CN115116711A - Low-impedance inductor and preparation method and application thereof - Google Patents
Low-impedance inductor and preparation method and application thereof Download PDFInfo
- Publication number
- CN115116711A CN115116711A CN202210766413.5A CN202210766413A CN115116711A CN 115116711 A CN115116711 A CN 115116711A CN 202210766413 A CN202210766413 A CN 202210766413A CN 115116711 A CN115116711 A CN 115116711A
- Authority
- CN
- China
- Prior art keywords
- treatment
- magnetic center
- center pillar
- inductor
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention provides a low-impedance inductor and a preparation method and application thereof, wherein the low-impedance inductor comprises a magnetic center pillar with a recess; the volume of the concave part accounts for 1-10% of the volume of the magnetic center pillar; the preparation method comprises the steps of firstly, mixing magnetic powder with glue to obtain a mixed raw material; then, after sequentially carrying out coating granulation and screening treatment, placing the mixture in a die for first pressing treatment to obtain a magnetic center pillar with a recess; assembling a conductor coil after the magnetic center pillar is subjected to first curing treatment, and then sequentially performing second pressing treatment and second curing treatment to obtain a semi-finished product; and sequentially carrying out insulation protection, laser paint stripping and electroplating on the semi-finished product to obtain the low-impedance inductor. The magnetic center pillar with the recess in the low-impedance inductor can effectively reduce the deformation degree of the conductor coil, thereby reducing the direct-current impedance of the inductor.
Description
Technical Field
The invention relates to the technical field of inductors, in particular to a low-impedance inductor and a preparation method and application thereof.
Background
The integrally formed inductor can work for a long time under the condition of large current and stably supply power to the CPU. With the smaller and smaller size and larger power of electronic products, electronic components are developed towards smaller size and larger power. How to prepare an inductor with lower impedance in a smaller volume is an important research direction in the field of inductor processing.
CN111508694A discloses an ultra-low impedance hot press molding inductor and a manufacturing method thereof, the inductor includes an inductor-coated insulator and a group of inductor functional components embedded in the inductor-coated insulator; the inductance functional assembly is formed by combining a magnetic core body and a flat coil, the inductance coating insulator coats the peripheral part of the inductance functional assembly in the hot press molding state of the inductance coating insulator and the inductance functional assembly, and two pin parts of the flat coil protrude out of one side end face of the inductance coating insulator. The method has the advantages that the hot press molding replaces the cold press molding, the flat coil replaces the round coil, and the like, so that the insulation performance of the inductance device is greatly improved, and the use stability of the inductance device is improved. The inductor device can bear higher maximum current, has low alternating current loss in the practical application process, and improves the overall energy-saving effect of the device to the maximum extent.
CN202183292U discloses an improved integrally formed inductor, which includes a coil, a magnetic solid and two electrode pins, wherein the coil is embedded in the magnetic solid, one end of the electrode pin is a first end, the other end of the electrode pin is a second end, the first ends of the two electrode pins are embedded in the magnetic solid, and the two electrode pins are welded with the two ends of the coil. And the preparation is carried out by adopting a die pressing process after coil welding, but contact impedance is introduced when the coil and the terminal are welded, so that direct current impedance is increased, and the coil and the terminal are deformed during die pressing, so that the direct current impedance is increased again.
CN108648901A discloses an electronic component and a method for manufacturing an inductor, the electronic component includes: a body; a conductive element arranged in the body, wherein at least one part of a terminal of the conductive element is exposed out of the outer side of the body; a metal foil having an adhesive material on a bottom surface thereof, the metal foil adhered to the body by the adhesive material and covering a first portion of the terminal of the conductive element, wherein a second portion of the terminal of the conductive element is not covered by the metal foil and the adhesive material; and a first metal layer covering the metal foil and covering a second portion of the terminal of the conductive element, wherein the first metal layer is electrically connected to the second portion of the terminal of the conductive element for electrically connecting an external circuit. The coil is wound on the T-core by adopting a T-core processing technology, and T-core protection is arranged inside and at the bottom of the coil during pressing; however, the T-core is still compressed and deformed during the pressing process, the coil still has a certain outward expansion, and the deformation of the coil under different design conditions can be greatly different, which brings great inconvenience to the design and production.
Therefore, it is of great significance to develop a low impedance inductor and a preparation method thereof, wherein the preparation method is simple and the deformation of the coil in the pressing process is reduced.
Disclosure of Invention
In view of the problems in the prior art, the invention provides a low-impedance inductor and a preparation method and application thereof, wherein the deformation degree of a conductor coil is reduced by increasing a recess on the surface of a magnetic center pillar, so that the direct-current impedance of the inductor is reduced; the preparation method is simple in process and suitable for large-scale popularization and application.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a low impedance inductor comprising a magnetic center pillar with a recess; the volume of the concave part accounts for 1-10% of the volume of the magnetic center pillar.
The surface of the magnetic center pillar of the low-impedance inductor is provided with the recess, the volume of the recess part accounts for 1-10% of the volume of the magnetic center pillar, the stress condition of the conductor coil during pressing treatment can be changed, and the extrusion deformation degree of the conductor coil is improved, so that the purposes of reducing the deformation of the conductor coil and reducing the direct current impedance are achieved. When the volume of the concave part is too small or too large in the volume of the magnetic center pillar, the direct current impedance of the finally obtained inductor is increased.
In the present invention, the volume of the recessed portion is 1% to 10% of the volume of the pillar in the magnetic field, and may be, for example, 1%, 3%, 5%, 8%, 9%, or 10%, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the cross-sectional shape of the magnetic center pillar includes any one of a circle, a square, an ellipse, or a racetrack shape.
Preferably, the shape of the depression comprises any one or a combination of at least two of a groove, an opening, a dimple or a thread, wherein typical but non-limiting combinations include a combination of a groove and an opening, a combination of a dimple and a thread, a combination of an opening and a dimple or a combination of a thread, a groove and an opening.
Preferably, a conductor coil is arranged outside the magnetic center pillar; a schematic diagram of a conductor coil is shown in fig. 1.
Preferably, the conductor coil is formed by winding at least one strand of conducting wire, and the conducting wire comprises a round wire or a flat wire.
Preferably, the material of the conductor coil includes metal.
In a second aspect, the present invention also provides a method for manufacturing a low impedance inductor as described in the first aspect, the method comprising the steps of:
(1) mixing the magnetic powder with glue to obtain a mixed raw material;
(2) the mixed raw materials are sequentially subjected to coating granulation and screening treatment, and then are placed in a die for first pressing treatment to obtain a magnetic center pillar with a recess;
(3) assembling a conductor coil after the magnetic center pillar is subjected to first curing treatment, and then sequentially performing second pressing treatment and second curing treatment to obtain a semi-finished product;
(4) and sequentially carrying out insulation protection, laser paint stripping and electroplating on the semi-finished product to obtain the low-impedance inductor.
The preparation method of the low-impedance inductor performs first pressing in the die, so that the obtained magnetic center pillar has a recess with a certain volume, the stress condition of the conductor coil during the first pressing is changed, and the extrusion deformation degree of the conductor coil is improved, thereby reducing the deformation of the coil and reducing the direct-current impedance of the inductor. The preparation method provided by the invention obtains the inductor with lower direct current impedance through twice pressing treatment and twice curing treatment, and has the advantages of simple process flow and large-scale popularization and application prospect.
Preferably, the glue in step (1) accounts for 1-5% of the mixed raw material, such as 1%, 1.3%, 2%, 3%, 4%, or 5%, but not limited to the listed values, and other values in the range are also applicable.
Preferably, the mesh number of the screen in the screening treatment in the step (2) is 60 to 250 meshes, for example, 60 meshes, 80 meshes, 100 meshes, 120 meshes, 150 meshes, 200 meshes, 250 meshes, etc., but not limited to the enumerated values, and other values not enumerated within the numerical range are also applicable.
Preferably, the pressure of the first pressing treatment is 3-10 t/cm 2 For example, it may be 3t/cm 2 、4t/cm 2 、5t/cm 2 、6t/cm 2 、7t/cm 2 、8t/cm 2 Or 10t/cm 2 And the like, but are not limited to the recited values, and other values not recited within the numerical range are also applicable.
Preferably, the temperature of the first pressing treatment is 10 to 30 ℃, and may be, for example, 10 ℃, 15 ℃, 20 ℃, 25 ℃, 28 ℃ or 30 ℃, but is not limited to the recited values, and other values not recited in the numerical range are also applicable.
Preferably, the time of the first pressing process is 1 to 10 seconds, for example, 1s, 2s, 3s, 5s, 7s, 9s, or 10s, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the volume of the recessed portion is 1% to 10% of the volume of the pillar, and may be, for example, 1%, 3%, 5%, 8%, 9%, 10%, or the like, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the density of the magnetic center pillar is 5.5-7.5 g/cm 3 For example, it may be 5.5g/cm 3 、5.8g/cm 3 、6g/cm 3 、6.5g/cm 3 、7g/cm 3 Or 7.5g/cm 3 And the like, but are not limited to the recited values, and other values not recited within the numerical range are also applicable.
The preferred density of the magnetic center pillar is 5.5-7.5 g/cm 3 And the direct-current impedance of the finally obtained inductor is ensured to be lower. When the density of the magnetic center pillars is too high or too low, the direct current resistance of the finally obtained inductor is increased.
Preferably, the temperature of the first curing treatment in step (3) is 210 ℃ or less, and may be, for example, 210 ℃, 200 ℃, 180 ℃, 150 ℃, 120 ℃ or 100 ℃, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the time of the first curing treatment is 10s or less, and may be, for example, 10s, 9s, 8s, 5s, 4s, or 2s, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the degree of curing of the magnetic center pillar after the first curing treatment is 5 to 30%, for example, 5%, 8%, 10%, 15%, 20%, 25%, or 30%, but the curing degree is not limited to the above-mentioned values, and other values not shown in the above-mentioned range are also applicable.
According to the invention, the temperature of the first curing treatment is controlled to be less than or equal to 210 ℃, and the time of the first curing treatment is controlled to be less than or equal to 10s, so that the curing degree of the magnetic center pillar after the first curing treatment is 5-30%, and the magnetic center pillar has certain strength but can not be completely cured.
Preferably, the pressure of the second pressing treatment in the step (3) is 3-10 t/cm 2 For example, it may be 3t/cm 2 、4t/cm 2 、5t/cm 2 、6t/cm 2 、7t/cm 2 、8t/cm 2 Or 10t/cm 2 And the like, but are not limited to the recited values, and other values not recited within the numerical range are also applicable.
Preferably, the temperature of the second pressing treatment is 50 to 300 ℃, and may be, for example, 50 ℃, 80 ℃, 100 ℃, 150 ℃, 200 ℃, 250 ℃, or 300 ℃, but is not limited to the recited values, and other values not recited in the numerical range are also applicable.
Preferably, the time of the second pressing treatment is 0.5 to 5min, for example, 0.5min, 1min, 2min, 3min, 4min, 4.5min, or 5min, but is not limited to the above-mentioned values, and other values not listed in the above-mentioned range are also applicable.
Preferably, the temperature of the second curing treatment in step (3) is 150 to 200 ℃, for example, 150 ℃, 155 ℃, 160 ℃, 170 ℃, 180 ℃ or 200 ℃, but not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the time of the second curing treatment is 0.5 to 3.0 hours, for example, 0.5 hour, 1 hour, 1.2 hours, 1.4 hours, 1.5 hours, 1.6 hours, 2.0 hours, 3.0 hours, etc., but is not limited to the recited values, and other values not recited in the range of the values are also applicable.
Preferably, the degree of cure of the semifinished product is > 90%, for example 90.5%, 91%, 92%, 95%, 97% or 99%, etc., but is not limited to the recited values, and other values not recited within this range of values are equally applicable.
Preferably, the thickness of the insulating layer in the insulating protection in step (4) is 5 to 15 μm, such as 5 μm, 6 μm, 7 μm, 10 μm, 12 μm or 15 μm, but not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the electroplated metal layer of step (4) comprises any one of a Cu layer, a Ni layer or a Sn layer or a combination of at least two thereof, wherein typical but non-limiting combinations include a combination of a Cu layer and a Ni layer, a combination of a Sn layer and a Cu layer or a combination of a Ni layer, a Sn layer and a Cu layer.
As a preferred technical scheme of the invention, the preparation method comprises the following steps:
(1) mixing the magnetic powder with glue to obtain a mixed raw material; the mass of the glue accounts for 1-5% of the mass of the mixed raw materials;
(2) the mixed raw materials are sequentially subjected to coating granulation and screening treatment, and then placed in a die to be subjected to pressure of 3-10 t/cm 2 Performing first pressing treatment at the temperature of 10-30 ℃ for 1-10 s to obtain a magnetic center pillar with a recess; the mesh number of the screen in the screening process is 60-250 meshes; the volume of the concave part accounts for 1-10% of the volume of the magnetic center pillar; the density of the magnetic center pillar is 5.5-7.5 g/cm 3 ；
(3) After the magnetic center pillar is subjected to first curing treatment at the temperature of less than or equal to 210 ℃, the conductor coil is assembled, and then the pressure is sequentially carried out at 3-10 t/cm 2 A second pressing treatment at 50-300 ℃ for 0.5-5 min and a second curing treatment at 150-200 ℃ for 0.5-3.0 h to obtain a curing degree>90% of semi-finished product; the time of the first curing treatment is less than or equal to 10 s; the curing degree of the magnetic center pillar after the first curing treatment is 5-30%;
(4) and sequentially carrying out insulation protection, laser paint stripping and electroplating on the semi-finished product to obtain the low-impedance inductor.
In a third aspect, the present invention further provides a use of the low impedance inductor according to the first aspect in power supply of a central processing unit.
Compared with the prior art, the invention has at least the following beneficial effects:
the preparation method of the low-impedance inductor provided by the invention is simple in process flow, and the prepared magnetic center pillar with the specific concave volume in the low-impedance inductor can effectively reduce the deformation degree of a conductor coil, so that the direct-current impedance of the inductor is reduced, and the low-impedance inductor has a wide popularization and application prospect.
Drawings
Fig. 1 is a schematic diagram of a low impedance inductor with a circular recess in the magnetic center post.
Fig. 2 is a schematic diagram of a low impedance inductor with square recesses in the magnetic center posts.
Fig. 3 is a schematic diagram of a low impedance inductor with a center pillar having a center recess.
Fig. 4 is a schematic diagram of a low impedance inductor with vertical bar shaped recesses in the magnetic center posts.
Fig. 5 is a schematic diagram of a conductor coil in a low impedance inductor provided by the present invention.
Fig. 6 is a cross-sectional view of a magnetic center post and a conductor coil provided by the present invention.
Fig. 7 is a cross-sectional view of the finished low impedance inductor provided by the present invention.
Fig. 8 is a schematic diagram of the invention providing a finished low impedance inductor.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The schematic diagrams of the magnetic center post in the low impedance inductor provided by the invention with circular, square, middle recess and vertical bar-shaped recess are shown in fig. 1-4.
The schematic diagram of the conductor coil in the low-impedance inductor provided by the invention is shown in fig. 5, the cross-sectional diagram of the magnetic center pillar and the conductor coil is shown in fig. 6, the cross-sectional diagram of the finished low-impedance inductor is shown in fig. 7, and the schematic diagram of the finished low-impedance inductor is shown in fig. 8.
The present invention is described in further detail below. The following examples are merely illustrative of the present invention and do not represent or limit the scope of the claims, which are defined by the claims.
Example 1
The embodiment provides a preparation method of a low-impedance inductor, which comprises the following steps:
(1) mixing magnetic powder formed by mixing amorphous alloy powder and alloy powder in a mass ratio of 4:6 with epoxy resin glue to obtain a mixed raw material; the mass of the glue accounts for 2% of the mass of the mixed raw materials;
(2) the mixed raw materials are sequentially subjected to coating granulation and screening treatment, and then placed in a die to be subjected to pressure of 5.5t/cm 2 Performing first pressing treatment at the temperature of 25 ℃ for 2.0s to obtain a magnetic center pillar with a recess; the screen mesh for screening separationThe mesh number of (2) is 120 meshes; the volume of the concave part accounts for 1.5% of the volume of the magnetic center pillar; the density of the magnetic center pillar is 5.9g/cm 3
(3) After the first curing treatment at the temperature of 210 ℃, the magnetic center column is assembled with a conductor coil, and then the pressure of the conductor coil is sequentially carried out at 5.0t/cm 2 A second pressing treatment at 170 ℃ for 90s and a second curing treatment at 180 ℃ for 1.5h to obtain a semi-finished product with the curing degree of more than 95 percent;
wherein the time of the first curing treatment is 10 s; the curing degree of the magnetic center pillar after the first curing treatment is 15%;
(4) the semi-finished product is sequentially subjected to insulation protection, laser paint stripping and electroplating to obtain the low-impedance inductor; the thickness of the insulating layer in the insulating protection is 10 mu m; the electroplated metal layer sequentially comprises a Cu layer, a Ni layer and a Sn layer from inside to outside.
Example 2
This example provides a method of making a low impedance inductor, which is the same as example 1 except that the volume of the recessed portion is 2.0% of the volume of the pillar.
Example 3
This example provides a method of making a low impedance inductor, which is the same as example 1 except that the volume of the recessed portion is 2.5% of the volume of the pillar.
Example 4
This example provides a method of making a low impedance inductor, which is the same as example 1 except that the volume of the recessed portion is 10% of the volume of the pillar.
Example 5
This example provides a method for manufacturing a low impedance inductor, except that the magnetic center pillar in step (2) has a density of 3g/cm 3 Otherwise, the same procedure as in example 1 was repeated.
Example 6
This example provides a method for manufacturing a low impedance inductor, which excludes the magnetic property in step (2)The density of the center pillar was 7.8g/cm 3 Otherwise, the same procedure as in example 1 was repeated.
Example 7
This example provides a method of manufacturing a low impedance inductor, which is the same as example 1 except that the degree of curing of the magnetic center pillar after the first curing process in step (3) is 2%.
Example 8
This example provides a method of manufacturing a low impedance inductor, which is the same as example 1 except that the degree of curing of the magnetic center pillar after the first curing process in step (3) is 35%.
Comparative example 1
The comparative example provides a method for manufacturing an inductor, which is the same as that in example 1 except that the processed mixed powder is directly placed in a conductor coil and only subjected to second pressing treatment, and specifically comprises the following steps:
(1) mixing magnetic powder formed by mixing amorphous alloy powder and alloy powder in a mass ratio of 4:6 with epoxy resin glue to obtain mixed raw materials; the mass of the glue accounts for 2% of the mass of the mixed raw materials;
(2) the mixed raw materials are sequentially subjected to coating granulation and screening treatment, then placed in a conductor coil and subjected to pressure of 5.0t/cm 2 After pressing treatment at the temperature of 170 ℃ for 90s, sequentially carrying out insulation protection, laser paint stripping and electroplating to obtain the low-impedance inductor; the thickness of the insulating layer in the insulating protection is 10 mu m; the electroplated metal layer sequentially comprises a Cu layer, a Ni layer and a Sn layer from inside to outside.
Comparative example 2
This comparative example provides a method of manufacturing an inductor, which is the same as in example 1 except that the first curing treatment and the second curing treatment are not performed, and specifically includes the steps of:
(1) mixing magnetic powder formed by mixing amorphous alloy powder and alloy powder in a mass ratio of 4:6 with epoxy resin glue to obtain mixed raw materials; the mass of the glue accounts for 2% of the mass of the mixed raw materials;
(2) the mixed raw materials are sequentially subjected to coating granulation and screening treatment, and then placed in a die to be subjected to pressure of 5.5t/cm 2 Performing first pressing treatment at the temperature of 25 ℃ for 2.0s to obtain a magnetic center pillar with a recess; the mesh number of the screen in the screening process is 120 meshes; the volume of the concave part accounts for 1.5% of the volume of the magnetic center pillar; the density of the magnetic center pillar is 5.9g/cm 3
(3) After the conductor coil is assembled on the magnetic center pillar, the pressure is 5.0t/cm 2 Performing second pressing treatment at the temperature of 170 ℃ for 90s to obtain a semi-finished product;
(4) the semi-finished product is sequentially subjected to insulation protection, laser paint stripping and electroplating to obtain the low-impedance inductor; the thickness of the insulating layer in the insulating protection is 10 mu m; the electroplated metal layer sequentially comprises a Cu layer, a Ni layer and a Sn layer from inside to outside.
Comparative example 3
This comparative example provides a method of manufacturing a low impedance inductor, which is the same as example 1 except that the volume of the depressed portion is 0.3% of the volume of the pillar in the magnetic field.
Comparative example 4
This comparative example provides a method of manufacturing a low impedance inductor, which is the same as example 1 except that the volume of the depressed portion is 13% of the volume of the pillar in the magnetic field.
The direct-current impedance of the inductors obtained in the above examples and comparative examples was measured using a direct-current resistance tester (AX-1152D), and the results are shown in Table 1.
TABLE 1
As can be seen from table 1:
(1) the embodiment 1-4 is integrated, so that the direct current impedance of the low-impedance inductor obtained by the preparation method of the low-impedance inductor can reach below 30.2m omega, and the method has a wide popularization and application prospect;
(2) it can be seen from the combination of the embodiment 1 and the embodiments 5 to 8 that when the density of the magnetic center pillars in the step (2) is too low or too high, the curing degree of the magnetic center pillars after the first curing treatment in the step (3) is too low or too high, which increases the dc resistance of the finally obtained inductor;
(3) it can be seen from the comprehensive examples 1 and comparative examples 1-2 that in comparative example 1, the processed mixed powder is directly placed in the conductor coil and only subjected to the second pressing treatment, and in comparative example 2, the first curing treatment and the second curing treatment are not performed, so that the conductor coil is poor in stress condition and easy to deform, and the direct-current impedance of the inductor is increased;
(4) it can be seen from the combination of example 1 and comparative examples 3 to 4 that when the volume of the recessed portion is too low or too high in proportion to the volume of the magnetic center pillar, the deformation degree of the conductor coil is greatly increased, and further the dc impedance of the inductor is increased.
In conclusion, the preparation method of the low-impedance inductor provided by the invention is simple in process flow, and the prepared magnetic center pillar with the specific concave volume in the low-impedance inductor can effectively reduce the deformation degree of the conductor coil, so that the direct-current impedance of the inductor is reduced, and the preparation method has a wide popularization and application prospect.
The applicant declares that the above description is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. A low impedance inductor, comprising a magnetic center post with a recess; the volume of the concave part accounts for 1-10% of the volume of the magnetic center pillar.
2. The low impedance inductor of claim 1, wherein the cross-sectional shape of the magnetic center pillar comprises any one of a circle, square, oval, or racetrack shape;
preferably, the shape of the recess comprises any one or a combination of at least two of a groove, an opening, a dimple or a thread.
3. The low impedance inductor of claim 1 or claim 2, wherein the magnetic center post is provided with a conductor coil on the outside;
preferably, the conductor coil is formed by winding at least one strand of conducting wire, and the conducting wire comprises a round wire or a flat wire;
preferably, the material of the conductor coil includes metal.
4. A method of manufacturing a low impedance inductor according to any of claims 1 to 3, comprising the steps of:
(1) mixing the magnetic powder with glue to obtain a mixed raw material;
(2) the mixed raw materials are sequentially subjected to coating granulation and screening treatment, and then are placed in a die for first pressing treatment to obtain a magnetic center pillar with a recess;
(3) assembling a conductor coil after the magnetic center pillar is subjected to first curing treatment, and then sequentially performing second pressing treatment and second curing treatment to obtain a semi-finished product;
(4) and sequentially carrying out insulation protection, laser paint stripping and electroplating on the semi-finished product to obtain the low-impedance inductor.
5. The preparation method according to claim 4, wherein the glue in the step (1) accounts for 1-5% of the mixed raw materials by mass.
6. The production method according to claim 4 or 5, wherein the mesh number of the screen in the screening treatment in the step (2) is 60 to 250 meshes;
preferably, the pressure of the first pressing treatment in the step (2) is 3-10t/cm 2 ；
Preferably, the temperature of the first pressing treatment in the step (2) is 10-30 ℃;
preferably, the time of the first pressing treatment in the step (2) is 1-10 s;
preferably, the volume of the concave part accounts for 1-10% of the volume of the magnetic center pillar in the step (2);
preferably, the density of the magnetic center pillar in the step (2) is 5.5-7.5 g/cm 3 。
7. The method according to any one of claims 4 to 6, wherein the temperature of the first curing treatment in the step (3) is 210 ℃ or less;
preferably, the time of the first curing treatment in the step (3) is less than or equal to 10 s;
preferably, the degree of curing of the magnetic center pillar after the first curing treatment in the step (3) is 5 to 30%.
8. The production method according to any one of claims 4 to 7, wherein the pressure of the second press treatment in the step (3) is 3 to 10t/cm 2 ；
Preferably, the temperature of the second pressing treatment in the step (3) is 50-300 ℃;
preferably, the time of the second pressing treatment in the step (3) is 0.5-5 min.
Preferably, the temperature of the second curing treatment in the step (3) is 150-200 ℃;
preferably, the time of the second curing treatment in the step (3) is 0.5-3.0 h;
preferably, the degree of cure of the semi-finished product of step (3) is > 90%.
9. The method according to any one of claims 4 to 8, wherein the method comprises the steps of:
(1) mixing the magnetic powder with glue to obtain a mixed raw material; the mass of the glue accounts for 1-5% of the mass of the mixed raw materials;
(2) the mixed raw materialsAfter being sequentially subjected to coating granulation and screening treatment, the mixture is placed in a die and subjected to pressure of 3-10 t/cm 2 Performing first pressing treatment at the temperature of 10-30 ℃ for 1-10 s to obtain a magnetic center pillar with a recess; the mesh number of the screen in the screening process is 60-250 meshes; the volume of the concave part accounts for 1-10% of the volume of the magnetic center pillar; the density of the magnetic center pillar is 5.5-7.5 g/cm 3 ；
(3) After the magnetic center pillar is subjected to first curing treatment at the temperature of less than or equal to 210 ℃, the conductor coil is assembled, and then the pressure is sequentially carried out at 3-10 t/cm 2 A second pressing treatment at 50-300 ℃ for 0.5-5 min and a second curing treatment at 150-200 ℃ for 0.5-3.0 h to obtain a curing degree>90% of semi-finished product; the time of the first curing treatment is less than or equal to 10 s; the curing degree of the magnetic center post after the first curing treatment is 5-30%;
(4) and sequentially carrying out insulation protection, laser paint stripping and electroplating on the semi-finished product to obtain the low-impedance inductor.
10. Use of a low impedance inductor as claimed in any one of claims 1 to 3 in powering a central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210766413.5A CN115116711A (en) | 2022-06-30 | 2022-06-30 | Low-impedance inductor and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210766413.5A CN115116711A (en) | 2022-06-30 | 2022-06-30 | Low-impedance inductor and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115116711A true CN115116711A (en) | 2022-09-27 |
Family
ID=83330379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210766413.5A Pending CN115116711A (en) | 2022-06-30 | 2022-06-30 | Low-impedance inductor and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115116711A (en) |
-
2022
- 2022-06-30 CN CN202210766413.5A patent/CN115116711A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111755233A (en) | Sectional forming micro-inductor manufacturing process | |
| KR102491048B1 (en) | Method of manufacturing a chip inductance with integrated metal magnetic powder core | |
| CN112655060B (en) | Integrally formed inductor and manufacturing method thereof | |
| CN112489972A (en) | Inductor and preparation method thereof | |
| US8707547B2 (en) | Method for fabricating a lead-frameless power inductor | |
| CN109448969A (en) | A kind of heavy-current inductor mold and manufacturing method | |
| CN115116711A (en) | Low-impedance inductor and preparation method and application thereof | |
| CN112786302A (en) | Inductor and compression molding method thereof | |
| CN114999808A (en) | Compression molding inductor and preparation method and application thereof | |
| WO2024098631A1 (en) | Inductor assembly, and manufacturing method therefor and use thereof | |
| CN115631937A (en) | Low-impedance inductor and manufacturing method and application thereof | |
| US20140292462A1 (en) | Power inductor and method for fabricating the same | |
| CN107749340A (en) | A kind of high reliability high current molding inductance and manufacture method | |
| CN114512309A (en) | Cylindrical inductor precursor and preparation method and application thereof | |
| CN116487143A (en) | Manufacturing method of integrated inductor and inductor manufactured by using same | |
| CN204010890U (en) | Inductor | |
| CN102214510B (en) | Ferronickel soft magnetic material and manufacturing method thereof | |
| CN102306530B (en) | Fe-Ni alloy soft magnetic material with magnetic permeability mu of 60 and manufacturing method for Fe-Ni alloy soft magnetic material | |
| CN111899970A (en) | Preparation method of inductor | |
| CN115295299B (en) | Preparation method and application of integrated inductor | |
| CN115527768A (en) | Inductor and preparation method and application thereof | |
| JPS58132907A (en) | Manufacture of inductor | |
| CN114999815A (en) | Compression molding inductor and preparation method and application thereof | |
| CN218631610U (en) | Surface-mounted inductor for realizing high performance by small thinning | |
| TWI729910B (en) | Magnetic core, manufacturing method of magnetic core electrode and inductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |