CN114963824A

CN114963824A - Heat dissipation structure, and manufacturing method and device of heat dissipation structure

Info

Publication number: CN114963824A
Application number: CN202110214018.1A
Authority: CN
Inventors: 许加兴; 肖富平
Original assignee: Champ Tech Optical Foshan Corp
Current assignee: Champ Tech Optical Foshan Corp
Priority date: 2021-02-25
Filing date: 2021-02-25
Publication date: 2022-08-30
Also published as: TWI787749B; TW202238059A

Abstract

A heat dissipation structure comprises a first shell, a pipe body, a second shell, a first capillary structure and working liquid; the first shell comprises a main body part and a connecting part, wherein the connecting part is arranged on one side of the main body part and is bent to form a through hole; the pipe body comprises a first end and a second end, the first end is open, the second end is sealed, the first end is communicated with the second end to form a cavity, the first end is connected with the connecting part, and the cavity is communicated with the through hole; the second shell, the first shell and the pipe body are connected to form a sealed accommodating cavity; the first capillary structure is positioned on the inner wall of the pipe body and the same surface of the first shell connected with the pipe body; and the working liquid is accommodated in the accommodating cavity. The application also provides a manufacturing method of the heat dissipation structure and a device comprising the heat dissipation structure.

Description

Heat dissipation structure, and manufacturing method and device of heat dissipation structure

Technical Field

The present disclosure relates to the field of heat dissipation, and particularly, to a heat dissipation structure, a method for manufacturing the heat dissipation structure, and a device for manufacturing the heat dissipation structure.

Background

For devices with heat generating components (e.g., mechanical devices, electronic products, etc.), the heat generating components generate more and more heat as the devices operate. A heat dissipation structure having a heat dissipation function is generally disposed on a surface of the heat generating member to dissipate heat.

In the existing heat dissipation structure, a capillary structure in a heat pipe is connected to a capillary structure at the bottom of a temperature equalizing plate along the extension direction of the heat pipe, so that the capillary structure at a steam channel is blocked, the flow resistance of steam flowing into a heat pipe end is large, the steam can pass through the heat pipe only by high steam pressure, and the high steam pressure means that the heat resistance is increased due to high temperature; in addition, the capillary structure needs to be filled with powder twice in the forming process, and the fault condition can occur at the connecting part, so that the capillary backflow is influenced, and the thermal resistance is increased.

Disclosure of Invention

In view of the above, it is desirable to provide a heat dissipation structure with low thermal resistance.

In addition, it is also necessary to provide a method for manufacturing a heat dissipation structure and a device including the heat dissipation structure.

A heat dissipation structure comprises a first shell, a pipe body, a second shell, a first capillary structure and working liquid; the first shell comprises a main body part and a connecting part, wherein the connecting part is arranged on one side of the main body part and is bent to form a through hole; the pipe body comprises a first end and a second end, the first end is open, the second end is sealed, the first end is communicated with the second end to form a cavity, the first end is connected with the connecting part, and the cavity is communicated with the through hole; the second shell, the first shell and the pipe body are connected to form a sealed accommodating cavity; the first capillary structure is positioned on the inner wall of the pipe body and the same surface of the first shell connected with the pipe body; and the working liquid is contained in the containing cavity.

In some embodiments, the first end is located inside and connected to the connection portion.

In some embodiments, the first end is at the end connected to the connection portion, and the first capillary structure also covers the connection portion.

In some embodiments, the second housing has a groove, and the groove is communicated with the cavity to form the accommodating cavity.

In some embodiments, a surface of the second housing facing the first housing is further provided with a second capillary structure, and the second capillary structure is connected with the first capillary structure.

A manufacturing method of a heat dissipation structure comprises the following steps:

providing a first shell, wherein the first shell comprises a main body part and a connecting part, and the connecting part is arranged on one side of the main body part and is bent to form a through hole;

providing a pipe body, wherein the pipe body comprises a first end and a second end, the first end is opened, the second end is sealed, the first end is communicated with the second end to form a cavity, the first end is connected with the connecting part, and the cavity is communicated with the through hole;

inserting a core rod into the pipe body, and reserving a gap between the core rod and the pipe body;

filling metal powder in the gap and the same surface of the first shell connected with the pipe body, and sintering to enable the metal powder to form a first capillary structure;

taking out the core rod;

providing a second shell, connecting the second shell with the first shell, wherein the second shell, the first shell and the pipe body form an accommodating cavity with a liquid injection port; and

and sealing the liquid injection port after injecting working liquid into the accommodating cavity to obtain the heat dissipation structure.

In some embodiments, the number of the connecting portions is multiple, and each connecting portion is connected to one of the pipe bodies.

In some embodiments, the tube body is disposed through the through hole and is overlapped with the connecting portion.

In some embodiments, a surface of the second housing facing the first housing is provided with a second capillary structure, which is connected to the first capillary structure.

An apparatus comprising the heat dissipation structure.

The application provides a heat radiation structure first casing with the surface of body sets up the first capillary structure of a body structure the in-process that working liquid is heated flow, flow resistance is little, and the heat dissipation is fast.

Drawings

Fig. 1 is a schematic structural diagram of an apparatus provided in an embodiment of the present application.

Fig. 2 is a schematic structural diagram of the heat dissipation structure shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of a heat dissipation structure according to an embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a first housing according to an embodiment of the present disclosure.

Fig. 5 is a schematic cross-sectional view of the connection pipe body on the first housing shown in fig. 4.

Fig. 6 is a schematic cross-sectional view of the pipe body shown in fig. 5 after a mandrel is inserted.

Fig. 7 is a schematic cross-sectional view illustrating a first capillary structure formed between the tube body and the core rod shown in fig. 6 and a surface of the first housing after the first capillary structure is filled with metal powder and sintered.

Fig. 8 is a schematic cross-sectional view of the mandrel shown in fig. 7 removed.

Description of the main elements

Device for measuring the position of a moving object	200
		Heating element	210
Heat radiation structure	100
		First shell	10
Main body part	12
		Connecting part	14
Through hole	16
		Pipe body	20
First end	22
		Second end	24
Cavity body	26
		Core rod	30
First capillary structure	35
		Second shell	50
Groove	52
		Sealing plug	53
Second capillary structure	54
		Containing cavity	60

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be made below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1, a device 200 includes a heat generating element 210 and a heat dissipating structure 100. The heat dissipation structure 100 is connected to the heat generating member 210, the heat generating member 210 generates heat in the operation process, the heat dissipation structure 100 transmits the heat to the heat dissipation structure 100, and the heat is quickly dissipated through the heat dissipation structure 100, so that the working environment of the heat generating member 210 is maintained stable. Wherein, the heat generating member 210 may be a battery, a CPU, or the like.

Referring to fig. 2 and 3, the heat dissipation structure 100 includes a first housing 10, a second housing 50, a tube 20, a first capillary structure 35, and a working fluid (not shown).

The first casing 10, the tube 20 and the second casing 50 form a closed accommodating cavity 60, the first capillary structure 35 is located on the inner wall of the tube 20 and the surface of the first casing 10, and the working fluid is accommodated in the accommodating cavity 60.

The first housing 10 includes a main body 12 and a connecting portion 14, the connecting portion 14 extends and encloses a through hole 16 on one side of the main body 12, each connecting portion 14 encloses a through hole 16, and a plurality of connecting portions 14 enclose a plurality of through holes 16.

In some embodiments, there are a plurality of tubes 20, each of the connecting portions 14 connects to one of the tubes 20, the connecting portions 14 are located on the same side of the main body 12, and the tubes 20 are located on the same side of the main body 12. The plurality of tube bodies 20 are beneficial to increasing the heat dissipation area of the heat dissipation structure 100, so that the heat dissipation efficiency of the heat dissipation structure 100 is improved.

The tube 20 is generally tubular, and the tube 20 includes a first end 22 and a second end 24, wherein the first end 22 and the second end 24 are connected to each other and communicate to form a cavity 26. The first end 22 is open, the second end 24 is closed, the first end 22 is connected to the connecting portion 14, the cavity 26 is communicated with the through hole 16, and the second end 24 and the connecting portion 14 extend in the same direction.

The first capillary structure 35 covers the inner wall of the tube 20 and the same surface of the main body 12 connected to the tube 20.

In some embodiments, the first end 22 of the tube 20 is located inside the connecting portion 14 and connected to the connecting portion 14, that is, the tube 20 overlaps the connecting portion 14, and the outer wall of the tube 20 is connected to the inner wall of the connecting portion 14.

In some embodiments, the tube 20 is located at the end of the connecting portion 14 away from the main body portion 12 and connected to the connecting portion 14, and the first capillary structure 35 covers the inner wall of the tube 20 and the surface of the main body portion 12 and also covers the surface of the connecting portion 14.

The second housing 50 has a groove 52, the second housing 50 is located on a side of the first housing 10 facing away from the tube 20, the second housing 50 is connected to the main body 12 at the outermost edge of the first housing 10, and the groove 52 and the plurality of cavities 26 together form the accommodating cavity 60. The volume of the accommodating cavity 60 can be increased by the arrangement of the groove 52, so that more working fluid can be accommodated, and the heat dissipation efficiency of the heat dissipation structure 100 can be improved.

In some embodiments, the surface of the second housing 50 facing the first housing 10 is further provided with a second capillary structure 54, and the second capillary structure 54 is connected to the first capillary structure 35. When the heat dissipation structure 100 is installed in the device 200, the second housing 50 deviates from the surface of the first housing 10 and is connected to the heat generating member 210, when the heat generating member 210 generates heat, the temperature of the second housing 50 is higher than the temperature of the first housing 10 and the temperature of the tube 20, the working fluid in the second capillary structure 54 absorbs heat, and the working fluid after absorbing heat transfers heat to the tube 20 along with the first capillary structure 35, so as to rapidly dissipate the heat.

Referring to fig. 3 to 8, a method for manufacturing a heat dissipation structure 100 includes steps S1-S7.

Step S1: referring to fig. 4, a first housing 10 is provided, which includes a main body 12 and a connecting portion 14, wherein the connecting portion 14 is bent and surrounded to form a through hole 16 at one side of the main body 12.

That is, the region of the first housing 10 where the through hole 16 is not formed is the main body 12, and the connecting portion 14 is connected to the main body 12.

The number of the through holes 16 may be one or more. In the present embodiment, the number of the through holes 16 is plural, and the positions of the plural through holes 16 may be set as needed, for example, arranged in a certain array.

It is understood that each of the through holes 16 has one of the connection portions 14 at the periphery thereof, and a plurality of the through holes 16 have a plurality of the connection portions 14. The connecting portions 14 are all bent and extended toward the same direction, that is, the connecting portions 14 are located on the same side of the main body portion 12.

Step S2: referring to fig. 5, a tube 20 is provided, the tube 20 includes a first end 22 and a second end 24, the first end 22 is open, the second end 24 is closed, the first end 22 is communicated with the second end 24 to form a cavity 26, the first end 22 is connected with the connecting portion 14, and the cavity 26 is communicated with the through hole 16.

The number of the tube bodies 20 is the same as that of the connecting portions 14, each connecting portion 14 is connected to one tube body 20, and the second end 24 extends along the bending direction of the connecting portion 14.

In some embodiments, the first end 22 of the tube 20 has an outer diameter matching the diameter of the through hole 16, and the tube 20 is inserted into the through hole 16. The outer wall of the first end 22 is connected with the inner wall of the connecting portion 14, and can be connected into a whole by laser welding, diffusion welding and the like.

In other embodiments, the first end 22 of the tube 20 is connected to the end of the connecting portion 14 facing away from the body portion 12.

The tube 20 is made of a material with good thermal conductivity, such as metal, for improving heat dissipation efficiency.

Step S3: referring to fig. 6, a mandrel 30 is inserted into the tube 20, and a gap is reserved between the mandrel 30 and the tube 20.

It will be appreciated that the diameter of the mandrel 30 is less than the diameter of the through-hole 16. The core rod 30 is inserted into the tube body 20 from the first end 22 of the opening, the core rod 30 is located at the center of the tube body 20, one end of the core rod 30 abuts against the second end 24 or is arranged away from the second end 24, and a space for forming a first capillary structure 35 is reserved.

Step S4: referring to fig. 7, metal powder is filled in the gap and the same surface of the first housing 10 connected to the tube 20, and then sintered, so that the metal powder forms a first capillary structure 35.

In some embodiments, the metal powder fills the gap between the tube body 20 and the mandrel 30, and is also spread on the surface of the main body 12 on the same side as the tube body 20, so that the first capillary structure 35 is continuously formed on the inner wall of the tube body 20 and the surface of the main body 12 during one-step sintering, thereby avoiding the first capillary structure 35 from breaking due to multiple times of sintering, and simplifying the process.

In other embodiments, the metal powder also covers the surface of the connection portion 14.

Step S5: referring to fig. 8, the mandrel 30 is removed.

The first capillary structure 35 formed by sintering the metal powder is fixed on the inner wall of the tube 20 and the surface of the connection portion 14. After the mandrel 30 is removed from the tube 20, a cavity 26 is formed in the tube 20. It is understood that the first capillary structure 35 is formed in the same sintering step, and the first capillary structure 35 is a unitary structure and does not have a fault.

In some embodiments, the first capillary structure 35 also covers the surface of the connection portion 14.

It is understood that, in the present embodiment, the number of the cavities 26 is plural.

Step S6: referring to fig. 3 again, a second casing 50 is provided to connect the second casing 50 and the first casing 10, and the second casing 50, the first casing 10 and the tube 20 form a containing cavity 60 having a liquid injection port (not shown).

The second housing 50 substantially conforms to the shape of the first housing 10. The second housing 50 has a groove 52, the second housing 50 is located on a side of the first housing 10 facing away from the tube 20, the second housing 50 is connected to the main body 12 at the outermost edge of the first housing 10, and the groove 52 and the plurality of cavities 26 together form the accommodating cavity 60.

When the second shell 50 is connected to the first shell 10, a liquid injection port is reserved for injecting working liquid into the accommodating chamber 60 in the subsequent step.

In some embodiments, the surface of the second casing 50 facing the first casing 10 is further provided with a second capillary structure 54, and the second capillary structure 54 is connected with the first capillary structure 35 to facilitate vapor transmission and reduce thermal resistance.

Step S7: after the working fluid is injected from the injection port into the accommodating chamber 60, the injection port is sealed, and the heat dissipation structure 100 is obtained.

The working liquid can be water, or other liquid capable of generating phase change during use, such as acetone, ethanol, etc.

After the working fluid 40 is injected, a vacuum is applied, and then the injection port may be sealed by welding or by a sealing plug 53.

In the heat dissipation structure 100 provided by the present application, the first capillary structure 35 of an integrated structure is disposed on the surfaces of the first housing 10 and the pipe 20, so that in a process of flowing the working liquid 40 when heated, the flow resistance is small, and the heat dissipation is fast; in the manufacturing process of the heat dissipation structure 100, the first capillary structure 35 is formed in one sintering step, so that a fault is avoided; meanwhile, the flow is simplified, and the cost is saved.

Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims

1. A heat dissipation structure, comprising:

the first shell comprises a main body part and a connecting part, wherein the connecting part is arranged on one side of the main body part and is bent to form a through hole;

the pipe body comprises a first end and a second end, the first end is open, the second end is sealed, the first end is communicated with the second end to form a cavity, the first end is connected with the connecting part, and the cavity is communicated with the through hole;

the second shell is connected with the first shell and the pipe body to form a sealed accommodating cavity;

the first capillary structure is positioned on the inner wall of the pipe body and the same surface of the first shell connected with the pipe body; and

and the working liquid is contained in the containing cavity.

2. The heat dissipation structure of claim 1, wherein the first end is located inside the connection portion and connected to the connection portion.

3. The heat dissipation structure of claim 1, wherein the first end is located at the end connected to the connection portion, and the first capillary structure further covers the connection portion.

4. The heat dissipating structure of claim 1, wherein the second housing has a recess communicating with the cavity to form the receiving cavity.

5. The heat dissipation structure according to claim 1, wherein a surface of the second housing facing the first housing is further provided with a second capillary structure, and the second capillary structure is connected to the first capillary structure.

6. A manufacturing method of a heat dissipation structure is characterized by comprising the following steps:

taking out the core rod;

and filling working liquid into the accommodating cavity and then sealing the liquid filling port to obtain the heat dissipation structure.

7. The method according to claim 6, wherein the number of the connecting portions is plural, and each connecting portion is connected to one of the tubes.

8. The method as claimed in claim 6, wherein the tube body is inserted into the through hole and connected to the connecting portion in a superposed manner.

9. The method for manufacturing the heat dissipation structure according to claim 6, wherein a second capillary structure is disposed on a surface of the second housing facing the first housing, and the second capillary structure is connected to the first capillary structure.

10. An apparatus comprising the heat dissipating structure of any one of claims 1-5.