CN114999808A - Compression molding inductor and preparation method and application thereof - Google Patents

Compression molding inductor and preparation method and application thereof Download PDF

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Publication number
CN114999808A
CN114999808A CN202210854437.6A CN202210854437A CN114999808A CN 114999808 A CN114999808 A CN 114999808A CN 202210854437 A CN202210854437 A CN 202210854437A CN 114999808 A CN114999808 A CN 114999808A
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powder
inductor
base
alloy powder
magnetic
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金崭凡
陈胜齐
娄海飞
胡江豪
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Hengdian Group DMEGC Magnetics Co Ltd
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Hengdian Group DMEGC Magnetics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0246Manufacturing of magnetic circuits by moulding or by pressing powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147Alloys characterised by their composition
    • H01F1/153Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15308Amorphous metallic alloys, e.g. glassy metals based on Fe/Ni
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147Alloys characterised by their composition
    • H01F1/153Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15341Preparation processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147Alloys characterised by their composition
    • H01F1/153Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15358Making agglomerates therefrom, e.g. by pressing
    • H01F1/15366Making agglomerates therefrom, e.g. by pressing using a binder
    • H01F1/15375Making agglomerates therefrom, e.g. by pressing using a binder using polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/255Magnetic cores made from particles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/30Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306Fastening or mounting coils or windings on core, casing or other support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/06Coil winding
    • H01F41/08Winding conductors onto closed formers or cores, e.g. threading conductors through toroidal cores
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Abstract

The invention provides a compression molding inductor and a preparation method and application thereof, wherein the preparation method comprises the following steps: (1) magnetic powder is used for sequentially carrying out mixing, granulation, pressing and solidification to obtain a magnetic substrate; (2) arranging a conductor coil on the magnetic substrate obtained in the step (1), filling magnetic powder and then performing compression molding to obtain a semi-finished inductor; (3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor; the magnetic substrate in the step (1) comprises a base and a middle column arranged on the base, and the base is in any one of a convex shape, an I shape, a cross shape or a diagonal shape. The compression molding inductor is convenient to manufacture and excellent in mechanical property, the manufacturing method reduces the difficulty of a winding manufacturing process, and the winding yield and the product strength are improved.

Description

Compression molding inductor and preparation method and application thereof
Technical Field
The invention belongs to the technical field of inductors, relates to a compression molding inductor, and particularly relates to a compression molding inductor and a preparation method and application thereof.
Background
With the development of computer Central Processing Units (CPUs), Field Programmable Gate Arrays (FPGAs) and different chip Application Specific Integrated Circuits (ASICs), low voltage and large current become the development trend of DC-DC power supplies. With the spread of multi-phase power supply circuit technology, the number of power inductors required in the market is further increasing. In comparison with the conventional products, the power inductor is required to be as small and thin as possible in accordance with space saving and high-density packaging technology. With the smaller and smaller volume and larger power of electronic products, electronic components are also developed towards the aspects of small volume and high power. Therefore, how to design an inductor with convenient manufacturing process and better mechanical properties on the premise of ensuring the characteristics becomes a problem to be solved urgently by those skilled in the art.
CN 202183292U discloses an improved integrally formed inductor, which comprises a coil, a magnetic solid body and two electrode pins, wherein the coil is embedded in the magnetic solid body, one end of each electrode pin is a first end, the other end of each electrode pin is a second end, the first ends of the two electrode pins are respectively embedded in the magnetic solid body, and the two electrode pins are respectively welded with two ends of the coil. However, since the inductor adopts a coil welding and post-molding process, contact impedance is introduced when the coil and the terminal are welded, which leads to one-time increase of dc impedance, and the coil and the terminal are deformed during molding, which leads to another increase of dc impedance, and impedance distribution is very large due to failure in control.
CN 108648901a discloses a method for manufacturing an inductor, which belongs to an integrated winding inductor, and the inductor is manufactured by firstly pressing magnetic powder into a T-core with a certain shape, then winding on the T-core, and processing through a series of processes such as hot pressing, roll spraying, laser, electroplating and the like. Although the manufacturing method adopts the T-core processing technology, the coil is wound on the T-core, and the T-core protection is arranged inside and at the bottom of the coil during pressing, the T-core can be compressed and deformed during pressing, the coil still has a certain degree of outward expansion, and the deformation of the coil can be greatly different under different design conditions, thereby bringing great inconvenience to design and production.
Therefore, how to provide the inductor with convenient manufacturing process and excellent mechanical property, reduce the difficulty of the winding manufacturing process, and improve the winding yield and the product strength becomes a problem which needs to be solved urgently by technical personnel in the field at present.
Disclosure of Invention
The invention aims to provide a compression molding inductor and a preparation method and application thereof, the compression molding inductor is convenient in manufacturing process and excellent in mechanical property, the preparation method reduces the difficulty of a winding manufacturing process, and improves the winding yield and the product strength.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a method for preparing a compression molding inductor, which comprises the following steps:
(1) sequentially mixing, granulating, pressing and curing magnetic powder to obtain a magnetic substrate;
(2) arranging a conductor coil on the magnetic substrate obtained in the step (1), filling magnetic powder, and then performing compression molding to obtain a semi-finished inductor;
(3) and (3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor.
The magnetic substrate in the step (1) comprises a base and a center column arranged on the base, and the base is in any one of a convex shape, an I shape, a cross shape or a diagonal shape.
The base shape of the magnetic substrate is specially designed to match the shape characteristics of the conductor coil, so that the difficulty of the winding process is reduced, the contact area between the conductor coil and the substrate is increased, and the winding yield is improved. In addition, the design of differentiation base shape makes hot pressing powder filling volume increase, has promoted product strength.
Preferably, the magnetic powder in step (1) comprises amorphous powder and/or alloy powder, and further preferably amorphous powder and alloy powder.
Preferably, the amorphous powder includes any one of or a combination of at least two of an iron-based amorphous powder, a nickel-based amorphous powder, or a zirconium-based amorphous powder, and typical but non-limiting combinations include a combination of an iron-based amorphous powder and a nickel-based amorphous powder, a combination of a nickel-based amorphous powder and a zirconium-based amorphous powder, a combination of an iron-based amorphous powder and a zirconium-based amorphous powder, or a combination of an iron-based amorphous powder, a nickel-based amorphous powder and a zirconium-based amorphous powder.
Preferably, the alloy powder includes any one of iron alloy powder, copper alloy powder, nickel alloy powder, cobalt alloy powder, aluminum alloy powder or titanium alloy powder or a combination of at least two thereof, and typical but non-limiting combinations include a combination of iron alloy powder and copper alloy powder, a combination of copper alloy powder and nickel alloy powder, a combination of nickel alloy powder and cobalt alloy powder, a combination of cobalt alloy powder and aluminum alloy powder, or a combination of aluminum alloy powder and titanium alloy powder.
In the invention, the amorphous powder has large particles, low loss, high hardness and high magnetic conductivity; the alloy powder has small particles and low hardness, and can fill the internal gaps of the amorphous powder, so that the density of the product is further improved, and the magnetic conductivity of the product is further improved.
Preferably, the amorphous powder accounts for 30-70% by mass of the magnetic powder, and may be, for example, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, or 70%, but is not limited to the enumerated values, and other values not enumerated within the range of values are also applicable.
Preferably, the mixing of step (1) comprises mixing magnetic powder and a binder.
Preferably, the adhesive comprises an epoxy resin.
Preferably, the binder is present in an amount of 1 to 5% by mass, for example 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 5% by mass, based on the total mass of the blend, but is not limited to the recited values, and other values not recited within this range are equally applicable.
Preferably, the average particle size of the granules obtained by the granulation in step (1) is 60-250 mesh, such as 60 mesh, 80 mesh, 100 mesh, 120 mesh, 140 mesh, 160 mesh, 180 mesh, 200 mesh, 220 mesh, 240 mesh or 250 mesh, but not limited to the listed values, and other values not listed in the range of values are also applicable.
Preferably, the pressing of step (1) is carried out at an applied pressure of 3 to 10T/cm 2 For example, it may be 3T/cm 2 、3.5T/cm 2 、4T/cm 2 、4.5T/cm 2 、5T/cm 2 、5.5T/cm 2 、6T/cm 2 、6.5T/cm 2 、7T/cm 2 、7.5T/cm 2 、8T/cm 2 、8.5T/cm 2 、9T/cm 2 、9.5T/cm 2 Or 10T/cm 2 However, the numerical values recited are not intended to be limiting, and other numerical values not recited within the numerical range may be equally applicable.
Preferably, the density of the base after pressing in step (1) is 5.5-7.5g/cm 3 For example, it may be 5.5g/cm 3 、5.6g/cm 3 、5.7g/cm 3 、5.8g/cm 3 、5.9g/cm 3 、6g/cm 3 、6.1g/cm 3 、6.2g/cm 3 、6.3g/cm 3 、6.4g/cm 3 、6.5g/cm 3 、6.6g/cm 3 、6.7g/cm 3 、6.8g/cm 3 、6.9g/cm 3 、7g/cm 3 、7.1g/cm 3 、7.2g/cm 3 、7.3g/cm 3 、7.4g/cm 3 Or 7.5g/cm 3 However, the numerical values recited are not intended to be limiting, and other numerical values not recited within the numerical range may be equally applicable.
Preferably, the base cure rate after curing in step (1) is 5-30%, and may be, for example, 5%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, or 30%, but is not limited to the recited values, and other values not recited in this range are also applicable.
Preferably, the shape of the notch on the base in the step (1) comprises a rectangle and/or an arc.
Preferably, the volume of the gap is 10-20% of the volume of the base, for example 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19% or 20%, but not limited to the recited values, and other values not recited within the range of values are equally applicable.
In the invention, the proportion of the volume of the gap compared with the volume of the base needs to be controlled within a reasonable range. When the proportion is lower than 10%, the coil lead is easy to expose on the surface of the product, so that the difficulty of subsequent electroplating and other processes is improved; when the proportion is higher than 20%, the size of the side package of the gap is larger than that of the magnetic substrate, and the gap at the bottom of the coil cannot be filled when the magnetic powder is filled, so that the appearance and the performance of the product are damaged.
Preferably, the conductor coil of step (2) is arranged in a manner that the conductor coil is wound or sleeved on the surface of the center pillar of the magnetic substrate.
Preferably, the conducting wire used in the conductor coil in the step (2) comprises a copper wire.
Preferably, the cross-section of the wire comprises a circle, an ellipse or a rectangle.
Preferably, the material of the magnetic powder in the step (2) is the same as that of the magnetic powder in the step (1).
Preferably, the pressure applied in the compression molding of the step (2) is 3-10T/cm 2 For example, it may be 3T/cm 2 、3.5T/cm 2 、4T/cm 2 、4.5T/cm 2 、5T/cm 2 、5.5T/cm 2 、6T/cm 2 、6.5T/cm 2 、7T/cm 2 、7.5T/cm 2 、8T/cm 2 、8.5T/cm 2 、9T/cm 2 、9.5T/cm 2 Or 10T/cm 2 However, the numerical values recited are not intended to be limiting, and other numerical values not recited within the numerical range may be equally applicable.
Preferably, the temperature for the compression molding in step (2) is 50 to 300 ℃, and may be, for example, 50 ℃, 60 ℃, 80 ℃, 100 ℃, 120 ℃, 140 ℃, 160 ℃, 180 ℃, 200 ℃, 220 ℃, 240 ℃, 260 ℃, 280 ℃ or 300 ℃, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
In the invention, the compression molding temperature needs to be controlled within a reasonable range. When the temperature is lower than 50 ℃, the epoxy resin monomer cannot be fully melted, the flowability is poor, the curing rate is low, and the utilization is influenced; when the temperature is higher than 300 ℃, the epoxy resin is easily decomposed, thereby breaking the crosslinking between the resins.
Preferably, the compression molding time in step (2) is 1-5min, such as 1min, 1.5min, 2min, 2.5min, 3min, 3.5min, 4min, 4.5min or 5min, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the temperature of the heat treatment in step (3) is 100-250 ℃, and may be, for example, 100 ℃, 120 ℃, 140 ℃, 160 ℃, 180 ℃, 200 ℃, 220 ℃, 240 ℃ or 250 ℃, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the heat treatment in step (3) is carried out for a time period of 0.5 to 10 hours, for example 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10 hours, but not limited to the recited values, and other values not recited in this range are also applicable.
Preferably, the insulation treatment in the step (3) includes spraying an insulation layer on the surface of the inductor and curing.
Preferably, the thickness of the insulating layer is 8 to 12 μm, and may be, for example, 8 μm, 8.5 μm, 9 μm, 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.5 μm or 12 μm, but is not limited to the values listed, and other values not listed in this range of values are also applicable.
Preferably, the paint stripping in the step (3) includes stripping the electrode area of the inductor by a laser method.
Preferably, the electroplating of step (3) includes electroplating a metal layer in the electrode region of the inductor.
Preferably, the metal layer comprises any one of a copper layer, a nickel layer or a tin layer.
As a preferred technical solution of the first aspect of the present invention, the preparation method comprises the steps of:
(1) magnetic powder is used for sequentially carrying out mixing, granulation, pressing and solidification to obtain a magnetic substrate; the magnetic powder comprises amorphous powder and alloy powder, and the amorphous powder comprises iron-based amorphous powderThe magnetic powder comprises any one or the combination of at least two of nickel-based amorphous powder and zirconium-based amorphous powder, wherein the alloy powder comprises any one or the combination of at least two of iron alloy powder, copper alloy powder, nickel alloy powder, cobalt alloy powder, aluminum alloy powder or titanium alloy powder, and the mass percentage of the amorphous powder in the magnetic powder is 30-70%; the mixed material comprises mixed magnetic powder and epoxy resin, and the mass of the epoxy resin accounts for 1-5% of the total mass of the mixed material; the average particle size of the granules obtained by granulation is 60-250 meshes; the pressing pressure is 3-10T/cm 2 And the density of the base after pressing is 5.5 to 7.5g/cm 3 (ii) a The curing rate of the cured base is 5-30%; the magnetic substrate comprises a base and a middle column arranged on the base, and the shape of the base comprises any one of a convex shape, an I shape, a cross shape or a diagonal shape; the shape of the notch on the base comprises a rectangle and/or an arc, and the volume of the notch is 10-20% of the volume of the base;
(2) winding or sleeving a conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1), filling magnetic powder, and then winding or sleeving the conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1) at a position of 3-10T/cm 2 Molding at 50-300 deg.C for 1-5min to obtain semi-finished inductor; the conductor coil is a copper wire with a circular, oval or rectangular cross section; the material of the magnetic powder is the same as that of the magnetic powder in the step (1);
(3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor; the temperature of the heat treatment is 100-250 ℃, and the time is 0.5-10 h; the insulation treatment comprises spraying 8-12 μm insulation layer on the surface of the inductor and curing; the paint stripping comprises the step of stripping an electrode area of the inductor in a laser mode; the electroplating comprises electroplating any one of a copper layer, a nickel layer or a tin layer in the electrode area of the inductor.
In a second aspect, the invention provides a compression molding inductor prepared by the preparation method of the first aspect.
In a third aspect, the invention provides an application of the molded inductor according to the second aspect in an electronic product.
Compared with the prior art, the invention has the following beneficial effects:
the base shape of the magnetic substrate is specially designed to be matched with the shape characteristics of the conductor coil, so that the difficulty of a winding process is reduced, the contact area between the conductor coil and the substrate is increased, and the winding yield is improved. In addition, the design of differentiation base shape makes hot pressing powder filling volume increase, has promoted product strength.
Drawings
FIG. 1 is a top view of a magnetic substrate in a compression molded inductor provided in example 1;
FIG. 2 is a perspective view of a magnetic substrate in a molded inductor provided in example 1;
FIG. 3 is a top view of a magnetic substrate in a compression molded inductor provided in example 2;
FIG. 4 is a perspective view of a magnetic substrate in a molded inductor provided in example 2;
FIG. 5 is a top view of the magnetic substrate in the compression molded inductor provided in example 3;
fig. 6 is a perspective view of a magnetic substrate in the molded inductor provided in example 3.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The embodiment provides a compression molding inductor and a preparation method thereof, wherein the preparation method specifically comprises the following steps:
(1) sequentially mixing, granulating, pressing and curing magnetic powder to obtain a magnetic substrate; the magnetic powder comprises iron-based amorphous powder and aluminum alloy powder, wherein the iron-based amorphous powder accounts for 40% of the magnetic powder by mass; the mixed material comprises mixed magnetic powder and glycidyl ether epoxy resin, and the mass of the epoxy resin accounts for 2% of the total mass of the mixed material; the average particle size of the granules obtained by granulation is 200 meshes; application of the pressThe pressure is 5T/cm 2 And the density of the base after pressing is 6g/cm 3 (ii) a The curing rate of the cured base is 15%; the magnetic substrate comprises a base and a center pillar arranged on the base, and the base is in a convex shape (see fig. 1 and 2); the shape of the notch on the base is arc, and the volume of the notch is 15% of the volume of the base;
(2) winding a conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1), filling magnetic powder, and then winding the conductor coil at 5T/cm 2 Molding at 150 deg.C for 2min to obtain semi-finished inductor; the conductor coil is a copper wire with a circular cross section; the material of the magnetic powder is the same as that of the magnetic powder in the step (1);
(3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor; the temperature of the heat treatment is 180 ℃, and the time is 1.5 h; the insulation treatment comprises spraying 10 μm of insulation layer on the surface of the inductor and curing; the paint stripping comprises the step of stripping an electrode area of the inductor in a laser mode; the electroplating comprises electroplating a copper layer in the electrode region of the inductor.
Example 2
The embodiment provides a compression molding inductor and a preparation method thereof, wherein the preparation method specifically comprises the following steps:
(1) magnetic powder is used for sequentially carrying out mixing, granulation, pressing and solidification to obtain a magnetic substrate; the magnetic powder comprises nickel-based amorphous powder and titanium alloy powder, wherein the nickel-based amorphous powder accounts for 30% of the magnetic powder by mass; the mixed material comprises mixed magnetic powder and glycidyl ether epoxy resin, and the mass of the epoxy resin accounts for 1% of the total mass of the mixed material; the average particle size of the granules obtained by granulation is 60 meshes; the pressing pressure is 3T/cm 2 And the density of the base after pressing is 5.5g/cm 3 (ii) a The curing rate of the cured base is 5%; the magnetic substrate comprises a base and a center pillar arranged on the base, and the base is I-shaped (see figures 3 and 4); the shape of the notch on the base is rectangular, and the volume of the notch is 10% of the volume of the base;
(2) sleeving a conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1), filling magnetic powder, and then filling the conductor coil at 3T/cm 2 Molding at 50 deg.C for 5min to obtain semi-finished inductor; the conductor coil adopts a copper wire with an oval cross section; the material of the magnetic powder is the same as that of the magnetic powder in the step (1);
(3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor; the temperature of the heat treatment is 100 ℃, and the time is 10 hours; the insulation treatment comprises spraying an 8-micron insulation layer on the surface of the inductor and curing; the paint stripping comprises the step of stripping an electrode area of the inductor in a laser mode; the electroplating comprises electroplating a nickel layer in the electrode region of the inductor.
Example 3
The embodiment provides a compression molding inductor and a preparation method thereof, wherein the preparation method specifically comprises the following steps:
(1) sequentially mixing, granulating, pressing and curing magnetic powder to obtain a magnetic substrate; the magnetic powder comprises zirconium-based amorphous powder and copper alloy powder, wherein the zirconium-based amorphous powder accounts for 70% of the magnetic powder by mass; the mixed material comprises mixed magnetic powder and glycidyl ether epoxy resin, and the mass of the epoxy resin accounts for 5% of the total mass of the mixed material; the average particle size of the granules obtained by granulation is 250 meshes; the applied pressure of the pressing is 10T/cm 2 And the density of the base after pressing is 7.5g/cm 3 (ii) a The curing rate of the cured base is 30%; the magnetic substrate comprises a base and a center post arranged on the base, and the base is in a cross shape (see fig. 5 and 6); the shape of the notch on the base is rectangular, and the volume of the notch is 20% of the volume of the base;
(2) winding a conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1), filling magnetic powder, and then winding the conductor coil at 10T/cm 2 Molding at 300 deg.C for 1min to obtain semi-finished inductor; the conductor coil is a copper wire with a rectangular cross section; the material of the magnetic powder is the same as that of the magnetic powder in the step (1);
(3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor; the temperature of the heat treatment is 250 ℃, and the time is 0.5 h; the insulation treatment comprises spraying an insulation layer of 12 mu m on the surface of the inductor and curing; the paint stripping comprises the step of stripping an electrode area of the inductor in a laser mode; the electroplating comprises electroplating a tin layer in the electrode area of the inductor.
Example 4
This embodiment provides a compression molding inductor and a method for manufacturing the same, where the steps and conditions are the same as those in embodiment 1 except that the volume of the notch in step (1) is reduced to 5% of the volume of the base, and thus are not described herein again.
Compared with embodiment 1, in this embodiment, because the volume of the notch is too small, the coil lead is easily exposed on the surface of the product, which leads to the difficulty of the subsequent electroplating and other processes to be obviously improved.
Example 5
This embodiment provides a compression molding inductor and a method for manufacturing the same, where the steps and conditions are the same as those in embodiment 1 except that the volume of the notch in step (1) is increased to 25% of the volume of the base, and thus are not described herein again.
Compared with embodiment 1, in this embodiment, the size of the side package of the notch is larger than that of the magnetic substrate due to the overlarge volume of the notch, and the gap at the bottom of the coil cannot be filled when the magnetic powder is filled, thereby damaging the appearance and performance of the product.
Example 6
The present embodiment provides a compression molding inductor and a method for manufacturing the same, wherein the method is the same as that of embodiment 1 except that the temperature of the compression molding in step (2) is reduced to 40 ℃, and thus, the details are not repeated herein.
Compared with example 1, in this example, due to the low temperature of the compression molding, the epoxy resin monomer cannot be fully melted, the flowability is poor, and the curing rate is low, which affects the operation.
Example 7
The present embodiment provides a compression molding inductor and a method for manufacturing the same, wherein the temperature for compression molding in step (2) is raised to 350 ℃, and the other steps and conditions are the same as those in embodiment 1, and thus are not described herein again.
In this example, the epoxy resin was easily decomposed due to an excessively high temperature for press molding, compared to example 1, and the crosslinking action between the resins was broken.
Comparative example 1
The comparative example provides a compression molding inductor and a preparation method thereof, and the preparation method is the same as that of example 1 except that the shape of the base in step (1) is changed into a conventional rectangular shape, so that the details are not repeated herein.
Compared with embodiment 1, the shape of the base of the magnetic substrate is not specially designed, but the conventional rectangle is selected, so that the shape characteristics of the conductor coil are not matched, the difficulty of the winding process is improved, and the winding yield is lower than that of embodiment 1.
In addition, the sensitivity of the product obtained in example 1 is improved by 8-10% compared with the product obtained in comparative example 1 under the condition of the same powder muH.
Therefore, the base shape of the magnetic substrate is specially designed to be matched with the shape characteristics of the conductor coil, so that the difficulty of the winding process is reduced, the contact area between the conductor coil and the substrate is increased, and the winding yield is improved. In addition, the design of differentiation base shape makes hot pressing powder filling volume increase, has promoted product strength.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.

Claims (10)

1. A preparation method of a compression molding inductor is characterized by comprising the following steps:
(1) magnetic powder is used for sequentially carrying out mixing, granulation, pressing and solidification to obtain a magnetic substrate;
(2) arranging a conductor coil on the magnetic substrate obtained in the step (1), filling magnetic powder and then performing compression molding to obtain a semi-finished inductor;
(3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor;
the magnetic substrate in the step (1) comprises a base and a center column arranged on the base, and the base is in any one of a convex shape, an I shape, a cross shape or a diagonal shape.
2. The production method according to claim 1, wherein the magnetic powder of step (1) comprises an amorphous powder and/or an alloy powder, and is further preferably an amorphous powder and an alloy powder;
preferably, the amorphous powder comprises any one of iron-based amorphous powder, nickel-based amorphous powder or zirconium-based amorphous powder or a combination of at least two of the iron-based amorphous powder, the nickel-based amorphous powder and the zirconium-based amorphous powder;
preferably, the alloy powder comprises any one of iron alloy powder, copper alloy powder, nickel alloy powder, cobalt alloy powder, aluminum alloy powder or titanium alloy powder or the combination of at least two of the iron alloy powder, the copper alloy powder, the nickel alloy powder, the cobalt alloy powder and the titanium alloy powder;
preferably, the mass percentage of the amorphous powder in the magnetic powder is 30-70%.
3. The production method according to claim 1 or 2, wherein the compounding of step (1) comprises mixing a magnetic powder and a binder;
preferably, the binder comprises an epoxy resin;
preferably, the mass of the binder accounts for 1-5% of the total mass of the mixed material.
4. The process according to any one of claims 1 to 3, wherein the granules obtained by the granulation in the step (1) have an average particle size of 60 to 250 mesh;
preferably, the pressing of step (1) is carried out at an applied pressure of 3-10T/cm 2
Preferably, the density of the base after pressing in step (1) is 5.5-7.5g/cm 3
Preferably, the curing rate of the base after curing in the step (1) is 5-30%;
preferably, the shape of the notch on the base in the step (1) comprises a rectangle and/or an arc;
preferably, the volume of the gap is 10-20% of the volume of the base.
5. The method according to any one of claims 1 to 4, wherein the conductor coil of step (2) is disposed in a manner that includes winding or sleeving the conductor coil on the surface of the center pillar of the magnetic substrate;
preferably, the conducting wire adopted by the conductor coil in the step (2) comprises a copper wire;
preferably, the cross-section of the wire comprises a circle, an ellipse or a rectangle.
6. The method according to any one of claims 1 to 5, wherein the magnetic powder in step (2) is made of the same material as the magnetic powder in step (1);
preferably, the pressure applied in the step (2) of compression molding is 3-10T/cm 2
Preferably, the temperature for compression molding in the step (2) is 50-300 ℃;
preferably, the time for the compression molding in the step (2) is 1-5 min.
7. The method as claimed in any one of claims 1 to 6, wherein the temperature of the heat treatment in step (3) is 100-250 ℃;
preferably, the time of the heat treatment in the step (3) is 0.5-10 h;
preferably, the insulation treatment in the step (3) comprises spraying an insulation layer on the surface of the inductor and curing;
preferably, the thickness of the insulating layer is 8-12 μm;
preferably, the paint stripping in the step (3) includes stripping an electrode area of the inductor in a laser mode;
preferably, the electroplating of step (3) includes electroplating a metal layer in the electrode region of the inductor;
preferably, the metal layer comprises any one of a copper layer, a nickel layer or a tin layer.
8. The method of any one of claims 1 to 7, comprising the steps of:
(1) magnetic powder is used for sequentially carrying out mixing, granulation, pressing and solidification to obtain a magnetic substrate; the magnetic powder comprises amorphous powder and alloy powder, the amorphous powder comprises any one or the combination of at least two of iron-based amorphous powder, nickel-based amorphous powder or zirconium-based amorphous powder, the alloy powder comprises any one or the combination of at least two of iron alloy powder, copper alloy powder, nickel alloy powder, cobalt alloy powder, aluminum alloy powder or titanium alloy powder, and the mass percentage of the amorphous powder in the magnetic powder is 30-70%; the mixed material comprises mixed magnetic powder and epoxy resin, and the mass of the epoxy resin accounts for 1-5% of the total mass of the mixed material; the average particle size of the granules obtained by granulation is 60-250 meshes; the pressing pressure is 3-10T/cm 2 And the density of the base after pressing is 5.5-7.5g/cm 3 (ii) a The curing rate of the cured base is 5-30%; the magnetic substrate comprises a base and a middle column arranged on the base, and the shape of the base comprises any one of a convex shape, an I shape, a cross shape or a diagonal shape; the shape of the notch on the base comprises a rectangle and/or an arc, and the volume of the notch is 10-20% of the volume of the base;
(2) winding or sleeving a conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1), filling magnetic powder, and then winding or sleeving the conductor coil on the surface of the center pillar of the magnetic substrate obtained in the step (1) at a position of 3-10T/cm 2 Molding at 50-300 deg.C for 1-5min to obtain semi-finished inductor; the conductor coil is a copper wire with a circular, oval or rectangular cross section; the material of the magnetic powder is the same as that of the magnetic powder in the step (1);
(3) sequentially carrying out heat treatment, insulation treatment, paint stripping and electroplating on the semi-finished inductor obtained in the step (2) to obtain a finished inductor; the temperature of the heat treatment is 100-250 ℃, and the time is 0.5-10 h; the insulation treatment comprises spraying 8-12 μm insulation layer on the surface of the inductor and curing; the paint stripping comprises the step of stripping an electrode area of the inductor in a laser mode; the electroplating comprises electroplating any one of a copper layer, a nickel layer or a tin layer in the electrode area of the inductor.
9. A compression molded inductor produced by the production method according to any one of claims 1 to 8.
10. Use of a molded inductor according to claim 9 in an electronic product.
CN202210854437.6A 2022-07-15 2022-07-15 Compression molding inductor and preparation method and application thereof Pending CN114999808A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111755233A (en) * 2020-06-24 2020-10-09 华萃微感电子(江苏)有限公司 Sectional forming micro-inductor manufacturing process
CN112397295A (en) * 2020-09-25 2021-02-23 宁波中科毕普拉斯新材料科技有限公司 Manufacturing method of integrally formed inductor
CN113661549A (en) * 2021-06-30 2021-11-16 东莞顺络电子有限公司 Integrally formed inductor and manufacturing method thereof
CN114050036A (en) * 2021-11-24 2022-02-15 横店集团东磁股份有限公司 Integrally-formed cup-core inductor and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111755233A (en) * 2020-06-24 2020-10-09 华萃微感电子(江苏)有限公司 Sectional forming micro-inductor manufacturing process
CN112397295A (en) * 2020-09-25 2021-02-23 宁波中科毕普拉斯新材料科技有限公司 Manufacturing method of integrally formed inductor
CN113661549A (en) * 2021-06-30 2021-11-16 东莞顺络电子有限公司 Integrally formed inductor and manufacturing method thereof
CN114050036A (en) * 2021-11-24 2022-02-15 横店集团东磁股份有限公司 Integrally-formed cup-core inductor and preparation method thereof

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