CN114974649A - Solar cell electrode and forming method thereof - Google Patents
Solar cell electrode and forming method thereof Download PDFInfo
- Publication number
- CN114974649A CN114974649A CN202110211709.6A CN202110211709A CN114974649A CN 114974649 A CN114974649 A CN 114974649A CN 202110211709 A CN202110211709 A CN 202110211709A CN 114974649 A CN114974649 A CN 114974649A
- Authority
- CN
- China
- Prior art keywords
- solar cell
- glass frit
- oxide
- cell electrode
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 22
- 239000011521 glass Substances 0.000 claims abstract description 102
- 239000000843 powder Substances 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000000203 mixture Substances 0.000 claims description 49
- 239000010936 titanium Substances 0.000 claims description 20
- 239000011734 sodium Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 238000010304 firing Methods 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 9
- 229910052796 boron Inorganic materials 0.000 claims description 9
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 8
- 239000011777 magnesium Substances 0.000 claims description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims description 8
- 239000011733 molybdenum Substances 0.000 claims description 8
- 229910052708 sodium Inorganic materials 0.000 claims description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 8
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 239000010937 tungsten Substances 0.000 claims description 8
- 239000011572 manganese Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052714 tellurium Inorganic materials 0.000 claims description 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052684 Cerium Inorganic materials 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052788 barium Inorganic materials 0.000 claims description 4
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 229910052792 caesium Inorganic materials 0.000 claims description 4
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims description 4
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 239000011591 potassium Substances 0.000 claims description 4
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052712 strontium Inorganic materials 0.000 claims description 4
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 4
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 22
- 230000006872 improvement Effects 0.000 description 15
- 239000002245 particle Substances 0.000 description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000006117 anti-reflective coating Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000005215 recombination Methods 0.000 description 5
- 230000006798 recombination Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910018557 Si O Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 229910007541 Zn O Inorganic materials 0.000 description 2
- -1 acrylic ester Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000001132 ultrasonic dispersion Methods 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910016336 Bi—Te—O Inorganic materials 0.000 description 1
- 229920000896 Ethulose Polymers 0.000 description 1
- 239000001859 Ethyl hydroxyethyl cellulose Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019326 ethyl hydroxyethyl cellulose Nutrition 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000010022 rotary screen printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a solar cell electrode and a preparation method thereof, wherein the solar cell electrode comprises: a first electrode layer comprising a conductive powder and a first glass frit; and a second electrode layer formed on the first electrode layer, the second electrode layer including a conductive powder and a second glass frit which is different from the first glass frit and has a molar ratio of lead (Pb) oxide/(lead (Pb) oxide + copper (Cu) oxide) of more than 0.2 and 0.95 or less.
Description
Technical Field
The present invention relates to a solar cell electrode and a method for forming the same, and more particularly, to a solar cell electrode and a method for forming the same, in which the solar cell electrode has excellent efficiency and improved adhesion to a wafer or a bonding wire by improving open-circuit voltage characteristics.
Background
Solar cells generate electrical energy using the photovoltaic effect of p-n junctions that convert photons (photons) of sunlight into electricity. A solar cell has a front electrode and a back electrode formed on the upper and lower surfaces of a semiconductor wafer or a substrate constituting a p-n junction. The solar cell induces a photoelectric effect of p-n junction by sunlight incident on the semiconductor wafer, and a current flowing to the outside through the electrode is supplied by electrons generated thereby.
The electrode of such a solar cell can be formed in a predetermined pattern on the surface of the substrate by coating, patterning, and firing the electrode-forming composition. In order to manufacture a high efficiency solar cell, it is necessary to reduce factors that reduce the efficiency of the solar cell. The efficiency loss of the solar cell can be roughly classified into optical loss, recombination loss of electron and hole, and loss due to resistance components.
Disclosure of Invention
The present invention is directed to a solar cell electrode having improved open-circuit voltage characteristics by reducing recombination loss caused by etching an anti-reflective coating (ARC) layer during electrode firing.
Another object of the present invention is to provide a solar cell electrode having excellent conversion efficiency.
Another object of the present invention is to provide a solar cell electrode having improved adhesion to a wafer or a bonding wire, thereby improving reliability.
Another object of the present invention is to provide a method for forming the solar cell electrode.
1. According to an embodiment, a solar cell electrode is provided. The solar cell electrode may include: a first electrode layer comprising a conductive powder and a first glass frit; and a second electrode layer formed on the first electrode layer, the second electrode layer including a conductive powder and a second glass frit which is different from the first glass frit and has a molar ratio of lead (Pb) oxide/(lead (Pb) oxide + copper (Cu) oxide) of more than 0.2 and 0.95 or less.
2. In item 1 above, the second glass frit may comprise 15 to 75 mol percent lead (Pb) oxide.
3. In the above 1 or 2, the second glass frit may include 3 to 60 mol% of copper (Cu) oxide.
4. In any one of the above 1 to 3, the second glass frit may further include 1 or more elements selected from tellurium (T e), bismuth (Bi), lithium (Li), boron (B), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), zinc (Zn), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), molybdenum (Mo), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), sodium (Na), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), and aluminum (Al).
5. In any one of the above 1 to 4, the second glass frit may further include 1 or more of silicon (Si) oxide, titanium (Ti) oxide, and iron (Fe) oxide.
6. In any of the above 1 to 5, the second glass frit may further include 5 to 25 mol% of silicon (Si) oxide.
7. In any of the above 1 to 6, the second glass frit may further include 0.3 to 15 mol% of titanium (Ti) oxide.
8. In any one of the above 1 to 7, the above second glass frit may further include iron (Fe) oxide in an amount of 1 to 5 mol%.
9. In any one of the above 1 to 8, the second glass frit may further include 1 or more of boron (B) oxide, sodium (Na) oxide, aluminum (Al) oxide, tungsten (W) oxide, and molybdenum (Mo) oxide.
10. According to another embodiment, there is provided a solar cell electrode forming method of any one of the above 1 to 9. The method can comprise the following steps: the method for manufacturing the solar cell includes a step of applying a first composition for forming a solar cell electrode, the first composition including a conductive powder, a first glass frit, and an organic vehicle, to form a first electrode layer, a step of applying a second composition for forming a solar cell electrode, the second composition including a conductive powder, a second glass frit, and an organic vehicle, to form a second electrode layer, and a firing step.
11. In the above 10, the first solar cell electrode-forming composition or the second solar cell electrode-forming composition may further include 1 or more of a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an antifoaming agent, a pigment, an ultraviolet stabilizer, an antioxidant, and a coupling agent.
12. In the above 10 or 11, the first solar cell electrode-forming composition may include 60 to 95 wt% of the conductive powder, 0.1 to 20 wt% of the first glass frit, and 1 to 30 wt% of the organic vehicle, and the second solar cell electrode-forming composition may include 60 to 95 wt% of the conductive powder, 0.1 to 20 wt% of the second glass frit, and 1 to 30 wt% of the organic vehicle.
The present invention has the effect of providing a solar cell electrode and a method for forming the same, which improve open circuit voltage characteristics by controlling interfacial reactions generated during electrode firing, and have excellent conversion efficiency and improved adhesion.
Drawings
Fig. 1 schematically shows the structure of a solar cell according to an example of the present invention.
Detailed Description
In the present specification, the singular expressions include plural expressions unless the context clearly indicates otherwise.
The terms including or having in the present specification mean the presence of the features or structural elements described in the specification, and do not preclude the possibility of adding one or more other features or structural elements.
The terms first, second, etc. used in the present specification may be used to describe various structural elements, but the structural elements are not limited by the terms. The terminology is used for the purpose of distinguishing one structural element from other structural elements only.
In explaining the structural elements, the error range is to be interpreted as being included even if there is no additional explicit description.
"to" in "a to b" representing numerical value ranges in the present specification is defined as ≧ a and ≦ b.
Solar cell electrode
According to an embodiment, a solar cell electrode is provided. The solar cell electrode may include: a first electrode layer comprising a conductive powder and a first glass frit; and a second electrode layer formed on the first electrode layer, the second electrode layer including a conductive powder and a second glass frit which is different from the first glass frit and has a molar ratio of lead (Pb) oxide/(lead (Pb) oxide + copper (Cu) oxide) of more than 0.2 and 0.95 or less.
The conductive powder may include, for example, one or more metal powders of silver (Ag), gold (Au), platinum (Pt), palladium (Pd), aluminum (Al), and nickel (Ni), but is not limited thereto. According to an example, the conductive powder may include silver powder.
The particle shape of the conductive powder is not particularly limited, and particles having various shapes, for example, spherical, plate-like, or amorphous particles can be used.
The conductive powder may be a powder having a particle diameter of a nano size or a micro size, and for example, may be a conductive powder of a size of several tens or hundreds of nanometers or a conductive powder of a size of several to several tens of micrometers. In addition, as the conductive powder, 2 or more conductive powders with different sizes may be mixed and used.
Average particle diameter (D) of conductive powder 50 ) May be 0.1 to 10 μm, for example, may be 0.5 to 5 μm. Within the above range, the contact resistance and the series resistance may be reduced. The average particle diameter (D) can be measured using 1064LD model manufactured by CI LAS after conducting ultrasonic dispersion of conductive powder in isopropyl alcohol (IPA) at 25 ℃ for 3 minutes 50 )。
The glass frit is used for etching (etching) the antireflection film in a firing step of the electrode-forming composition, and melts the conductive powder to generate crystal particles of the conductive powder in the emitter region. The glass frit improves the adhesion between the conductive powder and the wafer, and softens during sintering to induce an effect of further lowering the sintering temperature.
The first glass frit included in the first electrode layer and the second glass frit included in the second electrode layer may be different. For example, the elements included in the first glass frit and the second glass frit may be different in kind or content.
The first glass frit may generally be a glass frit used in the preparation of electrodes for solar cells. For example, the first glass frit may include 1 or more elements selected from lead (Pb), tellurium (Te), bismuth (Bi), lithium (Li), boron (B), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), zinc (Zn), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), molybdenum (Mo), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), copper (Cu), sodium (Na), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (M n), and aluminum (Al).
According to an example, the first glass frit may comprise a Bi-Te-O type glass frit, a Pb-Bi-O type glass frit, a Pb-Te-Bi-O type glass frit, a Te-B-O type glass frit, a Te-Ag-O type glass frit, a Pb-Si-O type glass frit, a Bi-Si-O type glass frit, 1 or more selected from the group consisting of a Te-Zn-O glass frit, a Bi-Te-Li-Zn-O glass frit, a Pb-Te-Si-Na-W-O glass frit, a Bi-B-O glass frit, a Pb-B-O glass frit, a Bi-M O-O glass frit, a Mo-B-O glass frit and a Te-Si-O glass frit. In this case, there is an advantage that the balance of the electrical characteristics of the solar cell electrode is excellent.
The second glass frit is different from the first glass frit and includes lead (Pb) oxide and copper (Cu) oxide, and a molar ratio of lead (Pb) oxide/(lead (Pb) oxide + copper (Cu) oxide) may be greater than 0.2 and 0.95 or less. In this case, the open circuit voltage characteristics and the solar cell efficiency are improved by reducing recombination loss caused by etching the ARC layer during electrode firing, and the adhesion to the wafer-gate line interface or the gate line-bonding wire interface is also excellent. According to an example, the molar ratio of lead (Pb) oxide/(lead (Pb) oxide + copper (Cu) oxide) in the second glass frit may be 0.23 to 0.93, according to another example, 0.23 to 0.87, according to another example, 0.23 to 0.80, but is not limited thereto.
According to an example, the lead (Pb) oxide may include 15 to 75 mol% (e.g., 17 to 75 mol%, to cite another example, 17 to 70 mol%) based on the total molar amount of the second glass frit, and within the above range, the open circuit voltage characteristic and the solar cell efficiency may be improved by reducing recombination loss caused by etching the ARC layer during firing of the electrode, and the adhesion to the wafer-gate line interface or the gate line-wire bond interface may be excellent, but is not limited thereto.
According to an example, the copper (Cu) oxide may include 3 to 60 mol% (e.g., 5 to 60 mol%, to cite another example, 5 to 58 mol%) based on the total molar amount of the second glass frit, and within the above range, the open circuit voltage characteristic and the solar cell efficiency may be improved by reducing recombination loss caused by etching the ARC layer during firing of the electrode, and the adhesion to the wafer-gate line interface or the gate line-bonding wire interface may also be excellent, but is not limited thereto.
The second glass frit may include, In addition to the elements of lead (Pb) and copper (Cu), 1 or more elements selected from tellurium (Te), bismuth (Bi), lithium (Li), boron (B), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), zinc (Zn), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), molybdenum (Mo), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), sodium (Na), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), and aluminum (Al), for example.
According to an example, the second glass frit may also include silicon (Si) oxide. In this case, an adhesion improvement effect can be obtained. The silicon (Si) oxide may be included, for example, in an amount of 5 to 25 mol%, in another example, 5 to 20 mol%, and in another example, 6 to 15 mol%, based on the total molar amount of the second glass frit, and the adhesion improvement effect may be further excellent within the above range, but is not limited thereto.
According to another example, the second glass frit may also include titanium (Ti) oxide. In this case, an adhesion improvement effect can be obtained. The titanium (Ti) oxide may be included, for example, in an amount of 0.3 to 13 mol%, for another example, 0.3 to 11 mol%, for another example, 0.3 to 10 mol%, based on the total molar amount of the second glass frit, and the adhesion improvement effect may be further excellent within the above range, but is not limited thereto.
According to another example, the second glass frit may also include iron (Fe) oxide. In this case, an adhesion improvement effect can be obtained. The iron (Fe) oxide may be included, for example, in an amount of 1 to 5 mol%, for another example, 1.2 to 4 mol%, for another example, 1.2 to 3.6 mol%, based on the total molar amount of the second glass frit, and the adhesion improvement effect may be further excellent within the above range, but is not limited thereto.
According to another example, the second glass frit may also include boron (B) oxide. In this case, the glass can be easily produced, and can have an adhesion improving effect. The boron (B) oxide may be included, for example, in an amount of 0.1 to 20 mol%, and as another example, in an amount of 0.1 to 15 mol%, based on the total molar amount of the second glass frit, and within the above range, the glass may be easily prepared and may have an adhesion improving effect, but is not limited thereto.
According to another example, the second glass frit may also include sodium (Na) oxide. In this case, the resistance improvement effect can be obtained. The sodium (Na) oxide may be included, for example, in an amount of 1 to 8 mol%, or, in another example, in an amount of 1.5 to 6 mol%, or, in another example, in an amount of 1.5 to 5 mol%, based on the total molar amount of the second glass frit, and may have a resistance improvement effect within the above range, but is not limited thereto.
According to another example, the second glass frit may also include aluminum (Al) oxide. In this case, an adhesion improvement effect can be obtained. The aluminum (Al) oxide may be included, for example, in an amount of 0.1 to 2 mol% based on the total molar amount of the second glass frit, and may have an adhesion improvement effect within the above range, but is not limited thereto.
According to another example, the second glass frit may also include tungsten (W) oxide. In this case, an adhesion improvement effect can be obtained. The tungsten (W) oxide may be included, for example, in an amount of 0.1 to 5 mol%, for another example, 0.1 to 3.5 mol%, for another example, 0.1 to 3 mol%, based on the total molar amount of the second glass frit, and may have an adhesion improving effect within the above range, but is not limited thereto.
According to another example, the second glass frit may also include molybdenum (Mo) oxide. In this case, the open circuit voltage improvement effect can be obtained. The molybdenum (Mo) oxide may be included, for example, in an amount of 0.1 to 5 mol% based on the total molar amount of the second glass frit, and may have an open circuit voltage improvement effect within the above range, but is not limited thereto.
According to another example, the second glass frit may not include tellurium (Te) elements. In this case, the resistance improvement effect can be obtained.
The shape, size, etc. of the glass frit are not particularly limited. For example, the shape of the glass frit may be spherical or amorphous, respectively, and the average particle size (D) of the glass frit 50 ) May be 0.1 to 10 μm. The average particle size (D) can be measured using 1064LD model manufactured by CILAS corporation after 3 minutes of ultrasonic dispersion of the glass frit in isopropanol at 25 ℃ 50 )。
The glass frit may be prepared from the above-described elements and/or element oxides using conventional methods. For example, the above-mentioned elements and/or element oxides are mixed by a ball mill (ball mill) or a planetary mill (planetary mill), the mixed composition is melted at 800 to 1300 ℃, quenched (quenching) at 25 ℃, and the resultant is pulverized by a disc mill (d isk mill), a planetary mill, or the like.
Method for forming solar cell electrode
According to another embodiment, a method of forming the solar cell electrode is provided. The solar cell electrode forming method may include: the method for manufacturing the solar cell includes a step of applying a first composition for forming a solar cell electrode, the first composition including a conductive powder, a first glass frit, and an organic vehicle, to form a first electrode layer, a step of applying a second composition for forming a solar cell electrode, the second composition including a conductive powder, a second glass frit, and an organic vehicle, to form a second electrode layer, and a firing step.
The first solar cell electrode-forming composition may be prepared by mixing a conductive powder, a first glass frit, and an organic vehicle, and the second solar cell electrode-forming composition may be prepared by mixing a conductive powder, a second glass frit, and an organic vehicle. Since the conductive powder, the first glass frit, and the second glass frit have been described in detail, detailed description is omitted.
The amount of the conductive powder used is not particularly limited, and for example, the conductive powder may be included by 60 to 95 weight percent, for example, 70 to 90 weight percent, with respect to the total weight of the first or second solar cell electrode forming composition. Within the above range, the solar cell has excellent conversion efficiency and can be pasted smoothly.
The amount of the glass frit used is not particularly limited, and may be, for example, 0.1 to 20 wt%, for example, 0.1 to 10 wt%, based on the total weight of the first or second solar cell electrode forming composition. Within the above range, the solar cell efficiency can be improved by the excellent open circuit voltage, and the adhesive force improvement effect can be provided.
The composition for forming a solar cell electrode may include an organic vehicle for imparting viscosity and rheological characteristics suitable for printing to the composition by mechanical mixing with inorganic components of the composition. The organic vehicle may be generally the one used in the composition for forming the solar cell electrode, and may include a binder resin, a solvent, and the like.
As the binder resin, acrylic ester or cellulose resin can be used. According to an example, ethyl cellulose may be used as the binder resin. According to another example, ethyl hydroxyethyl cellulose, cellulose nitrate, a mixture of ethyl cellulose and a phenol resin, an alkyd resin, a phenol resin, an acrylate resin, a xylene resin, a polybutene resin, a polyester resin, a urea resin, a melamine resin, a vinyl acetate resin, wood rosin (rosin), or an alcohol polymethyl acrylate can be used as the binder resin.
Examples of the solvent include hexane, toluene, ethyl cellosolve, cyclohexanone, butyl cellosolve, butyl carbitol (diethylene glycol monobutyl ether), dibutyl carbitol (diethylene glycol dibutyl ether), butyl carbitol acetate (diethylene glycol monobutyl ether acetate), propylene glycol monomethyl ether, hexylene glycol, terpineol (terpineol), methyl ethyl ketone, benzyl alcohol, γ -butyrolactone, ethyl lactate, and 2,2, 4-trimethyl-1, 3-pentanediol monoisobutyrate (e.g., ester alcohol), which may be used alone or in combination.
The amount of the organic vehicle used is not particularly limited, and for example, the organic vehicle may be contained in an amount of 1 to 30 weight percent, for example, 3 to 25 weight percent, with respect to the total weight of the first or second solar cell electrode forming composition. Within the above range, sufficient adhesive strength and excellent printability can be ensured.
The composition for forming a solar cell electrode may further include 2 or more kinds of dispersing agents, thixotropic agents, plasticizers, viscosity stabilizers, antifoaming agents, pigments, ultraviolet stabilizers, antioxidants, coupling agents, and the like, alone or in combination, as necessary, in addition to the above components, in order to improve flow characteristics, process characteristics, and stability. These components may be contained in an amount of 0.1 to 5 weight percent with respect to the total weight of the first or second solar cell electrode-forming composition, but the content thereof may be changed as needed.
The solar cell electrode forming method may include, for example: a step of forming a first electrode layer by applying a first solar cell electrode-forming composition to the surface of a substrate in a predetermined pattern and then drying the composition; a step of forming a second electrode layer by applying a second composition for forming a solar cell electrode on the substrate on which the first electrode layer is formed, and then drying the composition; and firing the electrode patterns formed from the first and second solar cell electrode-forming compositions.
The composition for forming the solar cell electrode may be applied by, for example, screen printing, gravure offset printing, rotary screen printing, or a peeling method, but is not limited thereto.
The composition for forming a solar cell electrode may be dried, for example, at about 200 ℃ to about 400 ℃ for about 10 seconds to about 60 seconds, but is not limited thereto.
The firing process may be performed, for example, at about 400 to about 980 c (e.g., about 600 to about 950 c) for about 60 to about 210 seconds, but is not limited thereto.
Solar cell
According to another embodiment, a solar cell is provided comprising the solar cell electrode described above.
Fig. 1 schematically shows the structure of a solar cell 100 according to an example of the present invention.
Referring to fig. 1, a solar cell 100 may include: a substrate 10 including a p layer (or n layer) 11 and an n layer (or p layer) 12 as an emitter; a back electrode 21 and a front electrode 23. The rear electrode 21 or the front electrode 23 may include a first electrode layer formed on the substrate 10, which may include conductive powder and a first glass frit, and a second electrode layer formed on the first electrode layer, which may include conductive powder and a second glass frit.
The solar cell 100 can be prepared, for example, by printing a first solar cell electrode-forming composition on the front surface of the substrate 10, drying the composition to form a first electrode layer, printing a second solar cell electrode-forming composition, drying the composition to form a second electrode layer, performing a preliminary preparation step for the front electrode 23, printing an aluminum paste on the rear surface of the substrate 10, drying the aluminum paste, performing a preliminary preparation step for the rear electrode 21, and firing the aluminum paste.
The present invention will be described in further detail below with reference to examples. However, this is mentioned as a preferred example of the present invention, and it should not be construed that the present invention is limited thereto in any sense.
Examples
Preparation example 1
2 parts by weight of ethyl cellulose (STD4, Dow chemical) as a binder resin was sufficiently dissolved in 6.5 parts by weight of terpene alcohol (Nippon Terpine) as a solvent at 60 ℃ and then 90 parts by weight of spherical silver powder (4-8F, Dowa) having an average particle diameter of 2.0 μm and 1.0 μm of the layer 1 (1) of Table 1 having an average particle diameter of 1.0 μm were put in st layer) glass frit 1.5 parts by weight, and after uniformly mixing, the mixture was mixed and dispersed by a 3-roll kneader, thereby preparing a first composition for forming a solar cell electrode.
Preparation examples 2 to 11
A second solar cell electrode-forming composition was prepared by the same method as preparation example 1, except that glass frits a to J described in table 1 below were used, respectively.
[ TABLE 1 ]
(unit: mole percent)
Examples 1 to 8 and comparative examples 1 and 2
Texturing (texturing) the front of a wafer (a Boron doped (doting) p-type wafer), followed by POCl 3 An n + layer was formed, and after an aluminum paste was printed on the rear surface of a single crystal (mono crystalline) wafer on which silicon nitride (SiNx: H) was formed as an anti-reflection film, the wafer was dried at 300 ℃ for 30 seconds. Subsequently, the first solar cell electrode-forming composition according to preparation example 1 was screen-printed in front of the wafer, dried at 300 ℃ for 30 seconds to form a first electrode layer, and then a second solar cell electrode-forming composition according to any one of preparation examples 2 to 11 was screen-printed thereon, dried at 300 ℃ for 30 seconds to form a second electrode layer. The solar cell sheet formed through the above process was fired at 940 ℃ for 70 seconds using a belt firing furnace to prepare a solar cell sheet.
Evaluation example 1: electric characteristics
The solar cell sheets prepared in examples 1 to 8 and comparative examples 1 and 2 were measured for short-circuit current (Isc, unit: a), open-circuit voltage (Voc, unit: mV), series resistance (Rs, unit: Ω), fill factor (FF, unit:%) and conversion efficiency (eff., unit:%) using a solar cell efficiency measuring apparatus (Halm, Fortix tech), and the results thereof are shown in table 2 below.
Evaluation example 2: adhesion force
Flux (Flux) was applied to the second electrode layer of the solar cell chips prepared in examples 1 to 8 and comparative examples 1 and 2 (952S, Kester corporation), the bonding wire (62Sn/36Pb/2Ag, thickness 0.18mm, width 1.5mm) was adhered using an electric iron at a temperature of 360 ℃, then the end of the bonding wire was fixed at an angle of 180 degrees using a tester (Mocel H5K-T, Tinius Olsen corporation), pulled at a speed of 50mm/min, and the value thereof was measured, and the result thereof was shown in table 2 below.
[ TABLE 2 ]
As can be seen from table 2, the solar cells of examples 1 to 8 have higher open circuit voltages and superior conversion efficiencies as compared to the solar cells of comparative examples 1 and 2, and thus have superior adhesion.
So far, embodiments of the present invention have been mainly explained. Those skilled in the art to which the present invention pertains will appreciate that the present invention can be implemented in various forms without departing from the essential characteristics of the invention. The disclosed embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. The scope of the invention is indicated in the appended claims rather than in the foregoing description, and all differences within the equivalent scope will be construed as being included in the present invention.
Claims (12)
1. A solar cell electrode, comprising:
a first electrode layer comprising a conductive powder and a first glass frit; and
and a second electrode layer formed on the first electrode layer, the second electrode layer including a conductive powder and a second glass frit which is different from the first glass frit and has a molar ratio of lead (Pb) oxide/(lead (Pb) oxide + copper (Cu) oxide) of more than 0.2 and 0.95 or less.
2. The solar cell electrode of claim 1, wherein the second glass frit comprises 15 to 75 mole percent lead (Pb) oxide.
3. The solar cell electrode of claim 1, wherein the second glass frit comprises 3 to 60 mole percent copper (Cu) oxide.
4. The solar cell electrode according to claim 1, wherein the second glass frit further comprises 1 or more elements selected from tellurium (Te), bismuth (Bi), lithium (Li), boron (B), phosphorus (P), germanium (Ge), gallium (Ga), cerium (Ce), iron (Fe), silicon (Si), zinc (Zn), tungsten (W), magnesium (Mg), cesium (Cs), strontium (Sr), molybdenum (Mo), titanium (Ti), tin (Sn), indium (In), vanadium (V), barium (Ba), nickel (Ni), sodium (Na), potassium (K), arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), and aluminum (Al).
5. The solar cell electrode according to claim 1, wherein the second glass frit further comprises at least one of silicon (Si) oxide, titanium (Ti) oxide, and iron (Fe) oxide.
6. The solar cell electrode of claim 1, wherein the second glass frit further comprises 5 to 25 mole percent silicon (Si) oxide.
7. The solar cell electrode of claim 1, wherein the second glass frit further comprises 0.3 to 13 mole percent titanium (Ti) oxide.
8. The solar cell electrode of claim 1, wherein the second glass frit further comprises 1 to 5 mole percent iron (Fe) oxide.
9. The solar cell electrode according to claim 1, wherein the second glass frit further comprises 1 or more of boron (B) oxide, sodium (Na) oxide, aluminum (Al) oxide, tungsten (W) oxide, and molybdenum (Mo) oxide.
10. A solar cell electrode forming method according to any one of claims 1 to 9, characterized by comprising:
a step of forming a first electrode layer by coating a first composition for forming a solar cell electrode, the composition comprising a conductive powder, a first glass frit, and an organic vehicle,
coating a second solar cell electrode-forming composition containing a conductive powder, a second glass frit, and an organic vehicle, forming a second electrode layer, and
and (5) a firing step.
11. The method of claim 10, wherein the first or second composition further comprises at least one of a dispersant, a thixotropic agent, a plasticizer, a viscosity stabilizer, an antifoaming agent, a pigment, an ultraviolet stabilizer, an antioxidant, and a coupling agent.
12. The solar cell electrode forming method according to claim 10,
the first solar cell electrode-forming composition includes 60 to 95 wt% of the conductive powder, 0.1 to 20 wt% of the first glass frit, and 1 to 30 wt% of the organic vehicle,
the second solar cell electrode-forming composition includes 60 to 95 wt% of the conductive powder, 0.1 to 20 wt% of the second glass frit, and 1 to 30 wt% of the organic vehicle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110211709.6A CN114974649A (en) | 2021-02-25 | 2021-02-25 | Solar cell electrode and forming method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110211709.6A CN114974649A (en) | 2021-02-25 | 2021-02-25 | Solar cell electrode and forming method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114974649A true CN114974649A (en) | 2022-08-30 |
Family
ID=82972750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110211709.6A Pending CN114974649A (en) | 2021-02-25 | 2021-02-25 | Solar cell electrode and forming method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114974649A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105263876A (en) * | 2012-12-28 | 2016-01-20 | 赫劳斯德国有限两和公司 | Binary glass frits used in n-type solar cell production |
CN106816484A (en) * | 2015-12-02 | 2017-06-09 | 三星Sdi株式会社 | The method for forming electrode, the electrode and solar cell that are produced from it |
KR20190031816A (en) * | 2017-09-18 | 2019-03-27 | 대주전자재료 주식회사 | Rear electrode paste for solar cell |
CN110066108A (en) * | 2018-01-23 | 2019-07-30 | Agc株式会社 | Glass, the manufacturing method of glass, conductive paste and solar battery |
CN111048601A (en) * | 2018-10-10 | 2020-04-21 | 三星Sdi株式会社 | Solar cell electrode, preparation method thereof and solar cell comprising solar cell electrode |
CN111354803A (en) * | 2018-12-21 | 2020-06-30 | 三星Sdi株式会社 | Method for forming solar cell electrode and solar cell |
-
2021
- 2021-02-25 CN CN202110211709.6A patent/CN114974649A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105263876A (en) * | 2012-12-28 | 2016-01-20 | 赫劳斯德国有限两和公司 | Binary glass frits used in n-type solar cell production |
CN106816484A (en) * | 2015-12-02 | 2017-06-09 | 三星Sdi株式会社 | The method for forming electrode, the electrode and solar cell that are produced from it |
KR20190031816A (en) * | 2017-09-18 | 2019-03-27 | 대주전자재료 주식회사 | Rear electrode paste for solar cell |
CN110066108A (en) * | 2018-01-23 | 2019-07-30 | Agc株式会社 | Glass, the manufacturing method of glass, conductive paste and solar battery |
CN111048601A (en) * | 2018-10-10 | 2020-04-21 | 三星Sdi株式会社 | Solar cell electrode, preparation method thereof and solar cell comprising solar cell electrode |
CN111354803A (en) * | 2018-12-21 | 2020-06-30 | 三星Sdi株式会社 | Method for forming solar cell electrode and solar cell |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101780531B1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
CN104715804A (en) | Composition for solar cell electrodes and electrode fabricated using the same | |
CN106816484B (en) | Method of forming electrode, electrode manufactured thereby, and solar cell | |
CN113380439A (en) | Composition for forming solar cell electrode and solar cell electrode formed therefrom | |
CN108074993B (en) | Front electrode for solar cell and solar cell including the same | |
CN111354803B (en) | Method for forming solar cell electrode and solar cell | |
CN113450941A (en) | Composition for forming solar cell electrode and solar cell electrode formed therefrom | |
CN111048601B (en) | Solar cell electrode, preparation method thereof and solar cell comprising solar cell electrode | |
KR20210076308A (en) | Solar cell electrode and method for forming the same | |
CN114974649A (en) | Solar cell electrode and forming method thereof | |
KR102018364B1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
CN110797134B (en) | Composition for solar cell electrode and solar cell | |
KR20190073210A (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
TWI663739B (en) | Composition for solar cell electrodes and solar cell electrode fabricated using the same | |
JP6804255B2 (en) | Electrode forming composition and electrodes and solar cells manufactured using the composition | |
KR20210111400A (en) | Solar cell | |
US20190035951A1 (en) | Composition for solar cell electrode and electrode prepared using the same | |
KR20220006374A (en) | Composition for forming solar cell electrode and solar cell electrode prepared using the same | |
CN114975644A (en) | Selective emitter solar cell electrode and solar cell comprising same | |
KR20200094555A (en) | Method for forming solar cell electrode, solar cell electrode manufactured therefrom and solar cell | |
US20200194601A1 (en) | Composition for forming diamond sawn wafer solar cell electrode and diamond sawn wafer solar cell electrode prepared using the same | |
US20190292092A1 (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
KR20210158738A (en) | Composition for forming solar cell electrode and solar cell electrode prepared using the same | |
KR20190010343A (en) | Composition for forming solar cell electrode and electrode prepared using the same | |
CN113436780A (en) | Composition for forming solar cell electrode and solar cell electrode formed from same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |