CN114995550A - On-chip fully-integrated temperature regulation and control system framework - Google Patents
On-chip fully-integrated temperature regulation and control system framework Download PDFInfo
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- CN114995550A CN114995550A CN202210827475.2A CN202210827475A CN114995550A CN 114995550 A CN114995550 A CN 114995550A CN 202210827475 A CN202210827475 A CN 202210827475A CN 114995550 A CN114995550 A CN 114995550A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses an on-chip fully-integrated temperature regulation and control system framework, which comprises a power supply management module, a heating unit, a control system and a temperature sensor for detecting the temperature of an area where the heating unit is located; the output end of the power supply management module is connected with the input end of the heating unit, the output end of the temperature sensor is connected with the input end of the control system, the output end of the control system is connected with the control end of the power supply management module, the system framework can realize temperature control on a chip, and the constant temperature system is miniaturized.
Description
Technical Field
The invention relates to a temperature control system framework, in particular to an on-chip fully integrated temperature control system framework.
Background
In today's life, temperature is an important physical parameter and is regarded as important in many ways. In laboratories, especially in biological laboratories for the culture of bacteria and microorganisms, requirements on a constant temperature experimental environment are strict in order to obtain more accurate experimental data. Therefore, a system capable of providing a constant temperature environment is important for a laboratory, and has a great influence on the research process and the research result of the laboratory. For the MENS device which is widely developed at present, the characteristic of the MENS device is often strongly correlated with the temperature, so that the provision of a stable temperature environment can also well promote the development and application of the device. Meanwhile, in the medical field, medical supplies such as storage and transportation of medicines and reagents, refrigeration and heat preservation of vaccines and blood and the like also need a system capable of providing a constant temperature environment.
Because the temperature is used as the nonlinear time-varying property and large hysteresis of the control object, the designed thermostatic control system is required to be stable, accurate and fast, a control object which is suitable for nonlinearity and uncertain mathematical models is required, the thermostatic control system has certain adaptability to the time-varying property and time-varying property of the controlled object, and simultaneously has stronger inhibition effect on noise, namely, the control algorithm with better robustness is used for carrying out simple and effective control on the system which is complicated and is difficult to establish the mathematical models.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an on-chip fully integrated temperature regulation and control system framework which can realize temperature control on a chip and miniaturize a constant temperature system.
In order to achieve the aim, the on-chip fully-integrated temperature regulation and control system framework comprises a power supply management module, a heating unit, a control system and a temperature sensor for detecting the temperature of an area where the heating unit is located;
the output end of the power management module is connected with the input end of the heating unit, the output end of the temperature sensor is connected with the input end of the control system, and the output end of the control system is connected with the control end of the power management module.
The power management module is of a dc-dc converter structure.
The heating unit is an on-chip resistor.
The temperature sensor is a fully integrated on-chip temperature sensor.
The control system is an integral logic control circuit.
The dc-dc converter structure comprises a main power switch tube, a power supply logic control circuit, a ring oscillator, a low-dropout linear regulator and a band-gap reference, wherein the main power switch tube is connected with the power supply logic control circuit, the power supply logic control circuit is connected with the overall logic control circuit, and the band-gap reference is connected with the ring oscillator, the power supply logic control circuit and the overall logic control circuit through the low-dropout linear regulator.
The ring oscillator outputs two reference voltages V through the low dropout linear regulator H 、V L To adjust the delay time of the ring oscillator.
The low dropout linear regulator consists of an operational amplifier with high gain and wide input, a power tube and a feedback unit.
The band-gap reference circuit adopts a self-biasing structure.
The invention has the following beneficial effects:
when the fully-integrated on-chip temperature regulation and control system is in specific operation, a voltage signal obtained by the temperature sensor is compared with an input set temperature signal, a control signal is generated by the control system according to a comparison result and is used as a reference signal for digital power supply PID control to control the output voltage of the digital power supply, the voltage generates heat on a chip through the heating unit, constant temperature operation is realized, and the problem of miniaturization of a thermostat is solved.
Drawings
FIG. 1 is a schematic diagram of the present invention;
FIG. 2 is a schematic structural view of a temperature sensor;
FIG. 3 is a schematic diagram of a ring oscillator;
FIG. 4 is a circuit schematic of the present invention;
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments, and are not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
There is shown in the drawings a schematic block diagram of a disclosed embodiment in accordance with the invention. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers and their relative sizes and positional relationships shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, according to actual needs.
Referring to fig. 1, the on-chip fully integrated temperature control system architecture of the present invention includes a power management module, a heating unit, a control system, and a temperature sensor for detecting the temperature of an area where the heating unit is located; the output end of the power management module is connected with the input end of the heating unit, the output end of the temperature sensor is connected with the input end of the control system, and the output end of the control system is connected with the control end of the power management module.
Referring to fig. 2, the temperature sensor according to the present invention uses a PMOS and NMOS cascade in which the PMOS gate is connected to its source and the NMOS gate is connected to its drain, and the structure is employed to generate the temperature sensing voltage V PTAT 。
In the whole structure, the band gap reference circuit BGR is used for providing necessary voltage reference and current bias for an analog circuit part in the whole chip; LDO for generating working voltage VDDL of digital circuit module in chip and bias voltage V required by ring oscillator OSC H 、V L (ii) a The ring oscillator OSC is used for generating a stable serial port output clock, can be generated inside a chip, and can also be used as an external crystal oscillator device for quantization and outputOf the reference clock.
Referring to fig. 3, the ring oscillator OSC is composed of a hysteresis comparator and an inverter-based oscillator. Low dropout regulator LDO output V H 、V L The output end of the hysteresis comparator is connected with one end of a phase inverter and one end of a capacitor, the other end of the capacitor is grounded, the other end of the phase inverter is connected with a CLK signal input unit, and the output frequency of the ring oscillator OSC is controlled by charging and discharging the capacitor.
Referring to fig. 4, the dc-dc converter structure includes a main power switch tube 1, a power logic control circuit 2, a ring oscillator OSC, a low dropout regulator LDO, and a bandgap reference BGR, wherein the main power switch tube 1 is connected to the power logic control circuit 2, the power logic control circuit 2 is connected to the global logic control circuit 3, and the bandgap reference BGR is connected to the ring oscillator OSC, the power logic control circuit 2, and the global logic control circuit 3 via the low dropout regulator LDO; the ring oscillator OSC outputs two reference voltages V through the low dropout regulator LDO H 、V L To adjust the delay time of the ring oscillator OSC; the LDO consists of an operational amplifier with high gain and wide input, a power tube and a feedback unit; the band gap reference circuit BGR adopts a self-bias structure.
Referring to fig. 1 to 4, in operation, the temperature sensor converts the temperature into an analog voltage signal, the analog voltage signal is converted into a digital signal by the analog-to-digital converter, the digital signal is input into the control system, the digital signal corresponding to the set temperature is operated, a control signal is generated according to the operation, the control signal is input into the DPID module, the other input of the DPID module is the digital signal obtained by a/D conversion of the output feedback voltage of the buck circuit, the output of the DPID module is generated into a square wave signal with a certain duty ratio for controlling the power tube switch through the DPWM module to control the output voltage, and the output voltage generates heat through the heating unit so that the temperature reaches the set value.
The above-described embodiments are merely exemplary and are not intended to limit the present invention, and any modification, equivalent replacement, or improvement made within the spirit and principle of the overall structure of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. An on-chip fully integrated temperature regulation system framework is characterized by comprising a power supply management module, a heating unit, a control system and a temperature sensor for detecting the temperature of an area where the heating unit is located;
the output end of the power management module is connected with the input end of the heating unit, the output end of the temperature sensor is connected with the input end of the control system, and the output end of the control system is connected with the control end of the power management module.
2. The on-chip fully integrated temperature regulation system architecture of claim 1, wherein the power management module is a dc-dc converter architecture.
3. The on-chip fully integrated temperature regulation system architecture of claim 1, wherein the heating unit (4) is an on-chip resistor.
4. The on-chip fully integrated temperature regulation system architecture of claim 1, wherein the temperature sensor is a fully integrated on-chip temperature sensor.
5. The on-chip fully integrated temperature regulation system architecture of claim 1, characterized in that the control system is an overall logic control circuit (3).
6. The on-chip fully integrated temperature control system architecture according to claim 2, wherein the dc-dc converter structure comprises a main power switch (1), a power logic control circuit (2), a ring Oscillator (OSC), a low dropout linear regulator (LDO), and a bandgap reference (BGR), wherein the main power switch (1) is connected to the power logic control circuit (2), the power logic control circuit (2) is connected to the global logic control circuit (3), and the bandgap reference (BGR) is connected to the ring Oscillator (OSC), the power logic control circuit (2), and the global logic control circuit (3) via the low dropout linear regulator (LDO).
7. The on-chip fully integrated temperature regulation system architecture of claim 6, wherein the ring Oscillator (OSC) outputs two reference voltages V through a low dropout linear regulator (LDO) H 、V L To adjust the delay time of the ring Oscillator (OSC).
8. The on-chip fully integrated temperature control system architecture of claim 6, wherein the low dropout linear regulator (LDO) is composed of a high gain wide input operational amplifier and a power tube and feedback unit.
9. The on-chip fully integrated temperature regulation system architecture of claim 6, wherein the band gap reference circuit (BGR) employs a self-biasing structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210827475.2A CN114995550A (en) | 2022-07-14 | 2022-07-14 | On-chip fully-integrated temperature regulation and control system framework |
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| CN202210827475.2A CN114995550A (en) | 2022-07-14 | 2022-07-14 | On-chip fully-integrated temperature regulation and control system framework |
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| CN103176489A (en) * | 2013-02-06 | 2013-06-26 | 南京千韵电子科技有限公司 | Method and device for controlling chip inner temperature and experiment instrument based on same method |
| CN203178831U (en) * | 2013-02-06 | 2013-09-04 | 南京千韵电子科技有限公司 | Chip internal temperature control device and experimental instrument |
| CN203933396U (en) * | 2014-07-01 | 2014-11-05 | 王帅 | DC-to-DC converter |
| CN104467416A (en) * | 2014-11-26 | 2015-03-25 | 上海华力微电子有限公司 | DC-DC switching circuit |
| CN204721219U (en) * | 2015-04-09 | 2015-10-21 | 杭州宽福科技有限公司 | A kind of dc-dc chip |
| CN111266139A (en) * | 2020-03-02 | 2020-06-12 | 京东方科技集团股份有限公司 | Temperature control system, detection system and temperature control method of micro-fluidic chip |
| CN112994443A (en) * | 2019-12-16 | 2021-06-18 | 上海交通大学 | Power management system applied to low-power-consumption fully-integrated system-level chip |
| WO2021159797A1 (en) * | 2020-02-14 | 2021-08-19 | 深圳市紫光同创电子有限公司 | Power source management system and power source management method for sram module, and fpga chip |
-
2022
- 2022-07-14 CN CN202210827475.2A patent/CN114995550A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103176489A (en) * | 2013-02-06 | 2013-06-26 | 南京千韵电子科技有限公司 | Method and device for controlling chip inner temperature and experiment instrument based on same method |
| CN203178831U (en) * | 2013-02-06 | 2013-09-04 | 南京千韵电子科技有限公司 | Chip internal temperature control device and experimental instrument |
| CN203933396U (en) * | 2014-07-01 | 2014-11-05 | 王帅 | DC-to-DC converter |
| CN104467416A (en) * | 2014-11-26 | 2015-03-25 | 上海华力微电子有限公司 | DC-DC switching circuit |
| CN204721219U (en) * | 2015-04-09 | 2015-10-21 | 杭州宽福科技有限公司 | A kind of dc-dc chip |
| CN112994443A (en) * | 2019-12-16 | 2021-06-18 | 上海交通大学 | Power management system applied to low-power-consumption fully-integrated system-level chip |
| WO2021159797A1 (en) * | 2020-02-14 | 2021-08-19 | 深圳市紫光同创电子有限公司 | Power source management system and power source management method for sram module, and fpga chip |
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