CN114964948A

CN114964948A - Surface acoustic wave SAW device dissecting device

Info

Publication number: CN114964948A
Application number: CN202210429896.XA
Authority: CN
Inventors: 徐轩涛; 钱永学; 赖亚明; 周一峰; 吴长春; 黄鑫
Original assignee: Shanghai Angrui Innovation Electronic Technology Co ltd
Current assignee: Shanghai Angrui Innovation Electronic Technology Co ltd
Priority date: 2022-04-22
Filing date: 2022-04-22
Publication date: 2022-08-30

Abstract

The present disclosure provides a surface acoustic wave SAW device dissecting apparatus, comprising: a base configured to carry components of the SAW device dissector device; a device elevating platform fixed on the base and used for installing the device clamp; a lifting knob configured to vertically move an upper surface of the device lifting platform by rotating the lifting knob; a device clamp configured to clamp the SAW device; the blade fixing platform is fixed on the base and is connected with the horizontal moving knob through a rotating rod; a blade clamp configured to be connected with the horizontal movement knob by a rotation lever and configured to clamp a blade; a horizontal movement knob configured to be connected with the blade fixing platform and the blade holder by a rotation lever, and to move the blade in a horizontal direction by rotating the horizontal movement knob; and a blade fixed to the blade holder.

Description

Surface acoustic wave SAW device dissecting device

Technical Field

The present disclosure relates to the field of device packaging technology, and more particularly, to a Surface Acoustic Wave (SAW) device dissecting apparatus.

Background

In recent years, along with the miniaturization of electronic devices such as mobile phones, the miniaturization of electronic devices used for these electronic devices has been demanded. Surface Acoustic Wave (SAW) devices are incorporated in a large number of wireless communication devices. With the progress of miniaturization, SAW devices have reached the order of millimeters or so. In order to meet the demand for miniaturization, Chip Scale Packages (CSPs) are used to make the packaged products close to the size of a Chip in the manufacturing process of SAW devices. However, with the miniaturization of SAW devices, finished product testing of SAW devices also poses many difficulties.

In the prior art, when the SAW device is subjected to finished product testing, so that the SAW device needs to be subjected to device dissection, the device needs to be held by tweezers and manually cut by a knife under a microscope.

BRIEF SUMMARY OF THE PRESENT DISCLOSURE

Technical problem

Since the device is small in size (e.g., 1.1mm by 0.9mm), the stability and strength of the device are not controlled and the device is easily shaken when the device is manually held by tweezers, and thus, when the device is cut by a force applied to align the boundary between the epoxy film and the substrate under a microscope by a blade, an error is easily caused.

In addition, since the cutting of the blade is manually operated, the cutting position, the cutting angle and the force applying direction of the cutting are all unstable, and the cutting is skewed and broken.

Therefore, a device for surface acoustic wave SAW device dissection is needed, and accurate sectioning of the SAW device packaged by the CSP (chip scale package) is realized by means of a tool clamp.

Solution to the problem

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissection apparatus, comprising: a base configured to carry components of the SAW device dissector device; a device elevating platform fixed on the base and used for installing the device clamp; a lifting knob configured to vertically move an upper surface of the device lifting platform by rotating the lifting knob; a device clamp configured to clamp the SAW device; the blade fixing platform is fixed on the base and is connected with the horizontal moving knob through a rotating rod; a blade clamp configured to be connected with the horizontal movement knob through a rotary rod and configured to clamp a blade; a horizontal movement knob configured to be connected with the blade fixing platform and the blade holder by a rotation lever, and to move the blade in a horizontal direction by rotating the horizontal movement knob; and a blade fixed to the blade holder.

Embodiments of the present disclosure provide a Surface Acoustic Wave (SAW) device dissection apparatus, wherein the base comprises a level calibration arrangement.

An embodiment of the present disclosure provides a surface acoustic wave SAW device dissection apparatus, wherein the device lifting platform includes a wedge block, the wedge block is connected with the lifting knob through a first rotating rod, and the wedge block is horizontally moved by rotating the lifting knob to vertically move an upper surface of the device lifting platform.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissecting apparatus, wherein the device clamp includes a device adsorption clamp configured with an adsorption groove for horizontally fixing the SAW device on the device adsorption clamp.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissection apparatus, wherein the device clamp includes a device vertical clamp configured with a left clamp block and a right clamp block for vertically fixing the SAW device.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissecting apparatus, wherein the left clamp block and the right clamp block are connected by a hinge, and the left clamp block is designed in a trapezoidal table structure such that a clamping force of a SAW device is adjusted by an elastic support disposed between the left clamp block and the right clamp block.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissecting apparatus wherein the elastic support comprises any one of a spring member, a rubber member, or an adjustable-elasticity member.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissecting apparatus, wherein the blade holder further comprises a blade stand-on holder, the blade is vertically fixed on the blade stand-on holder, and the blade is moved in a horizontal direction by rotating the horizontal movement knob.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissection apparatus, wherein the blade clamp further comprises a blade position fine adjustment device configured to adjust a cut-in angle of the blade.

Embodiments of the present disclosure provide a surface acoustic wave SAW device dissecting apparatus in which a SAW device is sectioned by rotating the horizontal movement knob while the SAW device is horizontally fixed.

Embodiments of the present disclosure provide a Surface Acoustic Wave (SAW) device dissecting apparatus in which a SAW device is dissected by rotating the lifting knob while the SAW device is vertically fixed.

Advantageous effects

Compared with the prior art, the SAW device dissecting device provided by the embodiment of the disclosure realizes accurate dissecting of the SAW device packaged by CSP by means of the tool clamp, can accurately position the incising position and the incising angle of the blade, and improves the success rate of dissecting the chip.

Drawings

The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description when taken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a schematic structural diagram of a Surface Acoustic Wave (SAW) device dissection apparatus, according to an embodiment of the present disclosure; and

fig. 2 illustrates a schematic structural diagram of a surface acoustic wave SAW device dissection apparatus according to an embodiment of the present disclosure.

Detailed Description

Before proceeding with the following detailed description, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document. The terms "couple," "connect," and derivatives thereof refer to any direct or indirect communication or connection between two or more elements, whether or not those elements are in physical contact with one another. The terms "transmit," "receive," and "communicate," as well as derivatives thereof, encompass both direct and indirect communication. The terms "include" and "comprise," as well as derivatives thereof, mean inclusion without limitation. The term "or" is inclusive, meaning and/or. The phrase "associated with … …" and derivatives thereof means including, included within … …, interconnected, contained within … …, connected or connected with … …, coupled or coupled with … …, in communication with … …, mated, interwoven, juxtaposed, proximate, bound or bound with … …, having an attribute, having a relationship or having a relationship with … …, and the like. The term "controller" refers to any device, system, or part thereof that controls at least one operation. Such a controller may be implemented in hardware, or a combination of hardware and software and/or firmware. The functionality associated with any particular controller may be centralized or distributed, whether locally or remotely. The phrase "at least one of, when used with a list of items, means that different combinations of one or more of the listed items can be used and only one item in the list can be required. For example, "at least one of A, B, C" includes any one of the following combinations: A. b, C, A and B, A and C, B and C, A and B and C.

Definitions for other specific words and phrases are provided throughout this patent document. Those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases.

In this patent document, the application combination of modules and the division levels of sub-modules are only used for illustration, and the application combination of modules and the division levels of sub-modules may have different manners without departing from the scope of the present disclosure.

Embodiments of the present disclosure will be further described below with reference to the accompanying drawings.

Fig. 1 shows a schematic structural diagram of a surface acoustic wave SAW device dissector apparatus according to an embodiment of the present disclosure.

As shown in fig. 1, a surface acoustic wave SAW device dissecting apparatus 100 according to an embodiment of the present disclosure includes: the device comprises a base 1, a device lifting platform 2, a lifting knob 3, a device adsorption clamp 4, a blade horizontal moving device 5, a blade 6, a horizontal moving knob 7 and a blade fixing platform 9.

Specifically, the base 1 is used for carrying the SAW device dissecting device and plays a role in supporting and fixing each part in the SAW device dissecting device. The base 1 may have any shape suitable for the fixing means, which in the present embodiment is shown as rectangular, but it will be understood by those skilled in the art that the present invention is not limited to its shape. Furthermore, a horizontal calibration means may be provided in the base 1 to maintain the level of the base 1.

The device elevating platform 2 is fixed on the base 1 for mounting the device adsorbing jig 4.

The device lifting platform 2 is used for adjusting the height of the SAW device 8 placed on the device adsorption clamp 4, and the device is vertically moved by rotating the lifting knob 3. Referring to fig. 1, the lifting knob 3 is connected to the rotating rod, and the wedge block in the middle of the device lifting platform 2 moves horizontally by rotating the lifting knob 3, so that the upper portion of the device lifting platform 2 moves vertically to drive the SAW device 8 to move. Through the structure, the position of the SAW device 8 can be accurately controlled, and therefore the success rate of device dissection is improved. It will be understood by those skilled in the art that the helical wedge table feed structure shown above is merely illustrative of the present invention and other lifting structures that allow the upper portion of the implement lift platform 2 to move vertically may be employed without departing from the present invention.

The device adsorption jig 4 is attached and fixed on the upper surface of the device elevating platform 2 so that the horizontal position of the SAW device 8 can be adjusted by the device elevating platform 2. The SAW device 8 is horizontally fixed on the device adsorption jig 4, and referring to fig. 1, the SAW device 8 is fixed on the device adsorption jig 4 by adsorbing grooves, and although only a single groove is illustrated in fig. 1, it will be understood by those skilled in the art that a plurality of grooves are provided without departing from the scope of the present invention.

The platform 2 is raised and lowered by the device so that the SAW device 8 is in the cutting position aligned with the edge of the blade 6. The blade 6 is mounted on the blade horizontal moving means 5, and the horizontal moving knob 7 is rotated to perform horizontal feed, thereby sectioning the device. Referring to fig. 1, a blade fixing platform 9 is attached and fixed to a base 1, and a horizontal movement knob 7 is connected to the blade fixing platform 9 fixed to the base 1 through a link, and the horizontal position of the blade horizontal movement means 5 with respect to the blade fixing platform 9 is adjusted by rotating the horizontal movement knob 7. Through the structure, the position of the blade 6 can be accurately controlled, so that the success rate of device dissection is improved. Further, the blade horizontal moving device 5 may further include a blade position fine-adjustment device (not shown) for adjusting the cutting angle of the blade 6.

The SAW device 8 is horizontally fixed by the device adsorption jig 4, and the SAW device 8 can be cut without applying pressure to the upper surface of the fixed SAW device 8, so that the SAW device 8 can be protected. In addition, the horizontal cutting application can also be applied to the situation that the bonding between the epoxy film of the device and the substrate and the chip is relatively firm, and generally, in the situation, the device is firstly heated to soften the epoxy film, then the epoxy film is removed, and the ceramic substrate is adsorbed to carry out fixed horizontal cutting, so that the chip is peeled off from the ceramic substrate. Through the horizontal sectioning application, the operation process is facilitated, and the chip device is protected.

As shown in fig. 2, a surface acoustic wave SAW device dissecting apparatus 100 according to an embodiment of the present disclosure includes: the device comprises a base 1, a device lifting platform 2, a lifting knob 3, a device vertical mounting clamp 4, a blade horizontal moving device 5, a blade 6, a horizontal moving knob 7, a blade vertical mounting clamp 9 and a blade fixing platform 10.

The device lifting platform 2 is fixed on the base 1 and used for installing the device vertical installation clamp 4.

The device lifting platform 2 is used for adjusting the height of the SAW device 8 placed on the device vertical jig 4, and the lifting knob 3 is rotated to vertically move the SAW device 8. Referring to fig. 2, the lifting knob 3 is connected to the rotating rod, and the wedge block in the middle of the device lifting platform 2 moves horizontally by rotating the lifting knob 3, so that the upper portion of the device lifting platform 2 moves vertically to drive the SAW device 8 to move. Through the structure, the position of the SAW device 8 can be accurately controlled, and therefore the success rate of device dissection is improved. It will be appreciated by those skilled in the art that the helical wedge table feed arrangement shown above is merely illustrative of the invention and that other lifting arrangements for vertically moving the upper part of the implement lifting platform 2 may be employed without departing from the invention.

The device stand jig 4 is attached and fixed on the upper surface of the device elevating platform 2 so that the horizontal position of the SAW device 8 can be adjusted by the device elevating platform 2. The SAW device 8 is vertically fixed on the device vertical jig 4, and referring to fig. 2, the SAW device 8 is fixed by a left block and a right block, wherein the left block and the right block are connected by a hinge, and the left block is designed in a trapezoidal table structure so that a clamping force of the SAW device 8 is clamped and adjusted by an elastic support 11 disposed between the left block and the right block. The elastic support 11 may be formed by a spring member, a rubber member, or other suitable elastic force-adjustable structure.

The blade 6 is vertically mounted on the blade vertically-mounting jig 9, and the blade vertically-mounting jig 9 is fixed to the blade horizontally-moving device 5, and rotating the horizontally-moving knob 7 causes the blade horizontally-moving device 5 to horizontally move, thereby adjusting the horizontal position of the blade 6 so that the cutting position of the SAW device 8 is aligned with the cutting edge of the blade 6 to cut the SAW device 8. Referring to fig. 2, a blade fixing platform 10 is attached and fixed to the base 1, and a horizontal movement knob 7 is connected to the blade fixing platform 10 fixed to the base 1 through a link, and the horizontal position of the blade horizontal movement means 5 with respect to the blade fixing platform 10 is adjusted by rotating the horizontal movement knob 7. The lifting knob 3 is rotated and the SAW device 8 is caused to be cut by the blade 6. Through the structure, the position of the blade 6 can be accurately controlled, so that the success rate of device dissection is improved. In addition, the blade stand jig 9 may further include a blade position fine adjustment device (not shown) for adjusting the cutting angle of the blade 6.

The SAW device 8 is vertically fixed through the device vertical mounting fixture 4 (the SAW device 8 is vertically mounted), and after the SAW device 8 is cut through the left clamping block and the right clamping block, the epoxy film is prevented from scattering after being separated from the substrate, so that the relative integrity of the SAW device is kept. The vertical cutting is used for manual imitation forceps dissection, and meanwhile, the loss caused by bouncing off of a device in the cutting process can be effectively prevented.

According to the embodiment of the invention, aiming at the problems that a semiconductor device is small and fragile, cutting needs to be carried out on and off the interface of the substrate and the epoxy film, and the force applying direction of the lower cutter are stable, the embodiment of the invention carries out cutting by using the jig, so that the device loss is easily caused compared with manual cutting, and the stability and the precision are improved.

Although the present disclosure has been described with exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. The present disclosure is intended to embrace such alterations and modifications as fall within the scope of the appended claims.

None of the description in this disclosure should be read as implying that any particular element, step, or function is an essential element which must be included in the claims scope. The scope of patented subject matter is defined only by the claims.

Claims

1. A Surface Acoustic Wave (SAW) device dissection apparatus, comprising:

a base configured to carry components of the SAW device dissector device;

a device elevating platform fixed on the base and used for installing the device clamp;

a lifting knob configured to vertically move an upper surface of the device lifting platform by rotating the lifting knob;

a device clamp configured to clamp the SAW device;

the blade fixing platform is fixed on the base and is connected with the horizontal moving knob through a rotating rod;

a blade clamp configured to be connected with the horizontal movement knob by a rotation lever and configured to clamp a blade;

a horizontal movement knob configured to be connected with the blade fixing platform and the blade holder by a rotation lever, and to move the blade in a horizontal direction by rotating the horizontal movement knob; and

a blade secured to the blade holder.

2. The SAW device dissecting device of claim 1, wherein the base includes a horizontal calibration device.

3. The SAW device dissection device of claim 1, wherein the device lift platform comprises a wedge block connected to the lift knob by a first lever, and wherein the wedge block is moved horizontally by rotating the lift knob to move the upper surface of the device lift platform vertically.

4. The SAW device dissecting device of claim 1, wherein the device clamp comprises a device suction clamp configured with suction grooves for horizontally securing the SAW device on the device suction clamp.

5. The SAW device dissection device of claim 1, wherein the device clamp comprises a device stand-off clamp configured with left and right clamp blocks for vertical fixation of the SAW device.

6. The SAW device dissecting device of claim 5, wherein the left clamp block and the right clamp block are connected by a hinge, and the left clamp block is designed in the structure of a trapezoidal table such that clamping force of the SAW device is adjusted by an elastic support disposed between the left clamp block and the right clamp block.

7. The SAW device dissecting device of claim 6, wherein the resilient support comprises any one of a spring member, a rubber member, or an adjustable-spring force member.

8. The SAW device dissecting device of claim 1, wherein blade clamp further comprises a blade stand-on clamp, the blade being vertically fixed to the blade stand-on clamp and being moved in a horizontal direction by rotating the horizontal movement knob.

9. The SAW device dissection device of claim 1, wherein blade clamp further comprises a blade position fine adjustment device configured to adjust a cutting angle of the blade.

10. The SAW device dissector device of claim 1, wherein when the SAW device is horizontally secured, the SAW device is sectioned by rotating the horizontal movement knob.

11. The SAW device dissector device of claim 1, wherein when the SAW device is vertically secured, sectioning of the SAW device is performed by rotating the lifting knob.