CN115011303A - Bi-component high-temperature-resistant high-shear-strength organic silicon adhesive and preparation method thereof - Google Patents

Bi-component high-temperature-resistant high-shear-strength organic silicon adhesive and preparation method thereof Download PDF

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CN115011303A
CN115011303A CN202210877362.3A CN202210877362A CN115011303A CN 115011303 A CN115011303 A CN 115011303A CN 202210877362 A CN202210877362 A CN 202210877362A CN 115011303 A CN115011303 A CN 115011303A
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temperature
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polysilazane
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CN115011303B (en
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曹叶霞
李慧卿
陈雪涛
魏婷婷
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Xinzhou Teachers University
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2272—Ferric oxide (Fe2O3)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Inorganic Chemistry (AREA)
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  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention provides a bi-component high-temperature-resistant high-shear-strength organic silicon adhesive and a preparation method thereof, wherein the adhesive comprises the following components in percentage by mass: (3-6) component A and component B; the component A comprises 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler; the component B comprises 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst. The high-temperature-resistant high-shear-strength organic silicon adhesive prepared by the cross-linking agent, the inorganic filler and other additives has good high-temperature resistance, and the shear strength can be more than 1.5MPa at 300 ℃; the prepared two-component high-temperature-resistant high-shear-strength organic silicon adhesive is particularly suitable for working condition requirements of high-temperature-resistant high-shear strength of aerospace, nuclear technology and automobiles.

Description

Bi-component high-temperature-resistant high-shear-strength organic silicon adhesive and preparation method thereof
Technical Field
The invention belongs to the technical field of adhesives, and particularly relates to a bi-component high-temperature-resistant high-shear-strength organic silicon adhesive and a preparation method thereof.
Background
The organic silicon adhesive has excellent cold and heat resistance and durability, is widely applied to various industrial fields, such as aerospace, nuclear technology, automobiles, buildings, electronic and electrical appliances, mechanical industry and other fields, develops the bi-component organic silicon adhesive gradually along with the deep research and development and the improvement of the technology, can realize the diversification of process application because of the performances of no toxicity, environmental protection, wide temperature resistance range, convenient operation and the like, and is applied to more and more fields.
However, in the process of continuous development of the whole market, the requirements of customers on products are higher and higher, and the requirements on the performance of the products are higher. The high-temperature-resistant high-shear-strength organic silicon adhesive on the market at present generally has the problems that the temperature resistance is not high enough and the shear strength is too low to meet the requirements.
Disclosure of Invention
In view of the above, the invention aims to provide a bi-component high-temperature-resistant high-shear-strength organic silicon adhesive and a preparation method thereof, the organic silicon adhesive has the characteristics of simple processing technology, excellent temperature resistance and high shear strength, and the problems that the high-temperature-resistant high-shear-strength organic silicon adhesive in the current market has insufficient temperature resistance and the shear strength is too low to meet the requirements are solved.
The invention provides a bi-component high-temperature-resistant high-shear-strength organic silicon adhesive, which comprises the following components in percentage by mass of 100: (3-6)) a component A and a component B;
the component A comprises 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler;
the component B comprises 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst.
In the invention, the combined action of the alpha, omega-dihydroxy polydimethylsiloxane and the polysilazane crosslinking agent enables the adhesive to resist high temperature and have higher shear strength.
In the present invention, the viscosity of the α, ω -dihydroxypolydimethylsiloxane is 1000 to 10000 cps. In specific embodiments, the α, ω -dihydroxypolydimethylsiloxane has a viscosity of one or more of 1000cps, 3000cps, 5000cps, and 10000 cps.
In the present invention, the silane coupling agent is selected from at least one of 3-aminopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, bis [3- (trimethoxy silicon) -propyl ] amine, phenylaminomethyltrimethoxysilane, phenylaminomethyltriethoxysilane and divinyltriaminopropyltrimethoxysilane.
In the invention, the inorganic filler is selected from one or more of silicon micropowder, fluorophlogopite powder, ferric oxide, fumed silica, calcium carbonate, silicon carbide and alumina.
In the invention, the granularity of the silicon micro powder is 3000-8000 meshes; in a specific embodiment, the granularity of the silicon micro powder is one or more of 3000 meshes, 5000 meshes, 6000 meshes and 8000 meshes;
the granularity of the fluorophlogopite powder is 1250-6000 meshes; in a specific embodiment, the fluorophlogopite powder has a particle size of one or more of 1250 mesh, 3000 mesh and 6000 mesh.
The ferric oxide is selected from one or more of Bayer 4130, Bayer 4110 and Bayer 180M;
the specific surface area of the fumed silica is 150-380 m 2 (ii)/g; in a specific embodiment, the fumed silica has a specific surface area of 150m 2 /g、220m 2 G and 380m 2 One or more of the following components in g.
The granularity of the calcium carbonate is 3000-8000 meshes; in a specific embodiment, the particle size of the calcium carbonate is one or more of 3000 meshes, 5000 meshes, 6000 meshes and 8000 meshes.
The granularity of the silicon carbide is 500-3000 meshes; in particular embodiments, the silicon carbide has a particle size of one or more of 500 mesh, 1250 mesh, and 3000 mesh.
The granularity of the aluminum oxide is 3000-8000 meshes; in a specific embodiment, the particle size of the alumina is one or more of 3000 meshes, 5000 meshes, 6000 meshes and 8000 meshes.
In the present invention, the polysilazane crosslinker is selected from one or more of silicone polysilazane PR21, polysilazane PR28, and polysilazane 9108.
In the present invention, the catalyst is selected from one or more of dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, monobutyltin hydroxide and stannous octoate.
In the specific embodiment of the invention, the two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises the components in a mass ratio of 100: 5; or 100: 4; or 100: 6; or 100:3 of a component A and a component B;
the component A comprises 35 wt% of alpha, omega-dihydroxy polydimethylsiloxane (3000cps), 3 wt% of iron red (Bayer 4130), 61 wt% of silicon micropowder with the granularity of 6000 meshes and 1 wt% of 3-aminopropyltrimethoxysilane; the B component comprises 99 weight percent of polysilazane (PR21) and 1 weight percent of dibutyltin dilaurate.
Or the A component comprises 10 wt% of 3-aminopropyltrimethoxysilane (3000cps), 30 wt% of alpha, omega-dihydroxy polydimethylsiloxane (5000cps), 3 wt% of iron oxide red (Bayer 4130), 40 wt% of silicon micropowder with the particle size of 6000 meshes, 16 wt% of fluorophlogopite powder with the particle size of 3000 meshes and 1 wt% of gamma-aminopropyltriethoxysilane; the B component comprises 99 wt% of polysilazane (PR21) and 1 wt% of dibutyltin diacetate.
Or the A component comprises 40 wt% of alpha, omega-dihydroxy polydimethylsiloxane (5000cps), 3.5 wt% of iron oxide red (Bayer 4110), 51.0 wt% of silicon micropowder with the particle size of 6000 meshes, and 5.0 wt% of specific surface area of 150m 2 The silica gel comprises fumed silica and 0.5 wt% of gamma-glycidoxypropyltrimethoxysilane; the B component comprises 98.5 wt% of polysilazane (PR28) and 1.5 wt% of dioctyltin dilaurate.
Or the A component comprises 40 wt% of alpha, omega-dihydroxy polydimethylsiloxane (5000cps), 3.0 wt% of iron oxide red (Bayer 4110), 20.0 wt% of silicon micropowder with the granularity of 8000 meshes, 36.0 wt% of calcium carbonate with the granularity of 3000 meshes and 1 wt% of gamma-aminopropyltriethoxysilane; the B component comprises 98.5 wt% of polysilazane (PR21) and 1.5 wt% of dioctyltin dilaurate.
Or the A component comprises 32 wt% of alpha, omega-dihydroxy polydimethylsiloxane (10000cps), 3.0 wt% of iron oxide red (Bayer 4110), 30.0 wt% of silicon micropowder with the granularity of 8000 meshes, 34.0 wt% of silicon carbide with the granularity of 3000 meshes and 1 wt% of gamma-aminopropyltriethoxysilane; the B component comprises 98.5 wt% of polysilazane (PR21) and 1.5 wt% of dioctyltin dilaurate.
Or the A component comprises 32 wt% of alpha, omega-dihydroxy polydimethylsiloxane (10000cps), 3.0 wt% of iron red (Bayer 4110), 30.0 wt% of silicon micropowder with the granularity of 8000 meshes, 34.0 wt% of alumina with the granularity of 3000 meshes and 1 wt% of gamma-aminopropyltriethoxysilane; the B component comprises 99.0 wt% of polysilazane (PR21) and 1.0 wt% of dioctyltin dilaurate.
The invention provides a preparation method of a bi-component high-temperature-resistant high-shear-strength organic silicon adhesive, which comprises the following steps:
mixing 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler, vacuumizing, and stirring at a stirring speed of 800-1000 r/min for 2-3 h at normal temperature to obtain a component A;
mixing 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst, vacuumizing, and stirring at 500-1000 rpm for 0.5-1 h at normal temperature to obtain a component B;
and (2) mixing the component A and the component B according to the mass ratio of 100: and (6-3) mixing to obtain the bi-component high-temperature-resistant high-shear-strength organic silicon adhesive.
The invention provides a bi-component high-temperature-resistant high-shear-strength organic silicon adhesive, which comprises the following components in percentage by mass of 100: (3-6)) a component A and a component B; the component A comprises 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler; the component B comprises 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst. The high-temperature-resistant high-shear-strength organic silicon adhesive prepared by the cross-linking agent, the inorganic filler and other additives has good high-temperature resistance, and the shear strength can be more than 1.5MPa at 300 ℃; the prepared two-component high-temperature-resistant high-shear-strength organic silicon adhesive is particularly suitable for working condition requirements of high-temperature-resistant high-shear strength of aerospace, nuclear technology and automobiles.
Detailed Description
In order to further illustrate the present invention, the following examples are provided to describe the two-component silicone adhesive with high temperature resistance and high shear strength and the preparation method thereof in detail, but they should not be construed as limiting the scope of the present invention.
Example 1
The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises a component A and a component B, wherein the component A and the component B are as shown in the following table 1:
TABLE 1 feed composition of A and B Components in example 1
Figure BDA0003763026270000041
Preparation of component A: adding the raw material of the component A into a planetary stirring kettle, vacuumizing at the stirring speed of 800r/min and stirring for 2 hours at normal temperature to obtain the component A, and sealing and storing;
preparation of the component B: adding the raw material of the component B into a stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 600r/min for 0.5h to obtain the component B, and sealing and storing;
the sizing is carried out: mixing the component A and the component B according to the mass ratio of 100:5 ratio for mixing.
Example 2
The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises a component A and a component B, wherein the component A and the component B are as shown in the following table 2:
TABLE 2 feed composition of A and B Components in example 2
Figure BDA0003763026270000051
Preparation of component A: adding the raw material of the component A into a planetary stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 1000r/min for 1.5h to obtain the component A, and sealing and storing;
preparation of the component B: adding the raw material of the component B into a stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 700r/min for 0.5h to obtain the component B, and sealing and storing;
the sizing is carried out: mixing the component A and the component B according to the mass ratio of 100:4 ratio for mixing.
Example 3
The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises a component A and a component B, wherein the component A and the component B are as shown in the following table 3:
table 3 raw material composition of a component a and B component in example 3
Figure BDA0003763026270000052
Preparation of the component A: adding the raw material of the component A into a planetary stirring kettle, vacuumizing at the stirring speed of 1000r/min and stirring for 2 hours at normal temperature to obtain the component A, and sealing and storing;
preparation of the component B: adding the raw material of the component B into a stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 700r/min for 0.5h to obtain the component B, and sealing and storing;
the sizing is carried out: mixing the component A and the component B according to the mass ratio of 100:5 ratio for mixing.
Example 4
The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises a component A and a component B, wherein the component A and the component B are as shown in the following table 4:
table 4 raw material composition of a component a and B component in example 4
Figure BDA0003763026270000061
Preparation of component A: adding the raw material of the component A into a planetary stirring kettle, vacuumizing at the stirring speed of 1000r/min and stirring for 2 hours at normal temperature to obtain the component A, and sealing and storing;
preparation of the component B: adding the raw material of the component B into a stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 700r/min for 0.5h to obtain the component B, and sealing and storing;
the sizing is carried out: mixing the component A and the component B according to the mass ratio of 100: and 6, mixing.
Example 5
The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises a component A and a component B, wherein the component A and the component B are as shown in the following table 5:
TABLE 5 feed composition of A and B Components in example 5
Figure BDA0003763026270000062
Figure BDA0003763026270000071
Preparation of the component A: adding the raw material of the component A into a planetary stirring kettle, vacuumizing at the stirring speed of 1000r/min and stirring for 2 hours at normal temperature to obtain the component A, and sealing and storing;
preparation of the component B: adding the raw material of the component B into a stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 600r/min for 0.5h to obtain the component B, and sealing and storing;
the sizing is carried out: mixing the component A and the component B according to the mass ratio of 100: mixing at a ratio of 3.
Example 6
The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises a component A and a component B, wherein the component A and the component B are as shown in the following table 6:
TABLE 6 feed composition of A and B Components in example 6
Figure BDA0003763026270000072
Preparation of component A: adding the raw material of the component A into a planetary stirring kettle, vacuumizing at the stirring speed of 1000r/min and stirring for 2 hours at normal temperature to obtain the component A, and sealing and storing;
preparation of the component B: adding the raw material of the component B into a stirring kettle, vacuumizing at the normal temperature and stirring at the stirring speed of 600r/min for 0.5h to obtain the component B, and sealing and storing;
the sizing is carried out: mixing the component A and the component B according to the mass ratio of 100:5 ratio for mixing.
Comparative example 1
The commercial bi-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises the following components in percentage by weight: the component A comprises alpha, omega-dihydroxy polydimethylsiloxane, a filler: iron oxide red, gas-phase white carbon black and silicon micropowder; the component B comprises a curing agent: methyl oxime, ethyl oxime, catalyst: dibutyltin dilaurate; when the sizing agent is used, the mass ratio of the component A to the component B is 100:4
Comparative example 2
A commercial two-component high-shear adhesive (the component A comprises epoxy resins E-51 and E-44, a filler is calcium carbonate, a diluent is polypropylene glycol diglycidyl ether, the component B comprises a curing agent R2026, a coupling agent is KH560 and a curing accelerator DMP-30, and the mass ratio of the component A to the component B is 100:5 when the adhesive is applied.
And (3) performance testing:
the performance tests of the two-component high-temperature-resistant high-shear silicone adhesives of examples 1 to 6 and the comparative example were carried out at normal temperature and high temperature (300 ℃), and the test results are shown in the following table 7:
table 7 test results of adhesives of examples and comparative examples
Figure BDA0003763026270000081
Known from the above embodiments, the invention provides a two-component high temperature resistant high shear strength silicone adhesive, which comprises the following components in mass ratio of 100: (3-6)) a component A and a component B; the component A comprises 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler; the component B comprises 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst. The high-temperature-resistant high-shear-strength organic silicon adhesive prepared by the cross-linking agent, the inorganic filler and other additives has good high-temperature resistance, and the shear strength can be more than 1.5MPa at 300 ℃; the prepared two-component high-temperature-resistant high-shear-strength organic silicon adhesive is particularly suitable for working condition requirements of high-temperature-resistant high-shear strength of aerospace, nuclear technology and automobiles.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (8)

1. The two-component high-temperature-resistant high-shear-strength organic silicon adhesive comprises the following components in percentage by mass of 100: (3-6) component A and component B;
the component A comprises 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler;
the component B comprises 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst.
2. The two-component high temperature resistant high shear strength silicone adhesive of claim 1, wherein the viscosity of the α, ω -dihydroxy polydimethylsiloxane is 1000 to 10000 cps.
3. The two-part high temperature and high shear strength silicone adhesive according to claim 1, wherein the silane coupling agent is selected from at least one of 3-aminopropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, gamma-glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane, bis [3- (trimethoxy silicon) -propyl ] amine, phenylaminomethyltrimethoxysilane, phenylaminomethyltriethoxysilane, and divinyltriaminopropyltrimethoxysilane.
4. The two-component silicone adhesive with high temperature resistance and high shear strength according to claim 1, wherein the inorganic filler is selected from one or more of silica micropowder, fluorophlogopite powder, ferric oxide, fumed silica, calcium carbonate, silicon carbide and aluminum oxide.
5. The two-component high-temperature-resistant high-shear-strength organosilicon adhesive according to claim 4, wherein the particle size of the silica micropowder is 3000-8000 meshes;
the granularity of the fluorophlogopite powder is 1250-6000 meshes;
the ferric oxide is selected from one or more of Bayer 4130, Bayer 4110 and Bayer 180M;
the specific surface area of the fumed silica is 150-380 m 2 /g；
The granularity of the calcium carbonate is 3000-8000 meshes;
the granularity of the silicon carbide is 500-3000 meshes;
the particle size of the alumina is 3000-8000 meshes.
6. The two-part high temperature resistant high shear strength silicone adhesive of claim 1, wherein the polysilazane crosslinker is selected from one or more of silicone polysilazane PR21, polysilazane PR28, and polysilazane 9108.
7. The two-part high temperature high shear strength silicone adhesive of claim 1, wherein the catalyst is selected from one or more of dibutyltin dilaurate, dibutyltin diacetate, dioctyltin dilaurate, monobutyltin hydroxide, and stannous octoate.
8. A preparation method of the two-component high temperature resistant and high shear strength silicone adhesive according to any one of claims 1 to 7 comprises the following steps:
mixing 30-75 wt% of alpha, omega-dihydroxy polydimethylsiloxane, 0.3-1.5 wt% of silane coupling agent and 25-70 wt% of inorganic filler, vacuumizing, and stirring at a stirring speed of 800-1000 r/min for 2-3 hours at normal temperature to obtain a component A;
mixing 98-99.5 wt% of polysilazane crosslinking agent and 0.5-2 wt% of catalyst, vacuumizing, and stirring at 500-1000 rpm for 0.5-1 h at normal temperature to obtain a component B;
and (2) mixing the component A and the component B according to the mass ratio of 100: and (6-3) mixing to obtain the bi-component high-temperature-resistant high-shear-strength organic silicon adhesive.
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CN107163908A (en) * 2017-07-18 2017-09-15 杭州之江有机硅化工有限公司 One kind is used for automobile lamp and assembles sealed two-component silicone rubber sealant and preparation method thereof
CN109593464A (en) * 2018-11-09 2019-04-09 中国科学院化学研究所 A kind of organic silicon rubber coating of room curing and high temperature resistant, preparation method and application
CN111057517A (en) * 2019-12-31 2020-04-24 广州机械科学研究院有限公司 Bi-component fast curing type organic silicon structural adhesive and preparation method thereof
CN114045151A (en) * 2021-11-26 2022-02-15 广州市白云化工实业有限公司 Flame-retardant silicone sealant and preparation method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040266925A1 (en) * 2003-06-09 2004-12-30 Mikio Shiono Adhesive composition
CN107163908A (en) * 2017-07-18 2017-09-15 杭州之江有机硅化工有限公司 One kind is used for automobile lamp and assembles sealed two-component silicone rubber sealant and preparation method thereof
CN109593464A (en) * 2018-11-09 2019-04-09 中国科学院化学研究所 A kind of organic silicon rubber coating of room curing and high temperature resistant, preparation method and application
CN111057517A (en) * 2019-12-31 2020-04-24 广州机械科学研究院有限公司 Bi-component fast curing type organic silicon structural adhesive and preparation method thereof
CN114045151A (en) * 2021-11-26 2022-02-15 广州市白云化工实业有限公司 Flame-retardant silicone sealant and preparation method thereof

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