CN114952024A - Laser etching method for plastic workpiece and plastic workpiece - Google Patents
Laser etching method for plastic workpiece and plastic workpiece Download PDFInfo
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- CN114952024A CN114952024A CN202210756181.5A CN202210756181A CN114952024A CN 114952024 A CN114952024 A CN 114952024A CN 202210756181 A CN202210756181 A CN 202210756181A CN 114952024 A CN114952024 A CN 114952024A
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- plastic workpiece
- laser etching
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- heat
- etched
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- 239000004033 plastic Substances 0.000 title claims abstract description 96
- 229920003023 plastic Polymers 0.000 title claims abstract description 96
- 238000010329 laser etching Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000007639 printing Methods 0.000 claims description 8
- 238000007598 dipping method Methods 0.000 claims description 5
- 239000002923 metal particle Substances 0.000 claims description 4
- 229920001342 Bakelite® Polymers 0.000 claims description 3
- 239000004637 bakelite Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000007480 spreading Effects 0.000 abstract description 3
- 238000003892 spreading Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser etching method for a plastic workpiece and the plastic workpiece, and relates to the technical field of plastic electronic manufacturing. The laser etching method for the plastic workpiece comprises the following steps: step 1, providing a plastic workpiece to be treated; step 2, determining a region to be etched on the plastic workpiece, and forming a heat conduction layer attached to the plastic workpiece at least around the region to be etched on the plastic workpiece; and 3, carrying out laser etching treatment on the area to be etched on the plastic workpiece based on the heat conduction layer. This application utilizes the heat conduction material to form the heat-conducting layer around the regional of treating the sculpture of plastics work piece in advance before carrying out laser etching, treats the sculpture region based on this heat-conducting layer and carries out laser etching when handling, treats that a large amount of heats that the sculpture region absorbs can be to spreading around through the heat-conducting layer to the heat of treating the regional outer fringe of sculpture is reduced fast, avoids its outer fringe surface to appear the uplift deformation defect of class "crater" formula.
Description
Technical Field
The invention belongs to the technical field of plastic electronic manufacturing, and particularly relates to a laser etching method for a plastic workpiece and the plastic workpiece.
Background
The basic principle of laser etching is to focus a high-beam-quality low-power laser beam (generally, ultraviolet laser and fiber laser) into an extremely small spot, and form a very high power density at the focus, so that the material is vaporized and evaporated instantly to form a hole, a seam and a groove.
Although the potential of laser etching is high, some defects may exist in some specific aspects, for example, laser etching is performed on plastic workpieces such as PC, ABS and the like, and due to poor temperature resistance and large thermal resistance of the plastic material, ablation defects in the form of "craters" are easily generated on the surface of the workpiece after laser etching, which affects the processing quality of the workpiece.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a laser etching method for a plastic workpiece, so as to solve the problem in the prior art that laser etching is difficult to be applied to plastic materials.
In some illustrative embodiments, the laser etching method for a plastic workpiece includes: step 1, providing a plastic workpiece to be treated; step 2, determining a region to be etched on the plastic workpiece, and forming a heat conduction layer attached to the plastic workpiece at least around the region to be etched on the plastic workpiece; and 3, carrying out laser etching treatment on the area to be etched on the plastic workpiece based on the heat conduction layer.
In some optional embodiments, the heat conduction layer in step 2 covers the area to be etched, and the area to be etched below the heat conduction layer in step 3 is subjected to laser etching treatment.
In some optional embodiments, after the laser etching treatment is performed on the area to be etched on the plastic workpiece based on the heat conduction layer, the method further includes: removing the heat conductive layer.
In some optional embodiments, the thermally conductive layer has a thermal conductivity greater than 1W/mK.
In some alternative embodiments, the thermally conductive layer is formed by printing from an electrically conductive ink mixed with metal particles.
In some optional embodiments, in the step 2 of forming the heat conductive layer by using the conductive ink, the conductive ink is used together to form a conductive trace attached to the plastic workpiece.
In some optional embodiments, the thermally conductive layer is at least a portion of the electrically conductive trace.
In some optional embodiments, the thermally conductive layer is formed by printing, or dipping.
In some optional embodiments, the plastic workpiece is one or more of PC, ABS, PMMA, PE, PVC, PS, PP, POM, PA, bakelite.
Another object of the present invention is to provide a plastic workpiece that solves the problems of the prior art.
In some illustrative embodiments, the plastic workpiece is formed by any one of the laser etching methods for plastic workpieces described above.
Compared with the prior art, the invention has the following advantages:
this application utilizes the heat conduction material to form the heat-conducting layer around the regional of treating the sculpture of plastics work piece in advance before carrying out laser etching, treats the sculpture region based on this heat-conducting layer and carries out laser etching when handling, treats that a large amount of heats that the sculpture region absorbs can be to spreading around through the heat-conducting layer to the heat of treating the regional outer fringe of sculpture is reduced fast, avoids its outer fringe surface to appear the uplift deformation defect of class "crater" formula. Meanwhile, the heat conduction layer is tightly paved on the surface of the plastic workpiece, and the thermal stability of the heat conduction layer structure further limits the surface deformation of the plastic workpiece, so that the quality of the product of the plastic workpiece subjected to laser etching is improved.
Drawings
FIG. 1 is a flow chart of a laser etching method for a plastic workpiece in an embodiment of the invention;
FIG. 2 is a process diagram of a laser etching method for a plastic workpiece according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating the effect of laser drilling directly on a plastic workpiece in the prior art.
Detailed Description
Reference will now be made in detail to the various embodiments of the present application, examples of which are illustrated in the accompanying drawings. While described in conjunction with these embodiments, it will be understood that they are not intended to limit the application to these embodiments. On the contrary, the application is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the application as defined by the appended claims. Furthermore, in the following detailed description of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it is understood that the present application may be practiced without these specific details.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The embodiment of the invention discloses a laser etching method for a plastic workpiece, and particularly, as shown in fig. 1-3, fig. 1 is a flow chart of the laser etching method for the plastic workpiece in the embodiment of the invention; FIG. 2 is a process diagram of a laser etching method for a plastic workpiece according to an embodiment of the present invention; fig. 3 is a schematic diagram illustrating the effect of laser drilling directly on a plastic workpiece in the prior art.
The laser etching method for the plastic workpiece comprises the following steps:
step S1, providing a plastic workpiece 1 to be processed;
step S2, determining a region to be etched on the plastic workpiece 1, and forming a heat conduction layer 4 attached to the plastic workpiece 1 at least around the region to be etched on the plastic workpiece 1;
step S3, performing laser etching treatment (for example, through hole 2) on the to-be-etched area on the plastic workpiece 1 based on the heat conduction layer 4.
The laser etching in the embodiment of the invention is to perform ablation material reduction treatment on a workpiece by using a high-energy laser beam so as to obtain a target groove and a target hole; the structural patterns of the grooves and the holes can be designed according to actual requirements, and the structure is not limited.
Fig. 3 shows a crater-like defect 3 generated around a plastic workpiece when the through-hole 2 is directly laser-etched on the plastic workpiece.
This application utilizes the heat conduction material to form the heat-conducting layer around the regional of treating the sculpture of plastics work piece in advance before carrying out laser etching, treats the sculpture region based on this heat-conducting layer and carries out laser etching when handling, treats that a large amount of heats that the sculpture region absorbs can be to spreading around through the heat-conducting layer to the heat of treating the regional outer fringe of sculpture is reduced fast, avoids its outer fringe surface to appear the uplift deformation defect of class "crater" formula. Meanwhile, the heat conduction layer is tightly paved on the surface of the plastic workpiece, and the thermal stability of the heat conduction layer structure further limits the surface deformation of the plastic workpiece, so that the product quality of the plastic workpiece for laser etching is improved.
The plastic workpiece in the embodiment of the invention can be one or more of PC, ABS, PMMA, PE, PVC, PS, PP, POM, PA, bakelite and the like.
In the embodiment of the present invention, the heat conductive layer may be a heat conductive material having a thermal conductivity greater than that of the plastic workpiece, including but not limited to one or more of silicon, silicide, silicone grease, ceramic, polymer, metal oxide, carbon, graphene, and a polymer mixture (such as a heat conductive paste, a conductive ink, and an electronic paste) containing the above heat conductive particles.
The heat conducting layer is formed in a manner not limited to bonding, printing, dipping and the like; preferably, the heat conducting layer in the embodiment of the invention can be formed by printing, dipping and the like by selecting a high-molecular mixture or silicone grease slurry, compared with the traditional bonding method, the process is simple to operate, low in cost and easy to implement, the formed heat conducting layer is tightly combined with the surface of a plastic workpiece, pores are not easy to generate, and the heat conducting performance of the heat conducting layer is further improved.
The laser used in the laser etching treatment in the embodiment of the invention is not limited to infrared laser beams or ultraviolet laser beams; preferably, the laser etching treatment in the embodiment of the invention can be matched with a corresponding positioning system (not limited to a CCD positioning system) to ensure the accuracy of the laser etching; meanwhile, a positioning mark (not limited to a positioning hole) matched with the positioning system can be formed on the plastic workpiece; the positioning mark can be located on the plastic workpiece in the area not covered by the heat conduction layer or formed on the heat conduction layer.
Furthermore, the heat conduction layer in the embodiment of the invention can be formed by selecting the heat conduction material with the heat conduction coefficient larger than 1W/mK, and the heat conduction coefficient of the heat conduction material is far larger than that of the plastic workpiece, so that the heat conduction layer has an obvious effect on the diffusion of the waste heat in the laser etching. The heat conduction material with the heat conduction coefficient larger than 1W/mK is not limited to one or more of silicon, silicide, silicone grease, ceramics, metal oxide, polymer mixture containing the materials, and the like.
In some cases, the heat conductive layer in the embodiment of the present invention is not used as a target structure on the plastic workpiece, but is used as a temporary auxiliary function structure in the laser etching process, so that after the laser etching on the plastic workpiece is completed in step S3, the heat conductive layer can be removed, so as to obtain the target plastic workpiece. The removing method is not limited to one or more of erasing, mechanical peeling, cutting, medicament and the like. When the heat conducting layer is then the target structure on the plastic workpiece, it may not need to be removed.
In some embodiments, in step 2 of the present invention, forming a heat conduction layer attached to the plastic workpiece at least around the region to be etched on the plastic workpiece specifically includes: the patterns of the heat conduction layer and the area to be etched are of a complementary structure, namely the heat conduction layer and the area to be etched are mutually connected in vertical projection and are not mutually overlapped.
Or, the pattern of the heat conduction layer and the area to be etched may be non-consecutive and complementary, that is, there may be a certain distance between the heat conduction layer and the area to be etched, and the distance may be determined according to the heat conductivity coefficient of the heat conduction layer.
In addition, the method can also comprise the following steps: the heat conduction layer covers the area to be etched, namely the heat conduction layer and the area to be etched are mutually overlapped in vertical projection, and the size of the heat conduction layer is larger than that of the area to be etched, so that a heat conduction area in a certain range is formed. In this case, the heat conducting layer in step 3 is subjected to laser etching treatment on the area to be etched therebelow.
Preferably, the heat conduction layer in the embodiment of the invention covers the area to be etched, the pattern requirement of the heat conduction layer can be ignored as much as possible, the forming is easier, and the operation is simpler.
Preferably, the laying range of the heat conduction layer is connected with the area to be etched, and the minimum distance between the edge of the heat conduction layer far away from the area to be etched and the area to be etched is 0.5mm, namely the heat conduction layer is laid in the range of at least 0.5mm around the area to be etched. Wherein the distance is not limited to 0.5mm, 0.8mm, 1mm, 1.5mm, 3mm, 5mm, etc. Preferably, the laying range of the heat conduction layer at least covers the area of 0.5mm around the area to be etched, so that a good heat dissipation effect on the laser etching waste heat can be achieved, and on the other hand, the using amount of the heat conduction layer can be effectively reduced, and the requirement of processing treatment on a high-precision plastic workpiece is met.
Preferably, the heat conducting layer in the embodiment of the present invention may be formed by printing with an electrically conductive ink mixed with heat conducting metal particles, and may be formed by one or more of spraying, silk-screening, pad printing, coating, and dipping, and compared with surface plating (evaporation, electroplating, or chemical plating), the method has the advantages of simple process, easily controllable parameters such as layer thickness density, high production efficiency, and low cost. On the other hand, the conductive ink mainly comprises heat-conducting metal particles and a resin carrier, can be removed in a proper mode (such as a solvent corresponding to the resin carrier) after being formed, is simple to remove, is not easy to generate residues, and is particularly suitable for serving as a temporary heat-conducting layer formed on a plastic workpiece by aiming at laser etching.
In some cases, the plastic workpiece of the embodiments of the invention can be used for manufacturing plastic electronic products, and when electronic circuits are processed on the plastic workpiece, conductive traces can be formed on the plastic workpiece by using conductive ink; since the electrically conductive traces and the thermally conductive layer of embodiments of the present invention can both be formed using electrically conductive ink by the same process, the electrically conductive layers of embodiments of the present invention can be formed together during the formation of the electrically conductive traces, or the electrically conductive traces can be formed together during the formation of the thermally conductive layers. In the embodiment, the conductive traces and the heat conducting layer can be simultaneously formed by the same process by adopting the conductive ink, so that the manufacturing procedure can be saved for plastic electronic products, and the production efficiency is further improved.
In some embodiments, the thermally conductive layer after the laser etching process is at least a portion of the electrically conductive trace. That is, the thermally conductive layer may be part of the electrically conductive traces after the laser etching process, and subsequent removal of the thermally conductive layer need not be considered in this embodiment.
In some optional embodiments, the conductive ink is selected from conductive silver paste.
Another object of the present invention is to provide a plastic workpiece, which can be formed by any of the above-mentioned laser etching methods for plastic workpieces.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
Claims (10)
1. A laser etching method for a plastic workpiece is characterized by comprising the following steps:
step 1, providing a plastic workpiece to be treated;
step 2, determining a region to be etched on the plastic workpiece, and forming a heat conduction layer attached to the plastic workpiece at least around the region to be etched on the plastic workpiece;
and 3, carrying out laser etching treatment on the area to be etched on the plastic workpiece based on the heat conduction layer.
2. The laser etching method for the plastic workpiece according to claim 1, wherein the heat conducting layer in step 2 covers the area to be etched, and the area to be etched below the heat conducting layer is subjected to laser etching treatment in step 3.
3. The laser etching method for the plastic workpiece according to claim 1 or 2, wherein after the laser etching treatment is performed on the area to be etched on the plastic workpiece based on the heat conduction layer, the method further comprises:
removing the heat conductive layer.
4. The laser etching method for the plastic workpiece according to claim 1, wherein the heat conduction coefficient of the heat conduction layer is greater than 1W/mK.
5. The laser etching method for the plastic workpiece according to claim 1, wherein the heat conducting layer is formed by printing of conductive ink mixed with metal particles.
6. The laser etching method for the plastic workpiece according to claim 5, wherein in the step 2 of forming the heat conducting layer by using the conductive ink, the conductive ink is used together to form a conductive trace attached on the plastic workpiece.
7. The laser etching method for plastic workpieces according to claim 6, wherein the thermally conductive layer is at least a portion of the electrically conductive trace.
8. The laser etching method for the plastic workpiece according to claim 5, wherein the heat conducting layer is formed by printing, printing or dipping.
9. The laser etching method for the plastic workpiece according to claim 1, wherein the plastic workpiece is one or more of PC, ABS, PMMA, PE, PVC, PS, PP, POM, PA and bakelite.
10. A plastic workpiece, characterized in that it is formed by a laser etching method for plastic workpieces as claimed in any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210756181.5A CN114952024A (en) | 2022-06-29 | 2022-06-29 | Laser etching method for plastic workpiece and plastic workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210756181.5A CN114952024A (en) | 2022-06-29 | 2022-06-29 | Laser etching method for plastic workpiece and plastic workpiece |
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| Publication Number | Publication Date |
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| CN114952024A true CN114952024A (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210756181.5A Pending CN114952024A (en) | 2022-06-29 | 2022-06-29 | Laser etching method for plastic workpiece and plastic workpiece |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248201A (en) * | 1997-02-20 | 2000-03-22 | 证券票据有限公司 | Laser marking of articles |
| US20040202776A1 (en) * | 2003-04-09 | 2004-10-14 | Che-Hung Huang | Process for forming a high-quality interface between a plated and a non-plated area |
| US20110292963A1 (en) * | 2010-01-28 | 2011-12-01 | Conductive Compounds, Inc. | Laser position detection system |
| CN103455179A (en) * | 2012-05-28 | 2013-12-18 | 东元奈米应材股份有限公司 | High-resolution laser etching method for transparent conducting layer of touch panel |
| CN112831261A (en) * | 2021-01-13 | 2021-05-25 | 科纳瑞雅(昆山)新材料科技有限公司 | Protective liquid film composition for laser-induced supercritical liquid ablation processing and laser cutting process |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
-
2022
- 2022-06-29 CN CN202210756181.5A patent/CN114952024A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248201A (en) * | 1997-02-20 | 2000-03-22 | 证券票据有限公司 | Laser marking of articles |
| US20040202776A1 (en) * | 2003-04-09 | 2004-10-14 | Che-Hung Huang | Process for forming a high-quality interface between a plated and a non-plated area |
| US20110292963A1 (en) * | 2010-01-28 | 2011-12-01 | Conductive Compounds, Inc. | Laser position detection system |
| CN103455179A (en) * | 2012-05-28 | 2013-12-18 | 东元奈米应材股份有限公司 | High-resolution laser etching method for transparent conducting layer of touch panel |
| CN112831261A (en) * | 2021-01-13 | 2021-05-25 | 科纳瑞雅(昆山)新材料科技有限公司 | Protective liquid film composition for laser-induced supercritical liquid ablation processing and laser cutting process |
| CN113770546A (en) * | 2021-10-11 | 2021-12-10 | 上海莘芝光电科技有限公司东莞分公司 | Process for manufacturing three-dimensional circuit by laser etching and carbonizing plastic surface |
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