CN114966364B - SPI test device and server - Google Patents
SPI test device and server Download PDFInfo
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- CN114966364B CN114966364B CN202210440096.8A CN202210440096A CN114966364B CN 114966364 B CN114966364 B CN 114966364B CN 202210440096 A CN202210440096 A CN 202210440096A CN 114966364 B CN114966364 B CN 114966364B
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- 238000012360 testing method Methods 0.000 title claims abstract description 146
- 239000002184 metal Substances 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 60
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 7
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides an SPI test device and a server, wherein the device comprises: the connecting part consists of a plurality of L-shaped metal pins, and one end of each L-shaped metal pin is connected to the serial flash memory slot so as to be connected with corresponding pins of the serial peripheral interface; the test part comprises a base and test needles, the base is connected to the other end of the L-shaped metal needle, a signal wire is arranged on the base, the test needles are arranged above the signal wire of the base, and each test needle is connected with a preset pin connected with the L-shaped metal needle through the signal wire. By using the scheme of the invention, the difficulty of SPI test can be reduced, the error generation can be reduced, the test speed can be improved, and the risk of damage to components in the test process can be reduced.
Description
Technical Field
The present invention relates to the field of computers, and more particularly to an apparatus and server for SPI testing.
Background
In the existing architecture, flash rom (Flash memory) is almost installed in a socket (slot), the angle which can be tested on the front surface of an object to be tested is very small, and a very large number of components are arranged on the uppermost layer, and the position which can be touched is just under the socket. Therefore, the test is usually performed at the bottom layer, but when some test points are not pulled to the bottom layer, the pins without the test points on the back surface must be fixed at the top layer, and the bottom layer is in a state of not assembling the casing. The testing methods can be divided into welding and point contact methods, wherein the welding is more easily damaged. Most of them use the point touch method to perform the test. In such a limited range, the signals are all hooked up at the same time and tested in every project, so that the test speed in this way is slower and the object to be tested may be damaged due to welding.
Disclosure of Invention
In view of the above, an object of the embodiments of the present invention is to provide an SPI testing device and server, which can reduce the difficulty of SPI testing, reduce the occurrence of errors, increase the testing speed, and reduce the risk of damage to components during the testing process.
With the above object in view, an aspect of an embodiment of the present invention provides an apparatus for SPI testing, including:
the connecting part consists of a plurality of L-shaped metal pins, and one end of each L-shaped metal pin is connected to the serial flash memory slot so as to be connected with corresponding pins of the serial peripheral interface;
the test part comprises a base and test needles, the base is connected to the other end of the L-shaped metal needle, a signal wire is arranged on the base, the test needles are arranged above the signal wire of the base, and each test needle is connected with a preset pin connected with the L-shaped metal needle through the signal wire.
According to one embodiment of the present invention, the connection part includes two sets of connection components, each set of connection components including 8L-shaped metal pins, the two sets of connection components being respectively connected to both sides of the serial flash memory slot.
According to one embodiment of the invention, the L-shaped metal pins are low transmission loss gold pins, each L-shaped metal pin having a diameter of 0.7mm and a distance between L-shaped metal pins of 1.27mm.
According to one embodiment of the invention, the base of the test part comprises two rows of connecting holes, each row of connecting holes is provided with 8 connecting holes, and the diameter of each connecting hole is 0.72mm.
According to one embodiment of the invention, the test pins comprise a short pin test pin and a long pin test pin, the short pin test pin has a diameter of 1mm and a length of 6mm, the short pin test pin is respectively connected to the CS pin, the DO pin, the DI pin and the CLK pin through signal wires arranged on the base, the long pin test pin has a diameter of 1mm and a length of 15mm, the long pin test pin is connected to the GND pin through signal wires arranged on the base, and the distance between the short pin test pin and the long pin test pin is larger than 5mm.
In another aspect of the embodiment of the present invention, there is also provided a server, the server including an apparatus for SPI testing, the apparatus for SPI testing including:
the connecting part consists of a plurality of L-shaped metal pins, and one end of each L-shaped metal pin is connected to the serial flash memory slot so as to be connected with corresponding pins of the serial peripheral interface;
the test part comprises a base and test needles, the base is connected to the other end of the L-shaped metal needle, a signal wire is arranged on the base, the test needles are arranged above the signal wire of the base, and each test needle is connected with a preset pin connected with the L-shaped metal needle through the signal wire.
According to one embodiment of the present invention, the connection part includes two sets of connection components, each set of connection components including 8L-shaped metal pins, the two sets of connection components being respectively connected to both sides of the serial flash memory slot.
According to one embodiment of the invention, the L-shaped metal pins are low transmission loss gold pins, each L-shaped metal pin having a diameter of 0.7mm and a distance between L-shaped metal pins of 1.27mm.
According to one embodiment of the invention, the base of the test part comprises two rows of connecting holes, each row of connecting holes is provided with 8 connecting holes, and the diameter of each connecting hole is 0.72mm.
According to one embodiment of the invention, the test pins comprise a short pin test pin and a long pin test pin, the short pin test pin has a diameter of 1mm and a length of 6mm, the short pin test pin is respectively connected to the/CS pin, the DO pin, the DI pin and the CLK pin through signal wires arranged on the base, the long pin test pin has a diameter of 1mm and a length of 15mm, the long pin test pin is connected to the GND pin through signal wires arranged on the base, and the distance between the short pin test pin and the long pin test pin is larger than 5mm. .
The invention has the following beneficial technical effects: according to the SPI testing device provided by the embodiment of the invention, the connecting part is arranged and consists of a plurality of L-shaped metal pins, and one end of each L-shaped metal pin is connected to the serial flash memory slot so as to be connected with the corresponding pin of the serial peripheral interface; the test part, test part include base and test needle, and the base is connected to on the other end of L shape metallic needle, is provided with signal wire on the base, and the test needle sets up the signal wire top at the base, and every test needle passes through signal wire and the technical scheme that the preset pin that L shape metallic needle is connected, can reduce the degree of difficulty of SPI test, reduces wrong production, promotes the speed of test, can reduce the risk that the part was damaged in the testing process.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an apparatus for SPI testing in accordance with one embodiment of the present invention;
FIG. 2 is a schematic diagram of a test section according to one embodiment of the invention.
Detailed Description
Embodiments of the present disclosure are described below. However, it is to be understood that the disclosed embodiments are merely examples and that other embodiments may take various alternative forms. The figures are not necessarily to scale; some functions may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. As will be appreciated by one of ordinary skill in the art, the various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combination of features shown provides representative embodiments for typical applications. However, various combinations and modifications of the features consistent with the teachings of the present disclosure may be desired for certain specific applications or implementations.
With the above object in view, in a first aspect, an embodiment of an apparatus for SPI testing is provided. Fig. 1 shows a schematic view of the device.
As shown in fig. 1, the apparatus may include:
the connecting part 1, the connecting part 1 is made up of a plurality of L-shaped metal pins 2, one end of the L-shaped metal pin 2 is connected to the serial Flash memory slot 3 (SPI Flash socket) to connect with the corresponding pin of the serial peripheral interface. The connecting part 1 comprises two groups of connecting components, each group of connecting components comprises 8L-shaped metal pins 2, the L-shaped metal pins 2 in each group are connected by using plastic parts, the two groups of connecting components are respectively connected to two sides of the serial flash memory slot 3, and after the connecting components are connected to the two sides of the serial flash memory slot 3, the cover of the slot is covered and clamped. The L-shaped metal needles 2 were gold needles with low transmission loss, each L-shaped metal needle 2 had a diameter of 0.7mm, and the distance between the L-shaped metal needles 2 was 1.27mm.
Referring to fig. 2, the test part further includes a base 4 and test pins 5, the base 4 is connected to the other end of the L-shaped metal pins 2, signal wires 6 are provided on the base 4, the test pins 5 are provided above the signal wires 6 of the base 4, and each test pin 5 is connected with a preset pin connected with the L-shaped metal pin 2 through the signal wire 6. The test part can be manufactured by utilizing the existing mature PCB (printed Circuit Board) processing technology, the base 4 of the test part comprises two rows of connecting holes, each row of connecting holes is provided with 8 connecting holes, the positions of the connecting holes correspond to the L-shaped metal pins 2, and the diameter of each connecting hole is 0.72mm, so that 16 metal pins can be tightly combined with the base 4, and signal transmission is smooth. The test needle 5 includes short pin test needle 7 and long pin test needle 8, and the diameter of short pin test needle 7 is 1mm, and length is 6mm, and short pin test needle 7 is connected to CS pin, DO pin, DI pin and CLK pin respectively through signal wire 6 that sets up on the base 4, and the diameter of long pin test needle 8 is 1mm, and length is 15mm, and long pin test needle 8 is connected to the GND pin through signal wire 6 that sets up on the base 4, and the interval of short pin test needle 7 and long pin test needle 8 is greater than 5mm. In actual test, the test can be performed on the long-pin test needle 8 and the short-pin test needle 7, so that the difficulty of SPI test can be reduced.
According to the technical scheme, the SPI test difficulty can be reduced, errors are reduced, the test speed is improved, and the risk of damage to components in the test process can be reduced.
In a preferred embodiment of the invention, the connection part comprises two sets of connection elements, each set of connection elements comprising 8L-shaped metal pins 2, the two sets of connection elements being connected to two sides of the serial flash slot, respectively. The L-shaped metal pins 2 in each group are connected by using plastic parts, and after the connecting components are connected to two sides of the serial flash memory slot, the cover of the slot is covered and clamped.
In a preferred embodiment of the invention, the L-shaped metal pins 2 are low transmission loss gold pins, each L-shaped metal pin 2 having a diameter of 0.7mm and the distance between L-shaped metal pins 2 being 1.27mm.
In a preferred embodiment of the invention, the base of the test part comprises two rows of connecting holes, each row of connecting holes being provided with 8 connecting holes, and each connecting hole having a diameter of 0.72mm.
In a preferred embodiment of the present invention, the test pins include a short pin test pin having a diameter of 1mm and a length of 6mm, the short pin test pin being connected to the CS pin, the DO pin, the DI pin, and the CLK pin, respectively, through signal wires provided on the base, the long pin test pin having a diameter of 1mm and a length of 15mm, the long pin test pin being connected to the GND pin through signal wires provided on the base, and a distance between the short pin test pin and the long pin test pin being greater than 5mm.
According to the technical scheme, the SPI test difficulty can be reduced, errors are reduced, the test speed is improved, and the risk of damage to components in the test process can be reduced.
In view of the above object, a second aspect of the embodiments of the present invention proposes a server, the server including an SPI testing apparatus, the SPI testing apparatus including:
the connecting part consists of a plurality of L-shaped metal pins 2, and one end of each L-shaped metal pin 2 is connected to the serial flash memory slot so as to be connected with a corresponding pin of the serial peripheral interface;
the test part, test part include base and test needle, and the base is connected to the other end of L shape metallic needle 2, is provided with signal wire on the base, and the test needle sets up the signal wire top at the base, and every test needle is connected with the preset pin that L shape metallic needle 2 is connected through signal wire.
In a preferred embodiment of the invention, the connection part comprises two sets of connection elements, each set of connection elements comprising 8L-shaped metal pins 2, the two sets of connection elements being connected to two sides of the serial flash slot, respectively.
In a preferred embodiment of the invention, the L-shaped metal pins 2 are low transmission loss gold pins, each L-shaped metal pin 2 having a diameter of 0.7mm and the distance between L-shaped metal pins 2 being 1.27mm.
In a preferred embodiment of the invention, the base of the test part comprises two rows of connecting holes, each row of connecting holes being provided with 8 connecting holes, and each connecting hole having a diameter of 0.72mm.
In a preferred embodiment of the present invention, the test pins include a short pin test pin having a diameter of 1mm and a length of 6mm, the short pin test pin being connected to the CS pin, the DO pin, the DI pin, and the CLK pin, respectively, through signal wires provided on the base, the long pin test pin having a diameter of 1mm and a length of 15mm, the long pin test pin being connected to the GND pin through signal wires provided on the base, and a distance between the short pin test pin and the long pin test pin being greater than 5mm.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The embodiments described above, and in particular any "preferred" embodiments, are possible examples of implementations and are presented only for clarity of understanding of the principles of the invention. Many variations and modifications may be made to the above-described embodiments without departing substantially from the spirit and principles of the technology described herein. All modifications are intended to be included within the scope of this disclosure and protected by the following claims.
Claims (6)
1. An apparatus for SPI testing, comprising:
the connecting part consists of a plurality of L-shaped metal pins, and one end of each L-shaped metal pin is connected to the serial flash memory slot so as to be connected with corresponding pins of the serial peripheral interface;
the test part, the test part includes base and test needle, the base is connected to on the other end of L shape metal needle, be provided with signal wire on the base, the test needle sets up in the signal wire top of base, every test needle is connected with the presupposition pin that L shape metal needle is connected through signal wire, include two rows of connecting holes on the base of test part, every row of connecting hole sets up to 8 connecting holes, the diameter of every connecting hole is 0.72mm, the test needle includes short foot test needle and long foot test needle, the diameter of short foot test needle is 1mm, length is 6mm, the short foot test needle is connected to CS pin through the signal wire that sets up on the base respectively, DO pin, DI pin and CLK pin, the diameter of long foot test needle is 1mm, length is 15mm, long foot test needle is connected to the GND pin through the signal wire that sets up on the base, the interval of short foot test needle and long foot test needle is greater than 5mm.
2. The device of claim 1, wherein the connection portion comprises two sets of connection members, each set of connection members comprising 8L-shaped metal pins, the two sets of connection members being connected to respective sides of the serial flash slot.
3. The device of claim 2, wherein the L-shaped metal pins are low transmission loss gold pins, each L-shaped metal pin having a diameter of 0.7mm and a distance between L-shaped metal pins of 1.27mm.
4. A server comprising means for SPI testing, said means for SPI testing comprising:
the connecting part consists of a plurality of L-shaped metal pins, and one end of each L-shaped metal pin is connected to the serial flash memory slot so as to be connected with corresponding pins of the serial peripheral interface;
the test part, the test part includes base and test needle, the base is connected to on the other end of L shape metal needle, be provided with signal wire on the base, the test needle sets up in the signal wire top of base, every test needle is connected with the presupposition pin that L shape metal needle is connected through signal wire, include two rows of connecting holes on the base of test part, every row of connecting hole sets up to 8 connecting holes, the diameter of every connecting hole is 0.72mm, the test needle includes short foot test needle and long foot test needle, the diameter of short foot test needle is 1mm, length is 6mm, the short foot test needle is connected to CS pin through the signal wire that sets up on the base respectively, DO pin, DI pin and CLK pin, the diameter of long foot test needle is 1mm, length is 15mm, long foot test needle is connected to the GND pin through the signal wire that sets up on the base, the interval of short foot test needle and long foot test needle is greater than 5mm.
5. The server of claim 4, wherein the connection portion comprises two sets of connection members, each set of connection members comprising 8L-shaped metal pins, the two sets of connection members being respectively connected to two sides of the serial flash slot.
6. The server of claim 5, wherein the L-shaped metal pins are low transmission loss gold pins, each L-shaped metal pin having a diameter of 0.7mm and a distance between L-shaped metal pins of 1.27mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210440096.8A CN114966364B (en) | 2022-04-25 | 2022-04-25 | SPI test device and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210440096.8A CN114966364B (en) | 2022-04-25 | 2022-04-25 | SPI test device and server |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114966364A CN114966364A (en) | 2022-08-30 |
| CN114966364B true CN114966364B (en) | 2024-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210440096.8A Active CN114966364B (en) | 2022-04-25 | 2022-04-25 | SPI test device and server |
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| CN (1) | CN114966364B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111198300A (en) * | 2018-11-16 | 2020-05-26 | 神讯电脑(昆山)有限公司 | Memory card slot detection device |
| CN112310689A (en) * | 2019-07-15 | 2021-02-02 | 李承龙 | Interface of curved structure, interface assembly and test socket comprising interface and method for manufacturing interface |
| CN212693960U (en) * | 2020-06-30 | 2021-03-12 | 合肥本源量子计算科技有限责任公司 | Quantum chip testing arrangement |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103870375A (en) * | 2012-12-11 | 2014-06-18 | 鸿富锦精密工业（深圳）有限公司 | Testing device for port |
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2022
- 2022-04-25 CN CN202210440096.8A patent/CN114966364B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111198300A (en) * | 2018-11-16 | 2020-05-26 | 神讯电脑(昆山)有限公司 | Memory card slot detection device |
| CN112310689A (en) * | 2019-07-15 | 2021-02-02 | 李承龙 | Interface of curved structure, interface assembly and test socket comprising interface and method for manufacturing interface |
| CN212693960U (en) * | 2020-06-30 | 2021-03-12 | 合肥本源量子计算科技有限责任公司 | Quantum chip testing arrangement |
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| Publication number | Publication date |
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| CN114966364A (en) | 2022-08-30 |
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