CN114980538A - Sensor chip embedded type three-dimensional concave-convex circuit board and manufacturing method thereof - Google Patents
Sensor chip embedded type three-dimensional concave-convex circuit board and manufacturing method thereof Download PDFInfo
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- CN114980538A CN114980538A CN202210820344.1A CN202210820344A CN114980538A CN 114980538 A CN114980538 A CN 114980538A CN 202210820344 A CN202210820344 A CN 202210820344A CN 114980538 A CN114980538 A CN 114980538A
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- circuit board
- sensor chip
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- chip embedded
- convex
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a sensor chip embedded type three-dimensional concave-convex circuit board and a manufacturing method thereof.A product structure is shaped in an injection molding mode, and a circuit pattern is processed on the surface of a plastic part in a laser engraving mode; removing oxide skin, grease, fingerprints and dirt on the surface of the material by using an alkaline degreasing agent and a regulator, and carrying out bottom copper plating or vacuum sputtering treatment on a carbonization area, wherein the copper thickness is controlled to be 10-18 mu M; and (3) carrying out chemical nickel plating treatment on the copper surface of the colloidal palladium-tin ion hydration adhesive film, wherein the thickness of the nickel layer is controlled to be 120-160 mu M, and finally forming the three-dimensional concave-convex circuit board. According to the invention, a carbonization curve is formed by laser engraving, and then a metal circuit is manufactured on the surface of the LDS (plastic cement) in a carbonization line area in a chemical plating metal mode, so that the effect that the chip can finish bonding is achieved, and the effects of pressure resistance, high temperature resistance and corrosion resistance of the outside of the chip are realized.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a sensor chip embedded type three-dimensional concave-convex circuit board and a manufacturing method thereof.
Background
The Printed Circuit Board may be called as a Printed Circuit Board or a Printed Circuit Board, the english name (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC (FPC Board is also called as a Flexible Printed Circuit Board Flexible Circuit Board) which is a Flexible Printed Circuit Board with high reliability and excellent property and has the characteristics of high wiring density, light weight, thin thickness and good bending property) and a Soft and hard combination Board (Soft and hard combination Board) -the birth and development of FPC and PCB, and the new product of Soft and hard combination Board is promoted.
The prior art can only solve a planar circuit and is difficult to solve the difficult problem of a three-dimensional or uneven irregular-shaped circuit board, so that the method for manufacturing the irregular circuit on the surface of laser etching and carbonized plastic (LDS or PA or PPS) is provided, the difficult problems of uneven circuit manufacturing and plating which are difficult to realize by a traditional process circuit board are solved, and the characteristics of improving the toughness of materials and reducing the easy cracking of plastic parts are realized by process transformation of different materials, so that an ideal effect is achieved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention discloses a sensor chip embedded type three-dimensional concave-convex circuit board and a manufacturing method thereof, which are used for solving the problem of the circuit board with three-dimensional or uneven and irregular shapes in the prior art.
The invention is realized by the following technical scheme:
in a first aspect, the invention provides a method for manufacturing a sensor chip embedded type three-dimensional concave-convex circuit board, which comprises the following steps:
s1, shaping the product structure by injection molding, and processing the circuit pattern on the surface of the plastic part by laser engraving;
s2, removing oxide skin, grease, fingerprints and dirt on the surface of the material by using an alkaline degreasing agent and an adjusting agent, adjusting the inner wall of the through hole, and finally cleaning the through hole by using hot water and deionized water;
s3 moving the material into H 2 SO 4 /H 2 O 2 Microetching in the system solution for 3-4min, and taking out when the surface of the material has active micro-roughness characteristics;
s4, washing with deionized water, pickling, activating with colloidal palladium, and adsorbing on the inner and outer surfaces of micropores of the material to form a colloidal palladium-tin ion hydrated adhesive film;
s5, carrying out bottom copper plating or vacuum sputtering treatment on the carbonization area, wherein the copper thickness is controlled to be 10-18 mu M;
s6, nickel plating treatment is carried out on the copper surface of the colloid palladium-tin ion hydrated glue film, wherein the thickness of the nickel layer is controlled to be 120-160 mu M, and finally the three-dimensional concave-convex circuit board is formed.
Furthermore, in the method, during injection molding, the granular or powdery LDS material is added into a hopper of an injection machine, is heated and melted to be in a flowing state, enters a mold cavity through a nozzle and a pouring system of the mold under the pushing of a screw rod or a piston of the injection machine, and is hardened and shaped in the mold cavity.
Further, in the method, the alkaline degreasing agent is made of a builder and a surfactant, and is adsorbed on the interface between the oil stain and the solution by using a hydrophilic group and an oleophilic group in a molecular structure of the surfactant.
Furthermore, in the method, when the laser is used for processing the circuit, a reasonable laser source and optimization of parameters are selected according to the characteristics of the material, so that the chemical plating effect of the surface circuit region is realized.
Furthermore, the method is characterized in that when the carbonization area is subjected to bottom copper plating or vacuum sputtering, and when the surface of the plating layer needs to be subjected to spraying treatment on the first-level appearance part, the thickness control of copper is determined according to the laser etching depth of the circuit area and the thickness of a subsequent nickel plating or other metal protection layers, so that the height of the whole plating layer and the flatness of the plastic surface are ensured.
Furthermore, in the method, during nickel plating treatment, organic additives are added and used, wherein the organic additives comprise a surfactant and a high molecular polymer, and the organic additives can be adsorbed on the surface of the plating layer and are used for inhibiting corrosion of a substrate and improving uniformity and compactness of the plating layer.
Furthermore, in the method, during nickel plating, inorganic additives are added and used, wherein the inorganic additives comprise arsenic, thallium and lead, and metal ions of the inorganic additives can generate underpotential deposition on the surface of a plating layer and then replace gold ions to play an accelerating role in the deposition process.
Furthermore, in the method, when the gold plating layer is carried out on the surface of the colloid palladium tin ion hydration adhesive film, the thickness of the gold plating layer is controlled to be 0.02-0.05 mu M.
Furthermore, in the method, the colloidal palladium solution is activated to activate circuit boards such as epoxy glass fiber, phenolic resin, epoxy resin, plastics and other non-conductive materials, so that the wall of the circuit board hole forms a layer of uniform and firmly-combined colloidal palladium.
In a second aspect, the invention provides a sensor chip embedded three-dimensional concave-convex circuit board, which is manufactured by the manufacturing method of the sensor chip embedded three-dimensional concave-convex circuit board in the first aspect, has the effects of pressure resistance, high temperature resistance and corrosion resistance, and is applied to an integrated circuit.
The invention has the beneficial effects that:
according to the invention, the fixing structure is manufactured by injection molding of the LDS material, the LDS material is used as a substrate, a carbonization curve is formed by laser engraving, and then a metal circuit is manufactured on the surface of the LDS (plastic cement) in a carbonization line area in a chemical plating metal mode, so that the effect that the chip can finish bonding is achieved, and the effects of pressure resistance, high temperature resistance and corrosion resistance of the outside of the chip are realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a block diagram of the principle steps of a manufacturing method of a sensor chip embedded type three-dimensional concave-convex circuit board;
fig. 2 is a finished product diagram of a three-dimensional concave-convex circuit board according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In a first aspect, the invention provides a method for manufacturing a sensor chip embedded type three-dimensional concave-convex circuit board, which comprises the following steps:
s1, shaping the product structure by injection molding, and processing the circuit pattern on the surface of the plastic part by laser engraving;
s2, removing oxide skin, grease, fingerprints and dirt on the surface of the material by using an alkaline degreasing agent and an adjusting agent, adjusting the inner wall of the through hole, and finally cleaning the through hole by using hot water and deionized water;
s3 moving the material into H 2 SO 4 /H 2 O 2 Microetching in the system solution for 3-4min, and taking out when the surface of the material has active micro-roughness characteristics;
s4, washing with deionized water, pickling, activating with colloidal palladium, and adsorbing on the inner and outer surfaces of micropores of the material to form a colloidal palladium-tin ion hydrated adhesive film;
s5, carrying out bottom copper plating or vacuum sputtering treatment on the carbonization area, wherein the copper thickness is controlled to be 10-18 mu M;
s6, nickel plating treatment is carried out on the copper surface of the colloid palladium-tin ion hydrated glue film, wherein the thickness of the nickel layer is controlled to be 120-160 mu M, and finally the three-dimensional concave-convex circuit board is formed.
In this embodiment, the degreasing/pore-forming treatment is required, and the degreasing/pore-forming agent in this embodiment is composed of an alkaline degreasing agent and a conditioning agent. It removes scale, grease, fingerprints and dirt from the copper surface and conditions the inner wall of the via to give an activated and water film-free copper surface. The treated double-layer or multi-layer printed circuit board can obtain a uniform electroless copper plating layer. The method is a key step of the pretreatment of copper melting, and if the treatment is not good, micro-holes and even copper-free areas can appear in the plating layer, so that the plating layer and the surface of the base material plating layer and non-conductive bases are influenced.
In the PCB with the oil/whole hole removed, the material is moved into H after being cleaned by hot water and deionized water 2 SO 4 /H 2 O 2 And (3) carrying out micro-etching in the system solution for 3-4min, taking out the material after the surface of the material has active micro-roughness characteristics, and providing a micro-rough active surface for chemical copper deposition.
In the embodiment, the microetching solution is added with the additive which can effectively inhibit H 2 O 2 The decomposed stabilizer, so that the solution is stable and the etching speed is constant. In addition, it can overcome the defects of non-uniform etching, complex salt generation in the etching process, difficult cleaning film formation on the plate surface and the like in the system.
The micro-etching of the present embodiment is performed to a certain depth to obtain the desired effect, and usually at least the copper foil is micro-etched by more than 1um, generally 1-2.5 um. If the microetching is insufficient, a micro-roughened bright pink active copper surface cannot be generated; the microetching may not be excessive, otherwise, the substrate may be exposed through the pores, thereby affecting the bonding force between the electroless copper plating layer and the copper foil and the non-conductive substrate. Experiments show that certain plating layer metal ions are required to exist in the micro-etching solution so as to obtain better effect.
Example 2
In a specific implementation level, the present embodiment performs actual operations specifically as follows:
a1, manufacturing a plastic base material for bearing the circuit by injection molding, wherein the plastic body is usually both of the circuit and a product structure part, therefore, the process can provide great flexibility for the design of the product, different injection molding materials need to adopt different laser parameter combinations according to actual effects in order to ensure the subsequent plating effect, and the coarsening liquid medicine and process parameters need to be adjusted necessarily during chemical plating carbonization.
A2, forming the product structure by injection molding, processing the circuit pattern on the surface of the plastic part by laser engraving, and selecting reasonable laser source and parameter optimization to realize the plating effect of the surface circuit region while processing the circuit by laser.
A3, before chemical plating, the surface of the material needs to be degreased, micro-etched and cleaned so as to eliminate the influence of surface dirt and laser dust on the surface of the product.
And A4, performing bottom copper chemical plating or vacuum sputtering on the carbonization area, wherein the copper thickness is controlled to be 10-18 mu M, and when the surface of the plating layer of the first-level appearance part needs to be subjected to spraying treatment, the copper thickness control needs to consider the depth of laser etching in the circuit area and the thickness of a subsequent nickel plating or other metal protection layer so as to ensure the height of the whole plating layer and the flatness of the plastic surface.
A5, nickel plating the copper surface of the plastic surface, the thickness of the nickel layer is required to reach 120-160 μ M, so as to prevent the copper layer from corroding the gold plating layer or other metal plating layers on the nickel surface.
A6, when the surface is made into gold plating, the thickness is required to reach 0.02-0.05 μ M.
In the application of this embodiment, a gold wire bonding process is used to package the chip in the groove step in the LDS frame, and then the chip is packaged and molded.
As shown in fig. 2, the circuit board formed by the embodiment solves the problem of the space size of the original bracket, and the embodiment can be made thinner; and the problem of the tolerance range of the original support scheme is solved.
The embodiment reaches the extreme range of plus or minus 0.02UM of tolerance, so that the product is more replaceable, and the compactness and the heat dissipation performance of the chip in the working process are ensured.
Example 3
The embodiment provides a sensor chip embedded type three-dimensional concave-convex circuit board, which is manufactured by the manufacturing method of the sensor chip embedded type three-dimensional concave-convex circuit board in the embodiment 1, has the effects of pressure resistance, high temperature resistance and corrosion resistance, and is applied to an integrated circuit.
In summary, the present invention provides a fixing structure manufactured by injection molding of an LDS material, wherein the LDS material is used as a substrate, a carbonization curve is formed by laser engraving, and then a metal circuit is manufactured on a surface of the LDS (plastic) in a carbonization line region by a chemical plating metal manner, so that a bonding effect of a chip can be achieved, thereby achieving the effects of pressure resistance, high temperature resistance and corrosion resistance of the outside of the chip.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A manufacturing method of a sensor chip embedded type three-dimensional concave-convex circuit board is characterized by comprising the following steps:
s1, shaping the product structure by injection molding, and processing the circuit pattern on the surface of the plastic part by laser engraving;
s2, removing oxide skin, grease, fingerprints and dirt on the surface of the material by using an alkaline degreasing agent and an adjusting agent, adjusting the inner wall of the through hole, and finally cleaning the through hole by using hot water and deionized water;
s3 moving the material into H 2 SO 4 /H 2 O 2 Microetching in the system solution for 3-4min, and taking out when the surface of the material has active micro-roughness characteristics;
s4, washing with deionized water, pickling, activating with colloidal palladium, and adsorbing on the inner and outer surfaces of micropores of the material to form a colloidal palladium-tin ion hydrated adhesive film;
s5, carrying out bottom copper plating or vacuum sputtering treatment on the carbonization area, wherein the copper thickness is controlled to be 10-18 mu M;
s6, nickel plating treatment is carried out on the copper surface of the colloid palladium-tin ion hydrated glue film, wherein the thickness of the nickel layer is controlled to be 120-160 mu M, and finally the three-dimensional concave-convex circuit board is formed.
2. The method for manufacturing the sensor chip embedded type three-dimensional concave-convex shape circuit board according to claim 1, wherein during injection molding, the granular or powdery LDS material is added into a hopper of an injection machine, is heated and melted to be in a flowing state, enters a mold cavity through a nozzle and a pouring system of the mold under the pushing of a screw or a piston of the injection machine, and is hardened and shaped in the mold cavity.
3. The method for manufacturing the sensor chip embedded three-dimensional concave-convex circuit board according to claim 1, wherein the alkaline degreasing agent is made of a builder and a surfactant, and is adsorbed on the interface between oil stains and a solution by using a hydrophilic group and an oleophilic group in a molecular structure of the surfactant.
4. The manufacturing method of the sensor chip embedded type three-dimensional concave-convex circuit board according to claim 1, wherein in the method, when the circuit is processed by laser, reasonable laser sources and optimization of parameters are selected according to the characteristics of materials, so that the chemical plating effect of a surface circuit area is realized.
5. The manufacturing method of the sensor chip embedded three-dimensional concave-convex circuit board according to claim 1, wherein in the method, when the carbonization area is subjected to bottom copper chemical plating or vacuum sputtering, and when a first-level appearance part needs to be subjected to spraying treatment on the surface of a plating layer, the thickness control of copper is determined according to the depth of laser etching of a circuit area and the thickness of a subsequent nickel plating or other metal protection layer, so as to ensure the height of the whole plating layer and the flatness of a plastic surface.
6. The method for manufacturing the sensor chip embedded type three-dimensional concave-convex circuit board according to claim 1, wherein in the method, during nickel plating, organic additives are added and used, wherein the organic additives comprise a surfactant and a high molecular polymer, and the organic additives can be adsorbed on the surface of a plating layer to inhibit corrosion of a substrate and improve uniformity and compactness of the plating layer.
7. The method for manufacturing the sensor chip embedded type three-dimensional concave-convex circuit board according to claim 6, wherein in the method, during nickel plating, inorganic additives are added and used, wherein the inorganic additives comprise arsenic, thallium and lead, and metal ions of the inorganic additives can generate underpotential deposition on the surface of a plating layer, and then replace gold ions to play an accelerating role in the deposition process.
8. The method for manufacturing the sensor chip embedded type three-dimensional concave-convex circuit board according to claim 6, wherein in the method, when the gold plating layer is performed on the surface of the colloidal palladium-tin ion hydrated adhesive film, the thickness of the gold plating layer is controlled to be 0.02-0.05 μ M.
9. The method for manufacturing the sensor chip embedded type three-dimensional concave-convex circuit board according to claim 1, wherein the colloidal palladium solution is activated to activate circuit boards such as epoxy glass fiber, phenolic resin and epoxy resin, plastics and other non-conductive materials, so that a layer of uniform and firmly-combined colloidal palladium is formed on the hole wall of the circuit board.
10. A sensor chip embedded three-dimensional concavo-convex circuit board manufactured by the method for manufacturing a sensor chip embedded three-dimensional concavo-convex circuit board according to any one of claims 1 to 9, characterized in that the circuit board has the effects of pressure resistance, high temperature resistance and corrosion resistance and is applied to an integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210820344.1A CN114980538A (en) | 2022-07-13 | 2022-07-13 | Sensor chip embedded type three-dimensional concave-convex circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210820344.1A CN114980538A (en) | 2022-07-13 | 2022-07-13 | Sensor chip embedded type three-dimensional concave-convex circuit board and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004087548A (en) * | 2002-08-23 | 2004-03-18 | Kanegafuchi Chem Ind Co Ltd | Method for manufacturing printed wiring board |
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| WO2017166851A1 (en) * | 2016-03-27 | 2017-10-05 | 华南理工大学 | Palladium-free chemical copper plating method |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
| CN113993303A (en) * | 2021-10-27 | 2022-01-28 | 上海天承化学有限公司 | Method for metallizing holes of mixed-pressure circuit board |
-
2022
- 2022-07-13 CN CN202210820344.1A patent/CN114980538A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004087548A (en) * | 2002-08-23 | 2004-03-18 | Kanegafuchi Chem Ind Co Ltd | Method for manufacturing printed wiring board |
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| WO2017166851A1 (en) * | 2016-03-27 | 2017-10-05 | 华南理工大学 | Palladium-free chemical copper plating method |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
| CN113993303A (en) * | 2021-10-27 | 2022-01-28 | 上海天承化学有限公司 | Method for metallizing holes of mixed-pressure circuit board |
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