CN114967362A - Two-dimensional positioning precision calibration method of precision displacement platform for photoetching machine - Google Patents

Two-dimensional positioning precision calibration method of precision displacement platform for photoetching machine Download PDF

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CN114967362A
CN114967362A CN202210489780.5A CN202210489780A CN114967362A CN 114967362 A CN114967362 A CN 114967362A CN 202210489780 A CN202210489780 A CN 202210489780A CN 114967362 A CN114967362 A CN 114967362A
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platform
precision
dimensional
standard plate
photoetching machine
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刘涛
张昌清
马强
于福来
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Zhejiang Jinxin Microelectronics Technology Co ltd
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Zhejiang Jinxin Microelectronics Technology Co ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses an on-line measurement and correction method for two-dimensional positioning accuracy of a precision displacement platform. The method uses the standard plate, the CCD imaging system, the image processing system and the platform motion control system to calibrate and compensate the positioning precision of the two-dimensional platform, improves the X, Y two-dimensional positioning precision of the precision displacement platform, and can meet the requirements of the precision of the calibration system of the photoetching machine and the precision of an exposure graph when the platform is used in the photoetching machine system. Before the measurement, the measurement method of the positioning accuracy of the precise displacement platform is limited to off-line adjustment and measurement, and the obtained motion platform cannot completely meet the accuracy requirement of the photoetching machine. The method adopts on-line test and data processing compensation, is easy to realize high precision, and makes up for the defect of off-line debugging precision.

Description

Two-dimensional positioning precision calibration method of precision displacement platform for photoetching machine
Technical Field
The invention belongs to the field of laser direct writing lithography of Printed Circuit Boards (PCBs), and particularly relates to a precision motion control system and a CCD imaging and image processing system, which are mainly used for calibrating and correcting the positioning precision of a two-dimensional precision displacement platform in a scanning lithography machine.
Background
Laser direct write Lithography (LDI) is an emerging technology for creating feature line patterns directly on photosensitive material on a copper substrate surface without the need for a negative plate. The LDI photoetching machine has the advantages of high precision, PCB manufacturing procedure saving and the like, so that the LDI photoetching machine has the tendency of replacing the traditional exposure machine.
In the laser direct-writing photoetching process, a copper-clad plate to be processed is adsorbed on a vacuum chuck, and the chuck is arranged on a two-dimensional displacement platform which can move along X, Y two directions. The characteristic line pattern is generated by a spatial light modulation device (SLM). The SLM is an array of micromirrors, each micromirror individually addressable to control the angular flip, causing it to reflect a light beam into an imaging lens or into its own absorbing medium, creating a light modulating effect. And then, imaging the light beam to the copper-clad plate by using an imaging lens to generate a characteristic circuit pattern. When the scanning type photoetching machine works, the two-dimensional platform moves in real time, and the turning time of the micro mirror array is controlled through the position feedback signal of the two-dimensional platform, so that the effect of synchronizing the position of the platform and the pattern of the characteristic circuit is achieved. Therefore, if the positioning accuracy of the platform is not good, the abnormity such as pattern deformation, deviation and insufficient accuracy can be caused directly.
In addition, in order to ensure the correctness of the information such as the shape and the position of an exposure pattern, a series of system parameters of the photoetching machine are calibrated before production, and the calibration is required to be established on the basis of a two-dimensional displacement platform.
In summary, the accuracy of the positioning precision of the two-dimensional displacement platform plays a significant role in the LDI lithography system. However, there is no accurate and efficient method for calibrating and correcting the two-dimensional platform on-line when the two-dimensional platform is installed in the whole system of the lithography machine. The accuracy of the exposure pattern of the LDI photoetching machine cannot be completely ensured only by offline adjustment and measurement of the positioning accuracy of the two-dimensional platform.
Disclosure of Invention
The invention provides a calibration and correction method for two-dimensional positioning precision of a precision displacement platform, which is used for improving the precision of an exposure graph of an LDI photoetching machine.
In order to achieve the purpose, the invention adopts the technical scheme that:
the two-dimensional positioning precision calibration method of the precision displacement platform for the photoetching machine is characterized by comprising the following steps of: the calibration and measurement system of the photoetching machine comprises an X, Y two-dimensional motion platform, a vacuum chuck, a CCD imaging system and an image processing system. The measuring tool is a standard plate with characteristic patterns, and the patterns are periodically arranged in the transverse direction and the longitudinal direction at fixed intervals. The vacuum chuck is arranged on an X, Y two-dimensional motion platform and is used for placing a standard plate. The CCD imaging system is arranged above the vacuum chuck, is fixed in position and is used for picking up the characteristic patterns on the standard plate and transmitting the images to the image processing system for real-time processing and calculation.
The calibration and correction process comprises the following steps:
1) placing the standard plate on a vacuum chuck, abutting against a positioning pin, and fixing by vacuum adsorption;
2) selecting a pattern at the upper left corner of the standard plate as an original point, and controlling X, Y to move the two-dimensional platform so that the original point appears in the field of view of the upper CCD;
3) the CCD imaging system collects and transmits images, and the distance between the CCD field of view center and the standard plate feature pattern center in the direction of X, Y is calculated through the image processing system;
4) the center of the standard plate characteristic pattern is coincided with the center of a CCD (charge coupled device) view field by controlling the platform to move, and the platform coordinate at the moment is obtained;
5) the platform moves leftwards according to the distance of the pattern on the standard plate, so that the right point in the same line with the origin appears at the center of the CCD view field;
6) repeating the steps 3-5 to obtain platform coordinates corresponding to a line of patterns on the standard plate, and ensuring that the platform coordinates cover the whole stroke of the X axis of the platform;
7) selecting a point below the same column as the original point, and controlling the platform to move to enable the point to appear in the CCD field of view;
8) and repeating the steps 3-6 to obtain platform coordinates corresponding to the second row of patterns on the standard plate, and repeating the steps in the same way until the tested row number covers the whole stroke of the Y axis of the platform. After the test is finished, obtaining a group of two-dimensional matrix data;
9) calculating the distance between two adjacent points in the same line (column), comparing the result with the distance between the characteristic patterns on the standard plate to obtain the positioning error when the platform moves according to the line (column), namely the X (Y) axis, and finally obtaining the positioning error data corresponding to the coordinate position of the X, Y two-dimensional motion platform;
10) compensating the positioning error into the platform motion control system: when the platform moves to the appointed coordinate position, calculating the positioning error of the position by linear interpolation of the endpoint error of the position interval where the position is located, and compensating;
11) and (4) performing coordinate compensation on the two-dimensional matrix data obtained in the step (8) according to the method in the step (10), and after compensation, randomly selecting a row and a column of data, and calculating an included angle between two straight lines. The angle is the included angle between the X-axis and the Y-axis of the platform, the included angle is compensated to 90 degrees, and the correction of the two-dimensional positioning precision of the precision displacement platform is completed.
The standard plate is made of quartz glass, and the characteristic pattern on the standard plate is processed by a photoetching method and can be any pattern. The positioning pins are arranged on the left side and the lower side of the suction cup to ensure that the direction of the standard plate is basically consistent with the two-dimensional motion direction of X, Y when the standard plate is placed.
The invention has the significance of providing an on-line positioning accuracy test correction method for an X, Y two-dimensional displacement platform. When the platform is installed in a photoetching machine system, the positioning precision error can be simply and efficiently measured. After the platform is corrected, the LDI photoetching machine has a set of ideal orthogonal motion system with high positioning precision, and the shape and position precision of the pattern produced by the photoetching machine are ensured. The method can also be used for other equipment comprising a motion platform and a CCD imaging system so as to improve the measurement or processing precision of the equipment.
Drawings
FIG. 1 is a schematic view of the overall apparatus.
FIG. 2 is a schematic view of a standard plate.
FIG. 3 is a schematic diagram of the motion effect of the platform before and after two-dimensional compensation.
FIG. 4 is a schematic diagram of transformation between a non-orthogonal coordinate system and an orthogonal coordinate system.
Detailed Description
The two-dimensional positioning precision calibration method of the precision displacement platform for the photoetching machine is characterized by comprising the following steps of: the equipment calibration measuring system is shown in fig. 1, and comprises X, Y two-dimensional motion platform 1, platform motion control system 6, vacuum chuck 2 installed on X, Y two-dimensional motion platform 1, CCD imaging system 4 and image processing system 5, and the measuring tool is standard plate 7. The CCD imaging system 4 is arranged above the vacuum chuck 2 and used for collecting characteristic patterns on the standard plate 7 and transmitting the images to the image processing system 5, and the image processing system 5 carries out real-time processing calculation.
The pattern of features on the standard plate 7 is shown in figure 2.
The specific process of testing and data processing is as follows:
1) placing the standard plate 7 on the vacuum chuck 2, abutting against the positioning pin 3, and fixing by vacuum adsorption;
2) as shown in FIG. 2, point A at the upper left corner of the standard board is selected 11 Controlling X, Y the two-dimensional platform to move to make the origin point appear in the visual field of the upper CCD;
3) the CCD imaging system 4 collects and transmits images, and the distance between the center of the CCD field of view and the center of the standard plate characteristic pattern in the direction of X, Y is calculated through the image processing system 5;
4) the platform motion control system 6 controls X, Y the two-dimensional motion platform 1 to move, so that the center of the characteristic pattern on the standard plate 7 coincides with the center of the CCD view field, and the platform coordinate (X) at the moment is obtained 11 ，Y 11 )；
5) Distance d of platform 1 according to pattern on standard plate 7 x Move to the left to point A on the right side of the same line as the origin 12 Appears in the center of the CCD field of view;
6) repeating the steps 3-5 to obtain platform coordinates (X) corresponding to the first row of patterns on the standard plate 7 11 ，Y 11 )、(X 12 ，Y 12 )……(X 1n ，Y 1n ) Ensuring that the platform coordinates cover the whole stroke of the X axis of the platform;
7) selecting a point A below the same row as the origin 21 Controlling the platform 1 to move to be in the CCD field of view;
8) repeating the steps 3-6 to obtain platform coordinates (X) corresponding to the second row of patterns on the standard plate 7 21 ，Y 21 )、(X 22 ，Y 22 )……(X 2n ，Y 2n ) And so on until the row of the testThe number covers the entire travel of the Y-axis of the stage. After the test is finished, a group of two-dimensional matrix data is obtained
Figure BDA0003624710390000041
9) Calculating the distance D between two adjacent points in the same row (column) (n+1)n (D (m+1)m )
Figure BDA0003624710390000042
Figure BDA0003624710390000043
The distance d between the result and the characteristic pattern on the standard plate 7 x 、d y Comparing to obtain the positioning error of the platform moving along the line (row), namely the X (Y) axis,
positioning error of line-by-line motion: e xmn ＝D m(n+1)n －d x
Positioning error for column-wise motion: e ymn ＝D (m+1)mn －d y
Finally obtaining positioning error data corresponding to X, Y two-dimensional motion platform coordinate position
Figure BDA0003624710390000044
Figure BDA0003624710390000045
10) The positioning error is compensated into the platform motion control system 6: when the platform moves to the appointed coordinate position, the positioning error of the position is calculated through the linear interpolation of the endpoint error of the position interval where the position is located, and compensation is carried out. E.g. the platform is moved to the (X, Y) position, an
X n－1 ＜X＜X n
Y m－1 ＜Y＜Y m
The positioning error E in the X direction of the position x Is composed of
Figure BDA0003624710390000051
Figure BDA0003624710390000052
Figure BDA0003624710390000053
Positioning error E in Y direction y Is composed of
Figure BDA0003624710390000054
Figure BDA0003624710390000055
Figure BDA0003624710390000056
Then, the compensated two-dimensional coordinate is (X + E) x ，Y+E y )；
11) And (3) performing coordinate compensation on the two-dimensional motion platform according to the method in the step 10, randomly selecting a row and a column of data after compensation, and calculating an included angle theta of two straight lines. The included angle is compensated to 90 degrees as shown in fig. 4. If the coordinates of a point in the non-orthogonal coordinate system are (X ', Y'), the coordinates of a point in the orthogonal coordinate system are
X＝X′·cos(θ-π/2)
Y＝Y′-X′·sin(θ-π/2)
Namely, the correction of the two-dimensional positioning precision of the precision displacement platform is completed.
Step 10 compensates for the two-dimensional platform motion effect pairs before and after the step shown in figure 3. Before compensation (fig. 3(a)), the trajectories are not parallel when the platform moves along the Y-axis at different X-axis positions; after compensation (fig. 3(b)), the motion tracks are parallel no matter where the platform is located and in which direction. The coordinates of the partial track points tested before and after compensation are shown in Table 1
TABLE 1 compensated two-dimensional motion track point coordinates of front and back platforms
Before compensation (unit: mm)
－0.468，0.398 －50.462，0.438 －100.456，0.475
－0.300，200.388 －50.304，200.429 －100.309，200.465
－0.134，400.400 －50.146，400.443 －100.162，400.479
After compensation (unit: mm)
2.557，－23.737 －47.445，－23.627 －97.443，－23.522
2.891，126.252 －47.108，126.361 －97.108，126.468
3.226，276.250 －46.774，276.360 －96.774，276.465
In addition, the maximum positioning error of the platform motion before compensation can reach +/-45 um; after compensation, the error is within +/-5 um.
After the orthogonality compensation correction in the step 11, the motion tracks of the platform along the X axis and the Y axis are vertical, and finally the X, Y two-dimensional motion platform which is ideal in orthogonality and has positioning accuracy in micrometer level is obtained, so that the accuracy requirements of a calibration system and an exposure pattern of a direct-writing photoetching machine can be met.

Claims (4)

1. The two-dimensional positioning precision calibration method of the precision displacement platform for the photoetching machine is characterized by comprising the following steps of: the calibration measurement system comprises a motion platform, a vacuum chuck, a CCD imaging system, an image processing system and a platform motion control system. The measuring tool is a standard plate with characteristic patterns, and the patterns are periodically arranged in the transverse direction and the longitudinal direction at fixed intervals. The vacuum chuck is arranged on the moving platform and used for placing the standard plate. The CCD imaging system is arranged above the vacuum chuck and used for picking up the characteristic patterns on the standard plate and transmitting the images to the image processing system for real-time processing and calculation.
2. The two-dimensional positioning precision calibration method of the precision displacement platform for the photoetching machine is characterized by comprising the following steps of: the calibration measurement method comprises the following steps:
1) the standard plate is placed on the vacuum chuck;
2) the CCD above is used for grabbing the characteristic pattern on the standard plate, and the positioning accuracy of the X, Y two-dimensional motion platform is measured;
3) comparing the difference between the measurement result and the design condition of the characteristic pattern on the standard plate, calculating the error of the positioning precision of the motion platform, and compensating the calculation result to a platform motion control system;
4) after the two-dimensional positioning accuracy error is compensated, the included angle of the motion tracks in the X direction and the Y direction is calculated and compensated to an ideal orthogonal coordinate system.
3. The calibration measurement method of claim 2, wherein: the CCD is fixed in the measuring process, and the measurement of the characteristic patterns on the standard plate is completed through the movement of the two-dimensional motion platform.
4. The calibration measurement method of claim 2, wherein: firstly, the positioning error of the two-dimensional motion platform at different coordinate positions is measured and corrected, and then the orthogonality of the two-dimensional motion platform is compensated.
CN202210489780.5A 2022-04-29 2022-04-29 Two-dimensional positioning precision calibration method of precision displacement platform for photoetching machine Pending CN114967362A (en)

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