CN112185884A - Position multi-dimensional high-adaptation bonding tool and use method - Google Patents
Position multi-dimensional high-adaptation bonding tool and use method Download PDFInfo
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- CN112185884A CN112185884A CN202011046454.4A CN202011046454A CN112185884A CN 112185884 A CN112185884 A CN 112185884A CN 202011046454 A CN202011046454 A CN 202011046454A CN 112185884 A CN112185884 A CN 112185884A
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- bonding
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000006978 adaptation Effects 0.000 claims abstract 2
- 235000014820 Galium aparine Nutrition 0.000 claims description 12
- 240000005702 Galium aparine Species 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 238000002604 ultrasonography Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 230000009347 mechanical transmission Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention designs a position multi-dimensional high-adaptation bonding tool and a using method thereof, and belongs to the technical field of machining. One of them position multidimension degree high adaptation bonding frock mainly includes clamping system, rotatory inclination system, can freely rotate, slope and fixed bonding module. The positioning platform is made of metal materials, and the positioning platform is positioned by a metal cylinder capable of automatically selecting positions. The tool plane is set to be inclined in a mechanical transmission mode, and a multi-dimensional bonding mode is provided for deep cavity bonding. The invention changes the processing technology of conventional bonding by increasing the function of the bonding tool, and effectively solves the problems that deep cavity bonding cannot be carried out and a non-planar bonding chopper cannot be used for cutting wires.
Description
Technical Field
The invention belongs to the technical field of machining and is applied to deep cavity gold wire bonding.
Background
The microelectronic assembly process is an important process in the process of producing microwave components, and the technical level achieved by the microelectronic assembly process directly influences whether the whole machine product can be assembled or not. When a semiconductor chip is packaged in a micro-assembly process, a bonding process is required. The bonding process refers to a process method for realizing interconnection of a bare chip, a capacitor component and a microstrip line by pressing a gold wire on a semiconductor chip and a carrier substrate by applying pressure, ultrasound and heat energy by using bonding equipment. The existing bonding tool cannot achieve adjustable clamping range and adjustable angle of a bonding plane, and only fixes a product on a bonding machine for bonding. In the bonding process, because the chopper has a certain length and a certain angle exists between the microscope and the chopper, when a chip in the microwave module is closer to the box body or a deep cavity structure exists in a bonded area, the problem that the deep cavity bonding cannot be used for cutting and the problem that the non-planar bonding chopper cannot be used for wire cutting can occur in the bonding process.
The invention improves the existing tool, increases the clamping range adjusting function, enables the bonding tool to be suitable for the installation of modules with various sizes, increases the tool inclining function, and enables the bonding tool to meet the requirement of deep cavity non-planar bonding.
Disclosure of Invention
Aiming at the problems, the invention provides a bonding tool which is exquisite in structure, convenient to use and capable of effectively solving the problem of difficult non-planar bonding in a deep cavity during bonding and a using method thereof.
The position multi-dimensional high-adaptation bonding tool provided by the invention comprises a workbench, a fixed positioning column, a telescopic positioning clamp spring and an inclination adjusting system. The top surface of the workbench is provided with a plurality of fixed positioning columns, and the diagonal positions of the workbench are provided with telescopic positioning clamp springs which are used for clamping modules to be bonded through the positioning columns and the telescopic positioning clamp springs; below the platform is a tilt adjustment system. The position of the fixed positioning column can be freely selected, so that the size range of the fixed clamp can be enlarged. The telescopic positioning clamp spring can be partially telescopic, so that the size range of clamping can be partially adjusted. The inclination system of bottom can adjust the inclination of platform as required, and the slope passes through mechanical gear structure, sets up the platform slope with the mode of rotatory feed rod.
Furthermore, the position of the fixed positioning column can be freely selected, and the size range of the fixed clamping is enlarged.
Furthermore, the telescopic positioning clamp spring can be partially telescopic and used for partially adjusting the size range of clamping.
Further, the inclination angle of the platform is adjusted according to the requirement by a high-adaptation inclination system below the platform; the arrangement of the inclination angle of the platform is completed by rotating the feeding rod through a mechanical gear structure.
The position multi-dimensional high-adaptation bonding tool disclosed by the invention displays the inclination angle in a rotary scale mode in a mechanical movement mode. In the process of bonding, the module is fixed on a bonding tool, and the movement and the spatial rotation can be freely controlled. The problems that the deep cavity bonding cannot be carried out and the non-planar bonding riving knife cannot be used for cutting wires in the bonding process can be solved.
The use method of the position multi-dimensional high-adaptation bonding tool provided by the invention comprises the following steps:
1) and selecting the position of a fixed column: selecting the position of the positioning column according to the size of the clamping module required, and determining the clamping force according to the telescopic clamp spring;
2) and installing a tool: installing a bonding tool below the module;
3) and positioning: positioning the bonding area of the microwave module through a microscope of the bonding equipment;
4) adjusting the inclination angle and placing the cleaver: the inclination angle of the platform is changed by adjusting a knob below the clamp, and a cleaver is placed in the platform and the bonding area is adjusted to meet the bonding requirement;
5) bonding: bonding two ends of the gold wire on the corresponding bonding points by applying pressure, ultrasound and heat energy;
6) adjusting the inclination angle and taking out the cleaver: the inclination angle of the platform is recovered by adjusting a knob below the tool, so that the requirement that the riving knife is freely taken down is met;
7) and a disassembling module: adjusting the force of the telescopic clamp spring, and taking down the module from the tool; and (6) finishing.
The original bonding tool cannot achieve the adjustable clamping range and the adjustable angle of the bonding plane, and only fixes the product on a bonding machine for bonding. The invention improves the existing tool, increases the clamping range adjusting function, and enables the bonding tool to be suitable for the installation of modules with various sizes. The tool inclination function is added, so that the bonding tool can meet the requirement of deep cavity non-planar bonding. And provides a use method of the improved bonding tool. The improved bonding tool has the clamping function of various sizes; the free movement of the bonding tool X, Y in the direction can be completed; and can complete the rotation within +/-10 degrees of the bonding plane.
Drawings
FIG. 1 is a top view of a bonding tool;
FIG. 2 is a side view of a bonding tool;
fig. 3 is an external view of an X-band eight-channel transceiver module applied to the embodiment.
Wherein 1-workbench 1, 2-fixed positioning column, 3-2 telescopic positioning clamp springs, 4-inclination adjusting system, and 5-inclination adjusting system knob.
Detailed Description
The invention provides a position multi-dimensional high-adaptation bonding tool and a using method thereof, and solves the problems that deep cavity bonding cannot be used for cutting and a non-planar bonding chopper cannot be used for wire cutting. The invention is further explained below with reference to the figures and examples.
Referring to fig. 1-3, the invention comprises a workbench 1, a fixed positioning column 2, a telescopic positioning clamp spring 3, an inclination adjusting system 4 and a knob 5 of the inclination adjusting system. Fig. 3 is a diagram of an external form of an X-band eight-channel transceiver module applied in the example. In the deep cavity bonding process, because the bonded cavity is deep, the bottom bonding disc cannot be seen after the vertical riving knife goes deep into the cavity due to the cavity vision problem, the bonded box body needs to be rotated to a certain degree through the tool clamp, a proper angle is found to observe a bottom bonding area, and bonding is completed. In non-planar bonding, the bonding region is at an angle to the plane due to the vertical orientation of the cleaver of the bond, and bonding cannot be accomplished. The box body is rotated and translated to a certain degree through the position multi-dimensional high-adaptation bonding tool, so that the rotated bonding area meets the bonding requirement, and bonding is completed.
In the embodiment of the invention, the improved bonding tool is applied to the assembly of the X-band eight-channel frequency conversion module. The bonded cleaver is a conventional 0.75 inch cleaver, and the gold wire is 25um gold wire. In the assembly of the X-band eight-channel frequency conversion module, a place needing bonding exists in a deep cavity with the width of 4mm and the length of 17mm and the step depth of 10 mm. The bond closest to the deep cavity wall is only 1.5 mm.
The X-band eight-channel frequency conversion module deep cavity bonding method comprises the following steps:
1) selecting the position of the positioning column 2 according to the overall dimension of the X-band eight-channel frequency conversion module, and determining the clamping force according to the telescopic clamp spring 3;
2) the X-band eight-channel frequency conversion module is arranged above a workbench 1 of the bonding tool;
3) positioning a bonding area of the X-band eight-channel frequency conversion module through a microscope of bonding equipment;
4) the inclination angle of the platform 1 is adjusted from 0 degree to 6 degrees by adjusting a knob 5 below the tool and rotating for 6 circles in the forward direction, the cleaver is moved by observing through a microscope and is lifted into a deep cavity, the platform 1 is adjusted from 6 degrees to 3 degrees by rotating for 3 circles in the reverse direction, and the bonding area meets the bonding requirement by observing through the microscope;
5) bonding the gold wire of 25um on the corresponding bonding point by applying pressure, ultrasound and heat energy;
6) the inclination angle of the platform 1 is adjusted from 3 degrees to 6 degrees by adjusting a knob 5 below the tool and rotating forwards for 3 circles, the cleaver is taken out from a deep cavity by observing through a microscope, and the inclination angle of the platform 1 is adjusted from 6 degrees to 0 degree by rotating backwards for 6 circles, so that the inclination angle of the platform 1 is restored to be parallel;
7) adjusting the strength of the telescopic clamp spring, and taking down the X-band eight-channel frequency conversion module from the bonding tool; and (6) finishing.
By applying the X-band eight-channel frequency conversion module deep cavity bonding method, a conventional 0.75-inch cleaver is used, and the problem that the size of a deep cavity is as follows due to a 25um gold wire is solved: the width is 4mm, the length is 17mm, the step depth reaches 10mm, and the bonding is 1.5mm close to the wall of the deep cavity.
Claims (5)
1. The utility model provides a high adaptation bonding frock of position multidimension degree which characterized in that: the device comprises a workbench, a fixed positioning column, a telescopic positioning clamp spring and a high-adaptation inclination adjusting system; the top surface of the workbench is provided with a plurality of fixed positioning columns, the diagonal positions of the workbench are provided with telescopic positioning snap springs, and planes needing to be bonded are clamped through the fixed positioning columns and the telescopic positioning snap springs; below the platform is a highly adaptable tilt adjustment system.
2. The position multi-dimensional high-adaptation bonding tool according to claim 1, characterized in that: the position of the fixed positioning column can be freely selected, and the size range of the fixed clamping is enlarged.
3. The position multi-dimensional high-adaptation bonding tool according to claim 1, characterized in that: the telescopic positioning clamp spring can be partially telescopic and used for partially adjusting the size range of clamping.
4. The position multi-dimensional high-adaptation bonding tool according to claim 1, characterized in that: the high-adaptation inclination system below the platform adjusts the inclination angle of the platform according to the requirement; the arrangement of the inclination angle of the platform is completed by rotating the feeding rod through a mechanical gear structure.
5. The use method of the position multi-dimensional high-adaptation bonding tool according to claim 1 is characterized in that:
1) and selecting the position of a fixed column: selecting the position of the positioning column according to the size of the clamping module required, and determining the clamping force according to the telescopic clamp spring;
2) and installing a tool: installing a bonding tool below the module;
3) and positioning: positioning the bonding area of the microwave module through a microscope of the bonding equipment;
4) adjusting the inclination angle and placing the cleaver: the inclination angle of the platform is changed by adjusting a knob below the clamp, and a cleaver is placed in the platform and the bonding area is adjusted to meet the bonding requirement;
5) bonding: bonding two ends of the gold wire on the corresponding bonding points by applying pressure, ultrasound and heat energy;
6) adjusting the inclination angle and taking out the cleaver: the inclination angle of the platform is recovered by adjusting a knob below the tool, so that the requirement that the riving knife is freely taken down is met;
7) and a disassembling module: adjusting the force of the telescopic clamp spring, and taking down the module from the tool; and (6) finishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011046454.4A CN112185884A (en) | 2020-09-29 | 2020-09-29 | Position multi-dimensional high-adaptation bonding tool and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011046454.4A CN112185884A (en) | 2020-09-29 | 2020-09-29 | Position multi-dimensional high-adaptation bonding tool and use method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112185884A true CN112185884A (en) | 2021-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011046454.4A Pending CN112185884A (en) | 2020-09-29 | 2020-09-29 | Position multi-dimensional high-adaptation bonding tool and use method |
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| Country | Link |
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| CN (1) | CN112185884A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114975077A (en) * | 2021-08-04 | 2022-08-30 | 江苏汉印机电科技股份有限公司 | Processing equipment and method for SiC epitaxial wafer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11150148A (en) * | 1997-11-14 | 1999-06-02 | Sharp Corp | Wire bonding apparatus |
| US20030024963A1 (en) * | 2001-08-01 | 2003-02-06 | Fujitsu Ten Limited | Die bonding apparatus |
| US20050011067A1 (en) * | 2003-05-21 | 2005-01-20 | Silvan Thuerlemann | Apparatus for mounting semiconductors |
| JP2005236234A (en) * | 2004-02-23 | 2005-09-02 | Sharp Corp | Wire bond apparatus, wire bond inspection method, and wire bond correction method |
| KR101591971B1 (en) * | 2014-12-03 | 2016-02-04 | 빛기술 주식회사 | Wafer bonding apparatus and wafer bonding system using the same |
-
2020
- 2020-09-29 CN CN202011046454.4A patent/CN112185884A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11150148A (en) * | 1997-11-14 | 1999-06-02 | Sharp Corp | Wire bonding apparatus |
| US20030024963A1 (en) * | 2001-08-01 | 2003-02-06 | Fujitsu Ten Limited | Die bonding apparatus |
| US20050011067A1 (en) * | 2003-05-21 | 2005-01-20 | Silvan Thuerlemann | Apparatus for mounting semiconductors |
| JP2005236234A (en) * | 2004-02-23 | 2005-09-02 | Sharp Corp | Wire bond apparatus, wire bond inspection method, and wire bond correction method |
| KR101591971B1 (en) * | 2014-12-03 | 2016-02-04 | 빛기술 주식회사 | Wafer bonding apparatus and wafer bonding system using the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114975077A (en) * | 2021-08-04 | 2022-08-30 | 江苏汉印机电科技股份有限公司 | Processing equipment and method for SiC epitaxial wafer |
| CN114975077B (en) * | 2021-08-04 | 2023-09-19 | 江苏汉印机电科技股份有限公司 | SiC epitaxial wafer processing equipment and method thereof |
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Address after: 210003 No. 346, Zhongshan North Road, Jiangsu, Nanjing Applicant after: 724 Research Institute of China Shipbuilding Corp. Address before: 210003 No. 346, Zhongshan North Road, Jiangsu, Nanjing Applicant before: 724TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp. |
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