of the above, the invention aims to provide a bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive and a preparation method thereof, and the organic silica gel adhesive has the characteristics of simple processing technology, excellent temperature resistance and high shear strength, and solves the problems that the high-temperature-resistant high-shear-strength organic silica gel adhesive in the current market is insufficient in temperature resistance and too low in shear strength and cannot meet the requirements.
The invention provides a double-component high-temperature-resistant high-shear-strength organic silica gel adhesive, which comprises the following components in percentage by mass: (3-6)) a component and a B component;
the component A comprises 30 to 75 weight percent of alpha, omega-dihydroxy polydimethylsiloxane, 0.3 to 1.5 weight percent of silane coupling agent and 25 to 70 weight percent of inorganic filler;
the component B comprises 98 to 99.5 weight percent of polysilazane cross-linking agent and 0.5 to 2 weight percent of catalyst.
In the invention, the combined action of the alpha, omega-dihydroxy polydimethylsiloxane and the polysilazane cross-linking agent enables the adhesive to be resistant to high temperature and have higher shear strength.
In the present invention, the viscosity of the α, ω -dihydroxy polydimethylsiloxane is 1000 to 10000cps. In specific embodiments, the alpha, omega-dihydroxy polydimethylsiloxane has a viscosity of one or more of 1000cps, 3000cps, 5000cps, and 10000cps.
In the present invention, the silane coupling agent is selected from at least one of 3-aminopropyl trimethoxysilane, γ -aminopropyl triethoxysilane, γ -glycidoxypropyl trimethoxysilane, γ -methacryloxypropyl trimethoxysilane, bis [3- (trimethoxy silicon) -propyl ] amine, anilinomethyl trimethoxysilane, anilinomethyl triethoxysilane, and divinyl triaminopropyl trimethoxysilane.
In the invention, the inorganic filler is selected from one or more of silicon micropowder, fluorophlogopite powder, ferric oxide, gas-phase white carbon black, calcium carbonate, silicon carbide and aluminum oxide.
In the invention, the granularity of the silicon micro powder is 3000-8000 meshes; in specific embodiments, the particle size of the silica micropowder is one or more of 3000 mesh, 5000 mesh, 6000 mesh and 8000 mesh;
the granularity of the fluorophlogopite powder is 1250-6000 meshes; in specific embodiments, the fluorophlogopite powder has a particle size of one or more of 1250 mesh, 3000 mesh and 6000 mesh.
The ferric oxide is selected from one or more of bayer 4130, bayer 4110 and bayer 180M;
the specific surface area of the gas phase white carbon black is 150-380 m 2 /g; in a specific embodiment, the specific surface area of the fumed silica is 150m 2 /g、220m 2 /g and 380m 2 One or more of/g.
The granularity of the calcium carbonate is 3000-8000 meshes; in specific embodiments, the calcium carbonate has a particle size of one or more of 3000 mesh, 5000 mesh, 6000 mesh, and 8000 mesh.
The granularity of the silicon carbide is 500-3000 meshes; in specific embodiments, the silicon carbide has a particle size of one or more of 500 mesh, 1250 mesh, and 3000 mesh.
The granularity of the alumina is 3000-8000 meshes; in specific embodiments, the alumina has a particle size of one or more of 3000 mesh, 5000 mesh, 6000 mesh, and 8000 mesh.
In the present invention, the polysilazane cross-linking agent is selected from one or more of organosilicon polysilazane PR21, polysilazane PR28 and polysilazane 9108.
In the present invention, the catalyst is selected from one or more of dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, monobutyl tin hydroxide and stannous octoate.
In the specific embodiment of the invention, the bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive comprises the following components in mass ratio of 100:5; or 100:4; or 100:6; or 100:3 of a component A and a component B;
the A component comprises 35wt% of alpha, omega-dihydroxypolydimethylsiloxane (3000 cps), 3wt% of iron oxide red (Bayer 4130), 61wt% of silicon micropowder with the granularity of 6000 meshes and 1wt% of 3-aminopropyl trimethoxysilane; the B component comprises 99wt% polysilazane (PR 21) and 1wt% dibutyltin dilaurate.
Or the A component comprises 10wt% of 3-aminopropyl trimethoxysilane (3000 cps), 30wt% of alpha, omega-dihydroxy polydimethylsiloxane (5000 cps), 3wt% of iron oxide red (Bayer 4130), 40wt% of silicon micropowder with the granularity of 6000 meshes, 16wt% of fluorophlogopite powder with the granularity of 3000 meshes and 1wt% of gamma-aminopropyl triethoxysilane; the B component comprises 99wt% of polysilazane (PR 21) and 1wt% of dibutyltin diacetate.
Or the A component comprises 40wt% of alpha, omega-dihydroxypolydimethylsiloxane (5000 cps), 3.5wt% of iron oxide red (Bayer 4110), 51.0wt% of 6000 mesh silica micropowder with the granularity of 6000 meshes and 5.0wt% of specific surface area of 150m 2 Gas phase white carbon black per gram, and 0.5wt% of gamma-glycidoxypropyl trimethoxysilane; the B component comprises 98.5wt% polysilazane (PR 28) and 1.5wt% dioctyltin dilaurate.
Or the A component comprises 40wt% of alpha, omega-dihydroxypolydimethylsiloxane (5000 cps), 3.0wt% of iron oxide red (Bayer 4110), 20.0wt% of silicon micropowder with a particle size of 8000 meshes, 36.0wt% of calcium carbonate with a particle size of 3000 meshes and 1wt% of gamma-aminopropyl triethoxysilane; the B component comprises 98.5wt% polysilazane (PR 21) and 1.5wt% dioctyltin dilaurate.
Or the A component comprises 32wt% of alpha, omega-dihydroxy polydimethylsiloxane (10000 cps), 3.0wt% of iron oxide red (Bayer 4110), 30.0wt% of silicon micropowder with a particle size of 8000 meshes, 34.0wt% of silicon carbide with a particle size of 3000 meshes and 1wt% of gamma-aminopropyl triethoxysilane; the B component comprises 98.5wt% polysilazane (PR 21) and 1.5wt% dioctyltin dilaurate.
Or the A component comprises 32wt% of alpha, omega-dihydroxy polydimethylsiloxane (10000 cps), 3.0wt% of iron oxide red (Bayer 4110), 30.0wt% of silicon micropowder with a particle size of 8000 meshes, 34.0wt% of aluminum oxide with a particle size of 3000 meshes and 1wt% of gamma-aminopropyl triethoxysilane; the B component comprises 99.0wt% polysilazane (PR 21) and 1.0wt% dioctyltin dilaurate.
The invention provides a preparation method of the bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive, which comprises the following steps:
mixing 30-75wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5wt% of silane coupling agent and 25-70wt% of inorganic filler, vacuumizing, and stirring at a stirring speed of 800-1000 r/min for 2-3 h at normal temperature to obtain a component A;
mixing 98-99.5 wt% of polysilazane cross-linking agent and 0.5-2 wt% of catalyst, vacuumizing, and stirring at 500-1000 rpm for 0.5-1 h at normal temperature to obtain a component B;
and (3) mixing the component A and the component B according to a mass ratio of 100: (6-3) mixing to obtain the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive.
The invention provides a double-component high-temperature-resistant high-shear-strength organic silica gel adhesive, which comprises the following components in percentage by mass: (3-6)) a component and a B component; the component A comprises 30 to 75 weight percent of alpha, omega-dihydroxy polydimethylsiloxane, 0.3 to 1.5 weight percent of silane coupling agent and 25 to 70 weight percent of inorganic filler; the component B comprises 98 to 99.5 weight percent of polysilazane cross-linking agent and 0.5 to 2 weight percent of catalyst. The high-temperature-resistant high-shear-strength organic silica gel adhesive prepared by the crosslinking agent and the inorganic filler in combination with other additives has good high-temperature resistance, and the shear strength of the organic silica gel adhesive can be more than 1.5MPa at 300 ℃; the prepared double-component high-temperature-resistant high-shear-strength organic silica gel adhesive is particularly suitable for the working condition requirements of high-temperature-resistant high-shear-strength of aerospace, nuclear technology and automobiles.
Detailed Description
In order to further illustrate the present invention, the following examples are provided to describe in detail a two-component high temperature and high shear strength silicone adhesive and a method for preparing the same, but they should not be construed as limiting the scope of the present invention.
Example 1
The raw material compositions of the A component and the B component of the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive are shown in the following table 1:
TABLE 1 raw material composition of A and B Components in example 1
And (3) preparation of the component A: adding the raw materials of the component A into a planetary stirring kettle, vacuumizing and stirring at a stirring speed of 800r/min for 2 hours at a normal temperature state, and sealing and preserving after the component A is obtained;
and (3) preparation of a component B: adding the raw materials of the component B into a stirring kettle, vacuumizing at the normal temperature state, stirring at the stirring speed of 600r/min for 0.5h, and sealing and preserving after the component B is obtained;
sizing is carried out by: the component A and the component B are mixed according to the mass ratio of 100:5 proportion.
Example 2
The raw material compositions of the A component and the B component of the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive are shown in the following table 2:
TABLE 2 raw material composition of A and B Components in example 2
And (3) preparation of the component A: adding the raw materials of the component A into a planetary stirring kettle, vacuumizing and stirring at a stirring speed of 1000r/min for 1.5 hours at normal temperature, and sealing and preserving after the component A is obtained;
and (3) preparation of a component B: adding the raw materials of the component B into a stirring kettle, vacuumizing and stirring at a stirring speed of 700r/min for 0.5h at a normal temperature state, and sealing and preserving after the component B is obtained;
sizing is carried out by: the component A and the component B are mixed according to the mass ratio of 100:4 ratio.
Example 3
The raw material compositions of the A component and the B component of the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive are shown in the following table 3:
TABLE 3 raw material composition of A and B Components in example 3
And (3) preparation of the component A: adding the raw materials of the component A into a planetary stirring kettle, vacuumizing and stirring at a stirring speed of 1000r/min for 2 hours at a normal temperature state, and sealing and preserving after the component A is obtained;
and (3) preparation of a component B: adding the raw materials of the component B into a stirring kettle, vacuumizing and stirring at a stirring speed of 700r/min for 0.5h at a normal temperature state, and sealing and preserving after the component B is obtained;
sizing is carried out by: the component A and the component B are mixed according to the mass ratio of 100:5 proportion.
Example 4
The raw material compositions of the A component and the B component of the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive are shown in the following table 4:
TABLE 4 raw material composition of A and B Components in example 4
And (3) preparation of the component A: adding the raw materials of the component A into a planetary stirring kettle, vacuumizing and stirring at a stirring speed of 1000r/min for 2 hours at a normal temperature state, and sealing and preserving after the component A is obtained;
and (3) preparation of a component B: adding the raw materials of the component B into a stirring kettle, vacuumizing and stirring at a stirring speed of 700r/min for 0.5h at a normal temperature state, and sealing and preserving after the component B is obtained;
sizing is carried out by: the component A and the component B are mixed according to the mass ratio of 100:6 proportions.
Example 5
The raw material compositions of the A component and the B component of the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive are shown in the following table 5:
TABLE 5 raw material composition of A and B Components in example 5
And (3) preparation of the component A: adding the raw materials of the component A into a planetary stirring kettle, vacuumizing and stirring at a stirring speed of 1000r/min for 2 hours at a normal temperature state, and sealing and preserving after the component A is obtained;
and (3) preparation of a component B: adding the raw materials of the component B into a stirring kettle, vacuumizing at the normal temperature state, stirring at the stirring speed of 600r/min for 0.5h, and sealing and preserving after the component B is obtained;
sizing is carried out by: the component A and the component B are mixed according to the mass ratio of 100:3 proportion.
Example 6
The raw material compositions of the A component and the B component of the double-component high-temperature-resistant high-shear-strength organic silica gel adhesive are shown in the following table 6:
TABLE 6 raw material composition of A and B Components in example 6
And (3) preparation of the component A: adding the raw materials of the component A into a planetary stirring kettle, vacuumizing and stirring at a stirring speed of 1000r/min for 2 hours at a normal temperature state, and sealing and preserving after the component A is obtained;
and (3) preparation of a component B: adding the raw materials of the component B into a stirring kettle, vacuumizing at the normal temperature state, stirring at the stirring speed of 600r/min for 0.5h, and sealing and preserving after the component B is obtained;
sizing is carried out by: the component A and the component B are mixed according to the mass ratio of 100:5 proportion.
Comparative example 1
Commercial two-component high temperature and high shear strength silicone adhesive: the A component comprises alpha, omega-dihydroxy polydimethylsiloxane and filler: iron oxide red, gas phase white carbon black, silica micropowder; the component B comprises a curing agent: mefloxime, glyoxime, catalyst: dibutyl tin dilaurate; the mass ratio of the component A to the component B is 100 when the sizing agent is used: 4
Comparative example 2
The commercial bi-component high shear adhesive (A component comprises epoxy resin E-51 and E-44, filler comprises calcium carbonate, diluent comprises polypropylene glycol diglycidyl ether, B component comprises a curing agent R2026, a coupling agent comprises KH560, a curing accelerator comprises DMP-30, and the mass ratio of the A component to the B component is 100:5 when the adhesive is used for sizing.
Performance test:
the two-component high temperature and high shear resistant silicone adhesives of examples 1 to 6 and comparative examples were tested at normal temperature and high temperature (300 ℃) and the test results are shown in Table 7 below:
table 7 test results of the adhesives of examples and comparative examples
As can be seen from the above examples, the present invention provides a two-component high temperature and high shear strength silicone adhesive, comprising the following components in mass ratio of 100: (3-6)) a component and a B component; the component A comprises 30 to 75 weight percent of alpha, omega-dihydroxy polydimethylsiloxane, 0.3 to 1.5 weight percent of silane coupling agent and 25 to 70 weight percent of inorganic filler; the component B comprises 98 to 99.5 weight percent of polysilazane cross-linking agent and 0.5 to 2 weight percent of catalyst. The high-temperature-resistant high-shear-strength organic silica gel adhesive prepared by the crosslinking agent and the inorganic filler in combination with other additives has good high-temperature resistance, and the shear strength of the organic silica gel adhesive can be more than 1.5MPa at 300 ℃; the prepared double-component high-temperature-resistant high-shear-strength organic silica gel adhesive is particularly suitable for the working condition requirements of high-temperature-resistant high-shear-strength of aerospace, nuclear technology and automobiles.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (5)
1. A preparation method of a bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive comprises the following steps:
mixing 30-75wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5wt% of silane coupling agent and 25-70wt% of inorganic filler, vacuumizing, and stirring at a stirring speed of 800-1000 r/min for 2-3 h at normal temperature to obtain a component A;
mixing 98-99.5 wt% of polysilazane cross-linking agent and 0.5-2 wt% of catalyst, vacuumizing, and stirring at 500-1000 rpm for 0.5-1 h at normal temperature to obtain a component B;
and (3) mixing the component A and the component B according to a mass ratio of 100: (6-3) mixing to obtain a bi-component high-temperature-resistant high-shear-strength organic silica gel adhesive;
the polysilazane cross-linking agent is selected from one or more of organosilicon polysilazane PR21, polysilazane PR28 and polysilazane 9108;
the silane coupling agent is at least one selected from 3-aminopropyl trimethoxysilane, gamma-aminopropyl triethoxysilane, gamma-glycidoxypropyl trimethoxysilane, gamma-methacryloxypropyl trimethoxysilane, bis [3- (trimethoxy silicon) -propyl ] amine, phenylaminomethyl trimethoxysilane, phenylaminomethyl triethoxysilane and divinyl triaminopropyl trimethoxysilane.
2. The method of claim 1, wherein the α, ω -dihydroxy polydimethylsiloxane has a viscosity of 1000 to 10000cps.
3. The method of claim 1, wherein the inorganic filler is selected from one or more of the group consisting of fine silica powder, fluorophlogopite powder, ferric oxide, fumed silica, calcium carbonate, silicon carbide, and aluminum oxide.
4. The method according to claim 3, wherein the particle size of the fine silica powder is 3000 to 8000 mesh;
the granularity of the fluorophlogopite powder is 1250-6000 meshes;
the ferric oxide is selected from one or more of bayer 4130, bayer 4110 and bayer 180M;
the specific surface area of the gas phase white carbon black is 150-380 m 2 /g；
The granularity of the calcium carbonate is 3000-8000 meshes;
the granularity of the silicon carbide is 500-3000 meshes;
the granularity of the alumina is 3000-8000 meshes.
5. The preparation method according to claim 1, wherein the catalyst is one or more selected from the group consisting of dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, monobutyl tin hydroxide and stannous octoate.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107163908A (en) * | 2017-07-18 | 2017-09-15 | 杭州之江有机硅化工有限公司 | One kind is used for automobile lamp and assembles sealed two-component silicone rubber sealant and preparation method thereof |
| CN109593464A (en) * | 2018-11-09 | 2019-04-09 | 中国科学院化学研究所 | A kind of organic silicon rubber coating of room curing and high temperature resistant, preparation method and application |
| CN111057517A (en) * | 2019-12-31 | 2020-04-24 | 广州机械科学研究院有限公司 | Bi-component fast curing type organic silicon structural adhesive and preparation method thereof |
| CN114045151A (en) * | 2021-11-26 | 2022-02-15 | 广州市白云化工实业有限公司 | Flame-retardant silicone sealant and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005002142A (en) * | 2003-06-09 | 2005-01-06 | Shin Etsu Chem Co Ltd | Adhesive composition and its manufacturing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107163908A (en) * | 2017-07-18 | 2017-09-15 | 杭州之江有机硅化工有限公司 | One kind is used for automobile lamp and assembles sealed two-component silicone rubber sealant and preparation method thereof |
| CN109593464A (en) * | 2018-11-09 | 2019-04-09 | 中国科学院化学研究所 | A kind of organic silicon rubber coating of room curing and high temperature resistant, preparation method and application |
| CN111057517A (en) * | 2019-12-31 | 2020-04-24 | 广州机械科学研究院有限公司 | Bi-component fast curing type organic silicon structural adhesive and preparation method thereof |
| CN114045151A (en) * | 2021-11-26 | 2022-02-15 | 广州市白云化工实业有限公司 | Flame-retardant silicone sealant and preparation method thereof |
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