CN114975209A - 一种半导体晶圆单片清洗机上料设备 - Google Patents
一种半导体晶圆单片清洗机上料设备 Download PDFInfo
- Publication number
- CN114975209A CN114975209A CN202210868361.2A CN202210868361A CN114975209A CN 114975209 A CN114975209 A CN 114975209A CN 202210868361 A CN202210868361 A CN 202210868361A CN 114975209 A CN114975209 A CN 114975209A
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- cleaning machine
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- semiconductor wafer
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- 238000004140 cleaning Methods 0.000 title claims abstract description 82
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 10
- 230000009471 action Effects 0.000 claims description 38
- 239000010720 hydraulic oil Substances 0.000 claims description 25
- 239000003921 oil Substances 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 14
- 239000011257 shell material Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 49
- 230000027455 binding Effects 0.000 description 12
- 230000005484 gravity Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
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- 238000012423 maintenance Methods 0.000 description 2
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- 230000003578 releasing effect Effects 0.000 description 2
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- 206010044565 Tremor Diseases 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Centrifugal Separators (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210868361.2A CN114975209B (zh) | 2022-07-22 | 2022-07-22 | 一种半导体晶圆清洗机上料设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210868361.2A CN114975209B (zh) | 2022-07-22 | 2022-07-22 | 一种半导体晶圆清洗机上料设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114975209A true CN114975209A (zh) | 2022-08-30 |
CN114975209B CN114975209B (zh) | 2022-11-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202210868361.2A Active CN114975209B (zh) | 2022-07-22 | 2022-07-22 | 一种半导体晶圆清洗机上料设备 |
Country Status (1)
Country | Link |
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CN (1) | CN114975209B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319327A (ja) * | 1989-06-16 | 1991-01-28 | Tokyo Electron Sagami Ltd | 縦型熱処理装置 |
CN104001704A (zh) * | 2014-05-19 | 2014-08-27 | 中国电子科技集团公司第四十五研究所 | 旋转冲洗设备专用多工位转架 |
US20160329228A1 (en) * | 2013-12-27 | 2016-11-10 | Beijing Nmc Co., Ltd. | Cassette positioning device and semiconductor processing apparatus |
CN110808219A (zh) * | 2019-11-01 | 2020-02-18 | 江苏亚电科技有限公司 | 一种晶圆存放盒清洗装置及清洗方法 |
CN210607196U (zh) * | 2019-11-01 | 2020-05-22 | 江苏亚电科技有限公司 | 一种具有热风烘干功能的晶圆存放盒清洗装置 |
US20210035841A1 (en) * | 2019-07-31 | 2021-02-04 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CN113843235A (zh) * | 2021-08-06 | 2021-12-28 | 徐州鑫晶半导体科技有限公司 | 晶圆盒清洗装置及其控制方法 |
-
2022
- 2022-07-22 CN CN202210868361.2A patent/CN114975209B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319327A (ja) * | 1989-06-16 | 1991-01-28 | Tokyo Electron Sagami Ltd | 縦型熱処理装置 |
US20160329228A1 (en) * | 2013-12-27 | 2016-11-10 | Beijing Nmc Co., Ltd. | Cassette positioning device and semiconductor processing apparatus |
CN104001704A (zh) * | 2014-05-19 | 2014-08-27 | 中国电子科技集团公司第四十五研究所 | 旋转冲洗设备专用多工位转架 |
US20210035841A1 (en) * | 2019-07-31 | 2021-02-04 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
CN110808219A (zh) * | 2019-11-01 | 2020-02-18 | 江苏亚电科技有限公司 | 一种晶圆存放盒清洗装置及清洗方法 |
CN210607196U (zh) * | 2019-11-01 | 2020-05-22 | 江苏亚电科技有限公司 | 一种具有热风烘干功能的晶圆存放盒清洗装置 |
CN113843235A (zh) * | 2021-08-06 | 2021-12-28 | 徐州鑫晶半导体科技有限公司 | 晶圆盒清洗装置及其控制方法 |
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CN114975209B (zh) | 2022-11-01 |
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GR01 | Patent grant | ||
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CP01 | Change in the name or title of a patent holder |
Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP03 | Change of name, title or address |
Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |
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