CN114985945B - Pattern marking method - Google Patents
Pattern marking method Download PDFInfo
- Publication number
- CN114985945B CN114985945B CN202210545534.7A CN202210545534A CN114985945B CN 114985945 B CN114985945 B CN 114985945B CN 202210545534 A CN202210545534 A CN 202210545534A CN 114985945 B CN114985945 B CN 114985945B
- Authority
- CN
- China
- Prior art keywords
- marking
- laser beam
- pattern
- continuous laser
- continuous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 39
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 21
- 238000010330 laser marking Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 56
- 238000003754 machining Methods 0.000 description 14
- 239000000126 substance Substances 0.000 description 7
- 230000000007 visual effect Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a pattern marking method, and belongs to the technical field of material processing. The method comprises the following steps: marking by using a first marking light spot formed on the surface of a product to be processed by a pulse laser beam to form a first marking pattern; and marking the second marking light spots formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power to form a target marking pattern. The method comprises the steps of firstly removing the oxide layer on the surface of the product by using the pulse laser beam, avoiding the lower glossiness of the pattern obtained by the oxide layer, and then completing the marking by using a plurality of continuous laser beams in sequence, so that on one hand, the oxide layer with higher brightness can be obtained by using the laser with high energy density, the glossiness is improved, and the protection of the oxide layer is provided, thereby improving the product quality; on the other hand, the laser marking speed can be improved by utilizing the characteristics of small laser spot, high energy density and high marking speed.
Description
Technical Field
The invention relates to the technical field of material processing, in particular to a pattern marking method.
Background
In the related art, pattern marking and polishing operations on the surface of a product can be realized by adopting modes of mechanical processing, chemical dissolution, electrochemical electrolysis and the like, so as to mark a required pattern on the surface of the product to be processed.
However, both machining and chemical/electrochemical machining belong to contact machining, the product is easy to damage, and specifically, mechanical extrusion or mechanical stress generated in machining and chemical reaction generated in chemical/electrochemical are likely to damage the product, so that the quality of the final product can be affected, meanwhile, the traditional mode has large machining area and large influence range, and fine machining on a small scale is difficult to achieve.
Disclosure of Invention
The invention mainly aims to provide a pattern marking method, which aims to solve the technical problem of lower quality precision of marking patterns on the surface of a product in the prior art.
According to a first aspect of the present invention, there is provided a pattern marking method, the method comprising:
marking by using a first marking light spot formed on the surface of a product to be processed by a pulse laser beam to form a first marking pattern;
and marking the second marking light spots formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power to form a target marking pattern.
Optionally, the marking is performed on the second marking light spot formed on the first marking pattern by sequentially using at least two continuous laser beams with sequentially increased power, so as to form a target marking pattern, including:
and marking the second marking light spots formed on the first marking pattern by using the continuous laser beams with four beams of sequentially increased power along a preset marking track to form the target marking pattern.
Optionally, the preset marking track is determined according to an edge shrinking dimension corresponding to the continuous laser beam, the edge shrinking dimension is a shrinking dimension of an edge of the preset marking track of the continuous laser beam relative to an edge of the first marking pattern, different edge shrinking dimensions of the continuous laser beam are different, and four edge shrinking dimensions corresponding to the continuous laser beam with four sequentially increased powers are sequentially increased.
Optionally, the marking speed of the pulse laser beam is 2000mm/s, the laser power of the pulse laser beam is 80% of the maximum power, the laser pulse width of the pulse laser beam is 50ns, and the laser frequency of the pulse laser beam is 100KHz.
Optionally, the marking speed of a first continuous laser beam in the four continuous laser beams with sequentially increased power is 1800mm/s, the laser power of the first continuous laser beam is 50% of the maximum power, and the laser frequency of the first continuous laser beam is 150-200KHz.
Optionally, the marking speed of a second continuous laser beam in the continuous laser beams with four sequentially increased power is 2000mm/s, the laser power of the second continuous laser beam is 60% of the maximum power, and the laser frequency of the second continuous laser beam is 100-200KHz.
Optionally, the marking speed of a third continuous laser beam in the four continuous laser beams with sequentially increased power is 2200mm/s, the laser power of the third continuous laser beam is 70% of the maximum power, and the laser frequency of the third continuous laser beam is 150-200KHz.
Optionally, the marking speed of a fourth continuous laser beam in the four continuous laser beams with sequentially increased power is 2300mm/s, the laser power of the fourth continuous laser beam is 80% of the maximum power, and the laser frequency of the fourth continuous laser beam is 200-220KHz.
Optionally, the method further includes, after the marking is performed on the second marking light spot formed on the first marking pattern by sequentially using at least two continuous laser beams with sequentially increased power to form a target marking pattern:
and detecting the glossiness of the target marking pattern by using a glossiness meter to obtain the surface glossiness of the target marking pattern.
Optionally, the product to be processed is made of aluminum alloy.
The embodiment of the invention provides a pattern marking method, which is characterized in that a first marking light spot formed on the surface of a product to be processed by a pulse laser beam is used for marking to form a first marking pattern; and marking the second marking light spots formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power to form a target marking pattern.
The method comprises the steps of firstly removing the oxide layer on the surface of the product by using the pulse laser beam, avoiding the lower glossiness of the pattern obtained by the oxide layer, and then completing the marking by using a plurality of continuous laser beams in sequence, so that on one hand, the oxide layer with higher brightness can be obtained by using the laser with high energy density, the glossiness is improved, and the protection of the oxide layer is provided, thereby improving the product quality; on the other hand, the laser marking speed can be improved by utilizing the characteristics of small laser spot, high energy density and high marking speed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a first embodiment of a pattern marking method of the present invention;
FIG. 2 is a flowchart illustrating the process after step S102 in FIG. 1 according to the present invention;
fig. 3 is a schematic structural diagram of a pattern marking apparatus according to an embodiment of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The main solutions of the embodiments of the present invention are: marking by using a first marking light spot formed on the surface of a product to be processed by a pulse laser beam to form a first marking pattern; and marking the second marking light spots formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power to form a target marking pattern.
In the related art, pattern marking and polishing operations on the surface of a product can be realized by adopting modes of mechanical processing, chemical dissolution, electrochemical electrolysis and the like, so as to mark a required pattern on the surface of the product to be processed. However, both machining and chemical/electrochemical machining belong to contact machining, the product is easy to damage, and specifically, mechanical extrusion or mechanical stress generated in machining and chemical reaction generated in chemical/electrochemical are likely to damage the product, so that the quality of the final product can be affected, meanwhile, the traditional mode has large machining area and large influence range, and fine machining on a small scale is difficult to achieve.
The invention provides a solution, firstly, the oxide layer on the surface of the product is removed by using the pulse laser beam, the lower glossiness of the pattern obtained later is avoided from being caused by the oxide layer, and then, marking is completed by sequentially using a plurality of continuous laser beams, on one hand, the oxide layer with higher brightness can be obtained by using the laser with high energy density, so that the glossiness is improved, and the protection of the oxide layer is provided, thereby improving the product quality; on the other hand, the laser marking speed can be improved by utilizing the characteristics of small laser spot, high energy density and high marking speed.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms "first" and "second" in the description and claims of embodiments of the invention are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order, and it should be understood that such data may be interchanged in appropriate circumstances such that the embodiments described herein may be practiced in other than those illustrated or described.
The invention provides a first embodiment of a pattern marking method. Referring to fig. 1, fig. 1 is a flowchart of a first embodiment of a pattern marking method according to the present invention.
In this embodiment, the method includes:
step S101, marking is carried out by utilizing a first marking light spot formed on the surface of a product to be processed by a pulse laser beam, so as to form a first marking pattern;
as described above, in this embodiment, the laser marking method is adopted to form the required pattern on the surface of the product to be processed, specifically, the marking is controlled by a computer program instead of manual marking, so that the design of the pattern and the setting of the laser parameters are required before the formal processing. Firstly, for a required marking pattern, the marking pattern can be designed on a related software interface provided by control equipment (the control equipment can be electronic equipment such as a computer) and can specifically comprise the shape appearance, the size and the color of the first marking pattern; for a pulsed laser beam, the corresponding marking speed, laser power, laser pulse width and laser frequency may be set on the control device. It should be noted that, in addition to the pattern, various contents such as characters and numerals may be marked in the method according to the present embodiment, and the related method flow is explained by taking the pattern as an example only in this embodiment, which is not limited thereto.
After the setting is completed, the marking operation can be started. Specifically, firstly, a product to be processed is placed in a processing area where a jig with a compression vacuum device is located, then the compression vacuum device jig is started to decompress the processing area, so that the product to be processed is adsorbed and fixed in the processing area by utilizing air pressure difference, the condition that the product to be processed is not uneven in height in the processing process is ensured, further the quality of subsequent processing is ensured, then a computer preset motion program is started, namely, a program related to pattern design and laser parameter setting is started, after the program is started, a control device controls a laser marking head to move to the processing area, then a pulse laser beam is output, so that the pulse laser with controlled repetition high frequency is output, a certain frequency and a certain pulse width are formed, the pulse laser beam is conducted and reflected through an optical path and focused on the surface of the product to be processed through a focusing lens group in the laser marking head, a fine light spot with high energy density is formed, and the height position of the laser marking head relative to the product to be processed can be adjusted through a lifting shaft, so that the focus of the laser beam is positioned near the surface of the product to be processed, and thus the high-energy density light spot is provided for instantly melting or gasifying the processed material. Each high-energy laser pulse can instantly splash a tiny hole on the surface of an object, and under the control of the control equipment, the laser marking head and a product to be processed perform continuous relative movement dotting according to a predesigned graph, namely the first marking graph, namely marking processing is performed along a path formed by edge lines corresponding to the first marking graph, so that a first marking graph is formed on the surface of the product to be processed.
It should be noted that, in this embodiment, specific parameters of the pulse laser beam may be set as follows: the marking speed is 2000mm/s, the laser power is 80% of the maximum power, the laser pulse width is 50ns, and the laser frequency is 100KHz. It should be clear at first that the parameter setting here is a preferred setting scheme, which in practical applications can be adjusted according to practical requirements, and the objective to be achieved for setting the resulting pulsed laser beam is: and carrying out marking processing along a path formed by the edge lines corresponding to the first marking pattern to form the first marking pattern, and simultaneously, removing an oxide layer on the surface of the product by using enough energy provided by the pulse laser beam and forming a contour line corresponding to the first marking pattern on the surface of the product to be processed. It should be emphasized that the product to be processed in this embodiment may be made of an aluminum alloy material, and for the aluminum alloy material, an oxide layer containing an oxide such as aluminum oxide is formed thereon when exposed to air, and this oxide layer is rough and dull, which obviously affects the smoothness and glossiness of the pattern obtained by subsequent processing, so that during processing, the oxide layer needs to be removed first to ensure that the surface glossiness of the pattern of the product obtained subsequently can meet the requirements.
Step S102, marking is carried out on the second marking light spots formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power, so as to form a target marking pattern.
After the first marking operation is completed by using the pulse laser beam, the oxide layer on the surface of the obtained first marked pattern is removed, and in order to further improve the glossiness of the marked pattern surface, the marking may be further performed on the first marked pattern by using the continuous laser beam in this embodiment. Specifically, at least two continuous laser beams with sequentially increased power are sequentially utilized to mark a second marking light spot formed on the first marking pattern, so that a target marking pattern is formed. It should be noted that, the laser in step S101 is a pulsed laser, the object to be processed is an oxide layer on the surface of the product to be processed, and specifically, a dotting operation is performed on the oxide layer by a pulse output manner, so as to remove the oxide layer and form a corresponding contour line, i.e. a first marking pattern; the laser in this step is a continuous laser, the object to be processed is a first marking pattern, it is not difficult to understand that the first marking pattern is obtained after removing the oxide layer, so that the oxide layer does not exist on the first marking pattern, and the effect of the continuous laser beam is obviously not to remove the oxide layer, unlike the effect of the pulse laser beam, specifically, since the high-energy high-temperature environment provided by the continuous laser beam is required to oxidize the surface of the first marking pattern, the effect of the continuous laser beam is to add the oxide layer on the surface of the first marking pattern, but the oxide layer formed at this time is different from the naturally-formed oxide layer, and because the continuous laser beam can provide high energy, particularly after focusing, a very fine and extremely high-energy-density laser beam is output, and a corresponding marking spot is formed.
Further, the specific number and parameters of at least two consecutive laser beams with sequentially increased power used in the embodiment may also be obtained by setting in the control device before the final processing, in a specific embodiment, the number of consecutive laser beams may be set to 4, that is, the power of the 4 consecutive laser beams is sequentially increased, for convenience of distinction, the parameters may be set to 1800mm/s for the first consecutive laser beam, the laser power is 50% of the maximum power, and the laser frequency is 150-200KHz for the first consecutive laser beam; for the second continuous laser beam, the parameters can be set to be that the marking speed is 2000mm/s, the laser power is 60% of the maximum power, and the laser frequency is 100-200KHz; for the third continuous laser beam, the parameter can be set to be 2200mm/s of marking speed, 70% of the maximum power of laser power and 150-200KHz of laser frequency; for the fourth continuous laser beam, the parameter can be set to be marked with the speed of 2300mm/s, the laser power is 80% of the maximum power, and the laser frequency is 200-220KHz. Also, the number setting and the parameter setting are a preferable setting scheme, and can be adjusted according to actual requirements in practical application, i.e. can be dynamically adjusted within a preset range.
In addition, it is also necessary to supplement the explanation: 1. in practical application, no matter how many continuous laser beams are arranged, the power of the continuous laser beams is gradually increased along with the marking sequence (the marking sequence can be arranged in the control equipment), the corresponding marking speed and the laser frequency also have an ascending trend, the aim is to continuously increase the energy output, repeatedly marking and polishing the first marking pattern to continuously increase the glossiness of the pattern, finally, the target marking pattern with the surface glossiness meeting the requirement is obtained, and the superposition of the multi-layer oxide layers can also provide multi-layer protection for the target marking pattern, meanwhile, if each marking operation corresponds to the pattern layers with different colors, the most can be increased through the superposition of the different colorsThe visual effect of the obtained product; 2. in order to output continuous laser beam, parameter adjustment can be performed according to the attribute of the laser, for example, MOPA200WM7 series laser can be adopted in the embodiment, the maximum single pulse energy of the laser can be 1.5mJ, and the repetition frequency is 1-4000KH Z The pulse width is 1-500ns, the marking speed is 1-5000mm/s, the software marks the pattern layer range of 0-255 layers, for the laser, the pulse width can be set to be 1ns to output continuous laser beams, the laser power is also determined according to the maximum power of the laser, and the specific laser can be selected according to the requirement in practical application; 3. as described above, the contour lines of the desired pattern are already marked when the first marking is performed with the pulse laser beam, and the subsequent use of the continuous laser beam aims at providing the oxidation protection layer and increasing the glossiness, that is, the subsequent marking is performed on the first marked pattern instead of re-marking the new pattern, so that the marking track of the subsequent continuous laser beam must be along the contour lines formed by the pulse laser beam. Then, in order to prevent the occurrence of a burst point on the marked edge during the marking process using the continuous laser beam, the marking track of the continuous laser beam cannot completely coincide with the contour line of the first marking pattern, but should be appropriately shrunk by a bit, that is, the marked pattern is uniform during each marking process, and a new round of marking is performed on the basis of the pattern obtained by the previous marking, which is a superimposed process, and the track of the next marking is identical in shape to the track of the previous marking, but is shrunk by a bit compared with the track of the previous marking in order to prevent the occurrence of a burst point on the edge, so that the edge shrink size corresponding to each continuous laser beam marking track increases sequentially with the marking sequence compared with the contour track of the first marking pattern. Of course, in order to ensure the quality of the final target marking pattern, and to avoid defects in visual effect caused by too significant delamination, these edges should not be too large, typically in the order of millimeters or even micrometers, and for the four continuous laser beams mentioned above, their corresponding edges may be retractedThe sizes are sequentially and incrementally set to 0.03mm, 0.04mm, 0.05mm and 0.06mm, although specific size parameters can be adjusted according to requirements. Finally, it should be noted that, in this embodiment, the laser marking method is adopted, so that the fine multi-layer processing can be achieved by using the ultra-fine laser beam for marking, which is obviously difficult to achieve by the traditional mechanical or chemical processing technology.
In the embodiment, firstly, the oxide layer on the surface of the product is removed by using the pulse laser beam, the lower glossiness of the pattern obtained later is avoided from being caused by the oxide layer, and then, marking is completed by sequentially using a plurality of continuous laser beams, on one hand, the oxide layer with higher glossiness can be obtained by using the laser with high energy density, so that the glossiness is improved, and the protection of the oxide layer is provided, thereby improving the product quality; on the other hand, the marking speed of the pattern can be improved by utilizing the characteristics of small laser light spot, high energy density and high marking speed; furthermore, in order to enhance the glossiness of the obtained pattern, the present embodiment involves a process of repeatedly marking the same pattern, in which the track of the post-marking is properly shrunk to prevent the occurrence of a burst point at the marked edge, but the shrinking size must be controlled within a small scale (10 in the present embodiment) -5 m), which must be achieved with very high machining accuracy, which is achieved in the present embodiment by means of a very fine laser beam formed after focusing, which is also difficult to achieve by conventional mechanical or chemical machining processes.
Finally, to help further understand the specific process of the above embodiment, a supplementary explanation is provided for a pattern marking device used for implementing the pattern marking process method of the present embodiment, and referring to fig. 3, fig. 3 is a schematic structural diagram of the pattern marking device according to the embodiment of the present invention. As shown in fig. 3, the laser marking head 1 of the pattern marking device is fixed on a lifting shaft 6, the laser marking head 1 can slide on the lifting shaft 6 to adjust the height position and focus of laser relative to a product to be processed, the laser beam is output from the laser marking head 1 and reaches a focusing mirror 3 after passing through a high-speed vibrating mirror 2, the focusing mirror 3 focuses the laser beam to obtain an extremely fine laser beam, the extremely fine laser beam with extremely high energy density is utilized to complete subsequent fine marking operation, the pulse laser beam or continuous laser beam emitted from the focusing mirror 3 irradiates on the product to be processed 4, and marking is performed on the product to be processed 4 according to a program setting and a preset track corresponding to a design pattern, so as to obtain a target marking pattern, the product to be processed 4 is fixed on a jig 5 provided in a processing area, and the jig can be a compression vacuum device jig, so that the product to be processed is adsorbed and fixed in the processing area by utilizing air pressure difference, thereby ensuring that the product to be processed cannot appear uneven, and further facilitating subsequent processing quality.
Further, as an embodiment, referring to fig. 2, fig. 2 is a schematic flow chart of the present invention after step S102 in fig. 1, where the marking is performed on a second marking light spot formed on the first marking pattern by sequentially using at least two consecutive laser beams with sequentially increased power, and after forming the target marking pattern, the method further includes:
and step S201, detecting the glossiness of the target marking pattern by using a glossiness meter to obtain the surface glossiness of the target marking pattern.
After the marking processing in the above embodiment is performed, a target product with a target marking pattern on the surface is obtained, and in order to further detect and verify the glossiness of the target marking pattern, to determine whether the obtained product is qualified, in this embodiment, the glossiness of the surface of the target marking pattern may be measured by using a glossiness meter.
Firstly, it should be explained that, the detection of the brightness of the surface of the product is based on the principle of reflection of a physical light source, the light source is used to irradiate the surface of the object to be tested from a certain incident angle, the brightness of the reflected light on the surface of the object is further calculated by measuring the quantity of the reflected light, in the conventional manner, the brightness can be observed by visual observation, and then the brightness of the polished surface is divided into 5 grades: level 1 indicates that the product surface has a layer of grey film without any reflected light; grade 2 indicates that the surface of the product is slightly faint and bright, but not clear; the level 3 indicates that the reflected light intensity of the surface of the product is moderate, and the outline of the product can be basically distinguished; the level 4 indicates that the surface of the product has luster, and the outline of the product can be directly seen; the level 5 indicates that the surface of the product has mirror-like brightness and good brightness.
However, although the brightness of the surface of the product can be primarily evaluated by visual observation, quantitative analysis cannot be performed, and the accuracy and precision are low. In the industrial production process, in order to more accurately control the brightness of the processed product, the brightness is generally measured by detecting the glossiness. Gloss is the property of selective reflection of the object surface in a direction that determines the degree to which strong reflected light or object mirroring is present as seen at the object surface. The gloss of a material is often expressed in terms of specular gloss.
The specular gloss is the ratio of the specular reflectance of a sample, i.e., a product to be measured, to the specular reflectance of a reference surface under the same conditions at a predetermined incident angle, and is expressed in terms of percentage, and the percentage is generally omitted and expressed in gloss units. The specular gloss can be classified into 20 °, 45 °, 60 °, 85 ° depending on the angle of the incident light (note: when the incident angle increases, the gloss value of any surface also increases; so in determining the specular gloss, it is necessary to determine the angle of the incident light, and in indicating the specular gloss of a material, it is necessary to specify the angle).
In this embodiment, in order to accurately measure the glossiness of the obtained product, the glossiness of the surface of the target marking pattern may be measured by using a glossiness meter, where the surface glossiness is the specular glossiness mentioned above. The gloss meter generally consists of a gloss probe and a reading device. In the specific detection process, an internal light source of the instrument generates an incident light beam, the incident light beam directly irradiates the surface of a target marking pattern at a certain incident angle, then reflected light is received at a corresponding specular reflection angle position, a corresponding electric signal is generated, and after the signal is amplified, an analog display instrument or a digital display instrument in a reading device is excited to display a glossiness value, namely the surface glossiness of the target marking pattern.
And then, after the surface glossiness of the target marking pattern is obtained, comparing the surface glossiness with a corresponding preset threshold value, and if the surface glossiness is larger than the preset threshold value, judging that the surface glossiness of the current target marking pattern meets the requirement, and if the product is qualified, otherwise, failing, and continuing the marking step using the continuous laser beam. The preset threshold value may be set according to the actual requirement, which is not limited in this embodiment, and in addition, the above-mentioned "when the incident angle increases, the gloss value of any surface also increases. Therefore, when the specular gloss is measured, the angle of the incident light needs to be determined, and when the specular gloss of the material is expressed, the angle needs to be indicated ", that is, the angle of the incident light output by the gloss meter may be various, and the surface gloss measured by different incident angles is different, so that the corresponding standard to be referred to, that is, the preset threshold value, may be different, that is, the preset threshold value may be plural, and in the actual detection process, the subsequent judgment needs to be performed according to the preset threshold value corresponding to the incident angle.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (3)
1. A method of pattern marking, the method comprising:
marking by using a first marking light spot formed on the surface of a product to be processed by a pulse laser beam to form a first marking pattern; the marking speed of the pulse laser beam is 2000mm/s, the laser power of the pulse laser beam is 80% of the maximum power, the laser pulse width of the pulse laser beam is 50ns, the laser frequency of the pulse laser beam is 100KHz, and the product to be processed is made of aluminum alloy;
marking a second marking light spot formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power to form a target marking pattern;
the method for marking the second marking light spot formed on the first marking pattern by sequentially utilizing at least two continuous laser beams with sequentially increased power to form a target marking pattern comprises the following steps:
marking the second marking light spots formed on the first marking pattern by using the continuous laser beams with four beams of sequentially increased power along a preset marking track to form the target marking pattern;
the marking speed of a first continuous laser beam in the four continuous laser beams with sequentially increased power is 1800mm/s, the laser power of the first continuous laser beam is 50% of the maximum power, and the laser frequency of the first continuous laser beam is 150-200KHz; the marking speed of a second continuous laser beam in the four continuous laser beams with sequentially increased power is 2000mm/s, the laser power of the second continuous laser beam is 60% of the maximum power, and the laser frequency of the second continuous laser beam is 100-200KHz; the marking speed of a third continuous laser beam in the four continuous laser beams with sequentially increased power is 2200mm/s, the laser power of the third continuous laser beam is 70% of the maximum power, and the laser frequency of the third continuous laser beam is 150-200KHz; the marking speed of a fourth continuous laser beam in the four continuous laser beams with sequentially increased power is 2300mm/s, the laser power of the fourth continuous laser beam is 80% of the maximum power, and the laser frequency of the fourth continuous laser beam is 200-220KHz.
2. The method of claim 1, wherein the predetermined marking track is determined according to an edge retraction dimension corresponding to the continuous laser beam, the edge retraction dimension being a retraction dimension of an edge of the predetermined marking track of the continuous laser beam relative to an edge of the first marking pattern, the edge retraction dimensions of the continuous laser beam being different, and four edge retraction dimensions corresponding to the continuous laser beam having four sequentially increased powers being sequentially increased.
3. The method of claim 1, wherein the marking is performed on a second marking spot formed on the first marking pattern by sequentially using at least two consecutive laser beams of sequentially increasing power, and wherein after forming the target marking pattern, the method further comprises:
and detecting the glossiness of the target marking pattern by using a glossiness meter to obtain the surface glossiness of the target marking pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210545534.7A CN114985945B (en) | 2022-05-19 | 2022-05-19 | Pattern marking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210545534.7A CN114985945B (en) | 2022-05-19 | 2022-05-19 | Pattern marking method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114985945A CN114985945A (en) | 2022-09-02 |
| CN114985945B true CN114985945B (en) | 2024-02-20 |
Family
ID=83027959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210545534.7A Active CN114985945B (en) | 2022-05-19 | 2022-05-19 | Pattern marking method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114985945B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5632916A (en) * | 1992-11-09 | 1997-05-27 | Partek Cargotec Oy | Laser marking method and a metal surface marked by this method |
| JPH11307914A (en) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Pattern forming method of thick film wiring board |
| JP2015030018A (en) * | 2013-08-05 | 2015-02-16 | パナソニック株式会社 | Laser welding method and laser welding device |
| CN106591850A (en) * | 2015-10-20 | 2017-04-26 | 依卡莎科技控股有限公司 | Method for preserving a mark on a metallic workpiece |
| CN106827514A (en) * | 2017-02-10 | 2017-06-13 | 上海联泰科技股份有限公司 | Layering builds image processing method, Method of printing and the 3D printing equipment of object |
| CN107252978A (en) * | 2017-05-12 | 2017-10-17 | 中国船舶重工集团公司第七二五研究所 | A kind of laser preparation method of super hydrophilic titanium alloy heat exchanger plates |
| CN108817672A (en) * | 2018-03-20 | 2018-11-16 | 深圳市吉祥云科技有限公司 | A method of fish scale-shaped lines is made on almag surface with laser |
| CN112008248A (en) * | 2020-07-29 | 2020-12-01 | 大连理工大学 | Method for generating surface pattern track by adopting laser double-scanning strategy |
| CN112266500A (en) * | 2020-11-05 | 2021-01-26 | 万华化学(四川)有限公司 | Marking powder, preparation method and application thereof, high-rigidity PC alloy suitable for laser marking and preparation method thereof |
| CN113199149A (en) * | 2020-01-15 | 2021-08-03 | 大族激光科技产业集团股份有限公司 | Processing technology for removing coating by laser |
| CN113793351A (en) * | 2021-09-30 | 2021-12-14 | 中国人民解放军国防科技大学 | Laser filling method and device of multi-layer contour pattern based on contour line |
| CN114178709A (en) * | 2021-12-29 | 2022-03-15 | 陕西科技大学 | Two-dimensional code laser marking method for pure titanium surface |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080110869A1 (en) * | 2006-11-15 | 2008-05-15 | Button International Co., Ltd. | Method of machining mold surface using laser |
| US9636776B2 (en) * | 2011-05-02 | 2017-05-02 | Ipg Photonics Corporation | Laser-based marking method and apparatus |
-
2022
- 2022-05-19 CN CN202210545534.7A patent/CN114985945B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5632916A (en) * | 1992-11-09 | 1997-05-27 | Partek Cargotec Oy | Laser marking method and a metal surface marked by this method |
| JPH11307914A (en) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Pattern forming method of thick film wiring board |
| JP2015030018A (en) * | 2013-08-05 | 2015-02-16 | パナソニック株式会社 | Laser welding method and laser welding device |
| CN106591850A (en) * | 2015-10-20 | 2017-04-26 | 依卡莎科技控股有限公司 | Method for preserving a mark on a metallic workpiece |
| CN106827514A (en) * | 2017-02-10 | 2017-06-13 | 上海联泰科技股份有限公司 | Layering builds image processing method, Method of printing and the 3D printing equipment of object |
| CN107252978A (en) * | 2017-05-12 | 2017-10-17 | 中国船舶重工集团公司第七二五研究所 | A kind of laser preparation method of super hydrophilic titanium alloy heat exchanger plates |
| CN108817672A (en) * | 2018-03-20 | 2018-11-16 | 深圳市吉祥云科技有限公司 | A method of fish scale-shaped lines is made on almag surface with laser |
| CN113199149A (en) * | 2020-01-15 | 2021-08-03 | 大族激光科技产业集团股份有限公司 | Processing technology for removing coating by laser |
| CN112008248A (en) * | 2020-07-29 | 2020-12-01 | 大连理工大学 | Method for generating surface pattern track by adopting laser double-scanning strategy |
| CN112266500A (en) * | 2020-11-05 | 2021-01-26 | 万华化学(四川)有限公司 | Marking powder, preparation method and application thereof, high-rigidity PC alloy suitable for laser marking and preparation method thereof |
| CN113793351A (en) * | 2021-09-30 | 2021-12-14 | 中国人民解放军国防科技大学 | Laser filling method and device of multi-layer contour pattern based on contour line |
| CN114178709A (en) * | 2021-12-29 | 2022-03-15 | 陕西科技大学 | Two-dimensional code laser marking method for pure titanium surface |
Non-Patent Citations (1)
| Title |
|---|
| 激光抛光表面形貌的误差复映规律;李健;杨叶;金卫凤;曾子涵;严思琴;;表面技术;20200229(第02期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114985945A (en) | 2022-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107102061A (en) | Metal material high energy beam increases and decreases the online laser ultrasonic detection combined machining method of material | |
| EP4141408A1 (en) | Nondestructive testing method for crack defects, and testing standard part and manufacturing method therefor | |
| Schulze et al. | Increase of process reliability in the micro-machining processes EDM-milling and laser ablation using on-machine sensors | |
| CN106770634A (en) | A kind of metal material high energy beam increases and decreases the online EDDY CURRENT combined machining method of material | |
| EP4141409A1 (en) | Non-destructive testing method for incomplete fusion defect, and testing standard part and manufacturing method therefor | |
| CN108444921B (en) | Additive manufacturing component online detection method based on signal correlation analysis | |
| CN109926711A (en) | A kind of method of automatic acquisition laser spot and the automatic processing unit (plant) for obtaining laser spot | |
| CN111288924A (en) | Laser ultrasonic detection device and method based on synthetic aperture focusing imaging | |
| CN111077223A (en) | Additive manufacturing method with three-dimensional display, online detection and repair functions | |
| TWI633642B (en) | Laser systems and methods for internally marking thin layers, and articles produced thereby | |
| CN114985945B (en) | Pattern marking method | |
| Rao et al. | Study of engineering surfaces using laser-scattering techniques | |
| CN113634883B (en) | By using CO 2 Method for representing fused quartz glass subsurface defect distribution by pulse laser chromatographic ablation | |
| Holder et al. | In-process determination of fiber orientation for layer accurate laser ablation of CFRP | |
| Gilbert et al. | Machining of aluminium nitride with ultra-violet and near-infrared Nd: YAG lasers | |
| Póka et al. | A robust digital image processing method for measuring the planar burr length at milling | |
| JP5405899B2 (en) | Surface inspection device | |
| DE102018202625B4 (en) | Measuring device | |
| JP6650379B2 (en) | Surface inspection device, surface inspection method and database | |
| CN113960032B (en) | Online laser cleaning effect detection method and three-dimensional detection device | |
| JPH0349833A (en) | Automatic positioning of electric discharging device and work accuracy measuring device | |
| CN207751817U (en) | The performance testing device of cutter after a kind of reconditioning | |
| CN211696267U (en) | Laser ultrasonic detection device based on synthetic aperture focusing imaging | |
| Bračun et al. | Surface defect detection on power transmission belts using laser profilometry | |
| Lazzini et al. | High precision feature detection in laser texturing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |