CN115000124B

CN115000124B - Display panel, display screen and electronic equipment

Info

Publication number: CN115000124B
Application number: CN202111331299.5A
Authority: CN
Inventors: 田正; 贺海明
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-11-11
Filing date: 2021-11-11
Publication date: 2023-09-01
Anticipated expiration: 2041-11-11
Also published as: WO2023082806A9; WO2023082806A1; CN115000124A

Abstract

The application provides a display panel, a display screen and electronic equipment. The display panel comprises a flat area and a bending area, wherein the flat area comprises a driving structure layer and a first light-emitting structure layer which are arranged in a stacked mode, and the first light-emitting structure layer is electrically connected with the driving structure layer and used for being driven by the driving structure layer to emit light; the bending region is connected to the periphery of the flat region and bends relative to the flat region, the bending region comprises a second light-emitting structure layer, the second light-emitting structure layer and the first light-emitting structure layer are arranged in the same layer, and the second light-emitting structure layer is electrically connected with the driving structure layer and used for being driven by the driving structure layer to emit light. The technical scheme of the application can realize the narrow frame of the screen on the basis of ensuring that the screen has good working performance.

Description

Display panel, display screen and electronic equipment

Technical Field

The present application relates to the field of display technologies, and in particular, to a display panel, a display screen, and an electronic device.

Background

With the development of display technology, flexible display screens are increasingly used in screens due to their excellent flexibility and adaptability. For a screen, a non-display area with a certain width exists around the display area, namely a frame, and the wider frame can influence the use experience of a user. How to realize the narrow frame of the screen on the basis of ensuring the screen to have good working performance is a subject of continuous exploration in the industry.

Disclosure of Invention

The embodiment of the application provides a display panel, a display screen and electronic equipment, which can realize the narrow frame of a screen on the basis of ensuring that the screen has good working performance.

In a first aspect, the present application provides a display panel comprising:

the flat area comprises a driving structure layer and a first light-emitting structure layer which are arranged in a stacked mode, and the first light-emitting structure layer is electrically connected with the driving structure layer and used for being driven by the driving structure layer to emit light; a kind of electronic device with high-pressure air-conditioning system

The bending area is connected to the periphery of the flat area and bent relative to the flat area, the bending area comprises a second light-emitting structure layer, the second light-emitting structure layer and the first light-emitting structure layer are arranged on the same layer, and the second light-emitting structure layer is electrically connected with the driving structure layer and used for being driven by the driving structure layer to emit light.

It is understood that, since the bending region is connected to the periphery of the flat region, in the display panel, the flat region may be a central region of the display panel, and the bending region may be an edge region of the display panel. While the bending region can be curved with respect to the flat region, i.e., the edge of the display panel can be curved to give the display panel a curved profile.

Illustratively, the inflection region is disposed circumferentially around the flat region and is connected to the periphery of the flat region.

It should be noted that, the division of the flat area and the inflection area represents that the inflection area is a portion of the two which is relatively easy to generate an inflection, and the flat area is a portion of the two which is relatively difficult to generate an inflection, and does not represent that the flat area is not easy to generate an inflection. That is, in the display region, the flat region and the bending region are different in stress that they can withstand when bending, that is, the bending capability of the two is different.

In the technical scheme of the application, the first light-emitting structure layer is arranged in the flat area, so that the flat area can be used as a region capable of emitting light and displaying in the display panel due to the characteristic that the first light-emitting structure layer can be driven by the driving structure layer to emit light. By providing the second light-emitting structure layer in the bending region, the bending region can be a region in the display panel where light-emitting display can be performed due to the characteristic that the second light-emitting structure layer can be driven to emit light by the driving structure layer. Based on the above description, it should be appreciated that the inflection region may form together with the flat region a region in the display panel where light emitting display may be performed, and the light emitting display region of the display panel may extend from the flat region to the inflection region.

Accordingly, the flat area and the bending area can be used for display, and compared with the prior art, the display panel can only display in the flat area, and the area, which can be displayed, of the display panel is enlarged from the area surrounded by the edges of the flat area to the area surrounded by the edges of the bending area. Under this setting, when display panel applied to the display screen, can be on the basis of not changing the size of display screen, because of the expansion of display area, and very big reduction non-display area's width, namely the frame width, and then make narrow frame even no frame become reality, and can also effectively improve the screen and hold up, improve user's use experience.

In addition, the driving structure layer is provided with a plurality of film structures made of inorganic materials, and the density of the inorganic layers is high and the driving structure layer is very compact, so that the driving structure layer is easy to break due to the influence of stress after being bent, and the normal operation of the display panel is further influenced. Therefore, the driving structure layer is arranged in the flat area, so that the whole driving structure layer is located in a relatively flat area with no stress concentration, and the normal operation of the driving structure layer is not influenced under the condition that the edge bending of the display panel is not influenced, and the whole operation reliability of the display panel is improved. The second light-emitting structure layer is arranged in the bending area, so that the second light-emitting structure layer can be well adapted to stress generated by bending when light-emitting display is performed due to the fact that the bending area is provided with less film layer structures made of inorganic materials, the possibility that the film layer structures are broken, wiring arrangement is affected, open circuits or short circuits are caused due to overlarge stress is reduced to the minimum possibility, and the light-emitting display performance of the display panel is effectively guaranteed, and the reliability is good.

It should be noted that the second light-emitting structure layer and the first light-emitting structure layer are formed in the same process, that is, the second light-emitting structure layer and the first light-emitting structure layer are arranged in the same layer, so that the display effect of the second light-emitting structure layer and the first light-emitting structure layer can be relatively consistent and balanced when the second light-emitting structure layer and the first light-emitting structure layer emit light.

In a possible implementation manner, the bending region further includes a circuit layer, where the circuit layer is stacked with the second light-emitting structure layer, and the circuit layer is electrically connected between the second light-emitting structure layer and the driving structure layer.

It can be understood that the second light emitting structure layer is located in the bending region, and the driving structure layer for driving the second light emitting structure layer to emit light is located in the flat region, which are located in different regions in the display region, so that it is difficult to directly realize the conduction of the electrical signal. Therefore, the circuit layer is arranged in the bending region and is electrically connected between the second light-emitting structure layer and the driving structure layer, so that a control signal sent by the driving structure layer positioned in the flat region can be transmitted to the second light-emitting structure layer through the transmission of the circuit layer, and the second light-emitting structure layer is driven to emit light. Under this setting, can prolong the control route of drive structure layer through the connection effect of circuit layer, make the drive structure layer not only can control the luminous in the first luminous structure layer of short distance, can also control the luminous in the second luminous structure layer of longer distance, have the dual function of short distance control and long distance control concurrently, the performance on drive structure layer is excellent.

For example, the line layer may include a data line, and the data line in the bent region may be electrically connected to the data line in the flat region to supply each column of sub-pixels (i.e., a first sub-light emitting unit and a second sub-light emitting unit disposed in the same column hereinafter) in the pixel array. The data line in the bending region may be a diagonal line. It can be understood that, because the data line is located in the bending area, the data line needs to have good bending performance, and the good bending performance can crack and break the line caused by bending, so that the possibility of occurrence of the failure problem of the display panel is reduced to the minimum, and the service life of the display panel is fully ensured.

Alternatively, the data line located at the inflection region may include a first portion and a second portion. The first part is connected with the data line of the flat area, the extending direction of the first part is the same as the bending direction of the bending area, the second part is connected with the first part in a bending way, and one end of the second part, which is far away from the first part, is used for being connected with the driving chip. That is, the data line may be a broken line. With this arrangement, the tension applied to the data line can be minimized, which is advantageous in ensuring that the data line is not broken when bent.

In a possible embodiment, the driving structure layer includes a first conductive layer and a second conductive layer that are stacked, and the second conductive layer is connected between the first conductive layer and the first light emitting structure layer;

the circuit layer is electrically connected with the first conductive layer. The circuit layer and the first conductive layer may be formed by the same process, i.e., the circuit layer and the first conductive layer are disposed on the same layer. With this arrangement, the second light emitting structure layer can be connected to the driving structure layer so that the control signal of the driving structure layer is transmitted to the second light emitting structure layer via the wiring layer.

Or, the circuit layer is electrically connected with the second conductive layer. The circuit layer and the second conductive layer may be formed by the same process, i.e., the circuit layer and the second conductive layer are disposed on the same layer. With this arrangement, the second light emitting structure layer can be connected to the driving structure layer so that the control signal of the driving structure layer is transmitted to the second light emitting structure layer via the wiring layer.

It should be noted that, the connection between the circuit layer and the first conductive layer or the second conductive layer in the driving structure layer can be flexibly selected according to the actual application requirement of the display panel, and only the electrical connection relationship between the circuit layer and the driving structure layer is needed, which is not strictly limited in the embodiment of the present application.

In a possible implementation manner, the first light emitting structure layer has a plurality of first pixel openings, each of the first pixel openings is used for forming one first light emitting unit, and the flat area further includes a first encapsulation layer, and the first encapsulation layer is disposed on the first light emitting structure layer, and covers at least part of surfaces of the plurality of first light emitting units and the first light emitting structure layer.

With this arrangement, the first sub-light emitting unit and the thin film transistor can be protected from oxidation or destruction of water, oxygen or other impurities in the external environment due to the blocking of the first encapsulation layer, and have good protection performance.

Illustratively, the first encapsulation layer may be in the form of a "sandwich" of "inorganic encapsulation layer-organic encapsulation layer-inorganic encapsulation layer", such a structure ensuring a better water-oxygen barrier property of the first encapsulation layer as a whole. Among them, the inorganic encapsulation layer may be formed of an inorganic material such as silicon nitride (SiNx) and/or silicon oxide (SiOx), and the organic encapsulation layer may be formed of an organic material such as an epoxy-based organic material, polymethyl methacrylate, or the like. Of course, the actual number of the first encapsulation layer is not limited to three, and may be one or more, and the number of the encapsulation layers and the layer materials constituting the embodiment of the present application are not strictly limited.

In a possible implementation manner, the flat region further includes a first isolation pillar, where the first isolation pillar is disposed on the first light emitting structure layer and is located at an edge of the first packaging layer.

Therefore, the first isolation column can isolate the first packaging layer, when external water and oxygen invade the first packaging layer from one side of the first isolation column, the external water and oxygen cannot cross the first isolation column and continue to invade because the first packaging layer is isolated at the isolation column, so that the first isolation column can play a role in isolating the water and oxygen, and the inside of the display panel is further protected from being corroded by the water and oxygen.

It should be noted that the number of the first isolation columns may be one or more according to the requirement, and when the number of the first isolation columns is multiple, the plurality of first isolation columns are all disposed at the edge of the first packaging layer to block water and oxygen. In addition, when the first functional layer and the cathode are formed, since deposition of the vapor deposition material has directionality (particles move substantially in a straight line), the first functional layer and the first cathode may be deposited on the surface of the first separator, so that the surface of the first separator is covered with the first functional layer and the first cathode.

In a possible embodiment, the bending region further includes a first flat layer, and the first flat layer is located between the line layer and the second light-emitting structure layer.

Under this setting, first flat layer can cover on the circuit layer, can reduce the mechanical damage of circuit layer, avoids its inside wiring to lead to the fact the damage, cracked problem emergence because of the interference of external environment. And when the wire is bent, stress release can be provided for the wire, the wire is prevented from receiving excessive tensile or compressive stress, and the wire has good protection performance.

Illustratively, the material of the first planarization layer may include one or more of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, and an unsaturated polyester resin, a polystyrene resin, a polyphenylene sulfide resin, and a benzocyclobutene.

In a possible embodiment, the bending region further includes an organic insulating layer, and the organic insulating layer is located on a side of the line layer facing away from the first flat layer.

The organic insulating layer may be formed of an organic material, such as an epoxy resin-based organic material, polymethyl methacrylate, or the like, for example.

It can be understood that the inorganic material is brittle and is easy to break during bending, so that the organic insulating layer made of the organic material can enable fewer inorganic layers to be arranged between the circuit layer and the substrate, and further the film layer structure of the bending region is difficult to break due to the good toughness and ductility of the material during bending, so that the bending region has better bending property and self-adaptability, the service life of the display panel is prolonged, and the working reliability of the display panel is improved.

In a possible implementation manner, the bending region further comprises a substrate, a buffer layer and an inorganic insulating layer, wherein the buffer layer and the inorganic insulating layer are sequentially stacked on the substrate, the organic insulating layer is arranged on one side, away from the buffer layer, of the inorganic insulating layer, the inorganic insulating layer is provided with a first groove penetrating through the inorganic insulating layer, and the buffer layer is provided with a second groove communicated with the first groove;

the organic insulating layer fills the first groove and the second groove, and the organic insulating layer arranged in the second groove is arranged at intervals with the substrate. That is, the second recess may be similar to a blind via structure, which does not penetrate the buffer layer, and the organic insulating layer in the second recess may be spaced from the substrate by the buffer layer.

Or the second groove penetrates through the buffer layer, the organic insulating layer fills the first groove and the second groove, and the organic insulating layer arranged in the second groove is in contact with the substrate.

In the two schemes, the organic insulating layer made of the organic material is used for replacing the etched buffer layer and the etched inorganic insulating layer, so that the ratio of the organic material in the bending region can be increased, less inorganic material is arranged between the circuit layer and the substrate, and further, when the bending region is bent, the film structure of the bending region is not easy to break due to the good toughness and ductility of the material, so that the bending region has better bending property and self-adaptability, the service life of the display panel is prolonged, and the working reliability of the display panel is improved.

In a possible implementation manner, the second light emitting structure layer has a plurality of second pixel openings, each of the second pixel openings is used for forming a second light emitting unit, and the bending region further includes a plurality of sub-packaging structures, and each of the sub-packaging structures covers at least one of the second sub-light emitting units.

It should be noted that, the sub-package structure disposed in the bending region may not completely cover the surface of the second light emitting structure layer, and may not cover the portion where the second sub-light emitting unit is not disposed, so that the sub-package structure covering only the second sub-light emitting unit may form a structure similar to an "island", and the second light emitting structure layer where the sub-package structure is not disposed is exposed between the "island" and the "island". For example, when each sub-package structure covers one second sub-light emitting unit, one sub-package structure may independently constitute an "island" that encapsulates one second sub-light emitting unit, and when each sub-package structure covers two second sub-light emitting units, one sub-package structure may independently constitute an "island" that encapsulates two second sub-light emitting units.

Under the arrangement, the plurality of sub-packaging structures arranged in the bending region can form an island-shaped packaging, and the island-shaped packaging can be different from the whole packaging in the prior art, so that the second light-emitting structure layer is provided with a part which is not covered by the sub-packaging structure, and therefore, the stress born by the bending region during bending can be effectively improved, and the film layer structure of the bending region is prevented from being broken. In addition, the blocking of the packaging structure can also be factored to prevent the second sub-light-emitting unit from being oxidized or damaged by water, oxygen or other impurities in the external environment, so that the second sub-light-emitting unit has good protection performance.

Illustratively, the second encapsulation layer may be in the form of a "sandwich" of "inorganic encapsulation layer-organic encapsulation layer-inorganic encapsulation layer", such a structure ensuring a better water-oxygen barrier property of the second encapsulation layer as a whole. Among them, the inorganic encapsulation layer may be formed of an inorganic material such as silicon nitride (SiNx) and/or silicon oxide (SiOx), and the organic encapsulation layer may be formed of an organic material such as an epoxy-based organic material, polymethyl methacrylate, or the like. Of course, the actual number of the second encapsulation layer is not limited to three, and may be one or more, and the number of the encapsulation layers and the layer materials constituting the embodiment of the present application are not strictly limited.

In a possible implementation manner, the bending region further includes a second isolation pillar, and the second isolation pillar is disposed on the second light-emitting structure layer and located at an edge of the second packaging layer.

Therefore, the second isolation column can isolate the second packaging layer, when external water and oxygen invade the second packaging layer from one side of the second isolation column, the external water and oxygen cannot cross the second isolation column and continuously invade the second packaging layer because the second packaging layer is isolated at the isolation column, so that the second isolation column can play a role in isolating the water and oxygen, and the inside of the display panel is further protected from being corroded by the water and oxygen.

It should be noted that the number of the second isolation columns may be one or more according to the requirement, and when the number of the second isolation columns is multiple, the plurality of second isolation columns are all disposed at the edge of the second packaging layer to block water and oxygen. In addition, when the second functional layer and the cathode are formed, since deposition of the vapor deposition material has directionality (particles move substantially in a straight line), the second functional layer and the second cathode may be deposited on the surface of the second separator, so that the surface of the second separator is covered with the second functional layer and the second cathode.

In a possible embodiment, the first light emitting structure layer includes a plurality of first sub-light emitting units, each of which has a color of red, green or blue, the second light emitting structure layer includes a plurality of second sub-light emitting units, each of which has a color of red, green or blue, and the driving structure layer includes a plurality of pixel driving circuits;

each pixel driving circuit drives one of the first sub-light emitting units to emit light; or alternatively, the process may be performed,

each pixel driving circuit drives one second sub-light-emitting unit to emit light; or alternatively, the process may be performed,

each pixel driving circuit drives at least two first sub-light-emitting units with the same color to emit light; or alternatively, the process may be performed,

Each pixel driving circuit drives at least two second sub-light emitting units with the same color to emit light; or alternatively, the process may be performed,

each pixel driving circuit drives at least one first sub-light emitting unit and at least one second sub-light emitting unit of the same color to emit light.

Based on the above description, it should be understood that the pixel driving circuit may drive the first sub-light emitting unit to emit light, the second sub-light emitting unit to emit light, and the first sub-light emitting unit and the second sub-light emitting unit to emit light, and may be configured to drive the first sub-light emitting unit to emit light of any color, or drive the second sub-light emitting unit to emit light of any color, or drive the first sub-light emitting units to emit light of multiple same colors, or drive the second sub-light emitting units to emit light of multiple same colors, or drive the first sub-light emitting unit and the second sub-light emitting unit of one or multiple same colors, where the driving manner may be adjusted accordingly according to the change of the actual application scenario, and the diversification of the driving type is beneficial to adapt to the application requirement under multiple scenarios, and the reliability is better.

In a second aspect, the present application further provides a display screen, where the display screen includes a cover plate and the display panel as described above, and the cover plate is attached to the display panel.

In a third aspect, the application also provides an electronic device comprising a display screen as described above.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is an exploded view of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic view illustrating an angle of a display panel according to an embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of a display panel according to an embodiment of the present application;

fig. 5 is a schematic diagram of a display panel according to an embodiment of the present application;

fig. 6 is another schematic diagram of a display panel provided by an embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of a display panel according to an embodiment of the present application;

FIG. 8 is a schematic cross-sectional view of a portion of a display panel according to an embodiment of the present application;

FIG. 9 is a schematic partial cross-sectional view of a display panel according to an embodiment of the present application;

fig. 10 is a schematic diagram of a first functional layer of a display panel according to an embodiment of the present application;

FIG. 11 is a schematic illustration of a display panel provided in accordance with an embodiment of the present application;

fig. 12 is a schematic diagram of a second functional layer of the display panel according to the embodiment of the present application;

Fig. 13 is a schematic diagram of a display panel according to an embodiment of the present application.

Detailed Description

For convenience of understanding, terms involved in the embodiments of the present application will be explained first.

And/or: merely one association relationship describing the associated object, the representation may have three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone.

A plurality of: refers to two or more.

And (3) connection: it is to be understood in a broad sense that, for example, a is linked to B either directly or indirectly via an intermediary.

The following description of the embodiments of the present application will be made with reference to the accompanying drawings.

With the development of display technology, flexible display screens are increasingly used in screens due to their excellent flexibility and adaptability. Currently, there is a non-display area, i.e., a frame, of a certain width around the display area of the screen. The existing frame is wider, is difficult to continue to optimize, is easy to cause the reduction of the screen duty ratio, and influences the appearance of the screen and the use experience of a user.

Based on this, referring to fig. 1 to 13, the embodiment of the application provides a display panel 100, a display screen 200 and an electronic device 300, which can increase the area of a display area on the basis of ensuring that a screen has good working performance, thereby effectively increasing the screen occupation ratio, realizing the narrow frame of the screen and improving the use experience of a user, and will be described in detail below.

Referring to fig. 1, an electronic device 300 may include a housing 310 and a display screen 200. The housing 310 serves as a structural load bearing member of the electronic device 300 for mounting the display screen 200, as well as housing or mounting other components such as a circuit board assembly. The display screen 200 may be used to display text, images, video, and the like. Illustratively, the display screen 200 may be a curved screen whose edges are curved to form a curved surface. That is, the display screen 200 may be a flexible display screen.

The electronic device 300 may be, but is not limited to, an intelligent consumer electronic device such as a mobile phone, a tablet computer, a notebook computer, or a wearable electronic device such as an augmented reality (augmented reality, AR), a Virtual Reality (VR), a smart watch, a smart bracelet, or a vehicle-mounted device such as a car machine.

The display screen 200 may be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini-led (mini organic lightemitting diode) display screen, a micro-led (micro organic light-emitting diode) display screen, a micro-organic led (micro organic light-emitting diode) display screen, a quantum dot led (quantum dot light emitting diodes, QLED) display screen.

It should be noted that, the display screen 200 is not only suitable for the electronic device 300 described above, but also suitable for any device that needs to display text, images, video, etc., which is not strictly limited by the embodiment of the present application.

Referring to fig. 1 and 2 in combination, the display screen 200 may include a cover 210 and a display panel 100, where the cover 210 is attached to the display panel 100, and the display panel 100 is enclosed by the cover 210 and a housing 310. The cover plate 210 serves to protect the display panel 100, which may provide a user with tactile and force feedback when the user touches. The display panel 100 may be a flexible display panel, that is, it may have flexibility and be adapted to be bent. The shape of the cover 210 may be adapted to the shape of the display panel 100, for example, when the display panel 100 is a curved panel, the cover 210 may be a curved cover.

The detailed structure of the display panel 100 will be described below with reference to fig. 3 to 13.

Referring to fig. 3, 4, 5 and 6 in combination, the display panel 100 may include a display area 10 and an edge area 40. The display area 10 may be an area capable of displaying images in the display panel 100, and the edge of the display area may be curved with a predetermined curvature according to the application scene requirement of the display panel 100, so that the display panel 100 may take the form of a curved panel. The edge area 40 may be an area of the display panel 100 where no image is displayed, and the edge area 40 is connected to the display area 10 and located at the periphery of the display area 10, and may bend to the back of the display area 10 following the bending of the display area 10.

Therefore, by bending the display area 10 of the display panel 100 and setting the edge area 40 (non-display area) of the display panel 100 on the back of the display area 10, the outline of the display area 10 is the outline of the display screen 200, and under the setting, no other structures except the display area 10 occupy the display space, so that the whole surface of the display screen 200 can display images, the device applying the display panel 100 can realize the full-screen display on the front of the device, and further the ultra-narrow frame or even the frame-free display becomes reality, so that the market competitiveness of the product is effectively improved, and the use experience of the user can be improved.

In the above description, the outline of the display screen 200 is independently configured by the outline of the display surface of the display area 10, that is, the whole surface of the display screen 200 displays an image, but in practical application of the display panel 100, a part of the surface of the edge area 40 may occupy a certain surface of the display screen 200. That is, some of the display surfaces (surfaces facing the user when the user holds the electronic device 300) of the display screen 200 may have surfaces (such as surfaces near edges) that do not display images. It is only required that the display area 10 has a flat portion and a bent portion, and the embodiment of the present application is not limited thereto.

Illustratively, with the placement direction of the display panel 100 shown in fig. 5 and 6 as a reference direction, four sides of the display area 10 are divided into an upper side 101, a lower side 102, a left side 103 and a right side 104, and the four sides of the display area 10 can be bent to form an arc surface.

The edge area 40 may be connected to three sides of the lower side 102, the left side 103, and the right side 104 of the display area 10 as shown in fig. 5, or the edge area 40 may be connected to the upper side 101, the lower side 102, the left side 103, and the right side 104 of the display area 10 as shown in fig. 6. The edge region 40 disposed at the lower side 102 may be a region in the display panel 100 where pads and circuit elements are disposed, for example, as shown in fig. 7, a flexible circuit board 50 (Flexible Printed Circuit, FPC) may be disposed at an end of the edge region 40 disposed at the lower side 102 remote from the display region 10, and a driving chip 60 may be disposed at the edge region 40 disposed at the lower side 102 and electrically connected to the flexible circuit board 50. As shown in fig. 5 and 6, the edge regions 40 disposed at the left and right sides 103 and 104 may be regions in the display panel 100 where wirings and the driving circuit 70 for driving the screen are disposed, for example, the driving circuit may be a GOA (Gate on Array) driving circuit.

It should be noted that, the connection position between the edge area 40 and the display area 10 is not limited to the above-mentioned manner, and the edge area 40 may be connected to any one, any two, any three or each of four sides of the display area 10 according to practical application requirements, and the key design of the embodiment of the present application is not limited to the edge area 40, and the specific structure and connection position of the edge area 40 are not strictly limited.

Referring to fig. 3 and 8 in combination, the display area 10 includes a flat area 20 and a bending area 30, and the bending area 30 is connected around the flat area 20 in a bending manner. That is, inflection region 30 is connected to flat region 20 and is inflection with respect to flat region 20. In other words, the flat region 20 is disposed at an angle to the inflection region 30, and the angle of the included angle may be in the range of 90 ° to 180 ° (including the end points 90 ° and 180 °).

The bending region 30 may be understood as a region capable of bending in the display region 10, and the flat region 20 may be understood as a region relatively flat and not capable of bending in the display region 10. When the bending region 30 bends relative to the flat region 20 about its bending axis (which can be understood as the rotation center line of the bending region 30, about which the bending region 30 can perform bending motion), the bending region 30 can take an arc-shaped state, and the dimension of the display panel 100 in the horizontal direction can be reduced.

It is understood that, since the bending region 30 is connected to the periphery of the flat region 20, in the display panel 100, the flat region 20 may be a central region of the display panel 100, and the bending region 30 may be an edge region of the display panel 100. While the inflection region 30 is capable of bending with respect to the flat region 20, i.e., the edge of the display panel 100 may be bent to make the display panel 100 take on a curved profile.

Illustratively, as shown in FIG. 3, the inflection region 30 is disposed circumferentially around the flat region 20 and is connected to the periphery of the flat region 20.

Note that, the division of the flat region 20 and the inflection region 30 represents that the inflection region 30 is a portion of the two that is relatively easy to be buckled, and the flat region 20 is a portion of the two that is relatively difficult to be buckled, which does not represent that the flat region 20 is not buckled. That is, in the display area 10, the flat area 20 and the bending area 30 are different in stress that they can withstand when bending, that is, the bending capability of the two areas is different.

The film structure of the flat region 20 and the inflection region 30 will be described in detail with reference to fig. 8 to 13.

Referring to fig. 8, the flat region 20 includes a substrate 21, a buffer layer 22, an inorganic insulating layer 26, a driving structure layer 23, a first light emitting structure layer 24 and a first encapsulation layer 25.

The substrate 21 may be a flexible substrate, and by using a flexible substrate, the flat region 20 can have good extensibility, and can provide strong support for the curved surface of the display screen 200.

Illustratively, the material of the substrate 21 may include one or more of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polysilane, polysiloxane, polysilazane, polycarbosilane, polyacrylate, polymethyl acrylate, polymethacrylate, polymethyl methacrylate, polyethyl acrylate, polyethyl methacrylate, cyclic Olefin Copolymer (COC), cyclic Olefin Polymer (COP), polyethylene (PE), polypropylene (PP), polyimide (PI), polymethyl methacrylate (PMMA), polystyrene (PS), polyacetal (POM; polyoxyethylene), polyetheretherketone (PEEK), polyester Sulfone (PEs), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polycarbonate (PC), polyvinylidene fluoride (PVDF), perfluoroalkyl Polymer (PFA), styrene acrylonitrile copolymer (SAN).

The buffer layer 22 is disposed on the substrate 21. On the one hand, penetration of moisture or other impurities in the external environment into the display panel 100 through the substrate 21 can be suppressed. On the other hand, the buffer layer 22 may planarize the surface of the substrate 21, which is advantageous for improving the yield of the display panel 100.

An inorganic insulating layer 26 is disposed on the buffer layer 22. For example, the inorganic insulating layer 26 may have a single-layer/multi-layer structure made of silicon oxide (SiOx), or the inorganic insulating layer 26 may have a single-layer/multi-layer structure made of silicon nitride (SiNx).

A portion of the driving structure layer 23 is disposed on the buffer layer 22 and a portion thereof is disposed on the inorganic insulating layer 26, and the driving structure layer 23 is used to drive the first light emitting structure layer 24 to emit light. The driving structure layer 23 may include a semiconductor layer 231 disposed on the buffer layer 22 and covered by the inorganic insulating layer 26, a first gate metal layer 232 disposed on the inorganic insulating layer 26, a first insulating layer 233 disposed on the inorganic insulating layer 26 and covering the first gate metal layer 232, a second gate metal layer 234 disposed on the first insulating layer 233, a second insulating layer 235 disposed on the first insulating layer 233 and covering the second gate metal layer 234, a first conductive layer 236 disposed on the second insulating layer 235, a second planarization layer 237 disposed on the second insulating layer 235 and covering the first conductive layer 236, a second conductive layer 238 disposed on the second planarization layer 237, and a third planarization layer 239 disposed on the second planarization layer 237 and covering the second conductive layer 238.

Specifically, the semiconductor layer 231 may include a source region for connection with the source electrode 2361 of the first gate metal layer 232, a drain region for connection with the drain electrode 2362 of the first gate metal layer 232, and a channel region connected between the source region and the drain region. Illustratively, the material of the semiconductor layer 231 may include one or more of indium tin gallium zinc oxide (InSnGaZnO), indium gallium zinc oxide (InGaZnO), indium tin zinc oxide (insnzzno), tin gallium zinc oxide (SnGaZnO), aluminum gallium zinc oxide (AlGaZnO), indium aluminum zinc oxide (inaldo), tin aluminum zinc oxide (snaldo), indium zinc oxide (InZnO), tin zinc oxide (SnZnO), aluminum zinc oxide (AlZnO), zinc magnesium oxide (ZnMgO), tin magnesium oxide (SnMgO), indium magnesium oxide (InMgO), indium gallium oxide (InGaO), indium oxide (InO), tin oxide (SnO), zinc oxide (ZnO), and the like.

In addition, by providing the inorganic insulating layer 26 between the semiconductor layer 231 and the first gate metal layer 232, the semiconductor layer 231 and the first gate metal layer 232 can be isolated from each other so that a current flowing through the semiconductor layer 231 does not flow to the first gate metal layer 232, thereby facilitating the normal flow of an electric signal.

The first gate metal layer 232 may include a gate electrode and a first capacitance electrode. Illustratively, the first gate metal layer 232 may include copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), or an alloy of the foregoing materials.

The first insulating layer 233 can space the first gate metal layer 232 and the second gate metal layer 234 apart to insulate them from each other, so that they have good electrical properties. The first insulating layer 233 may be an inorganic insulating layer, for example, the first insulating layer 233 may be a single-layer/multi-layer structure composed of silicon oxide (SiOx), or the first insulating layer 233 may be a single-layer/multi-layer structure composed of silicon nitride (SiNx).

The second gate metal layer 234 may include a second capacitive electrode. Illustratively, the second gate metal layer 234 may include copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), or an alloy of the foregoing materials.

The second insulating layer 235 can space the second gate metal layer 234 from the first conductive layer 236 to insulate the two from each other. The second insulating layer 235 may be an inorganic insulating layer, for example, the second insulating layer 235 may be a single layer/multilayer structure composed of silicon oxide (SiOx), or the second insulating layer 235 may be a single layer/multilayer structure composed of silicon nitride (SiNx).

The first conductive layer 236 may also be referred to as a first source drain metal layer (SD 1), and the first conductive layer 236 may include a source electrode 2361 and a drain electrode 2362. The source electrode 2361 may be connected to the source electrode 2361 region of the semiconductor layer 231 through a first metal via hole 2363 penetrating the inorganic insulating layer 26, the first insulating layer 233, and the second insulating layer 235. The drain electrode 2362 may be connected to the drain electrode 2362 region of the semiconductor layer 231 through a second metal via hole 2364 penetrating the inorganic insulating layer 26, the first insulating layer 233, and the second insulating layer 235. The first metal via 2363 and the second metal via 2364 may be understood as an electrical connection structure having conductive properties formed by filling a conductive metal in a hole type structure. Illustratively, the material of the first conductive layer 236 may include copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), or an alloy of the foregoing materials.

It is understood that the source electrode 2361 of the first conductive layer 236, the drain electrode 2362 of the first conductive layer 236, the gate electrode of the first gate metal layer 232, and the semiconductor layer 231 may collectively form a thin film transistor, which is a part of a structure constituting a pixel driving circuit for driving and controlling light emission or display of the light emitting unit, and may include a driving transistor and a switching transistor. The first capacitance electrode of the first gate metal layer 232 and the second capacitance electrode of the second gate metal layer 234 may collectively form a storage capacitance, which is a part of a structure constituting a pixel driving circuit for driving and controlling light emission or display of the light emitting unit. In addition, by providing a plurality of insulating layers between the source electrode 2361, the drain electrode 2362, and the gate electrode, the source electrode 2361, the drain electrode 2362, and the gate electrode can be insulated from each other, which is advantageous in ensuring that the electrical performance of the thin film transistor is not affected, and reliability is good.

It should be noted that, in practical application of the display panel 100, a plurality of thin film transistors and a plurality of storage capacitors may be formed on the driving structure layer 23, and each thin film transistor and the corresponding storage capacitor form a pixel driving circuit, so the driving structure layer 23 actually has a plurality of pixel driving circuits.

Based on the above description, it should be understood that the driving structure layer 23 has a multi-layered film structure composed of an inorganic material, and the driving structure layer 23 is easily broken due to stress after being bent due to the high density of the inorganic layer and is very dense, thereby affecting the normal operation of the display panel 100. Therefore, by arranging the flat region 20 on the driving structure layer 23, the driving structure layer 23 can be entirely located in a relatively flat region with no stress concentration, so that the normal operation of the driving structure layer 23 is not affected without affecting the bending of the edge of the display panel 100, and the improvement of the overall operational reliability of the display panel 100 is facilitated.

With continued reference to fig. 8, the second planarization layer 237 may cover the thin film transistor, and may serve to protect the thin film transistor, mitigate steps caused by disposing the thin film transistor, and reduce parasitic capacitance generated between the thin film transistor and other circuits and devices. Illustratively, the material of the second planarization layer 237 may include one or more of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, and an unsaturated polyester resin, a polystyrene resin, a polyphenylene sulfide resin, and a benzocyclobutene.

The second conductive layer 238 may also be referred to as a second source drain metal layer (SD 2), the second conductive layer 238 is stacked with the first conductive layer 236 and connected between the first conductive layer 236 and the first light emitting structure layer 24, the second conductive layer 238 may include a connection electrode 2381, and the connection electrode 2381 may be connected to the drain electrode 2362 of the first conductive layer 236 through a third metal via hole 2382 provided in the second planarization layer 237. The third metal via 2382 may be understood as an electrical connection structure having conductive properties formed by filling a conductive metal in a hole type structure. Illustratively, the material of the second conductive layer 238 may include copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), or an alloy of the foregoing materials.

It should be noted that the first conductive layer 236 and the second conductive layer 238 may further include signal lines (e.g., gate lines, data lines, etc.).

The third planarization layer 239 may cover the second conductive layer 238 and may function to protect the second conductive layer 238. Illustratively, the material of the third flat layer 239 may include one or more of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, and unsaturated polyester resin, polystyrene resin, polyphenylene sulfide resin, and benzocyclobutene.

Referring to fig. 8, 9 and 10, the first light emitting structure layer 24 is disposed on the third flat layer 239, and the first light emitting structure layer 24 is electrically connected to the driving structure layer 23 and is used for being driven by the driving structure layer 23 to emit light. By providing the first light emitting structure layer 24 in the flat region 20, the flat region 20 can be a region in the display panel 100 where light emission display is possible due to the characteristic that the first light emitting structure layer 24 can be driven by the driving structure layer 23 to emit light.

Specifically, the first light emitting structure layer 24 includes a first anode electrode 241, a first pixel defining layer 242, a first functional layer 243, and a first cathode electrode 244.

The first anode 241 is provided on the third planarization layer 239, and the first anode 241 can provide holes to the first functional layer 243 and can be connected to the connection electrode 2381 through a fourth metal via provided in the third planarization layer 239. The fourth metal via hole is understood as an electrical connection structure with conductive performance formed by filling conductive metal in the hole structure. Illustratively, the material of the first anode 241 may include Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), and the like.

The first pixel defining layer 242 is disposed on the third planarization layer 239 and covers the first anode electrode 241, the first pixel defining layer 242 has a first pixel opening 2421, and the first pixel opening 2421 exposes a portion of the first anode electrode 241.

At least a portion of the first functional layer 243 is disposed at the first pixel opening 2421 and connected to the first anode electrode 241, and the first functional layer 243 is for emitting light. As shown in fig. 10, the first functional layer 243 may include a hole injection layer 2431 (HIL), a hole transport layer 2432 (HTL), a light emitting layer 2433, an electron transport layer 2434 (ETL), and an electron injection layer 2435 (EIL).

The hole injection layer 2431 is disposed on the first anode 241 to facilitate hole injection of the first anode 241. The hole transport layer 2432 is provided on the hole injection layer 2431 to efficiently transport holes to the light emitting layer 2433. The light emitting layer 2433 is provided over the hole transporting layer 2432, and the light emitting layer 2433 may emit light of a specific color through a material capable of emitting light of a specific color, for example, may emit red light through a material capable of emitting red light, may emit green light through a material capable of emitting green light, and may emit blue light through a material capable of emitting blue light. The material of the light-emitting layer 2433 may include organic small molecule light-emitting materials, complex light-emitting materials, high molecular polymers, and the like. An electron transport layer 2434 may be disposed on the light emitting layer 2433 to efficiently transport electrons to the light emitting layer 2433. An electron injection layer 2435 can be disposed between electron transport layer 2434 and first cathode 244 to facilitate electron injection at first cathode 244.

It will be appreciated that the thin film transistor may input an anode voltage to the first anode 241 and a cathode voltage to the first cathode 244, whereby holes injected from the first anode 241 and electrons injected from the first cathode 244 are recombined in the first functional layer 243 to generate excitons (electron-hole pairs) under the driving of an external voltage, and the excitons radiate to de-excite photons to generate visible light, wherein the light emission color depends on the type of organic molecules of the light emitting layer, and the light emission brightness or intensity depends on the performance of the light emitting material and the magnitude of the applied current.

Referring to fig. 8, a first cathode 244 is disposed on the first functional layer 243, at least a portion of the first cathode 244 is located at the first pixel opening 2421, and the first cathode 244 is capable of providing electrons to the first functional layer 243. Illustratively, the material of the first cathode 244 may include magnesium (Mg), silver magnesium (Ag: mg), indium Tin Oxide (ITO), indium Zinc Oxide (IZO), indium Tin Zinc Oxide (ITZO), zinc oxide (ZnO), tin Oxide (TO).

In an embodiment of the present application, the first anode 241, the first functional layer 243, and the first cathode 244 may collectively form a first sub-light emitting unit 245, and the first sub-light emitting unit 245 is electrically connected to the thin film transistor, and is capable of emitting light or displaying light under the driving and control of the pixel driving circuit.

It should be noted that, in fig. 8 only illustrates one first sub-light emitting unit 245, however, in practical application of the display panel 100, the number of the first pixel openings 2421 is plural, that is, the first pixel defining layer 242 has plural first pixel openings 2421, and each first pixel opening 2421 has one first sub-light emitting unit 245 formed therein, so the first light emitting structure layer 24 actually has plural first sub-light emitting units 245.

In addition, referring to fig. 10, the color of each first sub-light emitting unit 245 includes red (R), green (G) or blue (B). That is, when the color of the first sub-light emitting unit 245 is red, it can emit red light under the driving of the pixel driving circuit, which may be referred to as a red sub-pixel R. When the color of the first sub-light emitting unit 245 is green, it can emit green light under the driving of the pixel driving circuit, which may be referred to as a green sub-pixel G. When the color of the first sub-light emitting unit 245 is blue, it can emit blue light under the driving of the pixel driving circuit, which may be referred to as a blue sub-pixel B.

In other words, the first pixel defining layer 242 defines a plurality of first sub-light emitting units 245 having different colors. The plurality of red first sub-light emitting units 245 (capable of emitting red light), the plurality of green first sub-light emitting units 245 (capable of emitting green light), and the plurality of blue first sub-light emitting units 245 (capable of emitting blue light) are arranged in an array.

In one possible implementation, each pixel driving circuit drives one of the first sub-light emitting units 245 to emit light, so that a 1-driving 1 driving mode can be formed. Specifically, each pixel driving circuit may drive one red first sub-light emitting unit 245 to emit light, or may drive one green first sub-light emitting unit 245 to emit light, or may drive one blue first sub-light emitting unit 245 to emit light.

In another possible implementation, each pixel driving circuit drives at least two first sub-light emitting units 245 with the same color to emit light, so a driving mode of 1 driving N can be formed. Specifically, each pixel driving circuit may drive at least two red first sub-light emitting units 245 to emit light, or may drive at least two green first sub-light emitting units 245 to emit light, or may drive at least two blue first sub-light emitting units 245 to emit light.

Based on the above description, it should be understood that the pixel driving circuit may be configured to drive the first sub-light emitting units 245 with any color to emit light or drive the plurality of first sub-light emitting units 245 with the same color to emit light according to the need, the driving manner may be adjusted accordingly according to the change of the actual application scene, and the diversification of the driving type is beneficial to adapting to the application requirements under multiple scenes, with better reliability.

Referring to fig. 8, the first encapsulation layer 25 is disposed on the first light emitting structure layer 24, and the first encapsulation layer 25 covers a part or all of the surfaces of the plurality of first sub-light emitting units 245 and the first light emitting structure layer 24. With this arrangement, the first sub-light emitting unit 245 and the thin film transistor can be protected from oxidation or destruction of water, oxygen or other impurities in the external environment due to the blocking of the first encapsulation layer 25, and have good protection performance.

Illustratively, the first encapsulation layer 25 may be in the form of a "sandwich" of "inorganic encapsulation layer-organic encapsulation layer-inorganic encapsulation layer", and such a structure ensures a good water-oxygen barrier property of the first encapsulation layer 25 as a whole. Among them, the inorganic encapsulation layer may be formed of an inorganic material such as silicon nitride (SiNx) and/or silicon oxide (SiOx), and the organic encapsulation layer may be formed of an organic material such as an epoxy-based organic material, polymethyl methacrylate, or the like. Of course, the actual number of layers of the first encapsulation layer 25 is not limited to three, and may be one or more layers, and the number of layers and the layer materials constituting the encapsulation layer are not strictly limited to the embodiment of the present application.

In one possible embodiment, as shown in fig. 8, the flat region 20 further includes a first isolation pillar 26, where the first isolation pillar 26 is disposed on the first light emitting structure layer 24 and located at an edge of the first encapsulation layer 25. Therefore, the first isolation column 26 can isolate the first encapsulation layer 25, and when external water and oxygen invade the first encapsulation layer 25 from the first isolation column 26, the external water and oxygen cannot cross the first isolation column 26 and continue to invade because the first encapsulation layer 25 is isolated at the isolation column, so that the first isolation column 26 can play a role in isolating the water and oxygen, and the inside of the display panel 100 is further protected from being corroded by the water and oxygen.

It should be noted that the number of the first isolation pillars 26 may be one or more according to the requirement, and when the number of the first isolation pillars 26 is plural, the plurality of first isolation pillars 26 are disposed at the edge of the first encapsulation layer 25 to block water and oxygen. In addition, when the first functional layer 243 and the first cathode 244 are formed, since the deposition of the vapor deposition material has directionality (particles move substantially in a straight line), the first functional layer 243 and the first cathode 244 may be deposited on the surface of the first barrier rib 26, so that the surface of the first barrier rib 26 is covered with the first functional layer 243 and the first cathode 244.

The film structure of the flat region 20 is described above, and the film structure of the inflection region 30 will be described in detail with reference to fig. 8, 9, 11, 12 and 13.

Referring to fig. 8 and 9 in combination, the bending region 30 includes a substrate 21, a buffer layer 22, an inorganic insulating layer 26, an organic insulating layer 31, a circuit layer 32, a first planarization layer 33, a second light-emitting structure layer 34, and a second encapsulation layer 35 sequentially stacked on the substrate 21. The specific description of the substrate 21, the buffer layer 22, and the inorganic insulating layer 26 can be referred to the foregoing description, and will not be repeated here.

The organic insulating layer 31 is provided on the inorganic insulating layer 26, and a portion of the organic insulating layer 31 is located in the inorganic insulating layer 26 and the buffer layer 22, wherein the portion of the organic insulating layer 31 is located in the inorganic insulating layer 26 and the buffer layer 22, that is, includes a case where the organic insulating layer 31 penetrates the inorganic insulating layer 26 and does not penetrate the buffer layer 22 so as not to be in direct contact with the substrate 21 by the interval of the buffer layer 22, and a case where the organic insulating layer 31 penetrates the inorganic insulating layer 26 and the buffer layer 22 so as to be in direct contact with the substrate 21.

Specifically, the inorganic insulating layer 26 has a first recess 261, and the first recess 261 penetrates the inorganic insulating layer 26. The buffer layer 22 has a second groove 221, the second groove 221 penetrates or does not penetrate the buffer layer 22, the second groove 221 communicates with the first groove 261, and the organic insulating layer 31 fills the first groove 261 and the second groove 221. As shown in fig. 9, when the second groove 221 penetrates the buffer layer 22, the organic insulating layer 31 is in direct contact with the substrate 21. As shown in fig. 8, when the second groove 221 does not penetrate the buffer layer 22, the organic insulating layer 31 is spaced apart from the substrate 21 by the buffer layer 22. In addition, the inner diameter of the first groove 261 may be larger than that of the second groove 221, so that the connection between the first groove 261 and the second groove 221 is stepped. The organic insulating layer 31 may be formed of an organic material, such as an epoxy resin-based organic material, polymethyl methacrylate, or the like, for example.

It can be understood that the buffer layer 22 and the inorganic insulating layer 26 may be made of inorganic materials, and the inorganic materials are brittle and are easy to break during bending, so that the organic insulating layer 31 made of organic materials replaces the etched part of the buffer layer 22 and the inorganic insulating layer 26, the ratio of the organic materials in the bending region 30 can be increased, so that less inorganic materials are provided between the circuit layer 32 and the substrate 21, and further the film structure of the bending region 30 is difficult to break due to the material with good toughness and ductility when the bending region 30 is bent, so that the bending region 30 has better bending property and adaptability, which is beneficial to prolonging the service life of the display panel 100 and improving the working reliability of the display panel 100.

The circuit layer 32 is disposed on the organic insulating layer 31, and the circuit layer 32 is electrically connected between the second light emitting structure layer 34 and the driving structure layer 23, so as to realize electrical connection between the second light emitting structure layer 34 and the driving structure layer 23, so that the second light emitting structure layer 34 can be driven by the driving structure layer 23 to perform a light emitting action.

It can be understood that the second light emitting structure layer 34 is located in the bending region 30, and the driving structure layer 23 for driving the second light emitting structure layer 34 to emit light is located in the flat region 20, which are located in different regions in the display region 10, so that it is difficult to directly conduct the electrical signal. Thus, by providing the wiring layer 32 in the inflection region 30 and electrically connecting the wiring layer 32 between the second light emitting structure layer 34 and the driving structure layer 23, the control signal emitted from the driving structure layer 23 located in the flat region 20 can be transmitted to the second light emitting structure layer 34 via the transmission of the wiring layer 32, and the second light emitting structure layer 34 can be driven to emit light. With this arrangement, the control path of the driving structure layer 23 can be extended by the connection of the wiring layer 32, so that the driving structure layer 23 can control not only the first light emitting structure layer 24 having a short distance to emit light, but also the second light emitting structure layer 34 having a long distance to emit light, and the dual functions of short distance control and long distance control are achieved, and the driving structure layer 23 is excellent in performance.

In one possible implementation, the wiring layer 32 is electrically connected to the first conductive layer 236. The circuit layer 32 and the first conductive layer 236 may be manufactured by the same process, i.e., the circuit layer 32 and the first conductive layer 236 are disposed on the same layer. With this arrangement, the second light emitting structure layer 34 can be connected to the driving structure layer 23 so as to transmit a control signal of the driving structure layer 23 to the second light emitting structure layer 34 via the wiring layer 32.

In another possible embodiment, the wiring layer 32 is electrically connected to the second conductive layer 238. The circuit layer 32 and the second conductive layer 238 may be formed by the same process, i.e., the circuit layer 32 and the second conductive layer 238 are disposed on the same layer. With this arrangement, the second light emitting structure layer 34 can be connected to the driving structure layer 23 so as to transmit a control signal of the driving structure layer 23 to the second light emitting structure layer 34 via the wiring layer 32.

It should be noted that, the connection between the circuit layer 32 and the first conductive layer 236 or the second conductive layer 238 in the driving structure layer 23 may be flexibly selected according to the practical application requirement of the display panel 100, and only the electrical connection between the circuit layer 32 and the driving structure layer 23 is required, which is not strictly limited in the embodiment of the present application.

Illustratively, the wiring layer 32 may include a plurality of traces, each electrically connected between the first light emitting structure layer 24 and the second light emitting structure layer 34. For example, the trace may be a data line and electrically connected to a data line (which may be located in the first conductive layer or the second conductive layer in particular) located in the flat region, thereby supplying pixels of each column in the pixel array.

Illustratively, the trace may be formed of a conductive material having excellent ductility, such as gold (Au), silver (Ag), or aluminum (Al), or may be formed of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and silver (Ag) and magnesium (Mg). The trace may be a single-layer structure, or may be a multi-layer structure of various conductive materials, such as a three-layer structure of titanium (Ti)/aluminum (Al)/titanium (Ti), which is not limited.

Referring to fig. 8, the first planarization layer 33 is disposed on the circuit layer 32 and is located between the circuit layer 32 and the second light emitting structure layer 34. With this arrangement, the first planarization layer 33 can cover the circuit layer 32, so as to reduce mechanical damage of the circuit layer 32 and avoid damage and breakage of the internal wiring caused by interference of external environment. And when the wire is bent, stress release can be provided for the wire, the wire is prevented from receiving excessive tensile or compressive stress, and the wire has good protection performance.

Illustratively, the material of the first planarization layer 33 may include one or more of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, and an unsaturated polyester resin, a polystyrene resin, a polyphenylene sulfide resin, and a benzocyclobutene. The first flat layer 33 and the second flat layer 237 may be manufactured by the same process, i.e., the first flat layer 33 and the second flat layer 237 are disposed on the same layer. Alternatively, the first planarization layer 33 and the third planarization layer 239 may be manufactured through the same process, i.e., the first planarization layer 33 and the third planarization layer 239 are disposed on the same layer.

Referring to fig. 8, the second light emitting structure layer 34 is disposed on the first flat layer 33, and the second light emitting structure layer 34 is electrically connected to the driving structure layer 23 and is used for being driven by the driving structure layer 23 to emit light. It should be appreciated that the driving structure layer 23 is not only capable of driving the first light emitting structure layer 24 to emit light, but it is also capable of driving the second light emitting structure layer 34 to emit light.

It should be noted that the second light emitting structure layer 34 and the first light emitting structure layer 24 may be formed in the same process, that is, they may be disposed in the same layer, so that the display effect of the two light emitting structures can be relatively consistent and balanced when they emit light.

By providing the second light-emitting structure layer 34 in the bending region 30, the bending region 30 can be a region in the display panel 100 where light emission display is possible due to the characteristic that the second light-emitting structure layer 34 can be driven to emit light by the driving structure layer 23. Based on the above description, it should be understood that the inflection region 30 and the flat region 20 may together form a region in the display panel 100 where light emitting display may be performed, and the light emitting display region of the display panel 100 may extend from the flat region 20 to the inflection region 30.

Accordingly, both the flat region 20 and the folded region 30 can be used for display, and the area surrounded by the edge of the flat region 20 in the display panel 100 can be enlarged to the area surrounded by the edge of the folded region 30, compared to the conventional display in which only the flat region 20 can be displayed. Under this setting, when the display panel 100 is applied to the display screen 200, the width of the non-display area, that is, the frame width, can be greatly reduced due to the expansion of the display area on the basis of not changing the size of the display screen 200, so that a narrow frame or even no frame becomes a reality, the screen occupation ratio can be effectively improved, and the use experience of a user is improved.

In addition, the second light-emitting structure layer 34 is disposed in the bending region 30, so that the bending region 30 has a smaller number of film structures made of inorganic materials, and the second light-emitting structure layer 34 can well adapt to stress generated by bending while performing light-emitting display, so that the possibility of occurrence of problems such as breakage of the film structure, influence on routing arrangement, disconnection or short circuit caused by overlarge stress is reduced to the minimum, and the light-emitting display performance and reliability of the display panel 100 are effectively ensured.

Referring to fig. 8, 9 and 12 in combination, specifically, the second light emitting structure layer 34 includes a second anode 341, a second pixel defining layer 342, a second functional layer 343 and a second cathode 344.

The second anode 341 is disposed on the first flat layer 33, and the second anode 341 is capable of providing holes to the second functional layer 343. Illustratively, the material of the second anode 341 may include Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), and the like. The second anode 341 may be in the form of a lead wire and is electrically connected to the first anode 241.

The second pixel defining layer 342 is disposed on the first planarization layer 33 and covers the second anode 341, the second pixel defining layer 342 has a second pixel opening 3421, and the second pixel opening 3421 exposes a portion of the second anode 341.

At least a portion of the second functional layer 343 is disposed in the second pixel opening 3421 and connected to the second anode 341, and the second functional layer 343 is configured to emit light. The second functional layer 343 may include a hole injection layer 3431 (HIL), a hole transport layer 3432 (HTL), a light emitting layer 3433, an electron transport layer 3434 (ETL), and an electron injection layer 3435 (EIL).

A hole injection layer 3431 is disposed on the second anode 341 to facilitate hole injection of the second anode 341. The hole transporting layer 3432 is provided over the hole injecting layer 3431 to efficiently transport holes to the light emitting layer 3433. The light emitting layer 3433 is provided over the hole transporting layer 3432, and the light emitting layer 3433 may emit light of a specific color through a material capable of emitting light of a specific color, for example, may emit red light through a material capable of emitting red light, may emit green light through a material capable of emitting green light, and may emit blue light through a material capable of emitting blue light. The material of the light emitting layer 3433 may include organic small molecule light emitting material, complex light emitting material, high molecular polymer, etc. An electron transport layer 3434 may be disposed on the light emitting layer 3433 to efficiently transport electrons to the light emitting layer 3433. An electron injection layer 3435 may be disposed between the electron transport layer 3434 and the second cathode 344 to facilitate electron injection from the second cathode 344.

It will be appreciated that the thin film transistor may input an anode voltage to the second anode 341 and a cathode voltage to the second cathode 344, and thus, under the driving of an external voltage, holes injected from the second anode 341 and electrons injected from the second cathode 344 are recombined in the second functional layer 343 to generate excitons (electron-hole pairs), and the excitons radiate to excite photons to generate visible light, wherein the light emission color depends on the type of organic molecules of the light emitting layer, and the light emission brightness or intensity depends on the performance of the light emitting material and the magnitude of the applied current.

The second cathode 344 is disposed on the second functional layer 343, at least a portion of the second cathode 344 is located in the second pixel opening 3421, and the second cathode 344 is capable of providing electrons to the second functional layer 343. Illustratively, the material of the second cathode 344 may include magnesium (Mg), silver magnesium (Ag: mg), indium Tin Oxide (ITO), indium Zinc Oxide (IZO), indium Tin Zinc Oxide (ITZO), zinc oxide (ZnO), tin Oxide (TO).

In the embodiment of the present application, the second anode 341, the second functional layer 343 and the second cathode 344 may together form a second sub-light emitting unit 345, and the second sub-light emitting unit 345 is electrically connected to the thin film transistor, and can emit light or display under the driving and control of the pixel driving circuit.

It should be noted that, in fig. 8 only two second sub-light emitting units 345 are illustrated, but in practical application of the display panel 100, the number of the second pixel openings 3421 is plural, that is, the second pixel defining layer 342 has plural second pixel openings 3421, and each second pixel opening 3421 has one second sub-light emitting unit 345 formed therein, so that the second light emitting structure layer 34 actually has plural second sub-light emitting units 345.

In addition, referring to fig. 10, the color of each second sub-light emitting unit 345 includes red (R), green (G) or blue (B). That is, when the color of the second sub-light emitting unit 345 is red, it can emit red light under the driving of the pixel driving circuit, which may be referred to as a red sub-pixel R. When the color of the second sub-light emitting unit 345 is green, it can emit green light under the driving of the pixel driving circuit, which may be referred to as a green sub-pixel G. When the color of the second sub-light emitting unit 345 is blue, it can emit blue light under the driving of the pixel driving circuit, which may be referred to as a blue sub-pixel B.

In other words, the second pixel defining layer 342 defines a plurality of second sub-light emitting units 345 having different colors. The plurality of red second sub-light emitting units 345 (capable of emitting red light), the plurality of green second sub-light emitting units 345 (capable of emitting green light), and the plurality of blue second sub-light emitting units 345 (capable of emitting blue light) are arranged in an array.

In one possible implementation, each pixel driving circuit drives one of the second sub-light emitting units 345 to emit light, so that a 1-driving 1 driving mode can be formed. Specifically, each pixel driving circuit may drive one red second sub-light emitting unit 345 to emit light, or may drive one green second sub-light emitting unit 345 to emit light, or may drive one blue second sub-light emitting unit 345 to emit light.

In another possible embodiment, each pixel driving circuit drives at least two second sub-light emitting units 345 with the same color to emit light, so that a driving mode of 1-driving N can be formed. Specifically, each pixel driving circuit may drive at least two red second sub-light emitting units 345 to emit light, or may drive at least two green second sub-light emitting units 345 to emit light, or may drive at least two blue second sub-light emitting units 345 to emit light.

In another possible embodiment, each pixel driving circuit drives at least one first sub-light emitting unit 245 and at least one second sub-light emitting unit 345 of the same color to emit light, so that a driving form of 1-driving N can be formed. Specifically, each pixel driving circuit may drive at least one red first sub-light emitting unit 245 to emit light and at least one red second sub-light emitting unit 345 to emit light, or may drive at least one green first sub-light emitting unit 245 to emit light and at least one green second sub-light emitting unit 345 to emit light, or may drive at least one blue first sub-light emitting unit 245 to emit light and at least one blue second sub-light emitting unit 345 to emit light.

Based on the above description, it should be understood that the pixel driving circuit may drive the first sub-light emitting unit 245 to emit light, the second sub-light emitting unit 345 to emit light, and the first sub-light emitting unit 245 and the second sub-light emitting unit 345 to emit light, and may be configured to drive the first sub-light emitting unit 245 with any color, or drive the second sub-light emitting unit 345 with any color to emit light, or drive the plurality of first sub-light emitting units 245 with the same color, or drive the plurality of second sub-light emitting units 345 with the same color, or drive the one or more first sub-light emitting units 245 with the same color and the second sub-light emitting unit 345 with the same color to emit light, where the driving manner may be adjusted accordingly according to the change of the actual application scenario, and the diversification of the driving type is beneficial to adapt to the application requirement under multiple scenarios, and the reliability is better.

In a possible embodiment, as shown in fig. 10, the trace in the wiring layer 32 described above may include a data line 321, and the data line 321 in the bending region 30 may be electrically connected to the data line in the flat region 20 to supply each column of sub-pixels in the array (i.e., the first sub-light emitting unit 245 and the second sub-light emitting unit 345 disposed in the same column). That is, one end of the data line 321 of the inflection region 30 is electrically connected to the data line of the flat region 20, and the other end is electrically connected to the driving chip 60.

Illustratively, the data line 321 may be a diagonal line. It can be appreciated that, since the data line 321 is located in the bending region 30, it needs to have good bending performance, and the good bending performance can reduce the possibility of cracking and breaking the line caused by bending, so as to minimize the possibility of failure of the display panel 100, and fully ensure the service life of the display panel 100.

Alternatively, as shown in fig. 11, the data lines 321 each include a first portion 322 and a second portion 323. The first portion 322 is connected to the data line of the flat area 20, the extending direction of the first portion 322 is the same as the bending direction of the bending area 30, the second portion 323 is connected to the first portion 322 in a bending manner, and an end of the second portion 323 away from the first portion 322 is used for being connected to the driving chip 60. That is, the data line 321 may be a broken line. With this arrangement, the tension applied to the data line 321 can be minimized, which is advantageous in ensuring that the data line 321 does not break when bent.

Referring to fig. 8 and 13 in combination, the second encapsulation layer 35 is disposed on the second light emitting structure layer 34, specifically, on the first flat layer 33, and the second encapsulation layer 35 includes a plurality of sub-encapsulation structures 351, where each sub-encapsulation structure 351 covers at least one second sub-light emitting unit 345.

It should be noted that, the second encapsulation layer 35 disposed in the bending region 30 does not completely cover the surface of the second light-emitting structure layer 34, in fig. 13, the gray portion is the surface of the second light-emitting structure layer 34 that is not covered by the second encapsulation layer 35, that is, the second encapsulation layer 35 may not cover the portion that is not provided with the second sub-light-emitting units 345, so that the sub-encapsulation structure 351 capable of covering the second sub-light-emitting units 345 may form a structure similar to an "island", and the second light-emitting structure layer 34 that is not provided with the second encapsulation layer 35 is exposed between the "island" and the "island". For example, when each sub-package structure 351 covers one second sub-light emitting unit 345, one sub-package structure 351 may independently constitute an "island" that encapsulates one second sub-light emitting unit 345, and when each sub-package structure 351 covers two second sub-light emitting units 345, one sub-package structure 351 may independently constitute an "island" that encapsulates two second sub-light emitting units 345.

In this arrangement, the plurality of sub-packages 351 disposed in the bending region 30 may form an "island" package, which may be different from the whole package in the prior art, so that the second light emitting structure layer 34 has a portion not covered by the sub-packages 351, thereby effectively improving the stress applied to the bending region 30 during bending, and avoiding the film structure of the bending region 30 from breaking. In addition, the blocking of the package structure 351 can also be taken as a factor to prevent the second sub-light emitting unit 345 from being oxidized or damaged by water, oxygen or other impurities in the external environment, so that the protection performance is good.

Illustratively, the second encapsulation layer 35 may be in the form of a "sandwich" of "inorganic encapsulation layer-organic encapsulation layer-inorganic encapsulation layer", such a structure ensuring a better water-oxygen barrier property of the second encapsulation layer 35 as a whole. Among them, the inorganic encapsulation layer may be formed of an inorganic material such as silicon nitride (SiNx) and/or silicon oxide (SiOx), and the organic encapsulation layer may be formed of an organic material such as an epoxy-based organic material, polymethyl methacrylate, or the like. Of course, the actual number of layers of the second encapsulation layer 35 is not limited to three, and may be one or more, and the number of layers and the layer materials constituting the encapsulation layer are not strictly limited to the embodiment of the present application.

In a possible embodiment, as shown in fig. 8, the bending region 30 further includes a second isolation pillar 36, where the second isolation pillar 36 is disposed on the second light emitting structure layer 34 and located at an edge of the second encapsulation layer 35. Therefore, the second isolation column 36 can isolate the second packaging layer 35, and when external water and oxygen invade the second packaging layer 35 from the second isolation column 36, the external water and oxygen cannot cross the second isolation column 36 and continuously invade the second packaging layer 35 because the second packaging layer 35 is isolated at the isolation column, so that the second isolation column 36 can play a role of isolating the water and oxygen, and the interior of the display panel 100 is further protected from being corroded by the water and oxygen.

It should be noted that the number of the second isolation pillars 36 may be one or more according to the requirement, and when the number of the second isolation pillars 36 is plural, the plurality of second isolation pillars 36 are all disposed at the edge of the second encapsulation layer 35 to block water and oxygen. In addition, when the second functional layer 343 and the cathode are formed, since deposition of the vapor deposition material has directionality (particles move substantially in a straight line), the second functional layer 343 and the second cathode 344 may be deposited on the surface of the second barrier rib 36, so that the surface of the second barrier rib 36 is covered with the second functional layer 343 and the second cathode 344.

The foregoing has outlined rather broadly the more detailed description of embodiments of the application, wherein the principles and embodiments of the application are explained in detail using specific examples, the above examples being provided solely to facilitate the understanding of the method and core concepts of the application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims

1. A display panel, the display panel comprising:

the flat area comprises a driving structure layer and a first light-emitting structure layer which are arranged in a stacked mode, the first light-emitting structure layer is electrically connected with the driving structure layer and is used for being driven by the driving structure layer to emit light, the driving structure layer comprises a first conductive layer and a second conductive layer which are arranged in a stacked mode, and the second conductive layer is connected between the first conductive layer and the first light-emitting structure layer; a kind of electronic device with high-pressure air-conditioning system

The bending region is connected to the periphery of the flat region and is bent relative to the flat region, the bending region comprises a circuit layer, a second light-emitting structure layer and a second packaging layer, the circuit layer, the second light-emitting structure layer and the second packaging layer are sequentially stacked, the circuit layer is electrically connected with the first conductive layer and arranged in the same layer, or the circuit layer is electrically connected with the second conductive layer and arranged in the same layer, the second light-emitting structure layer is arranged in the same layer as the first light-emitting structure layer, and the second light-emitting structure layer is electrically connected with the driving structure layer and is used for being driven by the driving structure layer to emit light;

the second light-emitting structure layer is provided with a plurality of second pixel openings, each second pixel opening is used for forming a second sub-light-emitting unit, the second packaging layer comprises a plurality of sub-packaging structures, each sub-packaging structure covers at least one second sub-light-emitting unit, gaps are reserved between every two adjacent sub-packaging structures, the bending area further comprises a second isolation column, the second isolation column is arranged on the second light-emitting structure layer and located at the edge of the second packaging layer, and the surface of the second isolation column can cover part of the second light-emitting structure layer.

2. The display panel of claim 1, wherein the wiring layer is electrically connected between the second light emitting structure layer and the driving structure layer.

3. The display panel of claim 1 or 2, wherein the first light emitting structure layer has a plurality of first pixel openings, each of the first pixel openings is used to form a first sub-light emitting unit, and the flat region further includes a first encapsulation layer disposed on the first light emitting structure layer, and the first encapsulation layer covers at least part of surfaces of the plurality of first sub-light emitting units and the first light emitting structure layer.

4. The display panel of claim 3, wherein the flat region further comprises a first spacer disposed on the first light emitting structure layer and at an edge of the first encapsulation layer.

5. The display panel of any one of claims 1, 2, and 4, wherein the bending region further comprises a first flat layer between the wiring layer and the second light-emitting structure layer.

6. The display panel of claim 5, wherein the bending region further comprises an organic insulating layer on a side of the wiring layer facing away from the first flat layer.

7. The display panel of claim 6, wherein the bending region further comprises a substrate, a buffer layer and an inorganic insulating layer sequentially stacked on the substrate, the organic insulating layer is disposed on a side of the inorganic insulating layer facing away from the buffer layer, the inorganic insulating layer has a first groove penetrating the inorganic insulating layer, and the buffer layer has a second groove communicating with the first groove;

the organic insulating layer fills the first groove and the second groove, and the organic insulating layer arranged in the second groove is arranged at intervals with the substrate; or alternatively, the process may be performed,

the second groove penetrates through the buffer layer, the organic insulating layer fills the first groove and the second groove, and the organic insulating layer arranged in the second groove is in contact with the substrate.

8. The display panel of any one of claims 1, 2, 4, 6, 7, wherein the first light emitting structure layer comprises a plurality of first sub-light emitting units, each of which has a color of red, green, or blue, the second light emitting structure layer comprises a plurality of second sub-light emitting units, each of which has a color of red, green, or blue, and the driving structure layer comprises a plurality of pixel driving circuits;

9. A display screen comprising a cover sheet and a display panel according to any one of claims 1 to 8, the cover sheet being attached to the display panel.

10. An electronic device comprising the display screen of claim 9.