CN115000327A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN115000327A CN115000327A CN202210625400.6A CN202210625400A CN115000327A CN 115000327 A CN115000327 A CN 115000327A CN 202210625400 A CN202210625400 A CN 202210625400A CN 115000327 A CN115000327 A CN 115000327A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The invention discloses a display panel and a display device, wherein the display panel comprises a display function layer and a semiconductor device layer arranged on one side of the display function layer, which is far away from a light-emitting surface, the semiconductor refrigerator comprises a first heat conduction layer, a semiconductor refrigeration layer, a second heat conduction layer and a direct current power supply connected with the semiconductor refrigeration layer, the first heat conduction layer, the semiconductor refrigeration layer and the second heat conduction layer are arranged on one side of the display function layer, which is far away from the light-emitting surface, the direct current power supply is connected with the semiconductor refrigeration layer, heat generated by the display function layer in working is conducted to the first heat conduction layer, the heat of the first heat conduction layer is conducted to the second heat conduction layer through a closed loop, so that the heat dissipation effect on the display function layer is realized, the temperature of the first heat conduction layer can be reduced to be lower than the ambient temperature, the temperature of the display function layer is reduced to be lower than the ambient temperature, and the heat dissipation efficiency under higher ambient temperature is greatly improved, so that the display panel has better high-temperature-resistant reliability and longer service life.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
In the field of display technology, an OLED (Organic Light-Emitting Diode) display device belongs to an electroluminescent device, and has the advantages of self-luminescence, high Light-Emitting efficiency, low operating voltage, thinness, flexibility, simple manufacturing process and the like, so that the OLED display device is widely applied in the fields of display and illumination.
The requirement for integration level and performance along with OLED display panel is higher and higher for the heat that produces in the OLED display screen working process is bigger and bigger, at present, mainly through attaching the heat dissipation membrane on the OLED display panel back to dispel the heat to OLED display panel through the mode of physical heat transfer, however, the radiating efficiency of this kind of heat dissipation membrane highly relies on ambient temperature, when OLED display panel worked under higher ambient temperature, the radiating efficiency of heat dissipation membrane is lower, lead to OLED display panel to work under high temperature for a long time, finally lead to life to shorten greatly.
Disclosure of Invention
The invention provides a display panel and a display device, wherein the display panel has better high-temperature-resistant reliability and longer service life.
To solve the above problem, in a first aspect, the present invention provides a display panel, including:
a display functional layer;
the semiconductor refrigerator is arranged on one side, away from the light emitting surface, of the display functional layer;
the semiconductor refrigerator comprises a first heat conduction layer arranged on one side, away from a light outlet face, of the display function layer, a semiconductor refrigeration layer arranged on the first heat conduction layer and far away from the display function layer, a second heat conduction layer arranged on the semiconductor refrigeration layer and far away from the first heat conduction layer, and a direct-current power supply connected with the semiconductor refrigeration layer to form a closed loop, wherein the direct-current power supply provides control voltage for the semiconductor refrigeration layer to enable heat of the first heat conduction layer to be conducted to the second heat conduction layer through the semiconductor refrigeration layer.
In a display panel provided in an embodiment of the present invention, the semiconductor refrigeration layer includes a first electrode layer disposed on a side of the first heat conduction layer away from the display function layer, a semiconductor layer disposed on a side of the first electrode layer away from the first heat conduction layer, and a second electrode layer disposed on a side of the semiconductor layer away from the first electrode layer;
the semiconductor layer comprises a plurality of N-type semiconductor parts and a plurality of P-type semiconductor parts which are arranged at intervals and alternately, the first electrode layer comprises a plurality of first electrode parts which are arranged at intervals, the second electrode layer comprises a plurality of second electrode parts which are arranged at intervals, one first electrode part is connected with one adjacent N-type semiconductor part and one P-type semiconductor part, one second electrode part is connected with one adjacent N-type semiconductor part and one P-type semiconductor part, and the plurality of N-type semiconductor parts and the plurality of P-type semiconductor parts are connected in series through the corresponding first electrode parts and the corresponding second electrode parts and form a closed loop with the direct-current power supply.
In the display panel provided in the embodiment of the present invention, the semiconductor layer includes a plurality of semiconductor groups arranged at intervals, the semiconductor section includes a plurality of N-type semiconductor sections and a plurality of P-type semiconductor sections, and the semiconductor refrigerator includes a plurality of dc power supplies;
in any of the semiconductor groups, the N-type semiconductor sections and the P-type semiconductor sections are connected in series by the corresponding first electrode sections and second electrode sections and form a closed circuit with the corresponding dc power supply.
In the display panel provided in the embodiment of the present invention, the display panel includes a plurality of display sub-regions adjacent to each other in sequence and arranged in an array, and one of the semiconductor groups is correspondingly disposed in one of the display sub-regions.
In the display panel provided in the embodiment of the present invention, the semiconductor cooling layer further includes an insulating layer, and the insulating layer includes an insulating portion disposed in a spacing region between adjacent N-type semiconductor portion and P-type semiconductor portion.
In the display panel provided in the embodiment of the present invention, the display panel further includes a first substrate layer disposed on a side of the display functional layer away from the light exit surface, and a second substrate disposed on a side of the first substrate layer away from the display functional layer, and the semiconductor refrigerator is disposed between the first substrate and the second substrate.
In the display panel provided in the embodiment of the present invention, the display function layer includes at least two binding terminals disposed on the first substrate, the first substrate includes a via hole corresponding to the binding terminal, the positive electrode of the dc power supply is bound to one binding terminal and connected to one end of the semiconductor refrigeration layer through the corresponding via hole, and the negative electrode of the dc power supply is bound to the other binding terminal and connected to the other end of the semiconductor refrigeration layer through the corresponding via hole.
In an embodiment of the present invention, the display panel includes a display area, and an orthographic projection of the first heat conduction layer on the display function layer covers the display area.
In the display panel provided in the embodiment of the present invention, the first heat conductive layer and the second heat conductive layer are made of a heat conductive insulating material.
In a second aspect, the present invention provides a display device, which includes the display panel.
Has the advantages that: the embodiment of the invention provides a display panel and a display device, wherein the display panel comprises a display function layer and a semiconductor device layer arranged on one side of the display function layer, which is far away from a light-emitting surface, the semiconductor refrigerator comprises a first heat conduction layer arranged on one side of the display function layer, which is far away from the light-emitting surface, a semiconductor refrigeration layer arranged on the first heat conduction layer, which is far away from the display function layer, a second heat conduction layer arranged on the semiconductor refrigeration layer, which is far away from the semiconductor refrigeration layer, and a direct current power supply connected with the semiconductor refrigeration layer to form a closed loop, in the display panel, heat generated by the display function layer during working is firstly conducted to the first heat conduction layer, the direct current power supply provides control voltage for the semiconductor refrigeration layer, and then the heat of the first heat conduction layer is conducted to the second heat conduction layer through the closed loop, therefore, the heat dissipation effect on the display function layer is achieved, the temperature of the first heat conduction layer can be reduced to be lower than the ambient temperature based on the Peltier effect, and then the temperature of the display function layer can be reduced to be lower than the ambient temperature, so that the heat dissipation efficiency at higher ambient temperature can be greatly improved, and the display panel has better high-temperature-resistant reliability and longer service life.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view illustrating a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic plan view of a semiconductor layer in a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of another display panel according to an embodiment of the present invention;
fig. 4 is a schematic plan view illustrating a first heat conductive layer in a display panel according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
An embodiment of the present invention provides a display panel, which will be described in detail below with reference to a cross-sectional structure of the display panel shown in fig. 1.
The display panel comprises a display functional layer 100 and a semiconductor refrigerator 200 arranged on one side of the display functional layer 100, which is far away from a light emitting surface, wherein the semiconductor refrigerator 200 is used for dissipating heat of the display functional layer 100 so as to enable the display functional layer to work within a certain safe temperature range all the time;
specifically, the semiconductor refrigerator 200 includes a first heat conduction layer 210 disposed on a side of the display function layer 100 away from the light emitting surface, a semiconductor refrigeration layer 220 disposed on the first heat conduction layer 210 away from the display function layer 100, a second heat conduction layer 230 disposed on the semiconductor refrigeration layer 220 away from the first heat conduction layer 210, and a dc power supply 240 connected to the semiconductor refrigeration layer 220 to form a closed loop, where the dc power supply 240 provides a control voltage to the semiconductor refrigeration layer 220 so that heat in the first heat conduction layer 210 is conducted to the second heat conduction layer 230 through the semiconductor refrigeration layer 220;
the heat generated by the display function layer 100 during operation is firstly conducted to the first heat conduction layer 210 in contact with the first heat conduction layer by means of physical heat transfer, the direct-current power supply 240 provides a control voltage to the semiconductor refrigeration layer 220, and then the heat of the first heat conduction layer 210 is conducted to the second heat conduction layer 230 through the semiconductor refrigeration layer 220, that is, the heat generated by the display function layer 100 during operation is finally conducted to the second heat conduction layer 230 and further conducted to the environment, so that the heat dissipation effect on the display function layer 100 in the display panel is realized;
the semiconductor cooler 200 can reduce the temperature of the first heat conducting layer 210 to be lower than the ambient temperature based on the peltier effect, and further reduce the temperature of the display function layer 100 to be lower than the ambient temperature, so that the heat dissipation efficiency at higher ambient temperature is greatly improved, and the display panel has better high temperature reliability and longer service life.
In this embodiment, the peltier effect applied by the semiconductor refrigerator is a phenomenon that one contact is cooled and the other contact is heated when direct current is supplied to a closed circuit formed by combining two different metals, and the peltier effect is realized by transferring energy through holes and electrons in motion, and the heat dissipation speed and the heat dissipation temperature of the heat dissipation mode can be adjusted by changing the voltage of a direct current power supply according to actual requirements so as to meet the dynamically-changed heat dissipation requirement of the display panel;
the display function layer 100 generally includes a thin film transistor layer, an OLED light emitting layer disposed on the thin film transistor layer, and other necessary functional film layers.
In some embodiments, with reference to fig. 1, the semiconductor refrigeration layer 220 specifically includes a first electrode layer 221 disposed on a side of the first heat conduction layer 210 away from the display function layer 100, a semiconductor layer 222 disposed on a side of the first electrode layer 221 away from the first heat conduction layer 210, and a second electrode layer 223 disposed on a side of the semiconductor layer 222 away from the first electrode layer 221;
the semiconductor layer 222 includes a plurality of N-type semiconductor portions 2221 and a plurality of P-type semiconductor portions 2222 that are alternately arranged at intervals, and the number of the N-type semiconductor portions 2221 is the same as that of the P-type semiconductor portions 2222;
the first electrode layer 221 includes a plurality of first electrode portions 2211 arranged at intervals, and each first electrode portion 2211 is connected to the first heat conduction layer 210;
the second electrode layer 223 includes a plurality of second electrode portions 2231 arranged at intervals, and each of the second electrode portions 2231 is connected to the second heat conduction layer 230;
a first electrode portion 2211 connects an adjacent N-type semiconductor portion 2221 and an adjacent P-type semiconductor portion 2222, and a second electrode portion 2231 connects an adjacent N-type semiconductor portion 2221 and an adjacent P-type semiconductor portion 2222, so that the N-type semiconductor portions 2221 and the P-type semiconductor portions 2222 in the semiconductor layer 222 sequentially form a series circuit through the corresponding first electrode portion 2211 and the corresponding second electrode portion 2231, and further form a closed loop with the dc power supply 240, wherein the positive electrode of the dc power supply 240 is connected to the N-type semiconductor portion 2221 at one end of the series circuit, and the negative electrode of the dc power supply 240 is connected to the P-type semiconductor portion 2222 at one end of the series circuit;
it should be noted that the first electrode layer 221 and the second electrode layer 223 are made of metal materials commonly used in the art, such as copper, aluminum, molybdenum, titanium, and the like, and are formed by a physical vapor deposition process and then patterned by a patterning process to form a film layer with a corresponding pattern;
the N-type semiconductor portion 2221 in the semiconductor layer 222 is usually made of silicon or germanium doped with a certain amount of phosphorus, antimony, or arsenic atoms, the P-type semiconductor portion 2222 is usually made of silicon or germanium doped with a certain amount of boron, indium, or gallium atoms, and is formed by forming a film through a physical or chemical vapor deposition process, then forming a film layer with a corresponding pattern through a patterning process, and finally doping corresponding atoms through an ion implantation process.
In some embodiments, the second electrode layer 223 further includes a plurality of power connection traces 2232, one end of each power connection trace 2232 is connected to the N-type semiconductor portion 2221 at one end of the series connection, and is arranged around the semiconductor refrigeration layer 220 until the other end is connected to the positive electrode of the dc power supply 240; one end of the other power connection trace 2232 is connected to the P-type semiconductor portion 2222 at one end of the series connection, and is arranged around the semiconductor refrigeration layer 220 until the other end is connected to the negative electrode of the dc power supply 240.
In some embodiments, the heat dissipation of the display function layer 100 is more precise, and the semiconductor layer 222 may be divided into a plurality of independent portions to realize the partition heat dissipation of the display function layer 100;
specifically, referring to fig. 2, the semiconductor layer 222 includes a plurality of semiconductor groups 222a arranged at intervals, one semiconductor group 222a includes a plurality of N-type semiconductor portions 2221 and a plurality of P-type semiconductor portions 2222, and the semiconductor refrigerator 200 includes a plurality of dc power supplies 240 corresponding to the plurality of semiconductor groups 222 a; in any of the semiconductor groups 222a, the N-type semiconductor portions and the P-type semiconductor portions are connected in series by the corresponding first electrode portions and second electrode portions and form a closed loop with the corresponding dc power supply 240, that is, each of the semiconductor groups 222a forms an independent closed loop with the corresponding dc power supply 240, and each independently dissipates heat to a corresponding region of the display function layer 100;
specifically, the display panel includes a display area, the display area includes a plurality of display sub-areas AA1 adjacent to each other in sequence and arranged in an array, one semiconductor group 222a is correspondingly disposed in one display sub-area AA1, and each semiconductor group 222a is independently used for dissipating heat of the corresponding display sub-area AA 1;
in practical application, the display panel further includes a temperature detection system and a heat dissipation control system, the temperature detection system is configured to measure the temperature of each display sub-area AA1 in real time and transmit the measured temperature information to the heat dissipation control system, and the heat dissipation control system obtains the voltage required by the semiconductor group 222a corresponding to each display sub-area AA1 according to the obtained temperature information and by combining with a certain algorithm, and controls the corresponding dc power supply to load the voltage, so that real-time partitioned heat dissipation of the display panel is achieved, and the heat dissipation efficiency is further improved.
In some embodiments, with continued reference to fig. 1, the semiconductor refrigeration layer 220 further includes an insulating layer 224, the insulating layer 224 includes an insulating portion 2241 disposed in a spacing region between the adjacent N-type semiconductor portions 2221 and P-type semiconductor portions 2222, and the insulating portion 2241 is filled in the spacing region, so as to, in a first aspect, increase the insulating reliability of the adjacent N-type semiconductor portions 2221 and P-type semiconductor portions 2222 and prevent the adjacent N-type semiconductor portions 2221 and P-type semiconductor portions 2222 from overlapping with each other to cause heat dissipation failure; in a second aspect, the spacing region is filled to planarize the semiconductor cooling layer 220 so as to form other upper structural layers; in a third aspect, the insulating layer 224 may also be made of an insulating material with low thermal conductivity, and the insulating layer 224 may act as a physical thermal insulation layer between the first heat conduction layer 210 and the second heat conduction layer 230, so as to avoid that the heat conducted to the second heat conduction layer 230 through the semiconductor refrigeration layer 220 returns to the first heat conduction layer 210 by means of physical heat transfer to affect the heat dissipation efficiency.
In some embodiments, referring to fig. 1, the display panel further includes a first substrate layer 310 disposed on a side of the display function layer 100 away from the light emitting surface, and a second substrate 320 disposed on a side of the first substrate layer 310 away from the display function layer 100, and the semiconductor refrigerator 200 is disposed between the first substrate 310 and the second substrate 320, wherein the first substrate 310 can completely couple the semiconductor refrigerator 200, so as to prevent the display effect from being affected by mutual interference between the related traces in the semiconductor refrigerator 200 and the display function layer 100;
the first substrate 310 and the second substrate 320 are specifically flexible substrates made of polyimide films.
In some embodiments, referring to fig. 3, the display function layer 100 includes at least two binding terminals 101 disposed on the first substrate 310, the first substrate 310 includes via holes 311 corresponding to the binding terminals 101, a positive electrode of the dc power 240 is bound to one of the binding terminals 101 and connected to one end of the semiconductor refrigeration layer 220 through the corresponding via hole 311, and a negative electrode of the dc power 240 is bound to the other binding terminal 101 and connected to the other end of the semiconductor refrigeration layer 220 through the corresponding via hole 311, so that the dc power 240 and the semiconductor refrigeration layer 220 are connected to form a closed loop;
in this configuration, the dc power supply 240 may be connected to the semiconductor refrigeration layer 220 by a conventional bonding process in the display field, so that the display panel may be industrialized on a large scale;
the binding terminal 101 is generally disposed in a frame region of a display panel, and is disposed on the same layer as a metal film layer in a thin film transistor in the display function layer 100, for example, the binding terminal 101 may be disposed on the same layer as a gate metal layer or a source/drain metal layer, and in addition, the binding terminal 101 is disposed corresponding to the dc power supply 240, and one of the dc power supply 240 is correspondingly disposed with two binding terminals 101;
the via holes 311 are arranged in a one-to-one correspondence with the plurality of binding terminals 101, and when the semiconductor refrigeration layer 220 further comprises an insulating layer 224, the via holes are arranged in the insulating layer 224 and the first substrate 310, so that the binding terminals 101 are connected with the N-type semiconductor portions 2221 or the P-type semiconductor portions 2222 in the semiconductor refrigeration layer 220;
specifically, the positive electrode of the dc power supply 240 is bound to one of the binding terminals 101 and connected to one of the N-type semiconductor portions 2221 at one end of the semiconductor refrigeration layer 220 through the corresponding via hole 311, and the negative electrode of the dc power supply 240 is bound to the other binding terminal 101 and connected to one of the P-type semiconductor portions 2222 at one end of the semiconductor refrigeration layer 220 through the corresponding via hole 311.
In some embodiments, referring to fig. 4, the display panel includes a display area AA and a frame area BA disposed around the display area AA, wherein an orthographic projection of the first thermal conductive layer 210 on the display functional layer 100 covers the display area AA, so as to effectively dissipate heat of all light emitting devices disposed in the display area AA in the display functional layer 100.
In some embodiments, the material of the first heat conducting layer 210 and the second heat conducting layer 230 is a heat conducting insulating material, and may be, for example, a heat conducting silica gel material, a heat conducting ceramic material, or the like.
In some embodiments, the structure in the semiconductor cooler 200 can be reused as a conventional structure in a display panel to simplify the manufacturing process of the display panel;
for example, in a conventional display panel, a light shielding layer is generally disposed under an active layer, and the first electrode layer 221 and the second electrode layer 223 in the semiconductor cooler 200 are generally formed by a light shielding metal material, the first electrode layer 221 and the second electrode layer 223 can be multiplexed as the light shielding layer, and specifically, an orthographic projection of the first electrode layer 221 and/or the second electrode layer 223 on the display functional layer 100 covers an orthographic projection of the active layer on the display functional layer 100.
It should be noted that, in the above embodiment of the display panel, only the above structure is described, and it is understood that, in addition to the above structure, the display panel according to the embodiment of the present invention may further include any other necessary structure as needed, and the specific structure is not limited herein.
In another embodiment of the present invention, a display device is further provided, where the display device includes the display panel provided in the above embodiment, and the type of the display device is not particularly limited, and may be a vehicle-mounted display that needs to operate at a high ambient temperature for a long time.
In the display panel and the display device described in the above embodiments, the semiconductor refrigerator is disposed on the side of the display functional layer away from the light emitting surface, and includes the first heat conduction layer disposed on the side of the display functional layer away from the light emitting surface, the semiconductor refrigeration layer disposed on the first heat conduction layer away from the display functional layer, the second heat conduction layer disposed on the semiconductor refrigeration layer away from the semiconductor refrigeration layer, and the dc power supply connected to the semiconductor refrigeration layer to form a closed loop, so that heat generated by the display functional layer during operation is firstly conducted to the first heat conduction layer, the dc power supply provides a control voltage to the semiconductor refrigeration layer, and then the heat of the first heat conduction layer is conducted to the second heat conduction layer through the closed loop, thereby achieving a heat dissipation effect on the display functional layer, and the semiconductor refrigeration layer is based on peltier effect, the temperature of the first heat conduction layer can be reduced to be lower than the ambient temperature, and then the temperature of the display function layer can be reduced to be lower than the ambient temperature, so that the heat dissipation efficiency under higher ambient temperature can be greatly improved, and the display panel has better high-temperature-resistant reliability and longer service life.
The supplementary explanation is that, in the preparation of the display panel, different organic light emitting film layers are all completed in different cavities, and different atmospheres of different cavities cause temperature differences, which inevitably causes different substrate expansion amounts, so that film forming positions of different film layers are inconsistent, and the performance stability of the prepared display panel and the development of high-resolution products are severely restricted.
Therefore, the semiconductor refrigerator utilizing the Peltier principle can also be applied to an evaporation process of an organic light-emitting film layer in a display panel preparation process, the heat dissipation effect of the semiconductor refrigerator is utilized to enable the substrate to always keep constant low temperature in the whole organic light-emitting film layer evaporation process, on one hand, the consistency of different substrate film forming environments can be realized, on the other hand, the consistency of the same substrate in different cavities is promoted, the abnormal film layer retraction caused by the expansion of the substrate is avoided, and the performance stability of the prepared display panel and the development of high-resolution products are favorably improved.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.
The display panel and the display device provided by the embodiment of the present invention are described in detail above, and the principle and the embodiment of the present invention are explained by applying specific examples herein, and the description of the above embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display panel, comprising:
a display functional layer;
the semiconductor refrigerator is arranged on one side, away from the light emitting surface, of the display functional layer;
the semiconductor refrigerator comprises a first heat conduction layer arranged on one side, away from a light outlet face, of the display function layer, a semiconductor refrigeration layer arranged on the first heat conduction layer and far away from the display function layer, a second heat conduction layer arranged on the semiconductor refrigeration layer and far away from the first heat conduction layer, and a direct-current power supply connected with the semiconductor refrigeration layer to form a closed loop, wherein the direct-current power supply provides control voltage for the semiconductor refrigeration layer to enable heat of the first heat conduction layer to be conducted to the second heat conduction layer through the semiconductor refrigeration layer.
2. The display panel according to claim 1, wherein the semiconductor refrigeration layer comprises a first electrode layer disposed on a side of the first heat conductive layer away from the display function layer, a semiconductor layer disposed on a side of the first electrode layer away from the first heat conductive layer, and a second electrode layer disposed on a side of the semiconductor layer away from the first electrode layer;
the semiconductor layer comprises a plurality of N-type semiconductor parts and a plurality of P-type semiconductor parts which are arranged at intervals and alternately, the first electrode layer comprises a plurality of first electrode parts which are arranged at intervals, the second electrode layer comprises a plurality of second electrode parts which are arranged at intervals, one first electrode part is connected with one adjacent N-type semiconductor part and one P-type semiconductor part, one second electrode part is connected with one adjacent N-type semiconductor part and one P-type semiconductor part, and the plurality of N-type semiconductor parts and the plurality of P-type semiconductor parts are connected in series through the corresponding first electrode parts and the corresponding second electrode parts and form a closed loop with the direct-current power supply.
3. The display panel according to claim 2, wherein the semiconductor layer includes a plurality of semiconductor groups arranged at intervals, one of the semiconductor sections includes a plurality of N-type semiconductor sections and a plurality of P-type semiconductor sections, and the semiconductor refrigerator includes a plurality of the dc power supplies;
in any of the semiconductor groups, the N-type semiconductor portions and the P-type semiconductor portions are connected in series by the corresponding first electrode portions and second electrode portions and form a closed circuit with the corresponding dc power supply.
4. The display panel according to claim 3, wherein the display panel comprises a plurality of display sub-regions adjacent to each other in sequence and arranged in an array, and one of the semiconductor groups is disposed in one of the display sub-regions.
5. The display panel according to claim 2, wherein the semiconductor cooling layer further comprises an insulating layer comprising an insulating portion disposed in a region between adjacent N-type semiconductor portions and P-type semiconductor portions.
6. The display panel according to claim 1, further comprising a first substrate layer disposed on a side of the display functional layer facing away from the light exit surface, and a second substrate disposed on a side of the first substrate layer facing away from the display functional layer, wherein the semiconductor refrigerator is disposed between the first substrate and the second substrate.
7. The display panel according to claim 2, wherein the display function layer includes at least two binding terminals disposed on the first substrate, the first substrate includes via holes corresponding to the binding terminals, a positive electrode of the dc power supply is bound to one of the binding terminals and connected to one end of the semiconductor refrigeration layer through the corresponding via hole, and a negative electrode of the dc power supply is bound to the other binding terminal and connected to the other end of the semiconductor refrigeration layer through the corresponding via hole.
8. The display panel of claim 2, wherein the display panel comprises a display area, and wherein an orthographic projection of the first thermally conductive layer on the display functional layer covers the display area.
9. The display panel according to claim 1, wherein the material of the first thermally conductive layer and the second thermally conductive layer is a thermally conductive and insulating material.
10. A display device characterized in that it comprises a display panel according to any one of claims 1 to 9.
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| CN202210625400.6A CN115000327A (en) | 2022-06-02 | 2022-06-02 | Display panel and display device |
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| CN202210625400.6A CN115000327A (en) | 2022-06-02 | 2022-06-02 | Display panel and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115359736A (en) * | 2022-09-23 | 2022-11-18 | 武汉天马微电子有限公司 | Display module and display device |
| CN115513363A (en) * | 2022-10-09 | 2022-12-23 | 上海天马微电子有限公司 | Display module and display device |
-
2022
- 2022-06-02 CN CN202210625400.6A patent/CN115000327A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115359736A (en) * | 2022-09-23 | 2022-11-18 | 武汉天马微电子有限公司 | Display module and display device |
| CN115359736B (en) * | 2022-09-23 | 2023-11-21 | 武汉天马微电子有限公司 | Display assembly and display device |
| CN115513363A (en) * | 2022-10-09 | 2022-12-23 | 上海天马微电子有限公司 | Display module and display device |
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